Wafer cleaning system

Abstract

The application provides a wafer cleaning system and relates to the technical field of semiconductor manufacturing. The application comprises a wafer transfer box and a wafer cleaning mechanism. Multiple wafers are stacked in the wafer transfer box at equal intervals. The wafer cleaning mechanism comprises multiple cleaning tanks arranged vertically. A circular ring-shaped ring seat with an inner diameter matching the wafer is arranged in the cleaning tank. The inner wall of the ring seat is provided with a clamping piece. A rotating column is arranged on the side of the cleaning tank. Multiple supporting rods are arranged on the upper and lower parts of the cleaning tank and connected with the rotating column. The bottom of the supporting rod on the upper part of the cleaning tank and the top of the supporting rod on the lower part are respectively provided with an upper cleaning assembly and a lower cleaning assembly. The system further comprises a wafer positioning mechanism and a wafer moving mechanism. The wafer moving mechanism is used for transferring the wafer among the wafer transfer box, the wafer positioning mechanism and the wafer cleaning mechanism. The wafer is positioned in the wafer positioning mechanism and then enters the wafer cleaning mechanism. The application realizes batch cleaning of the wafer and greatly improves the wafer cleaning efficiency.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and more specifically to a wafer cleaning system. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits; its raw material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon crystal seeds, and then slowly pulled out to form a cylindrical single-crystal silicon ingot. After grinding, polishing, and slicing, the silicon ingot forms a silicon wafer. Wafer cleaning refers to the process in integrated circuit manufacturing where chemical or physical methods are used to remove contaminants and oxides from the wafer surface, ensuring the wafer surface meets cleanliness requirements.

[0003] In existing technologies, wafer cleaning equipment can only clean one wafer at a time, making batch cleaning impossible and resulting in low cleaning efficiency, which urgently needs to be addressed. Summary of the Invention

[0004] The purpose of this invention is to develop a wafer cleaning system that can accommodate multiple wafers for simultaneous cleaning, thereby improving wafer cleaning efficiency.

[0005] This invention is achieved through the following technical solution:

[0006] A wafer cleaning system, comprising:

[0007] The wafer transport box contains multiple wafers stacked at equal intervals on both sides.

[0008] The wafer cleaning system includes:

[0009] Multiple cleaning tanks, arranged vertically;

[0010] The ring seat is a ring-shaped structure with an inner diameter that matches the wafer and is rotatably mounted in the cleaning tank.

[0011] Clamping components are located on the inner wall of the ring seat;

[0012] A rotating column is rotatably mounted on the side of the cleaning tank.

[0013] Multiple support rods are respectively installed at the upper and lower parts of the cleaning tank and connected to the rotating column;

[0014] The upper cleaning assembly is located at the bottom of the support rod at the top of the cleaning tank;

[0015] The lower cleaning assembly is located on the top of the support rod at the bottom of the cleaning tank;

[0016] The system also includes a wafer positioning mechanism and a wafer moving mechanism. The wafer moving mechanism is used to transfer wafers between the wafer transfer box, the wafer positioning mechanism, and the wafer cleaning mechanism. The wafer is positioned in the wafer positioning mechanism and then enters the wafer cleaning mechanism.

[0017] Optionally, the upper cleaning assembly includes a first nozzle and a second nozzle located at the bottom of the support rod. Both the first nozzle and the second nozzle are connected to a liquid pipeline, and the first nozzle is also connected to a gas pipeline.

[0018] Optionally, the lower cleaning assembly includes a third nozzle and a cleaning brush located at the top of the support rod, the third nozzle being connected to a liquid pipeline.

[0019] Optionally, the cleaning tank is closed at the bottom and open at the top. A lifting component is provided between the third nozzle, the cleaning brush and the support rod. The lifting component drives the third nozzle and the cleaning brush to rise and fall. The bottom of the cleaning tank is provided with a swing groove for the third nozzle and the cleaning brush to pass through and slide. The bottom of the cleaning tank on both sides of the swing groove is inclined. The edge of the cleaning tank is the higher end of the inclined surface. The bottom sidewall of the cleaning tank is provided with a pipe.

[0020] Optionally, the top of the support rod is provided with a spherical baffle, the third nozzle and cleaning brush are located in the middle of the baffle, the center of the baffle is the lowest point, and a liquid drain pipe is connected to the center of the baffle.

