Packaging structure and packaging method of inkjet printer print head

Abstract

The present invention provides a packaging structure for an inkjet printer printhead and a packaging method thereof. The packaging structure includes an ink cartridge, a chip module holder, a circuit board, and a printing chip. The ink cartridge includes an ink cartridge housing and a chip module assembly area for the printhead. The chip module holder is located below the chip module assembly area. The circuit board is located below the chip module holder. The printing chip is located below the circuit board and, together with the circuit board and the chip module holder, forms a chip module. The printing chip includes at least two adjacent chip units. The present invention flexibly selects the number of chip units in the printing chip, the number of ink channels in the chip units, the nozzle structure in the ink channels, and the nozzle order in the ink channels based on the material of the printing object and printing requirements, thereby achieving modular customization of the printing chip.

Description

Technical Field

[0001] The invention belongs to the field of inkjet printing and relates to a packaging structure of a print head of an inkjet printer and a packaging method thereof. Background Art

[0002] With the development of technology, dot matrix printers, laser printers, and inkjet printers have emerged one after another and have rapidly become an indispensable part of today's office equipment. Although inkjet printers appeared relatively late, they have rapidly developed due to their advantages such as low price, simple ink refilling, and low printing costs, and are widely used in daily office work.

[0003] Currently, the print chip in an inkjet printer is typically packaged into the cartridge housing and cannot be removed. Either a single print chip controls multiple ink channels (red, yellow, blue, and black), or two separate print chips are packaged into the printhead, with one print chip corresponding to each color ink channel and one corresponding to each black ink channel. Consequently, these printheads offer limited flexibility in the number of ink channels, lacking the ability to flexibly select the number of ink channels based on actual needs, and lack modular customization of the ink channel colors. Furthermore, the nozzle arrangement and structural design are monotonous, making them incapable of high-quality printing on diverse materials.

[0004] Therefore, there is an urgent need to develop a packaging method for an inkjet printer print head in which the ink channel can be flexibly selected, the arrangement order of the nozzles can be selected, the nozzle structure can be designed differently according to the material of the printing object, and the ink channel color of the print head can be modularly customized. Summary of the Invention

[0005] In view of the shortcomings of the prior art described above, the object of the present invention is to provide a packaging structure and packaging method for an inkjet printer print head, which are used to solve the problems in the prior art of poor selectivity of ink channels, single arrangement order of nozzles and structural design of nozzles, and inability to modularly customize the ink channel color of the print head.

[0006] To achieve the above-mentioned and other related purposes, the present invention provides a method for packaging an inkjet printer print head, comprising the following steps:

[0007] A wafer is provided, wherein a plurality of adjacent chip units are fabricated in the wafer, wherein one of the chip units comprises at least one ink channel and at least one row of nozzles, and the ink channel is connected to the at least one row of nozzles;

[0008] Cutting the wafer to obtain a plurality of printed chips, each printed chip comprising at least two adjacent chip units;

[0009] The printing chip is assembled to a circuit board, and the circuit board is assembled to a chip module bracket to form a chip module, and the chip module is assembled to a chip module assembly area of a print head in an ink cartridge to form a print head.

[0010] Optionally, the plurality of chip units are arranged in at least one row and at least one column on the plane where the wafer is located.

[0011] Optionally, in the same row or column of chip units, at least two adjacent chip units adopt the same nozzle size and the same nozzle arrangement.

[0012] Optionally, a first printing chip is obtained by selective cutting, and in the first printing chip, all the chip units use the same nozzle size and the same nozzle arrangement.

[0013] Optionally, in the same row or column of chip units, at least two adjacent chip units respectively adopt different nozzle sizes and / or different nozzle arrangements.

[0014] Optionally, a second printing chip is obtained by selective cutting, and in the second printing chip, at least two adjacent chip units respectively adopt different nozzle sizes and / or different nozzle arrangements.

[0015] Optionally, at least two of the printing chips include different numbers of chip units.

[0016] Optionally, the method of cutting the wafer includes one of laser cutting and blade cutting.

[0017] Optionally, the method further includes forming a protective layer on the printed chip electrodes of the printed chip, the circuit terminals of the circuit board, and the exposed surfaces of the electrical connection portions.

