A dust removal method and a device with a dust removal function

Abstract

The embodiment of the application discloses a dust removal method and a device with a dust removal function, wherein the device with the dust removal function comprises a dust removal assembly and a to-be-dusted assembly, wherein the dust removal assembly comprises a fan and a telescopic structure; the first end of the telescopic structure is fixed with the fan; the second end of the telescopic structure can be telescoped and used for stretching to contact the to-be-dusted assembly, so that the vibration of the fan is transmitted to the to-be-dusted assembly; and the fan can be used for heat dissipation of the device.

Description

Technical Field

[0001] This application relates to, but is not limited to, the field of computer technology, and in particular to a dust removal method and a device with dust removal function. Background Technology

[0002] In related technologies, an additional vibrator is needed to provide vibration to the computer and to vibrate the server chassis to remove dust. The addition of a vibrator to the system increases the design cost.

[0003] In server design, there is rubber between the fan and the chassis to reduce the impact of fan vibration on the system. However, this means that fan vibration cannot effectively remove dust from the server. Summary of the Invention

[0004] In view of this, the present application provides a dust removal method and a device with dust removal function to solve the problems existing in the prior art.

[0005] The technical solution of this application embodiment is implemented as follows:

[0006] In a first aspect, embodiments of this application provide a device with a dust removal function, the device comprising: a dust removal component and a component to be dusted, wherein:

[0007] The dust removal component includes: a fan and a telescopic structure;

[0008] The first end of the telescopic structure is fixed to the fan;

[0009] The second end of the telescopic structure is telescopic, extending to contact the component to be cleaned, so as to transmit the vibration of the fan to the component to be cleaned.

[0010] The fan is used to dissipate heat from the device.

[0011] Secondly, embodiments of this application provide a dust removal method applied to the aforementioned dust removal device, wherein the dust removal device includes: a dust removal component and a component to be dusted, and the method includes:

[0012] Based on receiving a dust removal command for the component to be dusted, the telescopic structure in the dust removal component is controlled to extend;

[0013] Based on the extended telescopic structure, the vibration of the fan in the dust removal assembly is transmitted to the dust removal assembly.

[0014] The dust is removed from the component to be cleaned based on the vibration of the fan.

[0015] Correspondingly, embodiments of this application provide a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps described in the second aspect above.

[0016] In this embodiment, the device with dust removal function includes a dust removal component and a component to be dusted. The dust removal component includes a fan and a telescopic structure. The fan is used to dissipate heat from the device. A first end of the telescopic structure is fixed to the fan. Thus, the fan's vibration is transmitted through the telescopic structure. The second end of the telescopic structure is telescopic, extending to contact the component to be dusted, thereby transmitting the fan's vibration to the component. When dust removal is required, the second end of the telescopic structure extends to contact the component to be dusted and transmits the fan's vibration to it, thereby removing dust from the component and improving the dust removal efficiency. Attached Figure Description

[0017] In the accompanying drawings (which are not necessarily drawn to scale), similar reference numerals may describe similar parts in different views. Similar reference numerals with different letter suffixes may indicate different examples of similar parts. The drawings illustrate, by way of example and not limitation, the various embodiments discussed herein.

[0018] Figure 1 This is a schematic diagram of the composition structure of a dust removal device provided in an embodiment of this application;

[0019] Figure 2 A schematic diagram illustrating the implementation process of a dust removal method provided in an embodiment of this application;

[0020] Figure 3 This is a schematic diagram illustrating another implementation process of a dust removal method provided in an embodiment of this application;

[0021] Figure 4 This is a structural diagram of a device in the relevant technology where the air inlet is blocked.

[0022] Figure 5 This is a schematic diagram of a device in the related technology where the sensor is blocked.

[0023] Figure 6 This is a schematic diagram of the circuit board structure where the sensor is blocked in a related technology;

[0024] Figure 7 The images provided in some embodiments show the spectral content of each particle in the dust.

[0025] Figure 8 This is a schematic diagram of another component structure of a device with dust removal function provided in an embodiment of this application;

[0026] Figure 9 This is a schematic diagram illustrating another implementation process of a dust removal method provided in an embodiment of this application;

[0027] Figure 10 This is a schematic diagram of the hardware entity of the electronic device provided in the embodiments of this application. Detailed Implementation

[0028] It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of this application.

