Sensor hetero-material pin wire connecting device and connecting method thereof

Abstract

The application provides a sensor heterogeneous material pin wire connecting device, and belongs to the technical field of avionics components. The application comprises a solder electromagnetic shrinkage connector, a heating device, a magnet collector and a coil. The electromagnetic shrinkage connector comprises: a shrinkage body filled with solder, and multiple wires and micro-wire sensor pins arranged in the shrinkage body; the heating device is used for heating the shrinkage body to melt the solder into liquid solder; the coil generates electromagnetic pulses to make the metal electromagnetic shrinkage sleeve generate plastic deformation after being electrified, and the liquid solder is filled into the gap between the multiple wires and the micro-wire sensor pins. The application uses the heating device to heat and melt the solder into liquid solder, and uses the coil to make the shrinkage body generate plastic shrinkage, so that the liquid solder better infiltrates the gap between the multiple wires and the micro-wire, the connection between the multiple wires and the micro-wire is completed, the forming is fast, the efficiency is high, the process is clean and environmentally friendly, and the welding quality is improved.

Description

Technical Field

[0001] This invention relates to the field of avionics components technology, and in particular to a device and method for connecting heterogeneous material pins of sensors. Background Technology

[0002] Sensing components are crucial parts in avionics systems. Their manufacturing process involves connecting microfilaments with multiple strands of wires of varying diameters. However, the materials of the microfilaments and the multiple strands are typically dissimilar metals with significant diameter differences. Furthermore, the microfilaments are prone to softening at high temperatures, greatly increasing the difficulty of welding. Traditional fusion welding has a high heat input, easily causing the microfilaments to melt or even break. Therefore, traditional fusion welding is unsuitable for connecting microfilaments and multiple strands, leading to the selection of welding methods with lower and more stable heat input. Currently, brazing is the primary method for welding these components, generally including flame brazing, laser brazing, and resistance brazing, with resistance brazing being the most widely used. However, due to capillary action, traditional resistance brazing often results in the filler metal preferentially wetting the gaps within the multiple strands themselves, rather than the gaps between the microfilaments and the filler metal. This leads to poor wetting between the microfilaments and the filler metal, and between the multiple strands and the filler metal, resulting in decreased weld quality. Summary of the Invention

[0003] In view of this, to address the technical problem that in the existing resistance brazing process, the brazing filler metal often preferentially wets the gaps within the multi-strand wires themselves, rather than the gaps between the micro-wires and the multi-strand wires, resulting in poor wetting between the micro-wires and the brazing filler metal, and between the multi-strand wires and the brazing filler metal, thus reducing the welding quality, this invention provides a device for connecting heterogeneous material pins of sensors. This device consists of an electromagnetic shrink connector, a heating device, a magnetizer, and a coil, arranged sequentially from the inside out. The multi-strand wires and micro-wire sensor pins are fixed in the electromagnetic shrink connector, and brazing filler metal is filled in. The heating device melts the brazing filler metal into a liquid state. Subsequently, the electromagnetic force generated by the coil causes the shrink body to plastically shrink, allowing the liquid brazing filler metal to simultaneously wet both the micro-wires and the multi-strand wires. This allows the liquid brazing filler metal to better wet the gaps between the multi-strand wires and the micro-wires, completing the connection between the multi-strand wires and the micro-wires. This device is characterized by fast forming, high efficiency, cleanliness, and environmental friendliness, thus improving the welding quality.

[0004] To achieve the above objectives, the present invention provides the following technical solution:

[0005] A device for connecting heterogeneous material pins of sensors includes an electromagnetic shrink connector, a heating device, a magnet collector, and a coil, which are sequentially arranged from the inside to the outside.

[0006] The electromagnetic shrink connector includes:

[0007] The shrink body is filled with brazing filler metal and has microfilament sensor pins inside.

[0008] A heating device for heating the shrink body to melt the solder into a liquid solder;

[0009] The coil generates an electromagnetic pulse when energized, which, through the magnetizer, impacts the shrinking body at high speed, causing the shrinking body to undergo shrinkage and plastic deformation, allowing the liquid brazing filler metal to fill the gap between the multi-strand wires inside the shrinking body and the pins of the microfilament sensor.

[0010] Preferably, the heating device consists of two conductive copper terminals, each coated with a graphite layer.

