Electronic tag and method of manufacturing the same

Abstract

The application provides an electronic tag and a manufacturing method thereof. The electronic tag comprises a substrate, an inductive coil located on one side of the substrate, a flat layer located on the side of the inductive coil away from the substrate, an anode located on the side of the inductive coil away from the substrate and in contact with a first end of the inductive coil, a pixel defining layer covering a part of the surface of the anode away from the substrate and defining an opening, a light-emitting layer located in the opening, a cathode located on the side of the pixel defining layer away from the substrate and in contact with a second end of the inductive coil, wherein the orthographic projection of the anode on the substrate and the orthographic projection of the flat layer on the substrate have no overlapping area, or the anode covers a part of the surface of the flat layer away from the substrate, the anode has a plurality of hollow areas, and the pixel defining layer fills the hollow areas. The electronic tag has good display effect and can at least to some extent avoid pixel shrinkage and / or black spot defects.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to an electronic tag and a manufacturing method thereof. Background Art

[0002] With the continuous development of display technology, the scope of application of display technology is becoming wider and wider, including mobile phones, televisions, car displays, etc. In order to achieve better anti-counterfeiting effect, products in many fields currently use electronic tags as anti-counterfeiting identification.

[0003] However, current electronic tags have problems such as pixel shrinkage and black spot defects, and electronic tags and their production methods need to be improved. Summary of the Invention

[0004] The present invention aims to solve one of the technical problems in the related art at least to a certain extent.

[0005] In one aspect, the present invention provides an electronic tag. According to an embodiment of the present invention, the electronic tag includes: a substrate; an induction coil, the induction coil being located on one side of the substrate; a flat layer, the flat layer being located on a side of the induction coil away from the substrate; an anode, the anode being located on a side of the induction coil away from the substrate, the anode being in contact with and connected to a first end of the induction coil; a pixel defining layer, the pixel defining layer covering a portion of the surface of the anode away from the substrate, the pixel defining layer defining an opening; a light-emitting layer, the light-emitting layer being located in the opening; a cathode, the cathode being located on a side of the pixel defining layer away from the substrate, the cathode being in contact with and connected to a second end of the induction coil; wherein the orthographic projection of the anode on the substrate and the orthographic projection of the flat layer on the substrate have no overlapping area; or, the anode covers a portion of the surface of the flat layer away from the substrate, the anode has multiple hollow areas, and the pixel defining layer fills the hollow areas. As a result, the electronic tag has a good display effect and can at least to a certain extent avoid pixel shrinkage and / or black spot defects.

[0006] According to an embodiment of the present invention, the electronic tag further includes: a protective layer covering a portion of the surface of the induction coil away from the substrate; and / or an encapsulation layer covering at least a portion of the surface of the cathode away from the substrate. Thus, the protective layer can protect the induction coil, at least to a certain extent, from corrosion, thereby extending the service life of the electronic tag; the encapsulation layer can prevent external water and oxygen from invading the luminescent layer, thereby further extending the service life of the electronic tag.

[0007] According to the embodiment of the present application, the material of the inductive coil comprises copper, and / or the thickness of the inductive coil is 0.5-1.5 μm. Thus, the overall performance of the electronic tag is improved.

[0008] According to the embodiment of the present application, the material of the protective layer comprises at least one of silicon oxide, silicon nitride and silicon oxynitride, and / or the thickness of the protective layer is 150-600 nm. Thus, the protective layer has good insulation performance and can protect the inductive coil.

[0009] According to the embodiment of the present application, the material of the planar layer comprises polyimide, and / or the thickness of the planar layer is 1-1.5 μm; and / or the material of the pixel defining layer comprises polyimide; and / or the thickness of the pixel defining layer is 1-1.5 μm. Thus, the overall performance of the electronic tag is further improved.

[0010] According to the embodiment of the present application, the anode comprises a first indium tin oxide layer, a silver layer and a second indium tin oxide layer which are stacked, wherein the thickness of the first and second indium tin oxide layers is independently 80-100 nm, and / or the thickness of the silver layer is 8-10 nm. Thus, the anode has good conductivity, and the overall performance of the electronic tag is further improved.

[0011] According to the embodiment of the present application, the material of the substrate comprises at least one of polyimide and polyethylene terephthalate. The material of the substrate has certain flexibility, which is beneficial to improve the flexibility of the electronic tag and expand the application field of the electronic tag.

