Display device and method of manufacturing the same

Abstract

A display device includes: a first substrate formed in a rectangular shape, including an upper end, a left end, a right end, and a lower end, and including a plurality of wiring pads extending to the lower end; a display layer disposed on a front surface of the first substrate; a second substrate disposed on the front surface of the display layer, including an upper end, a left end, and a right end corresponding to the upper end, the left end, and the right end of the first substrate, and a lower end shorter than the lower end of the first substrate, and mounted such that the plurality of wiring pads of the first substrate are exposed; a plurality of side wiring pads disposed on the lower end of the first substrate and the lower end of the second substrate and connected to the plurality of wiring pads; and a display driving circuit connected to the plurality of side wiring pads.

Description

Technical Field

[0001] This disclosure relates to a display device and a method of manufacturing the same, and more specifically to a display device and a method of manufacturing the same having narrow bezels formed on its four sides. Background Technology

[0002] Recently, with the rapid development of electronic technology, display devices that display image information are also developing rapidly.

[0003] In other words, a wide variety of lightweight, thin, and low-power display devices are being used. Examples of such display devices include liquid crystal displays (LCDs), organic light-emitting diode (OLED) displays, quantum dot light-emitting diode (QLED) displays, electroluminescent displays (ELDs), and so on.

[0004] Typically, a display device may include a display panel for displaying images and a housing therein that houses the display panel. An opening is provided on the front surface of the housing to expose the front surface of the display panel. A bezel may be formed around the perimeter of the opening.

[0005] Since the border is not a component for displaying images, it is preferable to make the border width as narrow as possible while maximizing the display area of ​​the display device, thereby minimizing the overall size.

[0006] The narrower the bezels on the four sides of the display device, the more the user will feel that the four sides of the display device seem to be infinitely extended. Summary of the Invention

[0007] [Technical Issues]

[0008] This disclosure was made to overcome the aforementioned drawbacks and other problems associated with conventional arrangements. One aspect of this disclosure relates to a display device having four narrow bezels and a method for manufacturing the same.

[0009] [Technical Solution]

[0010] According to one aspect of this disclosure, a display device includes: a first substrate having a rectangular shape, including an upper end, a left end, a right end, and a lower end, and further including a plurality of wiring pads extending to the lower end; a display layer disposed on a front surface of the first substrate; a second substrate disposed on the front surface of the display layer, the second substrate including an upper end, a left end, and a right end coinciding with the upper end, the left end, and the right end of the first substrate, and further including a lower end shorter than the lower end of the first substrate, wherein the second substrate is configured relative to the first substrate to expose the plurality of wiring pads of the first substrate; a plurality of side wiring pads disposed on the lower end of the first substrate and the lower end of the second substrate, wherein each corresponding side wiring pad is connected to a corresponding wiring pad among the plurality of wiring pads; and a display driving circuit connected to the plurality of side wiring pads.

[0011] The display device may also include an anisotropic conductive film (ACF) disposed between a plurality of side wiring pads and the display driving circuit.

[0012] Each of the plurality of routing pads may include a top surface and an end, and the top surface and end of each of the plurality of routing pads may contact at least one of the plurality of side routing pads.

[0013] Each of the multiple side wiring pads may include silver paste, and the multiple side wiring pads may be formed by thermally transferring the multiple side wiring pads from the plastic film to the lower end of the first substrate and the lower end of the second substrate.

[0014] The plastic film can be polyethylene terephthalate (PET).

[0015] The display driving circuit may include multiple 3-chips on film, and each of the multiple 3-chips on film may include a gate integrated circuit and multiple source integrated circuits.

[0016] The display driving circuit may also include a flexible printed circuit board connected to multiple films and 3 chips.

[0017] The display layer may include a liquid crystal layer, wherein the first substrate further includes a plurality of thin-film transistors configured to operate the liquid crystal layer, and wherein the second substrate further includes a plurality of color filters.

[0018] Each of the plurality of thin-film transistors may include a gate electrode and a source electrode, and the gate electrode and source electrode of each of the plurality of thin-film transistors may be connected to a wiring pad in a plurality of wiring pads.

[0019] The display device may further include: a bezel formed to cover the edge of the second substrate, wherein the bezel includes a lower bezel configured to cover a plurality of side wiring pads and display driving circuitry, and wherein the width of the lower bezel is 1 mm or less.

[0020] According to another aspect of the embodiments of the present disclosure, a method of manufacturing a display device includes: forming a display panel including a first substrate, a display layer, and a second substrate; preparing a side wiring pad film having a plurality of side wiring pads, the plurality of side wiring pads being formed on the surface of the side wiring pad film; transferring the plurality of side wiring pads of the side wiring pad film to the edge of the display panel; curing the plurality of side wiring pads transferred to the edge of the display panel; and arranging a display driving circuit on the plurality of side wiring pads at the edge of the display panel.

[0021] Fabricating a side-wire pad film having multiple side-wire pads formed on the surface of the side-wire pad film includes: applying a conductive paste to one surface of a plastic film; and patterning the conductive paste using a photolithography process to form multiple side-wire pads from the conductive paste on the plastic film.

[0022] Transferring multiple side wiring pads of a side wiring pad film to the edge of a display panel includes: positioning the side wiring pad film on the edge of the display panel such that the multiple side wiring pads contact the edge of the display panel; bending the upper and lower portions of the side wiring pad film to conform to the shape of the edge of the display panel; transferring the multiple side wiring pads to the edge of the display panel by applying heat to the side wiring pad film; and removing the plastic film of the side wiring pad film.

[0023] The display panel can be formed such that the edge of the first substrate is configured to extend beyond the edge of the second substrate and a plurality of wiring pads of the first substrate are exposed to the outside. The upper and lower portions of the curved side wiring pad film, conforming to the shape of the edge of the display panel, may further include: a curved side wiring pad film such that each corresponding side wiring pad of the plurality of side wiring pads of the side wiring pad film contacts the upper surface of the wiring pad of the plurality of wiring pads.

[0024] Arranging the display driving circuit on multiple side wiring pads at the edge of the display panel may include: attaching an anisotropic conductive film to the multiple side wiring pads; and attaching the display driving circuit to the outer surface of the anisotropic conductive film.

