An electronic device

Abstract

This application relates to the field of waterproofing technology, specifically to an electronic device. The electronic device includes: a first middle frame and a second middle frame rotatably connected by a pivot, a first circuit board mounted within the first middle frame, a second circuit board mounted within the second middle frame, a flexible circuit board, a first sealing portion, and a second sealing portion. A first hole is provided at the connection point between the side wall of the first middle frame adjacent to the pivot and the bottom wall; a second hole is provided at the connection point between the side wall of the second middle frame adjacent to the pivot and the bottom wall. The flexible circuit board spans the pivot and passes through the first hole to be electrically connected to the first circuit board, and through the second hole to be electrically connected to the second circuit board. The first sealing portion is used to seal the first hole when the flexible circuit board passes through the first hole; the second sealing portion is used to seal the second hole when the flexible circuit board passes through the second hole. The waterproofing capability of the electronic device of this application is improved.

Description

Technical Field

[0001] This application relates to a waterproof electronic device. Background Technology

[0002] Foldable phones with foldable screens are becoming increasingly common, with various manufacturers releasing multiple models. The circuit boards within the side frames of a foldable phone are typically connected via one or more flexible printed circuits (FPCs) that pass through the respective frames to transmit information. Because foldable phones have a hinge in the middle, the FPC needs to bypass the hinge; therefore, this type of FPC is also called a through-hinge FPC. If water gets into the area where the through-hinge FPC passes through the frame, it will directly affect the use of the foldable phone, thus requiring a waterproof design in this area. Summary of the Invention

[0003] An embodiment of this application provides an electronic device that is waterproof.

[0004] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0005] In a first aspect, this application provides an electronic device (e.g., a foldable mobile phone), comprising: a first middle frame and a second middle frame rotatably connected by a pivot, a first circuit board installed in the first middle frame, a second circuit board installed in the second middle frame, a flexible circuit board, a first sealing portion, and a second sealing portion; wherein, the side wall of the first middle frame adjacent to the pivot has a first hole at its connection with the bottom wall, and the side wall of the second middle frame adjacent to the pivot has a second hole at its connection with the bottom wall; the flexible circuit board spans the pivot and passes through the first hole to be electrically connected to the first circuit board, and passes through the second hole to be electrically connected to the second circuit board; the first sealing portion is installed in the first middle frame and is used to seal the first hole when the flexible circuit board passes through the first hole, so that water cannot flow from one side of the side wall of the first middle frame to the opposite side through the first hole; the second sealing portion is installed in the second middle frame and is used to seal the second hole when the flexible circuit board passes through the second hole, so that water cannot flow from one side of the side wall of the second middle frame to the opposite side through the second hole.

[0006] According to the embodiments of this application, the holes (first hole and second hole) at the corresponding middle frame (first middle frame and second middle frame) of the folding phone are sealed using a first sealing part and a second sealing part. Since the first sealing part seals the first hole, water cannot flow from one side of the side wall of the first middle frame to the opposite side through the first hole; since the second sealing part seals the second hole, water cannot flow from one side of the side wall of the second middle frame to the opposite side through the second hole, thus achieving waterproofing of the special hole structure.

[0007] In one possible implementation of the first aspect described above, the first sealing portion and / or the second sealing portion includes: a sealing plate and a sealing ring; the sealing ring of the sealing portion is embedded in the sealing plate and protrudes from the sealing plate. That is, the first sealing portion described above includes a sealing plate and a sealing ring. Alternatively, the second sealing portion described above includes a sealing plate and a sealing ring. Alternatively, both the first and second sealing portions described above include a sealing plate and a sealing ring. In this structure, the sealing ring of the sealing portion is embedded in the sealing plate.

[0008] In one possible implementation of the first aspect described above, the portion of the sealing ring protruding from the sealing plate includes a first portion and a second portion. The first portion of the sealing ring is adjacent to the bottom wall of the corresponding middle frame and away from the hole in the corresponding middle frame. The first portion of the sealing ring is in contact with the adjacent surface of the flexible circuit board in the corresponding middle frame. The second portion of the sealing ring is in contact with the bottom wall and side wall of the corresponding middle frame.

[0009] In one possible implementation of the first aspect described above, the sidewall of the corresponding middle frame includes a first sidewall, a second sidewall, and a third sidewall with holes. The second sidewall and the third sidewall are spaced apart along the extending direction of the first sidewall and are respectively connected to the bottom wall and the first sidewall of the corresponding middle frame.

[0010] In one possible implementation of the first aspect described above, the sealing plate includes a first part and a second part, wherein the first part of the sealing plate is parallel to the side wall of the corresponding middle frame with holes, and the second part of the sealing plate is parallel to the bottom wall of the corresponding middle frame.

[0011] In one possible implementation of the first aspect above, each sealing ring protruding from the sealing plate includes a first protruding portion, a second protruding portion, and a third protruding portion connected together. For example, the first protruding portion corresponds to the first part of the sealing plate, and the second protruding portion and the third protruding portion correspond to the second part of the sealing plate.

[0012] The first protruding portion extends along the first direction and protrudes from the second portion of the sealing plate along the second direction, and is disposed facing the side wall with holes of the corresponding middle frame.

[0013] The second protruding portion protrudes from the first portion and the second portion of the sealing plate along the first direction. The second protruding portion is located on opposite sides of the first portion and the second portion of the sealing plate in the first direction, and is respectively set facing the sidewalls on both sides of the extension direction of the sidewall with holes in the corresponding middle frame.

[0014] The third protrusion protrudes from the first part of the sealing plate along the thickness direction of the electronic device. The third protrusion extends along the first direction and is disposed facing the bottom wall of the corresponding middle frame. The third protrusion is adjacent to the bottom wall of the corresponding middle frame and has a hole away from the corresponding middle frame.

[0015] In one possible implementation of the first aspect described above, the third protrusion has a recess for the flexible circuit board to pass through, the recess pressing against the flexible circuit board and fitting against the adjacent surface of the flexible circuit board.

[0016] In one possible implementation of the first aspect described above, the first direction, the second direction, and the thickness direction are perpendicular to each other.