[0012] In another aspect of the present application, the present application provides a method for manufacturing the electronic tag as described above. According to an embodiment of the present application, the method for manufacturing the electronic tag as described above comprises: providing a substrate; forming an inductive coil on one side of the substrate; forming a planar layer on the side of the inductive coil away from the substrate; forming an anode on the side of the inductive coil away from the substrate, the anode covering part of the surface of the planar layer away from the substrate, the anode being in contact with the first end of the inductive coil, patterning the anode to form a plurality of hollowed-out regions, forming a pixel defining layer, the pixel defining layer covering part of the surface of the anode away from the substrate, the pixel defining layer filling the hollowed-out regions, and the pixel defining layer defining an opening; or forming an anode on the side of the inductive coil away from the substrate, the anode being in contact with the first end of the inductive coil, the anode not overlapping with the planar layer in orthographic projection on the substrate, forming a pixel defining layer, the pixel defining layer covering part of the surface of the anode away from the substrate, and the pixel defining layer defining an opening; forming a light-emitting layer in the opening; forming a cathode on the side of the pixel defining layer away from the substrate, the cathode being in contact with the second end of the inductive coil. Thus, the electronic tag manufactured by the above method has all the features and advantages of the electronic tag as described above, which will not be repeated here. In general, the electronic tag has good display effect, and the manufacturing method is relatively simple, which is conducive to improving the yield of products.

[0013] According to an embodiment of the present application, after forming the inductive coil, the method for manufacturing the electronic tag as described above further comprises: forming a protective layer on the side of the inductive coil away from the substrate. Thus, the inductive coil can be protected by the protective layer to avoid corrosion of the inductive coil.

[0014] According to an embodiment of the present application, the method for manufacturing the electronic tag as described above further comprises: forming an encapsulation layer on at least part of the surface of the cathode away from the substrate. Thus, it is conducive to further prolonging the service life of the electronic tag. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 shows a structural schematic diagram of an electronic tag according to an embodiment of the present application;

[0016] Figure 2 shows a structural schematic diagram of an electronic tag according to another embodiment of the present application;

[0017] Figure 3 shows a structural schematic diagram of an electronic tag according to yet another embodiment of the present application;

[0018] Figure 4A structural schematic diagram of an electronic tag according to still another embodiment of the present application is shown;

[0019] Figure 5 A schematic diagram showing that an electronic tag in the related art has a pixel shrink problem is shown;

[0020] Figure 6 A schematic diagram showing that an electronic tag in the related art has a black spot defect is shown;

[0021] Figure 7 A structural schematic diagram of an inductive coil according to an embodiment of the present application is shown;

[0022] Figure 8 A schematic diagram showing that an inductive coil is connected to a display portion according to an embodiment of the present application is shown;

[0023] Figure 9 A schematic diagram showing that an inductive coil is connected to a display portion according to another embodiment of the present application is shown;

[0024] Figure 10 A flowchart showing a method of manufacturing an electronic tag according to an embodiment of the present application is shown;

[0025] Figure 11 A flowchart showing a method of manufacturing an electronic tag according to another embodiment of the present application is shown;

[0026] Figure 12 A flowchart showing a method of manufacturing an electronic tag according to still another embodiment of the present application is shown;

[0027] Figure 13 A flowchart showing a method of manufacturing an electronic tag according to still another embodiment of the present application is shown.

[0028] Explanation of Reference Numerals:

[0029] 100: substrate; 200: inductive coil; 210: first end; 220: second end; 300: flat layer; 400: anode; 410: hollowed-out region; 500: pixel defining layer; 600: light emitting layer; 700: cathode; 800: protective layer; 900: encapsulating layer; 10: first through-hole; 20: second through-hole; 30: sub-pixel; 1: theoretical display edge; 2: actual display edge. DETAILED DESCRIPTION

[0030] Embodiments of the present application are described in detail below. The embodiments described below are exemplary only and are not intended to be limiting of the present application. Where specific technical or conditions are not mentioned in the embodiments, the technical or conditions described in the literature in the field or according to the product manual are used.

