A massive ultra-dense multi-beam antenna system

Abstract

The application discloses a large-scale super-dense multi-beam antenna system, which comprises a transmitting phased array and a receiving phased array with the same structure, the transmitting phased array receives a transmitting beam and then transmits antenna signals outward, and the receiving phased array receives the antenna signals and forms a receiving beam; the receiving phased array comprises a plurality of receiving antenna subarrays, each receiving antenna subarray comprises a plurality of AIP devices, a baseband analog synthesis module and a digital acquisition and chain synthesis module, the AIP device comprises a plurality of antennas connected in sequence, a low-noise amplifier, an I / Q frequency converter and a baseband analog power divider connected with each I / Q frequency converter, the baseband analog synthesis module synthesizes signals output by baseband analog synthesizers of all the AIP devices and then outputs the signals to the digital acquisition and chain synthesis module; the application has the advantages that a large-scale super-dense multi-beam phased array antenna system hardware integration is realized.

Description

Technical Field

[0001] This invention relates to the field of multi-beam antennas, and more specifically to a large-scale ultra-dense multi-beam antenna system. Background Technology

[0002] Low-Earth orbit (LEO) communication satellites operate at low altitudes and have short on-orbit times, requiring rapid scheduling and placing increasing demands on payload flexibility. Phased array antennas, employing electronic scanning mechanisms, offer advantages such as flexible scheduling and fast response, and are playing an increasingly important role in LEO satellite communication payloads. Therefore, research on phased array antennas, especially multi-beam phased array antennas, is a crucial part of LEO communication satellite research.

[0003] Driven by continuous advancements in semiconductor epitaxial materials technology and microwave monolithic integrated circuit processes, microwave monolithic integrated circuits are gradually developing towards multifunctionality. Because the interconnections between different functional circuits in a multifunctional chip are completed internally, the number of solder joints is greatly reduced, significantly decreasing chip size, lowering costs, and improving integration consistency and reliability. This provides strong support for the high-density integration of phased array antennas.

[0004] Currently, most on-orbit phased array antennas both domestically and internationally are concentrated in the L-Ka band. The hardware integration of phased arrays has undergone a transformation from a brick-like approach of multi-module integration to a tile-like approach of multi-chip integration, with an integration density reaching 7mm. 2 / Unit / beams, limited by system architecture and manufacturing processes, have limited capacity and scale. With increasing beam count, higher frequencies, and larger phased array sizes, existing phased array system architectures struggle to achieve large-scale, ultra-dense multi-beam phased array antenna system hardware integration. For example, Chinese Patent Publication No. CN101651480A discloses an active antenna, base station, refresh amplitude, and phase method, along with signal processing, invented to address the problem of complex and unreliable phase-shifting network structures. The active antenna or base station includes an antenna element array, a transceiver unit array, a digital processing unit, and a transceiver calibration unit. When receiving signals, the transceiver unit down-converts and demodulates the RF signal from the antenna element into an IQ analog signal, which is then output to the digital processing unit. The digital processing unit converts the down-converted and demodulated IQ analog signal into an IQ digital signal and performs digital beamforming on the IQ digital signal according to the transceiver calibration unit. When transmitting signals, the transceiver unit up-converts the IQ analog signal from the digital processing unit into an RF signal and outputs it to the antenna element. The digital processing unit performs serial-to-parallel conversion of the baseband unit's signal into an IQ digital signal and performs digital beamforming on the IQ digital signal according to the transceiver calibration unit. This method uses digital beamforming to address the complexity and unreliability of phase-shifting network structures. However, digital beamforming faces challenges such as high cost, narrow bandwidth, and high power consumption. Its integration is limited, and digital phased arrays are limited in bandwidth and power consumption, making it difficult to support large-scale ultra-dense multi-beam phased array antenna systems. Its use in large-scale millimeter-wave arrays, especially broadband systems, is not engineering feasible. Summary of the Invention

[0005] The technical problem to be solved by this invention is that the existing phased array system architecture is difficult to realize the hardware integration of large-scale ultra-dense multi-beam phased array antenna systems.