[0021] Optionally, the cleaning tank is provided with a support, the ring seat is rotatably mounted on the support, the outer wall of the ring seat is provided with ring teeth, a gear is rotatably mounted on the support at a corresponding position to mesh with the ring teeth, and a motor connected to the gear transmission is provided on the support.

[0022] Optionally, the wafer positioning mechanism includes a support column, on which a plurality of positioning platforms corresponding to the number of cleaning tanks are slidably mounted, and two positioning blocks are slidably mounted on the positioning platforms, with the sidewalls of the two positioning blocks close to each other forming an arc shape adapted to the wafer shape.

[0023] Optionally, the wafer moving mechanism includes a first moving component that can move in three directions. The first moving component is equipped with a three-axis robotic arm. The three-axis robotic arm is equipped with a support frame. The support frame is equipped with a plurality of forks that are equally spaced in the vertical direction. The spacing between the forks is adapted to the spacing between wafers in the wafer transfer box. The number of forks corresponds to the cleaning tank.

[0024] Optionally, the wafer moving mechanism further includes a second moving component that can move in three directions. The second moving component is provided with a support column, and the support column is slidably provided with brackets corresponding to the number of cleaning tanks. The brackets are provided with suction cups at their ends.

[0025] Optionally, the clamping member includes a ring of pads on the inner wall of the ring seat. The inner wall of the ring seat above the pads has multiple slots. A locking block is slidably mounted on the inner wall of the slot. The locking block slides elastically along the radial direction of the ring seat. An elastic element connected to the locking block is correspondingly provided inside the ring seat. The top of the locking block is a sloping structure, and the end facing the center of the ring seat is the lower end of the sloping structure. The bracket has multiple L-shaped inserts. The horizontal part of the insert is connected to the bracket at the top of the suction cup, and the vertical part of the insert corresponds to the slot.

[0026] The beneficial effects of this invention are:

[0027] This invention enables batch movement, positioning, and cleaning of wafers, significantly improving wafer cleaning efficiency. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a structural diagram of the present invention;

[0030] Figure 2 This is a structural diagram showing the connection between the slider and the scissor lift.

[0031] Figure 3 Here is a structural diagram of the positioning platform;

[0032] Figure 4 Here is a structural diagram of the cleaning tank;

[0033] Figure 5 This is a diagram of the support structure. Detailed Implementation

[0034] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of the invention. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0035] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0036] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0037] like Figures 1-5 As shown, the present invention discloses a wafer cleaning system, including a wafer moving mechanism, a wafer positioning mechanism, and a wafer cleaning mechanism. The wafer transfer box 1 is a container for storing wafers. The wafers are stacked at equal intervals in the wafer transfer box 1. The wafer moving mechanism moves the wafers in the wafer transfer box 1 into the wafer positioning mechanism. After the wafer positioning mechanism completes the wafer positioning, the wafer moving mechanism moves the wafers into the wafer cleaning mechanism for cleaning.

[0038] The wafer moving mechanism includes a first moving component 2, on which a three-axis robotic arm 3 is mounted, and on which a wafer carrier component is mounted. The first moving component 2 drives the three-axis robotic arm 3 to move in three directions along the X-axis, Y-axis, and Z-axis, and the three-axis robotic arm 3 drives the wafer carrier component to remove the wafer from the wafer transfer box 1.

[0039] The wafer carrier assembly includes a carrier frame 4 connected to a three-axis robotic arm 3. The carrier frame 4 has three U-shaped, horizontally positioned forks 5, each with feet. The three forks 5 are evenly spaced vertically, with the spacing matching the spacing between wafers within the wafer transfer box 1. The three-axis robotic arm 3 moves the carrier frame 4, causing the three forks 5 to enter the gaps below three adjacent wafers within the wafer transfer box 1. The carrier frame 4 rises, lifting the three wafers with each fork 5. The three-axis robotic arm 3 then moves the carrier frame 4 outward, removing the three wafers.

[0040] The wafer positioning mechanism includes a pillar 6, three positioning platforms 7 on the side of the pillar 6, the positioning platforms 7 are horizontally arranged, the side of the positioning platforms 7 is provided with sliders 8, and the side of the pillar 6 is provided with a slide rail that is slidably connected to the sliders 8. Through the cooperation of the sliders 8 and the slide rail, the three positioning platforms 7 can slide vertically on the pillar 6.

