Temperature control system and control method thereof

Abstract

The application discloses a temperature control system and a control method thereof. The system comprises a temperature control module, a pressing module, a temperature control heat dissipation module and a sub-water tank assembly. The temperature control module is used to drive multiple TEC components of the temperature control module to contact a reaction pool above the temperature control module to provide the same or / and different temperature cycles when a to-be-tested chip of the reaction pool executes a PCR program. The pressing module is located above the reaction pool and is used to press the to-be-tested chip when the to-be-tested chip executes the PCR program. The temperature control heat dissipation module is used to dissipate heat of cooling liquid and form temperature control of the TEC components by inputting the cooling liquid into the TEC components. The sub-water tank assembly has a cavity for storing the cooling liquid and is connected with the TEC components and the temperature control heat dissipation module respectively. According to the application, the to-be-tested chip does not need to be manually transferred when the PCR program is executed, and the PCR programs of four chip positions can be independently and simultaneously executed to run the same or / and different PCR program information.

Description

Technical Field

[0001] This invention relates to the field of digital PCR technology, and in particular to a temperature control system and its control method. Background Technology

[0002] A digital PCR instrument is a medical research instrument used in the fields of preventive medicine and public health, providing highly sensitive and accurate quantitative analysis of samples.

[0003] Digital PCR instruments generally consist of three main stages: droplet preparation, PCR amplification, and detection and data analysis. Currently, in the field of droplet digital PCR instruments, they are mainly divided into two categories based on the droplet detection method: flow cytometry and imaging. Based on the spatial arrangement of the three stages, they are further divided into integrated and separate types. Due to variations in chip structures, the actual structures of droplet digital PCR instruments are highly diverse. Among these, the temperature control system is a crucial element for verifying PCR amplification efficiency and also affects the time required for the entire detection process. Existing digital PCR instruments' temperature control systems require manual intervention, resulting in inefficient temperature control that negatively impacts PCR amplification efficiency. Summary of the Invention

[0004] The purpose of this invention is to provide a temperature control system and its control method, so as to provide a high-efficiency and automated temperature control system for a PCR instrument.

[0005] Other features and advantages of the invention will become apparent from the following detailed description, or may be learned in part by practice of the invention.

[0006] According to one aspect of the present invention, a temperature control system is provided, comprising: a temperature control module, wherein the temperature control module is used to drive multiple TEC components of its own to contact the reaction cell to provide the same and / or different temperature cycles when the test chip located above it is executing a PCR program; a pressing module, the pressing module being located above the reaction cell, for pressing the test chip against the test chip when the PCR program is executed; a temperature control heat dissipation module, the temperature control heat dissipation module being used to dissipate heat from a coolant and to form temperature control of the TEC components by inputting coolant into the TEC components; and a secondary water tank assembly, the secondary water tank assembly having a cavity for storing coolant, which is connected to the TEC components and the temperature control heat dissipation module respectively.

[0007] Furthermore, the temperature control module also includes a temperature control drive assembly, which includes a temperature control support base, a guide shaft fixing base, a first fixing plate, a first nut connecting plate, a first optocoupler baffle, a first ball screw motor, a second optocoupler, a first guide shaft, a first bushing, and a first baffle, wherein:

[0008] The first ball screw motor is installed inside the temperature control support base. Its screw output shaft passes through the guide shaft fixing base and is connected to the nut in the first nut connecting plate. The first nut connecting plate is connected to the first fixing plate. The first fixing plate is equipped with a TEC component. The first optocoupler baffle is installed on one side of the first fixing plate. The second optocoupler is installed on the guide shaft fixing base to monitor the stroke of the first optocoupler baffle. One end of the first guide shaft is connected to the bottom surface of the first fixing plate, and the other end slides through the first bushing in the guide shaft fixing base and is connected to the first baffle.

[0009] Furthermore, the TEC assembly is mounted on the first fixing plate, and includes a water-cooled base plate, a second fixing plate, multiple heat-conducting plates, multiple first pipe joints, a PCB adapter board, multiple TEC boards, a temperature sensor, a heat insulation sleeve, a sealing gasket, and a sealing ring, wherein:

[0010] The second fixing plate is fitted to the water-cooled base plate, and a sealing gasket is placed between the water-cooled base plate and the second fixing plate. The first pipe joint, after being fitted with a sealing ring, is connected to the cavity between the second fixing plate and the water-cooled base plate. The cavity between the second fixing plate and the water-cooled base plate is correspondingly arranged with the TEC board and is not interconnected with each other. The PCB adapter board is connected to the second fixing plate. The temperature acquisition device is placed in the space enclosed by the water-cooled base plate, the heat-conducting plate, and the TEC board. The temperature acquisition device is electrically connected to the PCB adapter board. The first temperature source surface of the TEC board is engaged with the temperature transfer surface of the water-cooled base plate, and the second temperature source surface of the TEC board is engaged with the temperature transfer surface of the heat-conducting plate. The heat-conducting plate is connected to the water-cooled base plate through a heat insulation sleeve.

