An electronic device

Abstract

The application provides an electronic device, comprising a heat generating element and a heat dissipation module. The heat dissipation module comprises a centrifugal fan and a heat sink. The centrifugal fan comprises a volute, the volute has an air inlet and an air outlet, the air outlet has a first air outlet area and a second air outlet area, the heat sink comprises a plurality of first heat dissipation fins and a plurality of second heat dissipation fins, two adjacent first heat dissipation fins form a first heat dissipation channel which communicates with the first air outlet area, and two adjacent second heat dissipation fins form a second heat dissipation channel which communicates with the second air outlet area. The width dimension of the second heat dissipation channel closest to the first air outlet area is not less than the width dimension of any first heat dissipation channel, and in any two adjacent second heat dissipation channels, the width dimension of the second heat dissipation channel close to the first air outlet area is less than the width dimension of the second heat dissipation channel away from the first air outlet area. According to the electronic device of the application, the volume of the heat sink is small.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and more particularly to an electronic device. Background Technology

[0002] With the development of electronic device technology, users have increasingly higher functional requirements for electronic devices. To meet these needs, electronic devices integrate more electronic components. This increase in components leads to a greater overall heat generation. To improve heat dissipation, the size of the internal heat dissipation module must be increased, creating a contradiction between miniaturization and high heat dissipation capacity. Summary of the Invention

[0003] This application provides an electronic device that improves the heat dissipation effect of the electronic device.

[0004] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0005] This application provides an electronic device, including: a heat-generating element and a heat dissipation module. The heat dissipation module includes a centrifugal fan and a radiator. The centrifugal fan includes a volute, which has an air inlet and an air outlet, and a volute tongue. The air outlet has a first air outlet area and a second air outlet area. The second air outlet area is located on the side of the first air outlet area closer to the volute tongue. The radiator is thermally connected to the heat-generating element and is located outside the volute, blocking the air outlet. The radiator includes multiple heat sinks, which are spaced apart and parallel to each other in the arrangement direction of the first and second air outlet areas. The heat sink corresponding to the first air outlet area is the first heat sink, and a first heat dissipation channel communicating with the first air outlet area is formed between two adjacent first heat sinks. The heat sink corresponding to the second air outlet area is the second heat sink, and a second heat dissipation channel communicating with the second air outlet area is formed between two adjacent second heat sinks. The width of the second heat dissipation channel closest to the first air outlet area is not less than the width of any first heat dissipation channel, and in any two adjacent second heat dissipation channels, the width of the second heat dissipation channel closer to the first air outlet area is less than the width of the second heat dissipation channel farther from the first air outlet area.

[0006] According to embodiments of this application, in an electronic device, by ensuring that the width of the second heat dissipation channel closer to the first air outlet area is smaller than the width of the second heat dissipation channel farther from the first air outlet area, and ensuring that the width of the second heat dissipation channel closest to the first air outlet area is not smaller than the width of the first heat dissipation channel, the heat dissipation effect of the heat dissipation module is improved, the airflow within the heat dissipation module is increased, and more airflow from outside the electronic device passes through the heat sink, thereby improving the heat dissipation effect of the heat dissipation module. It also reduces the number of second heat sinks, decreasing the size of the heat sink, thus facilitating the miniaturization of the electronic device.

[0007] In one possible implementation of this application, a plurality of first heat sinks are arranged at equal intervals. This arrangement of the plurality of first heat sinks at equal intervals facilitates assembly.

[0008] In one possible implementation of this application, multiple first heat sinks are arranged at unequal intervals.

[0009] To ensure both effective heat dissipation and efficient airflow, and to prevent the dense arrangement of the first heat sink fins from blocking the first airflow area and hindering airflow circulation, thus affecting heat dissipation, in one possible implementation of this application, the average width of the multiple first heat dissipation channels is y1, where y1 satisfies the following formula:

[0010]

[0011] Where x1 is the average wind speed in the first air outlet area, the unit of x1 is m / s, a1 and b1 are both constants, and the value range of a1 is [5, 18], and the value range of b1 is [-20, -10].

[0012] In one possible implementation of this application, in any three adjacent second heat dissipation channels, the difference in width between the two second heat dissipation channels furthest from the first air outlet area is equal to the difference in width between the two second heat dissipation channels closest to the first air outlet area. This allows the spacing between the multiple second heat sinks to vary linearly, thereby simplifying the manufacturing process of the heat sink and reducing manufacturing costs.

[0013] In one possible implementation of this application, the length of the air outlet in the arrangement direction of the first air outlet area and the second air outlet area is L1, and the length of the first air outlet area in the arrangement direction of the first air outlet area and the second air outlet area is L2, where L1 and L2 satisfy: 0.3≤L2 / L1≤0.7. This allows for a reasonable arrangement of the first and second air outlet areas, thereby improving the heat dissipation effect of the heat dissipation module.

[0014] In one possible implementation of this application, 0.45 ≤ L2 / L1 ≤ 0.55.

[0015] In one possible implementation of this application, the heat sink is in the form of a flat plate. This saves space occupied by the heat sink, increases the number of heat sinks, and thus improves the heat dissipation effect of the radiator.

[0016] In one possible implementation of this application, the heat sink extends in a zigzag shape. This increases the heat dissipation area of ​​the heat sink and also increases the residence time of airflow within the heat dissipation channel, thereby improving the heat dissipation effect.

[0017] In one possible implementation of this application, the length of the first heat sink is greater than the length of the second heat sink. This improves the heat dissipation effect of the airflow exiting the first air outlet area and the first heat sink.

[0018] In one possible implementation of this application, the first heat sink and the second heat sink are the same size. This way, only one type of heat sink needs to be manufactured, eliminating the need to manufacture two heat sinks of different sizes separately, thus reducing costs.

[0019] In one possible implementation of this application, the flow area of ​​the first heat dissipation channel gradually decreases and then gradually increases. This facilitates the entry of airflow from the air outlet into the first heat dissipation channel, and increases the airflow pressure at the minimum flow area of ​​the first heat dissipation channel, extending the residence time of the airflow in the first heat dissipation channel, thereby ensuring reliable heat dissipation between the airflow and the first heat sink.

[0020] Specifically, the cross-sectional area of ​​the first heat sink gradually increases and then gradually decreases. For example, the cross-section of the first heat sink is elliptical or spindle-shaped.

[0021] In one possible implementation of this application, the flow area of ​​the second heat dissipation channel gradually decreases first and then gradually increases. This facilitates the entry of airflow from the air outlet into the second heat dissipation channel, and increases the airflow pressure at the minimum flow area of ​​the second heat dissipation channel, extending the residence time of the airflow within the second heat dissipation channel, thereby ensuring reliable heat dissipation between the airflow and the second heat sink.

[0022] Specifically, the cross-sectional area of ​​the second heat sink gradually increases and then gradually decreases. For example, the cross-section of the second heat sink is elliptical or spindle-shaped.