[0041] The slide rail of the support column 6 is equipped with a scissor lift 10, which is vertically set. The two sides of the scissor lift 10 are rotatably connected to the sliding column. The side wall of the slider 8 is provided with a horizontal groove 9 that is slidably connected to the sliding column. The sliders 8 of the three positioning platforms 7 are equally spaced at the three hinges on the side of the scissor lift 10, and the sliding column at the hinge slides in the groove 9 on the side of the slider 8.

[0042] The scissor lift 10 has drive blocks 12 rotatably mounted at both ends of its bottom. A drive screw 11 rotatably mounts within the support column 6 at the bottom of the scissor lift 10. The drive screw 11 is threadedly engaged with two drive blocks 12 on both sides. The threads of the drive screw 11 and the two drive blocks 12 are opposite in direction, ensuring that the two drive blocks 12 move synchronously in opposite directions when the drive screw 11 rotates. A motor, connected to the drive screw 11, serves as the drive source within the support column 6. As the drive screw 11 rotates, the two drive blocks 12 move closer or further apart, causing the scissor lift 10 to extend or shorten accordingly. The distance between the hinged sections on the sides of the scissor lift 10 increases or decreases accordingly, ensuring that the distance between the three sliders 8 remains equal during these increases or decreases. The three positioning platforms 7 move with the three sliders 8. During the lifting and lowering process of the three sliders 8 as the scissor lift 10 extends and retracts, the sliding column at the hinged section of the scissor lift 10 slides adaptively within the sliding groove 9 of the slider 8.

[0043] Two positioning blocks 14 are slidably mounted on the positioning stage 7. The sidewalls of the two positioning blocks 14 that are close to each other are arc-shaped to match the shape of the wafer. Each positioning block 14 has a transmission rod 15 on its side. The transmission rod 15 is L-shaped and has a rack 16 parallel to the sliding direction of the positioning block 14. A first gear 17 is rotatably mounted on the positioning stage 7 between the racks 16 of the two transmission rods 15. The two racks 16 mesh with the first gear 17 on both sides. The positioning stage 7 is also equipped with a cylinder 18. The extension and retraction direction of the piston rod of the cylinder 18 is parallel to the sliding direction of the positioning block 14. The piston rod of the cylinder 18 is connected to one of the transmission rods 15. The cylinder 18 drives one of the transmission rods 15 to slide. Through the transmission of the first gear 17 and the rack 16, the other transmission rod 15 slides synchronously in the opposite direction, so that the two positioning blocks 14 move closer or further apart. The positioning stage 7 between the two positioning blocks 14 is provided with a slot 13 that is adapted to the fork 5. The fork 5 places the wafer on the positioning stage 7 between the two positioning blocks 14. The fork 5 can pass through the slot 13, and the two positioning blocks 14 move closer to each other to position the wafer.

[0044] The wafer moving mechanism also includes a second moving component 20, which is identical to the first moving component 2 and can also perform three-way movement. The second moving component 20 is equipped with a support column 21, on which three supports 22 are slidably mounted. The supports 22 move vertically up and down on the support column 21, and a linear slide is correspondingly mounted on the support column 21 as the driving source for the supports 22. A suction cup 24 is located at the bottom of the free end of each support 22, used to pick up the wafer on the positioning stage 7.

[0045] The wafer cleaning mechanism includes three cleaning tanks 25 arranged at equal intervals. Each cleaning tank 25 is closed at the bottom and open at the top. A support 28 is provided inside each cleaning tank 25, and a connecting rod is provided on the side of the support 28 to connect with the inner wall of the cleaning tank 25. A ring seat 29 is rotatably mounted on the support 28. The ring seat 29 is annular in shape, and ring teeth 33 are provided on its outer wall. A second gear 34 is rotatably mounted on the support 28 at a corresponding position, meshing with the ring teeth 33. A motor is mounted on the support 28 and is driven by the second gear 34. The motor drives the second gear 34 to rotate, and the second gear 34, in turn, drives the ring seat 29 to rotate.