[0011] Furthermore, multiple cooling zones are formed on the water-cooled base plate, and S-shaped cooling channels are formed in the cooling zones. The two ends of the multiple cooling channels are respectively connected to different first pipe joints, and the multiple first pipe joints are respectively connected to the auxiliary water tank assembly and the temperature control heat dissipation module through multi-port pipe joints and hoses.

[0012] Furthermore, the temperature control and heat dissipation module includes: a heat dissipation tank bracket, a cooling pump bracket, a heat dissipation tank, a cooling fan, a cooling pump, and a second pipe connector. The cooling fan is connected to the heat dissipation tank and fixed on the heat dissipation tank bracket. The cooling pump is connected to the cooling pump bracket and fixed on the heat dissipation tank bracket. The cooling pump is connected to the heat dissipation tank and the TEC component through the second pipe connector. The heat dissipation tank is also connected to the auxiliary water tank component.

[0013] Furthermore, the auxiliary water tank assembly includes: an auxiliary water tank body, an auxiliary water tank bracket, a liquid level sensor, and a third pipe connector. The auxiliary water tank body is connected to the TEC component and the temperature control and heat dissipation module respectively through two third pipe connectors disposed on one side of it. The liquid level sensor is connected to the auxiliary water tank bracket and attached to the surface of the auxiliary water tank body, thereby detecting the liquid level in the auxiliary water tank body.

[0014] Furthermore, the clamping module includes a clamping pad and a trapezoidal lead screw motor for driving the clamping pad, and a heat insulation pad is provided on the downward-facing side of the clamping pad.

[0015] Furthermore, the clamping module also includes a guide post fixing seat, a clamping support block, a support plate, a second guide shaft, a second optocoupler baffle, a second screw nut connecting plate, a guide post, a second bushing, a second baffle, a compression spring, and a second optocoupler. One end of the second screw nut connecting plate is connected to the screw nut of the trapezoidal screw motor, and the other end of the second screw nut connecting plate is connected to the support plate. One end of the second guide shaft passes through the support plate and is connected to the clamping pad. The compression spring sleeves the second guide shaft therein, with one end connected to the bottom of the support plate and the other end connected to the clamping pad. The guide post slides through the second bushing and the clamping support block in the guide post fixing seat, with one end connected to the support plate and the other end limited to the clamping support block by the second baffle. The second optocoupler baffle is disposed on one side of the support plate, and the second optocoupler is disposed on one side of the guide post fixing seat to form a stroke detection of the second optocoupler baffle.

[0016] Furthermore, it also includes a support module, which includes a crossbeam connected to an upper side plate, the upper side plate connected to a mobile platform base plate, the mobile platform base plate connected to a lower side plate, and the lower side plate connected to a base plate.

[0017] One end of the clamping module is connected to the crossbeam. The reaction tank is movably mounted on the base plate of the mobile platform. The temperature control module and the temperature control heat dissipation module are mounted on the base plate, and the clamping module and the temperature control module are mounted correspondingly. The auxiliary water tank assembly is mounted on one side of the upper side plate.

[0018] According to another aspect of the present invention, a control method for a temperature control system is provided, including the above-described temperature control system. The method includes: after receiving PCR information, the receiving module stores the PCR information in a storage module; the query module obtains the position information of the PCR execution; the control module controls the reaction tank to move to a preset position, controls the temperature control drive component to rise to the preset position, and controls the pressing module to press down to the preset position; the query module obtains the chip number information of the PCR program and the set PCR program information; the control module controls the TEC component to execute the preset PCR program information corresponding to different chip number information; the control module controls the cooling fan and cooling pump of the temperature control heat dissipation module to execute the preset information corresponding to different chip number information; after the query module obtains the PCR program completion information or the receiving module receives further information, the control module controls the pressing module to return to a safe position and controls the temperature control drive component to return to a safe position.