[0017] In one possible implementation of the first aspect described above, the first sealing portion and / or the second sealing portion further includes an additional sealing strip. That is, the first sealing portion further includes an additional sealing strip. Alternatively, the second sealing portion further includes an additional sealing strip. Alternatively, both the first sealing portion and the second sealing portion include additional sealing strips.

[0018] The aforementioned additional sealing strip is located between the corresponding holes in the middle frame and the part where the corresponding sealing ring is attached to the flexible circuit board. The additional sealing strip is attached to the flexible circuit board and the bottom wall inside the corresponding middle frame.

[0019] In one possible implementation of the first aspect described above, the additional sealing strip extends parallel to the direction of extension of the perforated sidewall of the corresponding middle frame.

[0020] In one possible implementation of the first aspect mentioned above, the sealing plate is L-shaped.

[0021] In one possible implementation of the first aspect described above, the first sealing portion and / or the second sealing portion includes: a sealing plate and a sealing ring; the sealing plate of each sealing portion is disposed on the upper surface of the sealing ring. That is, the first sealing portion described above includes a sealing plate and a sealing ring. Alternatively, the second sealing portion described above includes a sealing plate and a sealing ring. Alternatively, both the first and second sealing portions described above include a sealing plate and a sealing ring. In this structure, the sealing plate of the sealing portion is disposed on the upper surface of the corresponding sealing ring.

[0022] In one possible implementation of the first aspect above, the lower surface of the sealing ring includes one side and the remaining side, one side of the lower surface of the sealing ring being adjacent to the bottom wall of the corresponding middle frame and away from the hole of the corresponding middle frame.

[0023] One side of the lower surface of the sealing ring is in contact with the adjacent surface of the flexible circuit board in the corresponding middle frame;

[0024] The remaining sides of the lower surface of the sealing ring fit against the bottom and side walls of the corresponding middle frame and surround the holes on the side walls of the corresponding middle frame.

[0025] In one possible implementation of the first aspect above, the sealing plate includes a first part and a second part, the first part of the sealing plate being parallel to and adjacent to the side wall of the corresponding middle frame with holes, and the second part of the sealing plate being parallel to and adjacent to the bottom wall of the corresponding middle frame.

[0026] One side of the lower surface of the sealing ring is located on the surface of the second part of the sealing plate facing the bottom wall of the middle frame, and the remaining side of the lower surface of the sealing ring is located on the first part and the second part of the sealing plate.

[0027] In one possible implementation of the first aspect described above, the remaining sides of the lower surface of the sealing ring include a first side, a second side, a third side, a fourth side, and a fifth side connected in sequence.

[0028] The first and fifth sides are located on the surface of the second part of the sealing plate facing the bottom wall of the corresponding middle frame, and the first and fifth sides are respectively connected to the two ends of the extension direction of one side of the lower surface of the sealing ring.

[0029] The second, third, and fourth sides are located on the surface of the sidewall with holes on the second part of the sealing plate facing the corresponding middle frame. The second and fourth sides extend along the thickness direction of the electronic device, and the two ends of the extension direction of the second side are connected to the first and third sides respectively. The two ends of the extension direction of the fourth side are connected to the third and fifth sides respectively.

[0030] The second, third, and fourth sides press against the corresponding middle frame's sidewalls with holes, and surround the corresponding middle frame's holes;

[0031] The first and fifth sides press against the bottom wall of the corresponding middle frame that is not covered by the flexible circuit board.

[0032] In one possible implementation of the first aspect described above, one side of the lower surface of the sealing ring includes an opening, the opening including a top surface and side surfaces located on both sides of the top surface, the opening allowing a flexible circuit board within the corresponding middle frame to pass through, and the top surface of the opening abuts against the top surface of the corresponding flexible circuit board, and the two side surfaces of the opening abut against the two side surfaces of the corresponding flexible circuit board.

[0033] In one possible implementation of the first aspect mentioned above, the sealing plate is L-shaped.

[0034] In one possible implementation of the first aspect described above, the sealing ring is formed by injection molding liquid silicone onto the sealing plate.

[0035] In one possible implementation of the first aspect described above, the corresponding middle frame is provided with a circuit board receiving cavity, and the sealing plate of the first sealing part and / or the second sealing part is engaged with the corresponding circuit board receiving cavity. That is, the first middle frame is provided with a circuit board receiving cavity, and the first sealing part is engaged with the circuit board receiving cavity within the first middle frame. Alternatively, the second middle frame is provided with a circuit board receiving cavity, and the second sealing part is engaged with the circuit board receiving cavity within the second middle frame. Alternatively, the first middle frame is provided with a circuit board receiving cavity, the first sealing part is engaged with the circuit board receiving cavity within the first middle frame, and simultaneously, the second middle frame is also provided with a circuit board receiving cavity, and the second sealing part is engaged with the circuit board receiving cavity within the second middle frame.

[0036] For example, the sidewalls and bottomwalls of the circuit board receiving cavity correspond to the sidewalls and bottomwalls of the aforementioned middle frame.

[0037] In one possible implementation of the first aspect described above, a snap-fit ​​block is provided on the side wall of the circuit board receiving cavity of the corresponding middle frame, and the snap-fit ​​block forms a snap-fit ​​space with the bottom wall of the circuit board receiving cavity of the corresponding middle frame, and the snap-fit ​​space snaps with the sealing plate.

