Directional coupler, high frequency module, and communication device

Abstract

The present application provides a directional coupler capable of suppressing electromagnetic coupling between first to third sub-lines. The directional coupler is provided with a main line, first to third sub-lines, and a multilayer substrate. The multilayer substrate has a plurality of dielectric layers. The multilayer substrate has a first main surface and a second main surface opposite to each other. The main line, the first sub-line, the second sub-line, and the third sub-line are formed in a ring shape when viewed from the thickness direction of the multilayer substrate, and are arranged on mutually different dielectric layers among the plurality of dielectric layers. The first sub-line, the second sub-line, and the third sub-line have mutually different first distances. Among the first sub-line, the second sub-line, and the third sub-line, a largest sub-line having the largest first distance and a smallest sub-line having the smallest first distance are arranged on the first main surface side of the main line, and an intermediate sub-line having an intermediate first distance is arranged on the second main surface side of the main line.

Description

TECHNICAL FIELD

[0001] The present application relates to a directional coupler, a high-frequency module, and a communication device. BACKGROUND

[0002] The directional coupler described in Patent Document 1 is provided with a main line, three sub-lines (first to third sub-lines), and a mounting substrate having a multilayer structure (multilayer substrate). The main line and the three sub-lines are disposed on the mounting substrate. Two of the three sub-lines are disposed with the main line interposed therebetween. Thereby, electromagnetic coupling with the main line is improved, and electromagnetic coupling between the two sub-lines is suppressed.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2021-27426

[0004] However, in Patent Document 1, regarding the third sub-line of the three sub-lines, there is no description of how to be disposed on the mounting substrate, electromagnetic coupling with the main line can be improved, and electromagnetic coupling with the two sub-lines described above can be suppressed. Therefore, in Patent Document 1, it is difficult to suppress electromagnetic coupling between each of the three sub-lines. SUMMARY

[0005] The present application relates to a directional coupler, a high-frequency module, and a communication device.

[0006] A directional coupler according to an embodiment of the present application includes a main line, a first sub-line, a second sub-line, a third sub-line, and a multilayer substrate. The multilayer substrate includes a plurality of dielectric layers. The multilayer substrate includes a first main surface and a second main surface that face each other. The first sub-line and the second sub-line are connected in series. The second sub-line and the third sub-line are connected in series. The main line, the first sub-line, the second sub-line, and the third sub-line include a loop-shaped line portion when viewed from a thickness direction of the multilayer substrate. The main line, the first sub-line, the second sub-line, and the third sub-line each include the line portion in different dielectric layers of the plurality of dielectric layers. In each of the first sub-line, the second sub-line, and the third sub-line, a maximum distance between an outer periphery and a center of gravity is a first distance. The first sub-line, the second sub-line, and the third sub-line include a maximum first distance, an intermediate first distance, and a minimum first distance that are different from each other. In the first sub-line, the second sub-line, and the third sub-line, a maximum sub-line having the maximum first distance and a minimum sub-line having the minimum first distance are arranged on the first main surface side of the main line, and an intermediate sub-line having the intermediate first distance is arranged on the second main surface side of the main line.

[0007] A high-frequency module according to an embodiment of the present application includes the directional coupler, an antenna terminal, and a signal path. The signal path reaches the antenna terminal. The main line of the directional coupler constitutes a part of the signal path.

[0008] A high-frequency module according to an embodiment of the present application includes the directional coupler, an antenna terminal, a plurality of filters, and a second switch. The second switch switches connection and non-connection of a first signal path that reaches the antenna terminal and each of a plurality of second signal paths that reach the plurality of filters. The IC chip further includes the second switch.

[0009] A communication device according to an embodiment of the present application includes the high-frequency module and a signal processing circuit. The signal processing circuit is connected to the high-frequency module and processes a high-frequency signal.

[0010] The directional coupler, the high-frequency module, and the communication device according to the above-described embodiment of the present application have the following advantages. Electromagnetic coupling between the main line and the first to third sub-lines can be increased, and electromagnetic coupling between the first to third sub-lines can be suppressed. BRIEF DESCRIPTION OF DRAWINGS

[0011] Figure 1 is an equivalent circuit diagram of the directional coupler according to Embodiment 1.

[0012] Figure 2 This is an equivalent circuit diagram used to illustrate the LB mode of the directional coupler described above.

[0013] Figure 3 This is an equivalent circuit diagram used to illustrate the MB mode of the directional coupler described above.

[0014] Figure 4 This is an equivalent circuit diagram used to illustrate the HB mode of the directional coupler described above.

[0015] Figure 5 This is a structural diagram illustrating an example of the structure of the aforementioned directional coupler.

[0016] Figure 6 yes Figure 5 Sectional view along line X1-X1.

[0017] Figure 7 This is a cross-sectional view of the multilayer substrate of the aforementioned directional coupler.

[0018] Figure 8 This is a three-dimensional diagram showing the main circuit of the aforementioned directional coupler and the first to third auxiliary circuits.

[0019] Figure 9 This is a top view showing the main circuit, the first auxiliary circuit, and the second auxiliary circuit of the aforementioned directional coupler.

[0020] Figure 10 This is a top view showing the main circuit and the third auxiliary circuit of the aforementioned directional coupler.

[0021] Figure 11 This is a cross-sectional view of the multilayer substrate of the directional coupler involved in Modified Example 1.

[0022] Figure 12 This is a three-dimensional view showing the first main circuit, the second main circuit, and the first to third auxiliary circuits of the directional coupler involved in Modification Example 2.

[0023] Figure 13 This is a cross-sectional view of the multilayer substrate of the aforementioned directional coupler.

[0024] Figure 14 This is a structural diagram showing an example of the communication device involved in Embodiment 2.

[0025] Explanation of reference numerals in the attached figures

[0026] 1 directional coupler; 2 main line; 2a first end; 2b second end; 2s outer periphery; 2u inner side portion; 2v outer side portion; 2w cut-off portion; 3 sub line; 5, 6 first switch; 5a, 6a common terminal; 5b, 5c, 6b, 6c selection terminal; 7 termination circuit; 7a resistor; 8 multilayer substrate; 8s first main surface; 8t second main surface; 9 IC chip; 10 resin member; 11 external connection electrode; 11g ground electrode; 12 electrode pad; 21 first main line; 21a first end; 21b second end; 21s outer periphery; 21t inner periphery; 21u inner side portion; 21v outer side portion; 22 second main line; 22a first end; 22b second end; 22u inner side portion; 31 first sub line (smallest sub line); 31a first end; 31b second end; 31s outer periphery; 31v outer side portion; 31w cut-off portion; 32 second sub line (largest sub line); 32a first end; 32b second end; 32t inner periphery; 32u inner side portion; 32w cut-off portion; 33 third sub line (intermediate sub line); 33a first end; 33b second end; 33s outer periphery; 33w cut-off portion; 41 input port; 42 output port; 43 first coupling port; 44 second coupling port; 45 third coupling port; 51-54 switch; 55 second switch; 55a common terminal; 55b-55e selection terminal; 57 multilayer substrate; 58 IC chip; 60 duplexer; 60H second filter; 60L first filter; 61-64 duplexer (filter); 61R-64R reception filter; 61T-61T transmission filter; 71-74 matching circuit; 81-86 dielectric layer; 81a-85a first main surface; 91 electrode pad; 92 solder bump; 100 high frequency module; 110 external connection terminal; 111, 112 signal input terminal; 121, 122 signal output terminal; 130 antenna terminal; 131, 132 output matching circuit; 141, 142 matching circuit; 151, 152 power amplifier; 161, 162 low noise amplifier; 181-183 first to third coupler output terminal; 200 communication device; 210 signal processing circuit; 211 RF signal processing circuit; 212 baseband signal processing circuit; 220 antenna; d0-d3, d21, d22 line width; D1 thickness direction; H1 wiring conductor; L0-L3 center of gravity; Q1 interval; R0 first distance; R1 first distance (smallest first distance); R2 first distance (largest first distance); R3 intermediate first distance (intermediate first distance); S0 first signal path (signal path); S1-S4 second signal path. Detailed Implementation

[0027] Hereinafter, the directional coupler, high-frequency module, and communication device according to the embodiments will be described with reference to the accompanying drawings. Furthermore, the sizes, thicknesses, and dimensional relationships of the constituent elements described in the specification and drawings are illustrative, and these constituent elements are not limited to the illustrative examples described in the specification and drawings.

[0028] (Implementation Method 1)

[0029] (1) Equivalent circuit of directional coupler

[0030] Reference Figure 1 The equivalent circuit of the directional coupler 1 according to Embodiment 1 will be described.

[0031] Directional coupler 1 is used, for example, in high-frequency modules of communication devices. Figure 1 As shown, the directional coupler 1 is a device that extracts a portion of the high-frequency signal flowing through a section of the signal path (main line 2) within the high-frequency module from the secondary line 3, which is electromagnetically coupled to the main line 2, as a detection signal. By monitoring the detection signal, the high-frequency signal flowing through the main line 2 can be monitored. The directional coupler 1 in this embodiment is configured to handle high-frequency signals from multiple frequency bands by allowing the line length of the secondary line 3 to vary in multiple stages (e.g., three stages).