[0019] By adopting the above solution, the beneficial effects of the present invention are:

[0020] The operator only needs to place the chip to be tested in the reaction chamber, and the system will automatically transport the chip to the corresponding functional position, including the PCR program position and automatically complete the PCR program without the need for manual transfer of the test chip; and it can realize that the PCR programs of the four chip positions can run independently and simultaneously with the same or / and different PCR program information. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of the temperature control system of the present invention;

[0022] Figure 2 This is a schematic diagram of the temperature control module structure of the present invention;

[0023] Figure 3 This is a schematic diagram of the clamping module structure of the present invention;

[0024] Figure 4 This is a schematic diagram of the temperature control and heat dissipation module structure of the present invention;

[0025] Figure 5 This is a schematic diagram of the auxiliary water tank assembly structure of the present invention;

[0026] Figure 6 This is a schematic diagram of the TEC component structure of the present invention;

[0027] Figure 7 This is a cross-sectional view of the TEC component of the present invention;

[0028] Figure 8 This is a schematic diagram of the water-cooled base plate structure of the present invention;

[0029] Figure 9 This is a schematic diagram of the temperature control drive component structure of the present invention;

[0030] Figure 10 This is a partial cross-sectional view of the temperature control drive assembly of the present invention;

[0031] Figure 11 This is a control flowchart of the temperature control system of the present invention;

[0032] The following are explanations of the labels in the attached diagram:

[0033] 1. Base plate; 2. Lower side panels; 3. Mobile platform base plate; 4. Upper side panels; 5. Crossbeams; 60. Mobile platform components;

[0034] 10. Temperature control module; 101. Temperature control drive assembly; 1011. Guide shaft fixing seat; 1012. Temperature control support seat; 1013. First fixing plate; 1014. First nut connecting plate; 1015. First optocoupler baffle; 1016. First guide shaft; 1017. First bushing; 1018. First baffle; 1019. Ball screw motor; 1020. First optocoupler; 102. TEC assembly; 1021. Water-cooled base plate; 1021A. Cooling channel; 1021B. Cooling area; 1022. Second fixing plate; 1023a. First heat conduction plate; 1023b. Second... Heat-conducting plate; 1023c, third heat-conducting plate; 1023d, fourth heat-conducting plate; 1024, first pipe connector; 1025, heat insulation sleeve; 1026, sealing gasket; 1027, sealing ring; 1028, first PCB adapter board; 1029, TEC board; 1030, temperature acquisition device; 103, cable mounting bracket; 104, cable mounting plate pressure plate; 105, cable lower mounting bracket; 106, cable lower pressure plate; 107, pipe connector mounting bracket; 108, multi-port pipe connector; 109, first flexible hose; 110, FFC cable; 111, support post; 112, second PCB adapter board;

[0035] 20. Clamping module; 201. Guide column fixing seat; 202. Clamping support block; 203. Support plate; 204. Second guide shaft; 205. Clamping pad; 206. Heat insulation pad; 207. Optocoupler baffle; 208. Second screw nut connecting plate; 209. Guide column; 210. Second bushing; 211. Second baffle; 212. Compression spring; 213. Trapezoidal screw motor; 214. Second optocoupler;

[0036] 30. Temperature control and heat dissipation module; 301. Radiator support bracket; 302. Cooling pump support bracket; 303. Radiator; 304. Cooling fan; 305. Cooling pump; 306. Second pipe connector; 307. Second flexible hose;

[0037] 40. Auxiliary water tank assembly; 401. Auxiliary water tank body; 402. Auxiliary water tank bracket; 403. Liquid level sensor; 404. Third pipe connector; 405. Third hose. Detailed Implementation

[0038] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0039] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it can be directly on the other component or may have an intervening component present. When a component is referred to as "connected to" another component, it can be directly connected to the other component or may have an intervening component present. The use of terms such as "one end," "the other end," "first," and "second" is to distinguish similar objects and not necessarily to describe a specific order or sequence; these terms should be understood to be interchangeable where appropriate.

[0040] Reference Figures 1 to 10 As shown, the present invention provides a temperature control system, comprising: a temperature control module 10, which drives multiple TEC components 102 of its own to contact the reaction cell when the test chip located above it is executing a PCR program to provide the same and / or different temperature cycles; a pressing module 20, located above the reaction cell, which is used to press the test chip (not shown) against the test chip when the PCR program is executed; a temperature control heat dissipation module 30, which is used to dissipate heat from the coolant and to form temperature control of the TEC components 102 by inputting coolant into the TEC components 102; and a secondary water tank assembly 40, which has a cavity for storing coolant and is connected to the TEC components 102 and the temperature control heat dissipation module 30 respectively.

