A wideband three-dimensional butler matrix for generating a vortex wave

Abstract

This invention provides a broadband three-dimensional Butler matrix for generating vortex waves, comprising eight dielectric substrates, microstrip lines, a metal ground plane, 3dB directional couplers, phase shifters, and SMA connectors. A metal ground plane lies between two dielectric substrate layers, with trace layers above and below, each composed of microstrip lines, 3dB directional couplers, and phase shifters connected in a specific order. Four dielectric substrates are placed horizontally, and four are placed vertically, connected by SMA connectors. Blind slots are provided near the SMA connectors on the dielectric substrates to facilitate SMA connector grounding. The coupler of this invention achieves cross-layer coupling and exhibits broadband characteristics. The large number of ports and the three-dimensional structure avoid complex connections between components, facilitating design, fabrication, and assembly.

Description

Technical Field

[0001] This invention belongs to the field of microwave devices, specifically relating to a broadband three-dimensional Butler matrix for generating vortex waves, and particularly to a 16×16 port broadband three-dimensional Butler matrix capable of generating multimode vortex waves. Background Technology

[0002] In modern communication technology, existing spectrum resources and multiplexing methods can no longer meet the ever-increasing communication demands, creating an urgent need for an efficient wireless access method that can increase wireless throughput without expanding bandwidth. Vortex waves carrying orbital angular momentum have attracted significant attention in recent years to address this issue. Vortex waves exhibit orthogonality between different modes, allowing for the multiplexing of OAM waves with different mode values. Furthermore, feeding a uniform circular ring antenna array with a Butler matrix can generate multiple modes of vortex waves and their transformations, adapting to complex vortex wave generation scenarios.

[0003] In 2016, Wincza K et al. from Poland designed an 8×8 Butler matrix using a dual-layer microstrip coupling structure, achieving a relative bandwidth of 33%, amplitude imbalance of ±0.5dB, and phase imbalance of ±10°. In 2017, Chu HN from China incorporated a reconfigurable transmission line into a 4×4 Butler matrix. By adjusting the electrical length of the transmission line, the phase shift between different ports was altered, achieving 16 different phase differences by changing the feed port and adjusting the transmission line, scanning 16 directions using only a 4th-order Butler matrix. In 2020, Feng et al. from the University of Electronic Science and Technology of China designed an 8×8 Butler matrix for the 17–23 GHz frequency range with a bandwidth exceeding 30%. A transmission array was used to generate vortex waves, with the feed source being a circular phased array antenna. Integrating the Butler matrix with the phased array antenna allowed for the simultaneous generation of multiple OAM modes without any active modules. Butler matrices are mostly planar, and the feed network becomes more complex and difficult to design with an increased number of ports. Summary of the Invention

[0004] To address the aforementioned technical problems, this invention provides a broadband three-dimensional Butler matrix for generating vortex waves, enabling the generation of 0, ±1, ±2, ±3, ±4, ±5, ±6, ±7, and -8 modal vortex waves. The cross-layer coupling and three-dimensional structure avoid complex connection methods and achieve broadband design. This invention not only enables the generation of multiple modal vortex waves over broadband but also avoids complex connection methods based on the cross-layer coupling and three-dimensional structure.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0006] A broadband three-dimensional Butler matrix for generating vortex waves includes:

[0007] Eight dielectric boards, microstrip lines, metal ground planes, 3dB directional couplers, phase shifters, and SMA connectors;

[0008] Each dielectric substrate is made of two dielectric substrates laminated together, with a metal ground plane in the middle, and trace layers on the top and bottom, which are respectively composed of microstrip lines, 3dB directional couplers, and phase shifters connected in the order of 3dB directional couplers, phase shifters, 3dB directional couplers, and phase shifters.

[0009] The four media boards with the eight media board functions are placed horizontally, and the four media boards from top to bottom are media board 1, media board 2, media board 3 and media board 4. The other four media boards are placed vertically, and the four media boards from front to back are media board 5, media board 6, media board 7 and media board 8. The media boards are connected by SMA connectors.

[0010] Furthermore, the two adjacent ports of the input of the No. 1 dielectric board are respectively connected to two 3dB directional couplers. The two output ports of the two 3dB directional couplers are then connected to the microstrip line and the -67.5 degree phase shifter, and the microstrip line and the -22.5 degree phase shifter, respectively. The two adjacent output ports are respectively connected to two 3dB directional couplers. The two output ports of the 3dB directional couplers are then connected to the -45 degree phase shifter and the microstrip line, respectively. The four output ports have blind slots on the back of the microstrip line to facilitate the connection of the SMA connector to the metal ground plane. The four SMA connectors are connected to the four output ports and then connected to one input port of the No. 5, No. 6, No. 7, and No. 8 dielectric boards.

[0011] Furthermore, the two adjacent ports of the input of the No. 2 dielectric board are respectively connected to two 3dB directional couplers. The two output ports of the two 3dB directional couplers are then connected to the microstrip line and the -22.5 degree phase shifter, and the microstrip line and the -67.5 degree phase shifter, respectively. The two adjacent output ports are then connected to two 3dB directional couplers. The two output ports of the 3dB directional couplers are then connected to the -45 degree phase shifter and the microstrip line, respectively. The four output ports have blind slots on the back of the microstrip line to facilitate the connection of the SMA connector to the metal ground plane. The four SMA connectors are connected to the four output ports and then connected to one input port of the No. 5, No. 6, No. 7, and No. 8 dielectric boards.

[0012] Furthermore, the two adjacent ports of the input of the No. 3 dielectric board are respectively connected to two 3dB directional couplers. The two output ports of each 3dB directional coupler are then connected to a microstrip line and a -45 degree phase shifter, respectively. The two adjacent output ports are then connected to two 3dB directional couplers, and the two output ports of the 3dB directional couplers are then connected to a microstrip line. The four output ports have blind slots on the back of the microstrip line to facilitate the connection of the SMA connector to the metal ground plane. The four SMA connectors are connected to the four output ports, and then connected to one input port of the No. 5, No. 6, No. 7, and No. 8 dielectric boards.

