An electronic bay for a drone and the drone itself

Abstract

This application relates to an electronic compartment for a drone and the drone itself. The electronic compartment includes an electronic compartment body and a flow guide. The electronic compartment body includes a shell, a heat dissipation assembly, and a circuit board. The heat dissipation assembly and the circuit board are installed inside the shell. The shell includes a first air inlet and a first air outlet that are connected to each other. The flow guide is installed outside the shell and includes a second air inlet and a second air outlet that are connected to each other. The second air outlet is connected to the first air inlet. The air inlet area of ​​the second air inlet is larger than the air outlet area of ​​the second air outlet, and the air inlet area of ​​the second air inlet is larger than the air inlet area of ​​the first air inlet. The flow guide of this application can guide flowing air into the shell and can pressurize and accelerate the flowing air, thereby improving heat dissipation efficiency.

Description

Technical Field

[0001] This application relates to the field of unmanned aerial vehicle (UAV) technology, and more particularly to an electronic bay for a UAV and the UAV itself. Background Technology

[0002] Drones typically consist of a mainboard that continuously generates heat during operation. When the mainboard temperature becomes too high, it reduces the drone's thermal reliability and operational performance. Therefore, it's necessary to introduce external airflow to the vicinity of the mainboard to transfer heat to the air, and then expel the hot air from the drone, completing a cyclical cooling process. However, while introducing external air, a dust filter is required to prevent foreign objects from contaminating the drone's interior and its mainboard. But the dust filter reduces the airflow speed into the drone, thus decreasing the cooling efficiency for the mainboard. Summary of the Invention

[0003] This application provides an electronic compartment for a drone and the drone itself. The air intake channel of the electronic compartment gradually narrows from the outside to the inside, which can gradually compress the air and increase the air flow speed to improve heat dissipation efficiency.

[0004] The first aspect of this application provides an electronic compartment for a drone. The electronic compartment includes an electronic compartment body and a flow guide. The electronic compartment body includes a shell, a heat dissipation component, and a circuit board. The heat dissipation component and the circuit board are installed inside the shell. The shell includes a first air inlet and a first air outlet that are connected to each other. The flow guide is installed outside the shell and includes a second air inlet and a second air outlet that are connected to each other. The second air outlet is connected to the first air inlet. The air inlet area of ​​the second air inlet is larger than the air outlet area of ​​the second air outlet, and the air inlet area of ​​the second air inlet is larger than the air inlet area of ​​the first air inlet.

[0005] In one possible design, the housing includes two opposing first sidewalls, each with a first air inlet. The guide includes two opposing second sidewalls, each with a second air outlet. The two second sidewalls sandwich the two first sidewalls so that the two second air outlets are connected to the two first air inlets. The air inlet area of ​​the second air inlet is greater than the total air outlet area of ​​the two second air outlets, and the air inlet area of ​​the second air inlet is greater than the total air inlet area of ​​the two first air inlets.

[0006] In one possible design, the air guide includes two second air inlets, which are respectively connected to two second air outlets. The total air intake area of ​​the two second air inlets is greater than the total air outlet area of ​​the two second air outlets, and the total air intake area of ​​the two second air inlets is greater than the total air intake area of ​​the two first air inlets.

[0007] In one possible design, the air guide is equipped with a rectifier located between the two second air inlets.

[0008] In one possible design, the second air intake is one of a semi-circular, elliptical, or circular shape.

[0009] In one possible design, the plane containing the first sidewall and / or the plane containing the second sidewall has a preset angle α with the line connecting the nose and tail of the drone, the preset angle α satisfying: 0°≤a<90°, and the plane containing the second air intake is perpendicular to the line connecting the nose and tail of the drone.

[0010] In one possible design, the plane containing the first sidewall and the plane containing the second sidewall both have a preset angle α of 0° with the line connecting the nose and tail of the drone.

[0011] In one possible design, the heat dissipation component includes a heat sink and a fan. The heat sink is attached to the outer surface of the circuit board, and the fan has an air intake and an air exhaust. The air intake is connected to a first air inlet, and the air exhaust faces the heat sink.

[0012] In one possible design, the housing includes two opposing first air inlets, the air guide includes two opposing second air outlets, two heat dissipation components are installed inside the housing, two heat sinks are respectively disposed on both sides of the circuit board, and two air intakes are respectively connected to the two first air inlets.

