pressure sensor

Abstract

The present application provides a pressure sensor capable of effectively dissipating heat generated in a conversion substrate to an external environment and capable of inhibiting heat transfer from a fluid of a pressure detection object to the conversion substrate. In the pressure sensor (100), a heat dissipation mechanism of the conversion substrate (133) is provided with a connector housing (131) that is in direct or indirect thermal contact with the conversion substrate (133) at a substrate facing surface (131a1) located at the other end of a substrate housing portion (131a), and a connection terminal (134) that is connected to the conversion substrate (133) at one end side and extends to a connector connection portion (131b) via a partition wall portion (131c) at the other end side, and a heat transfer inhibition mechanism that inhibits heat transfer to the conversion substrate (133) is provided with an internal space (S) between the conversion substrate (133) and a pressure detection portion (120).

Description

Technical Field

[0001] This invention relates to a pressure sensor with an internal conversion substrate. Background Technology

[0002] In recent years, control ICs used in fluid devices (such as air conditioning systems like air conditioners) have been widely adopted due to the desire for low power consumption and high versatility, resulting in the widespread use of various drive voltages and signal methods. Furthermore, pressure sensors used in these fluid devices also require compatibility with various drive voltages (e.g., 3.3V, 5V, 12V–24V) and various pressure detection signal methods (e.g., two-wire / three-wire current output, 1V–5V voltage output, digital output, or wireless output).

[0003] Therefore, for example, Patent Document 1 describes a pressure sensor in which a conversion board having a conversion circuit for converting both the drive voltage and the pressure detection signal is externally connected between the control circuit and the pressure sensor in order to be suitable for various drive voltage and pressure detection signal signal methods.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2018-040758 Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] However, in Patent Document 1, since an external connection between the pressure sensor and the conversion substrate is required via a cable, the following problems exist: it becomes long and difficult to miniaturize, or the connection may be poor due to external impacts, vibrations, etc.

[0009] To address this issue, a proposed solution is to omit the cable and place the conversion board inside the pressure sensor. However, this conversion board generates heat due to voltage variations and other factors. Therefore, placing the conversion board inside the pressure sensor makes it difficult to efficiently dissipate the heat generated within it to the external environment, raising concerns that the electronic components of the conversion board may overheat and break. Furthermore, there are concerns that the temperature of the fluid being pressure-detected may transfer heat to the conversion board inside the pressure sensor, potentially causing the electronic components of the conversion board to overheat and break.

[0010] In contrast, further consideration was given to increasing the heat resistance temperature of the electronic components on the conversion substrate to prevent breakage, but this led to increased costs, thus requiring other solutions.

[0011] The purpose of this invention is to provide a pressure sensor that can effectively dissipate heat generated in the conversion substrate to the external environment and suppress heat transfer from the fluid in the pressure detection object to the conversion substrate.

[0012] Solution for solving the problem

[0013] To address the aforementioned issues, a pressure sensor includes: a fluid inlet portion that introduces fluid to be pressure-detected into a pressure chamber; a pressure detection portion having a semiconductor sensor chip for detecting the pressure of the fluid introduced into the pressure chamber and multiple pins connected to the semiconductor sensor chip and constituting external input / output terminals of the semiconductor sensor chip; and a signal transmission portion having a connector housing, a conversion substrate, and a connection terminal. The connector housing has a substrate storage portion that divides the internal space at one end and a connector connection portion at the other end, and a partition portion between the substrate storage portion and the connector connection portion. The heat dissipation mechanism of the conversion substrate includes the connector housing that directly or indirectly heat-contacts the conversion substrate with the substrate facing surface located at the other end of the substrate storage portion, and the connection terminal that is connected to the conversion substrate at one end and extends to the connector connection portion via the partition portion at the other end. A heat transfer suppression mechanism that suppresses heat transfer to the conversion substrate has the internal space between the conversion substrate and the pressure detection portion.

[0014] Furthermore, in the aforementioned pressure sensor, the heat dissipation mechanism of the aforementioned conversion substrate can also fix the aforementioned conversion substrate to the opposing surface of the aforementioned substrate.

[0015] Furthermore, in the aforementioned pressure sensor, the heat dissipation mechanism of the aforementioned conversion substrate may also include a heat dissipation pattern circuit formed on at least the opposite side of the aforementioned conversion substrate.

[0016] Furthermore, in the aforementioned pressure sensor, the partition wall may have a through hole that connects the substrate housing portion and the connector connection portion, the heat-generating component of the conversion substrate may be disposed on the opposite side of the substrate, and the heat dissipation mechanism of the conversion substrate may also have the through hole in which the heat-generating component is disposed internally.

[0017] Furthermore, in the aforementioned pressure sensor, the through hole can be blocked with a waterproof insulating agent, and the heating element can be covered with the same waterproof insulating agent.

[0018] Furthermore, the pressure sensor described above may also include a connecting member that connects the fluid inlet, the pressure detection, and the signal transmission. The heat dissipation mechanism of the conversion substrate may also include the connecting member, which is configured to overlap with the conversion substrate when viewed from a direction perpendicular to the central axis.

[0019] Furthermore, in the aforementioned pressure sensor, the heating element of the conversion substrate may be disposed on the opposite side of the substrate, and the heat dissipation mechanism of the conversion substrate may include a thermally conductive adhesive that fills at least the gap between the heating element and the connector housing.

[0020] Furthermore, in the aforementioned pressure sensor, the heat dissipation mechanism of the aforementioned conversion substrate may also include multiple heat-generating components that are connected in parallel.

[0021] Furthermore, in the aforementioned pressure sensor, the heat dissipation mechanism of the aforementioned conversion substrate may also include a heat sink, one end of which is in contact with or adjacent to the aforementioned heat-generating component, and the other end of which extends to the aforementioned connector connection portion via the aforementioned partition portion.

[0022] Furthermore, in the aforementioned pressure sensor, the heat dissipation mechanism of the aforementioned conversion substrate may also include a lead-type heat-generating component and a recess in the aforementioned connector housing for housing the lead-type heat-generating component.

[0023] Furthermore, in the aforementioned pressure sensor, the signal transmitting unit may also have a flexible connector, and the heat transfer suppression mechanism for suppressing heat transfer to the aforementioned conversion substrate may have the aforementioned flexible connector that is bent or folded between the aforementioned plurality of pins and the aforementioned conversion substrate.

[0024] Furthermore, in the aforementioned pressure sensor, the heat transfer suppression mechanism for suppressing heat transfer to the aforementioned conversion substrate may also include a non-metallic resin sheet with heat dissipation properties and / or an adhesive disposed between the aforementioned pressure detection unit and the aforementioned signal transmission unit.