[0031] In one aspect of the present disclosure, an electronic tag is provided. According to embodiments of the present disclosure, referring to Figures 1 to 4 , the electronic tag can include a substrate 100, an inductive coil 200, a planar layer 300, an anode 400, a pixel defining layer 500, a light emitting layer 600, and a cathode 700. The inductive coil 200 is located on one side of the substrate 100. The planar layer 300 is located on a side of the inductive coil 200 away from the substrate 100. The anode 400 is located on a side of the inductive coil 200 away from the substrate 100, and the anode 400 is in contact with a first end of the inductive coil 200. The pixel defining layer 500 covers a portion of a surface of the anode 400 away from the substrate 100, and the pixel defining layer 500 defines an opening. The light emitting layer 600 is located in the opening. The cathode 700 is located on a side of the pixel defining layer 500 away from the substrate 100, and the cathode 700 is in contact with a second end of the inductive coil 200. According to some embodiments of the present disclosure, referring to Figure 1 and Figure 3 , the anode 400 covers a portion of a surface of the planar layer 300 away from the substrate 100, and the anode 400 has a plurality of hollow regions 410, and the pixel defining layer 500 fills the hollow regions 410. According to other embodiments of the present disclosure, referring to Figure 2 and Figure 4 , a normal projection of the anode 400 on the substrate 100 does not overlap with a normal projection of the planar layer 300 on the substrate 100. Thus, the electronic tag has a good display effect, and can at least to some extent avoid pixel shrinkage and / or black spot defects.

[0032] The principle that the electronic tag provided by the present disclosure can avoid pixel shrinkage and / or black spot defects is described as follows: in the related art, the anode is located on a surface of the planar layer away from the substrate, the planar layer is formed of an organic material, and water molecules and some small-molecule organic substances need to be discharged during the curing process. The anode is disposed on the surface of the planar layer, the material of the anode is usually an inorganic material, and the area of the planar layer covered by the anode is large, which makes it difficult for the water molecules and / or small-molecule organic substances generated by the planar layer to be discharged, resulting in pixel shrinkage (referring to Figure 5 , Figure 5 wherein 1 is a theoretical display edge, and 2 is an actual display edge) and black spot defects (referring to Figure 6 ).

[0033] The present disclosure alleviates or even solves the technical problems of pixel shrinkage and / or black spot defects of the electronic tag in the related art by reducing the area of the planar layer covered by the anode. According to some embodiments of the present disclosure, referring to Figure 1 and Figure 3The anode is patterned to form a plurality of hollowed-out regions, so that water molecules and other small-molecule organic substances generated by the flat layer under the anode can be discharged from the hollowed-out regions, thereby avoiding pixel shrinkage and / or black spot defects. According to some other embodiments of the present application, referring to Figure 2 and Figure 4 , the anode 400 has no overlapping area with the flat layer 300 on the substrate 100 in orthographic projection, that is, no flat layer 300 is arranged under the anode 400, and the surface of the flat layer is not covered by the anode, so that water molecules or other small-molecule organic substances generated by the flat layer can also be discharged, thereby avoiding pixel shrinkage and / or black spot defects.

[0034] According to embodiments of the present application, the structure of the inductive coil 200 can refer to Figure 7 , the inductive coil 200 has a first end 210 and a second end 220, the first end 210 can be in contact with the anode 400, and the second end 220 can be in contact with the cathode 700.

[0035] According to some embodiments of the present application, after the anode is patterned to form a plurality of hollowed-out regions, the display part is composed of a plurality of sub-pixels, referring to Figure 8 , the two ends of the inductive coil are connected with the cathode and the anode (not shown in the figure) of the display part, respectively, so that the electronic tag can display normally, and the display part of the electronic tag can be composed of a plurality of sub-pixels 30. According to some other embodiments of the present application, referring to Figure 9 , the anode is not patterned, and the display part of the electronic tag is composed of a whole pixel.

[0036] According to some embodiments of the present application, the material of the inductive coil 200 can include copper, so that the inductive coil can induce a voltage under the action of an external power supply, thereby applying a voltage to the anode and the cathode, so that the electronic tag can display. According to some specific embodiments of the present application, the material of the inductive coil 200 can be copper.

[0037] According to some embodiments of the present application, the thickness of the inductive coil 200 can be 0.5 μm to 1.5 μm, for example, the thickness of the inductive coil 200 can be 0.5 μm, 0.8 μm, 1.0 μm, 1.3 μm, 1.5 μm, etc., so that the inductive coil has a suitable thickness, is convenient to manufacture, and is conducive to the lightness and thinness of the electronic tag.