[0013] In one possible design, the circuit board includes a first board, a second board, and a connecting frame. The first board is connected to the second board through the connecting frame, and two heat sinks are respectively located on opposite sides of the first and second boards.

[0014] In one possible design, a baffle is provided on the inner wall of the housing, and the space enclosed by the baffle is used to install a fan and heat sink. The space enclosed by the baffle is also connected to the first air outlet.

[0015] In one possible design, along the height of the casing, the first air outlet is located above the first air inlet, and the deflector and heat sink are tilted relative to the line connecting the nose and tail of the drone.

[0016] In the electronic compartment of the drone of this application, the shell of the electronic compartment is provided with a first air inlet and a first air outlet that are connected to each other, so that air can enter the interior of the shell from the first air inlet. The heat dissipation component conducts the heat generated by the circuit board to the air inside the shell, and the air then flows to the outside of the shell through the first air outlet, thereby dissipating heat from the circuit board. A guide is also installed on the outside of the shell, which includes a second air inlet and a second air outlet that are connected to each other. The second air outlet is connected to the first air inlet, so that air passes through the second air inlet, the second air outlet, the first air inlet, and the first air outlet in sequence, transferring the heat inside the shell to the external environment. Because the intake area of ​​the second air inlet is larger than the exhaust area of ​​the second air outlet, and the intake area of ​​the second air inlet is larger than the intake area of ​​the first air inlet, when air flows from the second air inlet with a larger intake area to the second air outlet with a smaller exhaust area, or when it flows to the first air inlet with a smaller intake area, the air flow cross-section gradually decreases. The volume of air to enter the housing is gradually compressed and the pressure gradually increases, which increases the air flow speed before entering the housing. The more airflow that comes into contact with the heat dissipation component per unit time, the greater the efficiency of the heat dissipation component in transferring heat to the air, and the better the heat dissipation effect on the circuit board.

[0017] A second aspect of this application also provides a drone, which includes an airframe and an electronic compartment of the drone as described above, the electronic compartment being installed in the airframe, and the drone also has the aforementioned effects.

[0018] It should be understood that the above general description and the following detailed description are merely exemplary and do not limit this application. Attached Figure Description

[0019] Figure 1 A schematic diagram of the electronic bay of the drone provided in this application in a specific embodiment;

[0020] Figure 2 for Figure 1 A schematic diagram of the main structure of the electronic warehouse;

[0021] Figure 3 for Figure 2 Another structural diagram of the main body of the electronic warehouse;

[0022] Figure 4 for Figure 2 and Figure 3 Exploded view of the main structure of the electronic warehouse;

[0023] Figure 5 for Figure 1 Schematic diagram of the middle guide component;

[0024] Figure 6 for Figure 5 Another structural schematic diagram of the central guide component;

[0025] Figure 7 for Figure 1 A schematic diagram of the structure of the first specific embodiment of the electronic warehouse;

[0026] Figure 8 for Figure 1 A schematic diagram of the structure of the second specific embodiment of the electronic warehouse;

[0027] Figure 9 for Figure 1 A cross-sectional view of the main body of the electronic warehouse;

[0028] Figure 10 for Figure 9 A schematic diagram showing the structural connection between the heat dissipation component and the main circuit board;

[0029] Figure 11 for Figure 10 Exploded view of the structure of the main circuit board.

[0030] Figure label:

[0031] 10-Electronic Warehouse;

[0032] 1- Electronic warehouse main body;

[0033] 11-Shell;

[0034] 111 - First air intake;

[0035] 112 - First air outlet;

[0036] 113 - First sidewall;

[0037] 114 - Deflector plate;

[0038] 114a - Fracture surface;

[0039] 12-Heat dissipation components;

[0040] 121-Fan;

[0041] 121a - Fan blade;

[0042] 121b - Air intake;

[0043] 121c - Air outlet;

[0044] 122 - Heatsink;

[0045] 13-Circuit mainboard;

[0046] 131 - First Motherboard;

[0047] 132 - Second motherboard;

[0048] 133-Connecting frame;

[0049] 2-Flow guide;

[0050] 21 - Second air intake;

[0051] 22 - Second air outlet;

[0052] 23-Second sidewall;

[0053] 24 - Rectifier section;

[0054] First direction X.