[0046] The inner diameter of the ring seat 29 is adapted to the diameter of the wafer. A ring platform 30 is provided on the inner wall of the ring seat 29. Multiple slots 31 are provided on the inner wall of the ring seat 29 above the platform 30. The multiple slots 31 are equally spaced in the circumferential direction of the inner wall of the ring seat 29. A locking block 32 is slidably provided on the inner wall of the slot 31. The locking block 32 slides elastically in the radial direction of the ring seat 29. An elastic element, such as a spring, is provided inside the ring seat 29 to connect with the locking block 32. The top of the locking block 32 has a beveled structure, and the end facing the center of the ring seat 29 is the lower end of the beveled structure. The wafer is placed in the ring seat 29 between the platform 30 and the locking block 32. The platform 30 and the locking block 32 serve as wafer clamping components.

[0047] The support 22 is equipped with multiple L-shaped insertion rods 23. The horizontal part of the insertion rod 23 is connected to the support 22 at the top of the suction cup 24, and the vertical part of the insertion rod 23 corresponds to the slot 31. After the suction cup 24 picks up the wafer, the support 22 moves so that the suction cup 24 places the wafer onto the ring seat 29. The support 22 drives the suction cup 24 to move above the ring seat 29. At this time, the wafer and the ring seat 29 are coaxial. The multiple slots 31 are located directly below the vertical parts of the multiple insertion rods 23. The support 22 descends, and the insertion rods 23 are inserted into the slots 31. The insertion rods 23 cooperate with the inclined structure at the top of the locking block 32. The locking block 32 slides inward into the slot 31. After the wafer is placed on the pad 30 as the support 22 descends, the suction cup 24 separates from the wafer. The support 22 rises, and after the vertical part of the insertion rod 23 leaves the slot 31, the locking block 32 slides out again under the elastic force of the elastic element and is on top of the wafer. The positioning stage 7 has a through hole 19 at a corresponding position that matches the vertical part of the insertion rod 23, so that when the suction cup 24 adsorbs the wafer on the positioning stage 7, the vertical part of the insertion rod 23 can be inserted into the through hole 19.

[0048] A rotating column 27 is rotatably mounted on the side of the cleaning tank 25. Four support rods 26 are mounted on the rotating column 27. These four support rods 26 are positioned above the top of the cleaning tank 25, below the bottom of the cleaning tank 25, and between adjacent cleaning tanks 25, ensuring that each cleaning tank 25 has one support rod 26 both above and below it. The support rod 26 above the cleaning tank 25 has an upper cleaning component at its bottom, and the support rod 26 below the cleaning tank 25 has a lower cleaning component at its top.

[0049] The upper cleaning assembly includes a first nozzle 39 and a second nozzle 40 located at the bottom of the support rod 26. Both the first nozzle 39 and the second nozzle 40 are connected to a liquid pipeline, and the first nozzle 39 is also connected to a gas pipeline. The lower cleaning assembly includes a baffle 38 located at the top of the support rod 26. The baffle 38 is spherical, with its lowest point at the center. A third nozzle 36 and a cleaning brush 37 are located in the middle of the baffle 38, and a lower liquid pipe is also connected to the center of the baffle 38. The third nozzle 36 is connected to the liquid pipeline. Lifting components are provided between the third nozzle 36, the cleaning brush 37, and the support rod 26. The lifting components drive the third nozzle 36 and the cleaning brush 37 to move vertically up and down. The lifting components can be electric push rods. When the rotating column 27 rotates, the first nozzle 39, the second nozzle 40, the third nozzle 36, and the cleaning brush 37 rotate accordingly and can reciprocate on and off the wafer.

[0050] The bottom of the cleaning tank 25 is provided with a swing groove 35 for the third nozzle 36 and cleaning brush 37 to pass through and slide. The trajectory of the swing groove 35 is adapted to the swing trajectory of the third nozzle 36 and cleaning brush 37. When the rotating column 27 rotates, it drives the third nozzle 36 and cleaning brush 37 to the bottom of the cleaning tank 25, so that the third nozzle 36 and cleaning brush 37 are directly below the swing groove 35. The lifting component drives the third nozzle 36 and cleaning brush 37 to rise, so that the third nozzle 36 and cleaning brush 37 enter the bottom of the cleaning tank 25. When the rotating column 27 rotates, the third nozzle 36 and cleaning brush 37 swing back and forth in the swing groove 35. The bottom of the cleaning tank 25 on both sides of the swing groove 35 is inclined, and the edge of the cleaning tank 25 is the higher end of the inclined surface. The bottom side wall of the cleaning tank 25 is provided with a drain pipe, which is used to suction the liquid in the cleaning tank 25 and discharge the liquid in the cleaning tank 25 in a timely manner to prevent the liquid from overflowing the cleaning tank 25.

