A microchannel fluid heat dissipation device and a heat dissipation control system

Abstract

The present invention provides a microchannel fluid cooling device and a cooling control system, which relate to the field of electronic devices. The microchannel fluid cooling device and the cooling control system include a cooling device with microchannels and an electronic device. Heat conduction is carried out between the cooling device with microchannels and the electronic device. One end of the cooling device with microchannels is connected to a liquid inlet pipe, and a flowmeter is installed on the liquid inlet pipe. The flowmeter is close to the inlet of the cooling device with microchannels. One end of the flowmeter is connected to a filter, one end of the filter is connected to a valve, and one end of the valve is connected to a pulsating pump. In the case of a sinusoidal pulsating flow, the backflow vortex of the microchannel fluid cooling device and the cooling control system is affected by the pulsating flow, and its volume is significantly reduced. This enables the liquid with a lower temperature above the channel to mix with the working fluid with a higher temperature near the backflow vortex, improving the convective heat transfer of the microchannel and enabling better heat dissipation of the electronic device.

Description

Technical Field

[0001] The present invention relates to a heat dissipation device, in particular to a microchannel fluid heat dissipation device and a heat dissipation control system, belonging to the technical field of electronic devices. Background Art

[0002] With the rapid development of electronic technology, miniaturized and highly integrated high-power electronic devices are increasingly widely used. A large number of transistors are integrated on a single chip. A significant increase in the number of integrated devices per unit area of the chip will lead to a greatly increased heat flux density. In particular, the heat flux density of local hot spots can even reach as high as 500 - 1000 W / cm2, and there is an increasing trend.

[0003] At the same time, since the reduction of the chip size has approached the limit, the stacking of multiple layers of chips and the overall miniaturization of the device will make the heat of three-dimensional integrated circuits more difficult to dissipate, making the heat generation problem of the chips more serious. The excessively high heat flux density of the chips will cause the device temperature to exceed its normal operating temperature range, thereby accelerating the deterioration of the electrodes, reducing its service life, and even being unable to work properly in severe cases. Relevant research indicates that for every 1°C increase in the temperature of an electronic chip at the level of 70 - 80°C, its reliability will decrease by 5%. More than 55% of the electronic device failure problems are related to thermal management. Therefore, the heat dissipation technology of electronic devices has become an important factor restricting its further rapid development.

[0004] In most heat dissipation devices and methods for electronic devices, they are often limited to liquid cooling working media with a constant flow rate. Although the liquid cooling working media with a steady flow can also achieve the effect of heat dissipation and temperature reduction, its heat transfer effect is still poor. For some high-computing-power and high-heat-generation chips and electronic devices, it still cannot meet the good use and maintain a good operating condition. Summary of the Invention

[0005] The present invention is achieved through the following technical solutions: A microchannel fluid heat dissipation device and a heat dissipation control system, including a heat dissipation device with microchannels and an electronic device. Heat conduction occurs between the heat dissipation device with microchannels and the electronic device. One end of the heat dissipation device with microchannels is connected to a liquid inlet pipe, a flow meter is installed on the liquid inlet pipe, the flow meter is close to the inlet of the heat dissipation device with microchannels, one end of the flow meter is connected to a filter, one end of the filter is connected to a valve, one end of the valve is connected to a pulsating pump, the other end of the heat dissipation device with microchannels is connected to a heat exchanger, and one end of the heat exchanger is connected to the pulsating pump for liquid reflux;

[0006] The described device is applicable to the following heat dissipation control system;

[0007] The heat dissipation control system includes a processor, a control module, a storage unit, a reading unit, a wireless transmission module, a cloud storage server, a network reading module, data comparison, and data correction;

[0008] The flowmeter is used to measure the pulsating flow rate of the heat dissipation device with microchannels. The dimensionless verification method for the pulsating flow rate includes: using the dimensionless calculation formula for sinusoidal pulsating flow:

[0009]

[0010] where: A is the amplitude, T is the period of the pulsating flow, and the pulsation frequency is the reciprocal of the pulsating flow period;

[0011] Q is the instantaneous flow rate, and Q ave is the average flow rate of the pulsating pump;

[0012] When t / T = 0, Q / Q ave = 1, that is, Q = Q ave ;

[0013] When t = T / 4, Q = Q ave (1 + A), that is, Q = Q ave (1 + A), and the flow rate reaches the maximum value;

[0014] When t = T / 2, Q = Q ave , that is, Q = Q ave ;

[0015] When t = 3T / 4, Q = Q ave (1 - A), that is, Q = Q ave (1 - A), and the flow rate reaches the minimum value.

