Covers, electronic devices and their manufacturing methods

Abstract

This application relates to the field of electronic devices and aims to solve the problem in known technologies where overlapping easily occurs between the cover and the middle frame, affecting the sealing performance. It provides a cover, electronic devices, and a method for manufacturing the same. The cover includes a main body and an edge body. A notch is formed by recessing the peripheral surface of the main body into the inner panel surface. The edge body is made of a flexible material and integrally formed with the outer edge of the main body. The edge body includes a first side and a second side. The first side fills the notch, and the second side extends from the outer edge of one side along the thickness direction of the main body to cover the peripheral surface near the outer panel surface. The cover can be fixedly bonded to the middle frame with its inner side, and the edge body of the cover contacts and engages with the middle frame. The advantages of this application are that the cover and the middle frame are easy to assemble and seal, and the device has good drop resistance.

Description

Technical Field

[0001] This application relates to the field of electronic devices, and more specifically, to covers, electronic devices, and methods of manufacturing the same. Background Technology

[0002] Some devices or components have outer covers that may need to fit with other structural components of the device to maintain its shape. For example, the back cover of electronic devices such as mobile phones and tablets, as an outer cover, is typically used to cover the back of the electronic device and fits with the mid-frame of the electronic device to achieve functions such as waterproofing.

[0003] In known technologies, the fit between the outer cover and the middle frame may overlap due to dimensional deviations or assembly process deviations, resulting in inadequate fit between the outer cover and the middle frame and affecting the sealing performance. Summary of the Invention

[0004] This application provides a cover, electronic equipment, and a method for manufacturing the same, to solve the problem in the prior art where overlapping easily occurs between the cover and the middle frame, affecting the sealing performance of the fit.

[0005] In a first aspect, this application provides a cover for assembly into an electronic device and for mating with the mid-frame of the electronic device. The cover includes a cover body and an edge body. The cover body has an inner and an outer plate surface that are opposite to each other, and a circumferential surface surrounding the cover body; the circumferential surface of the cover body is recessed inward along the inner plate surface to form a notch on the side near the inner plate surface. The edge body is made of a flexible material and is integrally formed with the outer edge of the cover body; the edge body includes a first side and a second side, the first side filling the notch, and the second side extending from the outer edge of the first side along the thickness direction of the cover body to cover the circumferential surface near the outer plate surface. The cover can be fixedly bonded to the mid-frame with its inner side, and the cover can contact and engage with the mid-frame with its outer edge body.

[0006] In this embodiment, the flexible edge of the cover and the fit between it and the middle frame can accommodate fluctuations in structural tolerances or assembly deviations / dimensional tolerances between the cover and the middle frame. This avoids overlap between the middle frame and the cover during assembly, preventing the cover from being fully bonded and ensuring adequate airtightness or waterproofing. Furthermore, when the flexible edge is pressed onto the middle frame, it forms a surface contact with the middle frame. This provides waterproofing not only through bonding between the inner side of the cover and the middle frame, but also through contact sealing between the edge and the middle frame. The combination of these two features significantly improves the sealing performance between the cover and the middle frame.

[0007] In addition, the flexible contact between the edge body and the middle frame allows the contact point to be cushioned when the device is dropped, thereby improving its drop resistance.

[0008] In one possible implementation, the thickness of the first side is 0.1-0.2 mm, and the thickness of the second side is 0.1-0.2 mm.

[0009] In this implementation, the first and second sides are set with appropriate thicknesses so that the edge body has an appropriate amount of deformation to accommodate the shape or assembly errors that may exist when the middle frame and the cover are manufactured and assembled using conventional techniques, thus ensuring that the two are assembled in place.

[0010] In one possible implementation, the cover has an adhesive surface on the side near the middle frame for bonding with the middle frame; the adhesive surface spans the first edge and the cover body.

[0011] In this implementation, the adhesive surface spans the junction of the first edge and the cover body, allowing the first edge and the cover body to be bonded to the middle frame respectively, which improves the overall integrity of the first edge and the cover body in the assembled state to some extent. Furthermore, the second edge, being a flexible material, more easily forms a reliable bond with the adhesive layer, further improving the adhesive seal between the middle frame and the cover.

[0012] In one possible implementation, the second side is located outside the adhesive surface.

