Filter element bracket and camera module, and preparation process thereof

Abstract

The present invention discloses a filter element holder, a camera module, and a manufacturing process thereof. The filter element holder comprises a holder body and a metal insert. The holder body is provided with a first through-hole, the metal insert being partially embedded in the holder body. The metal insert is provided with a second through-hole, an extension, an embedded portion, and a copper oxide layer. The second through-hole and the first through-hole are arranged in communication on the light-sensing path of the photosensitive component. The extension integrally extends from the embedded portion toward the second through-hole. The embedded portion is embedded in the holder body. The copper oxide layer is attached to the outer surface of the extension, and the extension secures the filter element. This helps reduce the height of the filter element holder and effectively reduces the light reflectivity of the filter element holder.

Description

Technical Field

[0001] The present invention relates to the technical field of camera modules, and in particular to a filter element bracket, a camera module thereof, and a preparation process thereof. Background Art

[0002] In recent years, with the widespread adoption of mobile electronic devices, the technologies related to camera modules (used to capture images, such as videos or pictures) used in these devices have experienced rapid development and advancement, particularly in fields such as healthcare, security, mobile terminals, and industrial production. In the consumer electronics sector, miniaturized and lightweight camera modules are an indispensable component, and they are now commonly installed in mobile electronic devices such as tablets, laptops, and smartphones. Currently, portable devices are equipped with at least one camera module, and features such as autofocus (AF), optical image stabilization (OIS), and zoom have been added to these mobile terminal camera modules.

[0003] Since the installation space of camera modules in electronic devices such as mobile phones is limited, and in order to realize the various functions of camera modules, their structures have become more and more complex and their sizes have also increased accordingly, especially the increase in height (in the direction of the optical axis), which has increased the thickness of the electronic devices where the camera modules are installed.

[0004] In order to lower the height of the camera module, the back focus size of the camera module can be reduced. However, once the back focus size of the camera module is compressed, the height of the bracket used to support the filter element has to be lowered, and the reduction in the bracket height may weaken the structural strength. Summary of the Invention

[0005] An object of the present invention is to provide a filter element bracket and its camera module, and a preparation process, which overcome the shortcomings of the prior art, reduce the height of the filter element bracket, and at the same time, effectively reduce the light reflectivity of the filter element bracket.

[0006] In order to achieve the above objects, the technical solution adopted by the present invention is:

[0007] According to a first aspect provided by the present application, a filter element holder is provided, comprising:

[0008] A bracket body, wherein the bracket body is provided with a first through hole;

[0009] A metal insert, wherein the metal insert is partially embedded in the bracket body, and the metal insert is provided with a second through hole, a protruding portion, an embedded portion and a copper oxide layer. The second through hole and the first through hole are arranged in communication on the photosensitive path of the photosensitive component, and the protruding portion extends integrally from the embedded portion toward the second through hole. The embedded portion is embedded in the bracket body, and the copper oxide layer is attached to the outer surface of the protruding portion, so that the protruding portion can fix the filter element.

[0010] In some embodiments, the protruding portion is provided with an insert upper surface, an insert inner side surface and an insert bottom surface, the insert inner side surface connects the insert upper surface and the insert bottom surface, the insert inner side surface forms the second through hole, the copper oxide layer is attached to the outer layer of the insert upper surface and / or the insert inner side surface and / or the insert bottom surface, and the filter element is adhesively fixed to the insert upper surface or the insert bottom surface.

[0011] In some embodiments, the inner side surface of the insert is provided with an oblique inner side surface and a vertical inner side surface, and the oblique inner side surface obliquely connects the vertical inner side surface and the upper surface of the insert, so that the inner diameter of the second through hole gradually decreases from top to bottom along the optical axis.

[0012] In some embodiments, the bracket body includes a supporting portion and an extending portion, the extending portion integrally extends inward from the supporting portion toward the first through hole, the supporting portion is fixed to the circuit board, and the embedded portion of the metal insert is embedded in the extending portion, so that the metal insert is fixed on the extending portion.

[0013] In some embodiments, the inner diameter of the second through hole is smaller than that of the first through hole, and the extension portion of the metal insert extends inward from the extension portion of the bracket body, so that the filter element is adhered to the upper surface or bottom surface of the insert of the extension portion.

[0014] In some embodiments, the bracket body further includes at least two bracket protrusions, which protrude outward from the upper surface of the bracket body at intervals. The bracket protrusions are arranged adjacent to the copper oxide layer at the extension portion, so that the bracket protrusions are higher than the copper oxide layer.