[0025] Anisotropic conductive films can be formed as steps with corresponding side wiring pads.

[0026] The first substrate of the display panel can be formed in a rectangular shape, having a top, left, right, and bottom end, and including a plurality of wiring pads extending to the bottom end. A display layer can be disposed on the top surface of the first substrate. A second substrate can be disposed on the top surface of the display layer, and includes a top, left, and right end that coincide with the top, left, and right ends of the first substrate, and a bottom end that is shorter than the bottom end of the first substrate, so that the plurality of wiring pads are exposed.

[0027] [Beneficial Effects]

[0028] In the case of the display device and manufacturing method of the present disclosure as described above, a plurality of side wiring pads are provided at the lower end of the display panel, and 3-chips on film are connected to the plurality of side wiring pads. Therefore, the size of the structure connecting the wiring pads of the display panel to the 3-chips on film when viewed from the front of the display panel can be reduced.

[0029] Furthermore, in the case of the display device according to the embodiments of the present disclosure, the gate ICs for controlling the plurality of thin-film transistors are not arranged at the top, left, and right ends of the display panel, such that the width of each of the top, left, and right borders covering the top, left, and right ends of the display panel can be reduced more than the width of the bottom border.

[0030] Therefore, in the case of a display device according to an embodiment of the present disclosure, since each of the four side bezels is formed to have a width of 1 mm or less, the user may feel that the four sides of the display device seem to be infinitely extended. Attached Figure Description

[0031] Figure 1 This is a view showing a display device with narrow bezels on three sides;

[0032] Figure 2 It shows Figure 1 A partial view of the display panel of the display device;

[0033] Figure 3 This shows the removal of the display driver circuitry. Figure 2 A perspective view of the display panel;

[0034] Figure 4 This is a partial cross-sectional view showing the state in which the display panel of the display device is connected to the display driving circuit;

[0035] Figure 5 This is a view showing three chips on a film used in a display device according to an embodiment of the present disclosure;

[0036] Figure 6 This is a view showing a display device according to an embodiment of the present disclosure;

[0037] Figure 7 This is a perspective view showing the state in which the three chips on the film are arranged on the display panel of a display device according to an embodiment of the present disclosure;

[0038] Figure 8 yes Figure 7 A side view of the display panel and the 3 chips on the film;

[0039] Figure 9 This is a perspective view showing the display panel of a display device according to an embodiment of the present disclosure;

[0040] Figure 10 This is a partial cross-sectional view showing the lower part of a display device according to an embodiment of the present disclosure;

[0041] Figure 11This is a partial view showing another example of a display panel of a display device according to an embodiment of the present disclosure;

[0042] Figure 12 This is a flowchart illustrating a method for manufacturing a display device according to embodiments of the present disclosure;

[0043] Figure 13a and Figure 13b This is a perspective view and a side view showing a side wiring pad film used in a method for manufacturing a display device according to an embodiment of the present disclosure;

[0044] Figure 14a and Figure 14b These are perspective and side views illustrating a method for manufacturing a display device according to embodiments of the present disclosure;

[0045] Figure 15a and Figure 15b These are perspective and side views illustrating a method for manufacturing a display device according to embodiments of the present disclosure;

[0046] Figure 16a and Figure 16b These are perspective and side views illustrating a method for manufacturing a display device according to embodiments of the present disclosure;

[0047] Figure 17a and Figure 17b These are perspective and side views illustrating another example of a display panel of a display device according to embodiments of the present disclosure. Detailed Implementation

[0048] The various embodiments described herein are illustrated by way of example to aid in understanding this disclosure, and it should be understood that this disclosure can be modified and implemented in ways different from those described herein. However, in the following description of this disclosure, detailed descriptions and specific illustrations of relevant known functions or components will be omitted where it is determined that such detailed descriptions may unnecessarily obscure the spirit of the disclosure. Furthermore, in the accompanying drawings, the dimensions of certain components may be arbitrarily enlarged for ease of understanding and are not drawn to scale.

[0049] Terms such as “first” and “second” can be used to describe different components, but these components are not limited by these terms. These terms may be used only to distinguish one component from other components. For example, without departing from the scope of this disclosure, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component.

[0050] Unless otherwise defined, the terms used in the embodiments of this disclosure may be interpreted as terms commonly known to those skilled in the art.

[0051] Furthermore, the terms "front end," "rear end," "upper side," "lower side," "top," and "bottom" used in this disclosure are defined with reference to the accompanying drawings. However, the shape and position of each component are not limited by these terms.

[0052] In the following, a display device according to an embodiment of the present disclosure will be described in detail with reference to the accompanying drawings.

[0053] Figure 1 This is a view showing a display device with narrow bezels on its three sides. Figure 1 A television (TV) is shown as an example of a display device.

[0054] Reference Figure 1 The display device 1 may include a display panel 10 and a housing 2 that houses the display panel 10.

[0055] The display panel 10 is arranged inside the housing 2, and the front surface of the display panel 10 forms a display portion on which the image is displayed.

[0056] An opening 2a is formed on the front surface of the housing 2, through which the display panel 10 is exposed. A frame 3 is formed around the opening 2a of the housing 2.

[0057] The border 3 includes an upper border 3a covering the upper end of the display panel 10, a left border 3b covering the left end of the display panel 10, a right border 3c covering the right end of the display panel 10, and a lower border 3d covering the lower end of the display panel 10.

[0058] The three side borders (i.e., the top border 3a, the left border 3b, and the right border 3c) have a narrow width W, but the bottom border 3d can have a wide width W1. For example, the width W of the three side borders 3a, 3b, and 3c is 0.5mm, while the width W1 of the bottom border 3d is 7.7mm.

[0059] The display panel 10 of the display device 1 having such a structure has, for example... Figure 2 and Figure 3 The structure shown.

[0060] In the following text, reference will be made to Figure 2 and Figure 3 The display panel 10 used in the display device 1 of FIG1 will be described in detail.

[0061] Figure 2 It shows Figure 1 A partial view of the display panel of the display device. Figure 3 This shows the removal of the display driver circuitry. Figure 2 A perspective view of the display panel.

[0062] Reference Figure 2and Figure 3 The display panel 10 may include a first substrate 11, a display layer 13, and a second substrate 12.