[0032] The directional coupler 1 includes: a main line 2, a secondary line 3, multiple ports 4, two switches 5 and 6, and a termination circuit 7. Hereinafter, switches 5 and 6 will be referred to as the first switches 5 and 6.

[0033] The multiple ports 4 include an input port 41, an output port 42, and three coupling ports (first coupling port 43, second coupling port 44, and third coupling port 45). Input port 41 is used to input high-frequency signals from the outside to the main line 2. Output port 42 is used to output high-frequency signals from the main line 2 to the outside. The three coupling ports (first coupling port 43, second coupling port 44, and third coupling port 45) are used to output detector signals from the secondary line 3 to the outside. First coupling port 43 is the coupling port when the secondary line 3 is at its shortest length, second coupling port 44 is the coupling port when the secondary line 3 is at its medium length, and third coupling port 45 is the coupling port when the secondary line 3 is at its longest length.

[0034] Termination circuit 7 is a circuit that terminates one end of secondary line 3. Termination circuit 7 is connected between one end of secondary line 3 and ground. Termination circuit 7, for example, has a resistor 7a.

[0035] The main line 2 is a line through which a high-frequency signal to be detected flows. The main line 2 has a first end 2a and a second end 2b. The first end 2a of the main line 2 is connected to the input port 41. The second end 2b of the main line 2 is connected to the output port 42.

[0036] The sub line 3 is a line electromagnetically coupled to the main line 2 and taking out a part of the high-frequency signal flowing in the main line 2 as a detected signal. The sub line 3 has three sub lines (a first sub line 31, a second sub line 32, and a third sub line 33). For example, at least two of the above three sub lines have mutually different line lengths. In the present embodiment, all of the above three sub lines have mutually different line lengths. For example, the line length of the second sub line 32 is the longest, the line length of the first sub line 31 is the shortest, and the line length of the third sub line 33 is a length intermediate between the line length of the first sub line 31 and the line length of the second sub line 32.

[0037] The first sub line 31 has a first end 31a and a second end 31b. The first end 31a of the first sub line 31 is connected to the ground via the termination circuit 7. The second end 31b of the first sub line 31 is connected to the common terminal 5a of the first switch 5 described later. The second sub line 32 has a first end 32a and a second end 32b. The first end 32a of the second sub line 32 is connected to the selection terminal 5b of the first switch 5. The second end 32b of the second sub line 32 is connected to the common terminal 6a of the second switch 6 described later. The third sub line 33 has a first end 33a and a second end 33b. The first end 33a of the third sub line 33 is connected to the selection terminal 6b of the second switch 6 described later. The second end 33b of the third sub line 33 is connected to the third coupling port 45. The first sub line 31 and the second sub line 32 are connected in series via the first switch 5. The second sub line 32 and the third sub line 33 are connected in series via the second switch 6.

[0038] The first switches 5, 6 are line length switching switches for switching the line lengths of the sub lines 3 to a plurality of stages (for example, three stages). The first switches 5, 6 are constituted by, for example, a switch IC. The first switch 5 is connected between adjacent two of the above three sub lines (the first sub line 31 and the second sub line 32). The second switch 6 is connected between adjacent two of the above three sub lines (the second sub line 32 and the third sub line 33).

[0039] More specifically, the first switch 5 has one common terminal 5a and two selection terminals 5b, 5c. The common terminal 5a is selectively connectable to either of the two selection terminals 5b, 5c. The common terminal 5a is connected to the second end 31b of the first sub-line 31. The selection terminal 5b is connected to the first end 32a of the second sub-line 32. The selection terminal 5c is connected to the first coupling port 43. The first switch 6 has one common terminal 6a and two selection terminals 6b, 6c. The common terminal 6a is selectively connectable to either of the two selection terminals 6b, 6c. The common terminal 6a is connected to the second end 32b of the second sub-line 32. The selection terminal 6b is connected to the first end 33a of the third sub-line 33. The selection terminal 6c is connected to the second coupling port 44.

[0040] In the directional coupler 1, by switching the connection destination of the common terminals 5a, 6a of the first switches 5, 6, one or more of the three sub-lines (the first sub-line 31, the second sub-line 32, and the third sub-line 33) are selected to function as the sub-line 3, and one of the three coupling ports (the first to third coupling ports 43 to 45) is selected to function as the coupling port. That is, the one or more sub-lines selected by the first switches 5, 6 are connected in series between the one coupling port selected by the first switches 5, 6 and the termination circuit 7. As a result, the one or more selected sub-lines function as the sub-line 3, the unselected sub-lines do not function as the sub-line 3, and the selected coupling port functions as the coupling port, and the unselected coupling port does not function as the coupling port. At this time, the line length of the sub-line 3 is the sum of the line lengths of the one or more sub-lines of the three sub-lines that function as the sub-line 3. That is, the line length of the sub-line 3 can be switched to a plurality of stages (for example, three stages) by the first switches 5, 6.

[0041] In the directional coupler 1, the line length of the sub-line 3 can be switched to three stages. In the case where the line length of the sub-line 3 is the longest, the directional coupler 1 can cope with high-frequency signals of a low frequency band (low frequency). Hereinafter, the mode of the directional coupler 1 in this case is described as an LB (low frequency) mode. In addition, in the case where the line length of the sub-line 3 is the shortest, the directional coupler 1 can cope with high-frequency signals of a high frequency band (high frequency). The mode of the directional coupler 1 in this case is described as an MB (medium frequency) mode. In addition, in the case where the line length of the sub-line 3 is an intermediate length, high-frequency signals of an intermediate frequency band (medium frequency) can be coped with. The mode of the directional coupler 1 in this case is described as an HB (high frequency) mode. That is, the directional coupler 1 has three modes (the LB mode, the MB mode, and the HB mode) corresponding to the line length of the sub-line 3.

[0042] (2) Detailed description of three modes of the directional coupler

[0043] Referring to Figures 2-4 The three modes of the directional coupler 1 are described in detail. The directional coupler 1 has three modes (LB mode, MB mode, and HB mode).

[0044] In the case where the directional coupler 1 is in the LB mode, as shown in Figure 2 , the common terminal 5a of the first switch 5 is connected to the selection terminal 5b, and the common terminal 6a of the first switch 6 is connected to the selection terminal 6b. In this case, the three sub-lines (the first sub-line 31, the second sub-line 32, and the third sub-line 33) are all connected in series and function as the sub-line 3. In addition, the third coupling port 45 among the three coupling ports (the first coupling port 43, the second coupling port 44, and the third coupling port 45) is selected, and the selected third coupling port 45 functions as the coupling port. The line length of the sub-line 3 in this case becomes the sum of the line lengths of each of the three sub-lines, and becomes the longest line length among the switchable line lengths of the sub-line 3.

[0045] In the case where the directional coupler 1 is in the MB mode, as shown in Figure 3 , the common terminal 5a of the first switch 5 is connected to the selection terminal 5b, and the common terminal 6a of the first switch 6 is connected to the selection terminal 6c. In this case, two sub-lines (the first sub-line 31 and the second sub-line 32) among the three sub-lines described above are connected in series and function as the sub-line 3. In addition, the second coupling port 44 among the three coupling ports described above is selected, and the selected second coupling port 44 functions as the coupling port. The line length of the sub-line 3 in this case becomes the sum of the line lengths of each of the two sub-lines, and becomes the middle line length among the switchable line lengths of the sub-line 3.

[0046] In the case where the directional coupler 1 is in the HB mode, as shown in Figure 4 , the common terminal 5a of the first switch 5 is connected to the selection terminal 5c, and the common terminal 6a of the first switch 6 is connected to the selection terminal 6c. In this case, the first sub-line 31 among the three sub-lines described above is selected and functions as the sub-line 3. In addition, the first coupling port 43 among the three coupling ports described above is selected, and the selected first coupling port 43 functions as the coupling port. The line length of the sub-line 3 in this case is the line length of the first sub-line 31, and becomes the shortest line length among the switchable line lengths of the sub-line 3.

[0047] (3) Structure of the directional coupler

[0048] Referring to Figure 5 andFigure 6 The structure of the directional coupler 1 will be described in detail. As shown in FIG. 1, the directional coupler 1 has, in addition to the main line 2, the sub-lines 3 (the first to third sub-lines 31 to 33), the plurality of ports 4 (the input port 41, the output port 42, and the first to third coupling ports 43 to 45), and the termination circuit 7 described above, a multilayer substrate 8, an IC chip 9, and a resin member 10. Figure 5

[0049] The multilayer substrate 8 is a substrate in which the main line 2, the sub-lines 3, the plurality of ports 4, and the termination circuit 7 are provided. The multilayer substrate 8 has a plurality of (six in the example shown in FIG. 1) dielectric layers 81 to 86 which are stacked one on top of another. The main line 2 and the first to third sub-lines 31 to 33 are provided in different ones of the plurality of dielectric layers 81 to 86. The multilayer substrate 8 has a first main surface 8s and a second main surface 8t which face each other. Figure 5

[0050] The multilayer substrate 8 further has a plurality of external connection electrodes 11, a plurality of electrode pads 12, and a plurality of wiring conductors (not shown). The plurality of external connection electrodes 11 include the plurality of ports 4 and a ground electrode 11g. The ground electrode 11g is an electrode which is held at a ground potential. The external connection electrodes 11 are electrodes for electrically connecting with external circuits (for example, a high-frequency module). The plurality of electrode pads 12 are electrodes for electrically connecting with the IC chip 9. The plurality of wiring conductors described above are conductors which electrically connect the main line 2, the sub-lines 3, the plurality of ports 4, the termination circuit 7, the external connection electrodes 11, and the electrode pads 12 so as to satisfy a prescribed connection relationship (specifically, an equivalent circuit of the directional coupler 1). The plurality of wiring conductors described above are each composed of at least one of a via hole conductor (not shown) and a pattern conductor (not shown). The via hole conductor is provided so as to penetrate in the thickness direction in the plurality of dielectric layers 81 to 86. The pattern conductor is patterned on at least one of the main surfaces of the two sides of the plurality of dielectric layers 81 to 86.