[0013] Furthermore, the two adjacent ports of the input of the No. 4 dielectric board are respectively connected to two 3dB directional couplers. The two output ports of the two 3dB directional couplers are then connected to the microstrip line and the -90 degree phase shifter, respectively. The two adjacent output ports are then connected to two 3dB directional couplers. The two output ports of the 3dB directional couplers are then connected to the -90 degree phase shifter and the microstrip line, respectively. The four output ports have blind slots on the back of the microstrip line to facilitate the connection of the SMA connector to the metal ground plane. The four SMA connectors are connected to the four output ports and then connected to one input port of the No. 5, No. 6, No. 7, and No. 8 dielectric boards.

[0014] Furthermore, the two adjacent ports of the input of the No. 5 dielectric board are respectively connected to two 3dB directional couplers. The two output ports of the two 3dB directional couplers are then connected to the microstrip line and the -90 degree phase shifter, respectively. The two adjacent output ports are then connected to two 3dB directional couplers. The two output ports of the 3dB directional couplers are then connected to the -90 degree phase shifter and the microstrip line, respectively. The four input ports are connected to one output port of the No. 1, No. 2, No. 3, and No. 4 dielectric boards, respectively. The input ports have blind slots on the back of the microstrip line to facilitate the connection of the SMP connector to the metal ground plane. The four output ports have blind slots on the back of the microstrip line to facilitate the connection of the SMA connector to the metal ground plane.

[0015] Furthermore, the structure of the No. 6 medium board is the same as that of the No. 5 medium board, and the four input ports are connected to one output port of the No. 1, No. 2, No. 3, and No. 4 medium boards, respectively.

[0016] Furthermore, the structure of the No. 7 medium board is the same as that of the No. 5 medium board, and the four input ports are connected to one output port of the No. 1, No. 2, No. 3, and No. 4 medium boards, respectively.

[0017] Furthermore, the structure of the No. 8 medium board is the same as that of the No. 5 medium board, and the four input ports are connected to one output port of the No. 1, No. 2, No. 3, and No. 4 medium boards, respectively.

[0018] The advantages of this invention compared to the prior art are as follows:

[0019] (1) This invention proposes a broadband three-dimensional Butler matrix for generating vortex waves, which can realize the generation of multiple modal vortex waves in broadband.

[0020] (2) This invention proposes a broadband three-dimensional Butler matrix for generating vortex waves, which avoids complex connection methods based on cross-layer coupling structure and three-dimensional structure. Attached Figure Description

[0021] Figure 1 This is a front view schematic diagram of an embodiment of the present invention;

[0022] Figure 2 This is a top view schematic diagram of an embodiment of the present invention;

[0023] Figure 3 This is a top view of the upper surface of the dielectric substrate in Embodiment 1 of the present invention;

[0024] Figure 4 This is a top view of the lower surface of the dielectric substrate in Embodiment 1 of the present invention;

[0025] Figure 5 This is a top view of the metal floor in the middle of the dielectric plate in Embodiment 1 of the present invention;

[0026] Figure 6 This is a top view of the upper surface of the dielectric substrate in Embodiment 2 of the present invention;

[0027] Figure 7 This is a top view of the lower surface of the dielectric substrate in Embodiment 2 of the present invention;

[0028] Figure 8 This is a top view of the metal floor in the middle of the dielectric plate in Embodiment 2 of the present invention;

[0029] Figure 9 This is a top view of the upper surface of the dielectric substrate in Embodiment 3 of the present invention;

[0030] Figure 10 This is a top view of the lower surface of the dielectric substrate in Embodiment 3 of the present invention;

[0031] Figure 11 This is a top view of the metal floor in the middle of the dielectric plate in Embodiment 3 of the present invention;

[0032] Figure 12 This is a top view of the upper surface of the dielectric substrate in Embodiment 4 of the present invention;

[0033] Figure 13 This is a top view of the lower surface of the dielectric substrate in Embodiment 4 of the present invention;

[0034] Figure 14 This is a top view of the metal floor in the middle of the dielectric plate in Embodiment 4 of the present invention;

[0035] Figure 15 This is a schematic front view of the upper surface of the medium plate in Embodiment 5 of the present invention;

[0036] Figure 16 This is a schematic front view of the lower surface of the dielectric substrate in Embodiment 5 of the present invention;

[0037] Figure 17 This is a schematic front view of the metal floor in the middle of the dielectric board in Embodiment 5 of the present invention;

[0038] Figure 18 Reflection coefficient diagram for each input port;

[0039] Figure 19 Isolation diagram between ports;

[0040] Figure 201 shows the transmission coefficient curve of input port 101 of media board 201;

[0041] Figure 211 shows the phase difference between the output ports when input port 101 of the media board is input.

[0042] In the attached figures, the following labels are used:

[0043] 100: Plate 1, 200: Plate 2, 300: Plate 3, 400: Plate 4, 500: Plate 5, 600: Plate 6, 700: Plate 7, 800: Plate 8;

[0044] 101: Input port of the first media board

[0045] 102: Input port of media board No. 21

[0046] 103: Input port of media board No. 1 (third one)

[0047] 104: Input port of media board No. 41

[0048] 105: Output port of the first media board

[0049] 106: Output port of the second media board No. 1

[0050] 107: Output port of the third media board (No. 1)

[0051] 108: Output port of media board No. 41

[0052] 109: First 3dB directional coupler

[0053] 110: Second 3dB directional coupler

[0054] 111: First -67.5 degree phase shifter

[0055] 112: First -22.5 degree phase shifter

[0056] 113: First microstrip line

[0057] 114: Third 3dB directional coupler

[0058] 115: Fourth 3dB directional coupler

[0059] 116: First -45 degree phase shifter

[0060] 117: Second microstrip line

[0061] 118: Second -45 degree phase shifter

[0062] 119: Third microstrip line

[0063] 120: First Metal Floor

[0064] 121: First Blind Slot

[0065] 122: Cross-layer coupling structure

[0066] 201: Input port of the first and second media boards

[0067] 202: Input port of media board No. 2

[0068] 203: Input port of media board No. 2 (third one)

