Multi-functional robot and wafer processing apparatus

Abstract

The application discloses a multifunctional manipulator, which comprises a base, a suction cup manipulator fixed on the side of the base, a rotary cutting assembly arranged on the opposite side wall of the side wall where the suction cup manipulator is arranged, and a vision system arranged on the adjacent side wall of the side wall where the suction cup manipulator is arranged, wherein the direction of the vision system is consistent with the direction of the rotary cutting assembly. The multifunctional manipulator starts to work under the control of a six-axis manipulator, and can be placed at a specified position. During the working process, the multifunctional manipulator is flexible and convenient. The butterfly nut is controlled to adjust the angle of the cutter wheel in the cutting assembly, so that accurate cutting is realized. The vision system can accurately position the center of a wafer and the edge of the wafer.

Description

Technical Field

[0001] This invention relates to the field of wafer lamination technology, and in particular to a multifunctional robotic arm. Background Technology

[0002] Silicon carbide wafers undergo laser dicing, where a laser beam is focused inside the wafer, creating an instantaneous high temperature at the focal point. This generates a series of crisscrossing destructive layers within the wafer. Due to the high hardness of silicon carbide wafers, they cannot be cracked by film expansion alone. Suitable equipment is needed to dice the wafer line by line. The chip surface is sensitive to debris, so a PE film is applied to the wafer surface during the dicing process to prevent the dicing blades from directly contacting the wafer surface and to prevent debris generated during the dicing process from contaminating the chip.

[0003] Currently, composite films are used in wafer lamination. The composite film undergoes a film feeding mechanism, a film transfer mechanism, a film cutting mechanism, and a film application mechanism. The film applied to the wafer is a PE film. The area of ​​the cut PE film is often larger than the wafer disk, making it inconvenient to return the wafer disk to the storage container. Summary of the Invention

[0004] To solve the above-mentioned technical problems, the present invention provides a multifunctional robotic arm that can remove wafers from the hopper and has positioning and cutting functions.

[0005] The specific plan is as follows:

[0006] The multifunctional robotic arm includes a base, a suction cup robotic arm fixed to the side of the base, a rotary cutting component set on the side wall opposite to the side wall where the suction cup robotic arm is located, and a vision system set on the side wall adjacent to the side wall where the suction cup robotic arm is located. The orientation of the vision system is the same as the orientation of the rotary cutting component.

[0007] The rotary cutting assembly includes: a rotary drive device fixed to the side wall of the base, a rotary arm fixed to the end of the output shaft of the rotary drive device, and an adjustable cutter wheel assembly connected to the end of the rotary arm. The adjustable cutter wheel assembly comprises: a cutter wheel mounting base, a swing device, a movable plate, and a cutter wheel. The cutter wheel mounting base is fixed to the end of the rotary arm, and the movable plate is connected to the cutter wheel mounting base via the swing device. The cutter wheel is suspended at the bottom of the movable plate. A U-shaped notch is provided at the end of the cutter wheel mounting base away from the rotary motor. The swing device includes a swing plate, a swing shaft, an adjusting plate, an adjusting screw, and a movable plate. The swing plate is set inside the U-shaped notch via a swing shaft, which is fixed to the side wall of the U-shaped notch by bearings, with a margin between the swing plate and the adjacent side wall of the U-shaped notch; adjustment plates are fixed at the top and bottom of the U-shaped notch, with a groove corresponding to the U-shaped notch at the bottom and an adjustment hole at the top; the adjustment screw passes through the adjustment hole and through the swing plate, with the radial area of ​​the adjustment screw being smaller than the radial area of ​​the adjustment hole, and is threaded to the swing plate, with a wing nut threaded to the end of the screw; the movable plate is connected to the swing plate extending out of the side wall of the U-shaped notch.

[0008] A semi-circular washer is provided between the wing nut and the adjusting plate, and the semi-circular washer passes through the adjusting screw, with the arc-shaped surface of the semi-circular washer in contact with the adjusting plate.

