A semiconductor feeding mechanism

Abstract

The present invention provides a semiconductor feeding mechanism, which includes a tube clamping unit, a feeding track unit and a chip picking unit arranged on a machine base. The feeding track unit is arranged obliquely. A deceleration unit and a separation unit are sequentially arranged on the feeding track unit. The tube clamping unit includes a connecting seat, a tube clamping cylinder and clamping claws. The connecting seat is arranged on the machine base through a driving member capable of moving it up and down. A clamping table capable of swinging back and forth is connected to the connecting seat through a driving structure one. An introduction track with a chip introduction channel is installed on the clamping table. A bracket is installed on the introduction track. The tube clamping cylinder is installed on the bracket. The clamping claws are installed on the piston rod of the tube clamping cylinder, and the clamping claws can position the tube on the clamping table. A positioning claw for auxiliary positioning of the tube is installed at the inlet end of the introduction track, and a blocking module for blocking chips is provided at the outlet end of the introduction track.

Description

Technical Field

[0001] The present invention belongs to the technical field of machinery and relates to a semiconductor feeding mechanism. Background Art

[0002] After the track module is tilted at a certain angle, the flipping module is used to flip the material tube to the same angle as the track. Depending on the self - gravity of the chips, the chips will flow from the material tube into the track. Since the existing feeding mechanism uses a cylinder to push the material on the side, the speed cannot meet the higher requirements and the running stability is not high. The product has to go through separation actions, then slide into the front cover plate of the track, then the side cylinder extends in place, then the stop cylinder retracts, the product slides again to be flipped to the tilted angle, the flipping cylinder extends again, the chips are flipped to the horizontal position, and then the suction nozzle picks up the material. The whole process is relatively complicated. Therefore, it is necessary to improve the stability of the feeding mechanism, save time and improve efficiency, and it is very necessary to design a semiconductor feeding mechanism. Summary of the Invention

[0003] The purpose of the present invention is to address the above - mentioned problems in the existing technology and propose a semiconductor feeding mechanism.

[0004] The purpose of the present invention can be achieved by the following technical solutions: A semiconductor feeding mechanism includes a material tube clamping unit, a feeding track unit, and a chip picking unit arranged on a machine base. The feeding track unit is arranged obliquely. A deceleration unit and a separation unit are sequentially arranged on the feeding track unit. It is characterized in that the material tube clamping unit includes a connecting seat, a material tube clamping cylinder, and a clamping claw. The connecting seat is arranged on the machine base through a driving member capable of moving it up and down. A clamping table capable of swinging back and forth is connected to the connecting seat through a driving structure one. An introducing track with a chip introducing channel is installed on the clamping table. A bracket is installed on the introducing track. The material tube clamping cylinder is installed on the bracket. The clamping claw is installed on the piston rod of the material tube clamping cylinder, and the clamping claw can position the material tube on the clamping table. A positioning claw for auxiliary positioning of the material tube is installed at the inlet end of the introducing track. A blocking module for blocking the chips is provided at the outlet end of the introducing track.

[0005] The feeding track unit includes a track bottom plate, a track upper cover plate, and an upper cover plate bracket. Both the track bottom plate and the upper cover plate bracket are installed on the machine base, and the upper cover plate bracket is located on the side of the track bottom plate. A guiding groove for guiding the chips is opened on the track bottom plate. The track upper cover plate is connected to the upper cover plate bracket in an adjustable position manner, and a chip feeding channel is formed between the track upper cover plate and the track bottom plate.

[0006] The tube clamping unit further includes a tube ejecting cylinder and an ejecting claw. The tube ejecting cylinder is installed on the bracket, the ejecting claw is installed on the piston rod of the tube ejecting cylinder, and a supporting block cooperating with the clamping claw is also installed on the clamping table.