[0016] Preferably, the processor is used to control the control module and receive data feedback from the control module. The control module is used to control the valve and the pulsating pump. The flowmeter is used to monitor the flow rate on the fluid path of the valve and the pulsating pump. The flow rate data obtained by the flowmeter can be transmitted to the storage unit for storage or transmitted to the processor for data processing in real time. The data of the valve, the pulsating pump, and the flowmeter are stored in the storage unit. The reading unit is used to read the stored data in the storage unit. The data read by the reading unit can be directly transmitted to the processor or uploaded to the cloud storage server using the wireless transmission module.

[0017] Preferably, the liquid includes deionized water, silicon-containing coolant, and fluorine-containing coolant.

[0018] Preferably, the filter is used to filter impurities in the liquid.

[0019] Preferably, the heat dissipation device with microchannels is made of a metal with high thermal conductivity.

[0020] Preferably, the networking reading module is configured to read the opening / closing data of the valve, the operating data of the pulsating pump, and the flow data of the flowmeter stored in the cloud storage server, and after data comparison and data correction, transmit the data to the processor. The data comparison is used to compare the opening / closing data of the valve, the operating data of the pulsating pump, and the flow data of the flowmeter multiple times, and select the relatively accurate median data, that is, this similar number appears multiple times, and this data is more representative. The data correction is used to report errors for the data with large deviations and transmit them to the processor for recording.

[0021] The present invention provides a microchannel fluid cooling device and a cooling control system, and the beneficial effects thereof are as follows:

[0022] 1. The microchannel fluid cooling device and the cooling control system use a pulsating flow in a sine form, and the backflow vortex 2 formed by the cooling device with microchannels and the electronic device is reduced, and there is a situation where the backflow vortex 1 disappears. The backflow vortex in the case of the sine-form pulsating flow is affected by the pulsating flow, and the volume is significantly reduced. In this way, the liquid with a lower temperature above the microchannel is mixed with the working medium with a higher temperature near the backflow vortex, improving the convective heat transfer of the microchannel and enabling better heat dissipation of the electronic device.

[0023] 2. The microchannel fluid cooling device and the cooling control system change the cooling working medium of the cooling device with microchannels from a steady flow with a constant flow rate to a pulsating flow with a periodically changing flow rate, triggering the formation of new vortices in the microchannel, thereby destroying the thermal boundary layer and the backflow vortex structure, further enhancing the mixing of the cold and hot fluids, and thus increasing the convective heat transfer coefficient and ultimately further reducing the temperature of the electronic device.

[0024] 3. The microchannel fluid cooling device and the cooling control system continuously transmit the measured flow data in the passage to the processor through the flowmeter. The processor processes the data, makes fine adjustments and supervision. At the same time, all these data will be stored in the storage unit and then transmitted to the processor after being read by the reading unit. In this way, the storage unit can use the historical data as the comparison data for the processor to process the data, improving the accuracy of control.

[0025] 4. The microchannel fluid cooling device and the cooling control system avoid the loss of data during hardware storage, improve the security of the data, and are beneficial to better controlling the waveform pulsating flow of the passage, making the verification results more accurate. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0027] Figure 2 It is a schematic diagram of a pulsating flow in a square wave form;

[0028] Figure 3 Schematic diagram of pulsating flow in the form of a triangular wave;

[0029] Figure 4 Schematic diagram of the pulsating flow in the form of a sine wave according to the present invention;

[0030] Figure 5 Schematic diagram of streamline distribution under the steady flow condition of the present invention;

[0031] Figure 6 Schematic diagram of streamline distribution under the pulsating flow condition in the form of a sine wave according to the present invention;

[0032] Figure 7 Schematic diagram of the principle of the heat dissipation control system according to the present invention.

[0033]

Description of symbols of main components

[0034] 111, valve; 3, filter; 4, flowmeter; 5, heat dissipation device with microchannels; 6, electronic device; 7, heat exchanger; 11, pulsating pump. Specific embodiments

[0035] The embodiment of the present invention provides a microchannel fluid heat dissipation device and a heat dissipation control system.