[0009] A buffer device is connected between the movable plate and the swing plate. The buffer device includes a buffer base plate, a buffer spring, a buffer limiting shaft, a linear guide rail, and a buffer baffle. The buffer baffle is fixed to the top of the movable plate. The buffer base plate is connected to the side wall of the swing shaft extending out of the U-shaped notch. The buffer base plate is connected to the slider of the linear guide rail. The guide rail in the linear guide rail is fixed to the movable plate. The buffer limiting shaft passes through the buffer baffle, and one end is connected to the movable base plate. The other end is connected to a buffer pad. A buffer spring is sleeved between the buffer pad and the buffer baffle.

[0010] A portal-shaped cutter wheel fixing seat is fixed at the bottom of the movable plate; a cutter wheel bearing is coaxially fixed to the cutter wheel, which is rotatably connected to the portal-shaped cutter wheel fixing seat through a cutter wheel pin and fixed to the cutter wheel by a cutter wheel retaining spring.

[0011] The rotary drive device includes a rotary motor, a rotary cutter fixing plate, a motor mounting base, and a rotary shaft; the motor mounting base is fixed to the rotary cutter fixing plate, the rotary cutter fixing plate is connected to the base, the rotary shaft fixes the output end of the rotary motor, and its end is connected to the rotary robotic arm.

[0012] The multi-functional robotic arm is fixed to a six-axis robotic arm.

[0013] This invention uses a six-axis robotic arm to control a multi-functional robotic hand to start working and place it in a designated position. It is flexible and convenient during operation. In the cutting component, the angle of the cutter wheel is adjusted by controlling the wing nut to perform precise cutting. The vision system can accurately locate the center and edge of the wafer. Attached Figure Description

[0014] Figure 1 This is a structural diagram of a fully automatic film applicator;

[0015] Figure 2 yes Figure 1 Side view;

[0016] Figure 3 This is a schematic diagram of a multi-functional robot system.

[0017] Figure 4 This is a schematic diagram of a multi-functional robotic arm.

[0018] Figure 5 This is a schematic diagram of the rotary cutting assembly;

[0019] Figure 6 This is a schematic diagram of the adjustable cutter wheel assembly.

[0020] 1. Machine frame; 2. Composite film feeding system; 21. Feeding air shaft; 22. Driven roller system; 23. Feeding buffer roller; 24. Tension control and detection roller; 25. First drive roller; 3. Residual material collection system; 31. Residual material collection air shaft; 32. Second drive roller; 33. Residual material collection roller system; 34. Second buffer roller; 4. Protective film receiving system; 41. Protective film receiving air shaft; 42. Protective film receiving roller system; 5. Wafer lamination system. 51. Film application lifting platform; 52. Antistatic film application roller; 53. Film angle adjustment roller; 6. Multifunctional robot system; 61. Six-axis robotic arm; 62. Multifunctional robotic hand; 621. Base; 6211. Suction cup robotic hand; 6212. Vision system; 6213. Rotary cutting assembly; 62131. Rotary drive device; 62132. Rotary arm; 62133. Adjustable cutter wheel assembly; 62134. Cutter wheel; 7. Material feeding system. Detailed Implementation

[0021] The technical solutions in the embodiments of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the implementation of the present invention, and not all of it. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0022] like Figures 1-6As shown. The fully automatic wafer coating machine includes: a machine frame 1, a composite film feeding system 2, a waste material collection system 3, a protective film collection system 4, a wafer laminating system 5, a multi-functional robot system 6, and a feeding system 7. The composite film feeding system 2, waste material collection system 3, and protective film collection system 4 are mounted on the longitudinal sidewalls of the machine frame 1. The wafer laminating system 5 is mounted on the horizontal frame of the machine frame 1, positioned between the composite film feeding system 2 and the waste material collection system 3. The multi-functional robot system 6 includes a six-axis robotic arm 61 and a multi-functional robotic hand 62 fixed to the six-axis robotic arm 61. By rotating to the six-axis robotic arm 61, the multi-functional robotic hand 62 transports the wafer from the feeding system 7 to the wafer laminating system 5 and cuts the wafer after PE film lamination. The composite film includes a PE film and a protective film. The composite film roll is released from the composite film feeding system 2. Between passing through the wafer lamination system, the PE film and the protective film are separated. The protective film is collected by the protective film collection system 4. When the PE film passes through the lamination system, it is laminated with the wafer transported by the multi-functional robot system 6. Subsequently, the multi-functional robot cuts the PE film into sizes that match the wafer. The cut PE film strip is recycled as surplus material.