[0007] The first driving structure includes a rotating seat, a flipping cylinder, an adjustable screw one and a limiting block. The limiting block is installed on the connecting seat. The middle of the rotating seat is rotatably connected to the upper end of the connecting seat. The flipping cylinder is installed on the connecting seat, and the piston rod of the flipping cylinder is vertically upward. The end of the piston rod of the flipping cylinder is slidably connected to one end of the rotating seat. The adjustable screw one is connected to the other end of the rotating seat, and the end of the adjustable screw one can abut against the limiting block. The clamping table is connected to the rotating seat.

[0008] The driving member is a linear motor vertically installed on the machine base, and the connecting seat is connected to the slide table of the linear motor.

[0009] The chip picking unit includes a vertical plate, a first guide rail, a second guide rail, a first slider, a second slider, a reciprocating table and a chip inversion mold. The vertical plate is installed on the machine base. The first guide rail is vertically installed on the vertical plate. The first slider is arranged on the first guide rail. The second guide rail is horizontally installed on the first slider. The second slider is arranged on the second guide rail. The reciprocating table is installed on the second slider. The reciprocating table is connected to a second driving structure capable of making it move back and forth. The chip inversion mold is rotatably connected to the reciprocating table through a rotating shaft. The rotating shaft is also connected to a driving link. A follower cam is installed on the driving link. A guide groove cooperating with the follower cam is formed on the vertical plate. The guide groove has a horizontal portion and an inclined portion, and the chip inversion mold can be switched back and forth between a horizontal state and an inclined state under the cooperation of the follower cam and the guide groove.

[0010] The second driving structure includes a servo motor, a driving disk and a swing arm. The servo motor is installed on the vertical plate, and the output shaft of the servo motor is horizontally arranged. The driving disk is connected to the output shaft of the servo motor. One end of the swing arm is rotatably connected to the driving disk, and the other end of the swing arm is rotatably connected to the reciprocating table.

[0011] The reduction unit includes a first bracket, a lever bar, a speed reduction roller and a first cylinder. The first bracket is installed on the upper cover of the track. The middle of the first bracket is rotatably connected to the lever bar. The lower end of the lever bar is connected to the speed reduction roller, and the speed reduction roller can be located in the chip feeding channel. An adjusting screw two is threadedly connected to the first bracket, and the end of the adjusting screw two can abut against the upper end of the lever bar. A first spring is also provided between the lever bar and the first bracket. The first cylinder is installed on the first bracket, and the end of the piston rod of the first cylinder can abut against the upper end of the lever bar.

[0012] The separation unit includes a second bracket, a regulation block, a pressing rod, and a second cylinder. The second bracket is installed on the upper cover of the track. The second cylinder is installed on the second bracket. The piston rod of the second cylinder is connected to the regulation block. The pressing rod is slidably arranged on the regulation block and can be located in the chip feeding channel. There is also a second spring between the pressing rod and the regulation block. A separation claw is further installed on the regulation block and can be located in the chip feeding channel.

[0013] The blocking module includes a blocking head and a third cylinder. The blocking head is movably arranged on the guiding track and can be located within the guiding track. The third cylinder is installed on the guiding track, and the piston rod of the third cylinder is connected to the blocking head.

[0014] Compared with the prior art, this semiconductor feeding mechanism has the following advantages:

[0015] 1. It uses a more direct method for material taking, which can greatly save the feeding time compared with the original cylinder structure and improve the efficiency.

[0016] 2. The structure is simplified and the installation difficulty is reduced. The feeding track unit adopts a simpler structure, and the chip slides more smoothly on the track, improving the product stability.

[0017] 3. Claw positioning is designed at the material pipe positioning part, avoiding the situation of material jamming at the inlet caused by the deformation and inaccurate position of the material pipe. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a three-dimensional structural schematic diagram of the present invention;

[0019] Figure 2 is a three-dimensional structural schematic diagram of the material pipe clamping unit in the present invention;

[0020] Figure 3 is a three-dimensional structural schematic diagram of the removed part of the material pipe clamping unit in the present invention;

[0021] Figure 4 is a three-dimensional structural schematic diagram of the deceleration unit in the present invention;

[0022] Figure 5 is a three-dimensional structural schematic diagram of the separation unit in the present invention;