[0055] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application. Detailed Implementation

[0056] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0057] It should be understood that the described embodiments are merely some, not all, of the embodiments in this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0058] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0059] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0060] It should be noted that the directional terms such as "upper," "lower," "left," and "right" described in the embodiments of this application are used to describe the angles shown in the accompanying drawings and should not be construed as limiting the embodiments of this application. Furthermore, in the context, it should be understood that when it is mentioned that an element is connected "upper" or "lower" to another element, it can be directly connected to the other element "upper" or "lower," or indirectly connected to the other element "upper" or "lower" through an intermediate element.

[0061] This application provides an electronic housing 10 for a drone and the drone itself, which can be applied in the field of drone technology, such as... Figures 1-6 As shown, the electronic compartment 10 includes an electronic compartment body 1 and a flow guide 2. The electronic compartment body 1 includes a shell 11, a heat dissipation component 12, and a circuit board 13. The heat dissipation component 12 and the circuit board 13 are installed inside the shell 11. The shell 11 includes a first air inlet 111 and a first air outlet 112 that are connected to each other. The flow guide 2 is installed outside the shell 11. The flow guide 2 includes a second air inlet 21 and a second air outlet 22 that are connected to each other. The second air outlet 22 is connected to the first air inlet 111. The air inlet area of ​​the second air inlet 21 is larger than the air outlet area of ​​the second air outlet 22, and the air inlet area of ​​the second air inlet 21 is larger than the air inlet area of ​​the first air inlet 111.

[0062] In this embodiment, please refer to Figures 1-6 As shown, the housing 11 of the electronic compartment 10 is provided with a first air inlet 111 and a first air outlet 112 that are connected to each other, so that air can enter the interior of the housing 11 from the first air inlet 111. The heat dissipation component 12 conducts the heat generated by the circuit board 13 to the air inside the housing 11, and the air then flows to the outside of the housing 11 through the first air outlet 112, thereby dissipating heat from the circuit board 13. A flow guide 2 is also installed on the outside of the housing 11. The flow guide 2 includes a second air inlet 21 and a second air outlet 22 that are connected to each other. The second air outlet 22 is connected to the first air inlet 111, so that air passes through the second air inlet 21, the second air outlet 22, the first air inlet 111 and the first air outlet 112 in sequence, transferring the heat inside the housing 11 to the external environment of the housing 11.

[0063] In the embodiments of this application, the air intake area of ​​the second air inlet 21 is larger than the air outlet area of ​​the second air outlet 22, and the air intake area of ​​the second air inlet 21 is larger than the air intake area of ​​the first air inlet 111. Therefore, when air flows from the second air inlet 21 with a larger air intake area to the second air outlet 22 with a smaller air outlet area, or when it flows to the first air inlet 111 with a smaller air intake area, the air flow cross section gradually decreases, the volume of air to be entered into the housing 11 is gradually compressed and the pressure gradually increases, so that the air flow speed increases before entering the housing 11. The more air flow that comes into contact with the heat dissipation component 12 per unit time, the greater the efficiency of the heat dissipation component 12 in transferring heat to the air, and the better the heat dissipation effect on the circuit board 13.

[0064] Dust filters (not shown in the figure) can be provided at the first air inlet 111 and the first air outlet 112, or dust filters can be provided at the second air inlet 21 or the second air outlet 22 instead of the first air inlet 111, which can reduce the risk of foreign objects outside the electronic compartment 10 contaminating the heat dissipation components 12 and the circuit board 13 inside the housing 11.

[0065] Furthermore, the connection between the housing 11 and the air guide 2 can be detachable or integrally formed. When the housing 11 and the air guide 2 are detachable, air guides 2 with different areas of second air inlets 21 can be installed on the housing 11 according to the heat dissipation requirements of different circuit boards 13, flexibly adjusting the air speed ratio and improving the user experience.

[0066] In one specific embodiment, please refer to Figures 1-6 As shown, the housing 11 includes two opposing first sidewalls 113, each of which is provided with a first air inlet 111. The guide member 2 includes two opposing second sidewalls 23, each of which is provided with a second air outlet 22. The two second sidewalls 23 clamp the two first sidewalls 113 so that the two second air outlets 22 are respectively connected to the two first air inlets 111. The air inlet area of ​​the second air inlet 21 is greater than the total air outlet area of ​​the two second air outlets 22, and the air inlet area of ​​the second air inlet 21 is greater than the total air inlet area of ​​the two first air inlets 111.