[0023] In one possible implementation of this application, the heat dissipation module further includes a heat-conducting component, which is thermally connected between the heat-generating element and the heat sink.

[0024] In one possible implementation of this application, the heat-conducting component has a support portion, and each heat sink is integrally fixed to the support portion.

[0025] In order to increase the contact area between the heat-conducting component and the heat sink, and thus improve the heat conduction effect of both, the orthographic projection of the heat sink on the support is located within the outer contour of the support.

[0026] In one possible implementation of this application, the end of the support portion furthest from the heat-generating element has a flanged portion that bends towards the side where the heat sink is located. The flanged portion is arranged parallel to the heat sink and is in contact with the heat sink portion furthest from the heat-generating element. This further improves the heat conduction effect between the heat sink and the heat-conducting component.

[0027] In one possible implementation of this application, an extension is connected to the end of the flange furthest from the support, the extension being opposite to the support, and each heat sink is connected between the extension and the support. This further improves the heat conduction effect between the heat sink and the heat-conducting component.

[0028] In one possible implementation of this application, the heat-conducting element is a heat pipe or a heat spreader, the heat-conducting element has an evaporation section and a condensation section, the condensation section has a support portion, and the evaporation section is connected to the heating element.

[0029] In one possible implementation of this application, the electronic device includes a heat collection plate that is in contact with a heating element and is thermally connected to a heat-conducting element.

[0030] In one possible implementation of this application, the orthographic projection of the heating element on the heat collection plate is located within the outer contour of the heat collection plate.

[0031] In one possible implementation of this application, there are two heat dissipation modules, with their air outlets facing the same direction, and the two heat dissipation modules are symmetrically arranged on both sides of the heat-generating element. This improves the heat dissipation performance of the heat dissipation modules, thereby enhancing the performance of the electronic device.

[0032] In one possible implementation of this application, in each centrifugal fan, the second air outlet area is located on the side of the first air outlet area away from the heat-generating element. This facilitates the use of the higher air velocity in the first air outlet area and the higher distribution density of the first heat sink corresponding to the first air outlet area to preferentially dissipate heat from the heat-generating element, thereby improving the heat dissipation efficiency of the heat-generating element. Attached Figure Description

[0033] Figure 1 Schematic diagrams of the structure of electronic devices provided in some embodiments of this application;

[0034] Figure 2 for Figure 1 A perspective view of the keyboard unit of the electronic device shown.

[0035] Figure 3 For along Figure 2 The 3D view shown is a cross-sectional view along line AA;

[0036] Figure 4 According to the diagram Figure 3 A partial structural diagram of the heat dissipation module shown;

[0037] Figure 5 This is a schematic diagram of the structure of a heat sink according to other embodiments of this application;

[0038] Figure 6 This is a wind speed distribution curve at the outlet of the centrifugal fan in the embodiments of this application;

[0039] Figure 7 This is a schematic diagram of the structure of a heat sink according to other embodiments of this application;

[0040] Figure 8 According to Figure 4 A schematic diagram of the heat sink in the heat dissipation module from another direction;

[0041] Figure 9 According to Figure 4 The image shows a front view of the air outlet of a centrifugal fan.

[0042] Figure 10 This is a schematic diagram of the structure of a heat dissipation module according to some embodiments of this application;

[0043] Figure 11 This is a schematic diagram of the structure of a heat dissipation module according to other embodiments of this application;

[0044] Figure 12 This is a schematic diagram of the structure of a heat dissipation module according to some embodiments of this application;

[0045] Figure 13 According to Figure 12 A cross-sectional view of the heat dissipation module's heat-conducting components at line BB;

[0046] Figure 14 This is a schematic diagram of the structure of a heat dissipation module in some other embodiments of this application;

[0047] Figure 15 According to Figure 14 The diagram shows the interaction between the heat dissipation module and the heat-generating element. Detailed Implementation

[0048] In the embodiments of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" and "second" may explicitly or implicitly include one or more of that feature.

[0049] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, "linked" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0050] The directional terms used in the embodiments of this application, such as "inner" and "outer," are merely for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. Furthermore, unless otherwise stated in this application, "multiple" as used in this application refers to two or more.

[0051] In the description of embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0052] In the embodiments of this application, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0053] This application provides an electronic device, which is a type of electronic device with a heat dissipation module. This electronic device includes, but is not limited to, mobile phones, tablet personal computers, laptop computers, personal digital assistants (PDAs), personal computers, laptops, in-vehicle devices, wearable devices, portable music players, radios, televisions, and speakers. Wearable devices include, but are not limited to, smart bracelets, smartwatches, smart head-mounted displays, and smart glasses.

[0054] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of an electronic device 100 provided in some embodiments of this application. In this embodiment, the electronic device 100 is a laptop computer. Specifically, the electronic device 100 includes a display 1 and a keyboard host 2.

[0055] Monitor 1 is used to display images, videos, etc. Keyboard host 2 is rotatably connected to monitor 1. Keyboard host 2 is used to input commands and data, and controls monitor 1 to display images and videos based on the input commands and data. Simultaneously, keyboard host 2 is also used to play audio or music.

[0056] The electronic device 100 can switch between an open state and a closed state. When the electronic device 100 is in the open state, the display 1 and the keyboard host 2 form an angle greater than 0° and less than 180°. When the electronic device 100 is in the closed state, the display 1 covers the keyboard host 2, and the display surface of the display 1 is opposite to the keyboard surface of the keyboard host 2.

[0057] For ease of description in the following embodiments, an XYZ coordinate system is established for the keyboard host 2. Specifically, the extension direction of the rotation axis between the keyboard host 2 and the display 1 is defined as the X-axis direction, the thickness direction of the keyboard host 2 is defined as the Z-axis direction, and the direction perpendicular to both the X-axis and Z-axis directions is defined as the Y-axis direction. It is understood that the coordinate system settings of the keyboard host 2 can be flexibly set according to actual needs, and are not specifically limited here.

[0058] Please see Figure 2 , Figure 2 for Figure 1 A perspective view of the keyboard host 2 of the electronic device 100 shown. Figure 3 For along Figure 2 The perspective view shown is a cross-sectional view along line AA. In this embodiment, the keyboard host 22 includes a housing 21, a middle plate 22, a keyboard 23, a motherboard 24, and a heat dissipation module 25.

[0059] It should be noted that, Figures 2-3The keyboard host 2 is shown only schematically, and the actual shape, size, position, and construction of these components are not subject to change. Figure 2 and Figure 3 As well as the limitations of the accompanying figures below.