[0041] In one embodiment, the temperature control module 10 further includes a temperature control drive assembly 101. The temperature control drive assembly 101 includes a temperature control support base 1012, a guide shaft 204 fixing base 1011, a first fixing plate 1013, a first nut connecting plate 1014, a first optocoupler 1020, a baffle 1015, a first ball screw motor 1019, a second optocoupler 214, a first guide shaft 1016, a first bushing 1017, and a baffle. The first ball screw motor 1019 is disposed within the temperature control support base 1012, and its screw output shaft passes through the guide shaft fixing base 1011 and connects to the nut in the first nut connecting plate 1014. 14 is connected to the first fixed plate 1013, and the first fixed plate 1013 is provided with the TEC component 102; the first optocoupler baffle 1015 is installed on one side of the first fixed plate 1013, and the first optocoupler 1020 is set on the guide shaft fixing seat 1011 to form a stroke monitoring of the first optocoupler baffle 1015. By setting the first optocoupler 1020 and the first optocoupler baffle 1015, it is determined whether the drive mechanism is pushed to a preset position or returned to a safe position; one end of the first guide shaft 1016 is connected to the bottom surface of the first fixed plate 1013, and the other end slides through the first bushing 1017 in the guide shaft fixing seat 1011 and is connected to the first baffle 1018. The TEC assembly 102 is disposed on the first fixed plate 1013 and includes a water-cooled base plate 1021, a second fixed plate 1022, multiple heat-conducting plates, multiple first pipe joints 1024, a PCB adapter board, multiple TEC boards 1029, a temperature acquisition device 1030, a heat insulation sleeve 1025, a sealing gasket 1026, and a sealing ring 1027. The second fixed plate 1022 is fitted to the water-cooled base plate 1021, the sealing gasket 1026 is placed between the water-cooled base plate 1021 and the second fixed plate 1022, and the first pipe joint 1024, after being fitted with the sealing ring 1027, communicates with the cavity between the second fixed plate 1022 and the water-cooled base plate 1021. The cavity between the second fixing plate 1022 and the water-cooled base plate 1021 is correspondingly provided with the TEC plate 1029 and is not interconnected with each other; the first PCB adapter plate 1028 is connected to the second fixing plate 1022, and the temperature acquisition device 1030 is placed in the space enclosed by the water-cooled base plate 1021, the heat-conducting plate, and the TEC plate 1029. The temperature acquisition device 1030 is electrically connected to the first PCB adapter plate 1028; the first temperature source surface of the TEC plate 1029 is engaged with the temperature transfer surface of the water-cooled base plate 1021, and the second temperature source surface of the TEC plate 1029 is engaged with the temperature transfer surface of the heat-conducting plate; the heat-conducting plate is connected to the water-cooled base plate 1021 through the heat insulation sleeve 1025.

[0042] As a supplement, multiple cooling zones 1021B are formed on the water-cooled base plate 1021. S-shaped cooling channels 1021A are formed within each cooling zone 1021B. The two ends of each cooling channel 1021A are connected to different first pipe connectors 1024. These first pipe connectors 1024 are connected to the auxiliary water tank assembly 40 and the temperature control and heat dissipation module 30 via multi-port connectors 108 and flexible hoses. Specifically, the multi-port connector 108 is a one-to-four connector, corresponding to the four cooling channels 1021A within the four cooling zones 1021B.

[0043] In one embodiment, the temperature control and heat dissipation module 30 includes: a heat sink bracket 301, a cooling pump bracket 302, a heat sink 303, a cooling fan 304, a cooling pump 305, and a second pipe connector 306. The cooling fan 304 is connected to the heat sink 303 and fixed on the heat sink bracket 301. The cooling pump 305 is connected to the cooling pump bracket 302 and fixed on the heat sink bracket 301. The cooling pump 305 is connected to the heat sink 303 and the TEC component 102 through the second pipe connector 306. The heat sink 303 is also connected to the auxiliary water tank component 40. The cooling pump 305 draws the heated coolant from the TEC component 102 into the heat sink 303, and the cooling fan 304 dissipates the heat in the heat sink 303, resulting in cooling.

[0044] In one embodiment, the auxiliary water tank assembly 40 includes: an auxiliary water tank body 401, an auxiliary water tank bracket 402, a liquid level sensor 403, and a third pipe connector 404. The auxiliary water tank body 401 is connected to the TEC assembly 102 and the temperature control and heat dissipation module 30 respectively through two third pipe connectors 404 disposed on one side of it. The liquid level sensor 403 is connected to the auxiliary water tank bracket 402 and attached to the surface of the auxiliary water tank body 401, thereby detecting the liquid level in the auxiliary water tank body 401. The auxiliary water tank body 401 serves not only to hold coolant to increase the total coolant capacity, but also to dissipate heat and remove air bubbles from the entire liquid path. The auxiliary water tank body 401 may be made of a transparent material. The liquid level sensor 403 monitors the safe liquid level, providing the operator with prompts to add coolant or to check the equipment.

