Compression molding die, resin molding device, system, and resin molded article manufacturing method

Abstract

Provided are a compression molding die, a resin molding device, a system, and a resin molding product manufacturing method. The compression molding die includes a first die and a second die. The first die includes a side surface member and a bottom surface member. The side surface member has a step on the bottom surface member side of the side surface member. The step includes a first surface of the side surface member, a second surface extending from the first surface toward the bottom surface member, and a third surface extending downward from the second surface. The bottom surface member includes an upper surface on which a resin material is placed, and a sliding surface extending downward from the upper surface and slidable with respect to the third surface of the side surface member. The third surface of the side surface member is not exposed when the resin material is supplied.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a compression molding die, a resin molding apparatus, a resin molding system, and a resin molding product manufacturing method. BACKGROUND

[0002] From the past, an operation of resin-sealing electronic parts such as semiconductor chips mounted on a substrate by compression molding using a resin molding apparatus including a compression molding die including upper and lower dies has been performed.

[0003] For example, a resin-sealing method of a molded product is disclosed in Patent Literature 1, in which a molded product is sealed with resin in opposing dies, and includes a first sequence in which a portion of the molded product not to be resin-sealed is distanced from the dies, and is set to a state in which only resin is in contact with a specific die among the dies, and a second sequence in which resin molding shrinkage is awaited in the state.

[0004] PRIOR ART DOCUMENTS

[0005] PATENT LITERATURE

[0006] Patent Literature 1: Japanese Patent Laid-Open No. 2005-305951 SUMMARY

[0007] PROBLEMS TO BE SOLVED BY THE INVENTION

[0008] According to the resin-sealing method described in Patent Literature 1, a release film for distancing the molded product from the dies does not need to be used.

[0009] However, in the resin-sealing method described in Patent Literature 1, when the compression die is slid with respect to the frame-shaped die of the lower die while compression molding the molded product by the upper die and the lower die, liquid resin after being heated and melted sometimes enters between the frame-shaped die of the lower die and the compression die. When liquid resin enters between these dies, a part of the liquid resin returns to the dies, and after being hardened, causes resin scum that contaminates the dies, and resin burrs that enter the resin molded product and cause defective products. Therefore, the lower die needs to be disassembled frequently, and cleaning to remove the resin scum needs to be performed.

[0010] In addition, in order to prevent liquid resin from entering between the frame-shaped die and the compression die, a method of providing a release film to the frame-shaped die is also conceivable.

[0011] However, in a case where the height of the frame of the frame-shaped die with respect to the compression die is high, the release film sometimes does not extend completely or the release film breaks. In addition, even when the release film is extended, a part of the extended release film sometimes becomes a wrinkle and enters the resin of the resin molded product when the upper die and the lower die are locked.

[0012] Technical means for solving the problem

[0013] According to the embodiment disclosed herein, a compression molding die can be provided, including: a first die; and a second die facing the first die and disposed more upward than the first die, and the first die includes a side member and a bottom member, the side member has a step difference on a bottom member side of the side member, the step difference includes a first surface of the side member, a second surface extending from the first surface toward the bottom member, and a third surface extending downward from the second surface, and the bottom member includes an upper surface on which a resin material is disposed, and a sliding surface extending downward from the upper surface and slidable with respect to the third surface of the side member, and the third surface of the side member is not exposed when the resin material is supplied.

[0014] According to the embodiment disclosed herein, a resin molding device can be provided, including the compression molding die.

[0015] According to the embodiment disclosed herein, a resin molding system can be provided, including the resin molding device.

[0016] According to the embodiment disclosed herein, a resin molded product manufacturing method can be provided, including a step of preparing a compression molding die, and the compression molding die includes a first die and a second die facing the first die and disposed more upward than the first die, the first die includes a side member and a bottom member, the side member has a step difference on a bottom member side of the side member, the step difference includes a first surface of the side member, a second surface extending from the first surface toward the bottom member, and a third surface extending downward from the second surface, the bottom member includes an upper surface on which a resin material is disposed, and a sliding surface extending downward from the upper surface and slidable with respect to the third surface of the side member, and the resin molded product manufacturing method further includes a step of disposing a molding object in the second die, a step of supplying the resin material in a state that the third surface of the side member is not exposed, and a step of resin molding the molding object using the resin material.

[0017] Effects of the invention

[0018] According to the embodiment disclosed herein, a compression molding die, a resin molding device, a resin molding system, and a resin molded product manufacturing method can be provided, which can suppress the entry of a resin between structural members of a compression molding die without using a release film. BRIEF DESCRIPTION OF DRAWINGS

[0019] [ Figure 1 ] is a functional block diagram of an example of a resin molding system of Embodiment 1.