[0060] The housing 21 protects the internal structure of the keyboard host 2. The housing 21 is made of materials including, but not limited to, metal and plastic. The housing 21 can be a single, integral structure or formed by assembling multiple parts. For some embodiments, please refer to... Figures 2-3 The housing 21 includes a C-shell 211 and a D-shell 212. The C-shell 211 and D-shell 212 are mated to form an internal receiving space 21a within the housing 21. The C-shell 211 and D-shell 212 can be fixed by snap-fit, adhesive, or threaded connection; no specific limitation is made here. An air inlet 2122 and a heat dissipation vent 2123 are formed on the housing 21. Both the air inlet 2122 and the heat dissipation vent 2123 communicate with the receiving space 21a. For example, the air inlet 2122 and the heat dissipation vent 2123 are formed on the D-shell 212. Of course, it is understood that the air inlet 2122 and the heat dissipation vent 2123 can also be formed on the C-shell 211 and the D-shell 212, respectively. The heat dissipation vent 2123 can be formed on any side wall of the housing 21. For example, the heat dissipation vent 2123 is formed on the rear side wall of the housing 21. In this way, the heat dissipation vent 2123 can be hidden, improving the aesthetic appearance of the electronic device 100. The air inlet 2122 can be formed on any side wall of the housing 21. The air inlet 2122 can be located on the bottom wall of the housing 21. This also allows the air inlet 2122 to be hidden, improving the aesthetic appearance of the electronic device 100. In other embodiments, the electronic device 100 may not have a heat dissipation vent 2123 and an air inlet 2122; in this case, the airflow circulation between the accommodating space 21a and the electronic device 100 can be achieved through the assembly gap of the electronic device 100.

[0061] The middle plate 22 is located within the internal accommodating space 21a of the housing 21. The middle plate 22 is fixed to the inner surface of the C-shell 211 by means of adhesive, snap-fit, threaded connection, riveting, etc. In other embodiments, the middle plate 22 may also be fixed to the inner surface of the D-shell 212. The materials of the middle plate 22 include, but are not limited to, plastic and metal. The middle plate 22 serves as a supporting "skeleton" for the electronic components within the keyboard host 2. The keyboard 23, motherboard 24, and heat dissipation module 25 are fixed to the middle plate 22 directly or indirectly.

[0062] Keyboard 23 is used for inputting commands and data. Keyboard 23 includes a mounting plate 231 and multiple keys 232 connected to the mounting plate 231. (See also...) Figure 3The fixing plate 231 is fixed to the middle plate 22. The middle plate 22 is provided with a first clearance opening 22a. The C-shell 211 is provided with a second clearance opening 211a corresponding to the position of each button 232. The button 232 extends out of the C-shell 211 through the first clearance opening 22a and the second clearance opening 211a corresponding to the button 232.

[0063] The motherboard 24 is used to integrate control chips. Control chips may include a central processing unit (CPU), a graphics processing unit (GPU), an application processor (AP), double data rate synchronous dynamic random access memory (DDR), and universal flash storage (UFS), etc.

[0064] The motherboard 24 can be a rigid circuit board, a flexible circuit board, or a rigid-flex circuit board. The motherboard 24 can use an FR-4 dielectric board, a Rogers dielectric board, or a hybrid dielectric board of FR-4 and Rogers, etc. Here, FR-4 is a designation for a flame-retardant material grade, and the Rogers dielectric board is a high-frequency board.

[0065] A heat dissipation module 25 is disposed within the receiving space 21a. The heat dissipation module 25 is used to dissipate heat from the heat-generating components 3 within the electronic device 100 to ensure the normal operation of the electronic device 100. For example, the heat-generating component 3 may include at least one of the CPU and GPU on the motherboard 24. That is, the heat dissipation module 25 can be used to cool at least one of the CPU and GPU on the motherboard 24.

[0066] Please see Figure 4 , Figure 4 According to Figures 1-3 The diagram shows a partial structural schematic of the heat dissipation module 25. The heat dissipation module 25 includes a centrifugal fan 253 and a radiator 252.

[0067] Specifically, the centrifugal fan 253 includes a volute 2531 and an impeller 2532. The volute 2531 is shaped like a snail's shell. The material of the volute 2531 includes, but is not limited to, metal and plastic. The volute 2531 can be a single structural unit or assembled from multiple parts.

[0068] Please continue reading. Figure 4The volute 2531 has an air inlet 253111 and an air outlet 253121. The impeller 2532 is located inside the volute 2531. Specifically, the air inlet 253111 is located on one axial side of the volute 2531. For example, the axial direction of the volute 2531 is the Z-axis direction. The air outlet 253111 can be located on the axial side of the volute 2531 near the bottom wall of the housing 21, so that the air inlet 2531111 communicates with the air inlet 2122 located on the bottom wall of the housing 21. The air outlet 253121 is located on one radial side of the volute 2531. For example, the air outlet 253121 can face the rear wall of the housing 21, so that the air outlet 253121 communicates with the heat dissipation vent 2123 located on the rear wall of the housing 21. When the impeller 2532 rotates, it can drive the airflow outside the housing 21 to pass through the air inlet 2122 and the air inlet 253111 in sequence, enter the volute 2531, and then exit the housing 21 through the air outlet 253121 and the heat dissipation port 2123 in sequence.

[0069] For details, please continue reading. Figure 4 The volute 2531 includes a volute chamber 25311 and a diffuser 25312. The outer contour of the volute chamber 25311 is part of a generally hollow cylinder. The air inlet 253111 is located on the side wall of the volute chamber 25311 along its axial direction. The shape of the air inlet 253111 includes, but is not limited to, a circle, an ellipse, or an oblong shape. Specifically, the central axis of the air inlet 253111 is collinear with the central axis of the volute chamber 25311. The impeller 2532 is located inside the volute chamber 25311.

[0070] A diffuser 25312 is disposed on the outer peripheral wall of the volute 25311 and communicates with the volute 25311. The end of the diffuser 25312 away from the volute 25311 defines an air outlet 253121. The diffuser 25312 is formed into a flat tube shape, which helps to increase the area of ​​the air outlet 253121.

[0071] The diffuser 25312 has a first sidewall 253122 and a second sidewall 253123 that are radially opposite to each other in the volute 25311. A volute tongue 25313 is formed at the connection between the first sidewall 253122 and the volute 25311. By providing the volute tongue 25313, the airflow entering the volute 2531 from the inlet 253111 can be easily discharged through the outlet 253121 of the diffuser 25312, preventing the airflow from circulating within the volute 25311, thereby increasing the airflow volume of the centrifugal fan 253. The relative direction of the first sidewall 253122 and the second sidewall 253123 is the longitudinal direction of the outlet 253121. Thus, one end of the outlet 253121 along its longitudinal direction is adjacent to the volute tongue 25313, and the other end is away from the volute tongue 25313.