[0023] Figure 6 is a three-dimensional structural schematic diagram of the chip material taking unit in the present invention;

[0024] Figure 7 is a planar structural schematic diagram of the chip material taking unit in the present invention;

[0025] Figure 8 is a three-dimensional structural schematic diagram of the feeding track unit in the present invention;

[0026] Figure 9 It is a schematic diagram of the overall three-dimensional structure;

[0027] Figure 10 It is a schematic diagram of the three-dimensional structure of the removed part in the whole;

[0028] In the figure, 10 is the machine base; 20 is the material full / empty sensor; 30 is the material tube clamping unit; 301 is the connecting seat; 302 is the flipping cylinder; 303 is the guiding track; 304 is the blocking head; 305 is the material tube ejecting cylinder; 306 is the ejecting claw; 307 is the bracket; 308 is the material tube clamping cylinder; 309 is the clamping claw; 310 is the supporting block; 311 is the positioning claw; 312 is the linear motor; 313 is the cylinder three; 314 is the rotating seat; 315 is the adjustable screw one; 316 is the limiting block; 317 is the clamping table; 40 is the chip picking unit; 401 is the vertical plate; 401a is the guiding groove; 402 is the chip die-casting part; 403 is the guiding rail one; 404 is the slider one; 405 is the guiding rail two; 406 is the slider two; 407 is the reciprocating table; 408 is the rotating shaft; 409 is the swing arm; 410 is the servo motor; 411 is the driving disc; 412 is the driving link; 413 is the follower cam; 50 is the separation unit; 501 is the bracket two; 502 is the cylinder two; 503 is the regulating block; 504 is the separation claw; 505 is the pressing rod; 506 is the spring two; 60 is the deceleration unit; 601 is the bracket one; 602 is the spring one; 603 is the adjusting screw two; 604 is the cylinder one; 605 is the lever bar; 606 is the deceleration roller; 70 is the feeding track unit; 701 is the track bottom plate; 701a is the guiding groove; 702 is the track upper cover plate; 703 is the upper cover plate bracket. Specific embodiments

[0029] The following are specific embodiments of the present invention in combination with the accompanying drawings to further describe the technical solutions of the present invention, but the present invention is not limited to these embodiments.

[0030] Such as Figures 1-8As shown in the figure, this semiconductor feeding mechanism includes a tube clamping unit 30, a feeding track unit 70, and a chip picking unit 40 arranged on a machine base 10. The feeding track unit 70 is arranged obliquely, and a deceleration unit 60 and a separation unit 50 are sequentially arranged on the feeding track unit 70. The tube clamping unit 30 includes a connecting seat 301, a tube clamping cylinder 308, and a clamping claw 309. The connecting seat 301 is arranged on the machine base 10 through a driving member capable of moving it up and down. A clamping table 317 capable of swinging back and forth is connected to the connecting seat 301 through a driving structure I. An introducing track 303 with a chip introducing channel is installed on the clamping table 317. A bracket 307 is installed on the introducing track 303. The tube clamping cylinder 308 is installed on the bracket 307. The clamping claw 309 is installed on the piston rod of the tube clamping cylinder 308, and the clamping claw 309 can position the tube on the clamping table 317. A positioning claw 311 for auxiliary positioning of the tube is installed at the inlet end of the introducing track 303. The outlet end of the introducing track 303 has a blocking module for blocking chips. In the tube clamping unit 30, after the tube moves from the storage unit to the position of the tube clamping unit 30, this is achieved by using existing technology. A linear motor 312 is used to drive the tube clamping unit 30 to perform the function of feeding a tube; a tipping cylinder 302 is relied on to pour the chips. In order to make the position of the tube more accurate, reduce the deformation generated after the tube is clamped, and prevent the occurrence of product jamming, when the tube is clamped, the introducing track 303 is designed with a positioning claw 311 to ensure the discharge of the tube chips; the structure of the storage unit is specifically as Figures 9-10 shown.

