Ion trap system with vacuum chip replacement

Abstract

The present invention discloses an ion trap system capable of vacuum chip replacement, comprising: a vacuum module and a replacement module, the replacement module being connected to the vacuum module, a vacuum chamber being formed in the vacuum module, a chip replacement chamber being formed in the replacement module, the chip replacement chamber being connected to the vacuum chamber, and the replacement module being provided with a vacuum port connected to the chip replacement chamber; a first valve plate, the first valve plate being movably mounted at the connection between the replacement module and the vacuum module, and the first valve plate being used to selectively isolate the chip replacement chamber from the vacuum chamber. According to an embodiment of the present invention, the ion trap system capable of vacuum chip replacement can ensure uniformity of vacuum degree between the two by providing a vacuum chamber and a chip replacement chamber that can be connected to each other, and at the same time, the vacuum chamber and the chip replacement chamber can be blocked by the first valve plate, thereby protecting the vacuum environment of the vacuum chamber. Thus, it can be ensured that the vacuum environment of the vacuum chamber will not be damaged or contaminated during the replacement process, thereby reducing costs and improving work efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of ion trap chip manufacturing, and more particularly to an ion trap system capable of replacing chips in vacuum. Background Art

[0002] The trap chip is the core component of an ion trap quantum computing device, which can confine charged ions in a limited space through electromagnetic fields, thereby realizing the manipulation and readout of qubits. Among them, the stable trapping of ions is the basic condition for realizing quantum computing. Therefore, in order to successfully capture, stably trap, and conveniently manipulate these ions, an ultra-high vacuum environment (reaching the UHV level) needs to be provided for the trap chip.

[0003] In addition, after the trap chip is processed, it needs to be installed in the ion trap system for testing. In the prior art, after the trap chip is installed, it takes 10 - 15 days of vacuum pumping operation to make the vacuum degree of the ion trap system reach the expected requirement. Moreover, when replacing the trap chip, the vacuum degree of the ion trap system will be damaged, resulting in a long cycle of vacuum pumping operation when realizing the ultra-high vacuum environment again. At the same time, various impurities in the external environment will seriously contaminate the ion trap system, making the cleaning and impurity removal of the ion trap system also require a long operation cycle and a huge workload. Therefore, there is room for improvement. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. For this purpose, an object of the present invention is to provide an ion trap system capable of replacing chips in vacuum, which is used to solve the problem that the vacuum environment will be damaged when replacing chips, while improving the replacement efficiency and reducing the cost.

[0005] The ion trap system capable of replacing chips in vacuum according to an embodiment of the present invention includes: a vacuum module and a replacement module. The replacement module is connected to the vacuum module. A vacuum chamber is formed in the vacuum module, and a chip replacement chamber is formed in the replacement module. The chip replacement chamber is communicated with the vacuum chamber. The replacement module is provided with a vacuum pumping port communicated with the chip replacement chamber; a first valve plate, which is movably installed at the connection between the replacement module and the vacuum module, and the first valve plate is used to selectively block the communication between the chip replacement chamber and the vacuum chamber.

[0006] The ion trap system capable of replacing chips in vacuum according to an embodiment of the present invention can ensure the unity of the vacuum degree between the two by setting a vacuum chamber and a chip replacement chamber that can communicate with each other. At the same time, the vacuum chamber and the chip replacement chamber can be blocked by the first valve plate, which plays a role in protecting the vacuum environment of the vacuum chamber. Thus, it can ensure that the vacuum environment of the vacuum chamber will not be damaged or contaminated during the replacement process, avoiding the time and labor costs spent on subsequent maintenance of the environment in the vacuum chamber and improving the work efficiency.

[0007] For an ion trap system capable of vacuum chip replacement according to an embodiment of the present invention, a first movable seat is provided at the connection between the replacement module and the vacuum module. The first movable seat is provided with a first movable port communicating with the chip replacement chamber and the vacuum chamber. The first valve plate is movably installed at the first movable port and is adapted to selectively extend to the connection between the chip replacement chamber and the vacuum chamber.

[0008] For an ion trap system capable of vacuum chip replacement according to an embodiment of the present invention, it further includes: a grasping mechanism. The grasping mechanism is arranged in the replacement module, and the grasping mechanism is provided with a movable clamping part. The clamping part is used for clamping the chip mounting structure to move between the chip replacement chamber and the vacuum chamber.