[0051] The plurality of dielectric layers 81 to 85 can be formed of a monomer such as a BT (Bismaleimide Triazine) resin, an epoxy-based resin, a polyphenylene ether resin, a fluorine resin, a liquid crystal polymer resin, and a polyimide resin, or a mixed material of such a monomer and a glass fiber or other filler, or can be formed using a ceramic such as an LTCC (Low Temperature Co-fired Ceramics), an HTCC (High Temperature Co-fired Ceramics), or the like. In addition, the conductors such as the main line 2, the sub-lines 3, and the wiring conductors are formed of a copper foil, a thick film of copper or silver, or an alloy film or a composite film of copper, silver, and other metals.

[0052] ​​The plurality of dielectric layers 81 to 86 each have a first main surface and a second main surface. The first main surface of the dielectric layers 81 to 86 is the main surface on the first main surface 8s side of the multilayer substrate 8, and the second main surface of the dielectric layers 81 to 86 is the main surface on the second main surface 8t side of the multilayer substrate 8. The plurality of external connection electrodes 11 are provided on the second main surface of the dielectric layer 81. The third sub-line 33 is provided on the first main surface of the dielectric layer 82. The main line 2 is provided on the first main surface of the dielectric layer 83. The second sub-line 32 is provided on the first main surface of the dielectric layer 84. The first sub-line 31 and the termination circuit 7 are provided on the first main surface of the dielectric layer 85. The plurality of electrode pads 12 are provided on the first main surface of the dielectric layer 86.

[0053] Further, as the termination circuit 7, in addition to a resistor, a capacitor or an inductor can be used, or a circuit in which these are combined can be used. The components constituting the termination circuit 7 can be provided on the first main surfaces of the plurality of dielectric layers including the dielectric layer 85, or can be provided as a chip component on the first main surface 8s of the multilayer substrate 8.

[0054] The first end 2a of the main line 2 is connected to the input port 41 via a wiring conductor, and the second end 2b of the main line 2 is connected to the output port 42 via a wiring conductor. The first end 31a of the first sub-line 31 is connected to the termination circuit 7 via a wiring conductor. The termination circuit 7 is connected to the ground electrode 11g via a wiring conductor. The second end 31b of the first sub-line 31, the first end 32a and the second end 32b of the second sub-line 32, and the first end 33a of the third sub-line 33 are each connected to a determined one of the plurality of electrode pads 12. The second end 33b of the third sub-line 33 is connected to the third coupling port 45 via a wiring conductor. The first coupling port 43 and the second coupling port 44 are each connected to a determined one of the plurality of electrode pads 12.

[0055] The IC (Integrated Circuit) chip 9 is a semiconductor IC that integrates first switches 5 and 6 and a control circuit. The control circuit controls the connection destination of the common terminals 5a and 6a of the first switches 5 and 6 according to control signals from the outside. The IC chip 9 contains six terminals (three terminals 5a to 5c of the first switch 5 and three terminals 6a to 6c of the first switch 6). That is, the IC chip 9 includes the first switch 5. In other words, the IC chip 9 is integrally formed with the first switch 5. The IC chip 9 is, for example, a rectangular plate with a first main surface and a second main surface. The first main surface of the IC chip 9 is the main surface on the side of the first main surface 8s of the multilayer substrate 8, and the second main surface of the IC chip 9 is the main surface on the side of the second main surface 8t of the multilayer substrate 8. The IC chip 9 has a plurality of electrode pads 91. The plurality of electrode pads 91 are conductors electrically connected to a plurality of electrode pads 12 of the multilayer substrate 8. The six terminals 5a to 5c and 6a to 6c inside the IC chip 9 are electrically connected to the determined electrode pads among the plurality of electrode pads 91.

[0056] IC chip 9 is disposed on one of the main surfaces of the first main surface 8s and the second main surface 8t of the multilayer substrate 8 (in... Figure 6 (First main face 8s) (refer to) Figure 6 The multiple electrode pads 91 of the IC chip 9 are electrically connected to the multiple electrode pads 12 of the multilayer substrate 8 to satisfy a specified connection relationship (specifically, the equivalent circuit of the directional coupler 1). In this embodiment, the IC chip 9 is disposed on the first main surface 8s of the multilayer substrate 8, and the multiple electrode pads 91 and multiple electrode pads 12 of the IC chip 9 are connected by solder bumps 92 (see reference). Figure 6 )connect.

[0057] In this directional coupler 1, when viewed from above in the thickness direction D1, at least a portion of each of the main line 2, the first sub-line 31, the second sub-line 32, and the third sub-line 33 overlaps with the IC chip 9 (see reference). Figure 6 ).exist Figure 6 In the example, each of the main line 2, the first sub-line 31, the second sub-line 32, and the third sub-line 33 overlaps entirely with the IC chip 9. This shortens the wiring conductors connecting the IC chip 9 to each line (main line 2, first sub-line 31, second sub-line 32, and third sub-line 33). Consequently, the generation of unnecessary inductance in the wiring conductors connecting the IC chip 9 to each line can be suppressed.

[0058] The resin component 10 is a resin component covering the IC chip 9, disposed on one end face 8s of the multilayer substrate 8 to cover the entire IC chip 9. The resin component 10 is, for example, an epoxy resin. Alternatively, the bottom of the IC chip 9 can be filled with resin as the resin component 10. In addition, a metal shielding film can be formed on at least a portion of the top surface and side surface of the resin component 10.

[0059] (4) Details of the main line and the secondary line

[0060] Reference Figures 7-10 The main line 2, the first sub-line 31, the second sub-line 32, and the third sub-line 33 are described in detail.

[0061] As described above, the main line 2, the first secondary line 31, the second secondary line 32, and the third secondary line 33 are disposed on the first main surface of different dielectric layers among the multiple dielectric layers 81 to 81 (refer to...). Figure 7 ).exist Figure 7 In the example, the first sub-line 31 is disposed on the first main surface 85a of the dielectric layer 85, the second sub-line 32 is disposed on the first main surface 84a of the dielectric layer 84, the main line 2 is disposed on the first main surface 83a of the dielectric layer 83, and the third sub-line 33 is disposed on the first main surface 82a of the dielectric layer 82.

[0062] Main line 2, first sub-line 31, second sub-line 32, and third sub-line 33 are each formed, for example, from a strip conductor, and are formed to have a predetermined shape when viewed from the thickness direction D1 (in... Figure 8 In the example, a ring shape (either square or rectangular) (see reference) Figure 8 That is, the main line 2, the first sub-line 31, the second sub-line 32, and the third sub-line 33 are each contained in a ring-shaped line portion when viewed from the thickness direction D1 of the multilayer substrate 8. The aforementioned line portions of the main line 2, the first sub-line 31, the second sub-line 32, and the third sub-line 33 are disposed in different dielectric layers among the plurality of dielectric layers 81 to 86.

[0063] Here, "ring-shaped" refers to a ring-shaped section that is broken in the circumferential direction (the break portion). The main line 2, the first sub-line 31, the second sub-line 32, and the third sub-line 33 each have a break portion 2w, 31w, 32w, and 33w, respectively. As an example, the aforementioned "prescribed shape" is a square or rectangular shape, but it can also be a polygonal shape, a circular shape, or an elliptical shape, etc. In this embodiment, the main line 2, the first sub-line 31, the second sub-line 32, and the third sub-line 33 each have a prescribed shape that is identical to each other, but they can also have prescribed shapes that are different from each other, or they can have prescribed shapes where only a portion of the lines are different.

[0064] Main line 2, first sub-line 31, second sub-line 32, and third sub-line 33 each have line widths d0, d1, d2, and d3, respectively. Line widths d0, d1, d2, and d3 are the widths of each line (main line 2 and the first to third sub-lines 31 to 33) in a direction orthogonal to the long side when viewed from the thickness direction D1. In this embodiment, the line widths d0, d1, d2, and d3 of main line 2, first sub-line 31, second sub-line 32, and third sub-line 33 are the same size, but they can also be different sizes.