[0020] [ Figure 2 ] is a schematic cross-sectional view of an example of a resin molding device of Embodiment 1.

[0021] [ Figure 3(a) is a schematic cross-sectional view of the first mold at the time of supplying the resin material of the resin molding device, and (b) is a schematic cross-sectional view of the first mold at the time of resin molding of the resin molding device.

[0022] [ Figure 4 ] is a schematic cross-sectional view of another part of the process for explaining an example of the resin molding method of Embodiment 1.

[0023] [ Figure 5 ] is a schematic cross-sectional view of still another part of the process for explaining an example of the resin molding method of Embodiment 1.

[0024] [ Figure 6 ] is a schematic cross-sectional view of still another part of the process for explaining an example of the resin molding method of Embodiment 1.

[0025] [ Figure 7 ] is a schematic cross-sectional view of an example of the resin-molded molded object of Embodiment 1.

[0026] [ Figure 8 ] is a schematic cross-sectional view of an example of the resin molding of Embodiment 1.

[0027] [ Figure 9 ](a) is a schematic cross-sectional view of the first mold at the time of supplying the resin material of the resin molding device, and (b) is a schematic cross-sectional view of the first mold at the time of resin molding of the resin molding device.

[0028] [ Figure 10 ] is a photograph taken between the inner peripheral surface of the side surface member and the sliding surface of the bottom surface member of the resin-molded side surface member after resin molding of the resin molding device including the first mold shown in (a) and (b). Figure 9 (a) and Figure 9 (b) is a photograph taken of the resin molding using the resin molding device including the first mold shown in (a) and (b).

[0029] [ Figure 11 ] is a photograph taken of the resin molding using the resin molding device including the first mold shown in (a) and (b). Figure 9 (a) and Figure 9 (b) is a photograph taken of the resin molding using the resin molding device including the first mold shown in (a) and (b).

[0030] [ Figure 12 ](a) is a schematic cross-sectional view of the first mold at the time of supplying the resin material of the resin molding device, and (b) is a schematic cross-sectional view of the first mold at the time of resin molding of the resin molding device.

[0031] [ Figure 13 ] is a photograph taken between the inner peripheral surface of the side surface member and the sliding surface of the bottom surface member of the resin-molded side surface member after resin molding of the resin molding device.

[0032] [ Figure 14 ] is a photograph of a resin molded article obtained by resin molding using the resin molding apparatus of Embodiment 1.

[0033] [ Figure 15 ](a) is a schematic cross-sectional view of the first mold at the time of supplying a resin material to the resin molding apparatus of Embodiment 2, and (b) is a schematic cross-sectional view of the first mold at the time of resin molding of the resin molding apparatus of Embodiment 2.

[0034] [ Figure 16 ] is Figure 15 (b) is a schematic enlarged cross-sectional view of the first mold shown in (a).

[0035] [ Figure 17 ](a) is a schematic cross-sectional view of the first mold at the time of supplying a resin material to the resin molding apparatus of Embodiment 3, and (b) is a schematic cross-sectional view of the first mold at the time of resin molding of the resin molding apparatus of Embodiment 3.

[0036] [ Figure 18 ](a) is a schematic cross-sectional view of the first mold at the time of supplying a resin material to the resin molding apparatus of Embodiment 4, and (b) is a schematic cross-sectional view of the first mold at the time of resin molding of the resin molding apparatus of Embodiment 4.

[0037] [ Figure 19 ] is a schematic plan view of a molded object obtained by resin molding using the resin molding apparatus of Embodiment 4.

[0038] [ Figure 20 ] is a schematic plan view of a resin molded article manufactured by the resin molding apparatus of Embodiment 4.

[0039] [ Figure 21 ](a) is a schematic cross-sectional view of the first mold at the time of supplying a resin material to the resin molding apparatus of Embodiment 5, and (b) is a schematic cross-sectional view of the first mold at the time of resin molding of the resin molding apparatus of Embodiment 5. DETAILED DESCRIPTION

[0040] Hereinafter, embodiments will be described. In addition, in the drawings used in the description of the embodiments, the same reference numerals are used to denote the same parts or corresponding parts.

[0041] <Embodiment 1>

[0042] Figure 1 is a functional block diagram showing an example of the resin molding system of Embodiment 1. Figure 1The resin molding system 1000 shown includes a resin supply module 1001 that can supply a resin material, a resin molding module 1002 that can manufacture a resin molded article by compression molding a molded object, a supply and storage module 1003 that can supply a molded object before molding and can store a resin molded article after compression molding, and a control section 1004. The control section 1004 is configured so as to be able to control the resin supply module 1001, the resin molding module 1002, and the supply and storage module 1003.