[0013] In this implementation, the second side is located outside the adhesive surface, which allows the second side to extend outward when the cover is bonded to the middle frame. This weakens the limiting effect of the adhesive surface on the second side, increases the ability of the second side to deform and adapt to the middle frame, and enables it to adapt to assembly under greater shape and installation errors.

[0014] In one possible implementation, the cover includes a back plate portion and an outer arc portion, the outer arc portion being an arc-shaped structure that curves and extends from the outer edge of the back plate portion toward the inner side of the back plate portion. An edge body is located at the outer edge of the outer arc portion.

[0015] In this implementation, the cover includes a back plate and an outer arc, which is aesthetically pleasing and provides a good grip.

[0016] Secondly, this application provides a method for manufacturing a cover, used to manufacture the aforementioned cover, the method comprising:

[0017] Cut a notch into the edge of a cover blank to form the cover body;

[0018] Flexible material is injection molded onto the outer periphery of the cover body to form an integral edge body that is integrated with the cover body.

[0019] In this embodiment, the cover body is obtained by edge cutting, and the edge body of the cover body is integrally formed by injection molding of flexible material. This facilitates the use of different materials and / or different processing methods to form different parts. For example, the cover body is obtained by rough machining of a material with certain structural strength (such as ceramic) to ensure its structural strength and avoid the time-consuming, labor-intensive, and costly process of fine machining; while the edge body is made of a flexible material with certain deformation capacity and is formed by injection molding and other processes, which facilitates the shape adaptation between the edge body and other matching structures (such as the middle frame of a mobile phone).

[0020] Therefore, the cover manufacturing method in this application embodiment is convenient to design according to the performance requirements of different parts, thereby taking into account efficiency, cost and structural performance, so as to process the cover with the required performance in an efficient and low-cost manner, and the resulting cover can be well adapted to the middle frame and improve the equipment's drop resistance.

[0021] In one possible implementation, the main body of the cover is made of ceramic material.

[0022] In this implementation, the main body of the cover is made of ceramic material, which can improve rigidity and has better texture and appearance.

[0023] In one possible implementation, the flexible material is either plastic or silicone.

[0024] In this implementation, the flexible material is made of plastic or silicone, which can be easily injection molded and integrally integrated with the main body of the cover.

[0025] Thirdly, this application provides an electronic device, including a mid-frame and the aforementioned cover. The cover is adhered to the mid-frame with its inner side, and the outer edge of the cover is pressed against the mid-frame.

[0026] The electronic device in this embodiment uses the aforementioned cover, which on the one hand reduces the problem of the cover and the middle frame overlapping, thus affecting the proper assembly of the cover and the middle frame and consequently the sealing of the middle frame and the cover; on the other hand, the sealing performance between the cover and the middle frame is greatly improved by the combination of bonding the inner side of the cover to the middle frame and pressing the outer edge of the cover with the edge body.

[0027] In one possible implementation, an adhesive layer is provided between the mid-frame and the cover, and the cover is bonded to the mid-frame through the adhesive layer.

[0028] In this implementation method, the adhesive backing layer can effectively bond the middle frame and the cover.

[0029] In one possible implementation, the adhesive layer has an inactive, unpressurized state and an active state where it is pressed between the cover and the middle frame to bond the cover and the middle frame. In the inactive state, the cover is stacked on the outside of the middle frame via the adhesive layer, with the second edge of the cover extending outwards from the adhesive layer and having a gap with the middle frame. When the cover is pressed against the middle frame, the thickness of the adhesive layer is compressed, causing the adhesive layer to shift to an active state, where the second edge is pressed firmly against the middle frame.

[0030] In this implementation, the adhesive backing layer has a certain compressible thickness, which allows the cover to be stacked on the middle frame with its second side suspended before the adhesive backing layer is compressed. This avoids the second side being blocked by the middle frame when the cover is pressed, thus preventing it from affecting the accurate correspondence and adhesion between the cover and the middle frame. This ensures that during the assembly process, the cover is first positioned and stacked on the middle frame through the adhesive backing layer, and then the adhesive backing layer is pressed to activate it and the second side is pressed against the middle frame. This ensures the accuracy of the assembly position and the sealing performance.

[0031] In one possible implementation, the surface of the middle frame facing the cover includes an annular first surface and a second surface located on the outer periphery of the first surface. The cover is adhered to the first surface with its surface facing the middle frame via an adhesive layer; and after the adhesive layer is activated, the edge body abuts against the second surface.