[0067] In this embodiment, please refer to Figures 1-6 As shown, the two opposing second sidewalls 23 of the air guide 2 clamp the two opposing first sidewalls 113 of the housing 11, so that the air guide 2 can be detachably installed on the outside of the housing 11. The second air outlets 22 of each of the two second sidewalls 23 are connected to the first air inlets 111 of each of the two first sidewalls 113, allowing flowing air to enter the interior of the housing 11 simultaneously from both sides. This structure can fully utilize the area of ​​the two opposing first sidewalls 113 of the housing 11 and provide appropriately sized first air inlets 111 without increasing the sidewall area on the windward side of the housing 11, thus meeting the airflow required for heat dissipation of the circuit board 13. Furthermore, the air inlet area of ​​the second air inlet 21 is larger than the total air outlet area of ​​the two second air outlets 22, and the air inlet area of ​​the second air inlet 21 is larger than the total air inlet area of ​​the two first air inlets 111. Therefore, as air flows from the second air inlet 21 to the second air outlets 22 on both sides of the housing 11, or to the first air inlets 111 on both sides of the housing 11, the airflow cross-section gradually decreases. The volume of air entering the housing 11 is gradually compressed and the pressure gradually increases, resulting in a higher airflow velocity before entering the housing 11. The greater the airflow rate in contact with the heat dissipation component 12 per unit time, the greater the efficiency of the heat dissipation component 12 in transferring heat to the air, and the better the heat dissipation effect on the circuit board 13. Therefore, this embodiment improves the heat dissipation efficiency of the circuit board 13 by increasing both airflow rate and airflow velocity without increasing the frontal area of ​​the housing 11 or the flight drag of the UAV.

[0068] Please refer to Figures 1-6 As shown, the first air inlet 111 is located on two oppositely arranged first sidewalls 113 of the housing 11, and the second air inlet 21 is also located on two oppositely arranged second sidewalls 23 of the guide member 2, so that the guide member 2 can be symmetrically installed on the outside of the housing 11, so that the flowing air can pass evenly through the inner and outer surfaces of the guide member 2 and the electronic compartment body 1, so that the UAV is more stable during flight.

[0069] Furthermore, the number of first air inlets 111 on the two first sidewalls 113 and the number of second air outlets 22 on the two second sidewalls 23 can be adjusted according to the actual usage environment to meet different heat dissipation requirements. In this embodiment, the number of second air inlets 21 is not limited. It is sufficient that after the air passes through the second air inlets 21, the airflow is divided into at least two streams by the internal structure of the guide member 2, and flows from the second air outlets 22 and the first air inlets 111 on both sides of the housing 11 into the interior of the housing 11.

[0070] Specifically, please refer to Figure 1 , Figure 5 , Figure 7 and Figure 8 As shown, the guide member 2 includes two second air inlets 21, which are located on one side of the two first sidewalls 113 respectively, and are connected to the two second air outlets 22 respectively. The total air intake area of ​​the two second air inlets 21 is greater than the total air outlet area of ​​the two second air outlets 22, and the total air intake area of ​​the two second air inlets 21 is greater than the total air intake area of ​​the two first air inlets 111.

[0071] In this embodiment, please refer to Figure 1 , Figure 5 , Figure 7 and Figure 8 As shown, the number of second air inlets 21 of the guide member 2 is two, and they are located on one side of the two first sidewalls 113 respectively, and are connected to the two second air outlets 22 respectively. That is, an independent air compression channel is formed on both sides of the housing 11, so that the two streams of air to enter the housing 11 do not interfere with each other during the compression process, thereby increasing their respective flow speed and improving heat dissipation efficiency.

[0072] The two channels formed by the two second air inlets 21, the two second air outlets 22, and the two first air inlets 111 can also improve the reliability of air pressurization and speed-up, thereby reducing the risk of heat dissipation failure of the circuit board 13 in the event of failure of a single channel.

[0073] More specifically, please refer to Figure 5 , Figure 7 and Figure 8As shown, the guide member 2 is provided with a rectifier 24, which is located between the two second air inlets 21.

[0074] In this embodiment, please refer to Figure 5 , Figure 7 and Figure 8 As shown, the rectifier 24 protrudes from the guide member 2 and is located between the two second air inlets 21. The rectifier 24 and the second air inlets 21 have a gently transitioning slope. In this way, during flight, the air facing the rectifier 24 will be guided by the rectifier 24 to the second air inlets 21 on both sides. This can reduce the wind resistance of the guide member 2 and increase the flight speed of the UAV. It can also increase the airflow into the second air inlets 21 on both sides and improve the heat dissipation efficiency of the circuit board 13.