[0069] 204: Input port of media board No. 42

[0070] 205: Output port of the first and second media boards

[0071] 206: Output port of the second media board

[0072] 207: Output port of the third media board No. 2

[0073] 208: Output port of media board No. 42

[0074] 209: Fifth 3dB directional coupler

[0075] 210: Sixth 3dB directional coupler

[0076] 211: Second -22.5 degree phase shifter

[0077] 212: Second -67.5 degree phase shifter

[0078] 213: Fourth microstrip line

[0079] 214: Seventh 3dB Directional Coupler

[0080] 215: Eighth 3dB Directional Coupler

[0081] 216: Fifth microstrip line

[0082] 217: Third -45 degree phase shifter

[0083] 218: Sixth microstrip line

[0084] 219 Fourth - 45 degree phase shifter

[0085] 220: Second Metal Floor

[0086] 221: Second blind slot

[0087] 301: Input port of media board No. 3

[0088] 302: Input port of media board No. 2-3

[0089] 303: Input port of media board number 3

[0090] 304: Input port of media board #4 (No. 3)

[0091] 305: Output port of the first 3rd media board

[0092] 306: Output port of the second 3rd media board

[0093] 307: Output port of the third media board

[0094] 308: Output port of media board #4 (No. 3)

[0095] 309: Ninth 3dB Directional Coupler

[0096] 310: 10th 3dB Directional Coupler

[0097] 311: Fifth -45 degree phase shifter

[0098] 312: Sixth -45 degree phase shifter

[0099] 313: Seventh Microstrip Line

[0100] 314: Eleventh 3dB Directional Coupler

[0101] 315: Twelfth 3dB Directional Coupler

[0102] 316: Seventh - 45-degree phase shifter

[0103] 317: Eighth microstrip line

[0104] 318: Ninth Microstrip Line

[0105] 319: Second 0-degree phase shifter

[0106] 320: Third Metal Floor

[0107] 321: Third blind slot

[0108] 401: Input port of media board No. 4

[0109] 402: Input port of media board #2 (number 4)

[0110] 403: Input port of media board #3 (No. 4)

[0111] 404: Input port of media board #4

[0112] 405: Output port of the first 4th media board

[0113] 406: Output port of media board #2 (number 4)

[0114] 407: Output port of the third 4th media board

[0115] 408: Output port of media board number 4

[0116] 409: Thirteenth 3dB Directional Coupler

[0117] 410: Fourteenth 3dB Directional Coupler

[0118] 411: Third 0-degree phase shifter

[0119] 412: Fifth 0-degree phase shifter

[0120] 413: Tenth microstrip line

[0121] 414: Fifteenth 3dB Directional Coupler

[0122] 415: Sixteenth 3dB Directional Coupler

[0123] 416: Eleventh Microstrip Line

[0124] 417: Second -90 degree phase shifter

[0125] 418: Twelfth Microstrip Line

[0126] 419: Third -90 degree phase shifter

[0127] 420: Fourth Metal Floor

[0128] 421: Fourth blind slot

[0129] 501: Input port of media board No. 5

[0130] 502: Input port of media board #2 (No. 5)

[0131] 503 Third: Input port of media board #5

[0132] 504: Input port of media board #4 (No. 5)

[0133] 505: Output port of the first 5th media board

[0134] 506: Output port of media board #2 (number 5)

[0135] 507: Output port of the third 5th media board

[0136] 508: Output port of media board #4 (No. 5)

[0137] 509: Seventeenth 3dB Directional Coupler

[0138] 510: The Eighteenth 3dB Directional Coupler

[0139] 511: Fourth 0-degree phase shifter

[0140] 512: Sixth 0-degree phase shifter

[0141] 513: The Thirteenth Microstrip Line

[0142] 514: The Nineteenth 3dB Directional Coupler

[0143] 515: Twentieth 3dB Directional Coupler

[0144] 516: The Fourteenth Microstrip Line

[0145] 517: Fourth -90 degree phase shifter

[0146] 518: The Fifteenth Microstrip Line

[0147] 519: Fifth - 90 degree phase shifter

[0148] 520: The Fifth Metal Floor

[0149] 521: The Fifth Blind Spot Detailed Implementation

[0150] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the scope of the invention. Figure 1The diagram shown is a front view schematic of an embodiment of the present invention. Medium substrate 100, medium substrate 200, medium substrate 300, and medium substrate 400 are placed horizontally and connected to medium substrate 500, medium substrate 600, medium substrate 700, and medium substrate 800 placed vertically on the right side via SMA adapters. The spacing between medium substrate 100 and medium substrate 200 is H1 = 25mm; the spacing between medium substrate 200 and medium substrate 300 is H2 = 19.5mm; and the spacing between medium substrate 300 and medium substrate 400 is H1 = 25mm.

[0151] like Figure 2 As shown, this is a top view schematic diagram of an embodiment of the present invention. Medium substrates 500, 600, 700, and 800 are placed vertically and connected to medium substrates 100, 200, 300, and 400 placed horizontally on the left via SMA adapters. The spacing between medium substrates 500 and 600 is H1 = 25mm; the spacing between medium substrates 600 and 700 is H2 = 19.5mm; and the spacing between medium substrates 700 and 800 is H1 = 25mm.