[0025] The effects of the invention are as follows.

[0026] According to the present invention, a pressure sensor is provided that can effectively dissipate heat generated in the conversion substrate to the external environment and suppress heat transfer from the fluid of the pressure detection object to the conversion substrate. Attached Figure Description

[0027] Figure 1 This is a cross-sectional view showing a pressure sensor according to a first embodiment of the present invention.

[0028] Figure 2This is a partially enlarged cross-sectional view showing a pressure sensor according to a second embodiment of the present invention.

[0029] Figure 3 This is a partially enlarged cross-sectional view showing a pressure sensor according to a third embodiment of the present invention.

[0030] Figure 4 This is a partially enlarged cross-sectional view showing a pressure sensor according to a fourth embodiment of the present invention.

[0031] Figure 5 This is a cross-sectional view showing a pressure sensor according to a fifth embodiment of the present invention.

[0032] Figure 6 This is a partially enlarged cross-sectional view showing a pressure sensor according to a sixth embodiment of the present invention.

[0033] Figure 7 This is a partially enlarged cross-sectional view showing a pressure sensor according to the seventh embodiment of the present invention.

[0034] Figure 8A It includes Figure 7 A partial circuit diagram of the heating element on the conversion substrate.

[0035] Figure 8B Is with Figure 8A A partial circuit diagram of the heating element of the conversion substrate according to the eighth embodiment of the present invention.

[0036] Figure 9 This is a partially enlarged cross-sectional view showing a pressure sensor according to a ninth embodiment of the present invention.

[0037] Figure 10 This is a partially enlarged cross-sectional view showing a pressure sensor according to the tenth embodiment of the present invention. Detailed Implementation

[0038] Reference Figures 1 to 10 The embodiments of the present invention will be described in detail below. However, the present invention is not limited to the forms described in these embodiments.

[0039] The pressure sensors 100 to 1000 of the embodiments of the present invention each include a heat dissipation mechanism for the conversion substrate 133 and a heat transfer suppression mechanism for suppressing heat transfer to the conversion substrate 133, thereby solving the problem of effectively dissipating heat generated in the conversion substrate 133 to the external environment and suppressing heat transfer from the fluid being detected to the conversion substrate 133. Here, the heat dissipation mechanism for the conversion substrate is generally divided into two types: one in which the upper surface of the conversion substrate 133 is in direct thermal contact with the connector housing 131 (first to sixth embodiments) and the other in which the conversion substrate 133 (including the heat-generating component) is in indirect thermal contact with the connector housing 131 (seventh to tenth embodiments). Therefore, the case in which the conversion substrate 133 is in direct thermal contact with the connector housing 131 will be described first as the heat dissipation mechanism for the conversion substrate 133.

[0040] <About Terminology>

[0041] In this specification and the claims, "one end" and "the other end" refer to the "lower end" and "upper end" in the drawings.

[0042] (First Implementation)

[0043] <About the structure of the pressure sensor>

[0044] use Figure 1 The pressure sensor 100 of the first embodiment of the present invention will be described.

[0045] The pressure sensor 100 comprises a fluid inlet 110, a pressure sensing unit 120, a signal transmitting unit 130, and a connecting member 140. The various structures of the pressure sensor 100 will be described sequentially below. Furthermore, regarding the pressure sensor 100, after the fluid inlet 110 and the pressure sensing unit 120 are joined and fixed, and the pressure sensing unit 120 and the signal transmitting unit 130 are electrically connected, the connecting member 140 integrally assembles the fluid inlet 110, the pressure sensing unit 120, and the signal transmitting unit 130.

[0046] <About the fluid inlet section>

[0047] The fluid inlet 110 introduces the fluid to be pressure tested into the pressure chamber 112A described below, and includes a metal connector 111 and a metal base plate 112 connected to the other end of the connector 111 by welding or the like.

[0048] The connector component 111 has an internally threaded portion 111a that connects to a piping (not shown) through which the fluid to be pressure tested is introduced, and a port 111b that guides the fluid introduced from the piping to the pressure chamber 112A. The open end of the port 111b is connected to an opening located in the center of the base plate 112 by welding or the like. In this embodiment, the connector component 111 has an internally threaded portion 111a, but it is not limited to this; for example, it may have an externally threaded portion, or a copper connecting pipe may be used instead of the connector component 111.

[0049] The base plate 112 has a bowl shape that expands radially from one end toward the other relative to the central axis C of the pressure sensor 100, and forms a pressure chamber 112A between it and the diaphragm 122 described below.

[0050] <About the Pressure Testing Department>

[0051] The pressure detection unit 120 detects the pressure of the fluid in the pressure chamber 112A and includes a housing 121 with a through hole, a diaphragm 122 dividing the pressure chamber 112A and the liquid seal chamber 124A, and a protective cover 123 disposed on the pressure chamber 112A side of the diaphragm 122. Furthermore, the pressure detection unit 120 includes a sealing glass 124 sealed inside the through hole of the housing 121, a liquid seal chamber 124A filled with sealed oil between the recess on the pressure chamber 112A side of the sealing glass 124 and the diaphragm 122, and a support 125 disposed in the center of the sealing glass 124. Additionally, the pressure detection unit 120 includes a semiconductor sensor chip 126 supported by the support 125 and disposed inside the liquid seal chamber 124A, a potential adjustment component 127 disposed around the liquid seal chamber 124A, multiple pins 128 fixed to the sealing glass 124, and an oil filling tube 129 fixed to the sealing glass 124.

[0052] To ensure the strength around the sealing glass 124, the housing 121 is formed of a metallic material such as an Fe·Ni alloy or stainless steel. The diaphragm 122 and the protective cover 123 are both formed of a metallic material and are welded together to the outer periphery of the through hole on the pressure chamber 112A side of the housing 121. The protective cover 123 is located inside the pressure chamber 112A to protect the diaphragm 122 and has multiple connecting holes 123a for allowing fluid introduced from the fluid inlet 110 to pass through. After assembling the pressure sensing unit 120, the housing 121 is welded from the outside to the outer periphery of the base plate 112 of the fluid inlet 110 using methods such as TIG welding, plasma welding, or laser welding.

[0053] The sealing glass 124 is provided to protect the liquid-sealed chamber 124A containing the semiconductor sensor chip 126 from environmental conditions such as moisture, dust, and heat, and to maintain and insulate the multiple pins 128 from the housing 121. The semiconductor sensor chip 126 is supported by an adhesive or the like on the side of the liquid-sealed chamber 124A of the pillar 125 located in the center of the sealing glass 124. In this embodiment, the pillar 125 is formed of an Fe·Ni alloy, but it is not limited to this. For example, it can be formed of other metal materials such as stainless steel, or it can be configured to be directly supported on the flat surface of the recess forming the sealing glass 124 without the pillar 125.