[0072] The heat sink 252 is located outside the volute 2531 and blocks the air outlet 253121. This allows the heat sink 252 to be positioned between the air outlet 253121 and the heat dissipation port 2123. The heat sink 252 is thermally connected to the heating element 3. In this way, during operation, the heat generated by the heating element 3 can be thermally conducted to the heat sink 252. Simultaneously, the centrifugal fan 253 drives airflow from the air inlet 253111 to the air outlet 253121. The airflow blowing out from the air outlet 253121 of the centrifugal fan 253 directly exchanges heat with the heat sink 252 as it flows through it. The heat-exchanged airflow carries away the heat from the heat sink 252 and is then discharged from the heat dissipation port 2123 to the outside of the electronic device 100, thereby achieving the purpose of cooling the electronic device 100.

[0073] For details, please continue reading. Figure 4 The heat sink 252 includes multiple heat sinks 2521. These heat sinks 2521 are spaced apart and arranged parallel to each other along the length of the air outlet 253121. In this way, adjacent heat sinks 2521 can define a heat dissipation channel, which communicates with the air outlet 253121. This facilitates heat exchange between the airflow from the air outlet 253121 and the heat sinks 2521 as it flows through the heat dissipation channel, thereby improving the heat dissipation effect on the heat-generating element 3.

[0074] To improve heat dissipation, the heat sink 2521 is made of metal. For example, the material of the heat sink 2521 may include, but is not limited to, iron, aluminum, copper, or other materials with high thermal conductivity. Please continue reading. Figure 4 The heat sink 2521 is formed in a flat plate shape. This saves space occupied by the heat sink 2521, increases the number of heat sinks 2521, and thus improves the heat dissipation effect of the heat sink 252. Of course, this application is not limited to this; please refer to other examples. Figure 5 , Figure 5 The diagram below shows the structure of the heat sink 2521 in some other embodiments of this application. The heat sink 2521 is a corrugated heat sink, meaning that it extends in a zigzag shape in the direction of airflow within the heat dissipation channel. This increases the heat dissipation area of ​​the heat sink 2521 and also increases the residence time of the airflow within the heat dissipation channel, thereby improving the heat dissipation effect.

[0075] In some examples, the flow area of ​​the heat dissipation channel gradually decreases and then gradually increases in the direction of airflow within the channel. That is, the flow areas at the inlet and outlet of the heat dissipation channel are larger than the flow area in the middle of the channel. This facilitates airflow entering the heat dissipation channel from the outlet 253121, and increases the airflow pressure at the point of minimum flow area, extending the residence time of the airflow within the channel and ensuring reliable heat dissipation from the heat sink 2521. Specifically, the cross-sectional area of ​​the heat sink 2521 gradually increases and then gradually decreases; for example, the cross-section of the heat sink 2521 is elliptical or spindle-shaped. This configuration ensures that the flow area of ​​the heat dissipation channel gradually decreases and then gradually increases in the direction of airflow within the channel.

[0076] In their research to improve the heat dissipation capacity of the heat dissipation module 25, the inventors conducted multiple simulation experiments on the air outlet speed of the centrifugal fan 253's outlet 253121. Unexpectedly, they discovered that the air outlet speed of the centrifugal fan 253's outlet 253121 is not uniformly distributed, and that the distribution of the air outlet speed of the centrifugal fan 253's outlet 253121 exhibits a certain regularity. For detailed simulation results, please refer to... Figure 6 , Figure 6 This is a wind speed distribution curve at the outlet 253121 of the centrifugal fan 253 in this embodiment of the application. Wherein, Figure 6 In the diagram, the origin of the horizontal coordinate represents the end of the air outlet 253121 that is furthest from the volute tongue 25313 along its length (e.g., ...). Figure 4 (The position indicated by arrow M in the diagram). The horizontal axis represents the distance between the origin and the different air outlet positions along the length of air outlet 253121. The vertical axis represents the air outlet velocity.

[0077] according to Figure 6 The curve distribution shown indicates that the air velocity at outlet 253121 is relatively stable as it moves away from the origin, then decreases significantly until it slightly increases near the end of the volute tongue 25313 adjacent to outlet 253121. Specifically, on the horizontal axis, the curve to the left of coordinate value a shows a relatively stable change compared to the curve to the right of coordinate value a. Figure 6The curve shown reflects that the air outlet 253121 has a theoretical dividing point. The distance between this theoretical dividing point and the end of the air outlet 253121 located away from the volute tongue 25313 (i.e., the origin of the coordinate system) along its length is the coordinate value a. The overall air outlet velocity of the air outlet area of ​​the air outlet 253121 located at this theoretical dividing point, away from the volute tongue 25313, is higher than the overall air outlet velocity of the air outlet area of ​​the air outlet 253121 located at this theoretical dividing point, closer to the volute tongue 25313. Furthermore, the curve to the right of coordinate value a reflects that as the distance between the air outlet position of the air outlet 253121 and the origin of the coordinate system increases, the overall air outlet velocity at different air outlet positions of the air outlet 253121 shows a decreasing trend.

[0078] Therefore, based on this research finding, the inventors used the theoretical boundary position or any position near the theoretical boundary position as the actual boundary position (e.g., Figure 4 The air outlet 253121 is divided into a first air outlet region 253121a and a second air outlet region 253121b (indicated by arrow N). Based on the relationship between the airflow velocity changes in the first air outlet region 253121a and the second air outlet region 253121b, the structure of the radiator 252 has been improved. The following section will provide a detailed description of the structure of the radiator 252 corresponding to the first air outlet region 253121a and the second air outlet region 253121b.

[0079] Specifically, the air outlet 253121 has a first air outlet area 253121a and a second air outlet area 253121b, the first air outlet area 253121a and the second air outlet area 253121b are distributed along the length of the air outlet 253121, and the second air outlet area 253121b is located on the side of the first air outlet area 253121a near the volute tongue 25313.

[0080] Please continue reading. Figure 4 Among the multiple heat sinks 2521, the heat sink 2521 corresponding to the first air outlet area 253121a is the first heat sink 2521a. There are multiple first heat sinks 2521a, and two adjacent first heat sinks 2521a can form a first heat dissipation channel 2522a. The first heat dissipation channel 2522a is connected to the first air outlet area 253121a. For example, the width of the multiple first heat dissipation channels 2522a is equal, that is, the multiple first heat sinks 2521a are equally spaced. Thus, by equally spacing the multiple first heat sinks 2521a, assembly is facilitated. Of course, it is understood that in other examples, the multiple first heat sinks 2521a may also be unequally spaced.

[0081] It can be understood that the spacing between any two adjacent heat sinks 2521 is the width of the heat dissipation channel defined by the two heat sinks 2521.

[0082] Among the multiple heat sinks 2521, the heat sink 2521 corresponding to the second air outlet area 253121b is designated as the second heat sink 2521b. There are multiple second heat sinks 2521b. Two adjacent second heat sinks 2521b can form a second heat dissipation channel 2522b. The second heat dissipation channel 2522b communicates with the second air outlet area 253121b. The multiple second heat dissipation channels 2522b are of unequal width, meaning the multiple second heat sinks 2521b are spaced at unequal intervals.