[0063] The first substrate 11 may be formed in a rectangular shape, including a top end, a left end, a right end, and a bottom end. The first substrate 11 may include a plurality of wiring pads 14 formed to extend to the bottom end of its front surface.

[0064] The first substrate 11 is a base substrate for supporting various components of the display panel 10, and can be formed of an insulating substrate. For example, the first substrate 11 can be formed of glass or plastic.

[0065] As another example, the first substrate 11 can be formed of a flexible material that can be bent. For example, the first substrate 11 can be formed of thin glass or polyimide (PI) with flexible properties.

[0066] The first substrate 11 can be formed as a thin-film transistor substrate having a plurality of thin-film transistors formed on its front surface. A plurality of wiring pads 14 can be formed at the lower part of the front surface of the first substrate 11 to electrically connect to the gate, source and drain of the plurality of thin-film transistors.

[0067] Specifically, the gates of the plurality of thin-film transistors do not extend to the left or right end of the first substrate 11, but extend to the lower end of the first substrate 11. Accordingly, the gate integrated circuit (IC) configured to control the gates of the plurality of thin-film transistors is not arranged at the left or right end of the first substrate 11.

[0068] The display layer 13 can be disposed on the front surface of the first substrate 11. The display layer 13 can form multiple pixels capable of displaying images. The display layer 13 can be formed in various ways depending on the type of display device 1.

[0069] For example, when the display device 1 is a liquid crystal display as described in this embodiment, the display layer 13 may be formed of a liquid crystal layer. However, the display device 1 according to this disclosure is not limited to this.

[0070] As another example, when the display device 1 is an organic light-emitting diode display, the display layer 13 may be formed by a plurality of organic light-emitting elements.

[0071] The second substrate 12 is disposed on the front surface of the display layer 13 and can be formed in a rectangular shape including a top end, a left end, a right end, and a bottom end. The top end, left end, and right end of the second substrate 12 are formed to coincide with the top end, left end, and right end of the first substrate 11. The bottom end 12b of the second substrate 12 is shorter than the bottom end 11b of the first substrate 11. In other words, as Figure 3As shown, the lower end 11b of the first substrate 11 is formed to extend longer than the lower end 12b of the second substrate 12, so that a plurality of wiring pads 14 disposed on the front surface of the first substrate 11 are exposed and are not covered by the second substrate 12.

[0072] Multiple wiring pads 14 on the front surface of the first substrate 11 can be electrically connected to a display driving circuit 30 configured to operate multiple thin-film transistors.

[0073] The display driving circuit 30 may include a film-on-film 3-chip 31 electrically connected to a plurality of wiring pads 14 and a printed circuit board 32 electrically connected to the film-on-film 3-chip 31.

[0074] In order to connect the plurality of wiring pads 14 on the front surface of the first substrate 11 to the on-film 3-chip 31, an anisotropic conductive film (ACF) 40 can be arranged between the plurality of wiring pads 14 and the on-film 3-chip 31.

[0075] Specifically, such as Figure 2 As shown, when the anisotropic conductive film 40 is attached to the front surface of the plurality of wiring pads 14 of the first substrate 11, and then the on-film 3-chip 31 is arranged on the front surface of the anisotropic conductive film 40, the plurality of wiring pads 14 of the first substrate 11 and the on-film 3-chip 31 can be electrically connected to each other.

[0076] In the following text, reference will be made to Figure 4 The display panel 10 and the display driving circuit 30 of the display device 1 are described in detail.

[0077] Figure 4 This is a partial cross-sectional view showing the state in which the display panel of the display device is connected to the display driving circuit.

[0078] Reference Figure 4 The display panel 10 may include a first substrate 11, a display layer 13, and a second substrate 12.

[0079] Multiple thin-film transistors 20 and pixel electrodes 24 can be disposed on the upper surface of the first substrate 11.

[0080] The color filter 15 can be disposed on the lower surface of the second substrate 12, and the common electrode 25 can be disposed below the color filter 15.

[0081] The display layer 13 can be disposed between the first substrate 11 and the second substrate 12. The display layer 13 can be formed as a liquid crystal layer. Therefore, the common electrode 25 can be disposed between the liquid crystal layer 13 and the color filter 15.

[0082] For example, a gate electrode 21 may be formed on a first substrate 11, and a gate insulating layer 26 may be formed on the gate electrode 21. A semiconductor layer 27 may be formed on the upper side of the gate insulating layer 26 corresponding to the gate electrode 21, and a source electrode 22 and a drain electrode 23 may be formed on the upper side of the semiconductor layer 27 at intervals from each other.

[0083] The gate electrode 21, semiconductor layer 27, source electrode 22, and drain electrode 23 can constitute a thin-film transistor (TFT) 20. Although Figure 4 A thin-film transistor 20 with a bottom gate structure is shown, but this disclosure is not limited thereto. For example, the thin-film transistor 20 may be formed in a top gate structure.

[0084] A protective layer 28 can be formed on the upper side of the thin film transistor 20, and a pixel electrode 24 connected to the drain electrode 23 can be formed on the upper side of the protective layer 28.

[0085] The common electrode 25 can be formed on the upper side of the pixel electrode 24. As an example, the liquid crystal layer 13 can be disposed between the pixel electrode 24 and the common electrode 25.

[0086] The color filter 15 can be formed on the upper side of the common electrode 25.

[0087] When the thin-film transistor 20 is turned on according to the gate signal applied to the gate electrode 21, the data signal is applied to the pixel electrode 24 through the thin-film transistor 20, thereby generating an electric field between the pixel electrode 24 and the common electrode 25. Then, the plurality of liquid crystal molecules in the liquid crystal layer 13 rearrange according to the electric field, so that the corresponding pixel can display the gray level corresponding to the data signal.

[0088] The thin-film transistor 20, pixel electrode 24, and common electrode 25 can each extend through the conductive lines and can be electrically connected to a plurality of wiring pads 14 on the first substrate 11.

[0089] The polarizing layer 50 can be disposed on the upper surface of the display panel 10. For example, the polarizing layer 50 can be disposed on the upper surface of the second substrate 12. The polarizing layer 50 can be formed of a polarizing film.