[0029] In the following description, the use of suffixes such as "module," "part," or "unit" to denote elements is solely for the purpose of illustration and has no specific meaning in itself. Therefore, "module," "part," or "unit" may be used interchangeably.

[0030] Electronic devices can be implemented in various forms. For example, the electronic devices described in this application may include mobile electronic devices such as personal digital assistants (PDAs), navigation devices, and wearable devices, as well as fixed electronic devices such as digital TVs and desktop computers that can collect fingerprints.

[0031] The following description will use electronic devices as examples. Those skilled in the art will understand that, in addition to components specifically designed for mobile purposes, the construction according to the embodiments of this application can also be applied to fixed-type electronic devices.

[0032] Based on this, this application provides a device with a dust removal function. The fan is fixed to the first end of the telescopic structure, which can transmit the vibration of the fan. When dust removal is required, the second end of the telescopic structure extends to contact the component to be dusted and transmits the vibration of the fan to the component, thereby removing the dust from the component through the vibration of the fan. Figure 1 This application provides a schematic diagram of the composition of a dust removal device 100, which includes a dust removal component 101 and a dust removal component 102.

[0033] The dust removal component 101 includes: a fan 11 and a telescopic structure 12.

[0034] Here, fan 11 is used to dissipate heat from the device. The structure of fan 11 can be of any type; for example, the fan blades can be four or three, etc. The size of fan 11 can be set according to the size of the device; for example, the larger the device, the larger the fan; the smaller the device, the smaller the fan. Telescopic structure 12 can be a telescopic cylindrical or prismatic structure, etc., and the material of telescopic structure can be metal. For example, telescopic structure 12 can be an electric telescopic rod.

[0035] The first end of the telescopic structure 12 is fixed to the fan 11.

[0036] Here, the first end of the telescopic structure 12 can be either of the two ends of the telescopic structure. The first end of the telescopic structure is fixedly connected to the fan.

[0037] In some possible implementations, the first end of the telescopic structure 12 is fixedly connected to the housing of the fan 11. For example, the first end of the telescopic structure can be connected to the fan by screws, welded to the fan, embedded, or snap-fitted. In this way, before extending, the first end of the telescopic structure is fixedly connected to the fan housing, while the second end of the telescopic structure remains suspended, allowing it to quickly extend to contact the dust removal component upon receiving an extension command, thus enabling rapid dust removal.

[0038] The second end of the telescopic structure 12 is telescopic, extending to contact the dust-removing component 102 to transmit the vibration of the fan to the dust-removing component.

[0039] Here, the telescopic structure 12 may have a microprocessor unit inside, so as to automatically extend and retract upon receiving a telescopic command. Alternatively, the telescopic structure 12 may not have a microprocessor unit inside, and the extension and retraction of the telescopic structure may be controlled by the device's processor.

[0040] In some possible implementations, the second end of the telescopic structure 12 is a flexible, retractable piston. The second end of the telescopic structure 12 may also have a retractable rod-like structure, and this second end is provided with a receiving cavity to accommodate the rod-like structure. If the second end of the telescopic structure, after extending, can contact the dust-collecting assembly 102, thereby transmitting fan vibrations to the dust-collecting assembly to remove dust through the fan's vibration waves. If the second end of the telescopic structure, after retracting, can completely enter the receiving cavity; or only leave a contact port outside the receiving cavity, so that it can contact the dust-collecting assembly through this contact port after extending.

[0041] In this embodiment, the fan is fixed to the first end of the telescopic structure, which transmits the fan's vibration. When dust removal is required, the second end of the telescopic structure extends to contact the component to be cleaned and transmits the fan's vibration to the component, thereby removing dust from the component through the fan's vibration and improving the dust removal efficiency of the component.

[0042] In some embodiments, the telescopic structure can automatically extend in response to an extension command, thereby quickly coming into contact with the component to be cleaned; that is, the second end of the telescopic structure 12 is used to extend from the initial state to contact the component to be cleaned upon receiving an extension command.