[0006] This invention solves the aforementioned technical problems by employing baseband analog multi-beamforming within subarrays and digital chain-synthesis technology between subarrays. Specifically, the technical means include: a large-scale ultra-dense multi-beam antenna system comprising a transmitting phased array and a receiving phased array with identical structures. The transmitting phased array receives the transmitting beam and then transmits antenna signals outwards. The receiving phased array receives the antenna signals and forms a receiving beam. The receiving phased array includes several receiving antenna subarrays, each of which includes multiple AIP devices, a baseband analog synthesis module, and a digital acquisition and chain-synthesis module. The AIP devices include multiple antennas, low-noise amplifiers, etc. The I / Q inverter and the baseband analog power divider connected to each I / Q inverter also include a phase shifter connected to each baseband analog power divider and a baseband analog synthesizer that synthesizes the output signals of each phase shifter. The baseband analog synthesis module synthesizes the signals output by the baseband analog synthesizer of all AIP devices into 8 pairs of beam analog signals and outputs them to the digital acquisition and chain synthesis module for analog-to-digital conversion to form 8 pairs of beam digital signals. The module then superimposes the 8 pairs of beam digital signals sent from the neighboring subarray with the 8 pairs of beam digital signals of the current subarray and finally outputs 8 pairs of received beam digital signals synthesized from multiple subarrays.

[0007] This invention employs a three-level hybrid digital-analog integrated architecture at the device, subarray, and full array levels. It utilizes AIP devices to achieve signal transmission / reception, frequency conversion, amplification, phase shifting, and primary multi-beamforming, i.e., primary multi-beam baseband analog beamforming is implemented at the device level. Multiple AIP devices are integrated into a single subarray, which is then synthesized via a baseband analog synthesis module. This secondary multi-beam baseband analog beamforming is implemented within the subarray. After synthesis, the beam signals are digitized through a digital acquisition and chain synthesis module within the subarray, achieving high-speed digitization at the subarray level. These signals are then superimposed with eight pairs of digital beam signals from adjacent receiving antenna subarrays, ultimately outputting eight pairs of digital receiving beam signals synthesized from multiple subarrays. This chain interconnection of subarrays enables full-array chain digital beamforming, achieving a high degree of integration across the entire antenna system. This solves the technical challenge of achieving large-scale, ultra-dense multi-beam phased array antenna system hardware integration in existing phased array architectures.

[0008] Furthermore, each receiving antenna subarray includes 64 AIP devices, a baseband analog synthesis module, and a digital acquisition and chain synthesis module. Each AIP device includes 16 sequentially connected antennas, a low-noise amplifier, an I / Q converter, and a 1:8 baseband analog power divider connected to each I / Q converter. It also includes a phase shifter connected to the output of each baseband analog power divider and an 8:1 baseband analog synthesizer that synthesizes the output signals of each phase shifter. In this case, each AIP device outputs 8 pairs of signals. The baseband analog synthesis module includes multiple... Each 8:1 baseband analog synthesizer first synthesizes 64 pairs of signals from 64 AIP devices into 64 pairs of signals. Then, it synthesizes these 64 pairs of signals into 8 pairs of signals and outputs them to the digital acquisition module. The digital acquisition module includes 8 ADC converters, which convert the 8 pairs of beam analog signals output from the baseband analog synthesis module into 8 pairs of beam digital signals. These 8 pairs of signals are then superimposed with the 8 pairs of beam digital signals from the adjacent receiving antenna subarray and finally output as 8 receiving beam digital signals synthesized from multiple subarrays.

[0009] Furthermore, the transmitting phased array and the receiving phased array are arranged in a square, with 96 rows and 96 columns. Each transmitting phased array has 9 transmitting antenna subarrays, and each receiving phased array has 9 receiving antenna subarrays.

[0010] Furthermore, the AIP device is packaged using a three-dimensional heterogeneous active packaging method based on silicon-based MEMS technology.

[0011] Furthermore, the AIP device is packaged using a three-layer stacked structure. The top layer is the upper substrate layer with double-sided wiring; the middle layer is a silicon interposer board, in which multiple GaAs chips are buried before wiring, and each antenna is connected to the corresponding GaAs chip through metallized vias; the bottom layer is the lower substrate, in which the baseband multi-beam chip is buried between the silicon interposer board and the lower substrate, and connected to the upper electrical layer through bump soldering. The AIP device is interconnected with external circuits through a ball grid array (BGA). The GaAs chip integrates a low-noise amplifier, and the baseband multi-beam chip integrates an I / Q inverter, a 1:8 baseband analog power divider, a phase shifter, and an 8:1 baseband analog synthesizer.

[0012] Furthermore, the multi-beam antenna system is integrated using a combination of vertical microsystem chip integration and horizontal standard subarray partitioning.