[0083] Specifically, in any two adjacent second heat dissipation channels 2522b, the width of the second heat dissipation channel 2522b closer to the first air outlet area 253121a is smaller than the width of the second heat dissipation channel 2522b farther from the first air outlet area 253121a. That is, in any three adjacent second heat sinks 2521b, the distance between the two second heat sinks 2521b closer to the first air outlet area 253121a is smaller than the distance between the two second heat sinks 2521b farther from the first air outlet area 253121a. Therefore, for multiple second heat sinks 2521b, the closer they are to the first air outlet area 253121a, the smaller the distance between two adjacent second heat sinks 2521b, and the farther they are from the first air outlet area 253121a, the larger the distance between two adjacent second heat sinks 2521b. Furthermore, the distance between the two second heat sinks 2521b closest to the first air outlet area 253121a is the smallest. The distance between the two second heat sinks 2521b that are furthest from the first air outlet area 253121a is the largest.

[0084] Since the air velocity of the second air outlet area 253121b generally decreases in the direction away from the first air outlet area 253121a, by making the width of the second heat dissipation channel 2522b closer to the first air outlet area 253121a smaller than the width of the second heat dissipation channel 2522b farther from the first air outlet area 253121a in any two adjacent second heat dissipation channels 2522b, it is beneficial to make the spacing variation of multiple second heat dissipation fins 2521b more consistent with the air velocity variation of the second air outlet area 253121b in the direction away from the first air outlet area 253121a. This improves the heat dissipation effect of the second heat dissipation fins 2521b, reduces the processing and manufacturing cost of the heat sink, reduces the processing complexity of the heat sink, saves the number of second heat dissipation fins 2521b, and reduces the volume of the heat sink 252, thereby facilitating the miniaturization and thinning design of the electronic device 100.

[0085] Based on this, the width of the second heat dissipation channel 2522b closest to the first air outlet area 253121a is not less than the width of the first heat dissipation channel 2522a. Since the width of the second heat dissipation channel 2522b closest to the first air outlet area 253121a is the smallest among the multiple second heat dissipation channels 2522b, by ensuring that the width of the second heat dissipation channel 2522b closest to the first air outlet area 253121a is not less than the width of the first heat dissipation channel 2522a, the distribution density of the first heat sink 2521a corresponding to the first air outlet area 253121a can be greater than the distribution density of the second heat sink 2521b corresponding to the second air outlet area 253121b. In this way, for the first air outlet area 253121a, where the air outlet speed changes relatively steadily and the air outlet speed is relatively large, the distribution density of the first heat sink 2521a corresponding to the first air outlet area 253121a is relatively large. This can increase the overall heat dissipation area of ​​the heat sink 2521 corresponding to the first air outlet area 253121a, thereby improving the heat exchange effect between the first heat sink 2521a and the airflow flowing out of the first air outlet area 253121a, and thus improving the heat dissipation effect on the heat-generating element 3. Furthermore, since the overall airflow velocity of the second air outlet area 253121b is lower than that of the first air outlet area 253121a, the air pressure of the first air outlet area 253121a is greater than that of the second air outlet area 253121b. By reducing the distribution density of the second heat sinks 2521b corresponding to the second air outlet area 253121b, the air pressure of the second air outlet area 253121b can be increased by reducing the number of second heat sinks 2521b. This is beneficial to increasing the airflow in the entire heat dissipation module 25, allowing more airflow from outside the electronic device 100 to pass through the heat sink 252, thereby improving the heat dissipation effect of the heat dissipation module 25.

[0086] In short, the electronic device 100 according to the embodiments of this application improves the heat dissipation effect of the heat dissipation module 25 by ensuring that the width of the second heat dissipation channel 2522b closer to the first air outlet region 253121a is smaller than the width of the second heat dissipation channel 2522b farther from the first air outlet region 253121a, and that the width of the second heat dissipation channel 2522b closest to the first air outlet region 253121a is not less than the width of the first heat dissipation channel 2522a. This increases the airflow rate in the heat dissipation module 25, allowing more airflow from outside the electronic device 100 to pass through the heat sink 252, thereby improving the heat dissipation effect of the heat dissipation module 25. It also reduces the number of second heat sinks 2521b and the volume of the heat sink 252, thus facilitating the miniaturization and thinning design of the electronic device 100.

[0087] Here, it needs to be explained that "distribution density" refers to the number of heat sinks 2521 installed per unit length along the length direction of the air outlet 253121.

[0088] It is understandable that a heat sink 2521 corresponding to the actual dividing position can be provided on the heat sink 252. This heat sink 2521 can be regarded as the first heat sink 2521a, the second heat sink 2521b, or both. Of course, a heat sink 2521 may not be provided on the heat sink 252 at the actual dividing position.

[0089] Please continue reading. Figure 4 The length of the air outlet 253121 is L1, and the length of the first air outlet area 253121a is L2. L1 and L2 satisfy the condition: 0.3 ≤ L2 / L1 ≤ 0.7. For example, the value of L2 / L1 can be 0.35, 0.4, 0.45, 0.5, 0.55, or 0.6. Therefore, the first air outlet area 253121a and the second air outlet area 253121b are reasonably set to improve the heat dissipation effect of the heat dissipation module 25.

[0090] For the first air outlet area 253121a, where the air outlet velocity changes relatively steadily and the air outlet velocity is relatively large, in order to further improve the heat dissipation effect of the airflow flowing out of the first air outlet area 253121a and the first heat sink 2521a, please refer to... Figure 7 , Figure 7 This is a schematic diagram of the structure of a heat sink 252 according to other embodiments of this application. In the direction of airflow within the heat dissipation channel, the length of the first heat sink 2521a is greater than the length of the second heat sink 2521b. Of course, it is understood that in other embodiments, the dimensions of the first heat sink 2521a and the second heat sink 2521b may be the same. This way, only one type of heat sink 2521 needs to be manufactured, eliminating the need to manufacture two heat sinks 2521 of different sizes separately, thus reducing costs.

[0091] To optimize the structure of the heat sink 252 and improve heat dissipation, in any three adjacent second heat dissipation channels 2522b, the difference in width between the two channels 2522b furthest from the first air outlet region 253121a is equal to the difference in width between the two channels 2522b closest to the first air outlet region 253121a. In other words, in any three adjacent second heat sinks 2521b, the difference between the spacing between the two heat sinks 2521b furthest from the first air outlet region 253121a and the spacing between the two heat sinks 2521b closest to the first air outlet region 253121a is a constant value. For example, please refer to... Figure 8 , Figure 8 According to Figure 4 The diagram shows a schematic representation of the heat sink 252 in the heat dissipation module 25 from another direction. In the direction away from the first air outlet area 253121a, the widths of the plurality of second heat dissipation channels 2522b are d1, d2, d3, d4, d5, d6, d7, d8, and d9, respectively, where d2-d1 = d3-d2 = d4-d3 = d5-d4 = d6-d5 = d7-d6 = d8-d7 = d9-d8 = c, and c is a constant value. For example, the value of c ranges from 0.2mm to 1.5mm. For instance, the value of c can be 0.5mm, 0.8mm, or 1mm. This allows the spacing between the plurality of second heat sinks 2521b to vary linearly, thereby simplifying the manufacturing process of the heat sink 252 and reducing manufacturing costs.