[0065] Main line 2, first sub-line 31, second sub-line 32, and third sub-line 33 each have different first distances R0, R1, R2, and R3 (refer to...). Figure 7 , 8 Here, "first distance" refers to the distance between the centroids L0-L3 and the outer perimeters 2s and 31s-33s of each line (main line 2 and the first to third sub-lines 31-33) when viewed from the thickness direction D1 (refer to...). Figure 7 This distance, when varying circumferentially along each route, represents the maximum distance within that variation. Figure 7 , 8 In the example, among the three sub-lines (first sub-line 31, second sub-line 32, and third sub-line 33), the first sub-line 31 (the smallest sub-line) has the smallest first distance R1, the second sub-line 32 (the largest sub-line) has the largest first distance R2, and the third sub-line 33 (the middle sub-line) has the first distance between the smallest first distance R1 and the largest first distance R2, i.e., the middle first distance R3. The main line 2 has a first distance R0 of the same magnitude as the first distance R3 of the third sub-line 33. Furthermore, "center of gravity L0~L3" refers to the center of gravity of the shape defined by the closed outer perimeter when viewed from the thickness direction D1, approximating the outer perimeter after closing the outer perimeters 2s, 31s~33s in each line (main line 2, first to third sub-lines 31~33).

[0066] In other words, in the directional coupler 1, the first sub-line 31 with the smallest first distance R1, the second sub-line 32 with the largest first distance R2, and the third sub-line 33 with an intermediate first distance R3 are arranged on both sides of the main line 2 in the thickness direction D1. In other words, the first sub-line 31 with the smallest first distance R1 and the second sub-line 32 with the largest first distance R2 are arranged on the first main surface 8s side of the main line 2 in the thickness direction D1. On the other hand, the third sub-line 33 with an intermediate first distance R3, the first sub-line 31, and the second sub-line 32 are arranged on the second main surface 8t side of the main line 2.

[0067] Thus, in the thickness direction D1, the first sub-line 31 having the smallest first distance R1 and the second sub-line 32 having the largest first distance R2 and the third sub-line 33 having the intermediate first distance R3 are arranged on both sides of the main line 2. Therefore, the first sub-line 31 and the second sub-line 32 and the third sub-line 33 can be arranged while being kept apart from each other. Thus, the electromagnetic coupling between the first sub-line 31 and the second sub-line 32 and the third sub-line 33 can be suppressed. In addition, by arranging the first sub-line 31 having the smallest first distance R1 and the second sub-line 32 having the largest first distance R2 on the same side of the main line 2 (i.e., close to each other), the interval between the outer periphery 31s of the first sub-line 31 and the inner periphery 32t of the second sub-line 32 can be easily ensured when viewed from the thickness direction D1. Thus, the electromagnetic coupling between the first sub-line 31 and the second sub-line 32 can be suppressed. According to the above, the electromagnetic coupling between the main line 2 and the first to third sub-lines 31 to 33 can be improved, and the electromagnetic coupling between the first to third sub-lines 31 to 33 can be suppressed, as a result of which the directivity of the directional coupler 1 can be improved.

[0068] Further, in the present embodiment, the first sub-line 31 is arranged on the first main surface 8s side of the second sub-line 32, but the first sub-line 31 can also be arranged on the second main surface 8t side of the second sub-line 32. That is, the arrangement of the first sub-line 31 and the arrangement of the second sub-line 32 can also be exchanged with each other. In addition, in the present embodiment, the first sub-line 31 and the second sub-line 32 are arranged on the first main surface 8s side of the main line 2, and the third sub-line 33 is arranged on the second main surface 8t side of the main line 2, but the first sub-line 31 and the second sub-line 32 can also be arranged on the second main surface 8t side of the main line 2, and the third sub-line 33 can be arranged on the first main surface 8s side of the main line 2. That is, the arrangement of the first sub-line 31 and the second sub-line 32 and the arrangement of the third sub-line 33 can also be exchanged with each other.

[0069] As Figure 7 and Figure 9As shown, the first sub-line 31 has an outer periphery 31s, and the second sub-line 32 has an inner periphery 32t. When viewed from the thickness direction D1 of the multilayer substrate 8, the outer periphery 31s of the first sub-line 31 is disposed inside the inner periphery 32t of the second sub-line 32. In other words, the first sub-line 31, having the smallest first distance R1, and the second sub-line 32, having the largest first distance R2, are configured so that they do not overlap when viewed from the thickness direction D1 in the linewidth direction of their respective lines. Thus, the two closest sub-lines (first sub-line 31 and second sub-line 32) among the three sub-lines (first to third sub-lines 31 to 33) are configured so that they do not overlap when viewed from the thickness direction D1 in the linewidth direction of their respective lines. Therefore, electromagnetic coupling between the two closest sub-lines among the three sub-lines can be suppressed.

[0070] Furthermore, in this embodiment, the term "inner side" or "inner perimeter" refers to the edge of the line closest to the center of gravity when viewing each line from its center of gravity, and the area on the side of the line's width closest to the center of gravity is defined as the inner perimeter. Similarly, the term "outer side" or "outer perimeter" refers to the edge of the line furthest from the center of gravity when viewing each line from its center of gravity, and the area on the side of the line's width furthest from the center of gravity is defined as the outer perimeter.

[0071] In addition, such as Figure 7 as well as Figure 9 As shown, the first sub-line 31 has an outer portion 31v, the second sub-line 32 has an inner portion 32u, and the main line 2 has an outer portion 2v and an inner portion 2u. When viewed from the thickness direction D1 of the multilayer substrate 8, the main line 2 is disposed inside the outer periphery 32s of the second sub-line 32. More specifically, it is configured such that, when viewed from the thickness direction D1, the inner portion 32u of the second sub-line 32 and the outer portion 2v of the main line 2 overlap. This improves the electromagnetic coupling between the second sub-line 32 and the main line 2. Furthermore, when viewed from the thickness direction D1, the outer portion 31v of the first sub-line 31 and the inner portion 2u of the main line 2 overlap. This further improves the electromagnetic coupling between the first sub-line 31 and the main line 2.

[0072] In addition, such as Figure 7As shown, the main line 2, the first sub-line 31, the second sub-line 32, and the third sub-line 33 are arranged concentrically so that their centroids L0, L1, L2, and L3 overlap when viewed from the thickness direction D1 of the multilayer substrate 8. This allows for easy adjustment of the electromagnetic coupling of the main line 2, the first sub-line 31, the second sub-line 32, and the third sub-line 33. Furthermore, since the main line 2, the first sub-line 31, the second sub-line 32, and the third sub-line 33 can be concentrated in one location, the directional coupler 1 can be miniaturized.

[0073] Furthermore, the term "overlap of the centers of gravity of each line when viewed from the thickness direction D1" includes not only the case where the centers of gravity of each line overlap at one point, but also the case where the centers of gravity of each line are located within a circle of a specified radius. Here, the specified radius is, for example, a length of less than 10% of the maximum first distance R2. That is, the case where the centers of gravity of each line are located within a circle of a specified radius is also considered as the centers of gravity of each line substantially overlapping.

[0074] In addition, such as Figure 10 As shown, the main line 2 and the third sub-line 33 are configured such that, when viewed from the thickness direction D1 of the multilayer substrate 8, at least a portion of their lengths overlap. That is, when viewed from the thickness direction D1, at least a portion of the lines of the main line 2 and the third sub-line 33 are arranged parallel to each other. Figure 10 In this example, the main line 2 and the third sub-line 33 do not overlap at their circumferential (length direction) breaks 2w and 33w, respectively, but overlap at the parts other than the breaks 2w and 33w. That is, when viewed from the side of the first sub-line 31 and the second sub-line 32, the third sub-line 33 is configured to be hidden behind the main line 2. As a result, electromagnetic coupling between the first sub-line 31 and the second sub-line 32 and the third sub-line 33 can be suppressed, and the directionality of the directional coupler 1 can be improved.

[0075] (5) Variations

[0076] Hereinafter, variations of Embodiment 1 will be described. Embodiment 1 and the variations may also be implemented in combination. Furthermore, in the following description, the same reference numerals are sometimes used for the same constituent elements as in Embodiment 1, and the description is omitted.

[0077] (5.1) Variation Example 1

[0078] Reference Figure 11 Modification 1 will be explained. In Embodiment 1, the line width d0 of the main line 2 is the same as the line widths d1 to d3 of the first to third sub-lines 31 to 33 (see reference). Figure 7), but in the present modification, the line width dO of the main line 2 is larger than the line widths dl to d3 of at least one of the first to third sub lines 31 to 33 (see Figure 11 ) In the example of Figure 11 , the line width dO of the main line 2 is larger than the line widths dl to d3 of all of the first to third sub lines 31 to 33.

[0079] In the present modification, as in Embodiment 1, the first sub line 31 and the second sub line 32 are formed so that, when viewed from the thickness direction Dl, the outer side portion 3 Iv of the first sub line 31 overlaps with the inner side portion 2u of the main line 2, and the inner side portion 32u of the second sub line 32 overlaps with the outer side portion 2v of the main line 2. As in the present modification, the line width dO of the main line 2 is larger than the line widths dl to d3 of any one of the first to third sub lines 31 to 33, so that the first sub line 31 and the second sub line 32 can be formed so as to further increase the interval Ql between the outer periphery 3 Is of the first sub line 31 and the inner periphery 32t of the second sub line 32 in a state where, when viewed from the thickness direction Dl, the outer side portion 3 Iv of the first main line 21 overlaps with the inner side portion 2u of the main line 2, and the inner side portion 32u of the second main line 22 overlaps with the outer side portion 2v of the main line 2 (see Figure 11 ). Thus, the electromagnetic coupling of the first sub line 31 and the second sub line 32 can be further suppressed.