[0032] In this implementation, adhesive sealing and contact sealing are respectively achieved at the first and second surfaces of the annular rings that are spaced apart, which can achieve a combined seal of the inner and outer rings and achieve two layers of sealing in one assembly, greatly improving the sealing performance.

[0033] In one possible implementation, the adhesive backing layer spans the junction of the cover body and the edge body, and the second side of the edge body extends beyond the adhesive backing layer.

[0034] In this implementation, the adhesive layer extends across the junction of the cover body and the edge body, allowing the cover body and the edge body to be bonded to the middle frame respectively. This also improves the overall integrity of the cover body and the edge body, reducing the possibility of them separating due to thermal stress or other external forces. The second edge extends beyond the adhesive layer, providing greater freedom of deformation and facilitating adaptation to the middle frame.

[0035] In one possible implementation, the surface of the middle frame facing the cover is further provided with a recessed annular groove, which is located between the first surface and the second surface. Both the first surface and the second surface are lower on the side near the annular groove and higher on the other side, and the first surface extends to the upper opening of the annular groove on the side near the annular groove.

[0036] In this implementation, the lower side of the first surface extends to the upper opening of the connecting annular groove. Thus, when the adhesive layer is activated and thinned, excess adhesive can be squeezed into the annular groove along the first surface, facilitating the activation of the adhesive layer. Furthermore, the adhesive squeezed into the annular groove can fill the groove and bond to, or even support, the overhanging portion of the edge, further improving the seal between the cover and the middle frame.

[0037] In one possible implementation, the adhesive layer extends near the junction of the first surface and the annular groove on the side close to the groove.

[0038] In this implementation, when the adhesive backing layer is activated, the extruded adhesive backing is easily squeezed into the annular groove along the inclined first surface.

[0039] In one possible implementation, before the adhesive backing is activated, the outer peripheral surfaces of the second surface and the second side face each other, and the angle between the outer peripheral surface of the second side and the thickness direction of the middle frame is greater than the angle between the second surface and the thickness direction of the middle frame.

[0040] In this implementation, by setting an included angle difference, the side of the second edge closest to the outer plate of the cover body can first contact the second surface to achieve an outer contact seal. Then, as the cover continues to be pressed down, the outer peripheral surface of the second edge adaptably deforms to fit the second surface, achieving a reliable sealing contact fit with good sealing performance.

[0041] In one possible implementation, the angle between the outer peripheral surface of the second side and the thickness direction of the middle frame is 45°, and the angle between the outer peripheral surface of the second side and the thickness direction of the middle frame is 3-5° larger than the angle between the second surface and the thickness direction of the middle frame.

[0042] This implementation provides optimal values ​​for the included angle and the angle difference, which can effectively achieve the aforementioned effect of making the outer peripheral surface of the second side fit the second surface.

[0043] Fourthly, this application provides a method for manufacturing an electronic device, used to manufacture the aforementioned electronic device, the method comprising:

[0044] The cover is pressed and bonded to the middle frame, with the outer edge of the cover abutting against the middle frame at the second side.

[0045] In the embodiments of this application, the aforementioned electronic device manufactured by the electronic device manufacturing method can achieve a double seal by bonding the cover to the middle frame and by pressing the second side against the middle frame, resulting in good sealing performance between the middle frame and the cover.

[0046] In one possible implementation, the cover is bonded to the middle frame via an adhesive backing layer, and after the adhesive backing layer is activated by pressing the cover to the middle frame, the second side abuts against the middle frame.

[0047] In this implementation, the assembly of the cover and the middle frame is facilitated by setting an adhesive backing layer.

[0048] In one possible implementation, the pressure applied to the cover is between 0.5 and 0.9 MPa and maintained for 10 minutes, until the thickness of the adhesive backing layer is compressed by 30% to 40%.

[0049] In this implementation, by setting the pressure and holding time, the adhesive layer is compressed to a set thickness, which enables the middle frame and the cover to be bonded in place and the second side to be reliably pressed against the middle frame. Attached Figure Description

[0050] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0051] Figure 1 This is a schematic diagram of the structure of an electronic device according to an embodiment of this application;

[0052] Figure 2 for Figure 1 A plan view of the electronic equipment;

[0053] Figure 3 for Figure 2 Sectional view along line AA;

[0054] Figure 4 for Figure 3 Enlarged view of point B (adhesive backing layer is in an activated state);

[0055] Figure 5 for Figure 1 An expanded view of a portion of the structure of an electronic device in the image;

[0056] Figure 6 This is a three-dimensional sectional view of a portion of the cover structure in one embodiment of this application;

[0057] Figure 7 This is a view showing the mating relationship between the middle frame and the cover in one embodiment of this application (the adhesive layer is in an inactive state);

[0058] Figure 8 for Figure 7 Expanded view (some lines are hidden and not shown).