[0043] The resin supply module 1001, the resin molding module 1002, and the supply and storage module 1003 can be attached and detached from each other and can be replaced.

[0044] The resin supply module 1001 includes a resin material supply device that can supply a resin material to the resin molding module 1002.

[0045] The resin molding module 1002 includes the resin molding device of the embodiment. Details of the resin molding device 1 of the embodiment will be described later. The resin molding module 1002 can also be provided with a plurality of resin molding devices.

[0046] The supply and storage module 1003 includes a supply device that can supply a molded object before resin molding and a storage device that can store a resin molded article after compression molding.

[0047] The resin molded article obtained by compression resin molding by the resin molding device is stored in the supply and storage module 1003.

[0048] Figure 2 A schematic cross-sectional view of the resin molding device of the embodiment 1, which is an example of the resin molding device of the embodiment, is shown. As shown, the resin molding device 1 of the embodiment 1 includes a compression molding die 10. The compression molding die 10 includes a first die 110 and a second die 120 that is disposed in a higher position than the first die 110 so as to face the first die 110. Figure 2

[0049] The first die 110 includes a side surface member 111 and a bottom surface member 112. The side surface member 111 is disposed so as to surround the periphery of the bottom surface member 112. The inner peripheral surface of the side surface member 111 on the bottom surface member 112 side has a step 113. The step 113 includes a first surface 111a of the side surface member 111, a second surface 111b that extends from the first surface 111a toward the bottom surface member 112, and a third surface 111c that extends downward from the second surface 111b. The first surface 111a and the third surface 111c are perpendicular with respect to the second surface 111b, respectively.

[0050] ​The bottom surface member 112 includes an upper surface 112a of a resin material that can be configured, and a sliding surface 112b that extends downward from a periphery of the upper surface 112a. The sliding surface 112b is in contact with the third surface 111c of the side surface member 111, and is slidable with respect to the third surface 111c of the side surface member 111.

[0051] The resin molding apparatus 1 further includes an upper fixed disk 121, a lower fixed disk 122, and the movable disk 115. Between the upper fixed disk 121 and the lower fixed disk 122, a plurality of support portions 116 extend in the vertical direction. One end of each of the plurality of support portions 116 is fixed to the upper fixed disk 121, and the other end is fixed to the lower fixed disk 122. Further, between the side surface member 111 and the movable disk 115, the elastic member 114 is provided.

[0052] The resin molding apparatus 1 further includes a first drive mechanism 117 between the plurality of support portions 116 of the lower fixed disk 122. The first drive mechanism 117 allows the movable disk 115 to move upward and downward. The upper fixed disk 121 and the lower fixed disk 122 are fixed and cannot move. Therefore, the movable disk 115 is relatively movable with respect to the upper fixed disk 121 and the lower fixed disk 122. Further, the first drive mechanism 117 can move the side surface member 111 and the bottom surface member 112 upward and downward, that is, can raise and lower, via the movable disk 115.

[0053] The resin molding apparatus 1 further includes a second drive mechanism 118 inside the movable disk 115. The second drive mechanism 118 can move the bottom surface member 112 upward and downward, that is, can raise and lower. Thus, the bottom surface member 112 is relatively movable with respect to the side surface member 111.

[0054] Hereinafter, with reference to Figures 2-8 , a schematic cross-sectional view, a manufacturing method of a resin molded product of Embodiment 1, which is an example of a manufacturing method of a resin molded product according to an embodiment, will be described. First, as shown in Figure 2 , a process of preparing a compression molding mold 10 is performed. The process of preparing the compression molding mold 10 can be performed, for example, by providing the first mold 110 to the movable disk 115, and providing the second mold 120 to the upper fixed disk 121.

[0055] Subsequently, as shown in Figure 3 , a process of providing a molded object 201 to the second mold 120 is performed. The process of providing the molded object 201 to the second mold 120 can be performed, for example, by adsorbing and holding the molded object 201 to the second mold 120. The molded object 201 is, for example, a lead frame, a substrate, a semiconductor manufacturing substrate (silicon wafer or the like), a metal substrate, a glass substrate, a ceramic substrate, or a wiring substrate.