[0080] (5.2) Modification 2

[0081] Modification 2 will be described with reference to Figure 12 and Figure 13 In Embodiment 1, the main line 2 has one line (see Figure 8 ), but in the present modification, the main line 2 has a plurality of (for example, two) lines (the first main line 21 and the second main line 22) which are electrically connected in series with each other (see Figure 12 ).

[0082] More specifically, as shown in Figure 12 , the first main line 21 has a first end 21a and a second end 21b, and the second main line 22 has a first end 22a and a second end 22b. The second end 21b of the first main line 21 and the first end 22a of the second main line 22 are electrically connected by a wiring conductor Hl, so that the first main line 21 and the second main line 22 are electrically connected in series with each other. The first end 21a of the first main line 21 is connected to the output port, and the second end 22b of the second main line 22 is connected to the input port.

[0083] The first main line 21 and the second main line 22 are each formed to have a prescribed shape (in Figure 12In the example shown in FIG. 1, the first main line 21 and the second main line 22 each have a circular shape (a square shape or a rectangular shape) in plan view from the thickness direction Dl. That is, the first main line 21 and the second main line 22 each have a line portion that is formed in a circular shape in plan view from the thickness direction Dl. In plan view from the thickness direction Dl, the first main line 21, the second main line 22, the first sub line 31, the second sub line 32, and the third sub line 33 are arranged concentrically so that the centers of gravity of these respective lines overlap.

[0084] In each of the first main line 21 and the second main line 22, the maximum distance among the distances from the outer periphery 21s, 22s to the center of gravity L21, L22 is set as a first distance. The first main line 21 and the second main line 22 each have a first distance R21, R22 that is different from the other. In the present modification example, the first distance R21 is larger than the first distance R22 (see FIG. 1). Further, the first distance R21 of the first main line 21 is smaller than the first distance (i.e., the maximum first distance) R2 of the second sub line 32. The first distance R22 of the second main line 22 is larger than the first distance (i.e., the minimum first distance) Rl of the first sub line 31. Figure 12 Figure 13 In the example shown in FIG. 1, the first main line 21 and the second main line 22 each have a circular shape (a square shape or a rectangular shape) in plan view from the thickness direction Dl. That is, the first main line 21 and the second main line 22 each have a line portion that is formed in a circular shape in plan view from the thickness direction Dl. In plan view from the thickness direction Dl, the first main line 21, the second main line 22, the first sub line 31, the second sub line 32, and the third sub line 33 are arranged concentrically so that the centers of gravity of these respective lines overlap.

[0085] As shown in FIG. 1, the first main line 21 and the second main line 22 are provided in different dielectric layers among the plurality of dielectric layers 81 to 86. That is, the line portions of the first main line 21 and the second main line 22 are each arranged in a different dielectric layer among the plurality of dielectric layers 81 to 86. In the example shown in FIG. 1, the first main line 21 and the second main line 22 are each arranged in the first main surface 83a, 82a of the dielectric layer 83, 82. That is, the first main line 21 having a larger first distance is arranged on the first main surface 8s side of the second main line 22 having a smaller first distance. Further, the first sub line 31, the second sub line 32, and the third sub line 33 are each arranged in the first main surface 85a, 84a, 81a of the dielectric layer 85, the dielectric layer 84, and the dielectric layer 81, respectively. Figure 13 Figure 13 In the example shown in FIG. 1, the first main line 21 and the second main line 22 each have a circular shape (a square shape or a rectangular shape) in plan view from the thickness direction Dl. That is, the first main line 21 and the second main line 22 each have a line portion that is formed in a circular shape in plan view from the thickness direction Dl. In plan view from the thickness direction Dl, the first main line 21, the second main line 22, the first sub line 31, the second sub line 32, and the third sub line 33 are arranged concentrically so that the centers of gravity of these respective lines overlap.

[0086] Further, the line widths d21, d22 of the first main line 21 and the second main line 22 are each the same size as the line widths dl to d3 of the first to third sub lines 31 to 33. However, the line widths d21, d22 of the first main line 21 and the second main line 22 can each be different sizes from each other and from the line widths dl to d3 of the first to third sub lines 31 to 33.

[0087] ​​Further, the second main line 22 is arranged inside the outer periphery 21s of the first main line 21 when viewed from the thickness direction D1. In the present modification example, the inner side portion 21u of the first main line 21 overlaps the outer periphery portion 22v of the second main line 22 when viewed from the thickness direction D1, but can not overlap the second main line 22 at all. That is, the second main line 22 can also be arranged inside the inner periphery 21t of the first main line 21 when viewed from the thickness direction D1.

[0088] Further, the first sub line 31 and the second sub line 32 are arranged on the first main surface 8s side of the first main line 21. The first sub line 31 is arranged on the first main surface 8s side of the second sub line 32. The third sub line 33 is arranged on the second main surface 8t side of the second main line 22.

[0089] Further, the inner side portion 32u of the second sub line 32 overlaps the outer side portion 21v of the first main line 21 when viewed from the thickness direction D1. Further, the outer side portion 31v of the first sub line 31 overlaps the inner side portion 22u of the second main line 22.

[0090] In the thickness direction D1, the third sub line 33 is arranged so as to overlap at least one of the first main line 21 and the second main line 22 at least in part. For example, the first distance R3 of the third sub line 33 is the same size as the first distance R21 of the first main line 21. Therefore, the third sub line 33 is arranged so as to be hidden behind the first main line 21 when viewed from the thickness direction D1. However, by making the first distance R3 of the third sub line 33 the same size as the first distance R22 of the second main line 22, the third sub line 33 can be arranged so as to be hidden behind the second main line 22 when viewed from the thickness direction D1.

[0091] According to the present modification example, since the main line 2 can be configured by a double-layer structure (the first main line 21 and the second main line 22), the impedance of the main line 2 can be easily adjusted. Further, the first distances R21, R22 of the first main line 21 and the second main line 22, respectively, can be independently adjusted, and accordingly, the impedance of the main line 2 can be easily adjusted.

[0092] (5.3) Modification Example 3

[0093] In the present embodiment 1, the case where the directional coupler 1 detects the high-frequency signal input from the input port 41 and output from the output port 42 is assumed, but the high-frequency signal input from the output port 42 and output from the input port 41 can be detected. In this case, the input port 41 and the output port 42 are switched in the directional coupler 1. Figure 1In this case, the layout of the entire structure except for the main line 2, the input port 41, and the output port 42 (the first to third sub-lines 31 to 33, the first to third coupling ports 43 to 45, the first to third switches 5 to 7, and the termination circuit 7) is reversed left and right, the first sub-line 31 is disposed on the input port 41 side, and the third sub-line 33 and the third coupling port 45 are disposed on the output port 42 side.

[0094] (Embodiment 2)

[0095] Reference Figure 14 The high-frequency module 100 and the communication device 2005 according to Embodiment 2 will be described. The high-frequency module 100 according to Embodiment 2 is a high-frequency module 100 according to Embodiment 1 in which the first to third sub-lines 31 to 33, the first to third coupling ports 43 to 45, the first to third switches 5 to 7, and the termination circuit 7 are reversed left and right.

[0096] The high-frequency module 100 according to Embodiment 2 is one example of a high-frequency module 1. The communication device 200 according to Embodiment 2 is one example of a communication device 200 provided with the high-frequency module 100.

[0097] (1) Structure of communication device

[0098] The communication device 200 is, for example, a portable terminal (for example, a smartphone) or a wearable terminal (for example, a smartwatch). The communication device 200 is provided with the high-frequency module 100, a signal processing circuit 210, and an antenna 220.

[0099] The antenna 220.

[0100] The high-frequency module 100 is configured to extract a reception signal of a prescribed frequency band from a reception signal received by the antenna 220 and amplify and output the reception signal to the signal processing circuit 210. In addition, the high-frequency module 100 is configured to amplify a transmission signal output from the signal processing circuit 210 and convert the transmission signal into a transmission signal of a prescribed frequency band and output the transmission signal from the antenna 220.

[0101] The high-frequency module 100 is configured to extract a reception signal of a prescribed frequency band from a reception signal received by the antenna 220 and amplify and output the reception signal to the signal processing circuit 210. In addition, the high-frequency module 100 is configured to amplify a transmission signal output from the signal processing circuit 210 and convert the transmission signal into a transmission signal of a prescribed frequency band and output the transmission signal from the antenna 220.

[0102] The signal processing circuit 210 is configured to be connected to the high-frequency module 100 and perform signal processing on a high-frequency signal. More specifically, the signal processing circuit 210 performs signal processing on a reception signal output from the high-frequency module 100 and, in addition, performs signal processing on a transmission signal output to the high-frequency module 100.

