wafer carrier device

Abstract

This application discloses a wafer carrier device, including a housing, a cover, a rubber ring, and a vibration damping structure. The housing has a receiving space and an opening communicating with the receiving space, the receiving space being used to store wafers. The cover can be connected to the housing and is disposed at the opening. The rubber ring is disposed around the cover and can generate elastic deformation to fill the gap between the cover and the inner wall of the opening. The vibration damping structure is detachably connected to the cover. After the wafer is placed in the receiving space, the cover is moved to cover the opening so that the vibration damping structure comes into contact with the wafer, thereby increasing the tightness of the connection between the wafer and the housing, preventing collisions between adjacent wafers, and reducing the probability of wafer damage. Furthermore, when the wafer carrier device is subjected to an impact force, the vibration damping structure can deform to absorb the impact energy, thereby reducing the movement amplitude of the wafer and thus damping the wafer.

Description

Technical Field

[0001] This application relates to the field of wafer storage devices, and more specifically, to a wafer carrier device. Background Technology

[0002] In the relevant technical field, wafer carriers are used to place wafers so as to facilitate the transfer of wafers stored in the wafer carriers and prevent wafer damage. However, during transportation, wafer carriers are often subjected to impacts, vibrations or tilting, which can easily cause collisions between adjacent wafers or between wafers and the inner wall of the wafer carrier, resulting in wafer damage. Summary of the Invention

[0003] This application provides a wafer carrier device that, when the wafer carrier device is subjected to an impact, can use a vibration damping structure to dampen the wafer, thereby reducing the probability of wafer damage.

[0004] This application provides a wafer carrier device, including a housing, a cover, a rubber ring, and a vibration damping structure. The housing has a receiving space and an opening communicating with the receiving space, the receiving space being used to store wafers. The cover can be connected to the housing and is disposed at the opening. The rubber ring is disposed around the cover and can generate elastic deformation to fill the gap between the cover and the inner wall of the opening. The vibration damping structure is detachably connected to the cover and is used to contact the wafer when the cover is placed at the opening, thereby damping the wafer.

[0005] Based on the above embodiments, after the wafer is placed in the receiving space, the movable cover is placed over the opening so that the vibration damping structure comes into contact with the wafer, thereby increasing the tightness of the connection between the wafer and the housing, preventing collisions between adjacent wafers and preventing wafer damage. Furthermore, when the wafer carrier is subjected to impact, the vibration damping structure can deform to absorb the impact energy, thereby reducing the wafer's movement amplitude and thus damping the wafer, reducing the probability of wafer damage. Since the vibration damping structure and the cover are detachably connected, a new vibration damping structure can be replaced if damaged, ensuring that the vibration damping structure can still dampen the wafer. Moreover, when the cover is placed over the opening, the rubber ring can deform to fill the gap between the cover and the inner wall of the opening, thereby increasing the contact area between the cover and the housing, and thus increasing the connection stability between the cover and the housing, ensuring that the vibration damping structure can effectively dampen the wafer.

[0006] In some embodiments, the vibration damping structure includes an elastic frame, a first vibration damping component, and a second vibration damping component. The elastic frame is detachably connected to the cover. The first vibration damping component is connected to the elastic frame. The second vibration damping component is connected to the elastic frame and is spaced apart from the first vibration damping component. When the cover is placed over the opening, the first vibration damping component can contact the wafer, and the second vibration damping component is spaced apart from the wafer. When the impact force on the housing is less than a first preset impact force, the first vibration damping component is used to dampen the wafer. When the impact force on the housing is greater than or equal to the first preset impact force, both the first and second vibration damping components are in contact with the wafer to dampen the wafer.

[0007] Based on the above embodiments, when the cover is placed over the opening, the first damping component contacts the outer peripheral surface of the wafer, and the first damping component can undergo elastic deformation to increase the tightness of the connection between the wafer and the inner wall of the housing, thereby reducing the amplitude of wafer shaking, reducing the probability of wafer impact, and preventing wafer damage; when the impact force on the housing is less than the first preset impact force, the wafer moves towards the cover, squeezing the first damping component, so that the first damping component further deforms, thus damping the wafer; when the impact force on the housing is greater than or equal to the first preset impact force, the wafer moves towards the cover, causing the first damping component to deform and contact the second damping component, so that the second damping component contacts, further buffering the impact force, thus damping the wafer.

[0008] In some embodiments, the first vibration damping component includes an elastic connector and a plurality of first vibration damping components. The elastic connector is connected to an elastic frame and has a length direction. The plurality of first vibration damping components are spaced apart along the length direction and are all connected to the elastic connector. Each first vibration damping component includes two first elastic support portions and two first vibration damping portions. The two first elastic support portions are spaced apart, and one end of each first elastic support portion is connected to the side of the elastic connector away from the cover. The two first vibration damping portions are spaced apart and are respectively connected to the ends of the two first elastic support portions away from the elastic connector. The first vibration damping portion has a first surface away from the cover, and the first surface has a first slot. The two first slots are correspondingly arranged. When the cover is placed on the opening, the first vibration damping portion is located in the receiving space, and the bottom of the first slot can abut against the outer peripheral surface of the wafer.

[0009] Based on the above embodiments, when the cover moves toward the opening of the housing, the bottom of the first slots of the two first damping parts abut against the outer peripheral surface of the wafer. The cover continues to move toward the housing and moves away from each other along the outer peripheral surface of the wafer, so that the first elastic support part undergoes elastic deformation toward the cover. According to the interaction of forces, the elastic force after the deformation of the first elastic support part is applied to the outer peripheral surface of the wafer through the first damping part, so that the wafer can be stably stored in the housing. Two adjacent wafers are respectively connected to two adjacent first damping parts and abut against the bottom of the corresponding first slots to restrict the axial movement of the wafer, so as to prevent the two adjacent wafers from colliding and thus prevent wafer damage.

[0010] In some embodiments, the width of the first slot gradually decreases from the opening to the bottom; and / or, the wall of the first slot smoothly transitions to the first surface.

[0011] Based on the above embodiments, since the width of the first slot gradually decreases from the opening to the bottom, when the cover is placed over the opening, the larger opening slope first contacts the outer peripheral surface of the wafer. As the cover gradually moves closer to the housing, the opening slope pushes the wafer towards the bottom of the slot until the cover is completely closed with the housing. At this time, the bottom of the first slot abuts against the outer peripheral surface of the wafer, thereby using the opening slope to guide the movement of the wafer so that the wafer abuts against the bottom of the first slot.