[0038] According to some embodiments of the present application, the material of the substrate 100 can include at least one of polyimide (PI) and polyethylene terephthalate (PET), etc. The above-mentioned materials have good flexibility, and can provide certain support performance. The electronic tag made of the above-mentioned material as the substrate is beneficial to improve the flexibility and stability of the electronic tag, facilitate the use of the electronic tag, and thus is beneficial to expand the application field and use scenario of the electronic tag. According to some specific embodiments of the present application, the material of the substrate 100 can be polyimide. According to some other specific embodiments of the present application, the material of the substrate 100 can be polyethylene terephthalate.

[0039] According to embodiments of the present application, the material of the flat layer 300 can include polyimide. Thus, the flat layer can have good planarization effect, and the flat layer of the above-mentioned material can also provide certain support effect, which is beneficial to make other film layers thereon. According to some embodiments of the present application, the material of the flat layer 300 can be polyimide.

[0040] According to embodiments of the present application, the thickness of the flat layer 300 can be 1 μm to 1.5 μm, for example, the thickness of the flat layer 300 can be 1 μm, 1.1 μm, 1.2 μm, 1.3 μm, 1.4 μm, 1.5 μm, etc. Thus, the flat layer has a suitable thickness, and the surface of the flat layer away from the substrate is a flat surface, which is beneficial to make other film layers thereon.

[0041] According to embodiments of the present application, the anode 400 can include a first indium tin oxide layer, a silver layer and a second indium tin oxide layer which are stacked. Thus, the anode has good conductivity, which is beneficial to improve the overall performance of the electronic tag.

[0042] According to some embodiments of the present application, the thickness of the first indium tin oxide layer and the second indium tin oxide layer can be independently 80 nm to 100 nm, for example, the thickness of the first indium tin oxide layer can be 80 nm, 83 nm, 85 nm, 88 nm, 90 nm, 92 nm, 95 nm, 98 nm, 100 nm, etc., and the thickness of the second indium tin oxide layer can be 80 nm, 83 nm, 85 nm, 88 nm, 90 nm, 92 nm, 95 nm, 98 nm, 100 nm, etc. According to some embodiments of the present application, the thickness of the silver layer can be 8 nm to 10 nm, for example, the thickness of the silver layer can be 8 nm, 8.5 nm, 9 nm, 9.5 nm, 10 nm, etc.

[0043] According to an embodiment of the present application, the material of the pixel defining layer 500 can include polyimide, so that the pixel defining layer can provide certain support function and facilitate the fabrication of other film layers thereon, and the material of the pixel defining layer is organic, and the water molecules or other small molecule organic substances generated by the planarization layer below the pixel defining layer can be discharged by the pixel defining layer.

[0044] According to some embodiments of the present application, the thickness of the pixel defining layer 500 can be 1 μm to 1.5 μm, for example, the thickness of the pixel defining layer 500 can be 1 μm, 1.1 μm, 1.2 μm, 1.3 μm, 1.4 μm, 1.5 μm, etc.

[0045] According to some embodiments of the present application, the material of the cathode 700 can be a metal or an alloy with good conductivity, for example, copper, aluminum, silver, etc.

[0046] According to some embodiments of the present application, referring to Figures 1 to 4 , the electronic tag can further include a protective layer 800 covering at least part of the surface of the inductive coil 200 away from the substrate 100, so that the protective layer can play a role in protecting the inductive coil and effectively preventing the inductive coil from being corroded, thereby facilitating the extension of the service life of the electronic tag.

[0047] According to some embodiments of the present application, the material of the protective layer 800 can include at least one of silicon oxide, silicon nitride and silicon oxynitride, so that the protective layer can play a good insulation role and effectively prevent the inductive coil from being corroded.

[0048] According to some embodiments of the present application, the thickness of the protective layer 800 can be 150 nm to 600 nm, for example, the thickness of the protective layer 800 can be 150 nm, 200 nm, 300 nm, 400 nm, 500 nm, 600 nm, etc., so that the protective layer can play a good role in protecting the inductive coil, and facilitate the thinning of the electronic tag.

[0049] According to some embodiments of the present application, referring to Figure 3 and Figure 4 , the electronic tag can further include an encapsulation layer 900 covering at least part of the surface of the cathode 700 away from the substrate 100. Thus, the encapsulation layer can effectively prevent the intrusion of external water and oxygen into the light-emitting layer, thereby facilitating the further extension of the service life of the electronic tag.