[0103] The signal processing circuit 210 includes an RF signal processing circuit 211 and a baseband signal processing circuit 212. The RF signal processing circuit 211 is, for example, an RFIC (Radio Frequency Integrated Circuit:

[0104] The RF signal processing circuit 211 is configured to perform signal processing such as frequency down-conversion on a reception signal output from the high-frequency module 100 and output to the baseband signal processing circuit 212. In addition, the RF signal processing circuit 211 is configured to perform signal processing such as frequency up-conversion on a transmission signal output from the baseband signal processing circuit 212 and output to the high-frequency module 100. The baseband signal processing circuit 212 is, for example, a 5BBIC (Baseband Integrated Circuit). The baseband signal processing circuit 212 is configured to output a reception signal output from the RF signal processing circuit 211 to the outside, and, in addition, generate a transmission signal from a baseband signal (for example, a sound signal and an image signal) input from the outside, and output the generated transmission signal to the RF signal processing circuit 211.

[0105] The signal processing circuit 211 is configured to perform signal processing such as frequency down-conversion on a reception signal output from the high-frequency module 100 and output to the baseband signal processing circuit 212. In addition, the RF

[0106] The signal processing circuit 211 is configured to perform signal processing such as frequency down-conversion on a reception signal output from the high-frequency module 100 and output to the baseband signal processing circuit 212. In addition, the RF

[0107] (2) Structure of the high-frequency module

[0108] The high-frequency module 100 has, as circuit components, a plurality of external connection terminals 110, power amplifiers 151, 152, low-noise amplifiers 161, 162, transmission filters 61T to 64T, reception filters 61R to 64R, output matching circuits 131, 132, matching circuits 141, 142, matching circuits 71 to 74, switches 51 to 55, a duplexer 60, and a directional coupler 1 (coupler).

[0109] The plurality of external connection terminals 110 include an antenna terminal 130, two signal input terminals 111, 112, two signal output terminals 121, 122, and three coupler output terminals (first to third coupler output terminals 181 to 183). The antenna terminal 130 is a terminal to which the antenna 220 is connected. The two signal input terminals 111, 112 are terminals that input a transmission signal from the signal processing circuit 210, and are connected to an output portion of the signal processing circuit 210. The two signal output terminals 121, 122 are terminals that output a transmission signal from the high-frequency module 100 to the signal processing circuit 210, and are connected to an input portion of the signal processing circuit 210. The three coupler output terminals (first to third coupler output terminals 181 to 183) are terminals that output a detection signal taken out by the directional coupler 1 to the outside (for example, the signal processing circuit 210).

[0110] The power amplifiers 151, 152 each have an input and an output. The inputs of the power amplifiers 151, 152 are connected to the signal input terminals 111, 112, and the outputs of the power amplifiers 151, 152 are connected to the common terminals of the switches 51, 52 via the output matching circuits 131, 132. The power amplifiers 151, 152 each amplify a transmission signal input from the signal input terminals 111, 112, and output the amplified transmission signal to the common terminals of the switches 51, 52 via the output matching circuits 131, 132.

[0111] The switch 51 has a common terminal and two selection terminals (a first selection terminal and a second selection terminal). The common terminal of the switch 51 is connected to the power amplifier 151 via the output matching circuit 131. The two selection terminals of the switch 51 are connected to the inputs of the transmission filters 61T, 62T, respectively. The switch 51 selectively outputs an output signal of the power amplifier 151 to either of the transmission filters 61T, 62T. The switch 52 has a common terminal and two selection terminals (a first selection terminal and a second selection terminal). The common terminal of the switch 52 is connected to the power amplifier 152 via the output matching circuit 132. The two selection terminals of the switch 52 are connected to the inputs of the transmission filters 63T, 64T, respectively. The switch 52 selectively outputs an output signal of the power amplifier 152 to either of the transmission filters 63T, 64T.

[0112] The transmission filter 61T has an input and an output. The input of the transmission filter 61T is connected to the first selection terminal of the switch 51, and the output of the transmission filter 61T is connected to the switch 55 via the matching circuit 71. The transmission filter 61T passes a transmission signal of a transmission frequency band of a first communication band among the transmission signals amplified by the power amplifier 151. The transmission filter 62T has an input and an output. The input of the transmission filter 62T is connected to the second selection terminal of the switch 51, and the output of the transmission filter 62T is connected to the switch 55 via the matching circuit 72. The transmission filter 62T passes a transmission signal of a transmission frequency band of a second communication band among the transmission signals amplified by the power amplifier 151. The transmission filter 63T has an input and an output. The input of the transmission filter 63T is connected to the first selection terminal of the switch 52, and the output of the transmission filter 63T is connected to the switch 55 via the matching circuit 73. The transmission filter 63T passes a transmission signal of a transmission frequency band of a third communication band among the transmission signals amplified by the power amplifier 152. The transmission filter 64T has an input and an output. The input of the transmission filter 64T is connected to the second selection terminal of the switch 52, and the output of the transmission filter 64T is connected to the switch 55 via the matching circuit 74. The transmission filter 64T passes a transmission signal of a transmission frequency band of a fourth communication band among the transmission signals amplified by the power amplifier 152.

[0113] The low noise amplifiers 161, 162 each have an input portion and an output portion. The input portions of the low noise amplifiers 161, 162 are connected to the common terminals of the switches 53, 54 via the matching circuits 141, 142, respectively. The output portions of the low noise amplifiers 161, 162 are connected to the signal output terminals 121, 122. The low noise amplifiers 161, 162 each amplify the reception signal output from the switches 53, 54 and output to the signal output terminals 121, 122.

[0114] The switch 53 has a common terminal and two selection terminals (a first selection terminal and a second selection terminal). The common terminal of the switch 53 is connected to the low noise amplifier 161 via the matching circuit 141, and the two selection terminals of the switch 53 are connected to the output portions of the reception filters 61R, 62R, respectively. The switch 53 selectively outputs the reception signal from either one of the reception filters 61R, 62R to the low noise amplifier 161. The switch 54 has a common terminal and two selection terminals (a first selection terminal and a second selection terminal). The common terminal of the switch 54 is connected to the low noise amplifier 162 via the matching circuit 142, and the two selection terminals of the switch 54 are connected to the output portions of the reception filters 63R, 64R, respectively. The switch 54 selectively outputs the reception signal from either one of the reception filters 63R, 64R to the low noise amplifier 162.

[0115] The reception filter 61R has an input portion and an output portion. The input portion of the reception filter 61R is connected to the selection terminal of the switch 55 via the matching circuit 71, and the output portion of the reception filter 61R is connected to the first selection terminal of the switch 53. The reception filter 61R passes the reception signal of the reception frequency band of the first communication frequency band in the transmission signal output from the switch 55. The reception filter 62R has an input portion and an output portion. The input portion of the reception filter 62R is connected to the selection terminal of the switch 55 via the matching circuit 72, and the output portion of the reception filter 62R is connected to the second selection terminal of the switch 53. The reception filter 62R passes the reception signal of the reception frequency band of the second communication frequency band in the transmission signal output from the switch 55. The reception filter 63R has an input portion and an output portion. The input portion of the reception filter 63R is connected to the selection terminal of the switch 55 via the matching circuit 73, and the output portion of the reception filter 63R is connected to the first selection terminal of the switch 54. The reception filter 63R passes the reception signal of the reception frequency band of the third communication frequency band in the reception signal output from the switch 55. The reception filter 64R has an input portion and an output portion. The input portion of the reception filter 64R is connected to the selection terminal of the switch 55 via the matching circuit 74, and the output portion of the reception filter 64R is connected to the second selection terminal of the switch 54. The reception filter 64R passes the reception signal of the reception frequency band of the fourth communication frequency band in the reception signal output from the switch 55.

[0116] An output matching circuit 131 is connected between an output section of the power amplifier 151 and the common terminal of the switch 51, and achieves impedance matching between the power amplifier 151 and the transmission filters 61T, 62T. An output matching circuit 132 is connected between an output section of the power amplifier 152 and the common terminal of the switch 52, and achieves impedance matching between the power amplifier 152 and the transmission filters 63T, 64T. A matching circuit 141 is connected between an input section of the low-noise amplifier 161 and the common terminal of the switch 53, and achieves impedance matching between the low-noise amplifier 161 and the reception filters 61R, 62R. A matching circuit 142 is connected between an input section of the low-noise amplifier 162 and the common terminal of the switch 54, and achieves impedance matching between the low-noise amplifier 162 and the reception filters 63R, 64R.

[0117] A matching circuit 71 is connected between an output section of the transmission filter 61T and an input section of the reception filter 61R and the aforementioned selection terminal 55b of the switch 55, and achieves impedance matching between the transmission filter 61T and the reception filter 61R and the switch 55. A matching circuit 72 is connected between an output section of the transmission filter 62T and an input section of the reception filter 62R and the aforementioned selection terminal 55c of the switch 55, and achieves impedance matching between the transmission filter 62T and the reception filter 62R and the switch 55. A matching circuit 73 is connected between an output section of the transmission filter 63T and an input section of the reception filter 63R and the aforementioned selection terminal 55d of the switch 55, and achieves impedance matching between the transmission filter 63T and the reception filter 63R and the switch 55. A matching circuit 74 is connected between an output section of the transmission filter 64T and an input section of the reception filter 64R and the aforementioned selection terminal 55e of the switch 55, and achieves impedance matching between the transmission filter 64T and the reception filter 64R and the switch 55.