[0092] It is understandable that, in other examples, the spacing between the multiple second heat sinks 2521b may not be linear, but rather non-linear. For example, the width of the multiple second heat dissipation channels 2522b can satisfy the following formula (1) or formula (2):

[0093] d i+1 =kf i 2 +g (1)

[0094] d i+1 =kf i 3 +hf i 2 +g (2)

[0095] Where i represents the i-th second heat sink 2521b among a plurality of second heat sinks 2521b in the direction away from the first heat sink 2521a. d i+1This represents the width of the second heat dissipation channel 2522b formed by the i-th second heat sink 2521b and the (i+1)-th second heat sink 2521b, which is also the distance between the i-th second heat sink 2521b and the (i+1)-th second heat sink 2521b. i This represents the distance between the i-th second heat sink 2521b and the actual boundary position, where k, h, and g are all constants. For example, k, g, and h are all constants greater than 0. i and d i+1 The unit is millimeters. It is understandable that the formula that the width dimensions of the multiple second heat dissipation channels 2522b satisfy is not limited to this. The width dimensions of the multiple second heat dissipation channels 2522b can also satisfy higher-order mathematical function relationships, as long as the spacing of the multiple second heat sinks 2521b changes non-linearly.

[0096] To ensure that the heat sink 252 achieves both good heat dissipation and efficient airflow, and to prevent the dense arrangement of the first heat sink 2521a from blocking the first airflow area 253121a and thus hindering airflow circulation and affecting heat dissipation, the spacing of the multiple first heat sink 2521a needs to be optimized. Specifically, in the embodiments of this application, the average spacing between the multiple first heat sink 2521a is y1, which satisfies the following formula:

[0097]

[0098] Where x1 is the average wind speed of the first air outlet area 253121a, the unit of x1 is m / s, and the unit of y1 is mm. a1 and b1 are both constants, and the value range of a1 is [5, 18], the value range of b1 is [-20, -10], and the value of e is approximately 2.71828.

[0099] The average wind speed x1 in the first air outlet area 253121a can be obtained by measuring the following method. For details, please refer to... Figure 9 , Figure 9 According to Figure 4 The diagram shows a front view of the air outlet 253121 of the centrifugal fan 253. Along the length of the air outlet 253121, multiple spaced and parallel first dividing lines (such as...) are provided at the first air outlet area 253121a. Figure 9 (w1, w2, w3, w4, w5, w6, w7, w8, w9 in the text). Furthermore, along the width direction of the air outlet 253121, multiple spaced and parallel second dividing lines (such as...) are provided at the first air outlet area 253121a. Figure 9In the diagram, v1, v2, v3, v4, v5, and v6 are defined. The first dividing line is perpendicular to and intersects with the second dividing line. Multiple intersection points of the first and second dividing lines can be used as wind speed sampling points. An anemometer is used to sequentially collect the wind speed at each sampling point, and the average wind speed at each sampling point is calculated. This average value is the average wind speed x1 of the first air outlet area 253121a.

[0100] For example, the values ​​of a1 are 5.5, 6, 6.2, 6.5, 6.8, 7, 7.3, 7.5, 7.9, 8, 8.2, 8.6, 8.8, 9, 9.1, 9.2, 9.4, 9.6, 9.8, 10, 10.2, 10.5, 10.8, 11, 11.2, 11.25, 11.265, 11.35, 11.46, and 11.5. 8, 11.67, 11.99, 12, 12.1, 12.23, 12.45, 12.56, 12.6, 12.65, 12.699, 12.7, 12.72, 12.75, 12.78, 13, 13.2, 13.52, 13.56, 14, 14.5, 15, 15.5, 16, 16.5, 17, or 17.5. For example, the value of b1 can be -19.5, -19, -18.8, -18, -17.5, -17, -16.8, -16.5, -16, -15.6, -15.54, -15.55, -15.3, -15.2, -15, -14.9, -14.8, -14.5, -14, -13.5, -13, -12.5, -12, -11.5, -11, or -10.5.

[0101] To ensure optimal heat dissipation for the heat sink 252 and prevent poor heat dissipation due to sparse arrangement of the second heat sinks 2521b, the spacing between the multiple second heat sinks 2521b needs to be optimized. Specifically, in the embodiments of this application, the average spacing between the multiple second heat sinks 2521b is y2, which satisfies the following formula:

[0102]

[0103] Where x2 is the average wind speed of the second air outlet area 253121b, the unit of x2 is m / s, and the unit of y2 is mm. a2 and b2 are both constants, and the value range of a2 is [5, 18], and the value range of b2 is [-20, -10].

[0104] The average wind speed x2 in the second air outlet area 253121b can be obtained by measuring the following method. For details, please refer to [link / reference needed]. Figure 9Along the length of the air outlet 253121, multiple spaced and parallel first grid lines (such as...) are set at the second air outlet area 253121b. Figure 9 (D1, D2, D3, D4, D5, D6, D7, D8, D9 in the diagram). Furthermore, along the width direction of the air outlet 253121, multiple spaced and parallel second grid lines (such as...) are set at the second air outlet area 253121b. Figure 9 The grid lines (F1, F2, F3, F4, F5, F6) are perpendicular to and intersect the second grid lines, forming a mesh. Multiple intersection points of the first and second grid lines can be used as wind speed detection points. An anemometer is used to sequentially collect the wind speed at each detection point, and the average wind speed at each point is calculated. This average value is the average wind speed of the second wind outlet area 253121b multiplied by 2.

[0105] For example, the values ​​of a2 are 5.5, 6, 6.2, 6.5, 6.8, 7, 7.3, 7.5, 7.9, 8, 8.2, 8.6, 8.8, 9, 9.1, 9.2, 9.4, 9.6, 9.8, 10, 10.2, 10.5, 10.8, 11, 11.2, 11.25, 11.265, 11.35, 11.46, and 11.5. 8, 11.67, 11.99, 12, 12.1, 12.23, 12.45, 12.56, 12.6, 12.65, 12.699, 12.7, 12.72, 12.75, 12.78, 13, 13.2, 13.52, 13.56, 14, 14.5, 15, 15.5, 16, 16.5, 17, or 17.5. a2 and a1 can be the same or different.

[0106] For example, the value of b2 can be -19.5, -19, -18.8, -18, -17.5, -17, -16.8, -16.5, -16, -15.6, -15.54, -15.55, -15.3, -15.2, -15, -14.9, -14.8, -14.5, -14, -13.5, -13, -12.5, -12, -11.5, -11, or -10.5. b2 and b1 can be the same or different.