[0075] Please refer to Figure 5 , Figure 7 and Figure 8 As shown, the second air inlet 21 can be one of a semi-circular, elliptical, or circular shape. In this embodiment, the second air inlet 21 is semi-circular, so that the main air intake part of the second air inlet 21 can fit against the first sidewall 113 of the housing 11, increasing the possibility of the air guided by the rectifier 24 entering the second air inlet 21, increasing the airflow into the second air inlet 21, resulting in greater air pressure and faster airflow inside the guide member 2, further improving the heat dissipation efficiency of the circuit board 13.

[0076] In the above embodiments, please refer to Figures 1-8 As shown, the plane where the first sidewall 113 is located and / or the plane where the second sidewall 23 is located have a preset angle α with the line connecting the nose and tail of the UAV (first direction X). The preset angle α satisfies: 0°≤a<90°. The plane where the second air inlet 21 is located is perpendicular to the first direction X.

[0077] In this embodiment, please refer to Figures 1-8 As shown, the direction of the line connecting the nose and tail of the drone is taken as the first direction X, and this direction is used as the drone's flight direction. The plane containing the two first sidewalls 113 and / or the plane containing the two second sidewalls 23 is perpendicular to the first direction X (e.g., ...). Figure 7-Figure 8The structure, with a predetermined angle α between the two (indicated by the dashed arrow), minimizes the windward area of ​​the sidewall of the housing 11 without reducing the necessary space occupied by the heat dissipation component 12 and the circuit board 13, thereby reducing the drone's flight drag and increasing its flight speed. Simultaneously, the plane of the second air inlet 21 is perpendicular to the first direction X, guiding as much air as possible into the first air inlet 111 and improving the heat dissipation efficiency of the circuit board 13. Therefore, the structure of this embodiment reduces the windward area of ​​the housing 11, reducing flight drag, while allowing more air to enter the first air inlet 111, thus improving the heat dissipation efficiency of the circuit board 13.

[0078] Depending on the aerodynamic parameters required for different UAVs, the first sidewall 113 can be a flat surface and the second sidewall 23 can be an arc surface, or the first sidewall 113 can be an arc surface and the second sidewall 23 can be a flat surface, or both the first sidewall 113 and the second sidewall 23 can be flat surfaces.

[0079] Please refer to Figure 7-Figure 8 As shown, when both the first sidewall 113 and the second sidewall 23 are planar, both the first sidewall 113 and the second sidewall 23 have sufficient contact area, improving the reliability of the two second sidewalls 23 clamping the two first sidewalls 113. The distance between the two second sidewalls 23 can be slightly smaller than the distance between the two first sidewalls 113 to achieve the clamping effect.

[0080] In another embodiment (not shown in the figure), an outwardly extending circular wall may be provided on the first air inlet 111 and / or the second air outlet 22 so that the first air inlet 111 and the second air outlet 22 are fitted together, thereby installing the guide member 2 on the outside of the housing 11.

[0081] Specifically, please refer to Figure 8 As shown, the plane containing the first sidewall 113 and the plane containing the second sidewall 23 both have a preset angle α of 0° with the line connecting the nose and tail of the UAV (first direction X).

[0082] In this embodiment, please refer to Figure 8 As shown, both the first sidewall 113 and the second sidewall 23 are planar and parallel to the first direction X. This arrangement allows the first air inlet 111 to be located on the first sidewall 113, which is parallel to the direction of flight of the drone. This minimizes the windward area of ​​the shell 11, reduces the flight drag of the drone, and reduces the workload and heat generated by the circuit board 13.

[0083] In the above embodiments, please refer to Figure 4 , Figure 9 and Figure 10As shown, the heat dissipation assembly 12 includes a heat sink 122 and a fan 121. The heat sink 122 is attached to the outer surface of the circuit board 13. The fan 121 has an air intake 121b and an air outlet 121c. The air intake 121b is connected to the first air inlet 111, and the air outlet 121c faces the heat sink 122.

[0084] In this embodiment, please refer to Figure 4 , Figure 9 and Figure 10 As shown, the heat sink 122 can transfer heat from the circuit board 13 to the surrounding air. The fan 121 acts as an air booster inside the housing 11. When the fan 121 is working, it draws air into the air intake 121b from the first air intake 111. Inside the fan 121, the air pressure and flow rate are further increased, and the air is discharged from the air outlet 121c. The high-speed air blows towards the heat sink 122, improving the efficiency of the heat sink 122 in transferring heat to the air, thereby improving the heat dissipation efficiency of the circuit board 13.