[0012] Because the groove wall of the first slot is smoothly transitioned to the first surface, the contact surface between the first damping part and the wafer is always inclined during the process of moving the cover towards the housing. This avoids the first damping part having a surface perpendicular to the wafer's radial direction in contact with the outer peripheral surface of the wafer, reducing the probability of the wafer being damaged by a large radial force.

[0013] In some embodiments, the first damping component has a symmetrical plane along its length, the elastic connector and each first damping component are symmetrically arranged with respect to the symmetrical plane, the cover has a snap-fit ​​member on the side facing the box, the snap-fit ​​member extends along its length, the elastic connector has a snap-fit ​​groove on the side facing the cover, the snap-fit ​​groove extends along its length, and the snap-fit ​​member snaps into the groove wall of the snap-fit ​​groove.

[0014] Based on the above embodiments, since the two first damping parts are respectively connected to the elastic connectors through two first elastic support parts, and the elastic connectors are engaged with the snap-fit ​​parts to provide stable support for the first damping parts, when the cover is placed over the opening, if the first slot of one side of the first damping part contacts the periphery of the wafer first, the first elastic support part connected to the first damping part on that side will undergo elastic deformation in the direction closer to the cover, so that the first damping part on that side can move in the direction closer to the cover, so that the elastic connector will twist around the snap-fit ​​parts as the pivot, thereby causing the first elastic support part on the opposite side to drive the first damping part on the opposite side to move away from the cover, so that the first slot of the first damping part on the opposite side can contact the outer periphery of the wafer more quickly, thereby stabilizing the position of the wafer as soon as possible to prevent the wafer from being bumped.

[0015] In some embodiments, the first damping component has a symmetrical plane along its length, and the elastic connector and each damping component are symmetrically arranged with respect to the symmetrical plane. The second damping component includes two damping groups, each of which is connected to the side of the elastic frame away from the cover. The two damping groups are respectively arranged on both sides of the first damping component and are symmetrically arranged with respect to the symmetrical plane. Each damping group includes a plurality of second damping components spaced apart along its length. Each second damping component includes a second elastic support and a second damping part. One end of the second elastic support is connected to the side of the elastic frame away from the cover. The second damping part is connected to the end of the first elastic support away from the elastic frame. The second damping part has a second surface away from the cover, and the second surface has a second slot. Two second slots and two first slots are correspondingly arranged. When the cover is placed over the opening and the impact force on the box is greater than or equal to a first preset impact force, the bottom of the first slot and the bottom of the second slot can abut against the outer peripheral surface of the wafer.

[0016] Based on the above embodiments, by using two second damping members symmetrically arranged on both sides of the symmetrical plane, when the impact force on the housing is greater than or equal to the first preset impact force, the wafer can move to contact the bottom of the second slot and cause the second damping part to move towards the cover, so that the second elastic support part can generate elastic deformation towards the cover to absorb the impact force, thereby reducing the probability of wafer damage.

[0017] In some embodiments, the width of the opening of the second slot gradually decreases in the direction away from the first damping member, and the width of the second slot gradually decreases from the opening to the bottom; and / or, the wall of the second slot smoothly transitions to the second surface.

[0018] Based on the above embodiments, when the impact force on the housing is greater than the first preset impact force but less than the second preset impact force, the wafer continues to push the first damping part towards the cover, so that the outer peripheral surface of the wafer can abut against the second damping part. Since the width of the slot opening of the second slot gradually decreases away from the first damping part, the opening of the second slot is larger on the side closer to the first slot, which facilitates the outer peripheral surface of the wafer to enter the second slot and abut against the bottom of the second slot, thus pushing the second damping part to move, so that the second elastic support part generates elastic deformation, thereby further absorbing the impact force and reducing the probability of wafer collision damage. When the impact on the housing is greater than the second preset impact force, the wafer continues to push the second damping part towards the cover, so that the side with the smaller opening of the second slot contacts the wafer, thereby using the smaller sidewall of the second slot to clamp the wafer, thereby reducing the movement range of the wafer and reducing the probability of wafer collision damage. Because the groove wall of the second slot is smoothly transitioned to the second surface, it can guide the movement of the wafer as it moves into the second slot, thereby facilitating the wafer's movement to contact the bottom of the second slot and reducing the probability of wafer damage.

[0019] In some embodiments, the first damping portion and the second damping portion have two third surfaces intersecting the length direction, each third surface having a protrusion, the first surface and the corresponding protrusion smoothly transitioning away from the surface of the cover, and the second surface and the corresponding protrusion smoothly transitioning away from the surface of the cover.

[0020] Based on the above embodiments, by utilizing the protrusions provided on the two third surfaces, the contact area between the second damping part and the wafer can be increased, so as to guide the wafer into the first slot and / or the second slot, thereby providing a stable damping effect for the wafer and reducing the probability of collision between two adjacent wafers.

[0021] In some embodiments, the first damping portion has a fourth surface adjacent to the first surface and the third surface, and the projections of two protrusions between two adjacent first damping portions on the fourth surface at least partially overlap; the second damping portion has a fifth surface adjacent to the second surface and the third surface, and the projections of two protrusions between two adjacent second damping portions on the fifth surface at least partially overlap.

[0022] Based on the above embodiments, since the projections of the two protrusions between two adjacent first damping parts on the fourth surface partially overlap, the protrusions of the two adjacent first damping parts are misaligned, thereby compressing the distance between the two adjacent first damping parts, so that the size of the elastic frame is smaller in the length direction, so that the size of the cover is smaller, and thus the size of the wafer carrier is smaller, so as to facilitate the transportation of the wafer carrier.

[0023] In some embodiments, in the same first damper, the two first surfaces are arranged at an angle, and the opening of the angle faces away from the cover; in two symmetrical second dampers, the two second surfaces are arranged at an angle, and the opening of the angle faces away from the cover.

[0024] Based on the above embodiments, when the wafer contacts the first damping element, the first damping element and the wafer have a large contact area, thereby improving the stability of the wafer and reducing the probability of collision between two adjacent wafers. Similarly, in the two symmetrical second damping elements, the two second surfaces are set at an angle, and the opening of the angle faces away from the cover, which also makes the second damping element and the wafer have a large contact area, thereby improving the stability of the wafer.