[0054] The semiconductor sensor chip 126 internally includes an integrated circuit such as a diaphragm made of a piezoresistive material (e.g., single-crystal silicon), a bridge circuit on which multiple semiconductor strain gauges are formed and bridged, an amplification circuit that processes the output from the bridge circuit, and an arithmetic processing circuit. Furthermore, the semiconductor sensor chip 126 is connected to multiple pins 128, for example, by bonding leads 126a made of gold or aluminum, and these pins 128 constitute the external input / output terminals of the semiconductor sensor chip 126.

[0055] The potential adjustment component 127 is provided to place the semiconductor sensor chip 126 in a field-free (zero potential) environment so that the circuitry within the chip is not adversely affected by the potential generated between the frame ground and the secondary power supply. The potential adjustment component 127 is disposed between the semiconductor sensor chip 126 and the diaphragm 122 within the liquid-sealed chamber 124A, is formed of a conductive material such as metal, and is connected to the zero-potential terminal of the semiconductor sensor chip 126.

[0056] Multiple pins 128 and an oil-filling tube 129 are fixed to the sealing glass 124 in a through-hole state through a sealing process. In this embodiment, all eight pins 128 are provided. That is, three pins 128 are provided for external output (Vout), drive voltage supply (Vcc), and ground (GND), and five pins 128 are provided as terminals for adjusting the semiconductor sensor chip 126. Furthermore, Figure 1 The image shows four of the eight pins 128.

[0057] The oil filling tube 129 is provided for filling the interior of the liquid seal chamber 124A with sealing oil (such as silicone oil or a fluorinated inert liquid). Furthermore, after oil filling, the other end of the oil filling tube 129 is... Figure 1 The area is flattened and sealed as shown.

[0058] <Regarding the Operations of the Pressure Testing Department>

[0059] The operation of the pressure detection unit 120 will be explained. First, the diaphragm 122 is pressed by the fluid introduced from the connector member 111 into the pressure chamber 112A. The pressure applied to the diaphragm 122 in the pressure chamber 112A is transmitted to the semiconductor sensor chip 126 via the sealing oil in the liquid seal chamber 124A. The silicon diaphragm of the semiconductor sensor chip 126 deforms due to the transmitted pressure, and the bridge circuit formed by the piezoresistive element converts the pressure into an electrical signal, which is output from the integrated circuit of the semiconductor sensor chip 126 to the signal transmission unit 130 via the bonding lead 126a and multiple pins 128.

[0060] <About the Signal Transmission Unit>

[0061] The signal transmitting unit 130 transmits the pressure signal detected by the pressure detection unit 120 to the outside. It includes a connector housing 131 for external connection disposed on the other end of the pressure detection unit 120 and a flexible connector 132 connected to a plurality of pins 128 at one end. Furthermore, the signal transmitting unit 130 includes a conversion board 133 fixed to the connector housing 131 and a connection terminal 134 whose one end 134a is connected to the other end of the flexible connector 132 and is through-connected to the conversion board 133.

[0062] The connector housing 131 is formed of an insulating resin or the like with high thermal conductivity, and includes a substrate housing portion 131a with a concave shape at one end, a connector connecting portion 131b with a concave shape at the other end and connected to an external connector (not shown), and a partition portion 131c disposed between the substrate housing portion 131a and the connector connecting portion 131b. In the internal space S divided by the substrate housing portion 131a, a plurality of pins 128 extending from the sealing glass 124, an oil-filling tube 129, a flexible connector 132, and a conversion substrate 133 are disposed.

[0063] To correspond with the signal types of the drive voltage and pressure detection signal, the conversion board 133 includes a conversion circuit (not shown) that converts the drive voltage and pressure detection signal. This conversion circuit includes a step-down circuit (not shown) that reduces the drive voltage (e.g., 8V to 36V) of the control circuit (not shown) externally connected to the pressure sensor 100 via the connection terminal 134 to the drive voltage (e.g., 5.0V) of the semiconductor sensor chip 126, and a voltage conversion circuit (not shown) that boosts the pressure detection signal (e.g., 0.5V to 4.5V) of the pressure sensor 100 to the pressure detection signal (e.g., 1V to 5V) of the control circuit. Thus, by appropriately selecting the conversion board 133 within the pressure sensor 100 to correspond with the signal types of the drive voltage and pressure detection signal, the difference between the drive voltage and pressure detection signal can be absorbed without design changes to the pressure sensor 100.

[0064] The connection terminal 134 has at least three terminals: one for external output (Vout), one for drive voltage supply (Vcc), and one for ground (GND). To improve assemblability, one end 134a of the connection terminal 134 is inserted into a through hole provided in the conversion substrate 133, and the connection terminal 134 is connected to the conversion substrate 133 by soldering the through portion. Thus, one end 134a of the connection terminal 134 is directly connected to the flexible connector 132. On the other hand, the other end of the connection terminal 134 extends through the partition wall portion 131c and toward the connector connection portion 131b. The through portion of the partition wall portion 131c through which the connection terminal 134 passes is liquid-sealed. Furthermore, in this embodiment, the connection component between the connection terminal 134 and the conversion substrate 133, and the connection component between the conversion substrate 133 and the flexible connector 132 are considered as one component, but this is not a limitation. For example, the connection component between the connection terminal 134 and the conversion substrate 133, and the connection component between the conversion substrate 133 and the flexible connector 132, may be considered as separate components. Additionally, in this embodiment, the plurality of pins 128 are connected to one end 134a of the connection terminal 134 via the flexible connector 132, but this is not a necessary structure. For example, the flexible connector 132 may be omitted, and the plurality of pins 128 may be directly connected to one end 134a of the connection terminal 134 or the conversion substrate 133.

[0065] <About connecting components>

[0066] The connecting component 140 includes a riveting plate 141 that connects and fixes the fluid inlet 110, the pressure sensing part 120, and the signal transmitting part 130 by riveting, and an O-ring 142 disposed between the pressure sensing part 120 and the signal transmitting part 130.

[0067] The riveting plate 141 is formed in a cylindrical shape from a metal such as copper. The riveting plate 141 is disposed around the fluid inlet 110, the pressure sensing section 120, and the signal transmitting section 130, and is fixed to the fluid inlet 110 and the signal transmitting section 130 by riveting. To provide waterproofing and dustproofing, an O-ring 142 is clamped between the pressure sensing section 120 and the signal transmitting section 130 by the riveting process.