[0085] Please refer to Figure 4 , Figure 9 and Figure 10 As shown, fan 121 is a centrifugal fan. Air flows radially along the fan blades 121a to the air outlet 121c and blows directly onto the heat sink 122. This centrifugal fan 121 can reduce the frontal area of ​​the casing 11 and reduce the flight drag of the drone.

[0086] The power of the fan 121 is provided and controlled by the circuit board 13. When the drone is in normal working conditions, such as constant speed or slow flight, the heat generated by the circuit board 13 is low, and the fan 121 can not work or rotate at low speed. The air that naturally enters from the first air intake 111 during the flight of the drone is blown onto the heat sink 122. When the drone is under heavy load and accelerates, the heat generated by the circuit board 13 is high, and the fan 121 needs to rotate at high speed to ensure that the air with a faster flow rate is blown onto the heat sink 122.

[0087] Additionally, please refer to Figure 4 , Figure 9 and Figure 10 As shown, the surface of the heat sink 122 has multiple fins, which increases the contact area between the heat sink 122 and the air, thereby improving heat dissipation efficiency. Furthermore, the multiple fins on the surface of the heat sink 122 form rows of channels, guiding the airflow effectively. Moreover, there is a gap between each pair of adjacent fins; when the airflow passes through these gaps, turbulence is created, breaking the stratosphere (i.e., the relatively still airflow layer) at these gaps, allowing the heat from the heat sink 122 to be effectively transferred to the flowing air, thus improving heat dissipation efficiency.

[0088] In another embodiment (not shown in the figure), an axial fan can also be provided at the position of the second air inlet 21 of the guide member 2, which, together with the centrifugal fan adjacent to the first air inlet 111, forms a two-stage pressurization and speed-up effect on the air.

[0089] Specifically, please refer to Figure 4 , Figure 5 , Figure 9 and Figure 10 As shown, the housing 11 includes two oppositely arranged first air inlets 111, the air guide 2 includes two oppositely arranged second air outlets 22, and two heat dissipation components 12 are installed inside the housing 11. The two heat sinks 122 are respectively arranged on both sides of the circuit board 13, and the two air intakes 121b are respectively connected to the two first air inlets 111.

[0090] In this embodiment, please refer to Figure 4 , Figure 5 , Figure 9 and Figure 10 As shown, since the housing 11 includes two opposing first air inlets 111 and the guide 2 includes two opposing second air outlets 22, air can enter the interior of the housing 11 from both sides after being pressurized and accelerated. Simultaneously, two fans 121 and two heat sinks 122 are also installed inside the housing 11 and located on both sides of the circuit board 13. When the air intakes 121b of the two fans 121 are connected to the two first air inlets 111 respectively, the air at the two first air inlets 111 can be drawn in by the two sets of fans 121, pressurized and accelerated again, and blown onto the heat sinks 122 on both sides of the circuit board 13, reducing the heat of the circuit board 13 with twice the heat dissipation efficiency.

[0091] Specifically, please refer to Figure 11 As shown, the circuit board 13 includes a first board 131, a second board 132 and a connecting frame 133. The first board 131 is connected to the second board 132 through the connecting frame 133. Two heat sinks 122 are respectively disposed on the opposite sides of the first board 131 and the second board 132.

[0092] Since the mainboard 13 of a drone typically includes multiple control boards such as a computing core board and an electronic speed controller circuit board, it generates a high amount of heat during operation. Sufficient heat dissipation space is required within the shell 11. However, the drone's shell 11 also needs a small frontal area to reduce flight drag. In the above embodiment, air sequentially passes through two second air inlets 21, two second air outlets 22, and two first air inlets 111, entering the interior of the shell 11 from both sides. It then passes through two heat dissipation components 12 to cool the sides of the mainboard 13. Therefore, in this embodiment, the circuit motherboard 13 is divided into a first motherboard 131 and a second motherboard 132. The first motherboard 131 and the second motherboard 132 are connected by a connecting frame 133, so that the heat source of the circuit motherboard 13 is distributed on the first motherboard 131 and the second motherboard 132 which are arranged opposite to each other. Two heat sinks 122 are respectively arranged on the opposite side of the first motherboard 131 and the second motherboard 132. The circuit motherboard 13 can transfer heat to the heat sinks 122 on both sides, thereby improving the heat dissipation efficiency. This structure makes full use of the surface of the circuit motherboard 13 and the space inside the shell 11, and can also reduce the windward area of ​​the shell 11 of the UAV, thereby reducing flight drag.