[0043] Here, the telescopic structure 12 can be equipped with a microprocessor. The microprocessor receives extension commands from the device's processor and automatically controls the extension of the retractable rod at the second end to contact the component to be cleaned. The initial state of the second end of the telescopic structure is a suspended state, i.e., the state before extension. When the second end of the telescopic structure is not extended, the rod at the second end retracts into the receiving cavity, and the second end is suspended, not in contact with other devices. Thus, upon receiving an extension command, the telescopic structure 12 automatically controls the second end to extend from its initial suspended state to contact the component to be cleaned. In this way, the telescopic structure can respond to extension commands and automatically control the second end to contact the component to be cleaned, enabling timely extension of the second end for rapid dust removal.

[0044] In some embodiments, during the dust removal process, the fan speed is increased so that the second end of the telescopic structure can transmit the vibration generated by the fan at the increased speed to the component to be dusted. That is, the fan 11 is used to increase the initial speed upon receiving a speed adjustment command.

[0045] Here, the initial speed of fan 11 can be a default value set when dust removal of the dust removal components is not required. Fan 11 may be equipped with a microprocessor, which, upon receiving a speed adjustment command sent by the device's processor, automatically increases the current initial speed to raise the speed to the maximum speed, thereby rotating at the maximum speed.

[0046] The telescopic structure 12 is also used to transmit the vibration generated by the fan at the increased initial speed to the dust removal component.

[0047] Here, the telescopic structure 12 can automatically extend its second end after the fan increases its speed to the maximum speed, so as to contact the component to be cleaned and transmit the vibration generated by the fan at the increased initial speed to the component to be cleaned; in this way, the component to be cleaned can be cleaned by the vibration generated by the fan at the maximum speed.

[0048] In this embodiment, the fan responds to the speed adjustment command to automatically increase the initial speed, thereby rotating at the increased initial speed. In this way, the telescopic structure can transmit the vibration generated by the fan at the increased initial speed to the dust-removing component, thereby removing dust from the component through the vibration generated at a larger speed, so as to achieve the maximum dust removal effect.

[0049] In some embodiments, after the dust removal of the component to be dusted is completed, the second end of the telescopic structure and the fan are both restored to their original state. That is, the second end of the telescopic structure 12 is also used to retract to its initial state when the dust removal time of the component to be dusted reaches a preset time.

[0050] Here, the preset duration can be any length, such as 3 minutes. When the dust removal time reaches 3 minutes, a retraction command is sent to the telescopic structure 12, causing the extended second end to retract to its initial state. For example, if the telescopic structure is an electric push rod, when the dust removal time for the component to be dusted reaches the preset duration, the extended piston in the electric push rod retracts into the empty cylinder of the push rod, thus suspending the second end of the telescopic structure 12.

[0051] The fan 11 is used to restore its rotation speed to the initial rotation speed when the dust removal time reaches the preset time.

[0052] Here, when the dust removal time reaches the preset duration, the fan returns from its maximum speed to the default initial speed, rotating at a low speed. Thus, when the dust removal process of the dust removal component ends, the second end of the telescopic structure retracts from its contact with the component to its initial suspended state, disconnecting from the component, and the fan speed returns to its initial speed, rotating at a low speed. This not only ends the dust removal process promptly but also saves power consumption.

[0053] In some possible implementations, the telescopic structure 12 can be an electric actuator, with the second end of the telescopic structure being a telescopic rod within the electric actuator, and the first end of the telescopic structure being a receiving cavity within the electric actuator to accommodate the telescopic rod. In this way, by fixing one end of the electric actuator (as a telescopic structure) to the fan and having the other end contact the component to be cleaned after extension, the vibration of the fan can be quickly transmitted to the component, thus achieving both effective dust removal and cost savings.

[0054] In some embodiments, during the dust removal process, the processor in the component to be dusted reduces the read / write capability of the memory to prevent damage to the memory. That is, the aforementioned component to be dusted 102 includes: a processor and a memory;

[0055] The processor is configured to reduce the read / write capability of the memory upon receiving a dust removal instruction for the component to be dusted.