[0068] <Regarding the heat dissipation mechanism of the conversion substrate>

[0069] The conversion substrate 133 has one end face 133a for mounting various electronic components and another end face 133b bonded to the opposing substrate surface 131a1. In this embodiment (first embodiment), the heat-generating component 133h (e.g., a transistor, regulator, etc.) is a surface-mount type, mounted on one end face 133a. Since the conversion substrate 133 generates heat due to changes in driving voltage, there is a concern that the electronic components on the conversion substrate may break if no countermeasures are taken. Therefore, in this embodiment, various heat dissipation mechanisms for the conversion substrate 133 are employed to prevent the electronic components on the conversion substrate 133 from exceeding their heat resistance temperature. This allows for efficient release of heat generated in the conversion substrate 133 to the external environment, thus increasing the margin for the heat resistance temperature of the conversion substrate 133. The heat dissipation mechanism of the conversion substrate 133 in this embodiment will be described in detail below.

[0070] <Regarding the first heat dissipation mechanism (connector housing) of the conversion substrate>

[0071] As the first heat dissipation mechanism of the conversion substrate 133, to form Figure 1 The heat dissipation path shown by the dashed line (1) uses the connector housing 131. Specifically, a generally flat substrate facing surface 131a1 is formed at the other end of the substrate housing portion 131a, and the other end face 133b of the substrate 133 is bonded and fixed with a thermally conductive adhesive 133g so that the bonding area relative to the substrate facing surface 131a1 is larger. Here, in order to facilitate the heat transfer to the connector housing 131, the thermal conductivity of the thermally conductive adhesive 133g in this embodiment is greater than the thermal conductivity of air (0.0241 W / m·K), and more preferably 0.5 W / m·K or more. For example, Momentive silicone adhesive TSE3331 with a thermal conductivity of 0.63 W / m·K, Shin-Etsu Chemical's KE-4918-WF with a thermal conductivity of 0.85 W / m·K, 3M's epoxy adhesive EW2070 with a thermal conductivity of 1.6 W / m·K, and Shin-Etsu Chemical's silicone adhesive tape SR-BOND-1-200 with a thermal conductivity of 1.2 W / m·K can be used. Therefore, in this embodiment, the heat generated in the conversion substrate 133 can be efficiently dissipated to the external environment via the adhesive 133g with its high thermal conductivity and the connector housing 131 with its large bonding area. Furthermore, in this embodiment, the conversion substrate 133 is fixed to the substrate opposing surface 131a1 by a thermally conductive adhesive 133g, but it is not limited to this. For example, the conversion substrate 133 may also be fixed to the substrate opposing surface 131a1 by riveting, pressing, or the like.

[0072] <Regarding the second heat dissipation mechanism (connection terminal) of the conversion substrate>

[0073] As a second heat dissipation mechanism for the conversion substrate 133, to form Figure 1 The heat dissipation path shown by the dashed line (2) uses at least three connection terminals 134 for external output (Vout), drive voltage supply (Vcc), and ground (GND). These connection terminals 134 are directly electrically connected to the heat-generating components 133h of the conversion substrate 133, and have extremely high thermal conductivity compared to the resin connector housing 131, thus forming an excellent heat dissipation path. Therefore, in this embodiment, heat generated in the conversion substrate 133 can be dissipated to the external environment more efficiently via the highly thermally conductive connection terminals 134.

[0074] <Regarding heat transfer suppression mechanisms>

[0075] The fluid for pressure detection is introduced into the pressure chamber 112A. However, depending on the operating conditions of the fluid, sometimes a very high-temperature fluid (e.g., around 130°C) is introduced, becoming a heat source. At this time, heat from the semiconductor sensor chip 126 (heat from the high-temperature fluid introduced into the pressure chamber 112A, etc.) is transferred to the conversion substrate 133 (from...). Figure 1 The heat transfer, conduction, and radiation from one end to the other can cause the heat dissipation effects of the first heat dissipation mechanism (connector housing) and the second heat dissipation mechanism (connection terminal) to be offset. Therefore, in this embodiment, various heat transfer suppression mechanisms are employed to prevent heat from the semiconductor sensor chip 126 side (heat from the high-temperature fluid introduced into the pressure chamber 112A, etc.) from being transferred to the conversion substrate 133. As a result, in this embodiment, heat transfer from the semiconductor sensor chip 126 side to the conversion substrate 133 can be suppressed, thus achieving the heat dissipation effect of using the first heat dissipation mechanism (connector housing) and the second heat dissipation mechanism (connection terminal). Hereinafter, the heat transfer suppression mechanism for suppressing heat transfer to the conversion substrate 133 in this embodiment will be specifically described.

[0076] <Regarding the first heat transfer suppression mechanism (internal space) for suppressing heat transfer to the conversion substrate>

[0077] The internal space S is used as a first heat transfer suppression mechanism to suppress heat transfer to the conversion substrate 133. Specifically, by providing the conversion substrate 133 at the other end of the substrate housing portion 131a, the distance L between the conversion substrate 133 in the internal space S and the central axis C of the housing 121 on the semiconductor sensor chip 126 side can be set as large as possible. Thus, in this embodiment, heat from the semiconductor sensor chip 126 side is transferred through the internal space S, which has a longer heat transfer path and lower thermal conductivity, thereby suppressing heat transfer to the conversion substrate 133.

[0078] <Regarding the second heat transfer suppression mechanism (flexible connector) for suppressing heat transfer to the conversion substrate>

[0079] As a second heat transfer suppression mechanism to suppress heat transfer to the conversion substrate 133, a flexible connector 132 is used. Specifically, the flexible connector 132 is formed, for example, from a flexible printed circuit board (FPC), a thin-plate conductive component, a lead unit, or a lead assembly, and connects multiple pins 128 to one end 134a (conversion substrate 133) of the connection terminal 134 in a bent or folded state within the internal space S. This allows for a larger connection distance between the multiple pins 128 and one end 134a (conversion substrate 133) of the connection terminal 134. Therefore, in this embodiment, heat from the semiconductor sensor chip 126 side is transferred via the flexible connector 132, which has a longer heat transfer path, thus suppressing heat conduction to the conversion substrate 133. Here, even if the heat from the semiconductor sensor chip 126 side is conducted to the conversion substrate 133 side via the flexible connector 132, since the other end of the flexible connector 132 is directly connected to one end 134a of the connection terminal 134, the heat can be dissipated to the external environment more efficiently using the second heat dissipation mechanism (connection terminal).