[0107] Please see Figure 10 , Figure 10This is a schematic diagram of the structure of a heat dissipation module 25 according to other embodiments of this application. The heat dissipation module 25 includes a heat-conducting element 251. The heat-conducting element 251 is connected between the heating element 3 and the heat sink 252. In this way, the heat-conducting element 251 can conduct the heat generated by the heating element 3 to the heat sink 252. At the same time, the airflow delivered from the outlet 253121 of the centrifugal fan 253 passes through the heat sink 252, thereby carrying away the heat from the heat sink 252 and dissipating the heat to the outside of the electronic device 100, ensuring the reliability of the operation of the electronic device 100.

[0108] Specifically, the heat-conducting component 251 has a support portion 2511. Each heat sink 2521 can be integrally fixed to the support portion 2511. That is, the heat sink 2521 and the heat-conducting component 251 are an integral structure. This simplifies the manufacturing process of the heat sink 252, reduces production costs, and improves the manufacturing and assembly efficiency of the heat sink 252.

[0109] Of course, this application is not limited to this. In other embodiments, the heat sink 2521 and the heat conductor 251 can also be a separate structure. For example, the heat sink 2521 and the heat conductor 251 can be connected by snap-fit, screws, or adhesive.

[0110] Specifically, the heat sink 2521 is arranged perpendicularly to the support 2511. This achieves a compact structure for the heat sink 252 and the heat conductor 251, while also allowing for the installation of more heat sinks 2521.

[0111] In order to increase the contact area between the heat-conducting component 251 and the heat sink 2521, and thus improve the heat conduction effect of the two, the orthographic projection of the heat sink 2521 on the support 2511 is located within the outer contour of the support 2511.

[0112] To further improve the heat transfer between the heat sink 2521 and the heat conductor 251, please refer to... Figure 11 , Figure 11 This is a schematic diagram of the structure of a heat dissipation module 25 according to some embodiments of this application. The end of the support portion 2511 furthest from the heat-generating element 3 has a flange portion 2512 that bends towards the side where the heat sink 2521 is located. The flange portion 2512 is arranged parallel to the plurality of heat sinks 2521. Furthermore, the flange portion 2512 can be fitted with the heat sink 2521 furthest from the heat-generating element 3. This improves the heat dissipation effect between the heat sink 2521 and the heat conductor 251. Of course, it is understood that the structure of the heat conductor 251 is not limited to this, and the flange portion 2512 may not be provided on the heat conductor 251.

[0113] Of course, this application is not limited to this. In other examples, to further improve the heat transfer effect between the heat sink 2521 and the heat conductor 251, please refer to... Figure 12 , Figure 12 This is a schematic diagram of the structure of a heat dissipation module 25 according to some embodiments of this application. An extension 2513 is connected to the end of the flanged portion 2512 away from the support portion 2511. The extension 2513 is disposed opposite to the support portion 2511. Each heat sink 2521 is connected between the extension 2513 and the support portion 2511. This arrangement helps to further increase the contact area between the heat-conducting element 251 and the heat sink 2521, thereby improving the heat exchange effect and thus improving the heat dissipation effect on the electronic device 100.

[0114] Please see Figure 13 and combined Figure 12 ,in, Figure 13 According to Figure 12 The diagram shows a cross-sectional view of the heat-conducting element 251 at line BB. The heat-conducting element 251 is a heat pipe. Specifically, the heat-conducting element 251 includes an evaporation section and a condensation section. The evaporation section and the condensation section are located at opposite ends of the extending direction of the heat-conducting element 251. The evaporation section is adapted to be connected to the heating element 3. The condensation section has a support portion 2511 (for example, the aforementioned support portion 2511, or the support portion 2511 and the flange portion 2512, or the support portion 2511, the flange portion 2512, and the extension portion 2513 constitute the condensation section).

[0115] Specifically, the heat pipe includes a shell 2512a, a wick 2512b, and end caps. The shell 2512a has a hollow structure, and the wick 2512b covers the inner wall of the shell 2512a. After creating a negative pressure inside the shell 2512a, a suitable amount of working fluid 2512g is filled in, filling the capillary porous material of the wick 2512b, which is tightly attached to the inner wall of the tube, with liquid. The end caps then seal the heat pipe. When one end of the heat pipe (i.e., the evaporation section) is heated, the liquid in the wick 2512b evaporates and vaporizes. The vapor flows to the other end (i.e., the condensation section) under a small pressure difference, releasing heat and condensing into liquid. The liquid then flows back to the evaporation section along the porous material due to capillary force. This cyclical operation achieves rapid heat transfer and evenly distributes the heat to the radiator 252, where the heat is dissipated by the air, thereby improving the heat dissipation efficiency of the electronic device 100 to a certain extent.

[0116] In some embodiments, please refer to Figure 13 The heat pipe is formed into a flat tube. This reduces the space occupied by the heat pipe in the Z-axis direction, which is beneficial for achieving a thinner and lighter design of the electronic device 100.

[0117] In some embodiments, the heat-conducting element 251 can also be a vapor chamber. The vapor chamber is a vacuum cavity with a finely structured inner wall, typically made of copper, and filled with coolant. When heat is conducted from the heat source to the evaporation section, the coolant in the vacuum cavity, heated in a low-vacuum environment, begins to vaporize. It absorbs heat and expands rapidly, quickly filling the entire vacuum cavity. When the gaseous working fluid comes into contact with a relatively cool area, condensation occurs. This condensation releases the heat accumulated during evaporation. The condensed coolant then returns to the evaporation heat source through capillary channels in the microstructure. This process repeats continuously within the cavity, achieving rapid heat transfer and even distribution to the heat sink 252. The heat is then dissipated through the air, thereby improving the heat dissipation efficiency of the electronic device 100 to a certain extent.

[0118] Please see Figure 14 , Figure 14 This is a schematic diagram of the structure of a heat dissipation module 25 in some other embodiments of this application. The electronic device 100 includes a heat collection plate 4. The heat collection plate 4 is in contact with the heating element 3, and the heat collection plate 4 is thermally connected to the heat conductor 251. That is, the heat collection plate 4 can collect the heat generated by the heating element 3 and conduct the heat to the heat conductor 251.

[0119] Optionally, the heat collector plate 4 can be made of copper. Copper has good thermal conductivity and high ductility. Using copper to make the heat collector plate 4 can ensure the thermal conductivity of the heat collector plate 4 while making the heat collector plate 4 thinner, reducing the space occupied by the heat collector plate 4, and simultaneously taking into account the heat dissipation efficiency and the lightweight design of the electronic device 100.

[0120] Please see Figure 14 The heat collection plate 4 can be formed into a rectangular sheet structure. It is understood that in other embodiments, the heat collection plate 4 can also be formed into an elliptical, circular, racetrack-shaped or other structures. This application does not limit the specific shape of the heat collection plate 4.