[0056] Here, the dust removal command, extension command, and speed adjustment command may be the same or different; when the dust removal command, extension command, and speed adjustment command are different, the triggering time of the dust removal command is before the triggering time of the speed adjustment command, and the triggering time of the speed adjustment command is before the triggering time of the extension command. The processor of the component 102 to be dusted can be a microprocessor, and the memory of the component 102 to be dusted can be a hard disk drive. When the processor receives a dust removal command for the component to be dusted, it reduces its own operating frequency to the minimum operating frequency of the processor, thereby reducing the read and write speed of the memory and ensuring that the memory does not operate at high speed during dust removal, thus reducing the possibility of damage to the memory.

[0057] In some possible implementations, if the dust removal instruction, extension instruction, and speed adjustment instruction are identical, it means that after inputting the dust removal instruction, the processor reduces the memory read / write capability, the fan increases its initial speed to its maximum speed, and the second end of the telescopic structure extends synchronously. If the dust removal instruction, extension instruction, and speed adjustment instruction are different, then the processor first reduces the memory read / write capability, then the fan increases its speed to its maximum speed, and finally, the second end of the telescopic structure extends synchronously to contact the component to be dusted. This allows for a higher fan speed when dusting the component, thereby maximizing dust removal and improving the dust removal effect.

[0058] In this embodiment of the application, by reducing the operating frequency of the processor in the component to be cleaned, the read and write capabilities of the hard disk are reduced, thereby preventing damage to the hard disk during the cleaning process.

[0059] This application provides a dust removal method applied to the dust removal device provided in the above embodiments. The dust removal device includes a dust removal component and a component to be dusted. The method can... Figure 2 The steps shown are to be implemented as follows:

[0060] Step S201: Based on receiving a dust removal command for the dust removal component, control the telescopic structure in the dust removal component to extend.

[0061] Here, after the processor of the dust removal component receives the dust removal command, it sends an extension command to the telescopic structure in response to the dust removal command, so as to control the second end of the telescopic structure in the dust removal component to extend.

[0062] Step S202: Based on the extended telescopic structure, the vibration of the fan in the dust removal assembly is transmitted to the dust removal assembly.

[0063] Here, the second end of the telescopic structure extends to contact the component to be cleaned, and the first end of the telescopic structure is fixed to the fan. Therefore, the vibration of the fan in the dust removal component can be transmitted to the component to be cleaned through the second end of the telescopic structure.

[0064] Step S203: Based on the vibration of the fan, the component to be dusted is cleaned.

[0065] Here, the vibration of the fan is transmitted to the component to be cleaned through a telescopic structure, so that the vibration wave generated by the fan can clean the component.

[0066] In this embodiment, in response to a dust removal command, the telescopic structure of the dust removal component is controlled to extend so that the telescopic structure can contact the component to be dusted, thereby transmitting the vibration of the fan to the component to be dusted, and thus removing dust from the component through the vibration of the fan, thereby improving the dust removal efficiency of the component to be dusted.

[0067] In some embodiments, after receiving a dust removal command, the read / write capability of the memory is first reduced, then the fan speed is increased, and finally, the telescopic structure is controlled to extend. That is, step S202 can be achieved through... Figure 3 The steps shown are to be implemented as follows:

[0068] Step S301: Upon receiving the dust removal command, reduce the read / write capability of the memory in the component to be dusted and generate a speed adjustment command.

[0069] Here, after the processor in the dust removal component receives the dust removal command, it reduces its own operating frequency to decrease the read and write speed of the memory, thereby reducing the read and write capability of the memory in the dust removal component, and at the same time sends a speed adjustment command to the fan.

[0070] In some possible implementations, dust removal commands can be triggered automatically at set time intervals or be input by the user. For example, the equipment can be set to perform dust removal every 72 hours of operation, meaning a dust removal command can be automatically generated every 72 hours.

[0071] Step S302: Based on the speed adjustment command, increase the initial speed of the fan and generate an extension command.

[0072] Here, the fan responds to the speed adjustment command, increases the current initial speed to the maximum speed, and sends an extension command back to the telescopic structure.

[0073] Step S303: Based on the extension command, control the telescopic structure in the dust removal assembly to extend.

[0074] Here, the telescopic structure responds to an extension command, controlling the second end to extend so that it can contact the component to be cleaned. Thus, when cleaning is required, the read / write capability of the memory in the component is first reduced to protect it from damage; then, the fan speed is increased; finally, the second end of the telescopic structure extends to transmit the vibration generated by the fan at maximum speed to the component, thereby maximizing dust removal.