[0015] In some embodiments, the height of the stent protrusion is not less than 10 μm.

[0016] In some embodiments, the bracket body is made of resin, the metal insert is made of metal, and the thickness of the copper oxide layer is no more than 10 μm, thereby reducing stray light reflectivity.

[0017] According to a second aspect of the present application, a camera module is provided, comprising:

[0018] Optical lens;

[0019] The photosensitive component, the optical lens is located in the photosensitive path of the photosensitive component, the photosensitive component includes a circuit board, a photosensitive chip, electronic components, a filter element and the above-mentioned filter element bracket, the photosensitive chip and the electronic components are electrically connected to the circuit board, the filter element is fixed to the filter element bracket, and is arranged between the optical lens and the photosensitive chip.

[0020] According to a third aspect of the present application, a process for preparing a filter element holder is provided, comprising the steps of:

[0021] S10: loading a pre-prepared metal insert into the molding die, and injecting molten resin into the molding die so that the metal insert is partially embedded in the bracket body formed by solidifying the resin;

[0022] S20: attaching a copper oxide layer to the surface to be blackened of the metal insert through a copper blackening process, wherein the surface to be blackened is the inner side surface, the upper surface and / or the bottom surface of the metal insert.

[0023] In some embodiments, step S20 includes the steps of:

[0024] S201 copper plating on the surface of the metal insert to be blackened;

[0025] S202 activates the surface of the metal insert to be blackened by a sulfuric acid solution;

[0026] S203 soaking the activated surface to be blackened in a sodium hydroxide solution;

[0027] S204: soaking the surface to be blackened in a neutral solution, and depositing a copper oxide layer on the surface to be blackened by chemical deposition;

[0028] S205 high or low temperature baking filter element holder.

[0029] In some embodiments, step S202 specifically includes the steps of: activating the surface to be blackened by the sulfuric acid solution for 15-30 seconds at room temperature, cleaning the surface to be blackened by the sulfuric acid solution to remove the oxide of the copper plating layer on the surface to be blackened, wherein the mass fraction of the sulfuric acid solution is not greater than 5%.

[0030] In some embodiments, the step S203 specifically includes the steps of soaking the activated surface to be blackened in the sodium hydroxide solution at 85° C. for 3-5 minutes to neutralize the pH value of the surface to be blackened, wherein the pH value of the sodium hydroxide solution is 13-13.5.

[0031] In some embodiments, step S204 specifically includes the steps of: soaking in a neutral solution at room temperature for 3 minutes, and depositing a copper oxide layer on the surface to be blackened by chemical deposition, wherein the neutral solution is selected from one or more of water, nickel sulfate, boric acid, lemonade, ammonia water, copper sulfate, sodium succinate diester sulfonate, sodium phosphate diester, tin nitrate, sulfuric acid, nickel ammonia, and nickel sulfate.

[0032] In some embodiments, the step S205 specifically includes the steps of: baking the filter element holder at a high temperature of 85-90° C. for 20 minutes; or baking the filter element holder at 30° C. for 30-40 minutes. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a structural schematic diagram of a camera module according to an embodiment of the present application.

[0034] Figure 2 According to the embodiment of this application Figure 1 Schematic diagram of the partial structure of the camera module of part A.

[0035] Figure 3 Schematic diagram of the structure of the filter element bracket according to the embodiment of the present application.

[0036] Figure 4 3 is an exploded view of the structure of the filter element holder according to the embodiment of the present application.

[0037] Figure 5 It is a partial structural schematic diagram of the filter element bracket according to the embodiment of the present application.

[0038] Figure 6 It is a structural schematic diagram of the first camera module according to the implementation scheme of the present application.

[0039] Figure 7 It is a structural diagram of the second camera module according to the embodiment of the present application. DETAILED DESCRIPTION

[0040] The present invention will be further described below in conjunction with specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0041] In the description of the present invention, it should be noted that, for directional words, such as the terms "center", "horizontal", "longitudinal", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like, indicating directions and positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and cannot be understood as limiting the specific scope of protection of the present invention.

[0042] It should be noted that the terms "first", "second", etc. in the description and claims of this application are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0043] The terms "comprises" and "having" and any variations thereof in the specification and claims of this application are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus that includes a series of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, product or apparatus.