[0080] <Assembly process of pressure sensor>

[0081] The assembly process of the pressure sensor 100 will be described. First, the pressure sensing unit 120 and the signal transmitting unit 130 are assembled separately. Then, oil is filled into the liquid sealing chamber 124A of the pressure sensing unit 120 through the oil filling tube 129, and the oil filling tube 129 is sealed. Next, the fluid inlet 110 is fixed to the pressure sensing unit 120 by welding or the like. Then, the plurality of pins 128 of the pressure sensing unit 120 and the conversion board 133 of the signal transmitting unit 130 are arranged side by side with their respective upward orientations, and one and the other of the flexible connector 132 are fixed to one end 134a of the plurality of pins 128 and the connecting terminal 134 by laser welding or the like. Next, the pressure sensing unit 120 and the signal transmitting unit 130 are arranged opposite each other on the same axis via the bent or folded flexible connector 132, and an O-ring 142 is clamped between the pressure sensing unit 120 and the signal transmitting unit 130. Finally, one end of the riveting plate 141 and the other end are engaged with the base plate 112 of the fluid inlet section 110 and the connector housing 131 of the signal transmitting section 130, respectively, thereby fixing the fluid inlet section 110, the pressure detection section 120 and the signal transmitting section 130 into one unit.

[0082] Here, in the pressure sensor 100, without using the flexible connector 132 (which can be bent or folded), the assembly process of the pressure sensor 100 requires, for example, assembling it by stacking it from one end to the other in the direction of the central axis C. Therefore, the degree of freedom in the assembly process is extremely low, making it difficult to shorten the assembly time. However, in this embodiment, by connecting the pressure sensing unit 120 and the signal transmitting unit 130 via the flexible connector 132 (which can be bent or folded), the degree of freedom in the assembly process of the pressure sensor 100 can be increased, thus shortening the assembly time. Furthermore, in this embodiment, the timing for filling the liquid seal chamber 124A with sealing oil is before fixing the fluid inlet 110 to the pressure sensing unit 120, but it is not limited to this; for example, it can be done before fixing it using the riveting plate 141.

[0083] (Second Implementation)

[0084] use Figure 2 The pressure sensor 200 according to the second embodiment of the present invention will be described below. The main difference between the pressure sensor 200 of the second embodiment and the pressure sensor 100 of the first embodiment is that a heat dissipation pattern circuit 233p is provided on the conversion substrate 133, while the other basic structures are the same as those of the first embodiment. Here, the same reference numerals are used to mark the same components, and repeated descriptions are omitted.

[0085] <Regarding the first heat dissipation mechanism (connector housing) of the conversion substrate>

[0086] As the first heat dissipation mechanism of the conversion substrate 133, to form Figure 2 The heat dissipation path shown by the dashed line (1) uses a new heat dissipation pattern circuit 233p. Specifically, in the conversion substrate 133, a heat dissipation pattern circuit 233p made of a metal such as copper foil with high thermal conductivity is formed on one end face 133a, the side face 133c, and the other end face 133b. Therefore, in the second embodiment, compared with the first embodiment, the heat generated in the conversion substrate 133 can be actively transferred to the heat dissipation pattern circuit 233p with high thermal conductivity, so heat dissipation to the external environment can be achieved more efficiently through the thermally conductive adhesive 133g and the connector housing 131.

[0087] In this embodiment, since the heat dissipation pattern circuit 233p is formed to surround at least a portion of the heat-generating component 133h, the heat generated in the heat-generating component 133h can be more actively transferred to the heat dissipation pattern circuit 233p. Furthermore, in this embodiment, the heat dissipation pattern circuit 233p facilitates the heat transfer of the heat generated in the heat-generating component 133h from one end face 133a to the other end face 133b via the side surface 133c of the conversion substrate 133. However, this is not a limitation; for example, a pin inserted and erected on the conversion substrate 133, connecting one end face 133a and the other end face 133b, may be used instead of the side surface 133c of the conversion substrate 133. Moreover, in this embodiment, the heat dissipation pattern circuit 233p is formed on one end face 133a, the side surface 133c, and the other end face 133b, but this is not a limitation; for example, the heat dissipation pattern circuit 233p may be formed at least on the other end face 133b.

[0088] <Regarding the second heat dissipation mechanism (connection terminal) of the conversion substrate>

[0089] As a second heat dissipation mechanism for the conversion substrate 133, to form Figure 2 The heat dissipation path shown by the dashed line (2) uses a new heat dissipation pattern circuit 233p. Specifically, the heat dissipation pattern circuit 233p provided on the conversion substrate 133 is connected to the ground (GND) connection terminal 134. Therefore, in the second embodiment, compared with the first embodiment, the heat dissipation pattern circuit 233p, which has a high thermal conductivity generated in the conversion substrate 133, can actively transfer heat, and thus can dissipate heat to the external environment more efficiently through the ground (GND) connection terminal 134.

[0090] Furthermore, in this embodiment, the first heat dissipation mechanism (connector housing) and the second heat dissipation mechanism (connection terminal) are provided with heat dissipation pattern circuits 233p on the conversion substrate 133, but this is not limited to this. For example, a heat sink made of copper plate, aluminum plate, or the like can be used instead of the heat dissipation pattern circuits 233p. Also, in this embodiment, the heat dissipation pattern circuits 233p are connected to the ground (GND) connection terminal 134, but this is not limited to this. It is sufficient to generate heat transfer from the heat dissipation pattern circuits 233p to the ground (GND) connection terminal 134. For example, the heat dissipation pattern circuits 233p can also be disposed in a close proximity without being connected to the ground (GND) connection terminal 134. Furthermore, in this embodiment, heat is dissipated to the external environment via the ground (GND) connection terminal 134, but this is not limited to this. For example, heat can also be dissipated to the external environment via the external output (Vout) and drive voltage supply (Vcc) connection terminals 134.

[0091] (Third Implementation)

[0092] use Figure 3 The pressure sensor 300 according to the third embodiment of the present invention will be described below. The main difference between the pressure sensor 300 of the third embodiment and the pressure sensor 100 of the first embodiment is that a through hole 331c1 is formed in the partition wall portion 131c of the connector housing 131, and a heating element 333h of the conversion substrate 133 is disposed within this through hole 331c1. Other basic structures are the same as those of the first embodiment. Here, the same symbols are used for the same components, and repeated descriptions are omitted.

[0093] <Regarding the third heat dissipation mechanism (through hole) of the conversion substrate>

[0094] As a third heat dissipation mechanism for the conversion substrate 133, to form Figure 3 The heat dissipation path shown by the dashed line (3) uses a through hole 331c1. Specifically, a through hole 331c1 is provided in the partition 131c of the connector housing 131, which connects the substrate housing 131a and the connector connection 131b and extends along the central axis. Furthermore, the heat-generating component 333h of the conversion substrate 133 is a surface-mount type, disposed on the other end face 133b side and inside the through hole 331c1. Thus, in the third embodiment, in addition to the same effects as the first embodiment (the effects of the first heat dissipation mechanism (connector housing) and the second heat dissipation mechanism (connection terminal)), the heat generated in the heat-generating component 333h can be dissipated to the external environment more efficiently through the through hole 331c1.