[0152] like Figure 3 and 4 As shown, this is a top view of the upper surface of dielectric substrate 100 according to Embodiment 1 of the present invention. The dielectric constant ε of dielectric substrate 100 is... r=2.2, length L = 135.5mm, width W = 119.5mm, thickness h = 1.016mm. There are four input ports on the left side: first substrate input port 101, second substrate input port 102, third substrate input port 103, and fourth substrate input port 104. The spacing d1 between first substrate input ports 101 and second substrate input ports 102, the spacing d2 between third substrate input ports 103 and fourth substrate input ports 104 is 25mm, and the spacing d2 between second substrate input ports 102 and third substrate input ports 103 is 19.5mm. First substrate input ports 101 and second substrate input ports 102 are connected to the first 3dB directional coupler 109, and third substrate input ports 103 and fourth substrate input ports 104 are connected to the second 3dB directional coupler 110. The lower output port of coupler 109 is connected to the first microstrip line 113, and the upper output port is connected to the first -67.5 degree phase shifter 111. The rectangular patch in the first -67.5 degree phase shifter 111 has a length l3 = 5.9 mm, a width w3 = 5.87 mm, and a distance L3 = 3 mm from the cross-layer coupling structure. The upper output port of the second 3dB directional coupler 110 is connected to the first microstrip line 113, and the lower output port is connected to the first -22.5 degree phase shifter 112. The rectangular patch in the first -22.5 degree phase shifter 112 has a length l1 = 4 mm, a width w1 = 4.1 mm, and a distance L1 = 2.5 mm from the cross-layer coupling structure. The first -67.5 degree phase shifter 111 and the first microstrip line 113 are partially connected to the third 3dB directional coupler 114 on the upper surface of dielectric substrate 100. The first -22.5 degree phase shifter 112 and the first microstrip line 113 are partially connected to the fourth 3dB directional coupler 115 on the lower surface of dielectric substrate 100. The lower output port of the third 3dB directional coupler 114 is connected to the second microstrip line 117, and the upper output port is connected to the first -45 degree phase shifter 116. The first -45 degree phase shifter 116 has a length l2 = 5.12 mm, a width w2 = 4.81 mm, and a distance L2 = 2.47 mm from the cross-layer coupling structure. The lower output port of the fourth 3dB directional coupler 115 is connected to the third microstrip line 119, and the upper output port is connected to the second -45 degree phase shifter 118. The second -45 degree phase shifter 118 has a length l2 = 5.12 mm, a width w2 = 4.81 mm, and a distance L2 = 2.47 mm from the cross-layer coupling structure. The first -45 degree phase shifter 116 is connected to: the first dielectric substrate output port 105; the second microstrip line 117 is connected to the second dielectric substrate output port 106; the second -45 degree phase shifter 118 is connected to the third dielectric substrate output port 107; and the third microstrip line 119 is connected to the fourth dielectric substrate output port 108.The spacing between the output ports 105, 106, 107, and 108 of the first, second, and third dielectric substrates is d1 = 25 mm. The spacing between the output ports 106 and 107 is d2 = 19.5 mm. Each microstrip line structure at the output ports has a first blind slot 121 on its back to facilitate connection between the SMA adapter and the first metal ground plane 120. The blind slot has a length of 1m = 6 mm and a width of wm = 12 mm. Both the 3dB directional coupler and the phase shifter contain a cross-layer coupling structure 122. The portion of the cross-layer coupling structure 122 above and below the first dielectric substrate 100 adopts a sine function curve, with a length of lx = 9.2 mm and half its width ly = 3 mm. The linewidth of the microstrip line, the 3dB directional coupler, and the phase shifter is d = 1.5 mm.

[0153] like Figure 5 As shown, this is a top view schematic diagram of the intermediate metal floor of dielectric plate No. 1 in Embodiment 1 of the present invention. Dielectric plate No. 1 100 is formed by pressing two dielectric plates with a thickness of 0.508mm together, with a first metal floor 120 in the middle, and a part of a cross-layer coupling structure 122. The cross-layer coupling structure 122 adopts a sin function curve in the grooved part of the first metal floor 120, with a length lx2 = 9.75mm, half of the width ly2 = 3.9mm, and a turning part width ws = 3.3mm.

[0154] like Figure 6 and 7 As shown, this is a top view of the upper surface of dielectric substrate 200 in Embodiment 2 of the present invention. The dielectric constant ε of dielectric substrate 200 is... r=2.2, length L=135.5mm, width W=119.5mm, thickness h=1.016mm. There are 4 input ports on the left side: first 2nd medium board input port 201, second 2nd medium board input port 202, third 2nd medium board input port 203, and fourth 2nd medium board input port 204. The spacing d1 between the first 2nd medium board input ports 201 and 202, and between the third 2nd and fourth 2nd medium board input ports 203 and 204 is 25mm. The spacing d2 between the second 2nd and third 2nd medium board input ports 202 and 203 is 19.5mm. The first 2nd and second 2nd medium board input ports 201 and 202 are connected to the fifth 3dB directional coupler 209, respectively. The third 2nd and fourth 2nd medium board input ports 203 and 204 are connected to the fifth 3dB directional coupler 209, respectively. The board input port 204 is connected to the sixth 3dB directional coupler 210. The lower output port of the fifth 3dB directional coupler 209 is connected to the fourth microstrip line 213, and the upper output port is connected to the second -22.5 degree phase shifter 211. The rectangular patch in the second -22.5 degree phase shifter 211 has a length l1 = 4mm, a width w1 = 4.1mm, and a distance L1 = 2.5mm from the cross-layer coupling structure. The upper output port of the sixth 3dB directional coupler 210 is connected to the fourth microstrip line 213, and the lower output port is connected to the second -67.5 degree phase shifter 212. The rectangular patch in the second -67.5 degree phase shifter 212 has a length l3 = 5.9mm, a width w3 = 5.87mm, and a distance L3 = 3mm from the cross-layer coupling structure. The -22.5 degree phase shifter 211 and the fourth microstrip line 213 are partially connected to the seventh 3dB directional coupler 214 on the upper surface of the second dielectric substrate 200. The second -67.5 degree phase shifter 212 and the fourth microstrip line 213 are partially connected to the eighth 3dB directional coupler 215 on the lower surface of the second dielectric substrate 200. The upper output port of the third 3dB directional coupler 114 is connected to the fifth microstrip line 216, and the lower output port is connected to the third -45 degree phase shifter 217. The third -45 degree phase shifter 217 has a length l2 = 5.12 mm, a width w2 = 4.81 mm, and a distance L2 = 2.47 mm from the cross-layer coupling structure. The upper output port of the eighth 3dB directional coupler 215 is connected to the sixth microstrip line 218, and the lower output port is connected to the fourth -45 degree phase shifter 219. The fourth -45 degree phase shifter 219 has a length l2 = 5.12 mm, a width w2 = 4.81 mm, and a distance L2 = 2.47 mm from the cross-layer coupling structure. The fifth microstrip line 216 is connected to the first dielectric substrate output port 205, the third -45 degree phase shifter 217 is connected to the second dielectric substrate output port 206, the sixth microstrip line 218 is connected to the third dielectric substrate output port 207, and the fourth -45 degree phase shifter 219 is connected to the fourth dielectric substrate output port 208.The spacing between the output ports 205 and 206 of the first and second dielectric substrates, and the spacing between the output ports 207 and 208 of the third and fourth dielectric substrates, is d1 = 25 mm. The spacing between output ports 206 and 207 is d2 = 19.5 mm. Each output port's microstrip line structure has a second blind slot 221 on its back side to facilitate connection between the SMA adapter and the second metal ground plane 220. The blind slot has a length of 1m = 6 mm and a width of wm = 12 mm. The linewidth of the microstrip line, the 3dB directional coupler, and the phase shifter is d = 1.5 mm.