[0009] For an ion trap system capable of vacuum chip replacement according to an embodiment of the present invention, the grasping mechanism further includes a transmission rod, a vacuum housing, and a rod driving member. The clamping part is connected to one end of the transmission rod. The rod driving member is connected to the other end of the transmission rod and is used for driving the transmission rod to extend and retract. The vacuum housing is connected to the rod driving member. The replacement module is provided with a mounting port spaced apart from the replacement port. The transmission rod passes through the mounting port, and the vacuum housing is sleeved outside the transmission rod and is in sealing cooperation with the inner peripheral wall of the mounting port.

[0010] For an ion trap system capable of vacuum chip replacement according to an embodiment of the present invention, the mounting port, the chip replacement chamber, and the vacuum chamber are sequentially communicated along the telescopic direction of the transmission rod.

[0011] For an ion trap system capable of vacuum chip replacement according to an embodiment of the present invention, the replacement module is provided with a replacement port. A second valve plate is movably installed at the replacement port and is used for selectively closing the replacement port.

[0012] For an ion trap system capable of vacuum chip replacement according to an embodiment of the present invention, the opening direction of the mounting port is perpendicular to the opening direction of the replacement port.

[0013] For an ion trap system capable of vacuum chip replacement according to an embodiment of the present invention, a mounting seat is arranged in the vacuum chamber. The mounting seat is used for plugging and unplugging connection with the chip mounting structure, and the plugging and unplugging direction is towards the chip replacement chamber.

[0014] For an ion trap system capable of vacuum chip replacement according to an embodiment of the present invention, the chip mounting structure includes a circuit board, and the substrate material of the circuit board is a silicon-based material or a ceramic material.

[0015] According to the ion trap system with vacuum chip replacement according to an embodiment of the present invention, the first valve plate is configured to communicate the chip replacement cavity with the vacuum cavity when the vacuum degree in the chip replacement cavity exceeds a set vacuum degree, and the set vacuum degree is 10 -6 mBar.

[0016] Additional aspects and advantages of the present invention will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and / or additional aspects and advantages of the present invention will become apparent and be readily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0018] Figure 1 is a schematic structural diagram of an ion trap system with vacuum chip replacement according to an embodiment of the present invention;

[0019] Figure 2 is a side view of an ion trap system with vacuum chip replacement according to an embodiment of the present invention;

[0020] Figure 3 is a top view of an ion trap system with vacuum chip replacement according to an embodiment of the present invention;

[0021] Figure 4 is an effect diagram when the grasping mechanism grasps the chip mounting structure according to an embodiment of the present invention;

[0022] Figure 5 is an effect diagram when another grasping mechanism grasps the chip mounting structure according to an embodiment of the present invention;

[0023] Figure 6 is a schematic structural diagram of a mounting seat according to an embodiment of the present invention;

[0024] Figure 7 is a schematic structural diagram of the upper seat body in the mounting seat according to an embodiment of the present invention;

[0025] Figure 8 is a schematic structural diagram of the lower seat body in the mounting seat according to an embodiment of the present invention;

[0026] Figure 9 is an effect diagram when the chip mounting structure is mounted on the mounting seat according to an embodiment of the present invention;

[0027] Figure 10 is an effect diagram when the chip mounting structure is inserted into the electrical connection slot according to an embodiment of the present invention;

[0028] Figure 11 is a schematic structural diagram of the chip mounting structure according to an embodiment of the present invention;

[0029] Figure 12 It is an effect diagram of a positioning sleeve according to an embodiment of the present invention sleeved on a chip mounting structure;

[0030] Figure 13 It is a flowchart of the first method for replacing a chip in an ion trap system capable of vacuum chip replacement according to an embodiment of the present invention;

[0031] Figure 14 It is a flowchart of the second method for replacing a chip in an ion trap system capable of vacuum chip replacement according to an embodiment of the present invention;

[0032] Figure 15 It is a flowchart of the third method for replacing a chip in an ion trap system capable of vacuum chip replacement according to an embodiment of the present invention.

[0033] Reference numerals:

[0034] Ion trap system 100 capable of vacuum chip replacement,

[0035] Vacuum module 1, vacuum chamber 11,

[0036] Replacement module 2, chip replacement chamber 21, installation port 22, replacement port 23, positioning sleeve 231, movable tube cavity 2311, limiting portion 2312, positioning groove 2313, support groove 2314,

[0037] First movable seat 3, first valve plate 31, first movable port 32, first operation knob 33,

[0038] Grasping mechanism 4, clamping portion 41, fixing plate 411, movable plate 412, clamping protrusion 4121, transmission rod 42, rotating shaft 421, vacuum housing 43, rod driving member 44,

[0039] Mounting seat 5, upper seat body 51, limiting protrusion 511, lower seat body 52, limiting groove 521, sliding slot 522, electrical contact piece 523, electrical connection slot 524, bottom support groove 525, power connection notch 53,

[0040] Second movable seat 6, second valve plate 61, second movable port 62, second operation knob 63,

[0041] Chip mounting structure 200, circuit board 201, gold fingers 2011, RF plating layer 2012, DC plating layer 2013,

[0042] Chip bracket 202, bracket feet 2021, bracket base 203, base hollow portion 2031, base feet 2032. Detailed implementation manners

[0043] Embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where like or similar reference numerals denote like or similar elements or elements having like or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention and should not be construed as limiting the present invention.