[0025] In some embodiments, the vibration damping structure further includes two first limiting members and two second limiting members. The two first limiting members are disposed on the surface of the cover facing the elastic frame and extend along the length direction. The two first limiting members are symmetrically arranged in a symmetrical plane and are respectively disposed corresponding to the first damping portions on both sides, so that after the first elastic support portion undergoes elastic deformation in the direction closer to the cover, the first damping portion can abut against the first limiting member. The two second limiting members are disposed on the surface of the cover facing the elastic frame and extend along the length direction. The two second limiting members are symmetrically arranged in a symmetrical plane and are respectively disposed on both sides of the two first limiting members. The two second limiting members are respectively disposed corresponding to the second damping portions on both sides, so that after the second elastic support portion undergoes elastic deformation in the direction closer to the cover, the second damping portion can abut against the second limiting member.

[0026] Based on the above embodiments, when the wafer pushes the first damping part to move closer to the cover, after the first damping part moves a first preset distance, the side of the first damping part away from the wafer can abut against the first limiting member. Similarly, when the wafer pushes the second damping part to move closer to the cover, after the second damping part moves a second preset distance, the side of the second damping part away from the wafer abuts against the second limiting member, thus limiting the movement stroke of the wafer, reducing the movement amplitude of the wafer, improving the stability of the wafer in the housing, and thereby reducing the probability of wafer damage.

[0027] In some embodiments, the vibration damping structure includes an elastic frame, a first vibration damping component, and a second vibration damping component. The first vibration damping component is connected to the elastic frame. The second vibration damping component is connected to the elastic frame and spaced apart from the first vibration damping component. The cover has a mounting groove for mounting the elastic frame. The wafer carrier device also includes a plug-in structure that connects the elastic frame and the groove wall of the mounting groove so that the elastic frame engages with the groove wall of the mounting groove.

[0028] Based on the above embodiments, the plug-in structure can be used to connect the elastic frame to the wall of the mounting groove. This connection allows the plug-in structure to be disassembled when the first or second vibration damping component is damaged or needs to be cleaned, so that the plug-in structure can be removed from the cover for cleaning or replacement. Furthermore, the plug-in structure can be used to connect the vibration damping structure to the cover, so that when the cover is placed over the opening of the housing, the vibration damping structure can provide vibration damping for the wafer.

[0029] In some embodiments, the elastic frame has a first outer side and a second outer side extending along the length direction and arranged opposite to each other, the mounting groove has a first groove wall and a second groove wall extending along the length direction and arranged opposite to each other, and the plug-in structure includes two sets of first plug groups and two sets of second plug groups. The two sets of first plug groups are respectively disposed on the first outer side and the second outer side, and each first plug group includes a plurality of spaced-apart first plug members; the two sets of second plug groups are respectively disposed on the first groove wall and the second groove wall, and each second plug group includes a plurality of spaced-apart second plug members. Each second plug member, the bottom of the mounting groove, and the first groove wall or the second groove wall form a slot, and the first plug members are inserted into the slots one by one.

[0030] Based on the above embodiments, when installing the vibration damping structure, a force perpendicular to the length direction is applied to the elastic frame to cause the first outer surface and the second outer surface to undergo elastic deformation inward. The elastic frame is then placed in the mounting groove, and the first connector is aligned with the slot. The force applied to the elastic frame is released, and the elastic deformation of the elastic frame is restored, so that the first connector is engaged in the slot. The surface of the second connector facing the bottom of the mounting groove abuts against the first connector, thereby preventing the first connector from dislodging from the slot and increasing the connection stability between the vibration damping structure and the cover.

[0031] In some embodiments, the plug-in structure further includes a plurality of abutments spaced apart at the bottom of the mounting groove for abutting against the inner side of the elastic frame after the first plug-in is inserted into the slot; the abutment has a beveled portion on the side facing the slot, the beveled portion having a slope, the slope being disposed facing the slot and the mounting groove opening.

[0032] Based on the above embodiments, the inclined surface of the abutment can guide the movement of the elastic frame into the slot, thereby facilitating the insertion of the first plug into the slot. After the first plug is inserted into the slot, the abutment can abut against the inner side of the elastic frame to limit the elastic deformation of the elastic frame away from the slot, prevent the first plug from dislodging from the slot, and thus increase the connection stability between the first plug and the slot.

[0033] In some embodiments, the orthographic projection of the first plug on the first outer side surface is the first projection, and the orthographic projection of the first plug on the second outer side surface is the second projection. The first projection and the second projection are spaced apart or partially overlap.

[0034] Based on the above embodiments, since the first projection and the second projection are spaced apart or partially overlapped, a reference installation direction can be provided for the installation of the elastic frame on the cover, thereby improving the installation accuracy of the elastic frame. This allows each first damping component and the second component to accurately correspond to a wafer, thus providing reliable protection for wafer buffering.

[0035] In some embodiments, the first outer side and the second outer side of the elastic frame have a plurality of positioning grooves spaced apart, and the bottom of the mounting groove has a plurality of positioning posts spaced apart, each positioning post being able to abut against the groove wall of the positioning groove.

[0036] Based on the above embodiments, the positioning groove and the positioning post can be used to position the elastic frame on the cover, thereby increasing the installation accuracy of the elastic frame on the cover; and the positioning post and the positioning groove can be used to increase the contact area between the elastic frame and the cover, thereby increasing the connection stability between the elastic frame and the cover.

[0037] According to this application, a wafer carrier device, after the wafer is placed in the receiving space, a movable cover is placed at the opening to allow the vibration damping structure to contact the wafer, thereby increasing the tightness of the connection between the wafer and the housing and preventing collisions between adjacent wafers, thus preventing wafer damage. Furthermore, when the wafer carrier device is subjected to impact, the vibration damping structure can deform to absorb impact energy, thereby reducing the wafer's movement amplitude and thus damping the wafer, preventing damage. Since the vibration damping structure and the cover are detachably connected, a new vibration damping structure can be replaced if damaged, ensuring that the vibration damping structure can still dampen the wafer. Moreover, when the cover is placed at the opening, the rubber ring can deform to fill the gap between the cover and the inner wall of the opening, thereby increasing the contact area between the cover and the housing, and thus increasing the connection stability between the cover and the housing, ensuring that the vibration damping structure can effectively dampen the wafer. Attached Figure Description

[0038] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0039] Figure 1This is a schematic diagram of the structure of a wafer carrier device in one embodiment of this application;

[0040] Figure 2 This is an exploded structural diagram of the box body and the cover body in one embodiment of this application;

[0041] Figure 3 This is an exploded structural diagram of the box and cover from another perspective in one embodiment of this application;

[0042] Figure 4 This is a schematic diagram of the vibration reduction structure in one embodiment of this application;

[0043] Figure 5 This is a partial structural schematic diagram of the vibration reduction structure in one embodiment of this application;

[0044] Figure 6 This is a schematic diagram of the vibration reduction structure from another perspective in one embodiment of this application;

[0045] Figure 7 This is a schematic diagram of the structure of the cover in one embodiment of this application;

[0046] Figure 8 for Figure 7 A magnified structural diagram of point A in the middle.