[0031] The feeding track unit 70 includes a track bottom plate 701, a track upper cover plate 702, and an upper cover plate bracket 703. The track bottom plate 701 and the upper cover plate bracket 703 are both installed on the machine base 10, and the upper cover plate bracket 703 is located on the side of the track bottom plate 701. A guiding groove 701a for guiding chips is opened on the track bottom plate 701. The track upper cover plate 702 is connected to the upper cover plate bracket 703 in an adjustable position manner, and a chip feeding channel is formed between the track upper cover plate 702 and the track bottom plate 701; specifically: the lower end of the track upper cover plate 702 extends beyond the lower end of the track bottom plate 701. In the feeding track unit 70, 1. According to the characteristics of the product, the track bottom plate 701 is designed in a concave shape to ensure the control of the material direction; 2. The front end of the track upper cover plate 702 is designed in cooperation with the chip picking unit 40 to ensure that there is a track upper cover plate 702 when the chip casting member 402 is in the picking position, so as to prevent the occurrence of flying material; 3. If the gap between the track upper cover plate 702 and the track bottom plate 701 is too large, the chips will also tilt and cause jamming. Products in different batches may have dimensional differences. Therefore, the track upper cover plate 702 is designed with an up and down adjustment function to ensure a certain gap with the product and is not easy to damage the product.

[0032] Thus, it replaces the original segmented structure, which is redundant and complex, has high requirements for processing and assembly, and is not conducive to later maintenance.

[0033] The tube clamping unit 30 further includes a tube ejecting cylinder 305 and an ejecting claw 306. The tube ejecting cylinder 305 is installed on the bracket 307, and the ejecting claw 306 is installed on the piston rod of the tube ejecting cylinder 305. A support block 310 cooperating with the clamping claw 309 is also installed on the clamping table 317. In practice, after the material taking is completed, the end of the tube is pressed by the clamping claw 309 on the support block 310.

[0034] The first driving structure includes a rotating seat 314, a flipping cylinder 302, an adjustable screw 315 and a limiting block 316. The limiting block 316 is installed on the connecting seat 301. The middle of the rotating seat 314 is rotatably connected to the upper end of the connecting seat 301. The flipping cylinder 302 is installed on the connecting seat 301, and the piston rod of the flipping cylinder 302 is vertically upward. The end of the piston rod of the flipping cylinder 302 is slidably connected to one end of the rotating seat 314. The adjustable screw 315 is connected to the other end of the rotating seat 314, and the end of the adjustable screw 315 can abut against the limiting block 316. The clamping table 317 is connected to the rotating seat 314.

[0035] The driving member is a linear motor 312 vertically installed on the machine base 10. The connecting seat 301 is connected to the slide table of the linear motor 312. Of course, other existing driving members can also be used according to the actual situation.

[0036] The chip picking unit 40 includes a vertical plate 401, a first guide rail 403, a second guide rail 405, a first slider 404, a second slider 406, a reciprocating table 407, and a chip mold turning member 402. The vertical plate 401 is installed on the machine base 10. The first guide rail 403 is vertically installed on the vertical plate 401. The first slider 404 is arranged on the first guide rail 403. The second guide rail 405 is horizontally installed on the first slider 404. The second slider 406 is arranged on the second guide rail 405. The reciprocating table 407 is installed on the second slider 406. The reciprocating table 407 is connected to a second driving structure capable of making it move back and forth. The chip mold turning member 402 is rotationally connected to the reciprocating table 407 through a rotating shaft 408. The rotating shaft 408 is also connected to a driving link 412. A follower cam 413 is installed on the driving link 412. A guide groove 401a matching with the follower cam 413 is formed on the vertical plate 401. The guide groove 401a has a horizontal portion and an inclined portion. With the cooperation of the follower cam 413 and the guide groove 401a, the chip mold turning member 402 can be switched back and forth between a horizontal state and an inclined state. In the chip picking unit 40, driven by a servo motor 410, relying on two follower cams 413 to ensure the horizontal and the changes in the vertical and horizontal positions of the reciprocating table 407, the turret picking position and the flipping picking position are obtained. A vacuum groove is designed on the chip mold turning member 402 to ensure that the chip is more stable during movement. The vertical height of the chip mold turning member 402 can be adjusted by the side. The chip mold turning member 402 adopts an existing structure.