[0038] In one possible implementation of the first aspect described above, the gap between the corresponding mid-frame, the flexible circuit board within the corresponding mid-frame, and the sealing portion is filled with sealant. Attached Figure Description

[0039] Figure 1 A three-dimensional representation of an electronic device is shown according to some embodiments of this application. Figure 1 ;

[0040] Figure 2 A three-dimensional representation of an electronic device is shown according to some embodiments of this application. Figure 2 ;

[0041] Figure 3 yes Figure 2 Enlarged view of part A;

[0042] Figure 4 A side view of an electronic device is shown according to some embodiments of this application. Figure 1 ;

[0043] Figure 5 yes Figure 4 Enlarged view of section B;

[0044] Figure 6 A three-dimensional representation of an electronic device is shown according to some embodiments of this application. Figure 3 ;

[0045] Figure 7 A three-dimensional representation of an electronic device is shown according to some embodiments of this application. Figure 4 ;

[0046] Figure 8 A three-dimensional representation of an electronic device is shown according to some embodiments of this application. Figure 5 ;

[0047] Figure 9 yes Figure 8 Enlarged view of section C;

[0048] Figure 10 A side view of an electronic device is shown according to some embodiments of this application. Figure 2 ;

[0049] Figure 11 yes Figure 10 Enlarged view of section D;

[0050] Figure 12 A three-dimensional representation of an electronic device is shown according to some embodiments of this application. Figure 6 ;

[0051] Figure 13 A three-dimensional representation of an electronic device is shown according to some embodiments of this application. Figure 7 ;

[0052] Figure 14 A three-dimensional representation of the sealing portion of an electronic device is shown according to some embodiments of this application. Figure 1 ;

[0053] Figure 15 A side view of the sealing portion of an electronic device is shown according to some embodiments of this application. Figure 1 ;

[0054] Figure 16 A three-dimensional representation of the sealing portion of an electronic device is shown according to some embodiments of this application. Figure 2 ;

[0055] Figure 17 A three-dimensional representation of the sealing portion of an electronic device is shown according to some embodiments of this application. Figure 3 ;

[0056] Figure 18 A side view of an electronic device is shown according to some embodiments of this application. Figure 3 ;

[0057] Figure 19 yes Figure 18 Enlarged view of section F in the middle;

[0058] Figure 20 A three-dimensional representation of the sealing portion of an electronic device is shown according to some embodiments of this application. Figure 4 ;

[0059] Figure 21 A three-dimensional representation of the sealing portion of an electronic device is shown according to some embodiments of this application. Figure 5 ;

[0060] Figure 22 A side view of the sealing portion of an electronic device is shown according to some embodiments of this application. Figure 2 ;

[0061] Figure 23 A three-dimensional representation of the sealing portion of an electronic device is shown according to some embodiments of this application. Figure 6 ;

[0062] Figure 24 A three-dimensional representation of the sealing portion of an electronic device is shown according to some embodiments of this application. Figure 7 . Detailed Implementation

[0063] The specific embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0064] This application provides an electronic device in which a sealing part is used to seal the location where the through-axis flexible circuit board passes through the middle frame of the electronic device, thereby achieving waterproofing.

[0065] The technical solution of this application can be applied to electronic devices including, but not limited to, foldable mobile phones, foldable tablets, foldable computers, wearable devices (such as smartwatches), in-vehicle computers, portable multimedia players, navigation devices, desktop computers, televisions, and any device with two side frames containing circuit boards or through-axis flexible circuit boards. The through-axis flexible circuit boards pass through the respective side frames and are connected to the circuit boards within those frames.

[0066] For ease of explanation, the following description uses a foldable mobile phone as an example. The electronic device of this application will be described below with specific embodiments.

[0067] Figure 1 A schematic diagram of a foldable phone 1 according to an embodiment of this application is shown. The foldable phone 1 is in an unfolded state. The foldable phone 1 includes a first middle frame 10, a second middle frame 20, a first circuit board (not shown), a second circuit board (not shown), a hinge (not shown), and a flexible circuit board 30.

[0068] Figure 1 The image shows the first middle frame 10 and the second middle frame 20 respectively along the first direction ( Figure 1 (As shown in the Y direction). The first middle frame 10 has a first circuit board receiving cavity 11 adjacent to the pivot, and the first circuit board receiving cavity 11 extends along the first direction; the second middle frame 20 has a second circuit board receiving cavity 21 adjacent to the pivot, and the second circuit board receiving cavity 21 extends along the first direction. Exemplarily, the first direction is perpendicular to the second direction. The first circuit board is mounted within the first middle frame 10, and the second circuit board is mounted within the second middle frame 20. (As shown in the Y direction). Figure 1 (As shown in the X direction), the pivot is located between the first receiving cavity 11 and the second receiving cavity 21 of the circuit board (the specific location will be explained in detail later).

[0069] For example, Figure 1 The second direction shown is, for example, the width direction of the foldable phone 1. The first middle frame 10 and the second middle frame 20 of the foldable phone 1 can rotate left and right along the width direction around the pivot, so that the foldable phone 1 is in a folded state and an unfolded state. Figure 1(as shown in the diagram). In some possible implementations, the second direction is, for example, the length direction of the folding phone 1, and the first middle frame 10 and the second middle frame 20 of the folding phone 1 can rotate up and down about the pivot along the length direction to put the folding phone 1 into a folded state and an unfolded state.

[0070] like Figure 2 As shown, Figure 2 A cross-sectional view of a foldable mobile phone 1 provided in one embodiment of this application is shown from a perspective. Figure 3 It shows Figure 2 An enlarged view of section A. (See image below.) Figure 4 As shown, Figure 4 A cross-sectional view of a foldable phone 1 provided in one embodiment of this application is shown from a side view. Figure 5 It shows Figure 4 Enlarged view of section B.

[0071] refer to Figure 3 and Figure 5 The first middle frame 10 and the second middle frame 20 are along the second direction ( Figure 3 and Figure 5 The shafts are positioned relative to each other (as shown in the X direction) to form a shaft receiving space V1, which is located along the first direction (as shown in the X direction). Figure 3 (As shown in the Y direction). The aforementioned first accommodating cavity 11 and second accommodating cavity 21 of the circuit board are respectively adjacent to the rotating shaft accommodating space V1. That is, the aforementioned first accommodating cavity 11 and second accommodating cavity 21 of the circuit board are respectively adjacent to the rotating shaft. That is, along the second direction, the rotating shaft accommodating space V1 is located between the first accommodating cavity 11 and the second accommodating cavity 21 of the circuit board. The aforementioned rotating shaft extends along the first direction and is installed in the rotating shaft accommodating space V1, and the first middle frame 10 and the second middle frame 20 are rotatably connected by the rotating shaft.