[0051] The wafer carrier assembly removes three wafers from the wafer transport box 1. The spacing between the three positioning stages 7 is adapted to the three wafers. After the wafer carrier assembly places the three wafers into the three positioning stages 7, the scissor lift 10 extends, increasing the spacing between the three positioning stages 7. The positioning blocks 14 on the three positioning stages 7 move to complete the positioning of the wafers. The spacing between the three supports 22 on the support column 21 is adapted to the three positioning stages 7. The second moving component 20 drives the supports 22 to move. The suction cups 24 at the ends of the three supports 22 descend above the three positioning stages 7 respectively. As the supports 22 descend, the suction cups 24 adsorb the positioned wafers and move the three wafers above the three cleaning tanks 25 respectively. The supports 22 descend, allowing the three wafers to enter the three ring seats 29 respectively. The insertion rod 23 first enters the slot 31 to push the card block 32 to slide. After the wafer is placed on the pad 30, the supports 22 rises, causing the insertion rod 23 to leave the slot 31. The card block 32 pops out to realize the placement of the wafer on the ring seat 29. The suction cup 24 on the bracket 22 moves away from the cleaning tank 25 along with the second moving component 20. The motor on the support 28 drives the ring seat 29 to rotate, and the ring seat 29 drives the wafer to rotate. The rotating column 27 rotates, so that the four support rods 26 are above and below the three cleaning tanks 25. The third nozzle 36 is driven by the lifting component to pass through the swing groove 35 and is below the wafer. The cleaning brush 37 is driven by the lifting component to pass through the swing groove 35 and contact the lower surface of the wafer. The rotating column 27 rotates back and forth. The first nozzle 39 and the second nozzle 40 swing back and forth above the wafer to clean the upper surface of the wafer. The third nozzle 36 and the cleaning brush 37 cooperate to swing back and forth at the lower part of the wafer to clean the lower surface of the wafer. During the cleaning process, the liquid flows to the bottom of the cleaning tank 25. Since the bottom of the cleaning tank 25 is sloping and the edge of the swing tank 35 is the higher end of the sloping surface, the liquid will not flow out of the cleaning tank 25. The drain pipe keeps suctioning during the cleaning process to draw out the liquid in the cleaning tank 25. The droplets in the air in the cleaning tank 25 are also drawn out by the drain pipe. After some liquid flows out of the swing tank 35, it falls into the baffle 38 below the cleaning tank 25 and is discharged through the drain pipe at the center of the baffle 38 to prevent liquid accumulation.

[0052] When the wafer is removed from the cleaning tank 25 after cleaning, a separate wafer moving mechanism and wafer positioning mechanism can be provided to move and position the cleaned wafer and place it into the wafer transfer box 1. During this process, the third nozzle 36 and cleaning brush 37 descend under the drive of the lifting component and leave the swing trough 35. The rotating column 27 rotates, causing the support rod 26 to swing the upper and lower cleaning components away from the upper and lower parts of the cleaning tank 25. The bracket 22 drives the insertion rod 23 and suction cup 24. Upon entering the cleaning tank 25, the insert rod 23 enters the slot 31, pushing the slot block 32 to slide, causing the slot block 32 to retract into the ring seat 29 inside the slot 31. The suction cup 24 picks up the wafer. After the spacing between the three positioning platforms 7 of the wafer positioning mechanism is adapted to the suction cup 24 on the three supports 22, the supports 22 drive the wafer onto the three positioning platforms 7. The spacing between the three positioning platforms 7 is adjusted to adapt to the spacing between the three forks 5 on the carrier frame 4. After the three forks 5 carry the three wafers, they are placed into the wafer transfer box 1. Two sets of wafer moving mechanisms and two sets of wafer positioning mechanisms are used for the wafers to be cleaned and the wafers after cleaning, respectively, to prevent the cleaned wafers from being contaminated.

[0053] This invention enables batch movement, positioning, and cleaning of wafers, significantly improving wafer cleaning efficiency.