[0023] The composite film feeding system 2 includes: a feeding air shaft 21, a driven roller system 22, and a feeding buffer roller 23. A feeding electromagnetic brake is fixed to the end of the feeding air shaft 21. The feeding electromagnetic brake is electrically connected to a tension control roller 24. The tension control roller 24 detects the tension of the film strip and feeds it back to the feeding electromagnetic brake to maintain the composite film at all times. The composite film feeding system 2 also includes a first buffer roller, which acts as a slider connected to a guide rail on the longitudinal side wall and contacts the film strip under its own weight. A first drive roller 25 is provided between the composite film feeding system 2 and the wafer lamination system 5. A first fixed roller is provided below the first drive roller 25. There is a channel for the film strip to advance between the first fixed roller and the first drive roller 25. The PE film is in close contact with the first drive roller 25, and the protective film is in close contact with the first fixed roller. The PE film passes through each roller sequentially. The cooperation between the feeding electromagnetic brake and the tension control roller 24, as well as the first buffer roller relying on its own weight, ensure that the composite film strip maintains sufficient tension in the feeding system.

[0024] The protective film take-up system 4 includes a protective film take-up air shaft 41 and a protective film take-up roller system. The protective film passes through the first fixed rotating roller, passes through the protective film take-up roller system 42, and is wound on the protective film take-up air shaft 41. The protective film take-up air shaft 41 is fixed with a protective film take-up electromagnetic brake at its end to keep the protective film taut when it is retracted.

[0025] The wafer lamination system 5 includes a lamination lifting platform 51, an anti-static lamination roller 52, and a film angle adjusting roller 53. The anti-static lamination roller 52 is fixed to the longitudinal side wall via a two-dimensional moving device, and contacts the PE film on the lamination lifting platform through the two-dimensional moving device. The film angle adjusting roller 53 is fixed to the longitudinal side wall via a lifting cylinder, and the PE film extending from the lamination lifting platform contacts the bottom of the film angle adjusting roller 53, so that the angle between the film strip and the horizontal plane remains unchanged. After the wafer is transported to the lamination lifting platform by the multi-functional robot system 6, the lifting platform rises and contacts the PE film. The anti-static lamination roller 52 moves above the PE film via the two-dimensional moving device and presses the PE film firmly.

[0026] The multi-functional robot system 6 includes a six-axis robotic arm 61 and a multi-functional robotic hand 62 fixed on the six-axis robotic arm 61. The multi-functional robotic hand 62 includes a base 621, a suction cup robotic hand 6211 fixed to the side of the base 621, a rotary cutting assembly 6213 set on the side wall opposite to the side wall of the suction cup robotic hand 6211, and a vision system 6212 set on the adjacent side wall of the side wall of the suction cup robotic hand 6211. The orientation of the vision system 6212 is the same as the orientation of the rotary cutting assembly 6213. The suction cup robotic hand 6211 takes the wafer from the feeding system 7 and places it in the wafer lamination system 5, so that the wafer begins to be laminated. After lamination is completed, the multi-functional robotic hand 62 rotates, so that the vision system 6212 aligns with the wafer, detects the center position and edge position of the wafer, and the cutting assembly starts working to cut the PE film. After cutting, the suction cup robotic hand 6211 puts the wafer back into the feeding system 7.