[0072] Continue to refer Figure 3 and Figure 5 The circuit board first receiving cavity 11 includes a first sidewall 111 adjacent to the pivot receiving space V1 and a first bottom wall 112 adjacent to the first sidewall 111. The first sidewall 111 has a first hole 113 at the connection with the first bottom wall 112. Exemplarily, the first sidewall 111 is along the thickness direction of the folding phone 1. Figure 5 Extending along the Z-direction, the first sidewall 111 is perpendicular to the first bottom wall 112. In other words, the overall shape of the first sidewall 111 and the first bottom wall 112 is L-shaped. The circuit board second receiving cavity 21 includes a second sidewall 114 adjacent to the pivot receiving space V1 and a second bottom wall 212 adjacent to the second sidewall 211. The second sidewall 211 has a second hole 213 at its connection with the second bottom wall 212. Exemplarily, the second sidewall 211 extends along the thickness direction of the folding phone 1 (…). Figure 5Extending in the Z direction, the second sidewall 211 is perpendicular to the second bottom wall 212. This means that the overall shape of the second sidewall 114 and the second bottom wall 212 is L-shaped.

[0073] like Figure 3 and Figure 5 As shown, a flexible circuit board 30 spans the pivot and passes through the first hole 113 to be electrically connected to the first circuit board inside the first middle frame 10, and passes through the second hole 213 to be electrically connected to the second circuit board inside the second middle frame 20. This application does not limit the number of flexible circuit boards 30; the number of flexible circuit boards 30 is set according to the information transmission requirements of the circuit board, such as two, three, etc.

[0074] like Figure 5 As shown, the flexible circuit board 30 includes a left portion 31, a middle portion 32, and a right portion 33. The left portion 31 of the flexible circuit board 30 passes through the first hole 113 of the first middle frame 10 and is received in the first receiving cavity 11 of the circuit board. The right portion 33 of the flexible circuit board 30 passes through the second hole 213 of the second middle frame 20 and is received in the second receiving cavity 21 of the circuit board. The middle portion 32 of the flexible circuit board 30 is located within the pivot receiving space V1 and passes around the pivot.

[0075] For example, the middle portion 32 of the flexible circuit board 30 is Ω-shaped, and the Ω-shaped middle portion 32 of the flexible circuit board 30 forms a pivot bypass space V2, which is smaller than the pivot receiving space V1. The pivot bypass space V2 is the position where the flexible circuit board 30 bypasses the pivot. That is, the pivot is located within the pivot bypass space V2.

[0076] If water gets into the area where the flexible circuit board 30 passes through the mid-frame, it will directly affect the use of the foldable phone 1, so a waterproof design is required at this point. Since the hinge is a moving part, waterproofing is difficult, especially at the ends (both ends in the first direction). Furthermore, the orientation and position of the flexible circuit board 30 as it passes through the mid-frame determine the unique opening structure (L-shaped) of the first hole 113 and the second hole 213, which differs significantly from traditional waterproof structures.

[0077] Therefore, this application shifts the waterproofing design to the location of the hole through which the flexible circuit board passes through the mid-frame. This application proposes a waterproofing solution for the flexible circuit board passing through the mid-frame. In this solution, waterproofing is achieved by setting a sealing part at the corresponding hole in the mid-frame, thereby improving the waterproofing capability of the foldable phone.

[0078] The structure of the sealing section and the specific waterproofing scheme are described in detail below with reference to the attached diagram.

[0079] In some possible implementations, refer to Figure 6 , Figure 6A schematic diagram of a foldable phone 1 according to another embodiment of this application is shown. The foldable phone 1 is in an unfolded state. A first sealing part 40 is installed inside the first middle frame 10, and a second sealing part 50 is installed inside the second middle frame 20. The first sealing part 40 is installed inside the first receiving cavity 11 of the circuit board in the first middle frame 10 for sealing. Figure 3 and Figure 5 The first hole 113 is shown in the state where the flexible circuit board 30 passes through it. After the first sealing part 40 seals the first hole 113, the first hole 113 achieves a waterproof seal, preventing water from flowing from one side of the first sidewall 111 of the first middle frame 10 to the opposite side through the first hole 113. For example, water cannot flow from the outside of the first middle frame 10 to the inside of the first middle frame 10 through the first hole 113.

[0080] The second sealing part 50 is installed in the second receiving cavity 21 of the circuit board of the second middle frame 20 for sealing. Figure 3 and Figure 5 The second hole 213 is shown in the state where the flexible circuit board 30 passes through it. After the second sealing part 50 seals the second hole 213, the second hole 213 achieves a waterproof seal, preventing water from flowing from one side of the sidewall of the second middle frame 20 to the opposite side through the second hole 213. For example, water cannot flow from the outside of the second middle frame 20 to the inside of the second middle frame 20 through the second hole 213.

[0081] The first sealing part 40 and the second sealing part 50 are used to seal the holes (first hole 113 and second hole 213) at the corresponding middle frame (first middle frame 10 and second middle frame 20) of the folding phone 1, thereby achieving waterproofing of the special hole structure.

[0082] For example, the structure of the first sealing part 40 is the same as that of the second sealing part 50. The following description will use the structure of the first sealing part 40 as an example. The specific structure of the second sealing part 50 can be found in the following description of the structure of the first sealing part 40.

[0083] Figure 7 A three-dimensional schematic diagram is shown of the first sealing part 40 installed in the first middle frame 10 of the folding phone 1. Figure 8 It shows Figure 7 The first middle frame 10 shown is a cross-sectional view from a stereoscopic perspective. Figure 9 It shows Figure 8 A magnified view of section C. (See image below.) Figure 10 As shown, Figure 10 It shows Figure 7 The first middle frame 10 is shown as a sectional view from the side. Figure 11 It shows Figure 10 Enlarged view of section D.

[0084] In some possible implementations, refer to Figure 9 and Figure 11 The first sealing portion 40 of this application includes a sealing plate 41 and a sealing ring 42. The sealing plate 41 is used to install the sealing plate 41 into the circuit board first receiving cavity 11 of the first middle frame 10, and cooperates with the sealing ring 42 to seal the first hole 113 of the first middle frame 10. The specific connection form between the sealing plate 41 and the first middle frame 10 is not limited. For example, the sealing plate 41 of the first sealing portion 40 is snapped into the first middle frame 10.