[0056] Then, as Figure 3 As shown, a process of supplying resin material 202 is performed with the third surface 111c of the side member 111 not exposed. This process of supplying resin material 202 with the third surface 111c of the side member 111 not exposed can be performed, for example, by supplying resin material 202 into a cavity formed by the first surface 111a and the second surface 111b of the side member 111 and the upper surface 112a of the bottom member 112, without the third surface 111c of the side member 111 contacting the resin material 202.

[0057] Furthermore, in this embodiment, there is no particular limitation on the order of the process of setting the molding object 201 in the second mold 120 and the process of supplying the resin material 202 when the third surface 111c of the side member 111 is not exposed.

[0058] Then, as Figure 4 As shown, a process is performed to move the first mold 110 toward the second mold 120. This process can be performed, for example, by using the first drive mechanism 117 to move the movable disk 115 toward the second mold 120.

[0059] Next, a process of resin molding the molded object 201 using resin material 202 is performed. The process of resin molding the molded object 201 using resin material 202 can be performed, for example, as follows.

[0060] First, such as Figure 5 As shown, molten resin 202a is produced by heating and melting resin material 202, and then pushed upward by the second drive mechanism 118 so that the upper surface 112a of the bottom member 112 is positioned above the second surface 111b of the side member 111. At this time, the elastic member 114, which is compressed towards the side member 111 due to the pressure of the first mold 110 towards the second mold 120, is pressed downward, and the bottom member 112 is pushed upward. As a result, the sliding surface 112b of the bottom member 112 slides relative to the third surface 111c of the side member 111, while the bottom member 112 moves upward relative to the side member 111.

[0061] Then, as Figure 6 As shown, in a state where the upper surface 112a of the bottom member 112 is pushed upwards (towards the second mold 120 side) above the second surface 111b of the side member 111, the molten resin 202a is further heated and hardened to produce a hardened resin 202b.

[0062] Then, for example Figure 7As shown in the schematic cross-sectional view, the resin-molded object 300 is removed from the compression molding die 10. The resin-molded object 300 has an annular portion 220 extending downward in a manner that surrounds the periphery of the bottom surface. The annular portion 220 has a shape corresponding to the shape of the first surface 111a and the second surface 111b of the side member 111.

[0063] Then, in Figure 7 When the annular portion 220 shown is an excess portion, a process is performed to remove the excess annular portion 220 from the self-forming object 300. This allows for the manufacture of, for example... Figure 8 The schematic cross-sectional view shows a resin molded article 301, which is a self-molded object 300 with the annular portion 220 removed.

[0064] In the resin molding apparatus 1 of Embodiment 1, the third surface 111c of the side member 111 is not exposed when the resin material 202 is supplied. Therefore, according to the resin molding apparatus 1, resin can be prevented from entering the structural members of the compression molding die without using a release film.

[0065] That is, in the previous resin molding apparatus, for example Figure 9 The schematic cross-sectional view of (a) shows that the inner peripheral surface 1111a of the side member 1111 of the first mold 1100 does not have the step 113 as in the resin molding apparatus 1 of Embodiment 1, and extends in the vertical direction (up and down direction). Therefore, in the first mold 1100 with this configuration, when the resin material 202 is supplied, there is resin 202c in contact with the inner peripheral surface 1111a of the side member 1111.

[0066] Then, for example, in Figure 9 During resin molding as shown in the schematic cross-sectional view of (b), the sliding surface 112b of the bottom member 112 slides on the resin 202c attached to the inner peripheral surface 1111a of the side member 1111, while moving and bringing the resin 202c between the inner peripheral surface 1111a of the side member 1111 and the sliding surface 112b of the bottom member 112.

[0067] Therefore, in the previous resin molding apparatus, after the resin 202c brought into the space between the inner peripheral surface 1111a of the side member 1111 and the sliding surface 112b of the bottom member 112 hardens, it causes resin residue that contaminates the mold and resin burrs that enter the resin molded product and cause defective products.

[0068] Figure 10 The image shows a photograph taken from a previous resin molding apparatus, showing the inner circumferential surface 1111a of the resin-molded side member 1111 and the sliding surface 112b of the bottom member 112. The previous resin molding apparatus included... Figure 9 (a) andFigure 9 (b) shows the first module 1100. Figure 10 As shown, black spots corresponding to resin residue can be visually identified between the inner circumferential surface 1111a of the former side member 1111 and the sliding surface 112b of the bottom member 112.

[0069] Figure 11 The image shows photographs of resin-molded articles obtained by resin molding using a conventional resin molding apparatus, which includes... Figure 9 (a) and Figure 9 (b) shows the first module 1100. Figure 11 As shown, resin burrs protruding from the outer edge of the periphery of the resin molded article 3010 obtained by resin molding using a conventional resin molding apparatus can be visually confirmed.