[0047] Explanation of reference numerals in the attached drawings: 1. Wafer carrier; 11. Housing; 11A. Receiving space; 11B. Opening; 111. Side slot plate; 111A. Side slot; 12. Cover; 12A. Mounting slot; 12B. First slot wall; 12C. Second slot wall; 12D. Snap-fit ​​slot; 121. Snap-fit ​​component; 122. Positioning post; 13. Vibration damping structure; 131. Elastic frame; 131A. First outer surface; 131B. Second outer surface; 131C. Positioning slot; 132. First vibration damping component; 1321. Elastic connector; 1321A. Slot; 1322. First vibration damping component; 13221. First elastic support; 13222. First vibration damping part; 13222A. First surface; 1322 2B, First slot; 13222C, Fourth surface; 133, Second damping assembly; 1331, Damping group; 13311, Second damping component; 133111, Second elastic support; 133112, Second damping component; 133112A, Second surface; 133112B, Second slot; 133112C, Third surface; 133112D, Fifth surface; 133113, Protrusion; 134, First limiting component; 135, Second limiting component; 14, Insertion structure; 141, First insertion group; 1411, First insertion component; 142, Second insertion group; 1421, Second insertion component; 143, Abutting component; 1431, Inclined surface; X, Length direction; K, Symmetry plane. Detailed Implementation

[0048] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0049] Please refer to Figure 1-3 This application provides a wafer carrier device 1, which includes a housing 11, a cover 12, and a vibration damping structure 13.

[0050] The housing 11 has a receiving space 11A and an opening 11B communicating with the receiving space 11A. Two oppositely arranged side slot plates 111 are provided in the receiving space 11A. The two side slot plates 111 are respectively connected to two opposite inner walls of the receiving space 11A. Each side slot plate 111 includes a plurality of side slots 111A arranged at intervals. The side slots 111A are arranged through the side slot plate 111. The side slots 111A of the two side slot plates 111 are arranged one-to-one. The wafers can be placed one-to-one between the two side slots 111A, so that the side slot plates 111 can keep the two adjacent wafers spaced apart and provide support for the wafers, so that the wafers can be stably placed in the receiving space 11A. Both the housing 11 and the side slot plate 111 are made of PC (Polycarbonate), and are integrally molded using injection molding to achieve high structural strength. The housing 11 and side slot plate 111 are then connected to form a closed space that provides reliable protection for the wafer. The housing 11 and side slot plate 111 are detachably connected, and the connection method can be, but is not limited to, snap-fit, facilitating the removal of the side slot plate 111 from the housing 11 for cleaning, thus ensuring the cleanliness of the wafer.

[0051] The cover 12 can be connected to the housing 11 and is disposed at the opening 11B. This allows the cover 12 to seal the opening 11B after the wafer is placed inside the housing 11, preventing impurities from entering the housing 11 through the opening 11B, thus keeping the wafer clean and preventing it from detaching from the housing 11 through the opening 11B, thereby providing reliable protection for the wafer. The cover 12 can also be made of PC and can be integrally molded using an injection molding process to improve its structural strength. The cover 12 and the housing 11 can be connected via a locking structure to improve the connection stability. The specific form of the locking structure is not limited in this embodiment. Furthermore, to improve the tightness of the connection between the cover 12 and the housing 11, a rubber ring (not shown in the figure) is provided around the cover 12. When the cover 12 is placed over the opening 11B, the rubber ring undergoes elastic deformation to fill the gap between the cover 12 and the inner wall of the opening 11B, thereby preventing small impurities from entering the housing 11 through the gap, thus reliably ensuring the cleanliness of the wafer surface. Moreover, since the rubber ring can deform and fill the gap between the cover 12 and the inner wall of the opening 11B when the cover 12 is placed over the opening 11B, the contact area between the cover 12 and the housing 11 can be increased, thereby increasing the connection stability between the cover 12 and the housing 11, ensuring that the vibration damping structure 13 can dampen the wafer.

[0052] The vibration damping structure 13 is detachably connected to the cover 12. When the cover 12 is positioned over the opening 11B, the vibration damping structure 13 contacts the wafer, thereby increasing the tightness of the connection between the wafer and the housing 11 to prevent collisions between adjacent wafers and reduce the probability of wafer damage. Furthermore, when the wafer carrier 1 is subjected to an impact force, the vibration damping structure 13 can deform to absorb the impact energy, thereby reducing the movement amplitude of the wafer and further damping the wafer to reduce the probability of wafer damage.

[0053] In this embodiment, after the wafer is placed in the receiving space 11A, the movable cover 12 is placed over the opening 11B, and the vibration damping structure 13 contacts the wafer, thereby increasing the tightness of the connection between the wafer and the housing 11 to prevent collisions between adjacent wafers and prevent wafer damage. Furthermore, when the wafer carrier 1 is subjected to impact force, the vibration damping structure 13 can deform to absorb the impact energy, thereby reducing the movement amplitude of the wafer and thus damping the wafer, reducing the probability of wafer damage. Since the vibration damping structure 13 is detachably connected to the cover 12, a new vibration damping structure 13 can be replaced when it is damaged, ensuring that the vibration damping structure 13 can still dampen the wafer.

[0054] Please refer to Figure 2-4In one specific embodiment, the vibration damping structure 13 includes an elastic frame 131, a first vibration damping component 132, and a second vibration damping component 133. The elastic frame 131 is detachably connected to the cover 12; the first vibration damping component 132 is connected to the elastic frame 131; the second vibration damping component 133 is connected to the elastic frame 131 and is spaced apart from the first vibration damping component 132. When the cover 12 is placed over the opening 11B, the first vibration damping component 132 contacts the outer peripheral surface of the wafer, and the first vibration damping component 132 can undergo elastic deformation to increase the tightness of the connection between the wafer and the inner wall of the housing 11, thereby... The amplitude of wafer wobbling is reduced to decrease the probability of wafer impact and prevent wafer damage. When the impact force on the housing 11 is less than the first preset impact force, the wafer moves towards the cover 12, compressing the first damping component 132, causing the first damping component 132 to deform further, thus damping the wafer. When the impact force on the housing 11 is greater than or equal to the first preset impact force, the wafer moves towards the cover 12, causing the first damping component 132 to deform and the second damping component 133 to come into contact with the wafer, further buffering the impact force, thus damping the wafer. The elastic frame 131 can be made of PP (polypropylene) so that it can undergo elastic deformation, facilitating the connection between the elastic frame 131 and the cover 12, thereby achieving a detachable connection between the elastic frame 131 and the cover 12, and thus a detachable connection between the damping structure 13 and the cover 12, facilitating the replacement or cleaning of the damping structure 13.

