Semiconductor packaging material handling equipment

Abstract

This invention discloses a semiconductor packaging material handling equipment, comprising: a feeding mechanism for storing materials; a picking mechanism for removing materials from the feeding mechanism; a material identification mechanism for identifying the materials picked up by the picking mechanism; a robotic arm mechanism for picking up and placing materials; a stacking mechanism for stacking materials, feeding them into an oven mechanism, and removing them from the oven mechanism; an oven mechanism for baking the materials; a buffer station for storing the baked materials; and an unloading mechanism for unloading. This invention integrates feeding, mechanical sorting, stacking, baking, and unloading into a single unit, achieving truly fully automated transmission and material handling management, reducing manual assistance during processing, and improving product processing efficiency and quality.

Description

Technical fields:

[0001] This invention belongs to the field of semiconductor packaging equipment technology, and specifically relates to loading and unloading equipment for semiconductor packaging. Background technology:

[0002] In the semiconductor packaging industry, chip baking is a common process in semiconductor processing. Baking involves operations such as loading and unloading, and sorting. Currently, chip loading and unloading, and sorting require a lot of manual assistance, as there is a lack of complete loading and unloading processing equipment. Excessive manual assistance not only results in high labor costs, but also makes it easy for errors to occur during the manual process, leading to abnormalities in the processing, such as products falling, colliding, scratching, or getting contaminated due to human error. Therefore, it is necessary to develop an automated loading and unloading equipment to reduce manual assistance.

[0003] The information disclosed in this background section is intended only to enhance the understanding of the overall background of the invention and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Summary of the Invention:

[0004] The purpose of this invention is to provide a loading and unloading device for semiconductor packaging, thereby overcoming the defects in the prior art.

[0005] To achieve the above objectives, the present invention provides a semiconductor packaging loading and unloading device, comprising:

[0006] A feeding mechanism, used for storing materials;

[0007] A material handling mechanism, which is used to remove material from the feeding mechanism;

[0008] A material identification mechanism, wherein the material identification mechanism is used to identify the material taken out by the material handling mechanism;

[0009] A robotic arm mechanism, used for picking up and placing materials;

[0010] A stacking mechanism for stacking materials and feeding materials into and removing materials from the oven mechanism;

[0011] An oven mechanism for baking materials;

[0012] A buffer station, which is used to store the baked materials;

[0013] The material discharge mechanism is used for discharging materials.

[0014] Preferably, the feeding mechanism includes several feeding trolleys, each of which is provided with several layers of partition drive rails. Oven partitions are provided on the partition drive rails, and the oven partitions can slide on the partition drive rails. The oven partitions are used to place chip clips.

[0015] Preferably, the oven partition is further provided with a number of positioning pins, which are used to position the oven partition.

[0016] Preferably, the material handling mechanism is close to the feeding mechanism and includes a ground rail and a slide seat set on the ground rail. The slide seat is provided with a lifting mechanism, the lifting mechanism is provided with a support mechanism, the support mechanism is provided with a pair of transmission rails and a transmission seat, the transmission rails are used to place the oven partition, and the transmission seat is provided with a sliding clamp, the sliding clamp is used to clamp the oven partition.

[0017] Preferably, the material identification mechanism includes a frame and a light source and an identification camera mounted on the frame. The frame is close to the feeding mechanism and fixed to the ground, and the light source and identification camera are both located above the ground rail.

[0018] Preferably, the robotic arm mechanism includes a multi-axis robotic arm, which is close to the ground rail and is equipped with a partition gripper.

[0019] Preferably, the partition gripper includes a clamping seat, which is connected to a multi-axis robot. A pair of adjusting plates and a pair of cylinders are mounted on the clamping seat. The cylinders are connected to the adjusting plates and are used to adjust the adjusting plates. Each adjusting plate is provided with a pair of grippers.

[0020] Preferably, the stacking mechanism is close to the robotic arm mechanism and includes a stacking ground rail and a stacking trolley set on the stacking ground rail. The stacking trolley is provided with an up-and-down adjustable support seat. The up-and-down adjustable support seat is provided with a pair of feeding rails and a pushing rail. The pushing rail is provided with a pushing clamp, which is used to push the oven partition.

[0021] Preferably, the oven mechanism includes several ovens, which are evenly distributed on both sides of the stacking track.

[0022] Preferably, the buffer station is located close to the stacking mechanism and is used to buffer materials.

[0023] Preferably, the discharge mechanism is located close to the buffer station and includes at least one discharge conveyor line.

