Sensor package structure

Abstract

This invention discloses a sensor packaging structure, comprising a substrate, a sensing chip disposed on the substrate, an annular support layer disposed on the sensing chip, and a light-transmitting sheet disposed on the annular support layer. The light-transmitting sheet has an outer surface and an inner surface located on opposite sides, and an annular notch is formed at the edge of the inner surface. The depth of the annular notch relative to the inner surface is at least 10 micrometers. The light-transmitting sheet is disposed on the annular support layer with the annular notch, and the inner surface of the light-transmitting sheet does not contact the annular support layer, so that the inner surface of the light-transmitting sheet, the inner edge of the annular support layer, and the sensing chip together surround a closed space. Accordingly, by using the annular notch to attach the light-transmitting sheet only to the annular support layer, the probability of delamination between the light-transmitting sheet and the annular support layer is effectively reduced.

Description

Technical Field

[0001] This invention relates to a packaging structure, and more particularly to a sensor packaging structure. Background Technology

[0002] Existing sensor packaging structures include a glass sheet, a sensing chip, and an adhesive layer bonded between the glass sheet and the sensing chip. Since changes to the structure of the sensing chip can easily affect its sensing results, most existing sensor packaging structures focus on improving the adhesive layer to enhance its connection with other components. However, these improvements have limitations.

[0003] Therefore, the inventor believed that the above-mentioned defects could be improved, and thus devoted himself to research and applied scientific principles, and finally proposed an invention that is reasonably designed and effectively improves the above-mentioned defects. Summary of the Invention

[0004] The present invention provides a sensor packaging structure that can effectively improve the defects that may occur in existing sensor packaging structures.

[0005] This invention discloses a sensor packaging structure, comprising: a substrate having a first plate surface and a second plate surface located on opposite sides; a sensing chip disposed on the first plate surface of the substrate and electrically coupled to the substrate; wherein the top surface of the sensing chip has a sensing area and a bearing area located outside the sensing area; an annular support layer disposed on the bearing area of ​​the sensing chip and surrounding the sensing area; and a light-transmitting sheet having an outer surface and an inner surface located on opposite sides, wherein the light-transmitting sheet has an annular notch formed at the edge of the inner surface; wherein the depth of the annular notch relative to the inner surface is at least 10 micrometers, the light-transmitting sheet is disposed on the annular support layer with the annular notch, and the inner surface of the light-transmitting sheet does not contact the annular support layer, so that the inner surface of the light-transmitting sheet, the inner edge of the annular support layer, and the top surface of the sensing chip together surround a closed space.

[0006] Optionally, the light-transmitting sheet has a ring-shaped side surface connected to the outer surface, and the annular notch has a trapezoidal surface connected to the inner surface and a stepped surface connected to the trapezoidal surface and the ring-shaped side surface, and the stepped surfaces are parallel to the inner surface and are separated from each other by a distance equal to the depth.

[0007] Optionally, the substrate includes multiple solder pads located outside the sensing chip, the sensing chip includes multiple connection pads located in the carrier area, and the multiple connection pads are located directly below the stepped surface and embedded in the annular support layer; wherein, the sensor package structure includes multiple metal lines, one end of the multiple metal lines is connected to the multiple solder pads, and the other end of the multiple metal lines is connected to the multiple connection pads and embedded in the annular support layer.

[0008] Optionally, at least one metal wire is partially located within the annular notch and does not contact the annular notch.

[0009] Optionally, the lateral distance between the sensing area and the side surface of the sensing chip is less than 1 millimeter (mm), and the longitudinal distance between the top surface of the sensing chip and the inner surface of the light-transmitting sheet is between 75 micrometers and 200 micrometers.

[0010] Optionally, the outer edge of the annular support layer is flush with the side surface of the sensing chip and the annular side surface of the light-transmitting sheet.

[0011] Optionally, the annular support layer is further defined as a half-cured resin layer, a photoresist layer, or an opaque layer.

[0012] Optionally, the inner edge of the annular support layer is formed with a diffuser surface arranged in an annular shape; wherein, when a light ray passes through the light-transmitting sheet and is projected onto the diffuser surface at an incident angle, the diffuser surface can cause the light ray to be diffused into multiple light rays at multiple angles different from the incident angle.