[0070] On the other hand, in the resin molding apparatus 1 of Embodiment 1, for example... Figure 12 As shown in the schematic cross-sectional view of (a), when the resin material 202 is supplied, the third surface 111c of the side member 111 does not contact the resin material 202.

[0071] Therefore, for example in Figure 12 (b) Schematic cross-sectional view showing resin molding, even when the sliding surface 112b of the bottom member 112 slides along the third surface 111c of the side member 111 while moving upwards, the resin does not adhere to the third surface 111c of the side member 111, therefore, it is compatible with... Figure 9 (a) and Figure 9 Compared to the previous resin molding apparatus of the first mold 1100 shown in (b), the amount of resin brought into the space between the third surface 111c of the side member 111 and the sliding surface 112b of the bottom member 112 can be significantly reduced.

[0072] Therefore, according to Embodiment 1, the resin molding apparatus 1 can suppress resin from entering the structural components of the compression molding die without using a release film.

[0073] Figure 13 The image shows a photograph of the third surface 111c of the resin-molded side member 111 and the sliding surface 112b of the bottom member 112 of the resin molding apparatus 1 of Embodiment 1. Figure 13 As shown, between the third surface 111c of the side member 111 and the sliding surface 112b of the bottom member 112 of the resin molding apparatus 1 in Embodiment 1, black spots corresponding to resin residue cannot be visually identified.

[0074] Therefore, also by Figure 10 and Figure 13As is clear from the comparison with the prior resin molding device, the resin molding device 1 of the embodiment 1 can reduce the amount of resin scraps compared with the prior resin molding device.

[0075] Figure 14 A photograph of a resin molded product obtained by resin molding using the resin molding device 1 of the embodiment 1 is shown in FIG. 12. As is shown in FIG. 12, a resin burr that protrudes outward from the peripheral edge of the resin molded product 301 obtained by resin molding using the resin molding device 1 of the embodiment 1 cannot be visually confirmed. Figure 14

[0076] Therefore, as is clear from the comparison with the prior resin molding device, the resin molding device 1 of the embodiment 1 can reduce the resin burr of the peripheral edge of the resin molded product 301 compared with the prior resin molding device. Figure 11 Figure 14 As is clear from the comparison with the prior resin molding device, the resin molding device 1 of the embodiment 1 can reduce the amount of resin scraps compared with the prior resin molding device.

[0077] Here, in the present embodiment, a case where two driving mechanisms, the first driving mechanism 117 that can raise and lower the side member 111 and the bottom member 112 via the movable disc 115 and the second driving mechanism 118 that can raise and lower the bottom member 112, are provided is additionally described.

[0078] For example, in a configuration of the press mechanism where the second driving mechanism 118 is not provided and the first driving mechanism 117 is used to raise and lower the side member 111 and the bottom member 112, when a relatively thin product (resin molded product) having a thickness of 2 mm or less is manufactured, resin molding can be performed even if the press mechanism has a structure having only one such driving mechanism. However, when a relatively thick product (resin molded product) having a thickness exceeding 2 mm is manufactured, the distance that the side member 111 and the bottom member 112 relatively slide during resin molding becomes long, and thus in some cases, appropriate resin molding cannot be performed using only the expansion and contraction of the elastic member 114 interposed between the side member 111 and the movable disc 115. In such a case, by providing two driving mechanisms (the first driving mechanism 117 and the second driving mechanism 118) as in the present embodiment, even if the distance that the side member 111 and the bottom member 112 relatively slide during resin molding is relatively long, appropriate resin molding can be performed. Figure 2

[0079] ​​​In addition, for example, in the case of manufacturing a relatively thick product (resin molded product) having a thickness of more than 2 mm, the contact area of the molding die (for example, the first die 110) with the resin molded product becomes large, and thus the close contact force of the molding die with the resin molded product becomes large, and sometimes the demolding (removal of the resin molded product from the molding die after resin molding) becomes difficult. In such a case, by providing a drive mechanism that can perform drive to independently raise and lower at least one of the side surface member 111 and the bottom surface member 112, it is possible to make the demolding easy.

[0080] If one example of the case is described, in the demolding operation, only the side surface member 111 is lowered to demold, and then the side surface member 111 is raised to be clamped Figure 4 The state of the molding target 201 shown in the drawing, only the bottom surface member 112 is lowered to demold. In addition, it is also possible to, contrary to this, first only lower the bottom surface member 112 to demold, and then only lower the side surface member 111 to demold.