[0085] In some possible implementations, such as Figure 12 and Figure 13 As shown, the first sidewall 111 of the circuit board first receiving cavity 11 of the first middle frame 10 is provided with three snap-fit ​​blocks 1111, and the circuit board first receiving cavity 11 of the first middle frame 10 is along the second direction ( Figure 12 and Figure 13 A snap-fit ​​block 1111 is provided on the side wall opposite to the first side wall 111 of the circuit board first receiving cavity 11 of the first middle frame 10 (shown in the X direction). Figure 9 and Figure 11 As shown, the first bottom wall 112 of the first receiving cavity 11 of the circuit board forms a snap-fit ​​space with the four snap-fit ​​blocks 1111. The snap-fit ​​space snaps into the sealing plate 41, thereby snapping the first sealing part 40 into the first receiving cavity 11 of the circuit board in the first middle frame 10. The number of snap-fit ​​blocks 1111 in the aforementioned snap-fit ​​space is not limited to four. The corresponding number of snap-fit ​​blocks 1111 is set according to the snap-fit ​​requirements, such as three snap-fit ​​blocks 1111, five snap-fit ​​blocks 1111, etc.

[0086] refer to Figure 9 and Figure 11 After the sealing plate 41 of the first sealing part 40 is engaged with the first middle frame 10, the sealing ring 42 is then engaged with the first middle frame 10. The sealing ring 42 is a closed ring and presses against the first side wall 111, the first bottom wall 112, and the left side part 31 of the flexible circuit board 30 of the first middle frame 10, which is in contact with the first bottom wall 112, sealing the gap here and achieving the sealing of the first hole 113, thus improving the waterproof performance of the first hole 113 of the first middle frame 10.

[0087] In some possible implementations, refer to Figure 11 The left side portion 31 of the aforementioned flexible circuit is bonded to the first bottom wall 112 of the first middle frame 10 using adhesive 60. The adhesive 60 further enhances the waterproofing capability at the first hole 113 of the first middle frame 10.

[0088] This application does not limit the specific structure of the sealing plate 41 and the sealing ring 42. Any structure that can seal the first hole 113 is within the protection scope of this application.

[0089] In some possible implementations, refer to Figure 14 , Figure 14 This illustration shows a three-dimensional view of the sealing plate 41 provided in the embodiment of this application from a top perspective. Figure 1 . refer to Figure 15 , Figure 15 This diagram illustrates the connection between the sealing plate 41 and the first middle frame 10 according to an embodiment of this application. (See reference...) Figure 16 , Figure 16 This illustration shows a three-dimensional view of the sealing plate 41 provided in the embodiment of this application from a top perspective. Figure 2 .

[0090] refer to Figures 14 to 16 The sealing plate 41 of this application includes a first portion 411 and a second portion 412. The first portion 411 of the sealing plate 41 is parallel to the first side wall 111 of the first middle frame 10, and the second portion 412 of the sealing plate 41 is parallel to the first bottom wall 112 of the first middle frame 10. That is, the overall shape of the sealing plate 41 is fitted to the shape enclosed by the first side wall 111 and the first bottom wall 112. For example, the overall shape of the sealing plate 41 is L-shaped.

[0091] refer to Figure 14 and Figure 15 The aforementioned sealing ring 42 is embedded in the sealing plate 41 and protrudes from the sealing plate 41. The portion of the sealing ring 42 that protrudes from the sealing plate 41 includes a first protruding portion 421, a second protruding portion 422, and a third protruding portion 423 that are connected to each other.

[0092] refer to Figures 14 to 15 The first protruding portion 421 is along the second direction ( Figure 14 and Figure 15 The second part 412 protrudes from the sealing plate 41 (as shown in the X direction), and the first part 421 protrudes along the first direction (as shown in the X direction). Figure 14 (As shown in the Y direction) Extends and is positioned facing the first sidewall 111 of the first middle frame 10.

[0093] refer to Figures 14 to 15 The second protrusion 422 protrudes from the first portion 411 and the second portion 412 of the sealing plate 41 along the first direction. The second protrusion 422 is located on opposite sides of the first portion 411 and the second portion 412 of the sealing plate 41 along the first direction, and the second protrusion 422 is generally L-shaped. The second protrusion 422 is respectively positioned facing the second side wall 114 and the third side wall 115 of the first middle frame 10. The second side wall 114 and the third side wall 115 of the first middle frame 10 extend along the extension direction of the first side wall 111 ( Figure 13(As shown in the Y direction) are spaced apart and connected to the first bottom wall 112 and the first side wall 111 of the first middle frame 10, respectively. (Reference) Figure 15 The third protrusion 423 is along the thickness direction of the foldable phone 1. Figure 15 (As shown in the Z direction) The first portion 411 of the sealing plate 41 protrudes, and the third portion 423 extends along the first direction and is disposed facing the first bottom wall 112 of the first middle frame 10. The third portion 423 of the sealing ring 42 is adjacent to the first bottom wall 112 of the first middle frame 10 and away from the first hole 113 of the first middle frame 10.

[0094] refer to Figures 13 to 15 , Figures 13 to 15 The flexible circuit board is not shown. After the sealing plate 41 of the first sealing part 40 engages with the snap-fit ​​block 1111 on the first middle frame 10, the first hole 113 at this location is sealed. Specifically, the sealing ring 42 is fixed on the first middle frame 10, and the first protruding part 421 of the sealing ring 42 presses on the first side wall 111 of the first middle frame 10, and the second protruding part 422 presses on the second side wall 114 and the third side wall 115 of the first middle frame 10 respectively, sealing the gap at this location; the third protruding part 423 presses on the left side part 31 of the flexible circuit board 30 that is in contact with the first bottom wall 112, and is in contact with the adjacent surface of the left side part 31 of the flexible circuit board 30. At the same time, the third protruding part 423 presses on the remaining part of the first bottom wall 112, controlling the gap at this location.

[0095] Thus, the sealing plate 41, sealing ring 42, first bottom wall 112, first side wall 111, second side wall 114, and third side wall 115 form an enclosure, surrounding the first hole 113 on the first middle frame 10. The first hole 113 is sealed, achieving a waterproof seal. Water cannot flow from one side of the first side wall 111 of the first middle frame 10 to the opposite side through the first hole 113, thus improving the waterproof capability of the first hole 113 in the first middle frame 10.