[0075] In some embodiments, after the telescopic structure extends, dust removal is achieved by vibration generated by a fan at an increased initial speed. Specifically, in step S203, the vibration generated by the fan at an increased initial speed is transmitted to the component to be cleaned based on the extended telescopic structure. Thus, by transmitting the vibration generated by the fan at an increased initial speed to the component to be cleaned, dust removal can be achieved through the vibration of the fan at its maximum speed, thereby improving the dust removal effect.

[0076] In some embodiments, after dust removal of the component to be dusted, it is determined whether the dust removal time of the component to be dusted has reached a preset time, and the equipment is controlled to return to the state before dust removal. The following description is based on the following steps:

[0077] The first step is to determine the duration of dust removal for the component to be dusted.

[0078] The second step is to control the extended telescopic structure to retract after the preset duration has been reached, thereby restoring the initial speed of the fan and the read / write capability of the memory in the dust removal component.

[0079] In this embodiment, when the dust removal process of the component to be dusted is detected to be finished, the read and write capabilities of the memory are restored so that the memory can be read and written quickly. The second end of the telescopic structure retracts from contact with the component to be dusted to a suspended state to disconnect from the component to be dusted. Moreover, the fan speed is restored to the initial speed and rotates at a low speed. In this way, the dust removal process can be ended in time and the power consumption of the device can be saved.

[0080] The following describes the application of the dust removal device provided in the embodiments of this application in a real-world scenario, taking the dust removal of electronic equipment by fan vibration as an example.

[0081] In some embodiments, when the server is running, dust can enter the system with the airflow and accumulate there. This dust can obstruct airflow, causing server components to overheat. Furthermore, in some devices, dust can short-circuit system components, damaging them. Figure 4 As shown, Figure 4 This is a schematic diagram of a device with a blocked air inlet in the related art, wherein the air inlet 42 of device 41 is blocked by dust. Since the air inlet 42 of device 41 is used to measure the air inlet temperature, the blockage of the air inlet affects the accuracy of the air inlet sensor. Figure 5 This is a schematic diagram of a device in the related art where the sensor is blocked. In the device 51, dust accumulates at the inlet of the sensor 52, affecting the accuracy of the sensor. Figure 6 This is a schematic diagram of a circuit board in the related art where the sensor is blocked. Dust accumulates at the inlet sensor 62 of the circuit board 61, affecting the accuracy of the sensor and thus the accuracy of the entire circuit board.

[0082] In some embodiments, the dust in the device contains various elemental particles, such as metal particles or acidic particles. Figure 7 The images provided in some embodiments show the spectral content of various particles in the dust. Figure 7 It can be seen that dust contains carbon (C), oxygen (O), iron (Fe), copper (Cu), sodium (Na), magnesium (Mg), aluminum (Al), silicon (Si), sulfur (S), chlorine (Cl), zinc (Sn), etc. The content of these particles in dust is shown in Table 1.

[0083] Table 1. Content of various particles in the dust of the components to be dusted.

[0084] Spectrum 338 element Line type weight percentage Wt%Sigma Belongs to percentage O K-line system 30.29 0.89 39.60 Sn L-line system 25.03 0.68 4.41 Na K-line system 7.27 0.36 6.62 Si K-line system 3.53 0.18 2.63 Cl K-line system 3.97 0.18 2.34 Mg K-line system 1.96 0.19 1.69 C K-line system 23.24 0.18 40.47 Al K-line system 0.89 0.14 0.69 S K-line system 0.80 0.12 0.52 Cu K-line system 2.46 0.41 0.81 Fe K-line system 0.55 0.23 0.21

[0085] Dust particles can become conductors when they come into contact with water, damaging components. Dust containing acidic particles can corrode components. Dust buildup can damage areas on a circuit board, leading to the failure of the entire board.