[0081] Further, in the case of manufacturing a relatively thick product, if a demolding film is used, wrinkles are easily generated, and it is possible to cause a molding defect such as appearance defect of the resin molded product, and thus the structure of providing two drive mechanisms (the first drive mechanism 117 and the second drive mechanism 118) as in the present embodiment is particularly effective. However, in the case of manufacturing a relatively thin product (resin molded product), it is also possible to provide the structure of the resin molding device in which Figure 2 In the structure of the first drive mechanism 117 and the second drive mechanism 118, the second drive mechanism 118 is not provided, and only the first drive mechanism 117 is used to make the side surface member 111 and the bottom surface member 112 liftable and lowerable.

[0082] In addition, in the structure of the drive mechanism that can raise and lower the first die 110 described in the present embodiment, the second drive mechanism 118 that can independently raise and lower the bottom surface member 112 with respect to the side surface member 111 is provided separately from the first drive mechanism 117, but it is also possible to provide the structure in which a drive mechanism that can independently raise and lower the side surface member 111 with respect to the bottom surface member 112 is provided separately from the first drive mechanism 117.

[0083] Further, in the present specification, the "third surface of the side surface member is not exposed at the time of supplying the resin material" means the case in which the upper end of the third surface of the side surface member of the resin molding device is located at the same height as the upper end of the sliding surface of the bottom surface member, or is located more downward than the sliding surface of the bottom surface member, at a point of time that is at least earlier than the point of time at which the supply of the resin material is assumed.

[0084] <Embodiment 2>

[0085] Figure 15In (a), a schematic cross-sectional view of the first mold 110 at the time of supplying the resin material in the resin molding apparatus of Embodiment 2, which is another example of the resin molding apparatus of Embodiment, is shown. Figure 15 In (b), a schematic cross-sectional view of the first mold 110 at the time of resin molding in the resin molding apparatus of Embodiment 2 is shown. The resin molding apparatus of Embodiment 2 is characterized in that the third face 111c of the side face member 111 further includes a sealing material 130. As the sealing material 130, for example, a packing, a gasket, or a resin ring, or the like can be used. Further, the sealing material 130 can also be attached to the bottom face member 112.

[0086] Figure 16 In (a), a schematic cross-sectional view of the first mold 110 at the time of supplying the resin material in the resin molding apparatus of Embodiment 2, which is another example of the resin molding apparatus of Embodiment, is shown. Figure 15 (b) shown. As shown in (b), in the resin molding apparatus of Embodiment 2, the third face 111c of the side face member 111 and the sliding face 112b of the bottom face member 112 can be blocked by the sealing material 130, and resin leakage of the molten resin 202a to the third face 111c of the side face member 111 and the sliding face 112b of the bottom face member 112 caused by the molding pressure in the direction of the arrow 401 can be suppressed. Figure 16

[0087] Further, in the case of manufacturing the resin molded article using the resin molding apparatus of Embodiment 2, an example of the manufacturing method of the resin molded article of the embodiment can include a step of providing the sealing material 130 to the third face 111c of the side face member 111 at least before a step of supplying the resin material 202.

[0088] The description other than the above of Embodiment 2 is the same as that of Embodiment 1, and thus the description thereof is omitted.

[0089] <Embodiment 3>

[0090] Figure 17 In (a), a schematic cross-sectional view of the first mold 110 at the time of supplying the resin material in the resin molding apparatus of Embodiment 3, which is a further example of the resin molding apparatus of Embodiment, is shown. Figure 17 In (b), a schematic cross-sectional view of the first mold 110 at the time of resin molding in the resin molding apparatus of Embodiment 3 is shown. The resin molding apparatus of Embodiment 3 is characterized in that a consumable material 140 is further included, which is disposed between the first face 111a and the second face 111b of the side face member 111 and the sliding face 112b of the bottom face member 112. As the consumable material 140, for example, paper or rubber, or the like can be used.

[0091] ​In the resin molding apparatus of Embodiment 3, the upper surface between the third surface 111c of the side surface member 111 and the sliding surface 112b of the bottom surface member 112 is plugged by the consumable 140, so that resin leakage of the molten resin 202a toward the upper surface between the third surface 111c of the side surface member 111 and the sliding surface 112b of the bottom surface member 112 due to molding pressure can be suppressed.

[0092] Further, in the case of manufacturing the resin molded article using the resin molding apparatus of Embodiment 3, an example of the manufacturing method of the resin molded article of the embodiment can include, before at least the step of supplying the resin material 202, a step of providing the consumable 140 between the first surface 111a and the second surface 111b of the side surface member 111 and the sliding surface 112b of the bottom surface member 112.