[0155] like Figure 8 As shown, this is a top view of the intermediate metal floor of dielectric plate 200 in Embodiment 2 of the present invention. Dielectric plate 200 3 is formed by pressing two dielectric plates with a thickness of 0.508mm together, with a metal floor in the middle.

[0156] like Figure 9 and 10 As shown, this is a top view of the upper surface of dielectric substrate 300 in Embodiment 3 of the present invention. The dielectric constant ε of dielectric substrate 300 is... r=2.2, length L=135.5mm, width W=119.5mm, thickness h=1.016mm. There are four input ports on the left side: first media board input port 301, second media board input port 302, third media board input port 303, and fourth media board input port 304. The spacing d1 between the first and second media board input ports 301 and 302, and between the third and fourth media board input ports 303 and 304 is 25mm. The spacing d2 between the second and third media board input ports 302 and 303 is 19.5mm. The first and second media board input ports 301 and 302 are connected to the ninth 3dB directional coupler 309, respectively. The third and fourth media board input ports 303 and 304 are connected to the ninth 3dB directional coupler 309, respectively. The board input port 304 is connected to the tenth 3dB directional coupler 310. The lower output port of the ninth 3dB directional coupler 309 is connected to the seventh microstrip line 313, and the upper output port is connected to the fifth -45 degree phase shifter 311. The rectangular patch in the fifth -45 degree phase shifter 311 has a length l2 = 5.12 mm, a width w2 = 4.81 mm, and a distance L2 = 2.47 mm from the cross-layer coupling structure. The upper output port of the tenth 3dB directional coupler 310 is connected to the seventh microstrip line 313, and the lower output port is connected to the sixth -45 degree phase shifter 312. The rectangular patch in the sixth -45 degree phase shifter 312 has a length l2 = 5.12 mm, a width w2 = 4.81 mm, and a distance L2 = 2.47 mm from the cross-layer coupling structure. The fifth -45 degree phase shifter 311 and the seventh microstrip line 313 are connected to the eleventh 3dB directional coupler 314 on the upper surface of dielectric substrate 300. The sixth -45 degree phase shifter 312 and the seventh microstrip line 313 are connected to the twelfth 3dB directional coupler 315 on the lower surface of dielectric substrate 300. The lower output port of the eleventh 3dB directional coupler 314 is connected to the eighth microstrip line 317, and the upper output port is connected to the seventh -45 degree phase shifter 316. The seventh -45 degree phase shifter 316 has a length l0 = 3.55 mm, a width w0 = 3.3 mm, and a distance L0 = 2.3 mm from the cross-layer coupling structure. The lower output port of the twelfth 3dB directional coupler 315 is connected to the ninth microstrip line 318, and the upper output port is connected to the second 0 degree phase shifter 319. The 0 degree phase shifter 319 has a length l0 = 3.55 mm, a width w0 = 3.3 mm, and a distance L0 = 2.3 mm from the cross-layer coupling structure. The first 0-degree phase shifter 316 is connected to the first 3rd medium plate output port 305, the eighth microstrip line 317 is connected to the second 3rd medium plate output port 306, the second 0-degree phase shifter 318 is connected to the third 3rd medium plate output port 307, and the ninth microstrip line 319 is connected to the fourth 3rd medium plate output port 308.The spacing between the output ports 305 (first 3rd dielectric substrate), 306 (second 3rd dielectric substrate), 307 (third 3rd dielectric substrate), and 308 (fourth 3rd dielectric substrate) is d1 = 25mm. The spacing between the output ports 306 (second 3rd dielectric substrate) and 307 (third 3rd dielectric substrate) is d2 = 19.5mm. Each microstrip line structure at the output ports has a third blind slot 321 on its back for easy connection between the SMA adapter and the third metal ground plane 320. The blind slot has a length of 1m = 6mm and a width of wm = 12mm. The linewidth of the microstrip line, 3dB directional coupler, and phase shifter is d = 1.5mm.

[0157] like Figure 11 As shown, this is a top view schematic diagram of the metal floor in the middle of the dielectric plate in Embodiment 3 of the present invention. The dielectric plate 300 is composed of two dielectric plates with a thickness of 0.508mm pressed together, with a metal floor in the middle.