[0090] However, this is just an example, and the polarization layer 50 can be formed on both the upper and lower surfaces of the display panel 10. For example, the polarization layer 50 can be disposed on the lower surface of the first substrate 11 and the upper surface of the second substrate 12.

[0091] The display panel 10 can be electrically connected to the display driver circuit 30.

[0092] The first substrate 11 of the display panel 10 may include a plurality of gate lines extending in a first direction, such as in the horizontal direction (row direction). In addition, the first substrate 11 may include a plurality of data lines extending in a second direction perpendicular to the first direction, such as in the vertical direction (column direction).

[0093] Therefore, each of the multiple gate lines and multiple data lines that intersect at right angles can define a pixel.

[0094] Each pixel of the display panel 10 may include a thin-film transistor 20, liquid crystal, and a color filter. As an example, each pixel may include three sub-pixels, each displaying red, green, and blue.

[0095] The display driving circuit 30 may include a timing controller 37, a gate driver, and a data driver.

[0096] The timing controller 37 can receive image data and control signals, such as vertical synchronization signals, horizontal synchronization signals, master clock signals, and data enable signals, from the main circuit board 60 of the control display device 1.

[0097] The timing controller 37 can generate data control signals (DCS) for controlling the data driver based on the input control signals. For example, the data control signals (DCS) may include a source start pulse (SSP), a source sampling clock (SSC), a source output enable signal (SOE), a polarity signal (POL), etc.

[0098] In addition, the timing controller 37 can receive image data, align it, and send it to the data drive.

[0099] The timing controller 37 can generate a gate control signal (GCS) for controlling the gate driver in response to a control signal.

[0100] The data driver can provide data voltages to multiple data lines in response to data control signals (DCS) and image data. As an example, the data driver can be implemented using a source IC34 (see [link to implementation details]). Figure 5 ).

[0101] The gate driver can sequentially select multiple gate lines in response to a gate control signal (GCS) provided from the timing controller 37 and output a turn-on voltage to the selected gate line. The thin-film transistor 20 connected to the corresponding gate line can be turned on by the turn-on voltage. As an example, the gate driver can be implemented as a gate IC 33 (see...). Figure 5 ).

[0102] In the case of this embodiment, such as Figure 5 As shown, a gate IC 33 and two source ICs 34 are arranged on the film 35 to form a 3-chip-on-film 31. Figure 5 This is a view showing three chips on a film used in a display device according to an embodiment of the present disclosure.

[0103] The timing controller 37 can be arranged on the circuit board 32. The circuit board 32 can be electrically connected to the three chips 31 on the membrane. As an example, the circuit board 32 can be formed of a flexible circuit board with bendability.

[0104] When the display device 1 is incorporated as a liquid crystal display, the display device 1 may include a backlight. The backlight is used to provide light to the display panel 10. Cold cathode fluorescent lamps (CCFLs), external electrode fluorescent lamps (EEELs), light-emitting diodes (LEDs), etc., can be used as the light source for the backlight.

[0105] In the following text, reference will be made to Figure 6 A detailed description of the display device 1 according to an embodiment of the present disclosure.

[0106] Figure 6 This is a view showing a display device according to an embodiment of the present disclosure. Figure 6 A TV is shown as an example of a display device.

[0107] Reference Figure 6 The display device 100 may include a display panel 110 and a housing 102 that houses the display panel 110.

[0108] The display panel 110 is disposed inside the housing 102, and the front surface of the display panel 110 forms a display portion on which an image is displayed.

[0109] An opening 102a is formed on the front surface of the housing 102, through which the front surface of the display panel 110 is exposed. A frame 103 is formed around the opening 102a of the housing 102.

[0110] The border 103 may include an upper border 103a covering the upper end of the display panel 110, a left border 103b and a right border 103c covering the left and right ends of the display panel 110, and a lower border 103d covering the lower end of the display panel 110.

[0111] The four side borders (i.e., the top border 103a, the left border 103b, the right border 103c, and the bottom border 103d) can be formed with a narrow width W. For example, the width W of the four side borders 103 can be formed to be 1 mm or less.

[0112] As an example, the width W2 of the bottom border 103d can be slightly wider than the width W of the other three borders 103a, 103b, and 103c. For example, the width W of the three side borders 103a, 103b, and 103c can be 0.5mm, while the width W2 of the bottom border 103d can be 1mm.

[0113] The display panel 110 of the display device 100 having such a structure has, for example... Figures 7 to 9 The structure shown.

[0114] In the following text, reference will be made to Figures 7 to 9 For Figure 6 The display panel 110 used in the display device 100 will be described in detail.

[0115] Figure 7 This is a perspective view showing the state in which three chips on a film are arranged on a display panel of a display device according to an embodiment of the present disclosure. Figure 8 yes Figure 7 The side view of the display panel and the 3 chips on the film. Figure 9 This is a perspective view showing the display panel of a display device according to an embodiment of the present disclosure.

[0116] Reference Figures 7 to 9 The display panel 110 may include a first substrate 111, a display layer 113, and a second substrate 112.

[0117] The first substrate 111 may be formed in a rectangular shape to include an upper end 111a, a left end, a right end 111d, and a lower end 111b. The first substrate 111 may include a plurality of wiring pads 114 formed to extend to the lower end of its front surface.

[0118] The first substrate 111 is a base substrate for supporting various components of the display panel 110, and may be formed of an insulating substrate. For example, the first substrate 111 may be formed of glass or plastic.

[0119] As another example, the first substrate 111 can be formed of a flexible material that can be bent. For example, the first substrate 111 can be formed of thin glass or polyimide (PI) with flexible properties.

[0120] The first substrate 111 can be formed as a thin-film transistor substrate having a plurality of thin-film transistors formed on its front surface. A plurality of wiring pads 114 can be formed at the lower part of the front surface of the first substrate 111 to electrically connect to the gate, source and drain of the plurality of thin-film transistors.

[0121] Specifically, the gates of the plurality of thin-film transistors can be formed to extend to the lower end 111b of the first substrate 111, but not to one side of the first substrate 111, i.e., not to the left and right ends 111d of the first substrate 111. Therefore, the gate IC configured to control the gates of the plurality of thin-film transistors is not disposed on the left or right end 111d of the first substrate 111.