[0024] Preferably, the system also includes a work order temporary storage station, which is equipped with several work order temporary storage shelves.

[0025] Preferably, the discharge mechanism further includes a discharge robot arm, which is equipped with a vision scanning mechanism.

[0026] Compared with the prior art, one aspect of the present invention has the following beneficial effects:

[0027] (1) The equipment of the present invention integrates feeding, mechanical sorting, stacking, baking and unloading, which can truly realize fully automatic transmission and feeding management, reduce manual assistance in the processing process, and improve the efficiency and quality of product processing;

[0028] (2) The feeding structure adopts the design of a feeding trolley. The trolley is designed with a transmission rail and a partition, which makes it easier to pull the partition out of the trolley when picking up and putting down materials.

[0029] (3) The combined design of the material handling mechanism, the lifting mechanism and the sliding clamp makes it easier to pick up materials from the loading trolley;

[0030] (4) The partition clamp adopts a combination design of a pair of adjusting plates and a pair of cylinders, which makes it easier to stably clamp the partition;

[0031] (5) The stacking mechanism adopts a combination design of stacking ground rail, stacking trolley and pushing clamp, which makes it easier to send materials into the oven for baking and to take out the processed materials from the oven.

[0032] (6) The discharge mechanism is also designed with a discharge robot and a vision scanning mechanism, which can realize the sorting operation of the processed materials. Attached image description:

[0033] Figure 1 This is a schematic diagram of the overall structure of the semiconductor packaging loading and unloading equipment of the present invention;

[0034] Figure 2 This is a partial enlarged schematic diagram of the loading mechanism of the semiconductor packaging loading and unloading equipment of the present invention;

[0035] Figure 3 This is a top view of the material handling mechanism of the semiconductor packaging loading and unloading equipment of the present invention;

[0036] Figure 4 This is a partial enlarged top view of the material handling mechanism of the semiconductor packaging loading and unloading equipment of the present invention;

[0037] Figure 5 This is a partially enlarged schematic diagram of the material handling mechanism of the semiconductor packaging loading and unloading equipment of the present invention.

[0038] Figure 6 This is an enlarged schematic diagram of the material identification mechanism of the semiconductor packaging loading and unloading equipment of the present invention;

[0039] Figure 7 This is an enlarged schematic diagram of the robotic arm mechanism of the semiconductor packaging loading and unloading equipment of the present invention;

[0040] Figure 8 This is an enlarged schematic diagram of the partition gripper of the robotic arm mechanism of the semiconductor packaging loading and unloading equipment of the present invention.

[0041] Figure 9 This is an enlarged schematic diagram of the stacking mechanism of the semiconductor packaging loading and unloading equipment of the present invention;

[0042] Figure 10 This is an enlarged top view of the stacking mechanism and buffer mechanism of the semiconductor packaging loading and unloading equipment of the present invention;

[0043] Figure 11 This is an enlarged top view of the discharge mechanism of the semiconductor packaging loading and unloading device of the present invention;

[0044] Figure 12 This is an enlarged schematic diagram of the discharge robot arm of the discharge mechanism of the semiconductor packaging loading and unloading equipment of the present invention;

[0045] Figure 13 This is an enlarged schematic diagram of the work order temporary storage station of the semiconductor packaging loading and unloading equipment of the present invention;

[0046] Reference numerals: 1-Feeding mechanism, 101-Feeding trolley, 102-Baffle transmission rail, 103-Oven partition, 104-Chip magazine, 105-Positioning pin, 2-Material handling mechanism, 201-Ground rail, 202-Slide seat, 203-Lifting mechanism, 204-Support mechanism, 205-Transmission rail, 206-Transmission seat, 207-Sliding clamp, 3-Material identification mechanism, 301-Frame, 302-Light source, 303-Identification camera, 4-Robot mechanism, 401-Multi-axis robot, 402 - Partition gripper, 403- Fixture seat, 404- Adjusting plate, 405- Cylinder, 406- Gripper, 5- Stacking mechanism, 501- Stacking ground rail, 502- Stacking trolley, 503- Up and down adjusting support seat, 504- Feeding rail, 505- Pushing rail, 506- Pushing fixture, 6- Drying oven mechanism, 601- Drying oven, 7- Buffer station, 8- Discharge mechanism, 801- Discharge conveyor line, 802- Discharge robot, 803- Vision scanning mechanism, 9- Enclosure frame, 10- Work order temporary storage station. Detailed implementation method:

[0047] The specific embodiments of the present invention will be described in detail below, but it should be understood that the scope of protection of the present invention is not limited to the specific embodiments.