[0011] Preferably, the magnet is made of copper and has an isosceles trapezoidal cross-section.

[0012] Preferably, the shrinkage body is a conductive and easily deformable alloy material.

[0013] Preferably, the solder is a solid silver-based solder sheet.

[0014] On the other hand, the present invention provides a connection method for the above-mentioned sensor heterogeneous material pin wire connection device, comprising the following steps:

[0015] S1: Fix the brazing filler metal, the dispersed ends of the multi-strand wires, and the pins of the microfilament sensor in the shrink body;

[0016] S2: Turn on the heating device; the high temperature melts the solder into a liquid state.

[0017] S3: When the coil is energized, the electromagnetic force causes the shrinkage body at the connection between the multi-strand wire and the pin of the micro-wire sensor to shrink locally.

[0018] S4: Electromagnetic force causes the entire contractile body to contract, forming a connecting joint.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] The present invention provides a sensor heterogeneous material pin connection device, which consists of an electromagnetic shrink connector, a heating device, a magnetizer, and a coil arranged sequentially from the inside out. Multi-strand wires and micro-filament sensor pins are fixed in the electromagnetic shrink connector, and solder is filled in. The heating device melts the solder to form a liquid solder. Subsequently, the electromagnetic force generated by the coil impacts the shrink connector at high speed, causing the solder to simultaneously wet both the micro-filaments and the multi-strand wires. This allows the liquid solder to better wet the gaps between the multi-strand wires and the micro-filaments, reducing the gaps and obtaining a high-quality joint. This completes the connection between the multi-strand wires and the micro-filaments, resulting in fast forming, high efficiency, cleanliness, and environmental friendliness, and improving welding quality. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of the present invention;

[0022] Figure 2 This is a schematic diagram of the electromagnetic shrink connector.

[0023] Figure 3 This is a circuit diagram of the coil wiring in this invention;

[0024] Figure 4 This is a schematic diagram of the connection method of the present invention;

[0025] In the figure, 1. Electromagnetic shrink connector, 101. Solder, 102. Shrink body, 103. Liquid solder, 2. Multi-strand wire, 201. Dispersed end, 3. Micro-filament sensor pin, 4. Electromagnetic force, 5. Connector, 6. Heating device, 7. Magnet collector, 8. Coil. Detailed Implementation

[0026] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0027] In the description of this invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top / bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0028] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "sleeved / connected," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0029] like Figure 1-3 As shown, the present invention provides a sensor heterogeneous material pin wire connection device, including an electromagnetic shrink connector 1, a heating device 6, a magnet collector 7 and a coil 8 arranged sequentially from the inside to the outside;

[0030] The electromagnetic shrink connector 1 includes:

[0031] The shrink body 102 is filled with brazing filler metal 101 and has a microfilament sensor pin 3 inside.

[0032] Heating device 6 is used to heat the shrink body 102, so that the brazing filler metal 101 is melted into liquid brazing filler metal;

[0033] The coil 8 generates an electromagnetic pulse when energized, which, through the magnetizer 7, impacts the contractile body 102 at high speed, causing the contractile body 102 to undergo contraction and plastic deformation, allowing the liquid brazing filler metal to fill the gap between the multi-strand wires 2 and the microfilament sensor pins 3 within the contractile body 102.

[0034] Preferably, the heating device 6 consists of two conductive copper terminals, each coated with a graphite layer.

[0035] Preferably, the magnet collector 7 is made of copper and has an isosceles trapezoidal cross-section.

[0036] Preferably, the shrinkage body 102 is a conductive and easily deformable alloy material, such as aluminum alloy or copper alloy.

[0037] Preferably, the solder 101 is a solid silver-based solder sheet.

[0038] The working principle of the above-mentioned sensor heterogeneous material pin wire connection device provided by the present invention is as follows:

[0039] It mainly consists of an electromagnetic shrink connector 1, a heating device 6, and a coil 8. The micro-filament sensor pin 3 and the multi-strand wire 2 are fixed in the shrink body 102 filled with solder 101. After being energized, the heating device 6 generates high temperature, which melts the solder 101 into liquid solder 103. At this time, the high voltage capacitor discharges instantaneously to the coil 8 to generate an electromagnetic pulse. Through the magnetic collection device 7, eddy currents are generated in the conductive workpieces of the adjacent coils, and a corresponding instantaneous strong magnetic field is generated, so that the electromagnetic force 4 acts on the shrink body 101. Due to the high-speed impact of the electromagnetic pulse, the shrink body 102 can quickly shrink and deform, allowing the solder 101 to wet the multi-strand wire 2 and the micro-filament, reducing the gap and improving the welding efficiency.