[0122] The display layer 113 may be disposed on the front surface of the first substrate 111. The display layer 113 may form a plurality of pixels capable of displaying an image. The display layer 113 may be formed in various ways depending on the type of the display device 100. For example, when the display device 100 is a liquid crystal display as described in this embodiment, the display layer 113 may be formed of a liquid crystal layer. However, the display device 100 according to this disclosure is not limited thereto.

[0123] As another example, when the display device 100 is implemented as an organic light-emitting diode display, the display layer 113 may be formed by a plurality of organic light-emitting elements.

[0124] The second substrate 112 is disposed on the front surface of the display layer 113 and can be formed in a rectangular shape to include an upper end 112a, a left end 112c, a right end 112d, and a lower end 112b.

[0125] The upper end 112a, left end 112c, and right end 112d of the second substrate 112 are formed to coincide with the upper end 111a, left end, and right end 111d of the first substrate 111. The lower end 112b of the second substrate 112 is shorter than the lower end 111b of the first substrate 111. In other words, the lower end 111b of the first substrate 111 can be formed to extend longer than the lower end 112b of the second substrate 112, so that the plurality of wiring pads 114 disposed on the front surface of the first substrate 111 are exposed and not covered by the second substrate 112.

[0126] Multiple side wiring pads 120 can be disposed on the lower end of the display panel 110. For example, multiple side wiring pads 120 can be arranged on the lower end 111b of the first substrate 111 and the lower end 112b of the second substrate 112, and can be formed as multiple wiring pads 114 contacting the first substrate 111.

[0127] Multiple side wiring pads 120 can be arranged to be spaced apart at regular intervals in the longitudinal direction of the display panel 110. Specifically, as... Figure 9 As shown, each of the plurality of side wiring pads 120 can be formed to have a length corresponding to the thickness of the display panel 110. Therefore, each side wiring pad 120 can have a length corresponding to the sum of the thickness of the lower end 111b of the first substrate 111, the thickness of the lower end of the display layer 113, and the thickness of the lower end 112b of the second substrate 112.

[0128] The side wiring pad 120 can be formed in a shape that, after being bent twice, corresponds to the step at the lower end of the display panel 110. In other words, the side wiring pad 120 can be formed as one end 114a of the wiring pad 14 that contacts the first substrate 11 (see...). Figure 10 ) and upper surface 114b (see Figure 10 ).

[0129] For example, the side wiring pad 120 may include a first pad portion 121 that contacts the lower end 111b of the first substrate 11 and an end 114a of the wiring pad 114, a second pad portion 122 that contacts the upper surface 114b of the wiring pad 114 of the first substrate 111, and a third pad portion 123 that contacts the lower end 112b of the second substrate 112.

[0130] Therefore, the side wiring pad 120 contacts the upper surface 114b and an end 114a of the wiring pad 114 of the first substrate 111 that are not covered by the second substrate 112, thereby widening the contact area between the side wiring pad 120 and the wiring pad 114.

[0131] Multiple side-wire pads 120 may be formed of conductive paste. For example, multiple side-wire pads 120 may be formed of silver paste. However, the material of the side-wire pads 120 is not limited to this. For example, the side-wire pads 120 may be formed of conductive paste containing at least one of silver (Ag), copper (Cu), gold (Au), and aluminum (Al).

[0132] As an example, multiple side wiring pads 120 can be formed by thermally transferring multiple side wiring pads formed of silver paste on a plastic film to the lower end of the display panel 110 (i.e., the lower end 111b of the first substrate 111 and the lower end 112b of the second substrate 112). The plastic film can be formed of polyethylene terephthalate (PET).

[0133] Multiple side wiring pads 120 disposed on the lower end of the display panel 110 can be electrically connected to a display driving circuit 130 configured to operate multiple thin-film transistors of the first substrate 111.

[0134] The display driver circuit 130 may include a 3-on-film chip 131 electrically connected to a plurality of side wiring pads 120 and a printed circuit board electrically connected to the 3-on-film chip 131.

[0135] The on-film 3-chip 131 and printed circuit board of the display driving circuit according to this embodiment are the same as the on-film 3-chip 31 and printed circuit board 32 of the display driving circuit 30 of the display device 1 described above; therefore, their detailed description is omitted.

[0136] In order to connect the multiple side wiring pads 120 on the lower end of the display panel 110 to the on-film 3-chip 131, an anisotropic conductive film (ACF) 140 can be arranged between the multiple side wiring pads 120 and the on-film 3-chip 131.

[0137] Specifically, such as Figure 7 and Figure 8As shown, when the anisotropic conductive film 140 is attached to the lower surface of the plurality of side wiring pads 120 of the display panel 110 and the on-film 3-chip 131 is arranged on the lower surface of the anisotropic conductive film 140, the side wiring pads 120 and the on-film 3-chip 131 of the display panel 110 can be electrically connected to each other.

[0138] In this configuration, the anisotropic conductive film 140 can be formed to flatten the lower end of the display panel 110. For example, the anisotropic conductive film 140 can be formed to fill the step of the side wiring pad 120. In other words, the first portion 141 of the anisotropic conductive film 140 corresponding to the first pad portion 121 of the side wiring pad 120 can be formed thinly, and the second portion 142 of the anisotropic conductive film 140 corresponding to the third pad portion 123 of the side wiring pad 120 can be formed to be thicker than the first portion 141.

[0139] When the anisotropic conductive film 140 is formed in this manner, the three chips 131 on the film can be stably arranged on the lower end of the display panel 110.

[0140] The black matrix 150 can be disposed at the front end of the side wiring pad 120, the anisotropic conductive film 140, and the on-film 3-chip 131. The black matrix 150 can be configured to cover the side wiring pad 120, the anisotropic conductive film 140, and the on-film 3-chip 131. The black matrix 150 can be formed from black ink. The black matrix 150 of the display panel 110 can be covered by the bezel 103d (see...). Figure 10 ).

[0141] Figure 10 This is a partial cross-sectional view showing the lower part of a display device according to an embodiment of the present disclosure.

[0142] Reference Figure 10 The side wiring pads 120, anisotropic conductive film 140, and on-film 3-chip 131 arranged on the lower end of the display panel 110 can be covered by the housing 102. Specifically, the black matrix 150 of the display panel 110 can be covered by the lower border 103d of the housing 102.