[0093] Please refer to Figure 4 and Figure 9 As shown, a baffle plate 114 is provided on the inner wall of the housing 11. The space enclosed by the baffle plate 114 is used to install the fan 121 and the heat sink 122. The space enclosed by the baffle plate 114 is also connected to the first air outlet 112.

[0094] In this embodiment, please refer to Figure 4 and Figure 9 As shown, the air guide plate 114 protrudes from the inner wall of the housing 11. The space enclosed by the air guide plate 114 is used to accommodate the fan 121 and the heat sink 122. When the fan 121 is working, most of the air is blown towards the heat sink 122 under the guidance of the air guide plate 114. In the embodiment of this application, a break 114a is also provided near the first air outlet 112 of the air guide plate 114 so that the space enclosed by the air guide plate 114 can be connected to the first air outlet 112. After passing through the heat sink 122, the air is discharged to the external environment of the housing 11 through the break 114a and the first air outlet 112 in sequence. Therefore, in this embodiment, the air guide plate 114 can guide the flowing air to contact the heat sink 122, increase the effective contact rate between the air and the heat sink 122, reduce the possibility of ineffective air flow inside the housing 11, and thus improve the heat dissipation efficiency of the circuit board 13.

[0095] Please refer to Figure 4 and Figure 9As shown, the protruding end face of the air guide plate 114 is provided with mounting holes for mounting the fan 121 and the heat sink 122. The protrusion height of the air guide plate 114 on the inner wall of the housing 11 ensures that the heat sink 122 can make precise contact with the circuit board 13. Simultaneously, a thermally conductive interface material is coated between the circuit board 13 and the heat sink 122 to reduce the thermal resistance between them and improve heat dissipation efficiency.

[0096] Specifically, please refer to Figure 4 , Figure 9 and Figure 10 As shown, along the height direction of the housing 11, the first air outlet 112 is located above the first air inlet 111, and the guide plate 114 and the heat sink 122 are inclined relative to the line connecting the nose and tail of the UAV (first direction X).

[0097] In this embodiment, please refer to Figure 4 , Figure 9 and Figure 10 As shown, the air becomes hot after passing through the heat sink 122, and the hot air has a lower density and an upward flow characteristic. Therefore, this embodiment utilizes this characteristic by placing the first air outlet 112 above the first air inlet 111 along the height direction of the housing 11, and tilting the guide plate 114 and the heat sink 122 relative to the first direction X, so that air enters the housing 11 from the lower first air inlet 111 and contacts the heat sink 122 under the guidance of the guide plate 114. When the air becomes hot, it can continue to flow upward autonomously under the guidance of the guide plate 114, increasing the air flow speed, improving heat dissipation efficiency, reducing dependence on the fan 121, and reducing the workload of the circuit board 13.

[0098] This application also provides a drone (not shown in the figure), which includes a body and an electronic compartment 10. The electronic compartment 10 is the same as the electronic compartment 10 in the above embodiment. The electronic compartment 10 is installed on the body. The drone including the electronic compartment 10 in the above embodiment also has the above-mentioned effects.

[0099] The electronic compartment 10 of the drone and the drone's operating process in this application are as follows:

[0100] As the drone flies forward (along the first direction X), air, guided by the airflow guide 2, sequentially passes through the second air inlet 21, the second air outlet 22, and the first air inlet 111 before entering the housing 11. Because the intake area of ​​the second air inlet 21 is larger than the exhaust area of ​​the second air outlet 22, and the intake area of ​​the second air inlet 21 is larger than the intake area of ​​the first air inlet 111, the air gradually increases in pressure and speed before entering the housing 11. This increased airflow passes through the air intake 121b of the fan 121, and under the propulsion of the fan blades 121a, passes through the air outlet 121c, blowing towards the heat sink 122. The heat sink 122 transfers the heat from the main circuit board 13 to the nearby flowing air, and then exhausts it outside the housing 11 through the first air outlet 112. When the heat of the main circuit board 13 is low, the fan 121 of the heat dissipation component 12 may not operate or may operate at low speed; when the heat of the main circuit board 13 is high, the fan 121 operates at high speed.