[0036] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 , including a heat dissipation device 5 with microchannels and an electronic device 6, heat conduction is carried out between the heat dissipation device 5 with microchannels and the electronic device 6, one end of the heat dissipation device 5 with microchannels is connected to a liquid inlet pipe, a flowmeter 4 is installed on the liquid inlet pipe, the flowmeter 4 is close to the inlet of the heat dissipation device 5 with microchannels, one end of the flowmeter 4 is connected to a filter 3, one end of the filter 3 is connected to a valve 111, one end of the valve 111 is connected to a pulsating pump 11, the other end of the heat dissipation device 5 with microchannels is connected to a heat exchanger 7, one end of the heat exchanger 7 is connected to the pulsating pump 11 for liquid reflux, the liquid includes deionized water, silicon-containing coolant and fluorine-containing coolant, and the filter 3 is used to filter impurities in the liquid.

[0037] The heat dissipation device 5 with microchannels is made of a metal with high thermal conductivity;

[0038] The flowmeter 4 is used to measure the pulsating flow rate of the heat dissipation device 5 with microchannels, and the dimensionless verification method of the pulsating flow rate includes: using the dimensionless calculation formula of the pulsating flow in the form of a sine wave:

[0039]

[0040] Where: A is the amplitude, T is the period of the pulsating flow, and the pulsation frequency is the reciprocal of the period of the pulsating flow;

[0041] Q is the instantaneous flow rate, and Q ave is the average flow rate of the pulsating pump;

[0042] When t / T = 0, Q / Q ave = 1, that is, Q = Q ave ;

[0043] When t = T / 4, Q = Q ave (1 + A), that is, Q = Q ave (1 + A), and the flow rate reaches the maximum value;

[0044] When t = T / 2, Q = Q ave , that is, Q = Q ave ;

[0045] When t = 3T / 4, Q = Q ave (1 - A), that is, Q = Q ave (1 - A), and the flow rate reaches the minimum value.

[0046] To further illustrate the meaning of the formula, converting the above dimensionless expression into a dimensional expression is:

[0047]

[0048] That is, the instantaneous flow rate is a periodically varying, sinusoidal pulsating flow;

[0049] When t = 0, Q = Q ave ;

[0050] When t = T / 4, Q = Q ave (1 + A);

[0051] When t = T / 2, Q = Q ave ;

[0052] When t = 3T / 4, Q = Q ave (1 - A).

[0053] Specifically, in the present invention, the liquid is pumped out by the pulsating pump 11. The valve 111 controls the opening and closing of the liquid release. When it is open, it forms a circulation path; when it is closed, the circulation stops. The opening and closing degree of the valve 111 can cooperate with the power of the pulsating pump 11 to control the liquid flux. When the liquid passes through the filter 3, it is filtered to avoid impurities in the liquid affecting the heat conduction effect, thus playing a role in purifying the liquid. The liquid can be commonly used electronic device cooling liquids such as deionized water, pure water, silicon-containing coolant, fluorine-containing coolant, etc. Different from gases, but the selection of the liquid is not overly restricted. The flowmeter is used to detect the liquid flow rate entering the path from the valve 111 and the pulsating pump 11. The flowmeter 4 can be installed at both the inlet and outlet of the heat dissipation device 5 with microchannels. This installation position does not affect the use of the device and the accuracy of detection, or rather the influence can be negligible. When the liquid passes through the heat dissipation device 5 with microchannels, it can take away a large amount of heat inside the heat dissipation device 5 with microchannels and simultaneously reduce the heat of the electronic device 6 by means of heat conduction. When the liquid passes through the microchannels inside the heat dissipation device 5 with microchannels, a reflux vortex will be formed between the heat dissipation device 5 with microchannels and the electronic device 6. Please refer to the attached Figure 5 , use steady-state flow liquid to pass through the heat dissipation device 5 with microchannels and the electronic device 6, and compare with the attached Figure 6 , use pulsating flow in the form of a sine wave to flow through the heat dissipation device 5 with microchannels and the electronic device 6. The form of its reflux vortex is different. From the attached drawings, the reflux vortex 2 formed by using pulsating flow in the form of a sine wave to pass through the heat dissipation device 5 with microchannels and the electronic device 6 decreases, and there is a situation where the reflux vortex 1 disappears. The reflux vortex in the case of pulsating flow in the form of a sine wave is affected by the pulsating flow, and its volume decreases significantly. This makes the liquid with a lower temperature above the microchannel mix with the working medium with a higher temperature near the reflux vortex, improving the convective heat transfer of the microchannel and enabling better heat dissipation of the electronic device 6. It should be noted here that the pulsating flow in the form of a sine wave is controlled by the valve 111, the pulsating pump 11, and the control module that will be mentioned later to form a pulsating flow. Its flow rate changes periodically in the form of a sine wave. The pulsating flow entering the heat dissipation device 5 with microchannels triggers new vortices, thereby destroying the thermal boundary layer and the reflux vortex structure, further enhancing the mixing of cold and hot fluids, and ultimately improving the heat dissipation performance of the heat dissipation device 5 with microchannels. The temperature of the cooling working medium liquid increases, and the temperature of the heat dissipation device 5 with microchannels decreases significantly. After the cooling working medium leaves the heat dissipation device 5 with microchannels, it enters the heat exchanger 7 to be cooled. The heat exchanger 7 contacts the external air or other media for heat dissipation, and then undergoes the next cycle again. The present invention changes the cooling working medium of the heat dissipation device 5 with microchannels from a steady-state flow with a constant flow rate to a pulsating flow with a periodically changing flow rate, triggering the formation of new vortices in the microchannels, thereby destroying the thermal boundary layer and the reflux vortex structure, further enhancing the mixing of cold and hot fluids, and thus increasing the convective heat transfer coefficient and ultimately further reducing the temperature of the electronic device 6.