[0018] Optionally, an electrical connection portion is formed between the printed chip and the circuit board to electrically connect the printed chip to the circuit board.

[0019] The present invention also provides a packaging structure for an inkjet printer print head, which is manufactured using the above method, and the packaging structure includes:

[0020] An ink cartridge, comprising an ink cartridge housing and a chip module assembly area of a print head;

[0021] a chip module bracket, the chip module bracket being located below the chip module assembly area;

[0022] A circuit board, the circuit board is located below the chip module bracket;

[0023] A printing chip is located below the circuit board and forms a chip module with the circuit board and the chip module bracket. The printing chip includes at least two adjacent chip units, one of which includes at least one ink channel and at least one column of nozzles, and the ink channel is connected to at least one column of nozzles.

[0024] As described above, the packaging structure and packaging method of an inkjet printer print head of the present invention designs the printing chip according to the material of the printing object and the printing requirements, and then cuts the wafer to obtain the printing chip, and each printing chip selects at least two adjacent chip units according to the requirements, each chip unit includes at least one ink channel, and each ink channel includes at least one column of nozzles, thereby realizing flexible selection of the ink channel of the printing chip in the print head, and the structure of the nozzles in the wafer is not exactly the same, and the arrangement order of the nozzles in the printing chip and the structure of the nozzles can also be selected according to the requirements. In addition, each ink channel in the printing chip is filled with one color of ink, so that the print head can be modularly customized to achieve monochrome or multi-color printing. The printing chip has good compatibility, which ensures various printing requirements of the print head, and the packaging of the print head is simple, with broad market prospects. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 Shown is a flow chart of a method for packaging an inkjet printer print head according to the present invention.

[0026] Figure 2 Shown is a schematic structural diagram of a wafer for the packaging method of an inkjet printer print head of the present invention.

[0027] Figure 3 Shown is a schematic diagram of the printing chip structure of the packaging method of the inkjet printer print head of the present invention.

[0028] Figure 4 Shown is a schematic cross-sectional structure diagram of a chip module of the packaging method of an inkjet printer print head of the present invention.

[0029] Figure 5 It is a schematic cross-sectional structure diagram of forming a connection portion in the packaging method of the inkjet printer print head of the present invention.

[0030] Figure 6 A bottom view showing a connection portion of a packaging method for an inkjet printer print head according to the present invention.

[0031] Figure 7 A schematic diagram showing the cross-sectional structure of a print head of an inkjet printer according to the packaging method of the present invention is shown.

[0032] Component number description

[0033] 1 wafer

[0034] 2 Chip Module

[0035] 21 Printing Chip

[0036] 211 chip unit

[0037] 212 Nozzle

[0038] 22 circuit boards

[0039] 23 Chip module bracket

[0040] 24 Electrical connection

[0041] 3 ink cartridges

[0042] 31 Chip module assembly area

[0043] 32 ink cartridge housing DETAILED DESCRIPTION

[0044] The following describes the embodiments of the present invention through specific examples. Those skilled in the art will readily understand the other advantages and benefits of the present invention from the disclosure herein. The present invention may also be implemented or applied through various other specific embodiments, and the details in this specification may be modified or altered based on different viewpoints and applications without departing from the spirit of the present invention.

[0045] See also Figures 1 to 7 It should be noted that the diagrams provided in this embodiment are merely schematic illustrations of the basic concept of the present invention. Therefore, the diagrams only show components related to the present invention and are not drawn according to the number, shape, and size of components in actual implementation. In actual implementation, the type, quantity, and proportion of each component may be changed arbitrarily, and the component layout may also be more complex.

[0046] Example 1

[0047] This embodiment provides a packaging method for an inkjet printer print head. Figure 1 , which is a flowchart of the packaging method, including the following steps:

[0048] S1: providing a wafer for an inkjet printer, wherein a plurality of adjacent chip units are fabricated on the wafer, wherein each chip unit comprises at least one ink channel and at least one row of nozzles, and each ink channel is connected to at least one row of nozzles;

[0049] S2: cutting the wafer to obtain a plurality of printed chips, each printed chip comprising at least two adjacent chip units;

[0050] S3: Assembling the printing chip to a circuit board, and assembling the circuit board to a chip module bracket to form a chip module, and assembling the chip module to a chip module assembly area of a print head in an ink cartridge to form a print head.