[0095] Furthermore, in the pressure sensor 300 of this embodiment, since the internal space S is always connected to the external environment through the through hole 331c1, it is envisioned to be used in an environment that is not affected by liquids, dust, etc.

[0096] (Fourth Implementation)

[0097] use Figure 4 The pressure sensor 400 according to the fourth embodiment of the present invention will be described below. The main difference between the pressure sensor 400 of the fourth embodiment and the pressure sensor 300 of the third embodiment is that the through hole 331c1 is blocked by a waterproof insulating agent 433w, while the other basic structures are the same as those of the third embodiment. Here, the same symbols are used to mark the same parts, and repeated descriptions are omitted.

[0098] <Regarding the third heat dissipation mechanism (through hole) of the conversion substrate>

[0099] As a third heat dissipation mechanism for the conversion substrate 133, to form Figure 4The heat dissipation path shown by the dashed line (3) uses a new waterproof insulating agent 433w. Specifically, in the third embodiment, since the pressure sensor 300 is intended to be used in an environment unaffected by liquids, dust, etc., its application is limited. Therefore, by blocking the through hole 331c1 with the waterproof insulating agent 433w and covering the heat-generating component 333h with the waterproof insulating agent 433w, the waterproof and dustproof effects can be improved, thereby expanding its application. Thus, in the fourth embodiment, in addition to the same effects as the third embodiment (the effects of the first heat dissipation mechanism (connector housing), the second heat dissipation mechanism (connection terminal), and the third heat dissipation mechanism (through hole)), the waterproof and dustproof effects of the pressure sensor 400 can be improved.

[0100] Furthermore, the waterproof insulating agent 433w in this embodiment uses an insulating agent with high thermal conductivity. However, in order to suppress the increase in cost, for example, the material used as the thermally conductive adhesive 133g can also be used as the waterproof insulating agent 433w.

[0101] (Fifth Implementation)

[0102] use Figure 5 The pressure sensor 500 according to the fifth embodiment of the present invention will be described below. The main difference between the pressure sensor 500 of the fifth embodiment and the pressure sensor 100 of the first embodiment is that, when viewed from a direction perpendicular to the central axis C, the other end 541a of the riveting plate 541 is configured to overlap with the conversion substrate 133. Other basic structures are the same as those of the first embodiment. Here, the same reference numerals are used to mark the same parts, and repeated descriptions are omitted.

[0103] <Regarding the fourth heat dissipation mechanism (riveting plate) of the conversion substrate>

[0104] As the fourth heat dissipation mechanism of the conversion substrate 133, to form Figure 5 The heat dissipation path shown by the dashed line (4) uses a new riveting plate 541. Specifically, the other end 541a of the riveting plate 541, which is made of metal such as copper, is configured to overlap with the conversion substrate 133 when viewed in a direction perpendicular to the central axis C. Here, since the riveting plate 541, the base plate 112, and the connector component 111 that constitute the new heat dissipation path are all made of metal, their thermal conductivity is high. Thus, in the fifth embodiment, in addition to the same effects as the first embodiment (the effects of the first heat dissipation mechanism (connector housing) and the second heat dissipation mechanism (connection terminal)), the heat generated in the conversion substrate 133 can be dissipated to the external environment via the thermally conductive adhesive 133g and the connector housing 131, and from the riveting plate 541 with high thermal conductivity, and further, the heat can be dissipated to the external environment more efficiently via the base plate 112 and the connector component 111.

[0105] (Sixth Implementation Method)

[0106] use Figure 6 The pressure sensor 600 according to the sixth embodiment of the present invention will be described below. The main difference between the pressure sensor 600 of the sixth embodiment and the pressure sensor 100 of the first embodiment is that a non-metallic resin sheet 651 with heat dissipation properties and / or an adhesive 652 are sandwiched between the pressure detection unit 120 and the signal transmission unit 130. Other basic structures are the same as those of the first embodiment. Here, the same symbols are used to refer to the same components, and repeated descriptions are omitted.

[0107] <Regarding the third heat transfer suppression mechanism (resin sheet) for suppressing heat transfer to the conversion substrate>

[0108] As a third heat transfer suppression mechanism to suppress heat transfer to the conversion substrate 133, a non-metallic resin sheet 651 with heat dissipation properties and an adhesive 652 are used. Specifically, the non-metallic resin sheet 651 with heat dissipation properties and the adhesive 652 are positioned between the pressure detection section 120 and the signal transmission section 130. Here, the resin sheet 651 has a ring shape, is disposed around a plurality of pins 128, and covers the upper surface of the housing 121. Furthermore, the adhesive 652 is applied to the upper surface of the sealing glass 124. Thus, in the sixth embodiment, in addition to the same effects as in the first embodiment (the effects of the first heat transfer suppression mechanism (internal space) and the second heat transfer suppression mechanism (flexible connector)), electromagnetic waves containing infrared and visible light generated by heat from the semiconductor sensor chip 126 side are suppressed by passing through the non-metallic resin sheet 651 with heat dissipation properties and the adhesive 652, thereby suppressing heat radiation to the conversion substrate 133. Furthermore, by covering the other end of the housing 121, which has a lower thermal emissivity, with a non-metallic resin sheet 651 and an adhesive 652, the heat of the housing 121 is dissipated through thermal radiation via the heat-dissipating non-metallic resin sheet 651 and the adhesive 652, thus suppressing the temperature rise of the housing 121. Here, the heat-dissipating non-metallic resin sheet 651 in this embodiment can appropriately use a resin sheet with a thermal emissivity of 0.85 or higher. Furthermore, the heat-dissipating adhesive 652 in this embodiment can be made of the same material as the thermally conductive adhesive 133g described above.

[0109] Furthermore, the resin sheet 651 in this embodiment has a ring shape, but is not limited to this. For example, it can be shaped to be sandwiched between the pressure detection unit 120 and the signal transmission unit 130, or it can be any shape. In addition, in this embodiment, both the resin sheet 651 and the adhesive 652 are used, but it is not limited to this. For example, only the resin sheet 651 or the adhesive 652 may be used.

[0110] Next, we will describe the case where the heat dissipation mechanism of the conversion substrate 133 is of the type that makes indirect thermal contact between the conversion substrate 133 (including the heat-generating component) and the connector housing 131.