[0093] The description other than the description of Embodiment 3 is the same as that of Embodiments 1 to 2, and thus the description is omitted.

[0094] <Embodiment 4>

[0095] Figure 18 (a) is a schematic cross-sectional view of the first mold 110 at the time of supplying the resin material in the resin molding apparatus of Embodiment 4, which is a further example of the resin molding apparatus of the embodiment. Figure 18 (b) is a schematic cross-sectional view of the first mold 110 at the time of resin molding in the resin molding apparatus of Embodiment 4. The resin molding apparatus of Embodiment 4 is characterized in that the recess 150 is provided on the upper surface 112a of the bottom surface member 112. The recess 150 includes a flat bottom surface 150a and an inner peripheral surface 150b extending upward obliquely from the periphery of the bottom surface 150a.

[0096] Figure 19 (b) is a schematic cross-sectional view of the first mold 110 at the time of resin molding in the resin molding apparatus of Embodiment 4. The resin molding apparatus of Embodiment 4 is characterized in that the recess 150 is provided on the upper surface 112a of the bottom surface member 112. The recess 150 includes a flat bottom surface 150a and an inner peripheral surface 150b extending upward obliquely from the periphery of the bottom surface 150a. Figure 19 As shown, the resin molded article 300 subjected to resin molding includes the protrusion 500 corresponding to the shape of the recess 150 of the upper surface 112a of the bottom surface member 112.

[0097] As shown, the protrusion 500 includes the flat bottom surface 500a. Therefore, in the case of manufacturing the resin molded article using the resin molding apparatus of Embodiment 4, as shown in the schematic plan view of Figure 19 (b) is a schematic cross-sectional view of the first mold 110 at the time of resin molding in the resin molding apparatus of Embodiment 4. The resin molding apparatus of Embodiment 4 is characterized in that the recess 150 is provided on the upper surface 112a of the bottom surface member 112. The recess 150 includes a flat bottom surface 150a and an inner peripheral surface 150b extending upward obliquely from the periphery of the bottom surface 150a. Figure 20 (b) is a schematic cross-sectional view of the first mold 110 at the time of resin molding in the resin molding apparatus of Embodiment 4. The resin molding apparatus of Embodiment 4 is characterized in that the recess 150 is provided on the upper surface 112a of the bottom surface member 112. The recess 150 includes a flat bottom surface 150a and an inner peripheral surface 150b extending upward obliquely from the periphery of the bottom surface 150a.

[0098] Further, in the resin molding apparatus of Embodiment 4, the protrusion portion 500 has the outer peripheral surface 500b inclined with respect to the bottom surface 500a, and thus the resin molded article 301 can be easily taken out from the compression molding die 10.

[0099] Further, in Embodiment 4, the case where the inner peripheral surface 150b of the recess 150 is inclined with respect to the bottom surface 150a is described, but the inner peripheral surface 150b of the recess 150 can also be perpendicular with respect to the bottom surface 150a.

[0100] The description other than the above of Embodiment 4 is the same as that of Embodiments 1 to 3, and thus the description thereof is omitted.

[0101] <Embodiment 5>

[0102] Figure 21 (a) shows a schematic cross-sectional view of the first die 110 at the time of supplying a resin material in the resin molding apparatus of Embodiment 5, which is a further example of the resin molding apparatus of the embodiments. Figure 21 (b) shows a schematic cross-sectional view of the first die 110 at the time of resin molding in the resin molding apparatus of Embodiment 5. The resin molding apparatus of Embodiment 5 is characterized in that the first surface 111a of the side surface member 111 is inclined with respect to the second surface 111b.

[0103] In the resin molding apparatus of Embodiment 5, the first surface 111a of the side surface member 111 is inclined with respect to the second surface 111b, and thus compared with the resin molding apparatuses of Embodiments 1 to 4 in which the first surface 111a of the side surface member 111 is perpendicular with respect to the second surface 111b, the resin molded article 301 can be easily taken out from the compression molding die 10.

[0104] The description other than the above of Embodiment 5 is the same as that of Embodiments 1 to 4, and thus the description thereof is omitted.

[0105] The embodiments have been described as above, but each of the embodiments can also be appropriately combined from the beginning.

[0106] The embodiments disclosed this time are to be considered as illustrative in all points and not restrictive. The scope of the application is shown not by the above description but by the claims, and is intended to include all modifications equivalent within the meaning and scope of the claims.