[0143] Since the on-film 3-chip 131 is formed to be flexible, the on-film 3-chip 131 can be accommodated inside the housing 102 while bending toward the rear side of the display panel 110.

[0144] Furthermore, the three chips 131 on the film can be electrically connected to a printed circuit board. The printed circuit board can be equipped with a timing controller for controlling the gate IC and source IC of the three chips 131 on the film. As an example, the printed circuit board can be formed as a flexible printed circuit board. The printed circuit board can be electrically connected to a main circuit configured to control the display device 100.

[0145] As described above, when multiple side wiring pads 120 are formed on the lower end of the display panel 110 and the display driving circuit 130 is connected to the side wiring pads 120, the width W2 of the lower bezel 103d can be reduced. For example, in the case of the display device 100 according to this embodiment, the width W2 of the lower bezel 103d can be reduced to 1 mm or less.

[0146] Although this disclosure describes an embodiment in which a step exists at the lower end of the display panel 110, this disclosure is not limited thereto. As another example, the step may not be formed at the lower end of the display panel. Referring below... Figure 11 Describes a display panel 110′ without steps.

[0147] Figure 11 This is a partial view showing another example of a display panel of a display device according to an embodiment of the present disclosure.

[0148] Reference Figure 11 The display panel 110' may include a first substrate 111', a display layer 113, and a second substrate 112.

[0149] Unlike the display panel 110 according to the above embodiment, the display panel 110′ according to this embodiment is formed such that the lower end 111′b of the first substrate 111 coincides with the lower end 112b of the second substrate 112. In other words, the lower end 111′b of the first substrate 111 and the lower end 112b of the second substrate 112 are formed to form the same plane.

[0150] Accordingly, the upper surfaces of the plurality of wiring pads 114 formed on the front surface of the first substrate 111' are not exposed to the outside, and only one end 114a of the plurality of wiring pads 114 is exposed to the outside.

[0151] Multiple side wiring pads 120' are disposed on the lower end of the display panel 110'. The multiple side wiring pads 120' are formed as an end 114a of multiple wiring pads 114 that contact the first substrate 111'.

[0152] Unlike the side wiring pad 120 according to the foregoing embodiment, the side wiring pad 120' can be formed in a flat plate shape without any bends. An anisotropic conductive film 140' is disposed on the lower surface of the side wiring pad 120'. Unlike the anisotropic conductive film 140 according to the foregoing embodiment, the anisotropic conductive film 140' can be formed in a flat plate shape without any steps. On-film 3-chip 131 can be disposed on the lower surface of the anisotropic conductive film 140'.

[0153] The black matrix 150 can be disposed at the front end of the side wiring pad 120', the anisotropic conductive film 140', and the on-film 3-chip 131.

[0154] like Figure 11 As shown, when the lower end of the display panel 110' is formed flat, one end 114a of the plurality of wiring pads 114' of the first substrate 111' contacts the plurality of side wiring pads 120'.

[0155] Therefore, compared with the contact area between the wiring pad 114 and the side wiring pad 120′ of the display panel 110 according to the above embodiment, the contact area between the wiring pad 114 and the side wiring pad 120′ can be reduced.

[0156] Accordingly, with Figure 11 Compared to the display panel 110' shown, the display panel 110 with the steps as in the aforementioned embodiment has a stable and reliable electrical connection between the wiring pad 114 and the side wiring pad 120.

[0157] In the following text, reference will be made to Figures 12 to 16b A method for manufacturing a display device according to embodiments of the present disclosure is described in detail.

[0158] Figure 12 This is a flowchart illustrating a method for manufacturing a display device according to embodiments of the present disclosure. Figure 13a and Figure 13b These are perspective and side views showing a side wiring pad film used in a method for manufacturing a display device according to an embodiment of the present disclosure. Figure 14a and Figure 14b These are perspective and side views illustrating a method for manufacturing a display device according to an embodiment of the present disclosure. Figure 15a and Figure 15b These are perspective and side views illustrating a method for manufacturing a display device according to an embodiment of the present disclosure. Figure 16a and Figure 16b These are perspective and side views illustrating a method for manufacturing a display device according to an embodiment of the present disclosure.

[0159] First, a display panel 110 is fabricated (S121). In other words, a display panel 110 comprising a first substrate 111, a display layer 113, and a second substrate 112 is fabricated.

[0160] As an example, step 117 may be formed at the lower end of display panel 110. Specifically, the first substrate 111 of display panel 110 may be formed in a rectangular shape including an upper end, a left end, a right end and a lower end 111b, and may include a plurality of wiring pads 114 extending to the lower end 111b.

[0161] The display layer 113 can be disposed on the upper surface of the first substrate 111.

[0162] The second substrate 112 is disposed on the upper surface of the display layer 113, and may include an upper end, a left end, and a right end that coincide with the upper end, left end, and right end of the first substrate 111, and a lower end 112b that is shorter than the lower end 111b of the first substrate 111. In other words, a step 117 may be formed between the lower end 112b of the second substrate 112 and the lower end 111b of the first substrate 111. Accordingly, a plurality of wiring pads 114 of the first substrate 111 may be exposed on one side of the lower end 112b of the second substrate 112.

[0163] Next, the side wiring pad film is prepared (S122). When preparing the display panel 110 as described above, the side wiring pad film 170 can be formed in another process.

[0164] like Figure 13a and Figure 13b As shown, multiple side wiring pads 172 can be formed on one surface of the side wiring pad film 170.

[0165] The method for manufacturing the side wiring pad film 170 will be described in detail below.

[0166] First, a plastic film 171 with dimensions corresponding to the lower end of the display panel 110 is prepared. The plastic film 171 can be formed of a flexible material. For example, the plastic film 171 can be formed of polyethylene terephthalate (PET).

[0167] Next, a conductive paste is applied to one surface of the plastic film 171. As an example, silver paste can be used as the conductive paste. However, the conductive paste is not limited to this. For example, the conductive paste may include at least one of silver (Ag), copper (Cu), gold (Au), and aluminum (Al).

[0168] Subsequently, the conductive paste is patterned using photolithography, so that multiple side wiring pads 172 are formed on one surface of the plastic film 171.