[0096] For example, the sealing ring 42 described above is liquid injection molded silicone. The sealing ring 42 is formed by injection molding liquid silicone onto the sealing plate 41. Using liquid injection molded silicone facilitates the disassembly, maintenance, and reinstallation of the first sealing part 40, improving the maintainability of the product.

[0097] refer to Figure 17 , Figure 17 This illustration shows a three-dimensional view of the sealing plate 41 provided in the embodiment of this application from a bottom-view perspective. Figure 3 .

[0098] like Figure 11As shown, because the left side portion 31 of the flexible circuit board 30 is attached to the first bottom wall 112 of the first middle frame 10, the flexible circuit board 30 protrudes from the first bottom wall 112. Therefore, Figure 17 The third protrusion 423 of the sealing ring 42 has a recess 4231 for the flexible circuit board 30 to pass through. That is, the recess 4231 of the third protrusion 423 of the sealing ring 42 presses against the flexible circuit board 30, conforming to the adjacent surface of the flexible circuit board 30 to seal the flexible circuit board 30. The portion of the third protrusion 423 of the sealing ring 42, excluding the recess 4231, presses against the portion of the first bottom wall 112 not covered by the flexible circuit board 30.

[0099] This design effectively seals the flexible circuit board 30, preventing water from flowing into the first middle frame 10 through the gap between the flexible circuit board 30 and the third protruding part 423 of the sealing ring 42, thereby enhancing the waterproof capability of the first hole 113 in the first middle frame 10.

[0100] As mentioned above, Figure 15 and Figure 17 The first sealing portion 40 is shown to include a third protrusion 423. The specific structure of the first sealing portion 40 is not limited thereto. In some possible embodiments, Figures 18 and 19 Another structure of the first sealing part 40 is shown. Figure 18 A cross-sectional view of the first middle frame 10 from a side view is shown. Figure 2 . Figure 19 yes Figure 18 Enlarged view of section F in the middle. Figure 18 and Figure 19 As shown, the first sealing part 40 also includes an additional sealing strip 43. The specific material of the additional sealing strip 43 is not limited, as long as it can provide sealing and waterproofing performance, such as flexible silicone.

[0101] For example, refer to Figure 20 and Figure 21 The aforementioned additional sealing strip 43 is embedded in the first portion 411 of the sealing plate 41, and the additional sealing strip 43 is along the thickness direction ( Figure 20 (As shown in the Z direction) The first part 411 of the protruding sealing plate 41.

[0102] refer to Figure 22 The additional sealing strip 43 is positioned facing the first bottom wall 112 of the first middle frame 10. Combined Figure 19 As shown, the additional sealing strip 43 is located between the first hole 113 of the first middle frame 10 and the portion where the sealing ring 42 of the first sealing part 40 is attached to the flexible circuit board 30. The additional sealing strip 43 is attached to the flexible circuit board 30 inside the first middle frame 10 and the first bottom wall 112 (as shown). Figure 22(As shown). That is, the additional sealing strip 43 is located between the third protruding portion 423 of the sealing ring 42 and the first hole 113. Considering that there may be a micro gap between the sealing ring 42 and the first bottom wall 112 of the first middle frame 10 where the flexible circuit board 30 is sandwiched, an additional sealing strip 43 is added at the point where the flexible circuit board 30 is pressed, based on the above-mentioned sealing and waterproofing solution. The gap at this point is controlled by using double silicone, thereby improving the waterproofing capability at the first hole 113.

[0103] For example, refer to Figure 23 The aforementioned additional sealing strip 43 is along the first direction ( Figure 23 (As shown in the Y direction). That is, the additional sealing strip 43 extends parallel to the third protrusion 423 of the sealing ring 42 (as shown in the Y direction). Figure 23 (As shown). This also corresponds to the additional sealing strip 43 extending parallel to the extension direction of the first sidewall 111 of the first middle frame 10.

[0104] For example, Figure 23 The additional sealing strip 43 is shown to have an additional recess 431 for the flexible circuit board 30 to pass through. That is, the additional recess 431 of the additional sealing strip 43 presses against the flexible circuit board 30, conforming to the adjacent surface of the flexible circuit board 30 to seal the flexible circuit board 30. The portion of the additional sealing strip 43 other than the additional recess 431 presses against the portion of the first bottom wall 112 not covered by the flexible circuit board 30.

[0105] In some possible implementations, Figure 24 Another structure of the first sealing part 40 is shown. Figure 24 The structure of the sealing plate 41 and sealing ring 42 of the first sealing part 40 shown is different from the structure of the first sealing part 40 described in any of the above examples.

[0106] refer to Figure 24 The sealing plate 41 of the first sealing part 40 includes a first part 411 and a second part 412. The first part 411 of the sealing plate 41 is parallel to the first side wall 111 of the first middle frame 10. Figure 24 (Not shown in the image), the second part 412 of the sealing plate 41 is parallel to the first bottom wall 112 of the first middle frame 10. Figure 24 (Not shown in the image). That is, the overall shape of the sealing plate 41 is fitted to the shape enclosed by the first side wall 111 and the first bottom wall 112. For example, the overall shape of the sealing plate 41 is L-shaped. Figure 24 The first portion 411 of the sealing plate 41 shown is adjacent to the first side wall 111 of the first middle frame 10, and the second portion 412 of the sealing plate 41 is adjacent to the first bottom wall 112 of the first middle frame 10.

[0107] The sealing plate 41 of the first sealing portion 40 is disposed on the upper surface of the sealing ring 42, and the lower surface of the sealing ring 42 faces the first side wall 111 and the first bottom wall 112 of the first middle frame 10. The lower surface of the sealing ring 42 includes one side 424 and the remaining sides. Specifically, one side 424 of the lower surface of the sealing ring 42 is disposed on the surface of the second portion 412 of the sealing plate 41 facing the first bottom wall 112, along the aforementioned first direction ( Figure 24 Extending in the Y direction, and adjacent to the first bottom wall 112 of the first middle frame 10, and away from the first hole 113 of the first middle frame 10. One side 424 of the lower surface of the sealing ring 42 is in contact with the adjacent surface of the flexible circuit board 30 inside the first middle frame 10. That is, one side 424 of the sealing ring 42 presses against the flexible circuit board 30.