[0121] To improve the heat collection effect of the heat collector plate 4 on the heating element 3, the orthographic projection of the heating element 3 on the heat collector plate 4 can be located within the heat collector plate 4. This increases the contact area between the heating element 3 and the heat collector plate 4, allowing the heat on the heating element 3 to be quickly transferred to the heat sink 252 through the heat conductor 251, thus improving heat dissipation efficiency. Of course, it is understandable that in other examples, the orthographic projection of the heating element 3 on the heat collector plate 4 can be partially located within the heat collector plate 4.

[0122] Please continue reading. Figure 14 and combined Figure 15 , Figure 15 According to Figure 14The diagram shows the interaction between the heat dissipation module 25 and the heat-generating element 3. The heat collection plate 4 is fixed to the motherboard 24 and is thermally connected to the heat-generating elements 3 such as the CPU and GPU on the motherboard 24. For example, the heat collection plate 4 can be fixed to the motherboard 24 by means of adhesive, snap-fit, threaded connection, etc.

[0123] In some embodiments, please continue reading Figure 15 There are two heat dissipation modules 25. The air outlets 253121 of the two heat dissipation modules 25 face the same direction. The two heat dissipation modules 25 are symmetrically distributed on both sides of the heat-generating element 3. Specifically, the two heat dissipation modules 25 are symmetrically arranged on both sides of the motherboard 24, and the heat collection plate 44 is thermally connected to the heat-conducting component 251 of each heat dissipation module 25. As a result, the heat dissipation performance of the heat dissipation modules 25 can be improved, thereby improving the performance of the electronic device 100.

[0124] To simplify the manufacturing process and reduce costs, the heat collector plate 4 and the heat conductor 251 are integrated into a single unit. However, it is understandable that the heat collector plate 4 and the heat conductor 251 could also be separate units, connected by snap-fit, bolts, or thermally conductive adhesive. To further simplify the manufacturing process and reduce costs, the heat sink 2521, the heat collector plate 4, and the heat conductor 251 are all integrated into a single unit.

[0125] Please continue reading. Figure 15 The volute tongue 25313 of the volute 2531 is located on the side of the diffuser 25312 away from the heating element 3. In this way, the first air outlet area 253121a is closer to the heating element 3 than the second air outlet area 253121b, which is beneficial to utilize the higher air outlet velocity of the first air outlet area 253121a and the first heat sink 2521a with a larger distribution density corresponding to the first air outlet area 253121a to preferentially dissipate heat from the heating element 3, thereby improving the heat dissipation efficiency of the heating element 3.

[0126] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0127] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. An electronic device, characterized in that, include: Heating element; The heat dissipation module includes: A centrifugal fan includes a volute, the volute having an air inlet and an air outlet, the volute having a volute tongue, the air outlet having a first air outlet area and a second air outlet area, the second air outlet area being located on the side of the first air outlet area closer to the volute tongue, and the air outlet velocity of the first air outlet area being greater than the air outlet velocity of the second air outlet area. A heat sink is thermally connected to the heating element and is located outside the volute, blocking the air outlet. The heat sink includes multiple heat sinks, which are spaced apart and arranged parallel to each other in the arrangement direction of the first and second air outlet areas. The heat sink corresponding to the first air outlet area is the first heat sink, and a first heat dissipation channel communicating with the first air outlet area is formed between two adjacent first heat sinks. The heat sink corresponding to the second air outlet area is the second heat sink, and a second heat dissipation channel communicating with the second air outlet area is formed between two adjacent second heat sinks. Wherein, the width of the second heat dissipation channel closest to the first air outlet area is not less than the width of any of the first heat dissipation channels, and in any two adjacent second heat dissipation channels, the width of the second heat dissipation channel closer to the first air outlet area is less than the width of the second heat dissipation channel farther from the first air outlet area. A heat-conducting component is provided, which conducts heat between the heating element and the heat sink. The heat-conducting component includes a support portion, a flange portion, and an extension portion. Each heat sink fin is integrally fixed to the support portion. The end of the support portion away from the heating element is provided with a flange portion that bends toward the side where the heat sink fin is located. The flange portion is arranged parallel to the heat sink fin, and the flange portion is in contact with the heat sink fin furthest from the heating element. The end of the flange portion away from the support portion is connected to an extension portion. The extension portion is opposite to the support portion, and each heat sink fin is connected between the extension portion and the support portion.

2. The electronic device according to claim 1, characterized in that, Multiple first heat sinks are arranged at equal intervals.

3. The electronic device according to claim 1 or 2, characterized in that, The average width of the plurality of the first heat dissipation channels is y1, and y1 satisfies the following formula: Where x1 is the average wind speed of the first air outlet area, the unit of x1 is m / s, the unit of y1 is mm, a1 and b1 are both constants, and the value range of a1 is [5, 18], and the value range of b1 is [-20, -10].

4. The electronic device according to any one of claims 1-3, characterized in that, In any three adjacent second heat dissipation channels, the difference in width between the two second heat dissipation channels farther from the first air outlet area is equal to the difference in width between the two second heat dissipation channels closer to the first air outlet area.

5. The electronic device according to any one of claims 1-4, characterized in that, The length of the air outlet in the arrangement direction of the first air outlet area and the second air outlet area is L1, and the length of the first air outlet area in the arrangement direction of the first air outlet area and the second air outlet area is L2. The lengths of L1 and L2 satisfy: 0.3≤L2 / L1≤0.

7.

6. The electronic device according to claim 5, characterized in that, 0.45≤L2 / L1≤0.

55.

7. The electronic device according to any one of claims 1-6, characterized in that, The heat sink is flat; or, the heat sink extends in a zigzag shape.

8. The electronic device according to any one of claims 1-7, characterized in that, The length of the first heat sink is greater than the length of the second heat sink; or, the first heat sink and the second heat sink are the same size.

9. The electronic device according to any one of claims 1-8, characterized in that, The flow area of ​​at least one of the first heat dissipation channel and the second heat dissipation channel gradually decreases first and then gradually increases.

10. The electronic device according to any one of claims 1-9, characterized in that, The heat-conducting component is a heat pipe or a heat spreader plate. The heat-conducting component has an evaporation section and a condensation section. The condensation section has the support portion. The evaporation section is connected to the heating element.

11. The electronic device according to any one of claims 1-10, characterized in that, It includes a heat collection plate, which is in contact with the heating element and is thermally connected to the heat-conducting component.

12. The electronic device according to claim 11, characterized in that, The orthographic projection of the heating element on the heat collector plate is located within the heat collector plate.

13. The electronic device according to any one of claims 1-12, characterized in that, There are two heat dissipation modules, with the air outlets of the two heat dissipation modules facing the same direction, and the two heat dissipation modules are symmetrically arranged on both sides of the heat-generating element.

14. The electronic device according to claim 13, characterized in that, In each of the centrifugal fans, the second air outlet area is located on the side of the first air outlet area away from the heating element.

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