[0054] The principle of the above device is discussed in Table 1 and Table 2 below:

[0055] Table 1. Average Temperature at Different Positions of the Chip under the Condition of Average Flow Rate of 0.0105 kg / s

[0056]

[0057]

[0058] Table 2. Average Temperature of the Chip Corresponding to Different Flow Rates

[0059]

[0060] Combined with the above tables, taking the pulsating flow in the form of a sine wave as an example:

[0061] Table 1 gives the average temperatures at different positions of the chip under steady-state flow and pulsating flow in the form of a sine wave. A pulsating flow in the form of a sine wave is applied, with a pulsation frequency of 23 Hz, an amplitude A = 0.2, and an average flow rate Qave = 0.0105 kg / s. The instantaneous flow rate generated by the pulsating pump 11 satisfies:

[0062]

[0063] It can be seen that compared with the steady-state flow, the pulsating flow in the form of a sine wave reduces the temperatures at different positions of the chip.

[0064] Table 2 gives the average temperatures of the whole chip under steady-state flow and pulsating flow at different flow rates. A pulsating flow in the form of a sine wave is applied, with a pulsation frequency of 23 Hz and an amplitude A = 0.2. It can be seen that compared with the steady-state flow, the overall temperature of the chip decreases when using the pulsating flow in the form of a sine wave.

[0065] In addition, through the control of the control module, the pulsating pump 11 and the valve 111, pulsating flows in the form of triangular waves and square waves can also be generated.

[0066] Please refer to Figure 1 and Figure 7 , the described device is applicable to the following heat dissipation control system;

[0067] The heat dissipation control system includes a processor, a control module, a storage unit, a reading unit, a wireless transmission module, a cloud storage server, a network reading module, data comparison, and data correction;

[0068] The processor is used to control the control module and receive data feedback from the control module. The control module is used to control Valve 111 and the pulsating pump 11. The flowmeter 4 is used to monitor the flow rate in the fluid path of Valve 111 and the pulsating pump 11. The flow rate data obtained by the flowmeter can be transmitted to the storage unit for storage or transmitted to the processor for data processing in real time. The data of Valve 111, the pulsating pump 11, and the flowmeter 4 are stored in the storage unit. The reading unit is used to read the stored data in the storage unit. The data read by the reading unit can be directly transmitted to the processor or uploaded to the cloud storage server using a wireless transmission module. The networked reading module is used to read the opening / closing data of Valve 111, the operating data of the pulsating pump 11, and the flow rate data of the flowmeter 4 stored in the cloud storage server, and after data comparison and data correction, transmit them to the processor. The data comparison is used to compare the opening / closing data of Valve 111, the operating data of the pulsating pump 11, and the flow rate data of the flowmeter 4 multiple times, and select the relatively accurate median data, that is, this similar number appears multiple times, and this data is more representative. The data correction is used to report errors for data with large deviations and transmit them to the processor for recording.