[0013] Optionally, the diffused bread contains multiple serrated stripes arranged at intervals, and the length direction of each serrated stripe is perpendicular to the sensing area.

[0014] Optionally, the sensor packaging structure includes a package formed on the first plate, and the sensing chip, the annular support layer, and the light-transmitting sheet are all embedded in the package, while at least a portion of the outer surface of the light-transmitting sheet is exposed outside the package.

[0015] In summary, the sensor packaging structure disclosed in this embodiment of the invention effectively reduces the probability of delamination between the light-transmitting sheet and the annular support layer by using the annular notch on the light-transmitting sheet. It can also further improve the process defects that may occur during the manufacturing process of the sensor packaging structure, such as glue overflow during the curing process of the annular support layer, or tilting or cracking of the light-transmitting sheet.

[0016] To further understand the features and technical content of this invention, please refer to the following detailed description and accompanying drawings. However, these descriptions and drawings are only for illustrating the invention and are not intended to limit the scope of protection of the invention in any way. Attached Figure Description

[0017] Figure 1 This is a three-dimensional schematic diagram of the sensor packaging structure according to Embodiment 1 of the present invention.

[0018] Figure 2 for Figure 1 An exploded view omitting the encapsulation body.

[0019] Figure 3 for Figure 1 A top-view diagram.

[0020] Figure 4 for Figure 1 A schematic cross-sectional view along section line IV-IV.

[0021] Figure 5 This is a three-dimensional schematic diagram of the sensor packaging structure according to Embodiment 2 of the present invention.

[0022] Figure 6 This is a three-dimensional cross-sectional view of the sensor packaging structure according to Embodiment 2 of the present invention.

[0023] Figure 7 for Figure 5 A schematic cross-sectional view along section line VII-VII. Detailed Implementation

[0024] The following specific embodiments illustrate the implementation of the "sensor packaging structure" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions of actual dimensions; this is stated beforehand. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention.

[0025] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the related listed items.

[0026] Example 1

[0027] Please see Figures 1 to 4 As shown, this is an embodiment of the present invention. Figure 1 and Figure 2 As shown, this embodiment discloses a sensor packaging structure 100; that is, the internal structure is not any structure for packaging a sensor, and its structural design basis is different from the sensor packaging structure 100 referred to in this embodiment, so the two are not suitable for comparison.

[0028] like Figures 2 to 4As shown, the sensor packaging structure 100 in this embodiment includes a substrate 1, a sensing chip 2 disposed on the substrate 1 and electrically coupled to each other, multiple metal lines 3 electrically coupled to the sensing chip 2 and the substrate 1, an annular support layer 4 disposed on the sensing chip 2, a light-transmitting sheet 5 disposed on the annular support layer 4, and a package 6 formed on the substrate 1.

[0029] In this embodiment, the sensor packaging structure 100 is described as including the aforementioned components, but it can be adjusted and varied according to design requirements. For example, in other embodiments not shown in this invention, the sensor packaging structure 100 may omit multiple metal lines 3, and the sensing chip 2 may be fixed and electrically coupled to the substrate 1 via a flip-chip method; alternatively, the sensor packaging structure 100 may omit or replace the package body 6 with other structures. The structure and connection relationship of each component of the sensor packaging structure 100 in this embodiment will be described below.

[0030] In this embodiment, the substrate 1 is square or rectangular, but the invention is not limited thereto. The substrate 1 has a first surface 11 and a second surface 12 located on opposite sides. A die-bonding region 111 is provided at approximately the center of the first surface 11, and the substrate 1 has a plurality of bonding pads 112 formed outside the die-bonding region 111 (or the sensing chip 2). In this embodiment, the bonding pads 112 are generally arranged in a ring, but the invention is not limited thereto. For example, in other embodiments not shown in the illustration, the bonding pads 112 may also be arranged in two rows on opposite sides of the die-bonding region 111.

[0031] In addition, the substrate 1 may also have a plurality of solder balls 7 on the second plate surface 12, and the sensor package structure 100 can be soldered and fixed to an electronic component (not shown in the figure) by the plurality of solder balls 7, so that the sensor package structure 100 can be electrically coupled to the electronic component.