[0051] First see Figures 2 to 3 , performing step S1 and step S2: providing a wafer 1, in which a plurality of mutually adjacent chip units 211 are manufactured, wherein one chip unit 211 comprises at least one ink channel (not shown) and at least one column of nozzles 212, and one ink channel is connected to at least one column of nozzles 212; cutting the wafer 1 to obtain a plurality of printed chips 21, wherein the printed chip 21 comprises at least two mutually adjacent chip units 211.

[0052] As an example, Figure 2 , which is a schematic structural diagram of the wafer 1 , a plurality of the chip units 211 are arranged in at least one row and at least one column on the plane where the wafer 1 is located.

[0053] Specifically, the nozzles 212 in the wafer 1 may be designed with the same structure and the same arrangement, or may be designed with different structures and arrangements to meet different requirements.

[0054] As an example, in the same row or column of chip units, at least two adjacent chip units 211 use the same nozzle size and the same nozzle arrangement.

[0055] As an example, a first printing chip is obtained by selective cutting. In the first printing chip, all the chip units 211 use the same nozzle size and the same nozzle arrangement.

[0056] As an example, in the same row or column of chip units, at least two adjacent chip units 211 respectively adopt different nozzle sizes and / or different nozzle arrangements.

[0057] As an example, a second printing chip is obtained by selective cutting, in which at least two adjacent chip units 211 respectively adopt different nozzle sizes and / or different nozzle arrangements.

[0058] Specifically, the number of the chip units 211 and the number of the ink channels and the nozzles 212 in the chip unit 211 are selected appropriately according to the material of the printing object and the printing requirements to obtain the printing chip 21, thereby adapting to the material of the corresponding printing object and the printing requirements.

[0059] Specifically, for different printing object materials and printing requirements, the structures of the nozzles 212 in the chip unit 211 are different, and the arrangement order of the nozzles 212 in the selected chip unit 211 is different.

[0060] As an example, at least two of the printing chips 21 may include different numbers of chip units 211. For example, one of the cut printing chips may have two chip units 211, while the other printing chip may have three or four chip units 211. Furthermore, for each printing chip 21, all of the chip units 211 may use the same nozzle design (e.g., the same nozzle size and the same nozzle layout), or at least two of the chip units 211 may use different nozzle designs (e.g., different nozzle sizes and / or different nozzle layouts).

[0061] As an example, the method of cutting the wafer 1 includes one of laser cutting and blade cutting, or other suitable methods.

[0062] Specifically, the wafer 1 is cut according to the position of the ink channel, and the cutting to form the printing chip 21 is performed along the ink channel without damaging the edge of the ink channel.

[0063] Specifically, such as Figure 3 Figure 2 shows a schematic diagram of the structure of the printing chip 21. Based on the material of the print target and the printing requirements, appropriate chip units 211 are selected and the wafer 1 is cut to allow modular customization of the printing chip 21. In this embodiment, ordinary paper is selected as the print target, and the printing chip 21 includes four chip units 211 with the same nozzle size and nozzle arrangement. Each chip unit 211 includes one ink channel, and each ink channel includes two rows of nozzles 212.

[0064] See also Figures 4 to 7 , execute step S3: assemble the printing chip 21 to the circuit board 22, and assemble the circuit board 22 to the chip module bracket 23 to form the chip module 2, and assemble the chip module 2 to the chip module assembly area 31 of the print head in the ink cartridge 3 to form the print head.

[0065] As an example, an electrical connection portion 24 is formed between the printed chip 21 and the circuit board 22 to electrically connect the printed chip 21 to the circuit board 22 .

[0066] Specifically, a circuit for driving the printing chip 21 is provided inside the circuit board 22 .