[0118] The duplexer 60 has a first filter 60L and a second filter 60H. The first filter 60L is a filter that sets a frequency range including the first to fourth frequency bands described above as a passband. The second filter 60H is a filter that sets a frequency range including a different frequency band from the first to fourth frequency bands described above as a passband. The first filter 60L and the second filter 60H each have two input / output sections (a first input / output section and a second input / output section). The first input / output section of each of the first filter 60L and the second filter 60H is connected to the antenna terminal 130 via the directional coupler 1. The second input / output section of the first filter 60L is connected to the common terminal of the switch 55. Hereinafter, the first input / output section of the first filter 60L and the first input / output section of the second filter 60H are sometimes collectively described as "the first input / output section of the duplexer 60".

[0119] The directional coupler 1 is configured similarly to the directional coupler 1 of Embodiment 1. The directional coupler 1 takes out a part of a high-frequency signal (a reception signal) flowing in a part of a signal path (the main line 2) between the antenna terminal 130 and the first input / output portion of the duplexer 60 from the sub line 3 electromagnetically coupled with the main line 2 as a detection signal, and outputs the taken-out detection signal to the outside (for example, the signal processing circuit 210) of the high-frequency module 100 via any one of the first to third coupler output terminals 181 to 183.

[0120] The directional coupler 1 of the present embodiment, like the directional coupler 1 of Embodiment 1, has the main line 2, the first to third sub lines 31 to 33, the two first switches 5, 6, and the termination circuit 7.

[0121] In the directional coupler 1 of the present embodiment, the first switches 5, 6 are included in the switch 55, and are configured integrally with the switch 55.

[0122] In the present embodiment, the first end of the main line 2 is connected to the antenna terminal 130, and the second end of the main line 2 is connected to the first input / output portion of the duplexer 60. That is, the main line 2 of the directional coupler 1 configures a part of a signal path between the antenna terminal 130 and the duplexer 60. The first end of the first sub line 31 is connected to the ground via the termination circuit 7, and the second end of the first sub line 31 is connected to the common terminal 5a of the later-described switch 55. The first end of the second sub line 32 is connected to the selection terminal 5b of the later-described switch 55, and the second end of the second sub line 32 is connected to the common terminal 6a of the later-described switch 55. The first end of the third sub line 33 is connected to the selection terminal 6b of the later-described switch 55, and the second end of the third sub line 33 is connected to the third coupler output terminal 183.

[0123] The switch 55 is an antenna switch. Hereinafter, the switch 55 will be described as a second switch 55. The second switch 55 is a switch that switches connection and non-connection of each of a signal path SO reaching the antenna terminal 130 and a plurality of signal paths S1 to S4 reaching a plurality of duplexers 61 to 64 (filters). The second switch 55 includes the first switches 5, 6 as described above.

[0124] More specifically, the second switch 55 has the common terminal 55a, a plurality of selection terminals 55b, 55c, 55d, 55e, the common terminal 5a and the two selection terminals 5b, 5c of the switch 5, the common terminal 6a and the two selection terminals 6b, 6c of the switch 6.

[0125] The common terminal 55a of the second switch 55 is connected to the second input / output section of the first filter 60L, and the plurality of selection terminals 55b, 55c, 55d, 55e of the second switch 55 are connected to the first input / output sections of the duplexers 61 to 64 via the matching circuits 71 to 74, respectively. The selection terminals 5c, 6c of the second switch 55 are connected to the first coupler output terminal 181 and the second coupler output terminal 182, respectively. The common terminals 5a, 6a of the second switch 55 are connected to the second end of the first sub-line 31 and the second end of the second sub-line 32 in the directional coupler 1, respectively. The selection terminals 5b, 6b of the second switch 55 are connected to the first end of the second sub-line 32 and the first end of the third sub-line 33 in the directional coupler 1, respectively.

[0126] The high-frequency module 100 of the present embodiment further includes a multilayer substrate 57 and an IC chip 58 (see FIG. 6). The multilayer substrate 57 is a circuit substrate on which the above-described circuit components included in the high-frequency module 100 are arranged. The multilayer substrate 57 is configured similarly to the multilayer substrate 8 of Embodiment 1, and includes a plurality of dielectric layers. The multilayer substrate 57 has a first main surface and a second main surface which are opposed to each other in the thickness direction thereof. The circuit components other than the lines (the main line 2 and the first to third sub-lines 31 to 33) of the directional coupler 1 among the above-described circuit components are arranged on either one of the first main surface and the second main surface of the multilayer substrate 57. The lines (the main line 2 and the first to third sub-lines 31 to 33) of the directional coupler 1 are arranged on different ones of the plurality of dielectric layers of the multilayer substrate 57, similarly to the case of Embodiment 1. Figure 14

[0127] The IC chip 58 includes the first switches 5, 6 and the second switch 55 of the directional coupler 1. That is, the first switches 5, 6 and the second switch 55 are integrally configured as the IC chip 58.

[0128] The IC chip 58 is arranged on one of the first main surface and the second main surface of the multilayer substrate 57. In the present embodiment, as in Embodiment 1, at least a portion of each of the lines (the main line 2 and the first to third sub-lines 31 to 33) of the directional coupler 1 can overlap the IC chip 58 when viewed from the thickness direction of the multilayer substrate 57.

[0129] According to the present embodiment, the IC chip 58 includes the first switches 5, 6 and the second switch 55. Thus, the first switches 5, 6 and the second switch 55 can be concentrated at one location, and as a result, the high-frequency module 100 can be downsized.

[0130] Embodiment 2 and Embodiment 1 and modifications thereof can be combined.

[0131] (Embodiment) ​

[0132] According to the above-described embodiments and modifications, the following modes are disclosed.

[0133] The directional coupler (1) according to the first mode includes a main line (2), a first sub-line (31), a second sub-line (32), a third sub-line (33), and a multilayer substrate (8). The multilayer substrate (8) includes a plurality of dielectric layers (81 to 86). The multilayer substrate (8) includes a first main surface (8s) and a second main surface (8t) that face each other. The first sub-line (31) and the second sub-line (32) are connected in series. The second sub-line (32) and the third sub-line (33) are connected in series. The main line (2), the first sub-line (31), the second sub-line (32), and the third sub-line (33) are included in a line portion that is formed in a ring shape when viewed from the thickness direction (D1) of the multilayer substrate (8). The line portions of the main line (2), the first sub-line (31), the second sub-line (32), and the third sub-line (33) are respectively arranged in different dielectric layers among the plurality of dielectric layers (81 to 86). In each of the first sub-line (31), the second sub-line (32), and the third sub-line (33), the maximum distance among distances from the outer periphery (2s, 31s to 33s) to the center of gravity (L0 to L3) is set as a first distance (R0, R1, R2, R3). The first sub-line (31), the second sub-line (32), and the third sub-line (33) have mutually different first distances (R1 to R3) that are the maximum, intermediate, and minimum, respectively. Among the first sub-line (31), the second sub-line (32), and the third sub-line (33), the maximum sub-line (32) having the maximum first distance (R2) and the minimum sub-line (31) having the minimum first distance (R1) are arranged on the first main surface (8s) side of the main line (2), and the intermediate sub-line (33) having the intermediate first distance (R3) is arranged on the second main surface (8t) side of the main line (2).

[0134] According to this structure, since the maximum sub-line (32) and the minimum sub-line (31) and the intermediate sub-line (33) are arranged on both sides of the main line (2), the maximum sub-line (32) and the minimum sub-line (31) and the intermediate sub-line (33) can be arranged so as to be spaced apart from each other. Thus, the electromagnetic coupling between the maximum sub-line (32) and the minimum sub-line (31) and the intermediate sub-line (33) can be suppressed. In addition, by arranging the maximum sub-line (32) and the minimum sub-line (31) on the same side of the main line (2), the spacing of the two sub-lines (the maximum sub-line (32) and the minimum sub-line (31)) that are closest to each other among the three sub-lines (31 to 33) can be easily ensured. Thus, the electromagnetic coupling between the two sub-lines (the maximum sub-line (32) and the minimum sub-line (31)) that are closest to each other among the three sub-lines (31 to 33) can be suppressed. As described above, the electromagnetic coupling between the main line (2) and the first to third sub-lines (31 to 33) can be increased, and the electromagnetic coupling between each of the first to third sub-lines (33) can be suppressed, and as a result, the directivity of the directional coupler (1) can be improved.

[0135] In the directional coupler (1) according to the second aspect, in the first aspect, the maximum sub-line (32) and the minimum sub-line (31) are arranged so as not to overlap each other in the line width direction of the lines of the sub-lines when viewed from the thickness direction (D1) of the multilayer substrate (8).

[0136] According to this structure, the two sub-lines (the maximum sub-line (32) and the minimum sub-line (31)) that are closest to each other among the three sub-lines (31 to 33) in the thickness direction (D1) are arranged so as not to overlap each other when viewed from the thickness direction (D1), and thus the electromagnetic coupling between these two sub-lines can be suppressed.

[0137] In the directional coupler (1) according to the third aspect, in the first or second aspect, the main line (2) and the intermediate sub-line (33) are arranged so as to at least partially overlap each other in the long side direction of the lines of the sub-lines when viewed from the thickness direction (D1) of the multilayer substrate (8).