[0037] The second driving structure includes a servo motor 400, a driving disk 411, and a swing arm 409. The servo motor 410 is installed on the vertical plate 401, and the output shaft of the servo motor 410 is horizontally arranged. The driving disk 411 is connected to the output shaft of the servo motor 400. One end of the swing arm 409 is rotationally connected to the driving disk 411, and the other end of the swing arm 409 is rotationally connected to the reciprocating table 407.

[0038] Specifically: The servo motor 410 drives the driving disk 411 and then drives the swing arm 409 to move, so that the reciprocating table 407 reciprocates back and forth under the cooperation of the first guide rail 403, the second guide rail 405, the first slider 404, and the second slider 406. Relying on the cooperation of the follower cam 413 and the guide groove 401a, the movement of the chip mold turning member 402 is realized, and finally the chip mold turning member 402 is switched between horizontal movement and inclined movement. In practice, the angle of the inclined movement is 25°, just docking with the feeding track unit 70 inclined at 25°.

[0039] The deceleration unit 60 includes a first bracket 601, a lever bar 605, a deceleration roller 606, and a first cylinder 604. The first bracket 601 is installed on the upper cover plate 702 of the track. The middle parts of the first bracket 601 and the lever bar 605 are rotatably connected. The lower end of the lever bar 605 is connected to the deceleration roller 606, and the deceleration roller 606 can be located in the chip feeding channel. A second adjusting screw 603 is threadedly connected to the first bracket 601, and the end of the second adjusting screw 603 can abut against the upper end of the lever bar 605. A first spring 602 is also provided between the lever bar 605 and the first bracket 601. The first cylinder 604 is installed on the first bracket 601, and the end of the piston rod of the first cylinder 604 can abut against the upper end of the lever bar 605. In the deceleration unit 60, the lever bar 605 is tightened by the first spring 602 so that the deceleration roller 606 can contact the chip, and the speed of each chip is reduced through the friction of the deceleration roller 606. The second adjusting screw 603 can adjust the angle of the lever bar 605, thereby adjusting the deceleration amplitude. For the last few products, since the last few products are no longer subjected to the extrusion force of the subsequent products, the feeding speed will slow down. Therefore, the deceleration roller 606 is lifted by the action of the first cylinder 604 to enable the chip to pass through smoothly.

[0040] The separation unit 50 includes a second bracket 501, a control block 503, a pressure bar 505, and a second cylinder 502. The second bracket 501 is installed on the upper cover plate 702 of the track. The second cylinder 502 is installed on the second bracket 501. The piston rod of the second cylinder 502 is connected to the control block 503. The pressure bar 505 is slidably arranged on the control block 503, and the pressure bar 505 can be located in the chip feeding channel. A second spring 506 is also provided between the pressure bar 505 and the control block 503. A separation claw 504 is also installed on the control block 503, and the separation claw 504 can be located in the chip feeding channel. In the separation unit 50, through the telescopic action of the second cylinder 502, the chips are separated by the separation claw 504 to block the feeding of the second chip; and a chip pressing function is designed. The head of the pressure bar 505 is made of polyester material and cooperates with the second spring 506 to avoid damaging the chip due to overpressure contact during pressing. The pressure bar 505 is an existing product.

[0041] As required, a material presence / absence sensor 20 is also installed on the upper cover plate 702 of the track, which is located between the deceleration unit 60 and the separation unit 50; the material presence / absence sensor 20 is an existing product.

[0042] The blocking module includes a blocking head 304 and a third cylinder 313. The blocking head 304 is movably arranged on the guiding track 303, and the blocking head 304 can be located in the guiding track 303. The third cylinder 313 is installed on the guiding track 303, and the piston rod of the third cylinder 313 is connected to the blocking head 304.