[0111] (Seventh Implementation)

[0112] use Figure 7 The pressure sensor 700 according to the seventh embodiment of the present invention will be described below. The main difference between the pressure sensor 700 of the seventh embodiment and the pressure sensor 100 of the first embodiment is that the heating element 733h of the conversion substrate 133 is provided on the substrate opposing surface 131a1 side, and a thermally conductive adhesive 133g is filled in the gap between the conversion substrate 133 and the substrate opposing surface 131a1. Other basic structures are the same as those of the first embodiment. Here, the same symbols are used for the same components, and repeated descriptions are omitted.

[0113] <Regarding the first heat dissipation mechanism (connector housing) of the conversion substrate>

[0114] As the first heat dissipation mechanism of the conversion substrate 133, to form Figure 7 The heat dissipation path shown by the dashed line (1) uses a thicker thermally conductive adhesive 133g. Specifically, the surface-mount type heat-generating component 733h is provided on the substrate opposing surface 131a1 side. When the signal transmitting section 130 is reversed vertically, the conversion substrate 133 is fitted with the stepped portion 131d of the connector housing 131, and the gap between the conversion substrate 133 and the substrate opposing surface 131a1 is filled with thermally conductive adhesive 133g. To avoid interference with the oil filling tube 129, an opening 133d is formed in the conversion substrate 133, through which the thermally conductive adhesive 133g can be filled and air bubbles mixed with the adhesive 133g can be discharged. Alternatively, it can be as follows: Figure 7 As shown, the substrate facing surface 131a1 has a concave-convex shape for mold release, and is not necessarily a roughly flat shape.

[0115] In the seventh embodiment, the thermally conductive adhesive 133g not only surrounds the heat-generating component 733h, but also surrounds one end of the connecting terminal 134. This allows for active heat transfer from the heat-generating component 733h to the thermally conductive adhesive 133g surrounding it, thus enabling more efficient heat dissipation to the external environment via the first heat dissipation mechanism (connector housing) and the second heat dissipation mechanism (connecting terminal) compared to the first embodiment.

[0116] (Eighth Implementation Method)

[0117] use Figure 8B A partial circuit diagram of the conversion substrate 133 including the heat-generating component 833h according to the eighth embodiment of the present invention will be described. Furthermore, in order to... Figure 8B Compare, Figure 8A A partial circuit diagram of the heating element 733h in the seventh embodiment is shown. The main difference between the heating element 833h in the eighth embodiment and the heating element 733h in the seventh embodiment is that multiple heating elements are connected in parallel; otherwise, the basic structure is the same as in the seventh embodiment. Here, the same symbol is used to label the same component, and repeated descriptions are omitted.

[0118] <Regarding the fifth heat dissipation mechanism of the conversion substrate (multiple heat-generating components connected in parallel)>

[0119] As the fifth heat dissipation mechanism of the conversion substrate 133, multiple heat-generating components 833h are connected in parallel. Specifically, by connecting multiple heat-generating components 833h (e.g., transistors) in parallel, the power consumption is distributed according to the number of heat-generating components 833h, which can prevent the electronic components of the conversion substrate 133 from exceeding the heat resistance temperature.

[0120] In the eighth embodiment, multiple heating elements 833h are electrically connected in parallel. This allows the surface area to increase proportionally to the number of heating elements 833h, enabling efficient heat transfer of the heat generated in the heating elements 833h to the thermally conductive adhesive 133g. Therefore, compared to the seventh embodiment, heat dissipation to the external environment is more efficient via the first heat dissipation mechanism (connector housing) and the second heat dissipation mechanism (connection terminal).

[0121] (Ninth Implementation)

[0122] use Figure 9 The pressure sensor 900 according to the ninth embodiment of the present invention will be described below. The main difference between the pressure sensor 900 of the ninth embodiment and the pressure sensor 700 of the seventh embodiment is that the pressure sensor 900 of the ninth embodiment has a heat sink 133e disposed adjacent to the heat-generating part 733h, while the other basic structures are the same as those of the seventh embodiment. Here, the same reference numerals are used to mark the same parts, and repeated descriptions are omitted.

[0123] <Regarding the sixth heat dissipation mechanism (heat sink) of the conversion substrate>

[0124] As the sixth heat dissipation mechanism of the conversion substrate 133, to form Figure 9The heat dissipation path shown by the dashed line (6) uses a new heat sink 133e. Specifically, one end of the heat sink 133e, which is made of a metal with high thermal conductivity such as copper, is arranged adjacent to the heat-generating component 733h, and the other end of the heat sink 133e extends to the connector connection portion 131b via the partition portion 131c. Thus, in the ninth embodiment, in addition to the same effects as in the seventh embodiment (the effects of the first heat dissipation mechanism (connector housing) and the second heat dissipation mechanism (connection terminal)), the heat generated in the conversion substrate 133 can be dissipated to the external environment from the heat sink 133e, which has high thermal conductivity.

[0125] Furthermore, in this embodiment, the heat sink 133e is arranged adjacent to the heat-generating component 733h, but it is not limited to this; for example, it may also be arranged in contact with the heat-generating component 733h.

[0126] (Tenth Implementation)

[0127] use Figure 10 The pressure sensor 1000 according to the tenth embodiment of the present invention will be described below. The main difference between the pressure sensor 1000 of the tenth embodiment and the pressure sensor 700 of the seventh embodiment is that the lead-type heating element 1033h is housed in the recess 131e of the connector housing 131, and only the area around the lead-type heating element 1033h is filled with a thermally conductive adhesive 133g. Other basic structures are the same as in the seventh embodiment. Here, the same reference numerals are used for the same components, and repeated descriptions are omitted.

[0128] <Regarding the seventh heat dissipation mechanism (lead-type heat-generating component) of the conversion substrate>

[0129] As the seventh heat dissipation mechanism of the conversion substrate 133, to form Figure 10The heat dissipation path shown by the dashed line (7) uses a new lead-type heat-generating component 1033h. Specifically, the lead-type heat-generating component 1033h is provided on the substrate opposing surface 131a1 side. Furthermore, a recess 131e with a shape corresponding to the lead-type heat-generating component 1033h is formed in the connector housing 131. The lead-type heat-generating component 1033h is housed in the recess 131e, and a thermally conductive adhesive 133g is filled only in the gap between the recess 131e and the lead-type heat-generating component 1033h. Thus, in the tenth embodiment, compared with the surface-mount type heat-generating component 733h in the seventh embodiment, the surface area of ​​the heat-generating component 1033h can be significantly increased, and heat dissipation to the external environment can be more efficient via the thermally conductive adhesive 133g. Furthermore, since the lead-type heating element 1033h is mounted on the conversion substrate 133 via a lead, the heating part of the heating element 1033h is physically separated from the conversion substrate 133. As a result, it is possible to prevent the electronic components of the conversion substrate 133 from exceeding the heat resistance temperature.