[0050] According to some embodiments of the present application, the encapsulation layer 900 can include a first inorganic insulating layer, an organic insulating layer and a second inorganic insulating layer which are sequentially stacked.

[0051] In another aspect of the present application, the present application provides a method for manufacturing the electronic tag as described above. The steps of manufacturing the electronic tag are described below according to some specific embodiments of the present application.

[0052] According to some embodiments of the present application, referring to Figure 10 The method for manufacturing the electronic tag can include: providing a substrate 100; forming an inductive coil 200 on one side of the substrate 100; forming a planar layer 300 on the side of the inductive coil 200 away from the substrate 100; forming an anode 400 on the side of the inductive coil 200 away from the substrate 100, the anode 400 covering part of the surface of the planar layer 300 away from the substrate 100, the anode 400 being in contact with the first end of the inductive coil 200, and the anode 400 being patterned to form a plurality of hollowed-out areas 410; forming a pixel defining layer 500 covering part of the surface of the anode 400 away from the substrate 100, the pixel defining layer 500 filling the hollowed-out areas 410, and the pixel defining layer 500 defining an opening; forming a light-emitting layer 600 in the opening; and forming a cathode 700 on the side of the pixel defining layer 500 away from the substrate 100, the cathode 700 being in contact with the second end of the inductive coil 200. The structure of the electronic tag manufactured by the above steps is shown in FIG. 2, and the water molecules or other small-molecule organic substances generated by the planar layer can be discharged through the hollowed-out areas, thereby effectively avoiding technical problems such as pixel shrinkage and / or black spot defects, so that the electronic tag has a better display effect and can be used as an anti-counterfeiting identifier. The above method for manufacturing the electronic tag has relatively simple steps and is easy to operate, and is conducive to improving the yield of products. Figure 1

[0053] According to some other embodiments of the present application, referring to Figure 11 The method for manufacturing the electronic tag can include: providing a substrate 100; forming an inductive coil 200 on one side of the substrate 100; forming a planar layer 300 on the side of the inductive coil 200 away from the substrate 100; forming an anode 400 on the side of the inductive coil 200 away from the substrate 100, the anode 400 being in contact with the first end of the inductive coil 200, and the anode 400 not having an overlapping area with the orthographic projection of the planar layer 300 on the substrate 100; forming a pixel defining layer 500 covering part of the surface of the anode 400 away from the substrate 100, and the pixel defining layer 500 defining an opening; forming a light-emitting layer 600 in the opening; and forming a cathode 700 on the side of the pixel defining layer 500 away from the substrate 100, the cathode 700 being in contact with the second end of the inductive coil 200. The structure of the electronic tag manufactured by the above steps is shown in FIG. 2, and the water molecules or other small-molecule organic substances generated by the planar layer can be discharged through the hollowed-out areas, thereby effectively avoiding technical problems such as pixel shrinkage and / or black spot defects, so that the electronic tag has a better display effect and can be used as an anti-counterfeiting identifier. The above method for manufacturing the electronic tag has relatively simple steps and is easy to operate, and is conducive to improving the yield of products. Figure 2 ​As shown, the anode 400 is not arranged above the planar layer 300, which is beneficial for the discharge of water molecules or other small-molecule organic matters generated by the planar layer, thereby effectively avoiding pixel shrinkage and / or black spot defects; the above method is easy to operate, and is beneficial for improving the yield of products.

[0054] According to some embodiments of the present application, referring to Figures 10 to 13 After the inductive coil 200 is formed, the method for manufacturing the electronic tag can further include: forming a protective layer 800 on the side of the inductive coil 200 away from the substrate 100. The material and thickness of the protective layer 800 and other features have been described in detail above, and will not be repeated here.