[0048] The following provides a brief overview of one or more aspects to offer a basic understanding of them. This overview is not an exhaustive summary of all conceived aspects, nor is it intended to identify key or decisive elements of all aspects, nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form to prepare for the more detailed descriptions that follow.

[0049] Example 1:

[0050] like Figure 1-13 As shown, in order to achieve the above objectives, the present invention provides a semiconductor packaging loading and unloading device, comprising:

[0051] Feeding mechanism 1, which is used to store materials;

[0052] Material handling mechanism 2, which is used to remove material from the feeding mechanism 1;

[0053] Material identification mechanism 3, which is used to identify the material taken out by material picking mechanism 2;

[0054] Robotic arm mechanism 4, which is used to pick up and place materials;

[0055] Stacking mechanism 5, which is used to stack materials and feed materials into the drying oven mechanism 6 and to remove materials from the drying oven mechanism 6;

[0056] Oven mechanism 6, which is used for baking materials;

[0057] Buffer station 7, which is used to store the baked materials;

[0058] The discharge mechanism 8 is used for discharging materials.

[0059] The feeding mechanism 1, the picking mechanism 2, the material identification mechanism 3, the robotic arm mechanism 4, the stacking mechanism 5, the buffer station 7, and the unloading mechanism 8 are enclosed within the enclosure frame 9 by the design.

[0060] like Figure 2As shown, in this embodiment, the feeding mechanism 1 includes multiple neatly arranged feeding trolleys 101. Each feeding trolley 101 has multiple sets of partition drive rails 102 on its inner wall. Oven partitions 103 are placed on the partition drive rails 102. The bottom of the oven partitions 103 can move on the partition drive rails 102. Chip clips 104 are placed on the oven partitions 103, and chips to be processed are placed inside the chip clips 104. The bottom of the feeding trolley 101 can be equipped with casters to facilitate the movement of the trolley. The trolley's shelf is made of stainless steel, and its width matches that of the oven partitions 103 to facilitate the placement of the oven partitions 103 inside the trolley.

[0061] like Figure 3-5 As shown, in this embodiment, the material handling mechanism 2 is close to the loading trolley 101 and includes a ground rail 201, a slide 202 mounted on the ground rail 201, a lifting mechanism 203 mounted on the slide, the lifting mechanism 203 can be a combination structure of a drive motor and a lead screw, a support mechanism 204 mounted on the lifting mechanism 203, a pair of transmission rails 205 and a transmission seat 206 mounted on the support mechanism 204, a sliding clamp 207 mounted on the transmission seat 206, and the sliding clamp 207 can be controlled by a motor to move on the transmission seat 206. During material removal, the slide 202 moves on the ground rail 201 to a position close to the loading trolley 101 to be removed. The lifting mechanism 203 operates, adjusting the support mechanism 204 to a suitable height. The sliding clamp 207 moves along the transmission seat 206 into the loading trolley 101. When the sliding clamp 207 moves to the appropriate position in the loading trolley 101, it clamps the oven partition 103 inside the loading trolley 101. The sliding clamp 207 then moves in the opposite direction along the slide 206 to remove the oven partition 103 from the loading trolley 101. During this process, the bottom of the oven partition 103 slides on the partition transmission rail 102. After removal, the bottom of the oven partition 103 slides on a pair of transmission rails 205 on the support mechanism 204 until the oven partition 103 is completely removed from the loading trolley 101.

[0062] like Figure 6 As shown, in this embodiment, the material identification mechanism 3 includes a frame 301 and a light source 302 and an identification camera 303 mounted on the frame 301. The frame 301 is close to the feeding mechanism 1 and fixed to the ground. The light source 302 and the identification camera 303 are both located above the ground rail 201. After the sliding clamp 207 completely removes the oven partition 103 from the feeding trolley 101, the slide 202 moves on the ground rail 201, moving the oven partition 103 below the light source 302 and the identification camera 303, thereby achieving preliminary identification of the chips in the chip magazine 104 on the oven partition 103.

[0063] like Figure 7As shown, in this embodiment, the robotic arm mechanism 4 includes a multi-axis robotic arm 401, which is close to the ground rail 201, and a partition gripper 402 is installed on the multi-axis robotic arm 401.