[0044] Unless otherwise specified, the front-back direction in this application is the longitudinal direction of the ion trap system 100 capable of vacuum chip replacement, i.e., the X direction; the left-right direction is the transverse direction of the ion trap system 100 capable of vacuum chip replacement, i.e., the Y direction; and the up-down direction is the vertical direction of the ion trap system 100 capable of vacuum chip replacement, i.e., the Z direction.

[0045] The following refers to Figures 1 - 15 Describe an ion trap system 100 capable of vacuum chip replacement according to an embodiment of the present invention, including: a vacuum module 1, a replacement module 2, and a first valve plate 31. It should be noted that, as Figure 1 shown, a vacuum chamber 11 is formed inside the vacuum module 1, that is, the vacuum module 1 is configured as an annular structure with an ultra-high vacuum chamber 11, so that the inside of the vacuum module 1 can reach a vacuum environment of UHV level, thereby ensuring that the ultra-high vacuum chamber 11 formed by the vacuum module 1 can provide an ultra-high vacuum environment for the chip, and further ensuring that the chip can work smoothly when installed in the vacuum module 1, realizing qubit manipulation and readout.

[0046] In addition, a chip replacement chamber 21 is formed inside the replacement module 2, and the replacement module 2 is configured as a triangular valve-like structure with the chip replacement chamber 21. Among them, the inside of the chip replacement chamber 21 can reach a high vacuum environment. In actual work, because a high vacuum environment can be provided inside the chip replacement chamber 21, the removed chip and the chip to be installed can be stored and replaced inside the replacement module 2. Among them, the replacement module 2 is provided with a vacuum pumping port communicating with the chip replacement chamber 21, and both the removed chip and the chip to be installed can pass through the vacuum pumping port, thereby realizing the replacement task.

[0047] That is to say, in actual installation, the replacement module 2 is connected to the vacuum module 1, so that the vacuum pumping port is located between the replacement module 2 and the vacuum module 1, and the vacuum chamber 11 and the chip replacement chamber 21 can be communicated through the vacuum pumping port. Thus, during the chip replacement process, it can be ensured that the environment of the vacuum chamber 11 is not significantly contaminated, avoiding affecting the normal operation of the chip.

[0048] Moreover, the first valve plate 31 is configured as a square plate structure. In actual installation, the first valve plate 31 is installed at the connection between the replacement module 2 and the vacuum module 1, so that the first valve plate 31 can be used to selectively isolate the chip replacement chamber 21 from the vacuum chamber 11, thereby ensuring that the vacuum chamber 11 is always in an ultra-high vacuum environment and preventing the vacuum environment of the chip replacement chamber 21 from affecting the vacuum environment of the vacuum chamber 11, thus playing a blocking role. At the same time, the first valve plate 31 is configured as a controllable valve plate, and the lifting and lowering of the first valve plate 31 can be controlled in real time according to experimental requirements, which is conducive to the operation of replacing the chip, improves the installation efficiency, and reduces the workload.

[0049] According to the ion trap system 100 capable of vacuum chip replacement of the embodiment of the present invention, by providing a vacuum chamber 11 and a chip replacement chamber 21 that can communicate with each other, the unity of the vacuum degree between the two can be ensured. At the same time, the vacuum chamber 11 and the chip replacement chamber 21 can be blocked by the first valve plate 31, which plays a role in protecting the vacuum environment of the vacuum chamber 11. Thus, it can be ensured that the vacuum environment of the vacuum chamber 11 will not be damaged or polluted during the replacement process, avoiding the time and labor costs for subsequent maintenance of the environment in the vacuum chamber 11 and improving work efficiency.