[0045] In one embodiment, the clamping module 20 includes a clamping pad 205 and a trapezoidal lead screw motor 213 for driving the clamping pad 205. A heat insulation pad 206 is provided on the downward-facing side of the clamping pad 205. The clamping module 20 also includes a guide post fixing seat 201, a clamping support block 202, a support plate 203, a second guide shaft 204, a second optocoupler baffle 207, a second lead screw nut connecting plate 208, a guide post 209, a second bushing 210, a second baffle 211, a compression spring 212, and a second optocoupler 214. One end of the second lead screw nut connecting plate 208 is connected to the lead screw nut of the trapezoidal lead screw motor 213, and the other end of the second lead screw nut connecting plate 208 is connected to the support plate 203. One end of the second guide shaft 204 passes through the support plate 203 and is connected to the clamping pad 205. The compression spring 212 sleeves the second guide shaft 204 therein, with one end connected to... The support plate 203 is connected to the pressure pad 205 at its bottom and the other end. The guide post 209 slides through the second bushing 210 and the pressure support block 202 in the guide post fixing seat 201. One end of the guide post 209 is connected to the support plate 203, and the other end is limited to the pressure support block 202 by the second baffle 211. The second optocoupler 214 baffle 207 is disposed on one side of the support plate 203. The second optocoupler 214 is disposed on one side of the guide post fixing seat 201 to form a stroke detection of the second optocoupler baffle 207. The second optocoupler 214 determines whether the pressure pad 205 is pressed down to the preset position or returns to the safe position by detecting the position of the second optocoupler baffle 207. The pressure pad 205 is used to flatten the chip under test during the PCR process and also has a heat preservation function.

[0046] Working principle of this invention:

[0047] Continue to refer to Figures 1 to 10 As shown, in this embodiment, the system also includes a support module, which includes a crossbeam 5, which is connected to the upper side plate 4. The upper side plate 4 is connected to the mobile platform base plate 3, the mobile platform base plate 3 is connected to the lower side plate 2, and the lower side plate 2 is connected to the base plate 1, so as to play a connecting, supporting, and fixing role. One end of the pressing module 20 is connected to the crossbeam 5. The reaction tank is movably set on the mobile platform base plate 3. The temperature control module 10 and the temperature control heat dissipation module 30 are set on the base plate 1, and the pressing module 20 is correspondingly set with the temperature control module 10. The auxiliary water tank assembly 40 is set on one side of the upper side plate 4. It also includes a first hose 109 connecting the TEC assembly 102 and the multi-port connector 108, a second hose 307 connecting the cooling pump 305 and the radiator 303, a third hose 405 connecting the two third connectors 404, and a hose connecting the temperature control module 10 and the temperature control radiator module 30 and the auxiliary water tank assembly 40. The third hose 405 does not function during operation. When the auxiliary water tank 401 is low on coolant, the third hose 405 can be removed and coolant can be added to the third connector 404.

[0048] The temperature control module 10 is connected to the base plate 1. It moves vertically upwards to provide a position for executing the PCR program and a system environment that provides information for the PCR program. It also moves vertically downwards to a safe position. The clamping module 20 is connected to the crossbeam 5. It moves vertically downwards to provide a position for clamping the chip when executing the PCR program and moves vertically upwards to a safe position. The temperature control and heat dissipation module 30 is connected to the base plate 1 and exhausts air downwards to dissipate excess heat generated during the PCR process. The auxiliary water tank assembly 40 is connected to the upper side plate 4 and the moving platform base plate 3 via the auxiliary water tank body 401 and the auxiliary water tank bracket 402. The auxiliary water tank body 401 assists in holding coolant and assists in heat dissipation. The moving platform assembly 60 is connected to the moving platform base plate 3 and moves in two mutually perpendicular directions to transfer the chip to be tested to the preset position for PCR amplification and other preset positions.