[0043] Overall working principle: After the tube clamping unit 30 picks up the tube, it flips to the corresponding angle of 25°. Under the influence of its gravity, the chips in the tube will automatically slide into the feeding track unit 70. After passing through the deceleration unit 60, under the rolling friction of its deceleration roller 606, the chips will slow down their falling speed. When a chip enters the chip feeding channel, the material presence / absence sensor 20 will have a trigger signal. When it reaches the stop position of the separation unit 50, the chip will be stopped. When the servo motor 410 drives the chip picking unit 40 to move the chip inversion part 402 to the corresponding angle of 25°, the cylinder two 502 of the separation unit 50 will execute an opening action, and the chip will flow to the chip inversion part 402. At the same time, the separation claw 504 of the separation unit 50 presses down to block the subsequent chip feeding. Finally, the servo motor 410 drives the chip picking unit 40 to move to the turret picking position, and the chip is picked up by the turret.

[0044] In this embodiment, the inclined working angle is 25°, and this angle can be selected according to actual needs.

[0045] The above components are all common standard parts or parts known to those skilled in the art. Their structures and principles can all be learned by those skilled in the art through technical manuals or through conventional experimental methods.

[0046] The specific embodiments described herein are merely illustrative of the spirit of the present invention. Those skilled in the art of the present invention can make various modifications or supplements to the described specific embodiments or use similar methods for substitution, but will not deviate from the spirit of the present invention or exceed the scope defined by the appended claims.

Claims

1. A semiconductor feeding mechanism, comprising a material tube clamping unit (30), a feeding track unit (70) and a chip picking unit (40) arranged on a machine base (10), and the feeding track unit (70) is arranged obliquely. A deceleration unit (60) and a separation unit (50) are sequentially arranged on the feeding track unit (70), and it is characterized in that, The material pipe clamping unit (30) includes a connecting seat (301), a material pipe clamping cylinder (308) and clamping claws (309). The connecting seat (301) is arranged on the machine base (10) through a driving member capable of moving it up and down. A clamping table (317) capable of swinging back and forth is connected to the connecting seat (301) through a first driving structure. An introducing track (303) with a chip introducing channel is installed on the clamping table (317). A bracket (307) is installed on the introducing track (303). The material pipe clamping cylinder (308) is installed on the bracket (307). The clamping claws (309) are installed on the piston rod of the material pipe clamping cylinder (308), and the clamping claws (309) can position the material pipe on the clamping table (317). A positioning claw (311) for auxiliary positioning of the material pipe is installed at the inlet end of the introducing track (303). The outlet end of the introducing track (303) is provided with a blocking module for blocking the chips. The chip picking unit (40) includes a vertical plate (401), a first guide rail (403), a second guide rail (405), a first slider (404), a second slider (406), a reciprocating table (407) and a chip inversing member (402). The vertical plate (401) is installed on the machine base (10). The first guide rail (403) is vertically installed on the vertical plate (401). The first slider (404) is arranged on the first guide rail (403). The second guide rail (405) is horizontally installed on the first slider (404). The second slider (406) is arranged on the second guide rail (405). The reciprocating table (407) is installed on the second slider (406). The reciprocating table (407) is connected to a second driving structure capable of moving it back and forth. The chip inversing member (402) is rotationally connected to the reciprocating table (407) through a rotating shaft (408). The rotating shaft (408) is also connected to a driving link (412). A follower cam (413) is installed on the driving link (412). A guide groove (401a) matching with the follower cam (413) is formed on the vertical plate (401). The guide groove (401a) has a horizontal portion and an inclined portion, and the chip inversing member (402) can be switched back and forth between a horizontal state and an inclined state under the cooperation of the follower cam (413) and the guide groove (401a).The speed reduction unit (60) includes a first bracket (601), a lever bar (605), a speed reduction roller (606), and a first cylinder (604). The first bracket (601) is installed on the upper cover plate of the track (702). The middle parts of the first bracket (601) and the lever bar (605) are rotatably connected. The lower end of the lever bar (605) is connected to the speed reduction roller (606), and the speed reduction roller (606) can be located in the chip feeding channel. A second adjusting screw (603) is threadedly connected to the first bracket (601), and the end of the second adjusting screw (603) can abut against the upper end of the lever bar (605). A first spring (602) is further provided between the lever bar (605) and the first bracket (601). The first cylinder (604) is installed on the first bracket (601), and the end of the piston rod of the first cylinder (604) can abut against the upper end of the lever bar (605).; 2. The semiconductor feeding mechanism according to claim 1, wherein The feeding track unit (70) includes a track bottom plate (701), a track upper cover plate (702) and an upper cover plate bracket (703). The track bottom plate (701) and the upper cover plate bracket (703) are both installed on the machine base (10), and the upper cover plate bracket (703) is located at the side of the track bottom plate (701). A guiding groove (701a) for chip guiding is formed on the track bottom plate (701). The track upper cover plate (702) is connected to the upper cover plate bracket (703) in an adjustable position manner, and a chip feeding channel is formed between the track upper cover plate (702) and the track bottom plate (701).