[0064] like Figure 8 As shown, in a further preferred embodiment, the partition gripper 402 includes a clamping base 403 connected to a multi-axis robot 401. A pair of adjusting plates 404 and a pair of cylinders 405 are mounted on the clamping base 403. The cylinders 405 are connected to the adjusting plates 404 for adjusting the adjusting plates. Each adjusting plate 404 has a pair of grippers 406. After the material on the oven partition 103 has undergone initial identification, the multi-axis robot 401 operates, and the four grippers 406 clamp the oven partition 103 from both sides. During clamping, the cylinders 405 operate to adjust the distance between the pairs of grippers 406, so that the grippers 406 clamp the oven partition 103 tightly. The multi-axis robot 401 then delivers the oven partition 103 to the next workstation.

[0065] like Figure 9-10 As shown, in this embodiment, the stacking mechanism 5 is close to the robotic arm mechanism 4, including a stacking ground rail 501 and a stacking trolley 502 mounted on the stacking ground rail 501. The stacking trolley 502 is equipped with an adjustable support seat 503, which has a pair of feeding rails 504 and a pushing rail 505. The pushing rail 505 is equipped with a pushing clamp 506, which is used to push the oven partition 103. After the multi-axis robotic arm 401 clamps the oven partition 103, it delivers it to the feeding rail 504 of the stacking trolley 502. The pushing clamp 506 moves along the pushing rail 505 until it is close to the oven partition 103. The stacking trolley 502 moves on the stacking ground rail 501. When it reaches the oven position, the pushing clamp 506 pushes the oven partition 103 on the feeding rail 504 into the oven for baking.

[0066] like Figure 1 As shown, in this embodiment, the oven mechanism 6 includes a plurality of ovens 601, which are evenly distributed on both sides of the stacking track 501.

[0067] like Figure 11 As shown, in this embodiment, the buffer station 7 is close to the stacking mechanism 5 and is used to buffer materials. After the chips in the chip clips 104 on the oven partition 103 have completed the baking process, the pushing clamp 506 on the stacking trolley 502 takes out the oven partition 103 from the oven and moves it along the stacking track 501 to the buffer station 7 to temporarily place the oven partition 103 on the buffer station 7 for buffering.

[0068] like Figure 11As shown, in this embodiment, the discharge mechanism 8 is located close to the buffer station 7 and includes at least one discharge conveyor line 801. The material at the buffer station 7 is discharged from the discharge conveyor line 801.

[0069] like Figure 13 As shown, this embodiment also includes a work order temporary storage station 10, which is equipped with several work order temporary storage shelves 11. Work orders corresponding to the chips in the chip magazines 104 on the oven partition 103 are placed on the work order temporary storage station 10 for buffering.

[0070] Example 2:

[0071] like Figure 2 As shown, as a further optimization of Embodiment 1, a number of positioning pins 105 are also installed on the oven partition 103, and the positioning pins 105 clamp the chip clips 104 from the four corners.

[0072] Example 3:

[0073] like Figure 12 As shown, as a further optimization of Embodiment 1, the discharge mechanism 8 also includes a discharge robot 802, on which a vision scanning mechanism 803 is installed. Before discharge, the vision scanning mechanism 803 on the discharge robot 802 scans and detects the material at the buffer station 7. The qualified material is clamped by the discharge robot 802 and discharged onto the discharge conveyor line 801.

[0074] The working principle of this invention is as follows:

[0075] After the chip loading is completed, the chip magazine 104 is sent to the oven partition 103 of the feeding mechanism 1, and the four corners of the chip magazine 104 are positioned by the positioning pins 105.

[0076] The material handling mechanism 2 removes the oven partition 103 from the feeding mechanism 1 and moves it to the material identification mechanism 3. The light source 302 and the identification camera 303 at the material identification mechanism 3 operate to identify the material on the oven partition 103 and transmit the identified data to the control console. This data includes the barcode information on the material box (chip clip 104). The control console compares the data with the data in the MES and CIM systems to determine whether the material on the oven partition 103 needs to be baked using the same program. The MES is the work order posting system, which contains work order information and executes commands such as binding the material box to the work order and binding the baking program. The control console is the control assembly of the equipment, which can record alarm information and independently operate the robotic arm, stacking trolley, etc.

[0077] After the judgment is completed, the robotic arm mechanism 4 picks up the oven partition 103 from the material handling mechanism 2 and places it on the stacking trolley 502. At the same time, the corresponding work order is placed in the work order temporary storage station for storage and recording.