[0055] Please refer to Figure 2-4In one specific embodiment, the first vibration damping component 132 includes an elastic connector 1321 and a plurality of first vibration damping components 1322. The elastic connector 1321 is connected to the elastic frame 131 and has a length direction X. The plurality of first vibration damping components 1322 are spaced apart along the length direction X and are all connected to the elastic connector 1321. Each first vibration damping component 1322 includes two first elastic support portions 13221 and two first vibration damping portions 13222. The two first elastic support portions 13221 are spaced apart, and one end of each first elastic support portion 13221 is connected to the side of the elastic connector 1321 away from the cover 12. The two first vibration damping portions 13222 are spaced apart and are respectively connected to the ends of the two first elastic support portions 13221 away from the elastic connector 1321. The first vibration damping portion 13222 has a first surface 13222A away from the cover 12. The first surface 13222A has The first slot 13222B is provided with two corresponding slots. When the cover 12 moves toward the opening 11B of the housing 11, the bottom of the first slot 13222B of the two first damping parts 13222 abuts against the outer peripheral surface of the wafer. As the cover 12 continues to move toward the housing 11, it moves away from the outer peripheral surface of the wafer, so that the first elastic support part 13221 undergoes elastic deformation toward the cover 12. According to the interaction of forces, the elastic force of the first elastic support part 13221 after deformation is applied to the outer peripheral surface of the wafer through the first damping part 13222, so that the wafer can be stably stored in the housing 11. Two adjacent wafers are connected to two adjacent first damping parts 1322 respectively, and abut against the bottom of the corresponding first slot 13222B, so as to use the first slot 13222B to restrict the axial movement of the wafer, so as to prevent the two adjacent wafers from colliding, thereby reducing the probability of wafer damage. The first elastic support 13221 can be made of PP so that it can undergo elastic deformation and absorb impact force to reduce the vibration of the wafer; the first damping part 13222 can be made of PC so that it can maintain stable contact with the wafer and reduce the probability of wafer damage.

[0056] Please refer to Figure 2-5 In one specific embodiment, the width of the first slot 13222B gradually decreases from the opening to the bottom, so that when the cover 12 is placed on the opening 11B, the inclined surface of the larger slot first contacts the outer peripheral surface of the wafer. As the cover 12 gradually moves closer to the housing 11, the inclined surface of the slot provides guidance for the movement of the wafer, so that the inclined surface of the slot can push the wafer to the bottom of the slot until the cover 12 is completely closed with the housing 11. At this time, the bottom of the first slot 13222B abuts against the outer peripheral surface of the wafer.

[0057] Please refer to Figure 2-5 In another specific embodiment, the groove wall of the first slot 13222B smoothly transitions to the first surface 13222A, so that during the process of moving the cover 12 towards the housing 11, the contact surface between the first damping part 13222 and the wafer is always inclined, thereby avoiding the contact between the surface perpendicular to the wafer's radial direction and the outer peripheral surface of the wafer, reducing the probability of the wafer being damaged by a large radial force; and because the groove wall of the first slot 13222B smoothly transitions to the first surface 13222A, the contact range between the first damping part 13222 and the wafer can be increased, thereby facilitating the wafer to enter the first slot 13222B.

[0058] Please refer to Figure 2-5 It is understood that, in another specific embodiment, the width of the first slot 13222B gradually decreases from the opening to the bottom, and the wall of the first slot 13222B smoothly transitions to the first surface 13222A, so that the wafer can enter the first slot 13222B more accurately and the probability of wafer damage can be reduced.

[0059] Please refer to Figure 2-6 In one specific embodiment, the first vibration damping component 132 has a symmetrical plane K along the length direction X. The elastic connector 1321 and each of the first vibration damping components 1322 are symmetrically arranged with respect to the symmetrical plane K. The cover 12 has a snap-fit ​​component 121 on the side facing the box 11, extending along the length direction X. The elastic connector 1321 has a snap-fit ​​groove 12D on the side facing the cover 12, extending along the length direction X. The snap-fit ​​component 121 snaps into the groove wall of the snap-fit ​​groove 12D. Since the two first vibration damping parts 13222 are respectively connected to the elastic connector 1321 through two first elastic support parts 13221, and the elastic connector 1321 snaps into the snap-fit ​​component 121, it provides stable support for the first vibration damping components 1322, so that when the cover 12 is placed... When the opening 11B is made, if the first groove 13222B of the first damping part 13222 on one side first contacts the periphery of the wafer, the first elastic support part 13221 connected to the first damping part 13222 on that side will undergo elastic deformation in the direction closer to the cover 12, so that the first damping part 13222 on that side can move in the direction closer to the cover 12, so that the elastic connector 1321 will rotate around the locking member 121 as the pivot, thereby causing the first elastic support part 13221 on the opposite side to drive the first damping part 13222 on the opposite side to move away from the cover 12, so that the first groove 13222B of the first damping part 13222 on the opposite side can contact the outer periphery of the wafer more quickly, thereby stabilizing the position of the wafer as soon as possible and reducing the probability of wafer damage.