[0013] Furthermore, the vertical microsystem chip integration divides the entire antenna system into three functional layers: the first layer is the analog circuit layer, the second layer is the structural thermal control layer, and the third layer is the digital circuit layer. These layers are tightly connected to form a single unit. The analog circuit layer is equipped with an analog signal distribution board, the digital circuit layer is equipped with a digital signal board, and the structural thermal control layer is equipped with a structural thermal control board. The AIP devices are directly soldered onto the analog signal distribution board. The analog signal distribution board also integrates the power supply, control, and secondary multi-beam analog signal synthesis (i.e., baseband analog synthesis module) for the AIP devices. The digital signal distribution board integrates an ADC converter and secondary power conversion and distribution circuits.

[0014] Furthermore, the horizontal standard subarray division involves dividing the receiving phased array into multiple receiving antenna subarrays, which are then combined into one output using a digital acquisition and chain synthesis module. This output contains eight receiving beams. Similarly, the transmitting phased array is divided into multiple transmitting antenna subarrays, which are then combined into one output using a digital acquisition and chain synthesis module. This output contains eight transmitting beams.

[0015] The advantages of this invention are:

[0016] (1) This invention uses a three-level hybrid digital-analog integrated architecture of devices, subarrays, and full array. It uses AIP devices to realize signal transmission / reception, frequency conversion, amplification, phase shifting, and primary multi-beamforming, realizing the device-level implementation of primary multi-beamforming. Multiple AIP devices are integrated in one subarray, which is synthesized by the baseband analog synthesis module and each beam signal is digitized to realize high-speed digitization at the subarray level. After being superimposed with 8 pairs of digital signals from the adjacent receiving antenna subarray, the final output is 8 receiving beams synthesized from multiple subarrays. Thus, each subarray is interconnected in a chain to realize chain-type digital beamforming of the full array. The entire antenna system achieves high integration and solves the technical problem that the existing phased array system architecture is difficult to realize the hardware integration of large-scale ultra-dense multi-beam phased array antenna system.

[0017] (2) The signal output by the low noise amplifier of the present invention is converted to baseband by I / Q frequency converter and then phase shifted. The baseband analog multi-beamforming method solves the problem that digital multi-beamforming is difficult to meet the bandwidth requirements and the problems of post-stage synthesis compensation amplification pressure and heat dissipation pressure faced by the radio frequency analog beamforming method under high integration density.

[0018] (3) This invention uses Si-based CMOS technology to achieve high baseband multi-beam forming network integration density, and improves the single-chip integration scale and integration density by 10 times on the existing basis. It solves the bottleneck problem of multi-beam multi-channel integration at high frequency, reduces integration pressure, and provides sufficient space for heat dissipation of active devices.

[0019] (4) This invention converts all frequencies to the corresponding frequencies of the baseband circuit through an I / Q frequency converter, thereby achieving system beamforming without changing the system baseband and subsequent digital circuits. It has a wide range of applicable frequencies and is universally applicable.

[0020] (5) The high-density integration of the chip and device of the present invention greatly reduces the system material consumption and space cost, thereby greatly reducing the cost of phased array.

[0021] (6) The application of technologies such as longitudinal microsystem chip integration, horizontal standard subarray division, and digital chain synthesis between subarrays in this invention greatly simplifies the composition of system modules and the complexity of internal and external interfaces. Compared with the traditional integration method, the phased array antenna profile is reduced by 70% and the weight can be reduced by 50%. Attached Figure Description

[0022] Figure 1 This is a structural block diagram of a large-scale ultra-dense multi-beam antenna system provided in an embodiment of the present invention;

[0023] Figure 2 This is a schematic diagram of a large-scale ultra-dense multi-beam antenna system provided in an embodiment of the present invention;

[0024] Figure 3 This is a schematic diagram of a receiving antenna subarray of a large-scale ultra-dense multi-beam antenna system provided in an embodiment of the present invention;

[0025] Figure 4 This is a schematic diagram of the AIP device package for a large-scale ultra-dense multi-beam antenna system provided in an embodiment of the present invention;