[0169] When the side wiring pad film 170 is fabricated, a plurality of side wiring pads 172 of the side wiring pad film 170 are transferred to the lower end of the display panel 110 (S123). Specifically, the method for transferring the plurality of side wiring pads 172 to the lower end of the display panel 110 is as follows.

[0170] First, such as Figure 14a and Figure 14b As shown, the side wiring pad film 170 is placed at the lower end of the display panel 110, such that a plurality of side wiring pads 172 contact the lower end of the display panel 110. Then, the side wiring pads 172 of the side wiring pad film 170 contact one end 114a of the wiring pads 114 of the first substrate 11.

[0171] Next, the side wiring pad film 170 is bent so that the upper and lower parts of the side wiring pad film 170 cover the upper and lower surfaces of the display panel 110.

[0172] At this time, the side wiring pad film 170 is pressed down, causing the side wiring pad film 170 to bend in response to the step 117 of the display panel 110. Then, the plurality of side wiring pads 172 of the side wiring pad film 170 come into contact with the upper surface 114b of the plurality of wiring pads 114 of the first substrate 111.

[0173] Then, as Figure 15a and Figure 15b As shown, the side wiring pad film 170 is bent in a manner corresponding to the step 117 of the display panel 110.

[0174] The task of bending the side wiring pad film 170 to correspond to the step 117 at the lower end of the display panel 110 can be performed using a bending tool or bending fixture.

[0175] When the bending of the side wiring pad film 170 is completed, heat is applied to the side wiring pad film 170 to transfer the plurality of side wiring pads 172 to the lower end of the display panel 110.

[0176] When the transfer of multiple side wiring pads 172 is completed, the plastic film 171 of the side wiring pad film 170 is removed from the lower end of the display panel 110.

[0177] Then, the curing is transferred to the multiple side wiring pads 172 at the lower end of the display panel 110 (S124). Then, as... Figure 16a and Figure 16b As shown, a plurality of cured side wiring pads 120 are formed on the lower end of the display panel 110. For reference, in this specification, reference numeral 172 denotes a side wiring pad formed on a side wiring pad film 170, and reference numeral 120 denotes a side wiring pad formed by transferring the side wiring pads 172 of the side wiring pad film 170 to the lower end of the display panel 110 and curing it.

[0178] According to the manufacturing method described above, each of the plurality of side wiring pads 120 is formed to be bent twice to correspond to the step 117 at the lower end of the display panel 110. In other words, the side wiring pad 120 is formed to contact one end 114a and the upper surface 114b of the wiring pad 114 of the first substrate 111.

[0179] Specifically, the side wiring pad 120 includes a first pad portion 121 that contacts the lower end 111b of the first substrate 111 and one end 114a of the wiring pad 114, a second pad portion 122 that contacts the upper surface 114b of the wiring pad 114 of the first substrate 111, and a third pad portion 123 that contacts the lower end 112b of the second substrate 112.

[0180] In this embodiment, the upper end of the side wiring pad 120 is formed at a position lower than the upper surface of the second substrate 112, and the lower end of the side wiring pad 120 is formed at a position higher than the lower surface of the first substrate 111. Therefore, the side wiring pad 120 can be arranged such that the upper end of the side wiring pad 120 does not protrude above the second substrate 112, and the lower end of the side wiring pad 120 does not protrude below the first substrate 111.

[0181] However, the length of each side wiring pad 120 is not limited to this. For example, the length of each side wiring pad 120 can be made greater than the thickness of the display panel 110.

[0182] As another embodiment, such as Figure 17a and Figure 17b As shown, the side wiring pad 120' can be formed such that the upper part of the side wiring pad 120' covers the upper surface of the second substrate 112 and the lower part of the side wiring pad 120' covers the lower surface of the first substrate 111. Here, Figure 17a and Figure 17b These are perspective and side views, respectively, showing another example of a display panel of a display device according to an embodiment of the present disclosure.

[0183] Figure 17a and Figure 17b The side wiring pad 120′ shown can be formed by the same or similar manufacturing method as described above.

[0184] As another example, the side wiring pad 120 can be configured such that the upper end of the side wiring pad 120 is at the same horizontal height as the upper surface of the second substrate 112 and the lower end of the side wiring pad 120 is at the same horizontal height as the lower surface of the first substrate 111.

[0185] Finally, the display driving circuit 130 is arranged on a plurality of side wiring pads 120 at the lower end of the display panel 110 (S125).

[0186] Specifically, the anisotropic conductive film 140 is attached to a plurality of side wiring pads 120 at the lower end of the display panel 110.

[0187] In this case, the anisotropic conductive film 140 can be formed such that the lower end of the display panel 110 is flat. In other words, the anisotropic conductive film 140 can be formed to have steps corresponding to the steps of the side wiring pads 120, such that the anisotropic conductive film 140 fills the space formed by the steps of the side wiring pads 120.

[0188] Specifically, the first portion 141 of the anisotropic conductive film 140, corresponding to the first pad portion 121 of the side wiring pad 120, can be formed in a thin manner, and the second portion 142 of the anisotropic conductive film 140, corresponding to the third pad portion 123 of the side wiring pad 120, can be formed in a thick manner. In other words, the first portion 141 and the second portion 142 of the anisotropic conductive film 140 can be formed as steps corresponding to the steps of the side wiring pad 120.

[0189] Next, the display driving circuit 130 is attached to the outer surface of the anisotropic conductive film 140. Specifically, three chips 131 on the film are attached to the outer surface of the anisotropic conductive film 140 (see...). Figure 7 and Figure 8 At this point, since the outer surface of the anisotropic conductive film 140 is formed in a plane without steps, the three chips 131 on the film can be easily attached.

[0190] Thus, when the on-film 3-chip 131 is attached to the outer surface of the anisotropic conductive film 140, the on-film 3-chip 131 is electrically connected to a plurality of wiring pads 114 of the first substrate 111. Therefore, the gate IC and source IC of the on-film 3-chip 131 can control the thin-film transistors of the first substrate 111.

[0191] The three chips 131 on the film can be electrically connected to a flexible printed circuit board.