[0044] It should be noted that, as used in this application, the terms "substantially," "approximately," and similar terms are used as terms of approximation, not as terms of degree, and are intended to account for inherent deviations in measurements or calculations that would be recognized by a person of ordinary skill in the art.

[0045] In the description of the present invention, it should also be noted that, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct, contact, or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0046] According to the first aspect of the present application, a camera module 1 is provided, such as Figures 1 to 7 As shown, a camera module 1 according to an embodiment of the present application is illustrated, which includes a photosensitive component 30, an optical lens 10 held on the photosensitive path of the photosensitive component 30, and a driving component 20 for driving the optical lens 10 and / or the photosensitive component 30 to move to achieve optical performance adjustment, such as optical image stabilization, optical focus, etc.

[0047] Accordingly, the optical lens 10 includes a lens barrel 11 and a lens group 12 installed in the lens barrel 11. The lens group 12 includes at least one optical lens. The number of the at least one optical lens can be one or more, and is not limited. The optical lens 10 is directly fixed to the photosensitive component 30 or indirectly fixed to the photosensitive component 30 through the driving component 20.

[0048] The driving assembly 20 includes a fixed component 21, a movable component 22 and a driving unit. The optical lens 10 is fixed to the movable component 22 of the driving assembly 20. The driving unit drives the movable component 22 and the optical lens 10 to move to achieve lens anti-shake or lens focus functions. Figure 1 As shown, the fixed component 21 further includes an upper cover 211 and a base 212. The upper cover 211 and the base 212 form a chamber that accommodates the movable component 22 and the drive unit. The drive assembly 20 is fixed to the circuit board 31 via the base 212. In the embodiments of the present application, the drive assembly 20 can be a voice coil motor, a piezoelectric motor, an SMA (Shape Memory Alloy) motor, or other types of motors. When the drive assembly 20 is a voice coil motor, the drive unit can be a coil-magnet pair; when the drive assembly 20 is a piezoelectric motor, the drive unit can be a piezoelectric element; when the drive assembly 20 is an SMA motor, the drive unit can be an SMA wire.

[0049] The photosensitive component 30 includes a circuit board 31 and a photosensitive chip 32 electrically connected to the circuit board 31, an electronic component 33 and a connector 35. The photosensitive chip 32 is used to receive the external light imaging collected by the optical lens 10 and is electrically connected to an external mobile electronic device through the circuit board 31 and the connector 35.

[0050] The photosensitive chip 32 is directly or indirectly fixed to the circuit board 31. The photosensitive chip 32 includes a photosensitive area and a non-photosensitive area. The photosensitive chip 32 is electrically connected to the circuit board 31 through a chip pad located in the non-photosensitive area. For example, the photosensitive chip 32 can be electrically connected to the circuit board 31 through wire bonding (gold wire), welding, FC process (chip flip-chip) or RDL (rewiring layer technology).

[0051] In some embodiments, the circuit board 31 includes a circuit board body 311, a connecting tape 312, and a connecting plate 313. The connecting tape 312 connects and electrically conducts the circuit board body 311 and the connecting plate 313. The photosensitive chip 32 and the electronic component 33 are electrically connected to the circuit board body 311. The connector 35 is fixed and electrically connected to the connecting plate 313, so that the imaging information obtained by the photosensitive chip 32 is transmitted to the external mobile electronic device through the circuit board body 311, the connecting tape 312, the connecting plate 313 and the connector 35. Figure 1 shown.

[0052] In some embodiments, the circuit board body 311 is provided with a circuit board through-hole 3111 located in the middle, and a reinforcing plate 34 is fixed to the bottom surface of the circuit board body 311 (the side of the circuit board body 311 away from the optical lens 10 is defined as the bottom surface) through an adhesive medium 36. The reinforcing plate 34 and the circuit board body 311 form a mounting cavity to accommodate the photosensitive chip 32, thereby avoiding the influence of the thickness of the circuit board body 311 on the thickness of the photosensitive component 30 and reducing the height of the camera module 1. The reinforcing plate 34 can be made of metal such as stainless steel. The thinner thickness maintains higher strength while having better heat dissipation effect. In one embodiment of the present application, the photosensitive chip 32 is fixed to the reinforcing plate 34 through the adhesive medium 36 and is thereby indirectly fixed to the circuit board body 311. The photosensitive chip 32 is electrically connected to the circuit board body 311 through a lead 321, and the lead 321 can be a gold wire.