[0158] like Figure 12 and 13 As shown, this is a top view of the upper surface of dielectric substrate 400 in embodiment 4 of the present invention. The dielectric constant ε of dielectric substrate 400 is... r=2.2, length L=135.5mm, width W=119.5mm, thickness h=1.016mm. There are 4 input ports on the left side: first 4th medium board input port 401, second 4th medium board input port 402, third 4th medium board input port 403, and fourth 4th medium board input port 404. The spacing d1 between the first 4th medium board input ports 401 and 402, the spacing d2 between the third 4th medium board input ports 403 and 404 is 25mm, and the spacing d2 between the second 4th medium board input ports 402 and 403 is 19.5mm. The first 4th medium board input ports 401 and 402 are connected to the thirteenth 3dB directional coupler 409, respectively. The third 4th medium board input port 403, the fourth 4th medium board input port 404, and the fourth 4th medium board input port 404 are connected to the thirteenth 3dB directional coupler 409, respectively. The input port 404 of the fourth dielectric substrate is connected to the fourteenth 3dB directional coupler 410. The lower output port of the thirteenth 3dB directional coupler 409 is connected to the tenth microstrip line 413, and the upper output port is connected to the third 0-degree phase shifter 411. The rectangular patch in the third 0-degree phase shifter 411 has a length l0 = 3.55mm, a width w0 = 3.3mm, and a distance L0 = 2.3mm from the cross-layer coupling structure. The upper output port of the fourteenth 3dB directional coupler 410 is connected to the tenth microstrip line 413, and the lower output port is connected to the fifth 0-degree phase shifter 412. The rectangular patch in the fifth 0-degree phase shifter 412 has a length l4 = 7.85mm, a width w4 = 7.9mm, and a distance L4 = 3.2mm from the cross-layer coupling structure. The third 0-degree phase shifter 411 and the tenth microstrip line 413 are partially connected to the fifteenth 3dB directional coupler 414 on the upper surface of dielectric substrate 400. The fifth 0-degree phase shifter 412 and the tenth microstrip line 413 are partially connected to the sixteenth 3dB directional coupler 415 on the lower surface of dielectric substrate 400. The upper output port of the fifteenth 3dB directional coupler 414 is connected to the eleventh microstrip line 416, and the lower output port is connected to the second -90-degree phase shifter 417. The second -90-degree phase shifter 417 has a length l4 = 7.85 mm, a width w4 = 7.9 mm, and a distance L4 = 3.2 mm from the cross-layer coupling structure. The upper output port of the sixteenth 3dB directional coupler 415 is connected to the twelfth microstrip line 418, and the lower output port is connected to the third -90 degree phase shifter 419. The third -90 degree phase shifter 419 has a length l4 = 7.85 mm, a width w4 = 7.9 mm, and a distance L4 = 3.2 mm from the cross-layer coupling structure. The eleventh microstrip line 416 is connected to the first dielectric substrate output port 405, the second -90 degree phase shifter 417 is connected to the second dielectric substrate output port 406, the twelfth microstrip line 418 is connected to the third dielectric substrate output port 407, and the third -90 degree phase shifter 419 is connected to the fourth dielectric substrate output port 408.The spacing between the output ports 405 (first 4th dielectric substrate), 406 (second 4th dielectric substrate), 407 (third 4th dielectric substrate), and 408 (fourth 4th dielectric substrate) is d1 = 25mm. The spacing between the output ports 406 (second 4th dielectric substrate) and 407 (third 4th dielectric substrate) is d2 = 19.5mm. Each microstrip line structure at the output ports has a fourth blind slot 421 on its back for easy connection between the SMA adapter and the fourth metal ground plate 420. The blind slot has a length of 1m = 6mm and a width of wm = 12mm. The linewidth of the microstrip line, 3dB directional coupler, and phase shifter is d = 1.5mm.

[0159] like Figure 14 As shown, this is a top view schematic diagram of the metal floor in the middle of the dielectric plate in Embodiment 4 of the present invention. The dielectric plate 400 is composed of two dielectric plates with a thickness of 0.508mm pressed together, with a metal floor in the middle.

[0160] like Figure 15 and 16 As shown, this is a schematic front view of the upper surface of dielectric substrate No. 5 in Embodiment 5 of the present invention. Dielectric constant ε of dielectric substrate No. 5 is 500. r=2.2, length L = 135.5mm, width W = 119.5mm, thickness h = 1.016mm. There are four input ports on the left side: first 5th substrate input port 501, second 5th substrate input port 502, third 5th substrate input port 503, and fourth 5th substrate input port 504. The spacing between the first 5th substrate input port 501 and the second 5th substrate input port 502, and the spacing between the third 5th substrate input port 503 and the fourth 5th substrate input port 504 is d1 = 25mm. The spacing between the second 5th substrate input port 502 and the third 5th substrate input port 503 is d2 = 19.5mm. The first 5th substrate input port 501 and the second 5th substrate input port 502 are connected to the seventeenth 3dB directional coupler 509, respectively. The third 5th substrate input port 503 and the fourth 5th substrate input port 504 are connected to the eighteenth 3dB directional coupler 510, respectively. The lower output port of the 3dB directional coupler 509 is connected to the thirteenth microstrip line 513, and the upper output port is connected to the fourth 0-degree phase shifter 511. The rectangular patch in the fourth 0-degree phase shifter 511 has a length l0 = 3.55mm, a width w0 = 3.3mm, and a distance L0 = 2.3mm from the cross-layer coupling structure. The upper output port of the eighteenth 3dB directional coupler 510 is connected to the thirteenth microstrip line 513, and the lower output port is connected to the sixth 0-degree phase shifter 512. The rectangular patch in the sixth 0-degree phase shifter 512 has a length l4 = 7.85mm, a width w4 = 7.9mm, and a distance L4 = 3.2mm from the cross-layer coupling structure. The fourth 0-degree phase shifter 511 and the thirteenth microstrip line 513 are partially connected to the nineteenth 3dB directional coupler 514 on the upper surface of dielectric substrate 500. The sixth 0-degree phase shifter 512 and the thirteenth microstrip line 513 are partially connected to the twentieth 3dB directional coupler 515 on the lower surface of dielectric substrate 500. The upper output port of the nineteenth 3dB directional coupler 514 is connected to the fourteenth microstrip line 516, and the lower output port is connected to the fourth -90-degree phase shifter 517. The fourth -90-degree phase shifter 517 has a length l4 = 7.85 mm, a width w4 = 7.9 mm, and a distance L4 = 3.2 mm from the cross-layer coupling structure. The upper output port of the 20th 3dB directional coupler 515 is connected to the 15th microstrip line 518, and the lower output port is connected to the 5th -90 degree phase shifter 519. The 5th -90 degree phase shifter 519 has a length l4 = 7.85 mm, a width w4 = 7.9 mm, and a distance L4 = 3.2 mm from the cross-layer coupling structure. The 14th microstrip line 516 is connected to the first 5th dielectric substrate output port 505, the 4th -90 degree phase shifter 517 is connected to the second 5th dielectric substrate output port 506, the 15th microstrip line 518 is connected to the third 5th dielectric substrate output port 507, and the 5th -90 degree phase shifter 519 is connected to the fourth 5th dielectric substrate output port 508.The spacing between the output ports 505 (first 5th dielectric substrate), 506 (second 5th dielectric substrate), 507 (third 5th dielectric substrate), and 508 (fourth 5th dielectric substrate) is d1 = 25mm. The spacing between the output ports 506 (second 5th dielectric substrate) and 507 (third 5th dielectric substrate) is d2 = 19.5mm. Each microstrip line structure at the output ports has a fifth blind slot 521 on its back for easy connection between the SMA adapter and the fifth metal ground plate 520. The blind slot has a length lm = 6mm and a width wm = 12mm. The linewidth d = 1.5mm for the microstrip line, the 3dB directional coupler, and the phase shifter.