[0060] Please refer to Figure 2-6In one specific embodiment, the second damping assembly 133 includes two damping groups 1331. Each damping group 1331 is connected to the side of the elastic frame 131 away from the cover 12. The two damping groups 1331 are respectively disposed on both sides of the first damping member 1322 and are symmetrically arranged with a plane of symmetry K. Each damping group 1331 includes a plurality of second damping members 13311 spaced apart along the length direction X. Each second damping member 13311 includes a second elastic support portion 133111 and a second damping portion 133112. One end of the second elastic support portion 133111 is connected to the side of the elastic frame 131 away from the cover 12. The second damping portion 133112 and the first elastic support portion 13221 are away from the elastic frame. One end of 131 is connected to the second damping part 133112, which has a second surface 133112A facing away from the cover 12. The second surface 133112A has a second slot 133112B. The two second slots 133112B and the two first slots 13222B are correspondingly arranged. By using two second damping members 13311 symmetrically arranged on both sides of the symmetry plane K, when the impact force on the housing 11 is greater than or equal to the first preset impact force, the wafer can move to contact the bottom of the second slot 133112B, and the second damping part 133112 moves towards the cover 12, so that the second elastic support part 133111 undergoes elastic deformation towards the cover 12 to absorb the impact force, thereby reducing the probability of wafer damage. The second elastic support 133111 can be made of PP so that it can undergo elastic deformation to absorb impact force and reduce vibration of the wafer; the second vibration damping part 133112 can be made of PC so that it can maintain stable contact with the wafer and reduce the probability of wafer damage.

[0061] Please refer to Figure 2-6In one specific embodiment, the width of the opening of the second slot 133112B gradually decreases towards the direction away from the first damping member 1322, and the width of the second slot 133112B gradually decreases from the opening to the bottom, so that the opening 11B of the second slot 133112B near the first slot 13222B is larger. This facilitates the entry of the outer peripheral surface of the wafer into the second slot 133112B to abut against the bottom of the second slot 133112B and push the second damping member 13311 to move, so that the second elastic support 133111 undergoes elastic deformation, thereby further absorbing the impact force, reducing the probability of wafer collision damage, and also reducing the impact force on the housing 11. When the impact force is greater than the first preset impact force but less than the second preset impact force, the wafer continues to push the first damping part 13222 towards the cover 12, so that the outer peripheral surface of the wafer can come into contact with the second damping part 133112, so that the second damping part 133112 can further dampen the wafer; when the impact on the housing 11 is greater than the second preset impact force, the wafer continues to push the second damping part 133112 towards the cover 12, so that the smaller side of the opening 11B of the second slot 133112B contacts the wafer, thereby using the smaller sidewall of the second slot 133112B to clamp the wafer, thereby reducing the movement amplitude of the wafer and reducing the probability of wafer collision damage.

[0062] Please refer to Figure 2-6 In one specific embodiment, the groove wall of the second slot 133112B smoothly transitions to the second surface 133112A, which can provide guidance for the movement of the wafer when it moves into the second slot 133112B, thereby facilitating the wafer to move to contact the bottom of the second slot 133112B and reducing the probability of wafer damage.

[0063] Please refer to Figure 2-6 In one specific embodiment, the first damping part 13222 and the second damping part 133112 have two third surfaces 133112C intersecting the length direction X. Each third surface 133112C has a protrusion 133113. The first surface 13222A and the corresponding protrusion 133113 smoothly transition away from the surface of the cover 12. The second surface 133112A and the corresponding protrusion 133113 smoothly transition away from the surface of the cover 12. This can increase the contact area between the second damping part 133112 and the wafer, so as to guide the wafer into the first slot 13222B and / or the second slot 133112B, thereby providing a stable damping effect for the wafer and reducing the probability of collision between two adjacent wafers.

[0064] Please refer to Figure 2-6In one specific embodiment, the first damping portion 13222 has a fourth surface 13222C adjacent to the first surface 13222A and the third surface 133112C, and the projections of the two protrusions 133113 between two adjacent first damping portions 13222 on the fourth surface 13222C at least partially overlap; the second damping portion 133112 has a fifth surface 133112D adjacent to the second surface 133112A and the third surface 133112C, and the projections of the two protrusions 133113 between two adjacent second ... The projections of the two protrusions 133113 between the damping parts 133112 on the fifth surface 133112D at least partially overlap, so that the protrusions 133113 of the two adjacent first damping parts 13222 are misaligned, thereby compressing the distance between the two adjacent first damping parts 13222, so that the size of the elastic frame 131 in the length direction X is smaller, so that the size of the cover 12 is smaller, and thus the size of the wafer carrier device 1 is smaller, so as to facilitate the transportation of the wafer carrier device 1.

[0065] Please refer to Figure 2-6 In one specific embodiment, in the same first damping member 1322, the two first surfaces 13222A are arranged at an angle, and the opening 11B of the angle faces away from the cover 12, so that when the wafer contacts the first damping member 1322, the first damping member 1322 and the wafer have a larger contact area, thereby improving the stability of the wafer and reducing the probability of collision between two adjacent wafers. Similarly, in the two symmetrical second damping members 13311, the two second surfaces 133112A are arranged at an angle, and the opening 11B of the angle faces away from the cover 12, which also makes the second damping member 13311 and the wafer have a larger contact area, thereby improving the stability of the wafer.

[0066] Please refer to Figure 2-7In one specific embodiment, the vibration damping structure 13 further includes two first limiting members 134 and two second limiting members 135. The two first limiting members 134 are disposed on the surface of the cover 12 facing the elastic frame 131 and extend along the length direction X. The two first limiting members 134 are symmetrically arranged with respect to a plane of symmetry K. The two first limiting members 134 are respectively disposed corresponding to the first damping portions 13222 on both sides, so that after the first elastic support portion 13221 undergoes elastic deformation in the direction closer to the cover 12, the first damping portion 13222 can abut against the first limiting members 134. The two second limiting members 135 are disposed on the surface of the cover 12 facing the elastic frame 131 and extend along the length direction X. The two second limiting members 135 are symmetrically arranged with respect to a plane of symmetry K and are respectively disposed with respect to a plane of symmetry K. Two first limiting members 134 are positioned on either side of two second limiting members 135, which are respectively configured to correspond to the second damping parts 133112 on both sides. When the wafer pushes the first damping part 13222 towards the cover 12, after the first damping part 13222 moves a first preset distance, the side of the first damping part 13222 away from the wafer can abut against the first limiting member 134. Similarly, when the wafer pushes the second damping part 133112 towards the cover 12, after the second damping part 133112 moves a second preset distance, the side of the second damping part 133112 away from the wafer abuts against the second limiting member 135, thus limiting the movement stroke of the wafer, reducing the movement amplitude of the wafer, improving the stability of the wafer within the housing 11, and thereby reducing the probability of wafer damage. Both the first limiting member 134 and the second limiting member 135 can be made of PC material.

[0067] Please refer to Figure 2-7 In this embodiment of the application, the distance between the first damping part 13222 and the corresponding first limiting member 134 is 5mm, and the distance between the second damping part 133112 and the corresponding second damping part 133112 is 5mm, so that both the first damping part 13222 and the second damping part 133112 can provide damping effect for the wafer.