[0040] like Figure 4 As shown, on the other hand, the present invention provides a connection method for the above-mentioned sensor heterogeneous material pin wire connection device, specifically including the following steps:

[0041] S1: Fix the brazing filler metal 101, the dispersed end 201 of the multi-strand wire 2, and the microfilament sensor pin 3 in the shrink body 102;

[0042] S2: Start the device. After power is applied, the heating device 6 is turned on. The high temperature melts the brazing filler metal 101 into liquid brazing filler metal 103.

[0043] S3: When the coil 8 is energized, it generates an electromagnetic pulse. Through the magnet collector 7, the electromagnetic force 4 first impacts the contraction body 102 at high speed, causing it to undergo contraction and plastic deformation, resulting in local contraction. This allows the liquid brazing filler 103 to fill the gap between the multi-strand wire 2 and the micro-wire sensor pin 3.

[0044] S4: Subsequently, the entire shrinking body 102 shrinks and deforms under the action of electromagnetic force 4, and a joint 5 is formed at the dispersed end 201 of the multi-strand wire 2 and the pin 3 of the microfilament sensor, thus completing the connection between the multi-strand wire 2 and the microfilament.

[0045] In summary, this invention utilizes the heating device 6 to heat and melt the brazing filler metal 101 to form a liquid brazing filler metal 103. Subsequently, the electromagnetic force 4 generated by the coil 8 impacts the shrinking body 102 at high speed, causing the brazing filler metal 101 to simultaneously wet the microfilaments and multi-strand wires 2. This allows the liquid brazing filler metal 103 to wet the multi-strand wires 2 and microfilaments to a greater extent, thereby better wetting the gap between the multi-strand wires 2 and microfilaments, reducing the gap, obtaining a high-quality joint, and completing the connection between the multi-strand wires 2 and microfilaments. This invention features fast forming, high efficiency, and clean and environmentally friendly operation, improving the welding quality.

[0046] The above are merely preferred embodiments of the present invention; however, the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and its improved concept, should be covered within the scope of protection of the present invention.

Claims

1. A device for connecting heterogeneous material pins in sensors, characterized in that, It includes an electromagnetic shrink connector, a heating device, a magnet collector, and a coil, which are sequentially arranged from the inside out; The electromagnetic shrink connector includes: The shrink body is filled with brazing filler metal and has microfilament sensor pins inside. A heating device for heating the shrink body to melt the solder into a liquid solder; The coil generates an electromagnetic pulse when energized, which, through the magnetizer, impacts the shrinking body at high speed, causing the shrinking body to undergo shrinkage and plastic deformation, allowing the liquid brazing filler metal to fill the gap between the multi-strand wires inside the shrinking body and the pins of the microfilament sensor.

2. The sensor heterogeneous material pin connection device according to claim 1, characterized in that, The heating device consists of two conductive copper terminals, each coated with a graphite layer.

3. The sensor heterogeneous material pin connection device according to claim 1, characterized in that, The magnet is made of copper and has an isosceles trapezoidal cross-section.

4. The sensor heterogeneous material pin connection device according to claim 1, characterized in that, The shrinkage body is made of a conductive and easily deformable alloy material.

5. A sensor heterogeneous material pin connection device according to any one of claims 1-4, characterized in that, The solder is a solid silver-based solder sheet.

6. A connection method for a sensor heterogeneous material pin connection device according to any one of claims 1-5, characterized in that, Includes the following steps: S1: Fix the brazing filler metal, the dispersed ends of the multi-strand wires, and the pins of the microfilament sensor in the shrink body; S2: Turn on the heating device; the high temperature melts the solder into a liquid state. S3: When the coil is energized, the electromagnetic force causes the shrinkage body at the connection between the multi-strand wire and the pin of the micro-wire sensor to shrink locally. S4: Electromagnetic force causes the entire contractile body to contract, forming a connecting joint.

Images