[0069] Specifically, the control of Valve 111 and the pulsating pump 11 is achieved through the control module, so as to form pulsating flows with different waveforms in the passage of the device. Moreover, the processor can issue corresponding instructions to be transmitted to the control module, and then send instructions to Valve 111 and the pulsating pump 11 for execution. During this process, the flowmeter 4 continuously transmits the measured flow rate data in the passage to the processor. The processor processes the data, makes fine adjustments and supervision. At the same time, all these data will be stored in the storage unit, and then transmitted to the processor after being read by the reading unit. In this way, the storage unit can use the historical data as the comparison data for the processor to process data, improving the control accuracy.

[0070] In addition, the data of the reading unit can also be uploaded to the cloud storage server through the wireless transmission module to avoid data loss during hardware storage, improving data security. Through the networked reading module, after reading the data from the cloud storage server and performing data comparison and data correction, the processor receives these data, which can achieve a large amount of data comparison and data correction, and thus more accurately control Valve 111 and the pulsating pump 11, which is beneficial to better control the waveform pulsating flow of the passage and make the verification results more accurate.

[0071] The foregoing has shown and described the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments, and what is described in the above embodiments and the specification is only to illustrate the principle of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements fall within the scope of the present invention claimed. The scope of the present invention claimed is defined by the appended claims and their equivalents.

Claims

1. A microchannel fluid heat dissipation control system, comprising a heat dissipation device (5) with microchannels and an electronic device (6), where heat conduction occurs between the heat dissipation device (5) with microchannels and the electronic device (6), and is characterized in that: One end of the heat dissipation device (5) with microchannels is connected to a liquid inlet pipe, on which a flow meter (4) is installed. The flow meter (4) is near the inlet of the heat dissipation device (5) with microchannels. One end of the flow meter (4) is connected to a filter (3), one end of the filter (3) is connected to a valve (111), one end of the valve (111) is connected to a pulsating pump (11). The other end of the heat dissipation device (5) with microchannels is connected to a heat exchanger (7), and one end of the heat exchanger (7) is connected to the pulsating pump (11) for liquid reflux; The described device is applicable to the following heat dissipation control system; The heat dissipation control system includes a processor, a control module, a storage unit, a reading unit, a wireless transmission module, a cloud storage server, a networked reading module, data comparison, and data correction; The flow meter (4) is used to measure the pulsating flow rate of the heat dissipation device (5) with microchannels. The dimensionless verification method for the pulsating flow rate includes: using the dimensionless calculation formula for sinusoidal pulsating flow: Where: A is the amplitude, T is the period of the pulsating flow, and the pulsation frequency is the reciprocal of the period of the pulsating flow; Q is the instantaneous flow rate, and Q ave is the average flow rate of the pulsating pump; When t / T = 0, Q / Q ave = 1, that is, Q = Q ave ; When t = T / 4, Q = Q ave (1 + A), that is, Q = Q ave (1 + A), and the flow rate reaches the maximum value; When t = T / 2, Q = Q ave , that is, Q = Q ave ; When t = 3T / 4, Q = Q ave (1 - A), that is, Q = Q ave (1 - A), and the flow rate reaches the minimum value; The processor is used to control the control module and receive data feedback from the control module. The control module is used to control the valve (111) and the pulsating pump (11). The flow meter (4) is used to monitor the flow rate on the fluid path of the valve (111) and the pulsating pump (11). The flow rate data obtained by the flow meter can be transmitted to the storage unit for storage or transmitted to the processor for data processing in real time. The data of the valve (111), the pulsating pump (11), and the flow meter (4) are stored in the storage unit. The reading unit is used to read the stored data in the storage unit, and the data read by the reading unit is directly transmitted to the processor or uploaded to the cloud storage server using the wireless transmission module; The networked reading module is used to read the opening and closing data of the valve (111), the operating data of the pulsating pump (11), and the flow rate data of the flow meter (4) stored in the cloud storage server, and after data comparison and data correction, transmit them to the processor. The data comparison is used to compare the opening and closing data of the valve (111), the operating data of the pulsating pump (11), and the flow rate data of the flow meter (4) multiple times, and select the relatively accurate median data, that is, this similar number appears multiple times, and this data is more representative. The data correction is used to report errors for data with large deviations and transmit them to the processor for recording.

2. The microchannel fluid heat dissipation control system according to claim 1, characterized in that: The liquid includes deionized water, silicon-containing coolant, and fluorine-containing coolant.

3. The microchannel fluid heat dissipation control system according to claim 1, wherein: The filter (3) is used to filter impurities in the liquid.

4. The microchannel fluid heat dissipation control system according to claim 1, characterized in that: The heat dissipation device (5) with microchannels is made of a metal with high thermal conductivity.

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