[0068] Please refer to Figure 2-7In one specific embodiment, the cover 12 has a mounting groove 12A for mounting the elastic frame 131. The wafer carrier device 1 also includes a plug-in structure 14. The plug-in structure 14 enables the connection between the elastic frame 131 and the groove wall of the mounting groove 12A. This connection allows the plug-in structure 14 to be disassembled from the cover 12 when the first vibration damping component 132 or the second vibration damping component 133 is damaged or needs to be cleaned. This allows the vibration damping structure 13 to be cleaned or replaced. The plug-in structure 14 can also be used to connect the vibration damping structure 13 to the cover 12, so that when the cover 12 is placed over the opening 11B of the housing 11, the vibration damping structure 13 can dampen the wafer.

[0069] Please refer to Figure 2-7 In one specific embodiment, the elastic frame 131 has a first outer surface 131A and a second outer surface 131B extending along the length direction X and arranged opposite to each other. The mounting groove 12A has a first groove wall 12B and a second groove wall 12C extending along the length direction X and arranged opposite to each other. The plug-in structure 14 includes two sets of first plug groups 141 and two sets of second plug groups 142. The two sets of first plug groups 141 are respectively disposed on the first outer surface 131A and the second outer surface 131B, and each first plug group 141 includes a plurality of spaced-apart first plug members 1411121. The two sets of second plug groups 142 are respectively disposed on the first groove wall 12B and the second groove wall 12C, and each second plug group 142 includes a plurality of spaced-apart second plug members 1421121. Each second plug member 1421121, the bottom of the mounting groove 12A, and the first groove wall 12B or the second groove wall 12C form a slot 13. 21A, the first connectors 1411121 are inserted into the slots 1321A in a corresponding manner; when installing the vibration damping structure 13, a force perpendicular to the length direction X is applied to the elastic frame 131 so that the first outer surface 131A and the second outer surface 131B undergo elastic deformation inward into the elastic frame 131. Then, the elastic frame 131 is placed in the mounting groove 12A, and the first connectors 1411121 are aligned with the slots 1321A. The force applied to the elastic frame 131 is released, and the elastic deformation of the elastic frame 131 is restored so that the first connectors 1411121 are engaged in the slots 1321A. The surface of the second connectors 1421121 facing the bottom of the mounting groove 12A abuts against the first connectors 1411121, thereby preventing the first connectors 1411121 from dislodging from the slots 1321A, thus increasing the connection stability between the vibration damping structure 13 and the cover 12.

[0070] Please refer to Figure 2-8In one specific embodiment, the insertion structure 14 further includes a plurality of abutment members 143, which are spaced apart at the bottom of the mounting groove 12A and are used to abut against the inner side of the elastic frame 131 after the first insertion member 141121 is inserted into the slot 1321A. The abutment member 143 has a beveled portion 1431 on the side facing the slot 1321A. The beveled portion 1431 has a slope and is positioned facing the slot 1321A and the opening of the mounting groove 12A. The slope of the beveled portion 1431 of the abutment member 143 can be used to support the elastic frame. The frame 131 provides guidance for movement within the slot 1321A, thereby facilitating the insertion of the first connector 1411121 into the slot 1321A. After the first connector 1411121 is inserted into the slot 1321A, the abutment 143 can abut against the inner side of the elastic frame 131 to limit the elastic deformation of the elastic frame 131 in the direction away from the slot 1321A, preventing the first connector 1411121 from dislodging from the slot 1321A, thereby increasing the connection stability between the first connector 1411121 and the slot 1321A.

[0071] Please refer to Figure 2-8 In one specific embodiment, the orthographic projection of the first connector 1411121 located on the first outer side 131A is the first projection, and the orthographic projection of the first connector 1411121 located on the second outer side 131B on the first outer side 131A is the second projection. The first projection and the second projection are spaced apart or partially overlapped, thereby providing a reference installation direction for the installation of the elastic frame 131 on the cover 12, improving the installation accuracy of the elastic frame 131. This ensures that each first damping component 132 and the second damping component 133 can accurately correspond to a wafer, thus providing reliable protection for wafer buffering. Furthermore, since the wafer carrier device 1 has a reference plane, the dimensions of the structures within the wafer carrier device 1, such as the side slot plate 111 and the damping structure 13, are also based on the reference plane in the direction perpendicular to the reference plane. This allows the installation of the damping structure 13 to have high installation accuracy and facilitates automated equipment to access the wafers within the wafer carrier device 1 according to a preset program.

[0072] Please refer to Figure 2-8In one specific embodiment, the first outer surface 131A and the second outer surface 131B of the elastic frame 131 have a plurality of positioning grooves 131C spaced apart, and the bottom of the mounting groove 12A has a plurality of positioning posts 122 spaced apart. Each positioning post 122 can abut against the groove wall of the positioning groove 131C. By utilizing the cooperation between the positioning groove 131C and the positioning post 122, the elastic frame 131 can be positioned for installation on the cover 12, thereby increasing the installation accuracy of the elastic frame 131 on the cover 12. Furthermore, by utilizing the cooperation between the positioning post 122 and the positioning groove 131C, the contact area between the elastic frame 131 and the cover 12 can be increased, thereby increasing the connection stability between the elastic frame 131 and the cover 12.