[0086] In this embodiment, during dust removal, fan vibration can be transmitted to the server chassis via a movable structure. Furthermore, during dust removal, the system can issue commands to keep the hard drive operating at a low load, reducing the impact of fan vibration on the hard drive. For example, fan vibration can be transmitted to the chassis via an electric actuator. An electric actuator is added to the fan module. In normal operation when dust removal is not required, such as… Figure 8 As shown, Figure 8 This is a schematic diagram of another component structure of a device with a dust removal function provided in an embodiment of this application. When there is no dust removal requirement, the electric push rod 81 is in the following state: Figure 8As shown in (a), one end of the electric actuator 81 is connected to the fan 82, and the other end is suspended in the air. This other end can be extended to connect to the housing 83 (corresponding to the dust-removing component in the above embodiment). When dust removal is required, the electric actuator 81 changes state from... Figure 8 (a) transformed into Figure 8 (b) An electric actuator 81 extends to connect the fan 82 to the chassis 83, transmitting fan vibrations to the chassis. The fan operates at maximum speed for maximum dust removal.

[0087] Figure 9 This is a schematic diagram illustrating another implementation process of a dust removal method provided in this application embodiment, combined with... Figure 9 The steps shown are explained below:

[0088] Step S901: Start the dust removal process.

[0089] Here, the dust removal process can be started manually by the user, or it can be started automatically at a set time interval, such as setting the process to run once a month.

[0090] Step S902: Reduce the CPU power to the minimum power and increase the fan speed to the maximum to employ maximum fan vibration.

[0091] Here, the CPU power is reduced to the minimum to minimize memory I / O. After adjusting the CPU power to the minimum, a quality control is sent to the fan to increase its speed, causing the fan to run at its maximum speed.

[0092] In step S903, the electric actuator is extended to the chassis partition near the front control panel of the server to transmit the vibration of the fan to the server and remove dust from the server.

[0093] In step S904, after a certain interval, the electric push rod automatically pushes back and resets the fan speed to the automatic fan speed, removing the CPU cap to restore the storage I / O speed.

[0094] It should be noted that, in the embodiments of this application, if the above-mentioned problem discovery method is implemented as a software functional module and sold or used as an independent product, it can also be stored in a terminal-readable storage medium. Based on this understanding, the technical solution of the embodiments of this application, or the part that contributes to the prior art, can be embodied in the form of a software product. This terminal software product is stored in a storage medium and includes several instructions to cause a terminal (which may be a personal computer or a server, etc.) to execute all or part of the methods described in the various embodiments of this application.

[0095] It should be noted that, Figure 10A schematic diagram of the hardware entity of the electronic device provided in the embodiments of this application, such as... Figure 10 As shown, the electronic device 1000 can be a mobile device or a base station device. The hardware entity of the electronic device 1000 includes a processor 1001, a communication interface 1002, and a memory 1003. The processor 1001 typically controls the overall operation of the electronic device 1000. The communication interface 1002 enables the terminal to communicate with other terminals or servers via a network. The memory 1003 is configured to store instructions and applications executable by the processor 1001, and can also cache data to be processed or already processed by the processor 1001 and various modules in the electronic device 1000 (e.g., image data, audio data, voice communication data, and video communication data). This can be implemented using flash memory or random access memory (RAM).

[0096] Correspondingly, embodiments of this application provide a storage medium storing executable instructions for inducing the processor to execute and implement the problem discovery method described above.

[0097] The descriptions of the storage medium and device embodiments above are similar to those of the method embodiments above, and have similar beneficial effects. For technical details not disclosed in the storage medium and device embodiments of this application, please refer to the descriptions of the method embodiments of this application for understanding.

[0098] In the several embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. The device embodiments described above are merely illustrative. For example, the division of units is only a logical functional division, and in actual implementation, there may be other division methods, such as: multiple units or components can be combined, or integrated into another system, or some features can be ignored or not executed. In addition, the coupling, direct coupling, or communication connection between the various components shown or discussed can be through some interfaces, and the indirect coupling or communication connection between devices or units can be electrical, mechanical, or other forms. The above-mentioned separated components may or may not be physically separated, and the components shown may or may not be physical units; they can be located in one place or distributed across multiple network units; some or all of the units can be selected to achieve the purpose of the solution in this embodiment according to actual needs.