[0059] Explanation of key component symbols:

[0060] Electronic devices 10

[0061] Adhesive layer 11

[0062] Mid-frame 12

[0063] Screen 13

[0064] Solar panel 14

[0065] Cover 20

[0066] First side 21

[0067] Second side 22

[0068] Cover body 23

[0069] Edge body 24

[0070] Back panel 25

[0071] Outer arc portion 26

[0072] Slotted C1

[0073] Annular groove C2

[0074] Through hole K1

[0075] First surface P1

[0076] Second surface P2

[0077] Inner panel P3

[0078] Outer panel P4

[0079] Boundary P5

[0080] Peripheral P6

[0081] Adhesive surface P7

[0082] P8, the outer periphery of the second side

[0083] Storage space Q1

[0084] The thickness direction Y1 of the cover body

[0085] The thickness direction Y2 of the middle frame

[0086] gap f1 Detailed Implementation

[0087] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0088] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. When a component is said to be "set on" another component, it can be directly set on the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0089] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "or / and" as used herein includes any and all combinations of one or more of the associated listed items.

[0090] Some embodiments of this application are described in detail. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0091] Example

[0092] See Figures 1-3 This embodiment provides an electronic device 10, such as a mobile phone. The electronic device 10 includes a mid-frame 12, a screen 13, and a cover 20. The cover 20 shown in the figure has a through hole K1, which can be used to expose the rear camera (not shown) of the electronic device 10.

[0093] See also Figure 3 and Figure 4 In the electronic device 10 of this embodiment, the screen 13 is connected to one side of the middle frame 12, and the cover 20 is connected to the other side of the middle frame 12 and together with the middle frame 12 form an accommodating space Q1 for accommodating the battery panel 14.

[0094] See also Figure 4 and Figure 5 The cover 20 is bonded to the middle frame 12 via an adhesive backing layer 11. The adhesive backing layer 11 provides a certain degree of sealing between the cover 20 and the middle frame 12. However, due to limitations in the manufacturing precision, structural rigidity, and assembly precision of the middle frame 12 and the cover 20, relying solely on the adhesive backing layer 11 is insufficient to guarantee a tight seal, making it unsuitable for situations with high sealing requirements. In known technologies, this problem is partially alleviated by setting very high CNC machining precision for the cover, but this approach suffers from limited effectiveness, low efficiency, and high cost.

[0095] See also Figures 4-6In this embodiment, the cover 20 includes a cover body 23 and an edge body 24.

[0096] The cover body 23, serving as the main body of the cover 20, is roughly plate-shaped with a relatively small thickness, such as 0.2-0.4 mm. The cover body 23 has an inner plate surface P3 and an outer plate surface P4 with opposing inner and outer surfaces, as well as a circumferential surface P6 surrounding the cover body 23 (see also...). Figure 8 The outer panel P4 refers to the surface of the cover 20 facing the outside of the electronic device 10 when it is assembled on the electronic device 10, serving as the exterior surface of the electronic device 10; the inner panel P3 is the opposite concept to the outer panel P4, facing the inside of the electronic device 10, and can be used to connect with other parts of the electronic device 10.

[0097] The shape of the cover body 23 is adapted to the electronic device 10. For example, when the electronic device 10 is a mobile phone, since the mobile phone is roughly rectangular, the cover body 23 is also roughly rectangular. In this case, the peripheral surface P6 of the cover body 23 is a ring surface that surrounds the rectangle.

[0098] Optionally, the cover body 23 in this embodiment is made of ceramic, metal, or other rigid materials. Using a rigid material for the cover body 23 provides better rigidity.

[0099] Known technologies include ceramic covers, which not only possess superior rigidity but also offer excellent texture and appearance, conveying a sense of luxury. However, when ceramic covers are used in conjunction with metal mid-frames 12, to ensure a proper fit and achieve a high level of precision, the ceramic cover is prone to overlapping with the metal mid-frame due to shape or assembly errors. This can lead to issues with the adhesive not activating, resulting in poor overall airtightness and waterproofing.