[0130] Furthermore, in this embodiment, the thermally conductive adhesive 133g is only filled around the lead-type heating element 1033h, but it is not limited to this; for example, it can also be filled in the gap between the conversion substrate 133 and the substrate facing surface 131a1. Also, in this embodiment, a gap filled with the thermally conductive adhesive 133g is provided between the lead-type heating element 1033h and the recess 131e, but it is not limited to this; for example, the lead-type heating element 1033h and the recess 131e can also be in contact with each other.

[0131] <Other methods>

[0132] This invention is not limited to the various methods, embodiments, and variations described above. Appropriate changes and modifications can be made without departing from the technical concept of this invention. Specifically, to the extent possible, the first to tenth embodiments of this invention can be combined with each other.

[0133] Symbol Explanation

[0134] 100, 200, 300, 400, 500, 600, 700, 900, 1000—Pressure sensor; 110—Fluid inlet; 111—Connector component; 111a—Internal thread; 111b—Port; 112—Base plate; 112A—Pressure chamber; 120—Pressure detection part; 121—Housing; 122—Diaphragm; 123—Protective cover; 123a—Connecting hole; 124—Sealing glass; 124A—Liquid seal chamber; 125—Support; 126—Semiconductor sensor chip; 126a—Connecting lead; 127—Potential adjustment component; 128—Pin; 129—Oil filling tube; 130—Signal transmitting part; 131—Connector housing; 131a—Substrate storage part; 131a1—Substrate facing surface; 131b—Connector connection part; 131c—Isolation Wall portion, 131d—step portion, 131e—recess, 132—flexible connector, 133—conversion base plate, 133a—one end face, 133b—the other end face, 133c—side side, 133d—opening, 133e—heat sink, 133g—thermally conductive adhesive, 133h, 333h, 733h, 833h, 1033h—heat-generating components, 134—connecting terminal, 134a—one end, 140—connecting component, 141, 541—riveting plates, 142—O-ring, 233p—patterned circuit for heat dissipation, 331c1—through hole, 433w—waterproof insulating agent, 651—resin sheet with heat dissipation properties, 652—adhesive with heat dissipation properties, C—central axis, L—distance between the conversion base plate and the central axis of the housing, S—internal space.

Claims

1. A pressure sensor, characterized by Possessing: a fluid introduction portion that introduces a fluid to be pressure detected into a pressure chamber; a pressure detection portion that has a semiconductor sensor chip that detects the pressure of the fluid introduced into the pressure chamber and a plurality of pins that are connected to the semiconductor sensor chip and constitute external input and output terminals of the semiconductor sensor chip; and a signal transmission portion that has a connector housing, a conversion substrate, and a connection terminal, the connector housing having a substrate housing portion that divides an internal space at one end side, a connector connection portion at the other end side, and a partition wall portion between the substrate housing portion and the connector connection portion, a heat dissipation mechanism of the conversion substrate that directly or indirectly thermally contacts the connector housing of the conversion substrate at a substrate opposing surface at the other end of the substrate housing portion and the connection terminal that is connected to the conversion substrate at one end side and extends to the connector connection portion via the partition wall portion at the other end side, a heat transfer suppression mechanism that suppresses the transfer of heat to the conversion substrate that has the internal space between the conversion substrate and the pressure detection portion.

2. The pressure sensor according to claim 1, wherein the heat dissipation mechanism of the conversion substrate fixes the conversion substrate to the substrate opposing surface.

3. The pressure sensor according to claim 2, wherein the heat dissipation mechanism of the conversion substrate further has a pattern circuit for heat dissipation formed on at least the substrate opposing surface side of the conversion substrate.

4. The pressure sensor according to claim 2 or 3, wherein the partition wall portion has a through-hole that communicates the substrate housing portion and the connector connection portion, the heat generating part of the conversion substrate is provided on the substrate opposing surface side, the heat dissipation mechanism of the conversion substrate further has the through-hole in which the heat generating part is disposed.

5. The pressure sensor according to claim 4, wherein the through-hole is plugged with a waterproof insulating agent, and the heat generating part is covered with the waterproof insulating agent.

6. The pressure sensor according to any one of claims 1 to 3, further comprising a connection member that connects the fluid introduction portion, the pressure detection portion, and the signal transmission portion, the heat dissipation mechanism of the conversion substrate further has the connection member, and the connection member is disposed so as to overlap the conversion substrate when viewed from a direction perpendicular to a center axis.

7. The pressure sensor according to claim 1, wherein the heat generating part of the conversion substrate is provided on the substrate opposing surface side, the heat dissipation mechanism of the conversion substrate has an adhesive having thermal conductivity that fills a gap between the heat generating part and the connector housing.

8. The pressure sensor according to claim 7, wherein the heat dissipation mechanism of the conversion substrate further has a plurality of the heat generating parts that are electrically connected in parallel.

9. The pressure sensor according to claim 7 or 8, wherein the heat dissipation mechanism of the conversion substrate further has a heat dissipation plate that is in contact with or adjacent to the heat generating part at one end side and extends to the connector connection portion via the partition wall portion at the other end side. ​ ​ 10. The pressure sensor according to claim 7 or 8, characterized in that The heat dissipation mechanism of the conversion substrate further includes the lead-type heat generating component and a recess of the connector housing that accommodates the lead-type heat generating component.

11. The pressure sensor according to any one of claims 1 to 3, characterized in that The signal transmitting section further includes a flexible wiring member, The heat transfer suppression mechanism that suppresses the transfer of heat to the conversion substrate includes the flexible wiring member that is bent or folded between the plurality of pins and the conversion substrate.

12. The pressure sensor according to claim 10, characterized in that The signal transmitting section further includes a flexible wiring member, The heat transfer suppression mechanism that suppresses the transfer of heat to the conversion substrate includes the flexible wiring member that is bent or folded between the plurality of pins and the conversion substrate.

13. The pressure sensor according to any one of claims 1 to 3, characterized in that The heat transfer suppression mechanism that suppresses the transfer of heat to the conversion substrate further includes a resin sheet and / or an adhesive that has heat dissipation properties and is disposed between the pressure detecting section and the signal transmitting section.

14. The pressure sensor according to claim 11, characterized in that The heat transfer suppression mechanism that suppresses the transfer of heat to the conversion substrate further includes a resin sheet and / or an adhesive that has heat dissipation properties and is disposed between the pressure detecting section and the signal transmitting section.

15. The pressure sensor according to claim 12, characterized in that The heat transfer suppression mechanism that suppresses the transfer of heat to the conversion substrate further includes a resin sheet and / or an adhesive that has heat dissipation properties and is disposed between the pressure detecting section and the signal transmitting section.

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