[0026] Figure 5 This is a schematic diagram of the overall structure and packaging of a large-scale ultra-dense multi-beam antenna system provided in an embodiment of the present invention. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] For the large-scale, ultra-dense Q / V band spaceborne broadband multi-beam phased array antenna 111, with an element spacing of only 3.25 mm, if the number of beams is 16, the integration density needs to reach 1.125 mm. 2 / Unit / Beam. The integration density of intermediate frequency analog multi-beamforming cannot meet the requirements, and the bandwidth of digital multi-beamforming cannot meet the needs. While RF analog beamforming, using Si-based CMOS technology, promises to achieve multi-functional integration of 4 channels × 8 beams in the Q / V band within a 6.5mm*6.5mm area using a single chip, the pressure on subsequent synthesis, compensation, amplification, and heat dissipation is extremely high at this integration density, making it impossible for some phased array system architectures to achieve. Baseband analog beamforming, because its beamforming is in the baseband, can use lumped parameters to implement the beamforming circuit, greatly increasing the integration density and providing ample space for subsequent synthesis and heat dissipation. Therefore, there is an urgent need for a large-scale ultra-dense multi-beam antenna system architecture based on baseband analog multi-beamforming to solve the technical challenges faced by millimeter-wave large-scale multi-beam phased array antennas.

[0029] like Figures 1 to 3 As shown, this invention provides a large-scale ultra-dense multi-beam antenna system, including a transmitting phased array 200 and a receiving phased array 100 with identical structures. The transmitting phased array 200 receives the transmit beam and then transmits the signal from antenna 111 outwards. The receiving phased array 100 receives the signal from antenna 111 to form a receiving beam. An example is a large-scale (9216 elements each for transmitting and receiving) phased array antenna 111 with a Q / V band satellite-borne broadband 16-beam configuration (8 beams each for transmitting and receiving). Since the transmitting phased array 200 and the receiving phased array 100 have the same structure, the following description will only use the receiving phased array 100 as an example.

[0030] Continue reading Figures 1 to 3The receiving phased array 100 is arranged in a square, with 96 rows and 96 columns. In engineering, a modular design is adopted, with each subarray module consisting of 1024 units forming a complete and independent subarray module with complete functions including telecommunications, power supply, structure, and control. The entire array is divided into 3*3=9 subarrays. The receiving phased array 100 mainly consists of 9 receiving antenna subarrays 1 and a structural thermal control board. Each receiving antenna subarray 1 includes 64 AIP devices 11, a baseband analog synthesis module 12, and a digital acquisition and chain synthesis module 13. Each AIP device 11 includes 16 sequentially connected antennas 111, a low-noise amplifier 112, an I / Q inverter 113, and a 1:8 baseband analog power divider (not shown) connected to each I / Q inverter 113. It also includes a phase shifter 114 connected to the output of each baseband analog power divider and an 8:1 baseband analog synthesizer that synthesizes the output signals of all phase shifters 114. Each AIP device 11 outputs 8 pairs of signals. The baseband analog synthesis module 12 includes multiple 8:1 baseband analog synthesizers. First, the 64×8 pairs of signals from the 64 AIP devices 11 are synthesized into 64 pairs of signals by the 64 8:1 baseband analog synthesizers. Then, the 64 pairs of signals are synthesized into 8 pairs of signals by 8 8:1 baseband analog synthesizers and output to the digital acquisition and chain synthesis module 13. The digital acquisition and chain synthesis module 13 includes 8 ADC converters, which convert the 8 pairs of signals output by the baseband analog synthesis module 12 into 8 pairs of digital signals. The 8 pairs of digital signals from each receiving antenna subarray 1 are superimposed to finally output 8 receiving beams. This embodiment only provides a specific implementation method. In actual applications, the baseband analog power divider and baseband analog synthesizer are not limited to using 8:1 baseband analog synthesizers, 16:1 baseband analog synthesizers, or 1:8 baseband analog power dividers. They can be selected according to the actual situation, as long as 8 pairs of signals are ultimately output.

[0031] The working principle of the receiving phased array 100 is as follows: After receiving the user signal, the receiving phased array 100 amplifies and performs I / Q conversion to baseband via AIP devices 11. Weighting, shifting, and delay are then applied to the baseband signal to synthesize eight independent scanning beam signals, achieving device-level multi-beamforming of the received signal. Within each subarray, the signals from the 64 AIP devices 11 within that subarray undergo next-level baseband multi-beamforming, and the synthesized signal is then converted by an A / D converter to achieve subarray-level multi-beamforming. Finally, the digital multi-beam signals from the 1119 subarrays of the receiving phased array 100 antenna are added one by one to achieve full-array-level multi-beamforming of the phased array system. The synthesized signal can then be sent to the satellite switching network.