[0053] In some embodiments, the photosensitive component 30 further includes a filter element 37 , which is retained on the photosensitive path of the photosensitive chip 32 and is used to filter the imaging light entering the photosensitive chip 32 .

[0054] In some embodiments, the photosensitive component 30 further includes a filter element bracket 38, which is used to fix the filter element 37. The filter element 37 is arranged between the optical lens 10 and the photosensitive chip 32. The filter element 37 corresponds to at least the photosensitive area of ​​the photosensitive chip 32. The filter element 37 can be attached to the filter element bracket 38 upright or upside down.

[0055] In some embodiments, the filter element 37 is attached upside down to the filter element holder 38. That is, an adhesive medium 36 is interposed between the front surface of the filter element 37 (the side facing the optical lens 10 and away from the photosensitive chip 32) and the filter element holder 38 to bond and secure them. This inverted attachment of the filter element 37 reduces the distance between the filter element 37 and the photosensitive chip 32, effectively lowering the height of the photosensitive assembly 30 and thereby providing a camera module with a short back focus.

[0056] like Figure 2 The filter element bracket 38 shown in the figure includes a bracket body 383 and a metal insert 384, the bracket body 383 is provided with a first through hole 3834, the metal insert 384 is partially embedded in the bracket body 383, the metal insert 384 is provided with a second through hole 3847, a protruding portion 3841, an embedded portion 3842 and a copper oxide layer 3846, the second through hole 3847 and the first through hole 3834 are arranged in communication on the light-sensing path of the photosensitive component 30, the first through hole 3834 and the second through hole 3847 are arranged in communication with each other on the light-sensing path of the photosensitive component 30, and the first through hole 3834 and the second through hole 3847 are arranged in communication with each other on the light-sensing path of the photosensitive component 30. The second through-hole 3847 is used to provide a passage for imaging light, allowing light from the optical lens 10 to pass through the second through-hole 3847 and the first through-hole 3834 and enter the photosensitive chip 32. The extension 3841 integrally extends from the embedded portion 3842 toward the second through-hole 3847. The embedded portion 3842 is embedded in the bracket body 383. The copper oxide layer 3846 is attached to the outer surface of the extension 3841, which secures the filter element 37. The metal insert 384 is partially embedded in the bracket body 383 through an insert molding process, further reducing the height of the filter element bracket 38, facilitating a short back focus camera module 1. The copper oxide layer 3846 attached to the extension 3841 helps reduce stray light reflectivity.

[0057] In some embodiments, the material of the bracket body 383 can be a resin material, so as to maintain a lighter weight and lower light reflectivity, and the material of the metal insert 384 can be a metal material such as stainless steel, so that when the thickness of the bracket body 383 is thin, it can maintain its sufficient strength through the embedding of the embedded part 3842, and thus the height of the filter element bracket 38 can be lowered. At the same time, the protruding part 3841 of the metal insert 384 can fix the filter element 37, thereby increasing the support firmness of the filter element bracket 38 to the filter element 37.

[0058] In some embodiments, the bracket body 383 includes a support portion 3831 and an extension portion 3832. The extension portion 3832 integrally extends inward from the support portion 3831 toward the first through hole 3834. The support portion 3831 is fixed to the circuit board 31 and supports the extension portion 3832. The inner embedding portion 3842 of the metal insert 384 is embedded in the extension portion 3832, thereby securing the metal insert 384 to the extension portion 3832. The extension portion 3832 at least partially encloses the inner embedding portion 3842 to enhance the structural strength of the extension portion 3832. The protruding portion 3841 is not enclosed by the bracket body 383, thereby providing space for securing the filter element 37.

[0059] In some embodiments, the inner diameter of the second through hole 3847 is smaller than that of the first through hole 3834. The extension portion 3841 of the metal insert 384 extends inward from the extension portion 3832 of the bracket body 383, allowing the filter element 37 to adhere to the insert upper surface 3843 or the insert bottom surface 3845 of the extension portion 3841. Thus, the extension portion 3841 extends from the extension portion 3832, providing space for securing the filter element 37. As the extension portion 3841 further extends inward, the area of ​​the filter element 37 is reduced, allowing the filter element 37 to be bonded and secured to the filter element bracket 38 via the adhesive medium 36 disposed between the front surface of the filter element 37 and the extension portion 3841, forming an inverted structure.