[0054] The above embodiments are merely preferred embodiments of the present invention and are not intended to limit the technical solutions of the present invention. Any technical solution that can be implemented based on the above embodiments without creative effort should be considered to fall within the scope of protection of the patent of the present invention.

Claims

1. A wafer cleaning system, characterized in that, include: The wafer transport box contains multiple wafers stacked at equal intervals on both sides. The wafer cleaning system includes: Multiple cleaning tanks, arranged vertically; The ring seat is a ring-shaped structure with an inner diameter that matches the wafer and is rotatably mounted in the cleaning tank. Clamping components are located on the inner wall of the ring seat; A rotating column is rotatably mounted on the side of the cleaning tank. Multiple support rods are respectively installed at the upper and lower parts of the cleaning tank and connected to the rotating column; The upper cleaning assembly is located at the bottom of the support rod at the top of the cleaning tank; The lower cleaning assembly is located on the top of the support rod at the bottom of the cleaning tank; The system also includes a wafer positioning mechanism and a wafer moving mechanism. The wafer moving mechanism is used to transfer wafers between the wafer transfer box, the wafer positioning mechanism, and the wafer cleaning mechanism. The wafer is positioned in the wafer positioning mechanism and then enters the wafer cleaning mechanism. The lower cleaning assembly includes a third nozzle and a cleaning brush located at the top of the support rod, and the third nozzle is connected to a liquid pipeline; The cleaning tank is closed at the bottom and open at the top. Lifting components are provided between the third nozzle, the cleaning brush and the support rod. The lifting components drive the third nozzle and the cleaning brush to rise and fall. The bottom of the cleaning tank is provided with a swing groove for the third nozzle and the cleaning brush to pass through and slide. The bottom of the cleaning tank on both sides of the swing groove is sloping. The edge of the cleaning tank is the higher end of the sloping surface. Pipes are provided on the bottom side wall of the cleaning tank. The wafer moving mechanism includes a first moving component that can move in three directions. The first moving component is equipped with a three-axis robotic arm. The three-axis robotic arm is equipped with a support frame. The support frame is equipped with a plurality of forks that are equally spaced in the vertical direction. The spacing between the forks is adapted to the spacing between wafers in the wafer transfer box. The number of forks corresponds to the cleaning tank.

2. The wafer cleaning system according to claim 1, characterized in that, The upper cleaning assembly includes a first nozzle and a second nozzle located at the bottom of the support rod. Both the first nozzle and the second nozzle are connected to a liquid pipeline, and the first nozzle is also connected to a gas pipeline.

3. The wafer cleaning system according to claim 1, characterized in that, The top of the support rod is provided with a spherical baffle, the third nozzle and the cleaning brush are located in the middle of the baffle, the center of the baffle is the lowest point, and the center of the baffle is connected to the liquid drain pipe.

4. The wafer cleaning system according to claim 1, characterized in that, The cleaning tank is provided with a support, the ring seat is rotatably mounted on the support, the outer wall of the ring seat is provided with ring teeth, the support is provided with a gear that meshes with the ring teeth at a corresponding position, and the support is provided with a motor that is connected to the gear transmission.

5. The wafer cleaning system according to claim 1, characterized in that, The wafer positioning mechanism includes a support column, on which multiple positioning platforms corresponding to the number of cleaning tanks are slidably mounted. Two positioning blocks are slidably mounted on the positioning platforms, and the sidewalls of the two positioning blocks that are close to each other are arc-shaped to match the shape of the wafer.

6. The wafer cleaning system according to claim 1, characterized in that, The wafer moving mechanism also includes a second moving component that can move in three directions. The second moving component is provided with a support column, and the support column is provided with a number of brackets corresponding to the cleaning tank. The end of the bracket is provided with a suction cup.

7. The wafer cleaning system according to claim 6, characterized in that, The clamping member includes a ring of pads on the inner wall of the ring seat. The inner wall of the ring seat above the pads has multiple slots. A locking block is slidably mounted on the inner wall of the slot. The locking block slides elastically along the radial direction of the ring seat. An elastic element connected to the locking block is correspondingly provided inside the ring seat. The top of the locking block is a sloping structure, and the end facing the center of the ring seat is the lower end of the sloping structure. The bracket has multiple L-shaped inserts. The horizontal part of the insert is connected to the bracket at the top of the suction cup, and the vertical part of the insert corresponds to the slot.

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