[0032] like Figure 4As shown, the AIP device 11 is packaged using a three-dimensional heterogeneous active packaging method based on silicon-based MEMS technology. The AIP device 11 uses a three-layer stacked structure. The top layer is the upper substrate layer with double-sided wiring; the middle layer is a silicon interposer board, in which multiple GaAs chips are embedded before wiring, and each antenna 111 is connected to the corresponding GaAs chip through metallized vias; the bottom layer is the lower substrate, in which the baseband multi-beam chip is embedded between the silicon interposer board and the lower substrate, and connected to the upper electrical layer through bump soldering. The AIP device 11 is interconnected with external circuits through a ball grid array (BGA). A low-noise amplifier 112 is integrated on the GaAs chip, and an I / Q inverter 113, a 1:8 baseband analog power divider, a phase shifter 114, and a 16:1 baseband analog synthesizer are integrated on the baseband multi-beam chip. (Continue reading...) Figure 4 The AIP device 11 integrates 16 antenna elements (111), 16 low-noise amplifier chips (112) based on gallium arsenide, and a baseband multi-beam chip integrating 16 elements * 8 beams for a total of 128 beam channels. The baseband multi-beam chip utilizes Si-based CMOS technology, integrating 16 channels of I / Q conversion, local oscillator generation and distribution, 32 1:8 power dividers, 32 channels * 8 beams for a total of 256 phase-shift attenuation channels, 16 16:1 combiners, and 16 delay compensation amplifier circuits within an 8mm * 8mm chip, achieving a single-chip integration density of 0.25mm². 2 / channel / beam.

[0033] like Figure 5 As shown, the multi-beam antenna 111 system is integrated using a vertical microsystem chip integration and a horizontal standard subarray division method. The vertical microsystem chip integration divides the entire antenna 111 system into three functional layers: the first layer is the analog circuit layer, the second layer is the structural thermal control layer, and the third layer is the digital circuit layer. These layers are tightly connected to form a single unit. The analog circuit layer has an analog signal distribution board, the digital circuit layer has a digital signal board, and the structural thermal control layer has a structural thermal control board. The AIP device 11 is directly soldered onto the analog signal distribution board. The analog signal distribution board also integrates the power supply, control, and secondary multi-beam analog signal synthesis (i.e., baseband analog synthesis module 12) for the AIP device 11. The digital signal distribution board integrates an ADC converter and secondary power conversion and distribution circuits. The horizontal standard subarray division involves dividing the receiving phased array 100 into multiple receiving antenna subarrays 1, which are then combined into one output by the digital acquisition and chain synthesis module 13, with one output containing 8 receiving beams; and dividing the transmitting phased array 200 into multiple transmitting antenna subarrays 111, which are then combined into one output by the digital acquisition and chain synthesis module 13, with one output containing 8 transmitting beams.

[0034] Through the above technical solutions, this invention utilizes a three-level hybrid digital-analog integrated architecture of devices, subarrays, and the entire array. It employs AIP devices 11 to achieve signal transmission / reception, frequency conversion, amplification, phase shifting, and primary multi-beamforming, realizing device-level implementation of primary multi-beamforming. Multiple AIP devices 11 are integrated into a subarray, synthesized by a baseband analog synthesis module 12, and each beam signal is digitized, achieving high-speed digitization at the subarray level. The eight pairs of digital signals from each receiving antenna subarray 1 are superimposed to ultimately output eight receiving beams, thus interconnecting the subarrays in a chain to achieve chain-like digital beamforming across the entire array. The entire antenna 111 system achieves high integration, solving the technical challenge of hardware integration for large-scale ultra-dense multi-beam phased array antenna 111 systems in existing phased array system architectures.