[0060] However, while the insert molding process used to form the filter element holder 38 with the metal insert 384 reduces its height, making it suitable for use in camera modules with short back-focus, at least a portion of the metal insert 384 (the extension 3841) is not enclosed by the holder body 383 and is therefore exposed. Metal surfaces have a high light reflectivity. During the camera module's imaging process, light reflected from the extension 3841 of the metal insert 384 acts as stray light, adversely affecting image quality.

[0061] In order to solve the problem of increased stray light caused by the high light reflectivity of metal inserts, we have tried black plating processes such as electrophoresis and spraying to plate the metal inserts black. However, the effect of reducing the light reflectivity was not high, and the stray light problem of the camera module was still serious. Even if the shape of the metal inserts was further changed, it was difficult to reduce the stray light.

[0062] For example, during the electrophoresis process, electrophoretic paint (epoxy resin coated with color powder and matte powder) is first applied to the entire outer surface of the metal insert 384. Then, through insert molding, the metal insert 384 is embedded in the bracket body 383, leaving the extension 3841 of the metal insert 384 exposed. The electrophoretic paint formed on the outer surface of the metal insert 384 by the electrophoretic process has a thickness of approximately 20 microns and a light reflectivity of approximately 5%.

[0063] For example, in the spray coating process, ink is first sprayed onto the outer surface of the metal insert 384. Then, through the insert molding process, the metal insert 384 is embedded in the bracket body 383, exposing the metal insert's extension 3841. The ink layer formed on the outer surface of the metal insert by the spray coating process is approximately 25 microns thick and has a light reflectivity of approximately 2%. Although the ink layer further reduces light reflectivity compared to electrophoretic paint, stray light still cannot meet imaging requirements.

[0064] Therefore, in order to reduce the light reflectivity of the metal insert 384, a new process - copper blackening process is adopted to treat the metal insert, so that a layer of copper oxide layer 3846 is formed on the surface of the exposed part of the metal insert 384 of the filter element bracket 38 that is not wrapped by the bracket body 383, thereby reducing the light reflectivity to below 0.5% in the 420-680nm band.

[0065] In some embodiments, the extension portion 3841 includes an insert upper surface 3843, an insert inner side surface 3844, and an insert bottom surface 3845. The insert inner side surface 384 connects the insert upper surface 3843 and the insert bottom surface 3845. The insert inner side surface 3844 encloses the second through hole 3847. The copper oxide layer 3846 is attached to the outer layer of the insert upper surface 3843 and / or the insert inner side surface 3844 and / or the insert bottom surface 3845. The filter element 37 is adhesively fixed to the insert upper surface 3843 or the insert bottom surface 3845. Because the extension portion 3841 is not enclosed by the bracket body 383, its surface is easily exposed to light and generates stray light. Attaching the copper oxide layer to the outer surface of the extension portion 3841 helps reduce the light reflectivity of the exposed portion of the metal insert 384.

[0066] In the camera module 1, after light from the optical lens 10 hits the filter element holder 38, the inner surface 3844 of the metal insert 384 is most likely to reflect light, easily reflecting stray light directly onto the photosensitive chip 32, which has the greatest impact on the imaging of the camera module 1. Secondly, the upper surface 3843 of the metal insert 384 is more likely to reflect light onto the optical lens 10, which then reflects the light and then hits the photosensitive chip 32, affecting the imaging of the camera module. Light reflected from the bottom surface of the metal insert 384 can also reduce imaging quality, but the impact is relatively small.

[0067] In some embodiments, a copper oxide layer 3846 is attached to the inner surface 3844 of the metal insert 384 to reduce the light reflectivity of the inner surface 3844 of the metal insert 384. To further reduce the light reflected by the inner surface 3844, the inner surface 3844 is provided with an oblique inner surface 38441 and a vertical inner surface 38442. The oblique inner surface 38441 obliquely connects the vertical inner surface 38442 and the insert upper surface 3843, such that the inner diameter of the second through hole 3847 gradually decreases from top to bottom along the optical axis. That is to say, the oblique inner side surface 38441 is connected to the upper surface 3843 of the insert, and the vertical inner side surface 38442 is connected to the bottom surface 3845 of the insert, so that the inner side surface 3844 of the insert forms a through hole with a gradually decreasing aperture, and the oblique inner side surface 38441 reflects part of the light incident on the inner side surface 3844 of the insert toward the optical lens 10 instead of directly incident on the photosensitive chip 32.