[0049] After the mobile platform component 60 moves to the preset position for executing the PCR program, the TEC component 102 in the temperature control module 10 is pushed to the preset position by the temperature control drive component 101. Then, the trapezoidal lead screw motor 213 in the clamping module 20 drives the support plate 203 to move vertically through its own lead screw nut and the second lead screw connecting plate 208. This causes the guide shaft 204, which is flexibly connected to the support plate 203 and is connected to the clamping pad 205, the heat insulation pad 206, and the compression spring 212, to move to the preset position. The guide post 209 connected to the support plate 203 slides vertically in the bushing to constrain the swing of the support plate 203 during movement. The baffle acts as a limit when the vertical movement exceeds the limit. At this point, the TEC component 102 is in the open mode, the cooling fan runs to enhance the heat dissipation of the heat sink 303, and the cooling pump 305 runs to circulate the coolant in the flow channel to transfer heat. The temperature control module 10 and the clamping module 20 also have a safe return position after the PCR program ends.

[0050] In the TEC assembly 102, the enclosed cavity formed by the water-cooled base plate 1021, the sealing gasket 1026, and the fixing plate, together with the first pipe joint 1024 and the sealing ring 1027, constitute the main heat dissipation source flow channel. The TEC assembly 102 has multiple heat-conducting plates, specifically the first heat-conducting plate 1023a, the second heat-conducting plate 1023b, the third heat-conducting plate 1023c, and the fourth heat-conducting plate 1023d as shown in the figure. Different heat-conducting plates correspond to different cooling channels 1021A. The heat-conducting plates, the TEC plate 1029, the water-cooled base plate 1021, the temperature acquisition device 1030, and the first PCB adapter board 1028 constitute the temperature environment that provides information for executing the PCR program. An FFC cable 110 is also provided on one side of the TEC component 102. The two ends of the FFC cable 110 are connected to the cable holders on the first PCB adapter board 1028 and the second PCB adapter board 112, respectively. The cable is fixed to the cable mounting bracket 103 and the cable mounting bracket 105 by the cable upper pressure plate 104 and the cable lower pressure plate 106, respectively. The FFC cable 110 is used for power supply, signal acquisition and transmission. Among them, one heat conduction plate, two TEC boards 1029, one temperature acquisition device 1030, and four heat insulation sleeves 1025 correspond to one chip number information, and one TEC component 102 corresponds to four chip number information.

[0051] In the temperature control drive assembly 101, the ball screw motor 1019, connected to the guide shaft 204 mounting base 1011, drives the first fixed plate 1013 to move vertically via its own nut and the first nut connecting plate 1014, transporting the TEC assembly 102 to a preset position. The first guide shaft 1016, connected to the first fixed plate 1013, slides vertically in the first bushing 1017 to constrain the swing of the first fixed plate 1013 during movement. The first baffle 1018 serves to limit the vertical movement when it exceeds its travel range.

[0052] The temperature control system provides preset temperature control when the chip under test is performing the PCR program. For example, the preset time for the TEC board 1029 to heat up on its own and the preset time for the temperature control heat dissipation module 30 to dissipate heat from the TEC board 1029, forming a cycle of heating and cooling.

[0053] The specific control method is as follows:

[0054] A control method for a temperature control system is provided, such as... Figure 11 As shown, the method includes the following steps:

[0055] After receiving the PCR information, the receiving module retrieves the location information for the PCR execution from the query module.

[0056] First, the control module moves the mobile platform module to a preset position.

[0057] Secondly, by obtaining the position information of the first optocoupler 1020 baffle 1015 detected by the first optocoupler 1020 through the query module, the control module controls the ball screw motor 1019 in the temperature control drive assembly 101 to lift the TEC assembly 102 to the preset position.

[0058] Next, the position information of the second optocoupler 214 baffle 207 detected by the second optocoupler 214 is obtained by the query module, and the control module controls the trapezoidal screw motor 213 in the pressing module 20 to press the pressing pad 205 and the heat insulation pad 206 down to the preset position.

[0059] When the moving part reaches the preset position, the query module obtains the chip number information of the chip to be executed PCR program. When the query module obtains the PCR program information set for the corresponding chip number information, the control module controls the TEC1029 of the corresponding chip number information to execute the PCR program information. The control module controls the cooling fan and cooling pump 305 of the temperature control and heat dissipation module 30 to execute the preset information. At the same time, the temperature acquisition device 1030 obtains the real-time temperature information and feeds it back to the control module.

[0060] When the moving part reaches the preset position, if the query module obtains at least two chip number information for which the PCR program needs to be executed, the query module obtains the PCR program information set for the corresponding chip number information. The control module controls the TEC board 1029 of the corresponding chip number information to execute the PCR program information corresponding to this chip number information. The control module controls the cooling fan and cooling pump 305 of the temperature control and heat dissipation module 30 to execute the preset information. At the same time, the temperature acquisition device 1030 of the corresponding chip number information obtains the real-time temperature information of this chip number information and feeds it back to the control module.