[0099] Furthermore, the functional units in the various embodiments of this application can all be integrated into one processing unit, or each unit can be a separate unit, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or in a combination of hardware and software functional units. Those skilled in the art will understand that all or part of the steps of the above method embodiments can be implemented by hardware related to program instructions. The aforementioned program can be stored in a readable storage medium, and when executed, it performs the steps of the above method embodiments. The aforementioned storage medium includes various media capable of storing program code, such as mobile storage devices, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks. Alternatively, if the integrated unit of this application is implemented as a software functional module and sold or used as an independent product, it can also be stored in a readable storage medium. Based on this understanding, the technical solution of the embodiments of this application, or the part that contributes to the prior art, can be embodied in the form of a software product. This software product is stored in a storage medium and includes several instructions to cause the terminal to execute all or part of the methods described in the various embodiments of this application. The aforementioned storage media include various media capable of storing program code, such as mobile storage devices, ROM, RAM, magnetic disks, or optical disks. The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A device with dust removal function, characterized in that, The dust removal device includes: a dust removal component and a component to be dusted, wherein: The dust removal component includes: a fan and a telescopic structure; The first end of the telescopic structure is fixed to the fan; The second end of the telescopic structure is telescopic, extending to contact the component to be cleaned, so as to transmit the vibration of the fan to the component to be cleaned. The component to be dusted includes: a processor and a memory; The processor is configured to reduce the read / write capability of the memory upon receiving a dust removal instruction for the component to be dusted. Before the telescopic structure extends, the second end is suspended in the air; the telescopic structure contains a microprocessor unit to automatically extend and retract upon receiving a telescopic command; the fan is used to dissipate heat from the device; when the dust removal command is the same as the telescopic command, after the dust removal command is input, the processor reduces the read / write capability of the memory, and the second end of the telescopic structure extends synchronously.

2. The equipment with dust removal function according to claim 1, characterized in that, The second end of the telescopic structure is used to extend from its initial state to contact the component to be cleaned upon receiving an extension command.

3. The equipment with dust removal function according to claim 1 or 2, characterized in that, The fan is used to increase the initial speed upon receiving a speed adjustment command; The telescopic structure is also used to transmit the vibration generated by the fan at the increased initial speed to the dust removal component.

4. The equipment with dust removal function according to claim 3, characterized in that, The second end of the telescopic structure is also used to retract to the initial state when the dust removal time of the component to be dusted reaches a preset time. The fan is used to restore its rotation speed to the initial rotation speed when the dust removal time reaches the preset time.

5. The equipment with dust removal function according to claim 1, characterized in that, The first end of the telescopic structure is fixedly connected to the outer casing of the fan.

6. The equipment with dust removal function according to claim 1, characterized in that, The telescopic structure is an electric push rod.

7. The equipment with dust removal function according to claim 1, characterized in that, The dust removal command, extension command, and speed adjustment command may be the same or different; if the dust removal command, extension command, and speed adjustment command are different, the dust removal command is triggered before the speed adjustment command, and the speed adjustment command is triggered before the extension command.

8. A dust removal method, characterized in that, The method is applied to the dust removal device according to any one of claims 1 to 6, wherein the dust removal device comprises: a dust removal component and a component to be dusted, and the method comprises: Based on receiving a dust removal command for the component to be dusted, the telescopic structure in the dust removal component is controlled to extend; Based on the extended telescopic structure, the vibration of the fan in the dust removal assembly is transmitted to the dust removal assembly. The dust is removed from the component to be cleaned based on the vibration of the fan.

9. The method according to claim 8, characterized in that, The step of controlling the extension of the telescopic structure in the dust removal component based on receiving a dust removal command for the component to be dusted includes: Upon receiving the dust removal command, the read / write capability of the memory in the component to be dusted is reduced, and a speed adjustment command is generated; Based on the speed adjustment command, the initial speed of the fan is increased, and an extension command is generated; Based on the extension command, the telescopic structure in the dust removal assembly is controlled to extend.

10. The method according to claim 9, characterized in that, The telescopic structure, based on the extended state, transmits the vibration of the fan in the dust removal device to the component to be dusted, including: Based on the extended telescopic structure, the vibration generated by the fan at the increased initial speed is transmitted to the dust removal component.

11. The method according to any one of claims 8 to 10, characterized in that, After removing dust from the component to be cleaned based on the vibration of the fan, the method further includes: Determine the duration for dust removal of the component to be dusted; When the duration reaches a preset duration threshold, the extended telescopic structure is controlled to retract, restoring the initial speed of the fan and the read / write capability of the memory in the dust removal component.

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