[0032] In this embodiment, the sensing chip 2 is described as an image sensing chip, but this is not a limitation. The bottom surface 22 of the sensing chip 2 is fixed to the first surface 11 of the substrate 1 (e.g., the die-bonding region 111), and the sensing chip 2 is located inside the plurality of bonding pads 112. It should be further noted that in this embodiment, the sensor packaging structure 100 includes an adhesive material M (e.g., thermally conductive adhesive) disposed on the die-bonding region 111, and the sensing chip 2 is fixed to the die-bonding region 111 by the adhesive material M (e.g., the bottom surface 22 of the sensing chip 2 and the die-bonding region 111 are bonded and fixed to each other by the adhesive material M), but the present invention is not limited thereto. For example, in other embodiments of the present invention not illustrated, the adhesive material M may be omitted or replaced by other components.

[0033] Furthermore, a top surface 21 of the sensing chip 2 includes a sensing area 211 and a supporting area 212 surrounding the sensing area 211 (in a ring shape). It should be further noted that, in this embodiment, the sensor packaging structure 100 can be used to package the smaller sensing chip 2 through an integral structural fit, for example, the lateral distance Dh between the sensing area 211 and the side surface 23 of the sensing chip 2 is less than 1 millimeter (mm), but the present invention is not limited thereto.

[0034] More specifically, in this embodiment, the sensing chip 2 includes a plurality of connection pads 213 located in the bearing area 212, and the number and position of the plurality of connection pads 213 of the sensing chip 2 correspond to the number and position of the plurality of solder pads 112 of the substrate 1, respectively; that is, the plurality of connection pads 213 are generally arranged in a ring and their number is equal to the number of the plurality of solder pads 112.

[0035] One end of each of the plurality of metal lines 3 is connected to a plurality of bonding pads 112, and the other end of each of the plurality of metal lines 3 is connected to a plurality of connecting pads 213, thereby enabling the substrate 1 to be electrically coupled to the sensing chip 2 through the plurality of metal lines 3. Each of the metal lines 3 may be in a normal bond or reverse bond configuration depending on design requirements; this invention does not impose any limitation on this.

[0036] In this embodiment, the annular support layer 4 is defined as an opaque layer, and the annular support layer 4 is disposed on the bearing area 212 of the sensing chip 2 and surrounds the sensing area 211. That is, a plurality of connecting pads 213 are embedded in the annular support layer 4, and the other ends of the plurality of metal wires 3 respectively connected to the plurality of connecting pads 213 are also embedded in the annular support layer 4.

[0037] In this embodiment, the light-transmitting sheet 5 is described as a transparent flat glass, but the present invention is not limited thereto. In this embodiment, the light-transmitting sheet 5 includes an outer surface 51, an inner surface 52 located opposite to the outer surface 51, an annular side surface 53 connected to the outer surface 51, and an annular notch 54 formed at the edge of the inner surface 52 (and the bottom edge of the annular side surface 53).

[0038] The depth D of the annular notch 54 relative to the inner surface 52 is at least 10 micrometers (μm), but the depth D preferably does not exceed 50% of the thickness of the light-transmitting sheet 5. In this embodiment, the annular notch 54 has a trapezoidal surface 541 connected to the inner surface 52 and a stepped surface 542 connected to the trapezoidal surface 541 and the annular side surface 53, and the stepped surface 542 is parallel to the inner surface 52 and spaced apart from each other by a distance equal to the depth D.

[0039] The light-transmitting sheet 5 is disposed above the sensing chip 2 via the annular support layer 4; that is, in this embodiment, the annular support layer 4 is sandwiched between the light-transmitting sheet 5 (the stepped surface 542) and the sensing chip 2 (the supporting area 212). Furthermore, the inner surface 52 of the light-transmitting sheet 5, the inner edge of the annular support layer 4, and the top surface 21 of the sensing chip 2 together form a closed space E, and the sensing area 211 is located within the closed space E and faces the inner surface 52 of the light-transmitting sheet 5.

[0040] Furthermore, in this embodiment, the light-transmitting sheet 5 is limited to being disposed on the annular support layer 4 only with its annular notch 54, and the inner surface 52 of the light-transmitting sheet 5 does not contact the annular support layer 4. This can effectively reduce the probability of delamination defects between the light-transmitting sheet 5 and the annular support layer 4, and can also further improve the process defects that may occur during the manufacturing process of the sensor packaging structure 100, such as bleeding of the annular support layer 4 during the curing process, or tilting or squashing of the light-transmitting sheet 5.