[0100] In this embodiment, a notch C1 is formed by recessing the peripheral surface P6 of the cover body 23 into the inner plate surface P3. The notch C1 can be formed by cutting or other forming methods. The depth h2 of the notch C1 (referring to the dimension of the notch C1 along the thickness direction of the cover body 23) can be about 1 / 2 of the thickness h1 of the cover body 23, such as 0.1-0.2 mm. The width d of the notch C1 (referring to the distance the notch C1 extends inward from the circumference of the cover body 23) can be set to 1.0-2.0 mm.

[0101] In this embodiment, the edge body 24 is made of a flexible material, such as plastic or silicone. The edge body 24 is integrally formed with the outer edge of the cover body 23. The edge body 24 includes a first edge 21 and a second edge 22. The first edge 21 fills the notch C1, and the second edge 22 extends from the outer edge of one edge along the thickness direction Y1 of the cover body to cover the circumferential surface P6 near the outer plate surface P4. When using the aforementioned optional notch C1 size, the thickness of the first edge 21 filling the notch C1 is equal to the depth h2 of the notch C1, and the thickness of the second edge 22 (referring to the distance from the outer circumferential surface P8 of the second edge to the circumferential surface P6 of the cover body 23) can be set to 0.2-0.3 mm, so that the second edge 22 has suitable deformability. With the above-mentioned structure and dimensions, the first side 21 and the second side 22 are set with appropriate thicknesses, so that the edge body 24 has an appropriate amount of deformation to accommodate the shape error or assembly error that may exist in the middle frame 12 and the cover 20 when using conventional manufacturing and assembly techniques, and to ensure that the two are assembled in place.

[0102] In one implementation, see Figure 5 The cover 20 includes a back panel portion 25 and an outer arc portion 26. The outer arc portion 26 is an arc-shaped structure that curves and extends from the outer edge of the back panel portion 25 toward the inner side of the back panel portion 25. An edge body 24 is located at the outer edge of the outer arc portion 26. The portion of the outer arc portion 26 excluding the edge body 24, along with the entire back panel portion 25, constitutes the cover body 23. The outer arc portion 26 of this cover 20 is suitable for fitting with the middle frame 12, and it is aesthetically pleasing and provides a good grip.

[0103] This application provides a method for manufacturing the aforementioned cover 20, comprising:

[0104] A notch C1 is cut into the edge of a cover blank to form the cover body 23. For example, a cover blank made of ceramic material is cut into the edge by CNC machining or other means. Since the notch C1 in this embodiment does not directly determine the shape of the circumferential mating position of the cover 20, the notch C1 can be formed by rough machining only to reduce the processing difficulty, improve the processing efficiency and reduce the processing cost.

[0105] Flexible material is injection molded into the outer periphery of the cover body 23 to form an edge body 24 integrally attached to the cover body 23; wherein the edge body 24 includes the aforementioned first side 21 and second side 22; of course, there may be conventional subsequent processes such as cutting off the casting slit after injection molding, which will not be described in detail here; the edge body 24 of the required shape can be easily obtained through injection molding.

[0106] In this embodiment, the cover body 23 is obtained by edge cutting, and the edge body 24 of the cover body 23 is integrally formed by injection molding of flexible material. This facilitates the use of different materials and / or different processing methods to form different parts. For example, the cover body 23 is obtained by rough machining of a material with certain structural strength (such as ceramic) to ensure its structural strength and avoid the time-consuming, labor-intensive, and costly process of fine machining; while the edge body 24 is made of a flexible material with certain deformation capacity and is formed by injection molding and other processes, which facilitates the shape adaptation between the edge body 24 and other matching structures (such as the middle frame 12 of the mobile phone).

[0107] Therefore, the cover manufacturing method in this application embodiment is convenient to design according to the performance requirements of different parts, thereby taking into account efficiency, cost and structural performance, so as to process the cover 20 with the required performance in an efficient and low-cost manner, and the resulting cover 20 can be well adapted to the middle frame 12 and improve the equipment's drop resistance.