[0108] The remaining sides of the lower surface of the sealing ring 42 are abutted against the first bottom wall 112 and the first side wall 111 of the first middle frame 10, and surround the first hole 113 on the first side wall 111 of the first middle frame 10. Specifically, as Figure 24 As shown, the remaining sides of the lower surface of the sealing ring 42 include a first side 425, a second side 426, a third side 427, a fourth side 428, and a fifth side 429 connected in sequence. The first side 425 and the fifth side 429 of the remaining sides of the lower surface of the sealing ring 42 are located on the surface of the second portion 412 of the sealing plate 41 facing the first bottom wall 112, and the first side 425 and the fifth side 429 are respectively along the second direction (…). Figure 24 (As shown in the X direction) extends and connects to both ends of the extension direction of one side 424 respectively.

[0109] The second side 426, the third side 427, and the fourth side 428 of the remaining sides of the lower surface of the sealing ring 42 are provided on the surface of the second portion 412 of the sealing plate 41 facing the first sidewall 111. The second side 426 and the fourth side 428 are respectively along the aforementioned thickness direction ( Figure 24 Extending in the Z direction, the two ends of the extension direction of the second side 426 are connected to the first side 425 and the third side 427 respectively, and the two ends of the extension direction of the fourth side 428 are connected to the third side 427 and the fifth side 429 respectively. The aforementioned third side 427 extends along the first direction (as shown in the Z direction). Figure 24 (Extended in the Y direction as shown)

[0110] Among them, the second side 426, the third side 427, and the fourth side 428 of the remaining sides of the lower surface of the sealing ring 42 press against the first sidewall 111 of the first middle frame 10 and surround the first hole 113 on the first sidewall 111, controlling the gap there. The first side 425 and the fifth side 429 of the remaining sides of the lower surface of the sealing ring 42 press against the portion of the first bottom wall 112 of the first middle frame 10 not covered by the flexible circuit board 30, controlling the gap there. Exemplarily, along the first direction, the first side 425 and the fifth side 429 are located on both sides of the flexible circuit board 30. Thus, Figure 24 The sealing plate 41 in the first sealing part 40 shown presses the sealing ring 42 against the first side wall 111, the first bottom wall 112 and the flexible circuit board 30 of the first middle frame 10, and also seals the first hole 113 of the first middle frame 10.

[0111] In some possible implementations, one side 424 of the lower surface of the sealing ring 42 includes an opening, the shape of which is similar to the shape of the recess 4231 of the third protrusion 423 of the sealing ring 42. That is, the opening includes a top surface and side surfaces located on both sides of the top surface. The opening allows the flexible circuit board 30 inside the first middle frame 10 to pass through, and the top surface of the opening is attached to the top surface of the flexible circuit board 30, while the two side surfaces of the opening are attached to the two side surfaces of the flexible circuit board 30.

[0112] This design effectively seals the flexible circuit board 30, preventing water from flowing into the first middle frame 10 through the gap between the flexible circuit board 30 and the lower surface of the sealing ring 42, thereby enhancing the waterproof capability of the first hole 113 in the first middle frame 10.

[0113] In some possible implementations, considering the gaps (e.g., between the first middle frame 10, the flexible circuit board 30 within the first middle frame 10, and the first sealing portion 40) Figure 19 (At point V3). To enhance waterproofing, the micro-slits are sealed using an adhesive injection method. Thus, the gaps between the first middle frame 10, the flexible circuit board 30 within the first middle frame 10, and the first sealing portion 40 are filled with sealant. This also improves the waterproofing capability at the first hole 113 of the first middle frame 10.

[0114] As described above, the structure of the second sealing part 50 can be the same as that of the first sealing part 40. In some possible embodiments, the structure of the second sealing part 50 can be different from that of the first sealing part 40, for example, other sealing structures (e.g., foam) are used to seal the second hole 213. In some possible embodiments, the structure of the second sealing part 50 can be the same as that of the first sealing part 40, and the structure of the first sealing part 40 is, for example, other sealing structures (e.g., foam) used to seal the first hole 113.

[0115] In summary, this application provides a sealing part at the location of the hole in the flexible circuit board passing through the middle frame, and uses irregularly shaped liquid injection silicone to seal the hole in the middle frame, thereby achieving waterproofing for special hole structures.

Claims

1. An electronic device, characterized in that, include: A first middle frame and a second middle frame are rotatably connected by a pivot; a first circuit board is installed in the first middle frame; a second circuit board is installed in the second middle frame; a flexible circuit board is installed; a first sealing part is installed; and a second sealing part are installed. The first middle frame has a first hole at the connection between its side wall adjacent to the pivot and the bottom wall, and the second middle frame has a second hole at the connection between its side wall adjacent to the pivot and the bottom wall. The flexible circuit board spans the pivot and passes through the first hole to be electrically connected to the first circuit board, and passes through the second hole to be electrically connected to the second circuit board. The first sealing part is installed inside the first middle frame, and the first sealing part is used to seal the first hole when the flexible circuit board passes through the first hole; The second sealing part is installed inside the second middle frame, and the second sealing part is used to seal the second hole when the flexible circuit board passes through the second hole; The first sealing part and / or the second sealing part includes: a sealing plate and a sealing ring; The sealing ring is embedded in the sealing plate and protrudes from the sealing plate; The portion of the sealing ring that protrudes from the sealing plate includes a first portion and a second portion. The first portion of the sealing ring is adjacent to the bottom wall of the corresponding middle frame and is away from the hole of the corresponding middle frame. The first part of the sealing ring is in contact with the adjacent surface of the flexible circuit board in the corresponding middle frame; The second part of the sealing ring is in contact with the bottom wall and side wall of the corresponding middle frame.