[0041] Furthermore, the light-transmitting sheet 5, through the structural combination of the annular notch 54 and the annular support layer 4, can precisely control a longitudinal distance Dv between the top surface 21 of the sensing chip 2 and the inner surface 52 of the light-transmitting sheet 5, so that the longitudinal distance Dv is between 75 micrometers and 200 micrometers, but the present invention is not limited thereto.

[0042] Furthermore, the light-transmitting sheet 5 preferably conforms to the following structural features with other components to facilitate the packaging of the smaller-sized sensing chip 2. Specifically, a plurality of connecting pads 213 are located directly below the stepped surface 542 of the light-transmitting sheet 5, such that a portion of at least one metal line 3 can be located within the annular notch 54 and not in contact with the annular notch 54. Preferably, the annular side surface 53 of the light-transmitting sheet 5 is flush with (or coplanar with) the outer edge of the annular support layer 4 and the side surface 23 of the sensing chip 2, but the invention is not limited thereto.

[0043] In this embodiment, the package 6 is formed on the first surface 11 of the substrate 1, and its edges are flush with the edges of the substrate 1. The sensing chip 2, the annular support layer 4, the light-transmitting sheet 5, and portions of each of the metal lines 3 are embedded within the package 6, and at least a portion of the outer surface 51 of the light-transmitting sheet 5 is exposed outside the package 6.

[0044] Furthermore, in this embodiment, the package 6 is described as a liquid compound, but the invention is not limited thereto. For example, in other embodiments not illustrated in this invention, a molding compound may be further formed on the top surface of the liquid compound of the package 6; or, the package 6 may simply be a molding compound.

[0045] Example 2

[0046] Please see Figures 5 to 7 As shown, this is Embodiment Two of the present invention. Since this embodiment is similar to Embodiment One described above, the similarities between the two embodiments will not be repeated. The differences between this embodiment and Embodiment One are roughly explained as follows:

[0047] In this embodiment, the annular support layer 4 is composed of a semi-cured resin (B-stage epoxy) layer or a photoresist layer, and a light-diffusing surface 41 arranged in a ring is formed on the inner edge of the annular support layer 4. The light-diffusing surface 41 includes a plurality of serrated stripes 42 arranged at intervals. In this embodiment, the serrated stripes 42 of the light-diffusing surface 41 are arranged in a ring at equal intervals, but this is not a limitation of the invention. For example, in other embodiments not shown in the present invention, the serrated stripes 42 may also be connected to each other or arranged in a ring at non-equal intervals, depending on design requirements.

[0048] Furthermore, the diffuser surface 41 and the sensing area 211 form an angle σ, which is described as 90 degrees in this embodiment, but the invention is not limited thereto. For example, the angle σ can be adjusted to between 80 and 100 degrees according to design requirements. Preferably, the longitudinal direction of each sawtooth stripe 42 of the diffuser surface 41 is perpendicular to the sensing area 211 of the sensing chip 2.

[0049] Accordingly, when a ray L passes through the light-transmitting sheet 5 and is projected onto the light-scattering surface 41 at an incident angle (e.g.: Figure 6 The diffuser surface 41 (or the plurality of sawtooth stripes 42) can diffuse the light L into multiple light rays at multiple angles different from the incident angle, thereby effectively reducing glare in the sensor packaging structure 100.

[0050] Technical Effects of the Embodiments of the Invention

[0051] In summary, the sensor packaging structure disclosed in this embodiment of the invention effectively reduces the probability of delamination between the light-transmitting sheet and the annular support layer by using the annular notch on the light-transmitting sheet. It can also further improve the process defects that may occur during the manufacturing process of the sensor packaging structure, such as glue overflow during the curing process of the annular support layer, or tilting or cracking of the light-transmitting sheet.

[0052] Furthermore, the sensor packaging structure disclosed in the embodiments of the present invention forms the light-diffusing surface on the inner edge of the annular support layer, thereby enabling light rays that pass through the light-transmitting sheet and are projected onto the light-diffusing surface to be diffused into multiple light rays at multiple angles different from the incident angle, thereby effectively reducing the glare phenomenon generated in the sensor packaging structure.