[0035] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A massive ultra-dense multi-beam antenna system, characterized by, The application relates to a multi-subarray multi-beam antenna system, which comprises a structure-same transmitting phased array and receiving phased array, the transmitting phased array receives a transmitting beam to outwardly transmit antenna signals, and the receiving phased array receives the antenna signals to form a receiving beam; the receiving phased array comprises a plurality of receiving antenna subarrays, each receiving antenna subarray comprises a plurality of AIP devices, a baseband analog synthesis module and a digital acquisition and chain synthesis module, the AIP device comprises a plurality of antennas, a low-noise amplifier, an I / Q frequency converter and a baseband analog power divider connected with each I / Q frequency converter in sequence, further comprises a phase shifter connected with each baseband analog power divider and a baseband analog synthesizer for synthesizing output signals of each phase shifter, the baseband analog synthesis module synthesizes signals output by the baseband analog synthesizers of all AIP devices to output 8 pairs of beam analog signals to the digital acquisition and chain synthesis module for analog-digital conversion to form 8 pairs of beam digital signals, and finally outputs 8 pairs of receiving beam digital signals synthesized by the plurality of subarrays after superimposing 8 pairs of beam digital signals sent by adjacent subarrays and 8 pairs of beam digital signals of the subarray; the AIP device is packaged in a three-dimensional heterogeneous active packaging mode based on a silicon-based MEMS technology; the packaging of the AIP device adopts a three-layer stacking structure, the top layer is an upper substrate layer with double-sided wiring, the middle layer is a silicon adapter plate, a plurality of GaAs chips are embedded in the silicon adapter plate and then wired, and each antenna is connected with a GaAs chip at a corresponding position through a metallized via; the bottom layer is a lower substrate, a baseband multi-beam chip is embedded between the silicon adapter plate and the lower substrate and connected with the upper electrical layer through bump welding, the AIP device is interconnected with external circuits through a ball grid array (BGA), a low-noise amplifier is integrated on the GaAs chip, and an I / Q frequency converter, a 1:8 baseband analog power divider, a phase shifter and a 16:1 baseband analog synthesizer are integrated on the baseband multi-beam chip. Each receiving antenna subarray comprises 64 AIP devices, one baseband analog synthesis module and one digital acquisition and chain synthesis module, each AIP device receives 16 antenna unit signals, and the 64 AIP devices output 64*16 antenna unit signals to the digital acquisition and chain synthesis module through the baseband analog synthesis module to form 8 pairs of digital signals through analog-digital conversion.

2. The massive ultra-dense multi-beam antenna system of claim 1, wherein, Each AIP device comprises 16 antennas, a low-noise amplifier, an I / Q frequency converter and a 1:8 baseband analog power divider connected with each I / Q frequency converter in sequence, further comprises a phase shifter connected with the output end of each baseband analog power divider and a 16:1 baseband analog synthesizer for synthesizing output signals of all phase shifters, and each AIP device outputs 8 pairs of signals.

3. The massive ultra-dense multi-beam antenna system of claim 2, wherein, ​ 4. The massive ultra-dense multi-beam antenna system of claim 3, wherein, The baseband analog synthesis module comprises a plurality of 8:1 baseband analog synthesizers, 64x8 pairs of signals of the 64 AIP devices are first synthesized into 64 pairs of signals by the 64 8:1 baseband analog synthesizers, and then the 64 pairs of signals are synthesized into 8 pairs of signals by 8 8:1 baseband analog synthesizers and output to the digital acquisition and chain synthesis module; the digital acquisition and chain synthesis module comprises 8 ADC converters, which respectively convert the 8 pairs of beam analog signals output by the baseband analog synthesis module into 8 pairs of beam digital signals, and after superposition with 8 pairs of beam digital signals of adjacent receiving antenna subarrays, finally output 8 receiving beam digital signals synthesized by multiple subarrays.

5. A large-scale ultra-dense multi-beam antenna system according to claim 4, wherein, The transmitting phased array and the receiving phased array are arranged in a square shape, 96 rows and 96 columns, each transmitting phased array has 9 transmitting antenna subarrays, and each receiving phased array has 9 receiving antenna subarrays.

6. A large-scale ultra-dense multi-beam antenna system according to claim 4, wherein, The multi-beam antenna system adopts longitudinal microsystem chip integration and transverse standard subarray division.

7. A large-scale ultra-dense multi-beam antenna system according to claim 6, wherein, The longitudinal microsystem chip integration divides the entire antenna system into three functional layers, the first layer is an analog circuit layer, the second layer is a structure thermal control layer, and the third layer is a digital circuit layer; the layers are tightly connected to form an integral whole; the analog circuit layer is provided with an analog signal distribution board, the digital circuit layer is provided with a digital signal board, and the structure thermal control layer is provided with structure thermal control components; the AIP devices are directly welded on the analog signal distribution board, the analog signal distribution board also integrates power supply, control and secondary multi-beam analog signal synthesis of the AIP devices, i.e. the baseband analog synthesis module, and the digital signal distribution board integrates ADC converters and secondary power conversion and distribution circuits.

8. The massive ultra-dense multi-beam antenna system of claim 6, wherein, The transverse standard subarray division divides the receiving phased array into a plurality of receiving antenna subarrays, which are synthesized by the digital acquisition and chain synthesis module to output one way, and one way contains 8 receiving beams; the transmitting phased array is divided into a plurality of transmitting antenna subarrays, which are synthesized by the digital acquisition and chain synthesis module to output one way, and one way contains 8 transmitting beams.

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