[0107] Industrial Applicability

[0108] According to the embodiments disclosed here, it is possible to provide a compression molding die, a resin molding apparatus, a resin molding system, and a resin molded article manufacturing method.

[0109] Explanation of Symbols

[0110] 1: resin molding apparatus

[0111] 10: compression molding mold

[0112] 110, 1100: first mold

[0113] 120: second mold

[0114] 111, 1111: side member

[0115] 111a: first face

[0116] 111b: second face

[0117] 111c: third face

[0118] 112: bottom member

[0119] 112a: upper surface

[0120] 112b: sliding surface

[0121] 113: step

[0122] 114: elastic member

[0123] 115: movable disk

[0124] 116: support portion

[0125] 117: first drive mechanism

[0126] 118: second drive mechanism

[0127] 121: upper fixed disk

[0128] 122: lower fixed disk

[0129] 130: sealing material

[0130] 140: consumable

[0131] 150: recess

[0132] 150a, 500a: bottom surface

[0133] 150b, 1111a: inner peripheral surface

[0134] 201: molding object

[0135] 202: resin material

[0136] 202a: molten resin

[0137] 202b: hardened resin

[0138] 202c: resin

[0139] 220: annular portion

[0140] 300: resin-molded molded object

[0141] 301, 3010: resin molded product

[0142] 401: arrow

[0143] 500: protrusion

[0144] 500b: outer peripheral surface

[0145] 1000: resin molding system

[0146] 1001: resin supply module

[0147] 1002: resin molding module

[0148] 1003: supply storage module

[0149] 1004: control unit

Claims

1. A compression molding die, comprising: First template; The second module faces the first module and is positioned higher up than the first module. The first mold includes side components and bottom components. The side member has a step difference on the bottom member side of the side member. The step difference includes a first surface of the side member, a second surface extending from the first surface to the bottom member, and a third surface extending downward from the second surface. The bottom component includes an upper surface capable of being configured with resin material, and a sliding surface extending downward from the upper surface and capable of sliding relative to the third surface of the side component. When the resin material is supplied, the third surface of the side member is not exposed.

2. The compression molding die according to claim 1, wherein the third surface of the side member further includes a sealing material.

3. The compression molding die according to claim 1 or 2, further comprising: Consumable material is disposed between the first and second surfaces of the side member and the sliding surface of the bottom member.

4. The compression molding die according to claim 1 or 2, wherein the first surface of the side member is perpendicular to the second surface, or inclined to the second surface.

5. The compression molding die according to claim 1 or 2, wherein the upper surface of the bottom member is provided with a recess.

6. The compression molding die according to claim 5, wherein the recess includes a bottom surface and an inner peripheral surface extending upward from the bottom surface. The inner circumferential surface is perpendicular to the bottom surface, or inclined relative to the bottom surface.

7. A resin molding apparatus comprising a compression molding die as described in any one of claims 1 to 6.

8. The resin molding apparatus according to claim 7, further comprising: The drive mechanism enables the first mold to be raised and lowered. The drive mechanism enables one of the side members and the bottom member to rise and fall independently relative to the other.

9. A resin molding system comprising the resin molding apparatus as described in claim 7 or 8.

10. A method for manufacturing a resin molded article, comprising the step of preparing a compression molding die, and The compression molding die includes: First template; as well as The second module faces the first module and is positioned higher up than the first module. The first mold includes side components and bottom components. The side member has a step difference on the bottom member side of the side member. The step difference includes a first surface of the side member, a second surface extending from the first surface to the bottom member, and a third surface extending downward from the second surface. The bottom component includes an upper surface capable of being configured with resin material, and a sliding surface extending downward from the upper surface and capable of sliding relative to the third surface of the side component. The method for manufacturing the resin molded article further includes the following steps: The object to be shaped is set in the second mold; Resin material is supplied while the third surface of the side member is not exposed; and The object to be molded is resin molded using the resin material.

11. The method for manufacturing a resin molded article according to claim 10, wherein in the resin molding step, the molded object is resin molded in a state in which the upper surface of the bottom member is pushed upwards above the second surface of the side member.

12. The method of manufacturing a resin molded article according to claim 10 or 11, wherein at least before the step of supplying the resin material, the method further comprises the step of providing a sealing material on the third surface of the side member.

13. The method of manufacturing a resin molded article according to claim 10 or 11, wherein at least before the step of supplying the resin material, the method further comprises the step of: disposing a consumable material between the first and second surfaces of the side member and the sliding surface of the bottom member.

14. The method for manufacturing a resin molded article according to claim 10 or 11 further comprises the step of removing excess portions from the molded object formed by the resin.

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