[0067] Specifically, such as Figure 4FIG. 2 is a schematic cross-sectional view of the chip module 2. Before forming the electrical connection 24 between the printed chip 21 and the circuit board 22, the printed chip 21 is assembled to the circuit board 22 to secure it in place. The circuit board is then assembled to the chip module bracket 23 to form the chip module 2. The functional surface of the printed chip 21 is provided with printed chip electrodes, and the surface of the circuit board 22 is provided with circuit terminals electrically connected to the internal circuitry of the circuit board 22. In this embodiment, the printed chip electrodes face away from the circuit board 22, and the printed chip 21 is positioned between the circuit terminals.

[0068] Specifically, such as Figure 5 and Figure 6 , which are a cross-sectional structural diagram and a bottom view after the electrical connection portion 24 is formed on the chip module 2 , wherein the electrical connection portion 24 is located between the printed chip electrode and the circuit terminal, and is electrically connected to the printed chip electrode and the circuit terminal.

[0069] Specifically, the electrical connection portion 24 includes at least one of a metal wire and a metal column, or other suitable electrical connection components. In this embodiment, the electrical connection portion 24 is a metal wire.

[0070] Specifically, the electrical connection between the electrical connection portion 24 and the printed chip electrodes and the circuit terminals is formed by welding or other suitable methods.

[0071] As an example, the method further includes forming a protective layer on the printed chip electrodes of the printed chip 21 , the circuit terminals of the circuit board 22 , and the exposed surfaces of the electrical connection portion 24 to protect the circuits in the printed chip 21 , the circuits in the circuit board 22 , and the electrical connection portion 24 .

[0072] As an example, Figure 7 , which is a schematic diagram of the cross-sectional structure of the print head, the chip module 2 is assembled to the chip module assembly area 31 of the print head on the ink cartridge 3 to form the print head.

[0073] A packaging method for an inkjet printer print head of the present embodiment selects a pre-selected chip area suitable for the structure of the nozzle 212 and the arrangement order of the nozzle 212 in the wafer 1 according to the material of the printing object and the printing requirements before the cutting of the printing chip 21 is completed, and then cuts the wafer 1 according to the pre-selected chip area to obtain the printing chip 21, thereby realizing modular customization of the printing chip 21, and the chip units 211 in the printing chip 21, the number of the ink channels in the chip units 211, the structure of the nozzles 212 in the ink channels, and the arrangement order of the nozzles 212 in the ink channels can all be flexibly selected according to the material of the printing object and the printing requirements.

[0074] Example 2

[0075] This embodiment provides a packaging structure for an inkjet printer print head. Figure 7 , which is a schematic cross-sectional structural diagram of the packaging structure, is manufactured using the packaging method of the inkjet printer print head described in Example 1, and includes an ink cartridge 3, a chip module bracket 23, a circuit board 22, and a printing chip 21, wherein the ink cartridge 3 includes an ink cartridge housing 32 and a chip module assembly area 31 of the print head, the chip module bracket 23 is located below the chip module assembly area 31, the circuit board 22 is located below the chip module bracket 23, the printing chip 21 is located below the circuit board 22, and together with the circuit board 22 and the chip module bracket 23, forms a chip module 2, and the printing chip 21 includes at least two adjacent chip units 211, one of the chip units 211 includes at least one ink channel and at least one column of nozzles 212, and one of the ink channels is connected to at least one column of nozzles 212.

[0076] As an example, combine Figure 3 As shown in the structural diagram of the printing chip 21 , the chip unit 211 includes at least one ink channel, and the ink channel includes at least one column of nozzles 212 .

[0077] Specifically, the chip units 211 in the printing chip 21 are independent of each other, and the ink channels in the chip units 211 are independent of each other.

[0078] As an example, each ink channel in the printing chip 21 is filled with ink of one color, and a plurality of ink channels in the printing chip 21 are filled with ink of at least one color.

[0079] As an example, the printed chip 21 is fixed on the circuit board 22, the circuit board 22 is fixed on the chip module bracket 23, the chip module 2 is fixed to the chip module assembly area 31, and the chip module 2 is detachable, that is, it can be removed from the chip module assembly area 31.

[0080] As an example, an electrical connection portion 24 is provided between the printed chip 21 and the circuit board 22, and a protective layer is provided on the surface of the electrical connection portion 24, the printed chip electrodes of the printed chip 21 connected to the electrical connection portion 24, and the exposed surface of the circuit terminals of the circuit board 22 connected to the electrical connection portion 24.