[0068] In some embodiments, a copper oxide layer 3846 is attached to the insert upper surface 3843 of the metal insert 384 to reduce the light reflectivity of the insert upper surface 3843 of the metal insert 384. Since the copper oxide layer 3846 is easily scratched during the assembly process, the bracket body 383 further includes at least two bracket protrusions 3833, which protrude outward from the upper surface of the bracket body 383 at intervals. The bracket protrusions 3833 are arranged adjacent to the copper oxide layer 3846 at the extension portion 384, so that the bracket protrusions 3833 are higher than the copper oxide layer 3846, thereby protecting the copper oxide layer 3846. Figure 5 shown.

[0069] In some embodiments, the thickness of the copper oxide layer 3846 made by the copper blackening process is less than 10 microns, which reduces the stray light reflectivity. Therefore, the height of the support protrusion 3833 is greater than 10 microns. Figure 3As shown, the bracket body 383 includes six bracket protrusions 3833 protruding from the upper surface of the bracket body 383 , and the six bracket protrusions 3833 are distributed around the upper surface of the bracket body 383 .

[0070] In some embodiments, a copper oxide layer 3846 is attached to the bottom surface 3845 of the metal insert 384, thereby reducing the light reflectivity of the bottom surface 3845 of the metal insert 384. In this embodiment, the filter element 37 is fixed to the bottom surface 3845 of the extension 3841 via an adhesive medium 36, which is applied between the copper oxide layer 3846 attached to the bottom surface 3845 and the front surface of the filter element 37.

[0071] According to a second aspect of the present application, a method for manufacturing a filter element holder 38 is provided, comprising:

[0072] Step S10: After the pre-prepared metal insert 384 is placed in the mold, molten resin is injected into the mold. The resin combines with a portion of the metal insert 384 and solidifies to form a bracket body 383, thereby obtaining the filter element bracket 38. Part of the surface of the metal insert 384 is covered by the bracket body 383.

[0073] In step S20 , a copper oxide layer 3846 is attached to the surface to be blackened of the metal insert 384 through a copper blackening process, wherein the surface to be blackened is a portion of the surface of the metal insert 384 that is not wrapped by the bracket body 383 .

[0074] In one embodiment of the present application, the surface to be blackened includes the insert inner side surface 3844 of the metal insert 384 .

[0075] In another embodiment of the present application, the surface to be blackened includes the insert upper surface 3843 of the metal insert 384 .

[0076] In yet another embodiment of the present application, the surface to be blackened includes the insert bottom surface 3845 of the metal insert 384 .

[0077] According to the different process flows of the high temperature solution and the normal temperature solution in the copper blackening process, further, in one embodiment, the step S20 includes:

[0078] Step S201, copper plating the surface of the metal insert 384 to be blackened;

[0079] Step S202, activating the surface to be blackened by a sulfuric acid solution;

[0080] Step S203, soaking the surface to be blackened in a sodium hydroxide solution;

[0081] Step S204, soaking the surface to be blackened in a neutral solution to form a copper oxide layer 3846 on the surface to be blackened;

[0082] Step S205 , baking the filter element bracket 38 .

[0083] The normal temperature mentioned in this application refers to the ambient temperature of workshop production, which is usually between 15-30°C.

[0084] In one embodiment of the present application, in step S202, the mass fraction of the sulfuric acid solution is less than or equal to 5%, the time for the sulfuric acid solution to activate the surface to be blackened at room temperature is 15-30 seconds, and the surface to be blackened is cleaned by the sulfuric acid solution to remove the oxide of the copper plated layer.

[0085] In one embodiment of the present application, in step S203, the pH value (hydrogen ion concentration index) of the sodium hydroxide solution is between 13 and 13.5, and the sodium hydroxide solution is immersed in the blackened surface at 85°C for 3-5 minutes to neutralize the pH value of the blackened surface.

[0086] In one embodiment of the present application, in step S204, the neutral solution is immersed at room temperature for 3 minutes to deposit a copper oxide layer 3846 on the blackened surface by chemical deposition. The neutral solution includes water, nickel sulfate, boric acid, lemonade, ammonia water, copper sulfate, sodium sulfosuccinate diester, sodium phosphate diester, tin nitrate, sulfuric acid, nickel ammonia, nickel sulfate, hydrochloric acid, and the like.

[0087] In one embodiment of the present application, in step S205 , the filter element holder 38 is baked at a temperature of 85-90° C. for 20 minutes.