[0108] See you again Figure 3 and Figure 4 In this embodiment, the cover 20 can be fixedly bonded to the middle frame 12 with its inner side, and the cover 20 is pressed tightly against the middle frame 12 with its outer edge 24. In this embodiment, the fit between the cover 20 and the middle frame 12 using the flexible outer edge 24 can accommodate the fluctuations in structural tolerances or misalignment / dimensional tolerances between the cover 20 and the middle frame 12 during assembly, avoiding the problem of overlapping between the middle frame 12 and the cover 20 during assembly, which would prevent the cover 20 from being fully bonded and cause the airtightness or waterproofness between the cover 20 and the middle frame 12 from not meeting the requirements. Furthermore, when the flexible edge 24 is pressed onto the middle frame 12, the edge 24 can form a surface contact with the middle frame 12, so that in addition to the waterproof bonding between the inner side of the cover 20 and the middle frame 12, the cover 20 and the middle frame 12 also have a contact seal waterproofing between the edge 24 and the middle frame 12. The combination of these two aspects greatly improves the sealing performance between the cover 20 and the middle frame 12. In addition, the flexible contact between the edge body 24 and the middle frame 12 allows the contact point to be cushioned when the device is dropped, thereby improving its drop resistance.

[0109] In this embodiment, the cover 20 has an adhesive surface P7 on the side near the middle frame 12, and the cover 20 is bonded to the middle frame 12 via the adhesive surface P7 and the backing layer 11. Optionally, the adhesive surface P7 spans the junction P5 between the first side 21 and the cover body 23, so that the first side 21 and the cover body 23 can be bonded to the middle frame 12 respectively, which improves the integrity of the first side 21 and the cover body 23 in the assembled state to a certain extent. Moreover, the second side 22, as a flexible material, is easier to form a reliable bond with the backing layer 11, which also improves the adhesive sealing between the middle frame 12 and the cover 20. Optionally, the second side 22 is located outside the adhesive surface P7, so that when the cover 20 is bonded to the middle frame 12 by the adhesive backing layer 11, the second side 22 is in an outward protruding state, so that the second side 22 is less restricted by the adhesive surface P7 or the adhesive backing layer 11, increasing the ability of the second side 22 to deform and adapt to the middle frame 12, and can adapt to assembly under greater shape error and installation error.

[0110] The adhesive layer 11 has an inactive state where it is not compressed, and an active state where it is compressed between the cover 20 and the middle frame 12 to bond the cover 20 and the middle frame 12. See also Figure 7 When the adhesive backing layer 11 is inactive, the cover 20 is stacked on the outside of the middle frame 12 through the adhesive backing layer 11. At this time, the second side 22 of the cover 20 extends outward from the adhesive backing layer 11 and has a gap f1 with the middle frame 12. The cover 20 is pressed against the middle frame 12, compressing the thickness of the adhesive backing layer 11, causing the adhesive backing layer 11 to move to the active state. At this time, the second side 22 is pressed tightly against the middle frame 12, as seen in... Figure 4 In this embodiment, the adhesive backing layer 11 has a certain compressible thickness, which allows the cover 20 to be stacked on the middle frame 12 with its second side 22 suspended in the air before the adhesive backing layer 11 is compressed. This avoids the second side 22 being blocked by the middle frame 12 during compression, which would affect the accurate correspondence and adhesion between the cover 20 and the middle frame 12. This ensures that during the assembly of the cover 20, the cover 20 is first positioned and stacked on the middle frame 12 by the adhesive backing layer 11, and then the adhesive backing layer 11 is compressed and activated, causing the second side 22 to contact and be pressed against the middle frame 12. This ensures the accuracy of the assembly position and the sealing performance.

[0111] See also Figure 5 , Figure 7 and Figure 8The surface of the middle frame 12 facing the cover 20 includes an annular first surface P1 and a second surface P2 located on the outer periphery of the first surface P1. The cover 20, with its surface facing the middle frame 12, specifically the adhesive surface P7, is bonded to the first surface P1 by an adhesive layer 11; and after the adhesive layer 11 is activated, the edge body 24 abuts against the second surface P2. In this embodiment, the annular first surface P1 and the second surface P2, which are spaced apart, respectively achieve adhesive sealing and contact sealing, enabling a combined seal of the inner and outer rings, achieving two layers of sealing in a single assembly, and greatly improving sealing performance. The adhesive layer 11 spans across the junction P5 between the cover body 23 and the edge body 24, and the second edge 22 of the edge body 24 extends beyond the adhesive layer 11, allowing the cover body 23 and the edge body 24 to be bonded to the middle frame 12 respectively, improving the overall integrity of the cover body 23 and the edge body 24, and reducing the possibility of them separating due to thermal stress or other external forces. The second side 22 extends beyond the adhesive layer 11, providing greater flexibility in deformation and facilitating adaptation to the middle frame 12. In this embodiment, the surface of the middle frame 12 facing the cover 20 is also provided with a recessed annular groove C2, located between the first surface P1 and the second surface P2. Both the first surface P1 and the second surface P2 are lower on the side near the annular groove C2 and higher on the other side. The first surface P1 extends to the upper opening of the annular groove C2 on the side near the annular groove C2. Thus, when the adhesive layer 11 is activated and thinned, excess adhesive can be squeezed into the annular groove C2 along the first surface P1, facilitating the activation of the adhesive layer 11. Furthermore, the adhesive squeezed into the annular groove C2 can fill the annular groove C2 and bond or even support the suspended protruding portion of the edge at the annular groove C2, further improving the sealing between the cover 20 and the middle frame 12. Optionally, the adhesive layer 11 extends to the vicinity of the junction P5 between the first surface P1 and the annular groove C2 on the side near the annular groove C2. In this way, when the adhesive layer 11 is activated, the extruded adhesive can be easily squeezed into the annular groove C2 along the inclined first surface P1.