[0192] In the case of the display device and manufacturing method of the present disclosure as described above, a plurality of side wiring pads are provided at the lower end of the display panel, and the on-film 3-chip 131 is connected to the plurality of side wiring pads. Therefore, the size of the structure connecting the wiring pads of the display panel to the on-film 3-chip when viewed from the front of the display panel can be reduced.

[0193] Accordingly, according to embodiments of this disclosure, the width of the lower bezel covering the lower part of the display panel of the display device can be reduced to 1 mm or less.

[0194] Furthermore, in the case of the display device according to the embodiments of the present disclosure, the gate IC for controlling the plurality of thin-film transistors is not arranged at the top, left and right ends of the display panel, so that the width of each of the top bezel, left bezel and right bezel covering the top, left and right ends of the display panel can be reduced to 0.5 mm or less.

[0195] Therefore, in the case of the display device according to the embodiments of this disclosure, each of the four side bezels is formed to have a width of 1 mm or less. Thus, the user may perceive that the four sides of the display device appear to extend infinitely. In particular, in the case of display devices such as TVs, the effect of the four sides appearing to extend infinitely may be more pronounced when the bezel widths of all four sides are narrow.

[0196] In the foregoing, although a TV has been described as an example of a display device, this disclosure is not limited thereto. This disclosure can be applied to various display devices having a large screen (e.g., a monitor).

[0197] This disclosure has been described by way of example. The terminology used herein is for descriptive purposes only and should not be construed in a limiting sense. Various modifications and changes can be made to this disclosure based on the foregoing. Accordingly, unless otherwise stated, this disclosure may be freely practiced within the scope of the claims.

Claims

1. A display device comprising: a first substrate having a rectangular shape, including an upper end, a left end, a right end, and a lower end, and further including a plurality of wiring pads extending to the lower end; a display layer disposed on a front surface of the first substrate; a second substrate disposed on a front surface of the display layer, the second substrate including an upper end, a left end, and a right end coinciding with the upper end, the left end, and the right end of the first substrate, and further including a lower end shorter than the lower end of the first substrate, wherein the second substrate is configured to expose the plurality of wiring pads of the first substrate relative to the first substrate; a plurality of side wiring pads disposed on the lower end of the first substrate and the lower end of the second substrate, wherein each respective side wiring pad is connected to a respective wiring pad of the plurality of wiring pads; and a display drive circuit connected to the plurality of side wiring pads, wherein the plurality of side wiring pads are bent to correspond to a step formed by the lower end of the first substrate and the lower end of the second substrate.

2. The display device of claim 1, further comprising: an anisotropic conductive film (ACF) arranged between the plurality of side wiring pads and the display drive circuit.

3. The display device of claim 1, wherein each wiring pad of the plurality of wiring pads includes an upper surface and an end portion, and wherein the upper surface and the end portion of each wiring pad of the plurality of wiring pads are in contact with at least one side wiring pad of the plurality of side wiring pads.

4. The display device of claim 1, wherein each side wiring pad of the plurality of side wiring pads includes a silver paste, and wherein the plurality of side wiring pads are formed by thermally transferring the plurality of side wiring pads from a plastic film to the lower end of the first substrate and the lower end of the second substrate.

5. The display device of claim 4, wherein the plastic film includes polyethylene terephthalate (PET).

6. The display device of claim 1, wherein the display drive circuit includes a plurality of 3-chip on film (COF), and wherein each 3-chip on film of the plurality of 3-chip on film includes a gate integrated circuit and a plurality of source integrated circuits.

7. The display device of claim 6, wherein the display drive circuit further includes a flexible printed circuit board connected to the plurality of 3-chip on film.

8. The display device of claim 1, wherein the display layer includes a liquid crystal layer, wherein the first substrate further includes a plurality of thin film transistors configured to operate the liquid crystal layer, and wherein the second substrate further includes a plurality of color filters.

9. The display device of claim 8, wherein each thin film transistor of the plurality of thin film transistors includes a gate electrode and a source electrode, and wherein the gate electrode and the source electrode of each thin film transistor of the plurality of thin film transistors are connected to a wiring pad of the plurality of wiring pads.

10. The display device of claim 1, further comprising: a bezel formed to cover an edge of the second substrate, wherein the bezel includes a lower bezel configured to cover the plurality of side wiring pads and the display driving circuit, and wherein a width of the lower bezel is 1 mm or less.

11. A method of manufacturing a display device, the method comprising: forming a display panel including a first substrate, a display layer, and a second substrate; preparing a side wiring pad film having a plurality of side wiring pads formed on a surface of the side wiring pad film; transferring the plurality of side wiring pads of the side wiring pad film to an edge of the display panel; curing the plurality of side wiring pads transferred to the edge of the display panel; and arranging a display driving circuit on the plurality of side wiring pads at the edge of the display panel, wherein the transferring the plurality of side wiring pads of the side wiring pad film to an edge of the display panel comprises: positioning the side wiring pad film on the edge of the display panel such that the plurality of side wiring pads contact the edge of the display panel; bending an upper portion and a lower portion of the side wiring pad film to conform to a shape of the edge of the display panel; transferring the plurality of side wiring pads to the edge of the display panel by applying heat to the side wiring pad film; and removing a plastic film of the side wiring pad film.

12. The method of claim 11, wherein the preparing a side wiring pad film having a plurality of side wiring pads formed on a surface of the side wiring pad film comprises: applying a conductive paste to one surface of a plastic film; and patterning the conductive paste by a photolithography process, thereby forming the plurality of side wiring pads from the conductive paste on the plastic film.

13. The method of claim 11, wherein the display panel is formed such that an edge of the first substrate is configured to extend beyond an edge of the second substrate, and a plurality of wiring pads of the first substrate are exposed to an outside, and wherein the bending an upper portion and a lower portion of the side wiring pad film to conform to a shape of the edge of the display panel further comprises: bending the side wiring pad film such that each respective side wiring pad of the plurality of side wiring pads of the side wiring pad film contacts an upper surface of a wiring pad of the plurality of wiring pads.

14. The method of claim 11, wherein the arranging a display driving circuit on the plurality of side wiring pads at the edge of the display panel comprises: attaching an anisotropic conductive film to the plurality of side wiring pads; and attaching the display driving circuit to an outer surface of the anisotropic conductive film.

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