2. The electronic device as claimed in claim 1, characterized in that, The sidewalls of the corresponding middle frame include a first sidewall, a second sidewall, and a third sidewall with holes. The second sidewall and the third sidewall are spaced apart along the extension direction of the first sidewall and are respectively connected to the bottom wall and the first sidewall of the corresponding middle frame.

3. The electronic device as described in claim 2, characterized in that, The sealing plate includes a first part and a second part. The first part of the sealing plate is parallel to the side wall of the corresponding middle frame with holes, and the second part of the sealing plate is parallel to the bottom wall of the corresponding middle frame.

4. The electronic device as claimed in claim 3, characterized in that, Each of the sealing rings protruding from the sealing plate includes a first protruding portion, a second protruding portion, and a third protruding portion that are connected to each other; The first protruding portion extends along a first direction and protrudes from the second portion of the sealing plate along a second direction, and is disposed facing the side wall of the corresponding middle frame with holes; The second protruding portion protrudes from the first portion and the second portion of the sealing plate along the first direction. The second protruding portion is located on opposite sides of the first portion and the second portion of the sealing plate in the first direction, and is respectively positioned facing the sidewalls on both sides of the extension direction of the sidewall with holes in the corresponding middle frame. The third protruding portion protrudes from the first portion of the sealing plate along the thickness direction of the electronic device. The third protruding portion extends along the first direction and is disposed facing the bottom wall of the corresponding middle frame. The third protruding portion is adjacent to the bottom wall of the corresponding middle frame and has a hole away from the corresponding middle frame.

5. The electronic device as claimed in claim 4, characterized in that, The third protrusion has a recess for the flexible circuit board to pass through, the recess pressing against the flexible circuit board and fitting against the adjacent surface of the flexible circuit board.

6. The electronic device as claimed in claim 4 or 5, characterized in that, The first direction, the second direction, and the thickness direction are perpendicular to each other.

7. The electronic device according to any one of claims 1 to 5, characterized in that, The first sealing part and / or the second sealing part further includes: an additional sealing strip, which is located between the hole in the corresponding middle frame and the part where the corresponding sealing ring is attached to the flexible circuit board, and the additional sealing strip is attached to the flexible circuit board and the bottom wall in the corresponding middle frame respectively.

8. The electronic device as claimed in claim 7, characterized in that, The additional sealing strip extends parallel to the direction of the perforated sidewall of the corresponding middle frame.

9. The electronic device as claimed in claim 1 or 8, characterized in that, The sealing plate is L-shaped.

10. The electronic device as claimed in claim 1, characterized in that, The first sealing part and / or the second sealing part includes: a sealing plate and a sealing ring; The sealing plate is disposed on the upper surface of the sealing ring.

11. The electronic device as claimed in claim 10, characterized in that, The lower surface of the sealing ring includes one side and the remaining side, and the one side of the lower surface of the sealing ring is adjacent to the bottom wall of the corresponding middle frame and away from the hole of the corresponding middle frame; One side of the lower surface of the sealing ring is in contact with the adjacent surface of the flexible circuit board in the corresponding middle frame; The remaining sides of the lower surface of the sealing ring are fitted to the bottom and side walls of the corresponding middle frame and surround the holes on the side walls of the corresponding middle frame.

12. The electronic device as claimed in claim 11, characterized in that, The sealing plate includes a first part and a second part. The first part of the sealing plate is parallel to and adjacent to the side wall of the corresponding middle frame with holes, and the second part of the sealing plate is parallel to and adjacent to the bottom wall of the corresponding middle frame. One side of the lower surface of the sealing ring is located on the surface of the second portion of the sealing plate facing the bottom wall of the middle frame, and the remaining sides of the lower surface of the sealing ring are located on the first portion and the second portion of the sealing plate.

13. The electronic device as claimed in claim 12, characterized in that, The remaining sides of the lower surface of the sealing ring include a first side, a second side, a third side, a fourth side, and a fifth side connected in sequence; The first side and the fifth side are provided on the surface of the second part of the sealing plate facing the bottom wall of the corresponding middle frame, and the first side and the fifth side are respectively connected to the two ends of the extension direction of one side of the lower surface of the sealing ring; The second side, the third side, and the fourth side are provided on the surface of the sidewall with holes on the second part of the sealing plate facing the corresponding middle frame. The second side and the fourth side extend along the thickness direction of the electronic device. The two ends of the extension direction of the second side are connected to the first side and the third side, respectively. The two ends of the extension direction of the fourth side are connected to the third side and the fifth side, respectively. The second side, the third side, and the fourth side press against the sidewalls of the corresponding middle frame that have holes, and surround the holes of the corresponding middle frame; The first side and the fifth side press against the portion of the bottom wall of the corresponding middle frame that is not covered by the flexible circuit board.

14. The electronic device according to any one of claims 11 to 13, characterized in that, The lower surface of the sealing ring includes an opening on one side, the opening including a top surface and side surfaces on both sides of the top surface, the opening allowing a flexible circuit board within the corresponding middle frame to pass through, and the top surface of the opening abuts against the top surface of the corresponding flexible circuit board, and the two side surfaces of the opening abut against the two side surfaces of the corresponding flexible circuit board.

15. The electronic device according to any one of claims 10 to 13, characterized in that, The sealing plate is L-shaped.

16. The electronic device according to any one of claims 1 to 5, 10 to 13, characterized in that, The sealing ring is formed by injection molding liquid silicone onto the sealing plate.

17. The electronic device according to any one of claims 1 to 5, 10 to 13, characterized in that, The corresponding middle frame is provided with a circuit board receiving cavity, and the sealing plate of the first sealing part and / or the second sealing part is engaged with the corresponding circuit board receiving cavity.

18. The electronic device as claimed in claim 17, characterized in that, The corresponding middle frame circuit board receiving cavity has a snap-fit ​​block on its side wall. The snap-fit ​​block and the bottom wall of the corresponding middle frame circuit board receiving cavity form a snap-fit ​​space, and the snap-fit ​​space snaps into the sealing plate.

19. The electronic device according to any one of claims 1 to 5, 10 to 13, characterized in that, The gaps between the corresponding middle frame, the flexible circuit board inside the middle frame, and the sealing part are filled with sealant.

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