[0138] According to this structure, the intermediate sub-line (33) can be arranged to be hidden behind the main line (2) as viewed from the maximum sub-line (32) and the minimum sub-line (31). Thus, the electromagnetic coupling between the maximum sub-line (32) and the minimum sub-line (31) and the intermediate sub-line (33) can be suppressed.

[0139] In the directional coupler (1) according to the fourth aspect, in any one of the first to third aspects, an inner portion (32u) of the largest secondary line (32) and an outer portion (2v) of the main line (2) overlap when viewed from a thickness direction (D1) of the multilayer substrate (8), and an outer portion (31v) of the smallest secondary line (31) and an inner portion (2u) of the main line (2) overlap.

[0140] According to this structure, the electromagnetic coupling between the largest secondary line (32) and the main line (2) can be improved. Also, the electromagnetic coupling between the smallest secondary line (31) and the main line (2) can be improved.

[0141] In the directional coupler (1) according to the fifth aspect, in any one of the first to fourth aspects, the main line (2), the first secondary line (31), the second secondary line (32), and the third secondary line (33) are arranged in a concentric shape when viewed from a thickness direction (D1) of the multilayer substrate (8).

[0142] According to this structure, the adjustment of the electromagnetic coupling between the main line (2) and the first to third secondary lines (31 to 33) can be easily performed. Also, the main line (2) and the first to third secondary lines (31 to 33) can be arranged in a concentrated manner, and thus the directional coupler (1) can be downsized.

[0143] In the directional coupler (1) according to the sixth aspect, in the fourth aspect, a line width (d0) of the main line (2) is larger than a line width (d1 to d3) of at least one of the first secondary line (31), the second secondary line (32), and the third secondary line (33) when viewed from a thickness direction (D1) of the multilayer substrate (8).

[0144] According to this structure, the line width (d0) of the main line (2) can be increased when viewed from the thickness direction (D1) of the multilayer substrate (8). Thus, the interval (Q1) between the largest secondary line (32) arranged on the outer side of the main line (2) and the smallest secondary line (31) arranged on the inner side of the main line (2) can be increased when viewed from the thickness direction (D1). Thus, the electromagnetic coupling between the largest secondary line (32) and the smallest secondary line (31) can be suppressed.

[0145] In the directional coupler (1) according to the seventh aspect, in the sixth aspect, the main line (2) has a first main line (21) and a second main line (22) connected in series. The first main line (21) and the second main line (22) each have a line portion formed in a loop shape. The line portions of the first main line (21) and the second main line (22) are arranged in mutually different dielectric layers among the plurality of dielectric layers (81 to 86).

[0146] According to this structure, the main line (2) can be configured by the double-layer structure of the first main line (21) and the second main line (22). Thus, the impedance of the main line (2) can be easily adjusted.

[0147] In the directional coupler (1) according to the eighth aspect, in the seventh aspect, the first main line (21) and the second main line (22) have mutually different first distances (R21, R22).

[0148] According to this structure, the first distance (R21) of the first main line (21) and the second distance (R22) of the second main line (22) can be respectively and independently adjusted. Thus, the impedance of the main line (2) can be easily adjusted.

[0149] In the directional coupler (1) according to the ninth aspect, in any one of the first to eighth aspects, a first switch (5, 6) is further provided, which is connected between two of the first sub-line (31), the second sub-line (32), and the third sub-line (33).

[0150] According to this structure, the line length of the sub-line (3) configured by the first to third sub-lines (33) can be adjusted by the first switch (5, 6). Thus, a plurality of frequency bands corresponding to the line length of the sub-line (3) can be dealt with.

[0151] The directional coupler (1) according to the tenth aspect further includes an IC chip (9, 58) including the first switch (5, 6) in the ninth aspect. The IC chip (9, 58) is disposed on one of the first main surface (8s) and the second main surface (8t) of the multilayer substrate (8, 57). At least a part of each of the main line (2), the first sub-line (31), the second sub-line (32), and the third sub-line (33) overlaps the IC chip (9, 58) when viewed from the thickness direction (D1) of the multilayer substrate (8, 57).

[0152] According to this structure, the wiring conductor connecting the IC chip (9, 58) and each line (the main line (2) and the first to third sub-lines (31 to 33)) can be shortened. As a result, unnecessary inductors can be suppressed from being generated in the wiring conductor connecting the IC chip (9, 58) and each line.

[0153] The high-frequency module (100) according to the eleventh aspect includes the directional coupler (1), the antenna terminal (130), and the signal path (S0) in any one of the first to tenth aspects. The signal path (S0) reaches the antenna terminal (130). The main line (2) of the directional coupler (1) configures a part of the signal path (S0).

[0154] According to this structure, it is possible to provide the high-frequency module (100) that can detect the high-frequency signal flowing in the signal path (S0) to the antenna terminal (130) by the directional coupler (1). In addition, it is possible to provide the high-frequency module (100) that has the above-described advantageous effects of the directional coupler (1).

[0155] The high-frequency module (100) according to the twelfth aspect includes the directional coupler (1) according to the tenth aspect, the antenna terminal (130), the plurality of filters (61 to 64), and the second switch (55). The second switch (55) switches connection and non-connection of each of a plurality of second signal paths (S1 to S4) reaching the plurality of filters (61 to 64) and a first signal path (S0) reaching the antenna terminal (130). The IC chip (58) further includes the second switch (55).

[0156] According to this structure, the IC chip 58 includes the first switch (5, 6) and the second switch (55). Thus, it is possible to integrate the first switch (5, 6) and the second switch (55) at one place, and as a result, it is possible to miniaturize the high-frequency module (100).

[0157] The communication device (200) according to the thirteenth aspect includes the high-frequency module (100) according to the eleventh or twelfth aspect and a signal processing circuit (210). The signal processing circuit (210) is connected to the high-frequency module (100) and processes the high-frequency signal.

[0158] According to this structure, it is possible to provide the communication device (200) that includes the high-frequency module (100) having the above-described advantageous effects.

Claims

1. A directional coupler comprising: a main line; first, second, and third sub-lines; and a multilayer substrate having a plurality of dielectric layers, the multilayer substrate having first and second main surfaces facing each other, the first sub-line and the second sub-line being connected in series, the second sub-line and the third sub-line being connected in series, the main line, the first sub-line, the second sub-line, and the third sub-line including line portions formed in a ring shape as viewed from a thickness direction of the multilayer substrate, the line portions of the main line, the first sub-line, the second sub-line, and the third sub-line each being disposed in different ones of the plurality of dielectric layers, in each of the first, second, and third sub-lines, a maximum distance among distances from an outer periphery to a center of gravity being a first distance, the first, second, and third sub-lines having different first distances from each other, in the first, second, and third sub-lines, a maximum sub-line having a maximum first distance and a minimum sub-line having a minimum first distance being disposed on the first main surface side of the main line, and an intermediate sub-line having an intermediate first distance being disposed on the second main surface side of the main line.

2. The directional coupler according to claim 1, wherein the maximum sub-line and the minimum sub-line are disposed so as not to overlap each other in a line width direction of the lines as viewed from the thickness direction of the multilayer substrate.

3. The directional coupler according to claim 1 or 2, wherein the main line and the intermediate sub-line are disposed so as to at least partially overlap each other in a long side direction of the lines as viewed from the thickness direction of the multilayer substrate.

4. The directional coupler according to claim 1 or 2, wherein an inner side portion of the maximum sub-line overlaps an outer side portion of the main line, and an outer side portion of the minimum sub-line overlaps an inner side portion of the main line as viewed from the thickness direction of the multilayer substrate.

5. The directional coupler according to claim 1 or 2, wherein the main line, the first sub-line, the second sub-line, and the third sub-line are disposed in a concentric shape as viewed from the thickness direction of the multilayer substrate.

6. The directional coupler according to claim 4, wherein a line width of the main line is larger than a line width of at least one of the first, second, and third sub-lines as viewed from the thickness direction of the multilayer substrate.

7. The directional coupler according to claim 6, wherein the main line has first and second main lines connected in series, the first and second main lines each include a line portion formed in a ring shape, and the line portions of the first and second main lines each are disposed in different ones of the plurality of dielectric layers. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 8. The directional coupler according to claim 7, wherein The first main line and the second main line have different first distances from each other.

9. The directional coupler according to claim 1 or 2, wherein A first switch is further provided, which is connected between two of the first sub-line, the second sub-line, and the third sub-line.

10. The directional coupler according to claim 9, wherein An IC chip including the first switch is further provided, The IC chip is disposed on one of the first main surface and the second main surface of the multilayer substrate, At least a portion of each of the main line, the first sub-line, the second sub-line, and the third sub-line overlaps the IC chip when viewed from the thickness direction of the multilayer substrate.

11. A high-frequency module comprising: The directional coupler according to any one of claims 1 to 10; An antenna terminal; and A signal path to the antenna terminal, The main line of the directional coupler constitutes a part of the signal path.

12. A high-frequency module comprising: The directional coupler according to claim 10; An antenna terminal; A plurality of filters; and A second switch that switches connection and disconnection of a first signal path to the antenna terminal and each of a plurality of second signal paths to the plurality of filters, The IC chip further includes the second switch.

13. A communication device comprising: The high-frequency module according to claim 11 or 12; and A signal processing circuit that is connected to the high-frequency module and processes a high-frequency signal.

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