[0101] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An electronic bay for a drone, characterized in that, The electronic compartment (10) includes: Electronic compartment body (1), the electronic compartment body (1) includes a shell (11), a heat dissipation component (12) and a circuit board (13), the heat dissipation component (12) and the circuit board (13) are installed inside the shell (11), the shell (11) includes a first air inlet (111) and a first air outlet (112) that are connected to each other; A flow guide (2) is installed on the outside of the housing (11). The flow guide (2) includes a second air inlet (21) and a second air outlet (22) that are connected to each other. The second air outlet (22) is connected to the first air inlet (111). The air intake area of ​​the second air inlet (21) is larger than the air outlet area of ​​the second air outlet (22), and the air intake area of ​​the second air inlet (21) is larger than the air intake area of ​​the first air inlet (111). The housing (11) includes two opposing first sidewalls (113), and the two first sidewalls (113) are respectively provided with the first air inlet (111); The guide (2) includes two opposing second sidewalls (23), each of which is provided with a second air outlet (22). The two second sidewalls (23) clamp the two first sidewalls (113) so that the two second air outlets (22) are respectively connected to the two first air inlets (111). The air intake area of ​​the second air inlet (21) is greater than the total air outlet area of ​​the two second air outlets (22), and the air intake area of ​​the second air inlet (21) is greater than the total air intake area of ​​the two first air inlets (111). The plane containing the first sidewall (113) and / or the plane containing the second sidewall (23) has a preset angle α with the line connecting the nose and tail of the UAV, and the preset angle α satisfies: 0°≤a<90°; The plane containing the second air inlet (21) is perpendicular to the line connecting the nose and tail of the UAV; The heat dissipation assembly (12) includes a heat sink (122) and a fan (121), wherein the heat sink (122) is attached to the outer surface of the circuit board (13); The fan (121) has an air intake (121b) and an air outlet (121c). The air intake (121b) is connected to the first air inlet (111), and the air outlet (121c) faces the heat sink (122).

2. The electronic bay of the drone according to claim 1, characterized in that, The guide (2) includes two second air inlets (21), and the two second air inlets (21) are respectively connected to two second air outlets (22); The total air intake area of ​​the two second air inlets (21) is greater than the total air outlet area of ​​the two second air outlets (22), and the total air intake area of ​​the two second air inlets (21) is greater than the total air intake area of ​​the two first air inlets (111).

3. The electronic bay of the drone according to claim 2, characterized in that, The guide member (2) is provided with a rectifier (24), which is located between the two second air inlets (21).

4. The electronic bay of the drone according to claim 3, characterized in that, The second air inlet (21) is one of a semi-circular, elliptical or circular shape.

5. The electronic bay of the drone according to claim 1, characterized in that, The preset angle α between the plane containing the first sidewall (113) and the plane containing the second sidewall (23) and the line connecting the nose and tail of the UAV is 0°.

6. The electronic bay of the drone according to claim 1, characterized in that, The housing (11) includes two oppositely arranged first air inlets (111); The flow guide (2) includes two oppositely arranged second air outlets (22); Two heat dissipation components (12) are installed inside the housing (11), and two heat sinks (122) are respectively disposed on both sides of the circuit board (13). Two air intakes (121b) are respectively connected to two first air inlets (111).

7. The electronic bay of the drone according to claim 6, characterized in that, The circuit board (13) includes a first board (131), a second board (132) and a connecting frame (133), wherein the first board (131) is connected to the second board (132) through the connecting frame (133); The two heat sinks (122) are respectively disposed on opposite sides of the first motherboard (131) and the second motherboard (132).

8. The electronic bay of the drone according to claim 1, characterized in that, A flow guide plate (114) is provided on the inner wall of the housing (11), and the space enclosed by the flow guide plate (114) is used to install the fan (121) and the heat sink (122); The space enclosed by the guide plate (114) is also connected to the first air outlet (112).

9. The electronic bay of the drone according to claim 8, characterized in that, Along the height direction of the housing (11), the first air outlet (112) is located above the first air inlet (111); The air guide plate (114) and the heat sink (122) are tilted relative to the line connecting the nose and tail of the UAV.

10. A drone, characterized in that, The drone includes: Organism; Electronic compartment (10), wherein the electronic compartment (10) is the electronic compartment (10) of the UAV according to any one of claims 1 to 9; The electronic compartment (10) is installed on the body.

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