[0027] The rotary cutting assembly 6213 includes: a rotary drive device 62131 fixed to the side wall of the base 621, a rotary arm 62133 fixed to the end of the output shaft of the rotary drive device 62131, and an adjustable cutter wheel 62134 assembly 62133 connected to the end of the rotary arm 62133. The adjustable cutter wheel 62134 assembly 62133 includes: a cutter wheel 62134 mounting base, a swing device, a movable plate, and the cutter wheel 62134. The cutter wheel 62134 mounting base is fixed to the end of the rotary arm 62133. The movable plate and the cutter wheel 62134 mounting base are connected via the swing device. The cutter wheel 62134 is suspended from the bottom of the movable plate. A U-shaped notch is provided at the end of the cutter wheel 62134 mounting base away from the rotary motor. The swing device includes a swing arm. The system comprises a plate, a swing shaft, an adjusting plate, an adjusting screw, and a movable plate. The swing plate is positioned within a U-shaped notch via the swing shaft, which is fixed to the side wall of the U-shaped notch by bearings, with sufficient clearance between the swing plate and the adjacent side wall of the U-shaped notch. Adjusting plates are fixed at both the top and bottom of the U-shaped notch, with a groove corresponding to the U-shaped notch at the bottom and an adjusting hole at the top. The adjusting screw passes through the adjusting hole and through the swing plate, with its radial area smaller than that of the adjusting hole, and is threaded to the swing plate. A wing nut is threaded to the end of the screw. The movable plate extends from the side wall of the U-shaped notch and connects to the swing plate. A semi-circular washer is placed between the wing nut and the adjusting plate, passing through the adjusting screw, with its arc-shaped surface contacting the adjusting plate. A portal-shaped cutter wheel 62134 mounting base is fixed to the bottom of the movable plate; a cutter wheel 62134 bearing is coaxially fixed to the cutter wheel 62134, and the cutter wheel 62134 is rotatably connected to the portal-shaped cutter wheel 62134 mounting base via a cutter wheel 62134 pin and fixed by a cutter wheel 62134 retaining spring. A control adjusting screw causes the swing device to swing around the swing axis, allowing for precise adjustment of the angle of the cutter wheel 62134, facilitating precise cutting of the PE film. A semi-circular washer prevents the swing device from jamming during swing.

[0028] A buffer device is connected between the movable plate and the swing plate. The buffer device includes a buffer base plate, a buffer spring, a buffer limiting shaft, a linear guide rail, and a buffer baffle. The buffer baffle is fixed to the top of the movable plate. The buffer base plate is connected to the side wall of the swing shaft extending out of the U-shaped notch. The buffer base plate is connected to the slider of the linear guide rail. The guide rail in the linear guide rail is fixed to the movable plate. The buffer limiting shaft passes through the buffer baffle, and one end is connected to the movable base plate. The other end is connected to a buffer pad. A buffer spring is sleeved between the buffer pad and the buffer baffle.

[0029] The rotary drive device 62131 includes a rotary motor, a rotary cutter fixing plate, a motor mounting base, and a rotary shaft; the motor mounting base is fixed to the rotary cutter fixing plate, the rotary cutter fixing plate is connected to the base 621, the rotary shaft fixes the output end of the rotary motor, and the end is connected to the rotary robotic arm.

[0030] The residual material collection system 3 includes a residual material air shaft, a second drive roller 32, a residual material collection roller system 33, and a second buffer roller 34. After passing through the film angle adjustment roller 53, the film belt passes through the residual material collection roller system 33 on the upper surface of the second drive roller 32 and is wound on the residual material air shaft. An electromagnetic brake is fixed at the end of the residual material air shaft to keep the PE film taut at all times when it is recycled.

[0031] The composite film roll is fixed on the film-laying air-expansion shaft 21. Passing through the film-laying air-expansion shaft 21, the composite film reaches between the first drive roller 25 and the first fixed-rotation roller, separating the composite film into a PE film and a protective film. The protective film passes through the protective film take-up roller system and is wound around the protective film take-up air-expansion shaft 41. The PE film passes through the wafer lamination system 5. Simultaneously, the six-axis robotic arm 61 rotates, causing the multi-functional robotic arm 62 to remove the wafer from the feeding system 7 and place it on the lamination lifting platform of the wafer lamination system 5. The platform's lifting and lowering brings the wafer into contact with the PE film. The anti-static lamination roller 52, using a two-dimensional moving device, presses the PE film firmly onto the wafer surface. The multi-functional robotic arm 62 rotates, causing the vision system 6212 to align with the wafer, detecting its center and edge positions. The cutting assembly then begins cutting the PE film. After cutting, the suction cup robotic arm 6211 returns the wafer to the feeding system 7. The cut PE film strip passes through the waste material recovery roller system and is wound around the waste material recovery air-expansion shaft.