[0061] When the query module obtains at least two chip number information for which the PCR program needs to be executed, the TEC board 1029 corresponding to the chip number information controlled by the control module runs independently and simultaneously.

[0062] After the query module obtains the PCR program completion information, firstly, the control module controls the clamping module 20 to return to the safe position, and secondly, the control module controls the temperature control drive component 101 to return to the safe position.

[0063] This concludes the complete temperature control process.

[0064] The receiving module, query module, and control module can all be different parts of a computer or controller, or a combination of multiple computers or controllers.

[0065] Based on the above embodiments, the operator only needs to place the chip to be tested in the reaction chamber, and the system will automatically transport the chip to the corresponding functional position, including the PCR program position, and automatically complete the PCR program without the need for manual transfer of the test chip; and it can realize that the PCR programs of the four chip positions can run independently and simultaneously with the same or / and different PCR program information.

[0066] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A temperature control system, characterized in that, include: A temperature control module (10) is used to drive multiple TEC components (102) of the chip under test located above it to contact the reaction cell to provide the same and / or different temperature cycles when the PCR program is executed; the temperature control module (10) also includes a temperature control drive assembly (101), which includes a temperature control support (1012), a guide shaft fixing seat (1011), a first fixing plate (1013), a first wire connecting plate (1014), a first optocoupler baffle (1015), a first ball screw motor (1019), a first optocoupler (1020), a first guide shaft (1016), a first bushing (1017), and a first stop. The component (1018) comprises: a first ball screw motor (1019) housed within a temperature control support (1012), its screw output shaft passing through a guide shaft fixing seat (1011) and connected to a nut in a first nut connecting plate (1014), the first nut connecting plate (1014) being connected to a first fixed plate (1013), and a TEC component (102) mounted on the first fixed plate (1013); a first optocoupler baffle (1015) mounted on one side of the first fixed plate (1013), and a first optocoupler (1020) mounted on the guide shaft fixing seat (1011) to monitor the stroke of the first optocoupler baffle (1015); and one end of a first guide shaft (1016) connected to the first fixed plate (1013). The bottom surface of the first bushing (1017) of the guide shaft fixing seat (1011) is slidably passed through the first bushing (1017) and connected to the first baffle (1018); the TEC assembly (102) is set on the first fixing plate (1013), which includes a water-cooled base plate (1021), a second fixing plate (1022), multiple heat-conducting plates, multiple first pipe joints (1024), a first PCB adapter board (1028), multiple TEC boards (1029), a temperature acquisition device (1030), a heat insulation sleeve (1025), a sealing gasket (1026), and a sealing ring (1027), wherein: the second fixing plate (1022) is fitted to the water-cooled base plate (1021), and the sealing gasket (1026) is placed in the water. Between the cold base plate (1021) and the second fixed plate (1022), the first pipe joint (1024) is fitted with a sealing ring (1027) and connected to the cavity between the second fixed plate (1022) and the water-cooled base plate (1021); the cavity between the second fixed plate (1022) and the water-cooled base plate (1021) is correspondingly set with the TEC board (1029) and is not connected to each other; the first PCB adapter board (1028) is connected to the second fixed plate (1022), and the temperature acquisition device (1030) is placed in the space enclosed by the water-cooled base plate (1021), the heat conduction plate, and the TEC board (1029), and the temperature acquisition device (1030) is electrically connected to the first PCB adapter board (1028);The first temperature source surface of the TEC plate (1029) is joined to the heat transfer surface of the water-cooled base plate (1021), and the second temperature source surface of the TEC plate (1029) is joined to the heat transfer surface of the heat-conducting plate; the heat-conducting plate is connected to the water-cooled base plate (1021) through the heat insulation sleeve (1025). A pressing module (20) is located above the reaction cell and is used to press the chip under test against the chip under test when the PCR program is executed; Temperature control heat dissipation module (30), the temperature control heat dissipation module (30) is used to dissipate heat from the coolant and to form temperature control of the TEC component (102) by inputting coolant into the TEC component (102); The auxiliary water tank assembly (40) has a cavity for storing coolant, which is connected to the TEC assembly (102) and the temperature control heat dissipation module (30) respectively. Multiple cooling areas (1021B) are formed on the water-cooled base plate (1021). S-shaped cooling channels (1021A) are formed in the cooling areas (1021B). The two ends of the multiple cooling channels (1021A) are connected to different first pipe joints (1024) respectively. The multiple first pipe joints (1024) are connected to the auxiliary water tank assembly (40) and the temperature control heat dissipation module (30) respectively through multi-port pipe joints (108) and first hoses (109).