[0088] Steps S201-S205 provide a copper blackening process in which some steps are performed in a high-temperature environment. The high-temperature environment can accelerate the formation of the copper oxide layer 3846 and improve production efficiency. However, the high temperature will also cause the metal insert 384 in the filter element bracket 38 to deform. In particular, the copper plating on the metal insert 384 reacts with the sulfuric acid solution to generate high temperature, thereby causing unnecessary bending of the filter element bracket 38, affecting the installation of the filter element 37 and its installation position.

[0089] Therefore, a normal temperature solution is further provided. In one embodiment of the present application, step S20 includes:

[0090] Step S211, washing the surface of the metal insert 384 to be blackened with water to remove oil stains on the surface to be blackened;

[0091] Step S212, copper plating the surface of the metal insert 384 to be blackened at room temperature;

[0092] Step S213, activating the surface to be blackened at room temperature to remove oxides from the copper-plated layer on the surface to be blackened;

[0093] Step S214, soaking the surface to be blackened in a neutral solution at room temperature to form a copper oxide layer 3846 on the surface to be blackened;

[0094] Step S215 , baking the filter element bracket 38 at a low temperature.

[0095] In one embodiment of the present application, in step S214, the neutral solution includes water, nickel sulfate, boric acid, lemonade, ammonia water, copper sulfate, sodium succinate diester sulfonate, sodium phosphate diester, tin nitrate, sulfuric acid, nickel ammoniate, nickel sulfate, hydrochloric acid and other substances.

[0096] In one embodiment of the present application, in step S215 , the filter element holder 38 is baked at a temperature of 30° C. for a time of 30-40 minutes.

[0097] The aforementioned manufacturing method for the filter element holder 38 deposits a copper oxide layer 3846 on the exposed portion of the metal insert 384 of the filter element holder 38, thereby reducing the light reflectivity of this portion. However, due to the characteristics of the copper blackening process, the copper oxide layer 3846 on the surface of the metal insert 384 is easily damaged. Therefore, the metal insert 384 is first embedded in the holder body 383 through an insert molding process to form the filter element holder 38. The filter element holder 38 is then treated with the copper blackening process to remove the copper oxide layer 3846 from the surface of the metal insert 384 enclosed by the holder body 383.

[0098] In one embodiment of the present application, the camera module further includes dust-catching glue, which can be bonded to the filter element bracket 38 to capture free dust, debris and other dirt, thereby improving the imaging quality of the camera module.

[0099] Figure 1 In one embodiment of the present application shown, the driving assembly 20 is directly fixed to the circuit board body 311, and the optical lens 10 is fixed to the driving assembly 20. In other embodiments of the present application, the driving assembly 20 may also be fixed to the photosensitive assembly 30 and thus indirectly fixed to the circuit board 31, such as Figure 6Alternatively, the camera module has no driving assembly 20, the optical lens 10 is directly fixed to the photosensitive assembly 30 and thus indirectly fixed to the circuit board 31, as shown Figure 7 As shown, the present application is not limited thereto.

[0100] In this application, Figures 1 to 7 An embodiment is shown in which the filter element 37 is attached upside down to the bottom surface of the metal insert 384. In other embodiments of the present application, the filter element 37 may also be attached upright to the front surface of the metal insert 384. The purpose of providing a copper oxide layer 3846 on the exposed portion of the metal insert 384 using a copper blackening process is to reduce the light reflectivity of the metal insert 384 of the filter element holder 38. After the copper oxide layer 3846 is formed on the filter element holder 38, the filter element 37 is fixed to the filter element holder 38. Whether the filter element 37 is attached upright or upside down does not affect the setting of the copper blackening process.

[0101] The above describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the foregoing embodiments. The foregoing embodiments and description merely illustrate the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A filter element holder, characterized in that: include: A bracket body, wherein the bracket body is provided with a first through hole; A metal insert, wherein the metal insert is partially embedded in the bracket body, and the metal insert is provided with a second through hole, a protruding portion, an embedded portion and a copper oxide layer. The second through hole and the first through hole are arranged in communication on the photosensitive path of the photosensitive component, and the protruding portion extends from the embedded portion in an integral manner toward the second through hole. The embedded portion is embedded in the bracket body, and the copper oxide layer is attached to the outer surface of the protruding portion. The protruding portion is capable of fixing the filter element, wherein the protruding portion is provided with an insert upper surface, an insert inner side surface and an insert bottom surface, the insert inner side surface connects the insert upper surface and the insert bottom surface, and the insert inner side surface encloses the second through hole. The optical filter element is adhesively fixed to the upper surface of the insert or the bottom surface of the insert, and the inner side surface of the insert is provided with an oblique inner side surface and a vertical inner side surface, and the oblique inner side surface is obliquely connected to the vertical inner side surface and the upper surface of the insert, so that the inner diameter of the second through hole gradually decreases from top to bottom along the optical axis direction, wherein the bracket body further includes at least two bracket protrusions, and the bracket protrusions protrude outward from the upper surface of the bracket body at intervals, and the bracket protrusions are adjacent to the copper oxide layer at the protruding portion, so that the bracket protrusions are higher than the copper oxide layer.