[0032] The coordination between the air shaft, the electromagnetic brake, and the tension control roller 24 in the composite film feeding system 2, along with the weight of the first buffer roller, ensures that the composite film strip maintains sufficient tension within the feeding system. The anti-static film-applying roller 52 moves above the PE film via a two-dimensional moving device, pressing the PE film firmly. The second buffer roller 34 in the waste material collection system 3 maintains sufficient tension on the cut PE film strip due to its own gravity. The multi-functional robot system 6 operates flexibly and conveniently. The cutting assembly uses a wing nut to adjust the angle of the cutter wheel 62134 for precise cutting. A semi-circular washer prevents jamming during the swing of the oscillating device. During angle adjustment, a buffer device prevents the cutter wheel 62134 from rising and falling too quickly, causing damage. The vision system 6212 can accurately locate the center and edge of the wafer.

[0033] The technical means disclosed in this invention are not limited to those disclosed in the above embodiments, but also include technical solutions composed of any combination of the above technical features. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of this invention, and these improvements and modifications are also considered within the scope of protection of this invention.

Claims

1. A multifunctional robotic arm, including a base, characterized in that, A suction cup robot is fixed to the side of the base. A rotary cutting component is set on the side wall opposite to the side wall where the suction cup robot is located. A vision system is set on the side wall adjacent to the side wall where the suction cup robot is located. The orientation of the vision system is the same as the orientation of the rotary cutting component. The rotary cutting assembly includes: a rotary drive device fixed to the side wall of the base, a rotary arm fixed to the end of the output shaft of the rotary drive device, and an adjustable cutter wheel assembly connected to the end of the rotary arm. The adjustable cutter wheel assembly comprises: a cutter wheel mounting base, a swing device, a movable plate, and a cutter wheel. The cutter wheel mounting base is fixed to the end of the rotary arm, and the movable plate is connected to the cutter wheel mounting base via the swing device. The cutter wheel is suspended at the bottom of the movable plate. A U-shaped notch is provided at the end of the cutter wheel mounting base away from the rotary motor. The swing device includes a swing plate, a swing shaft, an adjusting plate, an adjusting screw, and a movable plate. The swing plate is set inside the U-shaped notch via a swing shaft, which is fixed to the side wall of the U-shaped notch by bearings, with a margin between the swing plate and the adjacent side wall of the U-shaped notch; adjustment plates are fixed at the top and bottom of the U-shaped notch, with a groove corresponding to the U-shaped notch at the bottom and an adjustment hole at the top; the adjustment screw passes through the adjustment hole and through the swing plate, with the radial area of ​​the adjustment screw being smaller than the radial area of ​​the adjustment hole, and is threaded to the swing plate, with a wing nut threaded to the end of the screw; the movable plate is connected to the swing plate extending out of the side wall of the U-shaped notch; A semi-circular washer is provided between the wing nut and the adjusting plate, and the semi-circular washer passes through the adjusting screw, with the arc-shaped surface of the semi-circular washer in contact with the adjusting plate; A buffer device is connected between the movable plate and the swing plate. The buffer device includes a buffer base plate, a buffer spring, a buffer limiting shaft, a linear guide rail, and a buffer baffle. The buffer baffle is fixed to the top of the movable plate. The buffer base plate is connected to the side wall of the swing shaft extending out of the U-shaped notch. The buffer base plate is connected to the slider of the linear guide rail. The guide rail in the linear guide rail is fixed to the movable plate. The buffer limiting shaft passes through the buffer baffle, and one end is connected to the movable base plate. The other end is connected to a buffer pad. A buffer spring is sleeved between the buffer pad and the buffer baffle.

2. The multifunctional robotic arm according to claim 1, characterized in that, A portal-shaped cutter wheel fixing seat is fixed at the bottom of the movable plate; a cutter wheel bearing is coaxially fixed to the cutter wheel, which is rotatably connected to the portal-shaped cutter wheel fixing seat through a cutter wheel pin and fixed to the cutter wheel by a cutter wheel retaining spring.

3. The multifunctional robotic arm according to claim 2, characterized in that, The rotary drive device includes a rotary motor, a rotary cutter fixing plate, a motor mounting base, and a rotary shaft; the motor mounting base is fixed to the rotary cutter fixing plate, the rotary cutter fixing plate is connected to the base, the rotary shaft fixes the output end of the rotary motor, and its end is connected to the rotary robotic arm.

4. A wafer processing apparatus comprising the multifunctional robotic arm according to any one of claims 1-3, characterized in that, The multi-functional robotic arm is fixed to a six-axis robotic arm.

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