[0112] See Figure 7Before the adhesive layer 11 is activated, the second surface P2 and the outer peripheral surface P8 of the second side face each other, and the angle α2 between the outer peripheral surface P8 of the second side and the thickness direction Y2 of the middle frame is greater than the angle α1 between the second surface P2 and the thickness direction Y2 of the middle frame. By setting the angle difference, the side of the second side 22 closest to the outer plate surface P4 of the cover body 23 can first contact the second surface P2 to achieve an outer contact seal. Then, as the cover 20 continues to press down, the outer peripheral surface P8 of the second side adapts to deform to fit the second surface P2, achieving a reliable sealing contact fit with good sealing performance. Optionally, the angle α2 between the outer peripheral surface P8 of the second side and the thickness direction Y2 of the middle frame is 45°, and the angle between the outer peripheral surface P8 of the second side and the thickness direction Y2 of the middle frame is 3-5° larger than the angle between the second surface P2 and the thickness direction Y2 of the middle frame. This embodiment provides a better value for the included angle and the difference between the included angles, which can better achieve the aforementioned effect of making the outer peripheral surface P8 of the second side fit the second surface P2.

[0113] This application also provides a method for manufacturing an electronic device, used to manufacture the aforementioned electronic device 10. The method includes pressing and bonding a cover 20 to a middle frame 12, with the outer edge of the cover 20 abutting against the middle frame 12 via a second side 22. In this application embodiment, the aforementioned electronic device 10 manufactured by this method achieves a double seal: the cover 20 is bonded to the middle frame 12, and the second side 22 abuts against the middle frame 12. The fit and sealing between the middle frame 12 and the cover 20 are good. In this embodiment, the cover 20 is bonded to the middle frame 12 via an adhesive layer 11. After pressing the cover 20 against the middle frame 12 to activate the adhesive layer 11, the second side 22 abuts against the middle frame 12. Optionally, the pressure applied to the cover 20 is between 0.5 and 0.9 MPa and held for 10 minutes, so that the thickness of the adhesive layer 11 is compressed by 30% to 40%. By setting the pressure and holding time, the adhesive layer 11 is compressed to a set thickness, which enables the middle frame 12 and the cover 20 to be bonded in place and the second side 22 to be reliably pressed against the middle frame 12.

[0114] The above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the spirit and scope of the technical solutions of this application.

Claims

1. A cover for assembly to an electronic device and for mating with the mid-frame of the electronic device, characterized in that, The cover includes: The cover body has an inner plate surface and an outer plate surface that are opposite to each other, as well as a circumferential surface surrounding the cover body; the circumferential surface of the cover body is recessed inward along the inner plate surface on the side near the inner plate surface to form a notch; An edge body, the edge body being made of a flexible material and integrally formed with the outer edge of the cover body; the edge body including a first edge and a second edge, the first edge filling the notch, and the second edge extending from the outer edge of the first edge along the thickness direction of the cover body to cover the circumferential surface near the outer plate surface; The cover can be fixedly bonded to the middle frame with its inner side, and the cover can contact and engage with the middle frame with its outer edge; the surface of the middle frame facing the cover includes an annular first surface and a second surface located on the outer periphery of the first surface; The outer peripheral surface of the second side and the thickness direction of the middle frame are set at an angle, and the second surface and the outer peripheral surface of the second side are opposite to each other.