3. A semiconductor feeding mechanism according to claim 1, wherein, The tube clamping unit (30) further includes a tube ejecting cylinder (305) and an ejecting claw (306). The tube ejecting cylinder (305) is installed on a bracket (307), and the ejecting claw (306) is installed on the piston rod of the tube ejecting cylinder (305). A support block (310) matching with the clamping claw (309) is also installed on the clamping table (317).

4. A semiconductor feeding mechanism according to claim 1, characterized in that, The first driving structure includes a rotating seat (314), a flipping cylinder (302), an adjustable screw one (315) and a limiting block (316). The limiting block (316) is installed on the connecting seat (301). The middle of the rotating seat (314) is rotatably connected to the upper end of the connecting seat (301). The flipping cylinder (302) is installed on the connecting seat (301), and the piston rod of the flipping cylinder (302) is vertically upward. The end of the piston rod of the flipping cylinder (302) is slidably connected to one end of the rotating seat (314). The adjustable screw one (315) is connected to the other end of the rotating seat (314), and the end of the adjustable screw one (315) can abut against the limiting block (316). The clamping table (317) is connected to the rotating seat (314).

5. A semiconductor feeding mechanism according to claim 1, wherein, The driving member is a linear motor (312) vertically installed on the machine base (10), and the connecting seat (301) is connected to the slide table of the linear motor (312).

6. The semiconductor feeding mechanism according to claim 1, characterized in that, The second driving structure includes a servo motor (410), a driving disc (411) and a swing arm (409). The servo motor (410) is installed on a vertical plate (401), and the output shaft of the servo motor (410) is horizontally arranged. The driving disc (411) is connected to the output shaft of the servo motor (410). One end of the swing arm (409) is rotatably connected to the driving disc (411), and the other end of the swing arm (409) is rotatably connected to the reciprocating table (407).

7. A semiconductor feeding mechanism according to claim 1, wherein The separation unit (50) includes a second bracket (501), a regulation block (503), a pressing rod (505), and a second cylinder (502). The second bracket (501) is installed on the upper cover plate of the track (702). The second cylinder (502) is installed on the second bracket (501). The piston rod of the second cylinder (502) is connected to the regulation block (503). The pressing rod (505) is slidably arranged on the regulation block (503), and the pressing rod (505) can be located in the chip feeding channel. A second spring (506) is further provided between the pressing rod (505) and the regulation block (503). A separation claw (504) is also installed on the regulation block (503), and the separation claw (504) can be located in the chip feeding channel.

8. A semiconductor feeding mechanism according to claim 1, characterized in that, The blocking module includes a blocking head (304) and a third cylinder (313). The blocking head (304) is movably arranged on the guiding track (303), and the blocking head (304) can be located in the guiding track (303). The third cylinder (313) is installed on the guiding track (303). The piston rod of the third cylinder (313) is connected to the blocking head (304).

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