[0161] like Figure 17 As shown, this is a schematic front view of the metal floor in the middle of the dielectric plate 500 according to Embodiment 5 of the present invention. The dielectric plate 500 is composed of two dielectric plates with a thickness of 0.508mm pressed together, with a metal floor in the middle.

[0162] Medium board 600, medium board 700, and medium board 800 have the same structure as medium board 500.

[0163] like Figure 18 The figures show the reflection coefficients of each input port in this embodiment of the invention. Within the Butler matrix, the reflection coefficients between ports are below -15dB in the 5–7 GHz range. The upper left figure shows the reflection coefficients of ports 1–4, the upper right figure shows the reflection coefficients of ports 5–8, the lower left figure shows the reflection coefficients of input ports 9–12, and the lower right figure shows the reflection coefficients of input ports 13–16.

[0164] like Figure 19 As shown, this represents the isolation between ports in this embodiment of the invention. The isolation between ports is less than -20dB, indicating good isolation characteristics between the ports. The left figure shows the isolation between input port 1 and input ports 2-8, and the right figure shows the isolation between input port 1 and input ports 9-16.

[0165] like Figure 20 As shown, this is the transmission coefficient curve for port 1 in an embodiment of the present invention. The transmission coefficient reaches -12.9±1dB, and the Butler matrix exhibits good amplitude consistency. The left figure shows the transmission coefficients of input port 1 and output ports 1-8, and the right figure shows the transmission coefficients of input port 1 and output ports 9-16.

[0166] like Figure 21As shown, this represents the phase difference between each output port when inputting port 1 in an embodiment of the present invention. The phase difference is basically stable between 5GHz and 7GHz. The upper left figure shows the phase difference between output ports 1 and 2, 2 and 3, 3 and 4, and 4 and 5; the upper right figure shows the phase difference between ports 5 and 6, 6 and 7, 7 and 8, and 8 and 9; the lower left figure shows the phase difference between input ports 9 and 10, 10 and 11, 11 and 12, and 12 and 13; and the lower right figure shows the phase difference between input ports 13 and 14, 14 and 15, 15 and 16, and 16 and 1.

[0167] As can be seen from the above embodiments of the present invention, the advantages of applying the present invention are: it can realize the generation of multiple modal vortex waves under broadband conditions; and it avoids complex connection methods based on cross-layer coupling structure and three-dimensional structure.

[0168] Of course, the present invention may have other various embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and modifications according to the present invention, but these corresponding changes and modifications should all fall within the protection scope of the claims of the present invention.

Claims

1. A broadband three-dimensional Butler matrix for generating vortex waves, characterized in that, Eight dielectric boards, microstrip lines, metal ground planes, 3dB directional couplers, phase shifters, and SMA connectors; Each dielectric substrate is made of two dielectric substrates laminated together, with a metal ground plane in the middle, and trace layers on the top and bottom, which are respectively composed of microstrip lines, 3dB directional couplers, and phase shifters connected in the order of 3dB directional couplers, phase shifters, 3dB directional couplers, and phase shifters. The four media boards with the eight media board functions are placed horizontally. The four media boards from top to bottom are media board 1, media board 2, media board 3, and media board 4. The other four media boards are placed vertically. From front to back, they are media board 5, media board 6, media board 7, and media board 8. The media boards are connected by SMA connectors. The first dielectric substrate has four input ports on its left side. The first and second input ports are connected to the first 3dB directional coupler, and the third and fourth input ports are connected to the second 3dB directional coupler. The lower output port of the first 3dB directional coupler is connected to the first microstrip line, and the upper output port is connected to the first -67.5 degree phase shifter. The upper output port of the second 3dB directional coupler is connected to the first microstrip line, and the lower output port is connected to the first -22.5 degree phase shifter. The upper portion of the first -67.5 degree phase shifter and the first microstrip line on the first dielectric substrate is connected to the third 3dB directional coupler. The lower portion of the first -22.5 degree phase shifter and the first microstrip line on the first dielectric substrate is connected to the fourth 3dB directional coupler. The lower output port of the third 3dB directional coupler is connected to the second microstrip line, and the upper output port is connected to the first -45 degree phase shifter. The lower output port of the directional coupler is connected to the third microstrip line, the upper output port is connected to the second -45 degree phase shifter, the first -45 degree phase shifter is connected to the first dielectric substrate output port, the second microstrip line is connected to the second dielectric substrate output port, the second -45 degree phase shifter is connected to the third dielectric substrate output port, and the third microstrip line is connected to the fourth dielectric substrate output port. The four output ports have blind slots on the back of the microstrip line to facilitate the connection of the SMA connectors to the metal ground plane. The four SMA connectors are connected to the four output ports, and then connected to one input port of media board 5, media board 6, media board 7, media board 8.