[0081] Specifically, the protective layer covers the exposed surfaces of the printed chip electrodes, the circuit terminals, and the electrical connection parts 24 to prevent the printed chip electrodes, the circuit terminals, and the electrical connection parts 24 from being corroded by fluids such as ink. At the same time, the protective layer has insulating properties to prevent electrical contact between the electrical connection parts.

[0082] The packaging structure of an inkjet printer print head of this embodiment selects at least two adjacent chip units 211 according to printing requirements through the design of the printing chip 21, each chip unit 211 includes at least one ink channel, each ink channel includes at least one column of nozzles 212, and the chip units 211 in the printing chip are independent of each other, the ink channels in the chip units 211 are independent of each other, each ink channel is filled with ink of one color, and multiple ink channels in the printing chip 211 are filled with ink of at least one color, thereby realizing monochrome or multi-color printing of the print head, and the printing chip 21 has good compatibility, ensuring various printing requirements of the print head. In addition, the print head is detachable, saving resources.

[0083] In summary, the packaging structure and packaging method of an inkjet printer printhead of the present invention design a printing chip, flexibly selecting the chip units in the printing chip, the number of ink channels in the chip units, the structure of the nozzles in the ink channels, and the arrangement order of the nozzles in the ink channels according to the material of the printing object and the printing requirements, thereby achieving modular customization of the printing chip. The chip units and ink channels in the printing chip are independent of each other, each ink channel is filled with a single color of ink, and multiple ink channels in the printing chip are filled with at least one color of ink, realizing single-color or multi-color printing of the printhead. Furthermore, the printing chip is highly compatible and removable, thereby ensuring the various printing requirements of the printhead, saving resources, and simplifying the packaging of the printhead. Therefore, the present invention effectively overcomes the various shortcomings of the prior art and has high industrial application value.

[0084] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical principles disclosed herein are intended to be covered by the claims of the present invention.

Claims

1. A packaging method for an inkjet printer print head, characterized in that: The following steps are involved: A wafer is provided, wherein a plurality of adjacent chip units are fabricated on the wafer, wherein each chip unit includes at least one ink channel and at least one column of nozzles, wherein the ink channel is connected to the at least one column of nozzles, and the plurality of chip units are arranged in at least one row and at least one column on the plane of the wafer, and within the same row or column of chip units, at least two adjacent chip units respectively utilize different nozzle sizes and / or different nozzle arrangements; Cutting the wafer to obtain a plurality of printed chips, wherein the printed chip comprises at least two adjacent chip units, and at least two adjacent chip units in the printed chip respectively adopt different nozzle sizes and / or different nozzle arrangements; The printing chip is assembled to a circuit board, and the circuit board is assembled to a chip module bracket to form a chip module, and the chip module is assembled to the chip module assembly area of the print head in the ink cartridge to form a print head, and the chip module is detachable.

2. The packaging method for an inkjet printer print head according to claim 1, wherein: At least two of the printed chips contain different numbers of chip units.

3. The packaging method for an inkjet printer print head according to claim 1, wherein: The method of cutting the wafer includes one of laser cutting and blade cutting.

4. The packaging method for an inkjet printer print head according to claim 1, wherein: The method further includes forming a protective layer on the printed chip electrodes of the printed chip, the circuit terminals of the circuit board and the exposed surfaces of the electrical connection parts.

5. A packaging structure for an inkjet printer print head, manufactured using the packaging method for an inkjet printer print head according to any one of claims 1 to 4, characterized in that: The packaging structure includes: An ink cartridge, comprising an ink cartridge housing and a chip module assembly area of a print head; a chip module bracket, the chip module bracket being located below the chip module assembly area; A circuit board, the circuit board is located below the chip module bracket; A printing chip is located below the circuit board and forms a chip module with the circuit board and the chip module bracket. The printing chip includes at least two adjacent chip units, one of which includes at least one ink channel and at least one column of nozzles, and one of which is connected to at least one column of nozzles. The chip module is detachable, and at least two adjacent chip units in the printing chip respectively adopt different nozzle sizes and / or different nozzle arrangements.

Images