[0053] Furthermore, when the annular support layer in this embodiment of the invention is implemented using the semi-cured resin or the photoresist layer, it can be manufactured by methods such as stamping, photolithography, printing, or coating. Therefore, the thickness of the annular support layer can be effectively and precisely controlled, and the shape of the annular support layer (e.g., the shape of the diffused surface) can also be precisely shaped. Accordingly, the sensor packaging structure can more effectively reduce the generation of glare.

[0054] Furthermore, in the sensor packaging structure disclosed in the embodiments of the present invention, the diffuser surface of the annular support layer may also be formed with a specific structure (e.g., the length direction of each of the sawtooth stripes of the diffuser surface is perpendicular to the inner surface of the light-transmitting sheet, or the plurality of sawtooth stripes of the diffuser surface are arranged at equal intervals), thereby enabling the sensor packaging structure to further reduce the generation of glare.

[0055] The above-disclosed content is only a preferred and feasible embodiment of the present invention and is not intended to limit the patent scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention specification and drawings are included within the patent scope of the present invention.

Claims

1. A sensor packaging structure, characterized in that, The sensor packaging structure includes: A substrate having a first plate surface and a second plate surface located on opposite sides; A sensing chip is disposed on the first plate surface of the substrate and is electrically coupled to the substrate; wherein, the top surface of the sensing chip has a sensing area and a bearing area located outside the sensing area; A ring-shaped support layer is disposed on the carrier area of ​​the sensing chip and surrounds the sensing area; and A light-transmitting sheet has an outer surface and an inner surface located on opposite sides, and the light-transmitting sheet has an annular notch formed at the edge of the inner surface; wherein the depth of the annular notch relative to the inner surface is at least 10 micrometers, the light-transmitting sheet is disposed on the annular support layer with the annular notch, and the inner surface of the light-transmitting sheet does not contact the annular support layer, so that the inner surface of the light-transmitting sheet, the inner edge of the annular support layer, and the top surface of the sensing chip together surround a closed space.

2. The sensor packaging structure according to claim 1, characterized in that, The light-transmitting sheet has an annular side surface connected to the outer surface, and the annular notch has a trapezoidal surface connected to the inner surface and a stepped surface connected to the trapezoidal surface and the annular side surface. The stepped surfaces are parallel to the inner surface and are spaced apart from each other by a distance equal to the depth.

3. The sensor packaging structure according to claim 2, characterized in that, The substrate includes a plurality of solder pads located outside the sensing chip, the sensing chip includes a plurality of connection pads located in the bearing area, and the plurality of connection pads are located directly below the stepped surface and embedded in the annular support layer; wherein, the sensor packaging structure includes a plurality of metal wires, one end of the plurality of metal wires is connected to the plurality of solder pads, and the other end of the plurality of metal wires is connected to the plurality of connection pads and embedded in the annular support layer.

4. The sensor packaging structure according to claim 3, characterized in that, At least one of the metal wires is partially located within the annular notch and does not contact the annular notch.

5. The sensor packaging structure according to claim 1, characterized in that, The lateral distance between the sensing area and the side surface of the sensing chip is less than 1 mm, and the longitudinal distance between the top surface of the sensing chip and the inner surface of the light-transmitting sheet is between 75 micrometers and 200 micrometers.

6. The sensor packaging structure according to claim 5, characterized in that, The outer edge of the annular support layer is flush with the side surface of the sensing chip and the annular side surface of the light-transmitting sheet.

7. The sensor packaging structure according to claim 1, characterized in that, The annular support layer is further defined as a half-cured resin layer, a photoresist layer, or an opaque layer.

8. The sensor packaging structure according to claim 1, characterized in that, The inner edge of the annular support layer has a diffuser surface arranged in an annular shape; wherein, when a light ray passes through the light-transmitting sheet and is projected onto the diffuser surface at an incident angle, the diffuser surface can cause the light ray to be diffused into multiple light rays at multiple angles different from the incident angle.

9. The sensor packaging structure according to claim 8, characterized in that, The diffused light bread contains a plurality of serrated stripes arranged at intervals, and the length direction of each serrated stripe is perpendicular to the sensing area.

10. The sensor packaging structure according to claim 1, characterized in that, The sensor packaging structure includes a package formed on the first plate surface, and the sensing chip, the annular support layer, and the light-transmitting sheet are all embedded within the package, while at least a portion of the outer surface of the light-transmitting sheet is exposed outside the package.

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