2. A broadband three-dimensional Butler matrix for generating vortex waves according to claim 1, characterized in that: The second dielectric substrate has four input ports on its left side. The first and second input ports are connected to the fifth 3dB directional coupler. The third and fourth input ports are connected to the sixth 3dB directional coupler. The lower output port of the fifth 3dB directional coupler is connected to the fourth microstrip line, and the upper output port is connected to the second -22.5 degree phase shifter. The upper output port of the sixth 3dB directional coupler is connected to the fourth microstrip line, and the lower output port is connected to the second -67.5 degree phase shifter. The upper portion of the second -22.5 degree phase shifter and the fourth microstrip line on the second dielectric substrate is connected to the seventh 3dB directional coupler. The lower portion of the second -67.5 degree phase shifter and the fourth microstrip line on the second dielectric substrate is connected to the eighth 3dB directional coupler. The upper output port of the seventh 3dB directional coupler is connected to the fifth microstrip line, and the lower output port is connected to the third -45 degree phase shifter. The upper output port of the directional coupler is connected to the sixth microstrip line, the lower output port is connected to the fourth -45 degree phase shifter, the fifth microstrip line is connected to the first No. 2 dielectric substrate output port, the third -45 degree phase shifter is connected to the second No. 2 dielectric substrate output port, the sixth microstrip line is connected to the third No. 2 dielectric substrate output port, and the fourth -45 degree phase shifter is connected to the fourth No. 2 dielectric substrate output port. The four output ports have blind slots on the back of the microstrip line to facilitate the connection of the SMA connectors to the metal ground plane. The four SMA connectors are connected to the four output ports, and then connected to one input port of media board 5, media board 6, media board 7, and media board 8.

3. A broadband three-dimensional Butler matrix for generating vortex waves according to claim 1, characterized in that: The third dielectric substrate has four input ports on its left side. The first and second input ports are connected to the ninth 3dB directional coupler. The third and fourth input ports are connected to the tenth 3dB directional coupler. The lower output port of the ninth 3dB directional coupler is connected to the seventh microstrip line, and the upper output port is connected to the fifth -45 degree phase shifter. The upper output port of the tenth 3dB directional coupler is connected to the seventh microstrip line, and the lower output port is connected to the sixth -45 degree phase shifter. The fifth -45 degree phase shifter and the seventh microstrip line are connected to the eleventh 3dB directional coupler on the upper surface of the third dielectric substrate. The sixth -45 degree phase shifter and the seventh microstrip line are connected to the twelfth 3dB directional coupler on the lower surface of the third dielectric substrate. The lower output port of the eleventh 3dB directional coupler is connected to the eighth microstrip line, and the upper output port is connected to the seventh -45 degree phase shifter. The lower output port of the directional coupler is connected to the ninth microstrip line, and the upper output port is connected to the sixteenth microstrip line. The four output ports have blind slots on the back of the microstrip lines to facilitate the connection of the SMA connectors to the metal ground plane. The four SMA connectors are connected to the four output ports, and then connected to one input port of the fifth, sixth, seventh, and eighth media boards.

4. A broadband three-dimensional Butler matrix for generating vortex waves according to claim 1, characterized in that: The fourth dielectric substrate has four input ports on its left side. The first and second input ports are connected to the thirteenth 3dB directional coupler. The third and fourth input ports are connected to the fourteenth 3dB directional coupler. The lower output port of the thirteenth 3dB directional coupler is connected to the tenth microstrip line, and the upper output port is connected to the third 0-degree phase shifter. The upper output port of the fourteenth 3dB directional coupler is connected to the tenth microstrip line, and the lower output port is connected to the fifth 0-degree phase shifter. The third 0-degree phase shifter and the tenth microstrip line are connected to the fifteenth 3dB directional coupler on the upper surface of the fourth dielectric substrate. The fifth 0-degree phase shifter and the tenth microstrip line are connected to the sixteenth 3dB directional coupler on the lower surface of the fourth dielectric substrate. The upper output port of the fifteenth 3dB directional coupler is connected to the eleventh microstrip line, and the lower output port is connected to the second -90-degree phase shifter. The upper output port of the directional coupler is connected to the twelfth microstrip line, and the lower output port is connected to the third -90 degree phase shifter. The four output ports have blind slots on the back of the microstrip line to facilitate the connection of the SMA connectors to the metal ground plane. The four SMA connectors are connected to the four output ports, and then connected to one input port of the fifth, sixth, seventh, and eighth dielectric boards.

5. A broadband three-dimensional Butler matrix for generating vortex waves according to claim 1, characterized in that: The fifth dielectric substrate has four input ports on its left side. The first and second input ports are connected to the seventeenth 3dB directional coupler, respectively. The third and fourth input ports are connected to the eighteenth 3dB directional coupler. The lower output port of the seventeenth 3dB directional coupler is connected to the thirteenth microstrip line, and the upper output port is connected to the fourth 0-degree phase shifter. The upper output port of the eighteenth 3dB directional coupler is connected to the thirteenth microstrip line, and the lower output port is connected to the sixth 0-degree phase shifter. The upper portion of the fourth 0-degree phase shifter and the thirteenth microstrip line on the fifth dielectric substrate is connected to the nineteenth 3dB directional coupler. The lower portion of the sixth 0-degree phase shifter and the thirteenth microstrip line on the fifth dielectric substrate is connected to the twentieth 3dB directional coupler. The upper output port of the nineteenth 3dB directional coupler is connected to the fourteenth microstrip line, and the lower output port is connected to the fourth -90-degree phase shifter. The upper output port of the directional coupler is connected to the fifteenth microstrip line, and the lower output port is connected to the fifth -90 degree phase shifter; The four input ports are connected to one output port of each of the following media boards: No. 1, No. 2, No. 3, and No.

4. The input ports have blind slots on the back of the microstrip lines to facilitate the connection of the SMP connector to the metal ground plane. The four output ports also have blind slots on the back of the microstrip lines to facilitate the connection of the SMA connector to the metal ground plane.

6. A broadband three-dimensional Butler matrix for generating vortex waves according to claim 1, characterized in that: The structure of the No. 6 media board is the same as that of the No. 5 media board, and the four input ports are connected to one output port of the No. 1, No. 2, No. 3, and No. 4 media boards, respectively.

7. A broadband three-dimensional Butler matrix for generating vortex waves according to claim 1, characterized in that: The structure of the No. 7 medium board is the same as that of the No. 5 medium board, and the four input ports are connected to one output port of the No. 1, No. 2, No. 3, and No. 4 medium boards, respectively.

8. A broadband three-dimensional Butler matrix for generating vortex waves according to claim 1, characterized in that: The structure of the No. 8 medium board is the same as that of the No. 5 medium board, and the four input ports are connected to one output port of the No. 1, No. 2, No. 3, and No. 4 medium boards, respectively.

Images