[0073] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components. In the description of this application, it should be understood that if terms such as "upper," "lower," "left," "right," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting this application. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0074] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A wafer carrier device, characterized in that, include: The enclosure has a receiving space and an opening communicating with the receiving space for storing wafers; A cover, which can be connected to the box body and is disposed at the opening; A rubber ring is provided around the periphery of the cover, which can produce elastic deformation to fill the gap between the cover and the inner wall of the opening; A vibration damping structure is detachably connected to the cover and is used to dampen the vibration of the wafer when the cover is placed over the opening. The vibration damping structure includes: A flexible frame is detachably connected to the cover. The first vibration damping component is connected to the elastic frame; The second vibration damping component is connected to the elastic frame and is spaced apart from the first vibration damping component; Wherein, when the cover is placed over the opening, the first vibration damping component can contact the wafer, and the second vibration damping component is spaced apart from the wafer; When the impact force on the housing is less than the first preset impact force, the first vibration damping component is used to dampen the vibration of the wafer; When the impact force on the housing is greater than or equal to the first preset impact force, both the first vibration damping component and the second vibration damping component come into contact with the wafer to dampen the wafer. The first vibration damping component includes an elastic connector and a plurality of first vibration damping elements. The elastic connector is connected to the elastic frame and has a length direction. The plurality of first vibration damping elements are spaced apart along the length direction and are all connected to the elastic connector. Each first vibration damping element includes: Two first elastic support parts are spaced apart, and one end of each first elastic support part is connected to the side of the elastic connector away from the cover. Two first damping parts are spaced apart and are respectively connected to the ends of two first elastic support parts away from the elastic connector. Each first damping part has a first surface facing away from the cover and a first slot. Two first slots are correspondingly arranged. When the cover is placed over the opening, the first damping part is located in the receiving space and the bottom of the first slot can abut against the outer peripheral surface of the wafer. The first vibration damping component has a symmetrical plane along the length direction, and the elastic connector and each of the first vibration damping components are symmetrically arranged with respect to the symmetrical plane. The second vibration damping component includes: Two sets of vibration damping groups are connected to the side of the elastic frame away from the cover. The two sets of vibration damping groups are respectively disposed on both sides of the first vibration damping member and are symmetrically arranged with respect to the plane of symmetry. Each vibration damping group includes a plurality of second vibration damping members spaced apart along the length direction. Each second vibration damping member includes: The second elastic support part, one end of which is connected to the side of the elastic frame away from the cover; The second vibration damping part is connected to the end of the first elastic support part away from the elastic frame. The second vibration damping part has a second surface away from the cover body. The second surface has a second slot. Two second slots and two first slots are correspondingly arranged. When the cover body is placed on the opening and the impact force on the box body is greater than or equal to the first preset impact force, the bottom of the first slot and the bottom of the second slot can both abut against the outer peripheral surface of the wafer. In the same first damping member, the two first surfaces are arranged at an angle, and the opening of the angle faces away from the cover; in the two symmetrical second damping members, the two second surfaces are arranged at an angle, and the opening of the angle faces away from the cover.

2. The wafer carrier apparatus of claim 1, wherein, The width of the first slot gradually decreases from the opening to the bottom; and / or, The wall of the first slot smoothly transitions to the first surface.

3. The wafer carrier device as described in claim 1, characterized in that, The first vibration damping component has a symmetrical plane along the length direction. The elastic connector and each of the first vibration damping components are symmetrically arranged with respect to the symmetrical plane. The cover has a snap-fit ​​component on the side facing the box, and the snap-fit ​​component extends along the length direction. The elastic connector has a snap-fit ​​groove on the side facing the cover, and the snap-fit ​​groove extends along the length direction. The snap-fit ​​component snaps into the groove wall of the snap-fit ​​groove.

4. The wafer carrier device as described in claim 1, characterized in that, The width of the second slot opening gradually decreases in the direction away from the first damping member, and the width of the second slot gradually decreases from the opening to the bottom; and / or, The groove wall of the second slot transitions smoothly with the second surface.

5. The wafer carrier device as described in claim 1, characterized in that, The first damping part and the second damping part have two third surfaces intersecting the length direction, each third surface having a protrusion, the first surface and the corresponding protrusion having a smooth transition away from the surface of the cover, and the second surface and the corresponding protrusion having a smooth transition away from the surface of the cover.

6. The wafer carrier device as described in claim 5, characterized in that, The first damping part has a fourth surface adjacent to the first surface and the third surface, and the projections of the two protrusions between two adjacent first damping parts on the fourth surface at least partially overlap. The second damping portion has a fifth surface adjacent to the second surface and the third surface, and the projections of the two protrusions between two adjacent second damping portions on the fifth surface at least partially overlap.

7. The wafer carrier device as described in claim 1, characterized in that, The vibration damping structure also includes: Two first limiting members are disposed on the surface of the cover facing the elastic frame and extend along the length direction. The two first limiting members are symmetrically arranged with respect to the plane of symmetry. The two first limiting members are respectively disposed corresponding to the first damping parts on both sides, so that after the first elastic support part undergoes elastic deformation in the direction closer to the cover, the first damping part can abut against the first limiting member. Two second limiting members are disposed on the surface of the cover facing the elastic frame and extend along the length direction. The two second limiting members are symmetrically arranged with respect to the plane of symmetry and are respectively disposed on both sides of the two first limiting members. The two second limiting members are respectively disposed corresponding to the second damping parts on both sides, so that after the second elastic support part undergoes elastic deformation in the direction closer to the cover, the second damping part can abut against the second limiting members.

8. The wafer carrier device according to any one of claims 1-7, characterized in that, The vibration damping structure includes an elastic frame, a first vibration damping component, and a second vibration damping component. The first vibration damping component is connected to the elastic frame; the second vibration damping component is connected to the elastic frame and spaced apart from the first vibration damping component. The cover has a mounting groove for mounting the elastic frame. The wafer carrier further includes: A plug-in structure connects the elastic frame and the wall of the mounting groove, so that the elastic frame engages with the wall of the mounting groove.

9. The wafer carrier device as described in claim 8, characterized in that, The elastic frame has a first outer surface and a second outer surface extending along the length direction and arranged opposite to each other; the mounting groove has a first groove wall and a second groove wall extending along the length direction and arranged opposite to each other; the plug-in structure includes: Two sets of first plug groups are respectively disposed on the first outer side and the second outer side, and each first plug group includes a plurality of first plug members disposed at intervals; Two sets of second insertion groups are respectively disposed on the first groove wall and the second groove wall, and each second insertion group includes multiple second insertion members disposed at intervals. Each second insertion member, the bottom of the mounting groove and the first groove wall or the second groove wall form a slot, and the first insertion member is inserted into the slot in a corresponding manner.

10. The wafer carrier device as claimed in claim 9, characterized in that, The plug-in structure also includes: Multiple abutments are spaced apart at the bottom of the mounting groove for abutting against the inner side of the elastic frame after the first connector is inserted into the slot; each abutment has a beveled portion on the side facing the slot, the beveled portion having an inclined surface, and the inclined surface is positioned towards the slot and the opening of the mounting groove.

11. The wafer carrier device as claimed in claim 9, characterized in that, The orthographic projection of the first plug on the first outer side surface is the first projection, and the orthographic projection of the first plug on the second outer side surface is the second projection. The first projection and the second projection are spaced apart or partially overlap.

12. The wafer carrier device as claimed in claim 9, characterized in that, The first outer side and the second outer side of the elastic frame have a plurality of positioning grooves spaced apart, and the bottom of the mounting groove has a plurality of positioning posts spaced apart, each of the positioning posts being able to abut against the groove wall of the positioning groove.

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