[0078] The stacking trolley 502 runs on the stacking track 501. After the oven partition 103 runs to the loading and unloading point of the oven, it is sent into the oven 601 for baking. After the above operation is repeated several times, the oven partition 103 fills an oven 601. The control console notifies the CIM that the loading is complete. The oven 601 receives the CIM signal and starts the equipment. After baking is completed, the CIM is notified to unload. The CIM interacts with the control console, and the control console instructs the stacking trolley 502 to work and remove the oven partition 103 from the oven 601.

[0079] The removed oven partition 103 is brought to the buffer station 7 by the stacking trolley 502, and the robotic arm 4 removes the oven partition 103 and places it on the buffer station 7.

[0080] The visual scanning mechanism 803 on the unloading robot 802 scans and detects the material at the buffer station 7. The qualified material is clamped by the unloading robot 802 and discharged onto the unloading conveyor line 801.

[0081] The equipment of this invention integrates feeding, mechanical sorting, stacking, baking, and unloading, and can truly realize fully automatic transmission and feeding management, reduce manual assistance in the processing process, and improve the efficiency and quality of product processing.

[0082] The foregoing description of specific exemplary embodiments of the invention is for illustrative and explanatory purposes. These descriptions are not intended to limit the invention to the precise forms disclosed, and it will be apparent that many changes and variations can be made in accordance with the foregoing teachings. The exemplary embodiments were chosen and described in order to explain the specific principles of the invention and its practical application, thereby enabling those skilled in the art to implement and utilize various different exemplary embodiments of the invention, as well as various different choices and variations. The scope of the invention is intended to be defined by the claims and their equivalents.

Claims

1. A semiconductor packaging loading and unloading device, characterized in that, include: A feeding mechanism, used for storing materials; A material handling mechanism, which is used to remove material from the feeding mechanism; A material identification mechanism, wherein the material identification mechanism is used to identify the material taken out by the material handling mechanism; A robotic arm mechanism, used for picking up and placing materials; A stacking mechanism for stacking materials and feeding materials into and removing materials from the oven mechanism; An oven mechanism for baking materials; A buffer station, which is used to store the baked materials; The discharging mechanism is used for discharging materials; The feeding mechanism includes several feeding trolleys, each of which is equipped with several layers of partition drive rails. Oven partitions are provided on the partition drive rails, and the oven partitions can slide on the partition drive rails. Chip clips are placed on the oven partitions. The material handling mechanism is close to the feeding mechanism and includes a ground rail and a slide seat set on the ground rail. The slide seat is equipped with a lifting mechanism, the lifting mechanism is equipped with a support mechanism, and the support mechanism is equipped with a pair of transmission rails and a transmission seat. The transmission rails are used to place the oven partition, and the transmission seat is equipped with a sliding clamp for clamping the oven partition.

2. The semiconductor packaging loading and unloading equipment according to claim 1, characterized in that, The oven partition is also provided with several positioning pins, which are used to position the oven partition.

3. The semiconductor packaging loading and unloading equipment according to claim 1, characterized in that, The material identification mechanism includes a frame and a light source and an identification camera mounted on the frame. The frame is close to the feeding mechanism and fixed to the ground, and the light source and identification camera are both located above the ground rail.

4. The semiconductor packaging loading and unloading equipment according to claim 1, characterized in that, The robotic arm mechanism includes a multi-axis robotic arm, which is close to the ground rail and is equipped with partition grippers.

5. The semiconductor packaging loading and unloading equipment according to claim 4, characterized in that, The partition gripper includes a gripper base, which is connected to a multi-axis manipulator. A pair of adjusting plates and a pair of cylinders are mounted on the gripper base. The cylinders are connected to the adjusting plates and are used to adjust the adjusting plates. Each adjusting plate is provided with a pair of grippers.

6. The semiconductor packaging loading and unloading equipment according to claim 1, characterized in that, The stacking mechanism is close to the robotic arm mechanism and includes a stacking ground rail and a stacking trolley set on the stacking ground rail. The stacking trolley is equipped with an up-and-down adjustable support seat. The up-and-down adjustable support seat is equipped with a pair of feeding rails and a pushing rail. The pushing rail is equipped with a pushing clamp, which is used to push the oven partition.

7. The semiconductor packaging loading and unloading equipment according to claim 1, characterized in that, The buffer station is located close to the stacking mechanism and is used to buffer materials; the discharge mechanism is located close to the buffer station and includes at least one discharge conveyor line; the discharge mechanism also includes a discharge robot arm, which is equipped with a vision scanning mechanism.

8. The semiconductor packaging loading and unloading equipment according to claim 1, characterized in that, It also includes a work order temporary storage station, which is equipped with several work order temporary storage shelves.

Images