[0055] According to some embodiments of the present application, referring to Figure 10 and Figure 12 A metal copper layer with a thickness of 0.5 μm to 1.5 μm can be deposited on the substrate 100, and then the inductive coil 200 is formed by patterning; the protective layer 800 is formed on the side of the inductive coil 200 away from the substrate 100, the material of the protective layer 800 can be at least one of silicon oxide, silicon nitride, and silicon oxynitride, and the protective layer 800 covers at least part of the surface of the inductive coil 200 away from the substrate 100; the planar layer 300 with a thickness of 1 μm to 1.5 μm is coated, the planar layer 300 covers the surface of the protective layer 800 away from the substrate, the planar layer 300 and the protective layer 800 are etched to form the first through hole 10; the anode 400 is deposited, the anode includes a first indium tin oxide layer (100 nm), a silver layer (8 nm to 10 nm), and a second indium tin oxide layer (100 nm) arranged in a stack, the anode is in contact with the first end of the inductive coil 200 through the first through hole 10, and the anode is patterned to form a plurality of hollow areas 410; a polyimide material with a thickness of 1 μm to 1.5 μm is coated, and a pixel defining layer 500 with openings is formed by patterning; the light-emitting layer 600 is formed in the openings (for example, the light-emitting layer can be formed in the openings by evaporating an organic light-emitting material); the pixel defining layer 500, the planar layer 300, and the protective layer 800 are etched to form the second through hole 20, and the cathode 700 is evaporated on the side of the pixel defining layer 500 away from the substrate 100, and the cathode 700 is in contact with the second end of the inductive coil 200 through the second through hole 20.

[0056] According to some embodiments of the present application, referring to Figure 11 and Figure 13The metal copper layer with a thickness of 0.5-1.5 μm can be deposited on the substrate 100, and then the inductive coil 200 is formed by patterning; the protective layer 800 is formed on the side of the inductive coil 200 away from the substrate 100, and the protective layer 800 covers at least part of the surface of the inductive coil 200 away from the substrate 100; the planar layer 300 with a thickness of 1-1.5 μm is coated, and the planar layer 300 covers part of the surface of the protective layer 800 away from the substrate 100; the first through hole 10 is formed by etching the protective layer 800; the anode 400 is deposited, and the anode 400 is connected with the first end of the inductive coil 200 through the first through hole 10, and the orthogonal projection of the anode 400 on the substrate 100 does not overlap with the orthogonal projection of the planar layer 300 on the substrate 100; the pixel defining layer 500 with an opening is formed by coating the polyimide material with a thickness of 1-1.5 μm and patterning; the light emitting layer 600 is formed in the opening (for example, the light emitting layer can be formed in the opening by evaporating the organic light emitting material); the second through hole 20 is formed by etching the pixel defining layer 500 and the protective layer 800, and the cathode 700 is evaporated on the side of the pixel defining layer 500 away from the substrate 100, and the cathode 700 is connected with the second end of the inductive coil 200 through the second through hole 20.

[0057] According to some embodiments of the present application, referring to Figure 12 and Figure 13 the method for manufacturing the electronic tag can further include forming the encapsulation layer 900 on at least part of the surface of the cathode 700 away from the substrate 100. The material of the encapsulation layer 900 has been described above, and thus will not be repeated here.

[0058] The electronic tag according to the present application can be adhered to the surface of an article by means of adhesion, or can be manufactured in the interior of the article, for example, in the interior of a banknote, to provide a security identification.

[0059] The terms "first", "second", etc. are used only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second", etc. can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specifically limited.

[0060] In the description of the specification, the description of the terms "one embodiment", "another embodiment", "some embodiments", "some specific embodiments" or "other specific embodiments" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are contained in at least one embodiment or example of the present application. In the specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Also, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. Furthermore, the person skilled in the art can combine and combine the different embodiments or examples described in the specification and the features of the different embodiments or examples, without contradiction.

[0061] Although the embodiments of the present application have been shown and described above, it is understood that the above-described embodiments are exemplary and are not to be construed as limiting the present application, and the person skilled in the art can make changes, modifications, replacements and variations to the above-described embodiments within the scope of the present application.

Claims

1. An electronic tag, characterized by The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof.

2. The electronic tag according to claim 1, characterized in that, The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof.

3. The electronic tag according to claim 1 or 2, characterized in that, The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof.

4. The electronic tag according to claim 2, characterized in that, The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof.

5. The electronic tag according to claim 1 or 2, characterized in that, The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof.

6. The electronic tag according to claim 1 or 2, characterized in that, The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof.

7. The electronic tag according to claim 1 or 2, characterized in that, The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof.

8. A method of manufacturing the electronic tag according to any one of claims 1 to 7, characterized by, The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof.

9. The method of claim 8, wherein, The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof.

10. The method according to claim 8 or 9, characterized in that, The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. 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The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting diode (OLED) and a manufacturing method thereof. The application relates to an organic light emitting

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