2. The filter element holder according to claim 1, characterized in that: The bracket body includes a supporting portion and an extending portion, wherein the extending portion integrally extends inward from the supporting portion toward the first through hole, the supporting portion is fixed to the circuit board, and the embedded portion of the metal insert is embedded in the extending portion, so that the metal insert is fixed on the extending portion.

3. The filter element holder according to claim 2, wherein: The inner diameter of the second through hole is smaller than that of the first through hole. The extension of the metal insert extends inward from the extension of the bracket body, so that the filter element is bonded to the upper surface or bottom surface of the insert of the extension.

4. The filter element holder according to claim 1, wherein: The height of the bracket protrusion is not less than 10 μm.

5. The filter element holder according to any one of claims 1 to 4, characterized in that: The bracket body is made of resin, the metal insert is made of metal, and the thickness of the copper oxide layer is no more than 10 μm, thereby reducing the stray light reflectivity.

6. A camera module, characterized in that: include: Optical lens; A photosensitive component, wherein the optical lens is located in the photosensitive path of the photosensitive component, and the photosensitive component includes a circuit board, a photosensitive chip, an electronic component, a filter element, and a filter element bracket as described in any one of claims 1 to 5, wherein the photosensitive chip and the electronic component are electrically connected to the circuit board, and the filter element is fixed to the filter element bracket and is arranged between the optical lens and the photosensitive chip.

7. A process for preparing a filter element holder according to any one of claims 1 to 5, characterized in that: Including steps: S10: loading a pre-prepared metal insert into the molding die, and injecting molten resin into the molding die so that the metal insert is partially embedded in the bracket body formed by solidifying the resin; S20: attaching a copper oxide layer to the surface to be blackened of the metal insert through a copper blackening process, wherein the surface to be blackened is the inner side surface, the upper surface and / or the bottom surface of the metal insert.

8. The process for preparing the filter element holder according to claim 7, wherein: The step S20 includes the following steps: S201 copper plating on the surface of the metal insert to be blackened; S202 activates the surface of the metal insert to be blackened by a sulfuric acid solution; S203 soaking the activated surface to be blackened in a sodium hydroxide solution; S204: soaking the surface to be blackened in a neutral solution, and depositing a copper oxide layer on the surface to be blackened by chemical deposition; S205 high or low temperature baking filter element holder.

9. The process for preparing the filter element holder according to claim 8, characterized in that: The step S202 specifically includes the steps of: activating the surface to be blackened with the sulfuric acid solution for 15-30 seconds at room temperature, and cleaning the surface to be blackened with the sulfuric acid solution to remove the oxide of the copper plating layer on the surface to be blackened, wherein the mass fraction of the sulfuric acid solution is not greater than 5%.

10. The process for preparing the filter element holder according to claim 8, wherein: The step S203 specifically includes the steps of soaking the activated surface to be blackened in the sodium hydroxide solution at 85° C. for 3-5 minutes to neutralize the pH value of the surface to be blackened, wherein the pH value of the sodium hydroxide solution is 13-13.

5.

11. The process for preparing the filter element holder according to claim 8, wherein: The step S204 specifically includes the steps of: soaking in a neutral solution at room temperature for 3 minutes, and depositing a copper oxide layer on the surface to be blackened by chemical deposition, wherein the neutral solution is selected from one or more of water, nickel sulfate, boric acid, lemonade, ammonia water, copper sulfate, sodium succinate diester sulfonate, sodium phosphate diester, tin nitrate, sulfuric acid, nickel ammonia, and nickel sulfate.

12. The process for preparing the filter element holder according to claim 8, wherein: The step S205 specifically includes the steps of: baking the filter element holder at a high temperature of 85-90° C. for 20 minutes; or baking the filter element holder at 30° C. for 30-40 minutes.

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