2. The temperature control system according to claim 1, characterized in that, The temperature control and heat dissipation module (30) includes: a heat dissipation tank bracket (301), a cooling pump bracket (302), a heat dissipation tank (303), a cooling fan (304), a cooling pump (305), and a second pipe connector (306). The cooling fan (304) is connected to the heat dissipation tank (303) and fixed on the heat dissipation tank bracket (301). The cooling pump (305) is connected to the cooling pump bracket (302) and fixed on the heat dissipation tank bracket (301). The cooling pump (305) is connected to the heat dissipation tank (303) and the TEC component (102) respectively through the second pipe connector (306). The heat dissipation tank (303) is also connected to the auxiliary water tank component (40).

3. The temperature control system according to claim 1, characterized in that, The auxiliary water tank assembly (40) includes: an auxiliary water tank body (401), an auxiliary water tank bracket (402), a liquid level sensor (403), and a third pipe connector (404). The auxiliary water tank body (401) is connected to the TEC assembly (102) and the temperature control and heat dissipation module (30) respectively through two third pipe connectors (404) provided on one side of it. The liquid level sensor (403) is connected to the auxiliary water tank bracket (402) and attached to the surface of the auxiliary water tank body (401), thereby detecting the liquid level of the auxiliary water tank body (401).

4. The temperature control system according to claim 1, characterized in that, The pressing module (20) includes a pressing pad (205) and a trapezoidal screw motor (213) for driving the pressing pad (205). A heat insulation pad (206) is provided on the downward-facing side of the pressing pad (205).

5. The temperature control system according to claim 4, characterized in that, The clamping module (20) further includes a guide post fixing seat (201), a clamping support block (202), a support plate (203), a second guide shaft (204), a second optocoupler baffle (207), a second lead screw connecting plate (208), a guide post (209), a second bushing (210), a second baffle (211), a compression spring (212), and a second optocoupler (214). One end of the second lead screw connecting plate (208) is connected to the lead screw nut of the trapezoidal lead screw motor (213), and the other end of the second lead screw connecting plate (208) is connected to the support plate (203). One end of the second guide shaft (204) passes through the support plate (203) and connects to the clamping pad (205). Next, the compression spring (212) sleeves the second guide shaft (204) therein, with one end connected to the bottom of the support plate (203) and the other end connected to the pressure pad (205); the guide post (209) slides through the second bushing (210) and the pressure support block (202) in the guide post fixing seat (201), with one end connected to the support plate (203) and the other end limited to the pressure support block (202) by the second baffle (211); the second optocoupler baffle (207) is disposed on one side of the support plate (203), and the second optocoupler (214) is disposed on one side of the guide post fixing seat (201) to form a stroke detection of the second optocoupler baffle (207).

6. The temperature control system according to claim 1, characterized in that, It also includes a support module, which includes a crossbeam (5), the crossbeam (5) being connected to the upper side plate (4), the upper side plate (4) being connected to the mobile platform base plate (3), the mobile platform base plate (3) being connected to the lower side plate (2), and the lower side plate (2) being connected to the base plate (1). One end of the clamping module (20) is connected to the crossbeam (5). The reaction tank is movably set on the base plate (3) of the mobile platform. The temperature control module (10) and the temperature control heat dissipation module (30) are set on the base plate (1) and the clamping module (20) is set in correspondence with the temperature control module (10). The auxiliary water tank assembly (40) is set on one side of the upper side plate (4).

7. A control method for a temperature control system, comprising the temperature control system according to any one of claims 1-6, characterized in that, The method includes: After receiving the PCR information, the receiving module stores the PCR information in the storage module; The query module obtains the location information for performing PCR, the control module controls the reaction chamber to move to the preset position, controls the temperature control drive component (101) to rise to the preset position, and controls the pressing module (20) to press down to the preset position; The query module obtains the chip number information and the set PCR program information for executing the PCR program. The control module controls the TEC component to execute the preset PCR program information corresponding to different chip number information. The control module controls the cooling fan (304) and cooling pump (305) of the temperature control and heat dissipation module (30) to execute the preset information corresponding to different chip number information. After the query module obtains the PCR program completion information or the receiving module receives further information, the control module controls the pressing module (20) to return to the safe position and controls the temperature control drive component (101) to return to the safe position.

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