2. The cover according to claim 1, characterized in that: The thickness of the first side is 0.1-0.2 mm, and the thickness of the second side is 0.2-0.3 mm.

3. The cover according to claim 1, characterized in that: The cover has an adhesive surface near the middle frame for bonding with the middle frame; the adhesive surface spans the junction of the first edge and the main body of the cover.

4. The cover according to claim 3, characterized in that: The second edge is located outside the adhesive surface.

5. The cover according to any one of claims 1-4, characterized in that: The cover includes a back plate portion and an outer arc portion, wherein the outer arc portion is an arc-shaped structure that bends and extends from the outer edge of the back plate portion toward the inner side of the back plate portion; The edge body is located at the outer edge of the outer arc portion.

6. A method for manufacturing a cover, characterized in that, A method for manufacturing a cover according to any one of claims 1-5, comprising: Cut a notch into the edge of a cover blank to form the cover body; Flexible material is injection molded onto the outer periphery of the cover body to form an edge body integrally attached to the cover body.

7. The method for manufacturing a cover according to claim 6, characterized in that: The main body of the cover is made of ceramic material.

8. The method for manufacturing a cover according to any one of claims 6-7, characterized in that: The flexible material is either plastic or silicone.

9. An electronic device, characterized in that, include: Mid-frame; The cover according to any one of claims 1-5; The cover is bonded to the middle frame with its inner side, and the outer edge of the cover is pressed against the middle frame.

10. The electronic device according to claim 9, characterized in that: An adhesive backing layer is provided between the middle frame and the cover, and the cover is bonded to the middle frame through the adhesive backing layer.

11. The electronic device according to claim 10, characterized in that: The adhesive backing layer has an inactive state when it is not under pressure, and an active state when it is pressed between the cover and the middle frame to bond the cover and the middle frame. When the adhesive backing layer is inactive, the cover piece is stacked on the outside of the middle frame through the adhesive backing layer. At this time, the second side of the cover piece extends outward from the adhesive backing layer and there is a gap between it and the middle frame. The cover is pressed against the middle frame, compressing the thickness of the adhesive backing layer and causing the adhesive backing layer to move to an active state, at which point the second edge is pressed tightly against the middle frame.

12. The electronic device according to claim 11, characterized in that: The cover is attached to the first surface with an adhesive layer on the surface facing the middle frame; and after the adhesive layer is activated, the edge body abuts against the second surface.

13. The electronic device according to claim 12, characterized in that: The adhesive backing layer spans the junction of the cover body and the edge body, and the second side of the edge body extends beyond the adhesive backing layer.

14. The electronic device according to claim 13, characterized in that: The surface of the middle frame facing the cover is also provided with a recessed annular groove, which is located between the first surface and the second surface. Both the first surface and the second surface are lower on one side near the annular groove and higher on the other side, and the first surface extends to the upper opening of the annular groove on the side near the annular groove.

15. The electronic device according to claim 14, characterized in that: The adhesive backing layer extends to the vicinity of the junction between the first surface and the annular groove on the side near the annular groove.

16. The electronic device according to claim 14, characterized in that: Before the adhesive backing layer is activated, the outer peripheral surfaces of the second surface and the second side are opposite each other, and the angle between the outer peripheral surface of the second side and the thickness direction of the middle frame is greater than the angle between the second surface and the thickness direction of the middle frame.

17. The electronic device according to claim 16, characterized in that: The angle between the outer peripheral surface of the second side and the thickness direction of the middle frame is 45°, and the angle between the outer peripheral surface of the second side and the thickness direction of the middle frame is 3-5° larger than the angle between the second surface and the thickness direction of the middle frame.

18. A method for manufacturing an electronic device, characterized in that, A method for manufacturing an electronic device according to any one of claims 9-17, comprising: The cover is pressed and bonded to the middle frame, and the outer edge of the cover abuts against the middle frame with the second side portion.

19. The method for manufacturing an electronic device according to claim 18, characterized in that: The cover is bonded to the middle frame by an adhesive backing layer. After the cover is pressed tightly against the middle frame to activate the adhesive backing layer, the second side abuts against the middle frame.

20. The method for manufacturing an electronic device according to claim 19, characterized in that: The pressure applied to the cover is between 0.5 and 0.9 MPa and maintained for 10 minutes, until the thickness of the adhesive backing layer is compressed by 30% to 40%.

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