[0050] In some embodiments, a first movable seat 3 is provided at the connection between the replacement module 2 and the vacuum module 1. The first movable seat 3 is provided with a first movable port 32 communicating with the chip replacement chamber 21 and the vacuum chamber 11. The first valve plate 31 is movably installed at the first movable port 32 and is adapted to selectively extend to the communication part between the chip replacement chamber 21 and the vacuum chamber 11. It should be noted that, as Figure 2 shown, the first movable port 32 is configured as a circular through hole, and the first valve plate 31 is connected to the first movable port 32 to form the first movable seat 3. Among them, during the process of selectively communicating the vacuum chamber 11 and the chip replacement chamber 21, the first valve plate 31 can ensure that the first movable port 32 is always in a sealed state, thereby ensuring that the vacuum environments of the vacuum chamber 11 and the chip replacement chamber 21 are not polluted and damaged by the external environment. At the same time, the width of the first valve plate 31 is greater than the diameter of the first movable port 32, so as to ensure that the first valve plate 31 can achieve an absolute sealing effect when blocking the first movable port 32.

[0051] In some embodiments, the first movable seat 3 is provided with a first operation knob 33. The first operation knob 33 is located outside the first movable seat 3 and is connected to the first valve plate 31. The first operation knob 33 is adapted to drive the first valve plate 31 to lift relative to the first movable port 32 during rotation. It should be noted that, as Figure 3As shown, the first operating knob 33 is arranged on the top of the first valve plate 31, and the first operating knob 33 is threadedly connected to the first valve plate 31, so that the first operating knob 33 can push or pull the first valve plate 31 to rise and fall during the twisting process, thereby achieving the purpose of opening or closing the first movable port 32.

[0052] That is, the first valve plate 31 can be unblocked or blocked by rotating the first operating knob 33. For example, in this embodiment, when the first operating knob 33 is rotated clockwise, the first valve plate 31 begins to descend. By continuing to rotate the first operating knob 33, the bottom of the first valve plate 31 is lower than the lowest end of the first movable port 32, thereby blocking the vacuum chamber 11 and the chip replacement chamber 21. When the first operating knob 33 is rotated counterclockwise, the first valve plate 31 begins to rise. By continuing to rotate the first operating knob 33, the bottom of the first valve plate 31 is higher than the highest end of the first movable port 32, thereby unblocking the vacuum chamber 11 and the chip replacement chamber 21.

[0053] In some embodiments, the ion trap system 100 capable of vacuum chip replacement further includes: a gripping mechanism 4, which is arranged on the replacement module 2, and the gripping mechanism 4 is provided with a movable clamping portion 41, which is used to clamp the chip mounting structure 200 and move between the chip replacement chamber 21 and the vacuum chamber 11.

[0054] It should be noted that the gripping mechanism 4 is constructed as a rod and is mounted on the side of the replacement module 2 facing away from the vacuum module 1. The gripping mechanism 4 can be detachably mounted on the replacement module 2. In other words, after the gripping mechanism 4 is removed from the replacement module 2, the chip to be installed can be replaced with the removed chip, and then the gripping mechanism 4 can be reinstalled on the replacement module 2 to carry out the next operation.

[0055] Among them, the grasping mechanism 4 is provided with a movable clamping part 41, which is used to clamp the chip mounting structure 200 and move it between the chip replacement chamber 21 and the vacuum chamber 11, so that the chip mounting structure 200 can be removed from or installed in the vacuum chamber 11, thereby completing the chip replacement process.

[0056] In some embodiments, the grasping mechanism 4 also includes a transmission rod 42, a vacuum shell 43 and a rod driving member 44. The clamping portion 41 is connected to one end of the transmission rod 42, and the rod driving member 44 is connected to the other end of the transmission rod 42 and is used to drive the transmission rod 42 to axially extend and retract. The axial direction of the transmission rod 42 is parallel to the plug-in and disassembly direction of the chip mounting structure 200, and the vacuum shell 43 is connected to the rod driving member 44.

[0057] It can be understood that the transmission rod 42 is used to control the clamping portion 41 so that the clamping portion 41 can perform axial telescopic movement simultaneously with the transmission rod 42. The vacuum housing 43 is used to provide a protective effect. A power element is provided in the rod drive 44, which can provide a driving force to the transmission rod 42 to control the transmission rod 42 to perform axial telescopic movement.

[0058] Specifically, the clamping portion 41 can be connected to one end of the transmission rod 42, the rod drive 44 is connected to the other end of the transmission rod 42, and the vacuum housing 43 is connected to the rod drive 44. The vacuum housing 43 is sleeved outside the transmission rod 42 and is used for sealing cooperation with the replacement module 2.

[0059] Thus, after connecting the grasping mechanism 4 to the replacement module 2, the rod drive 44 drives the transmission rod 42 to perform telescopic movement at the same time, so that the clamping portion 41 at the end of the transmission rod 42 contacts and clamps the chip mounting structure 200 in the vacuum chamber 11, and then the rod drive 44 drives the transmission rod 42 to reset, so as to complete the purpose of disassembling the chip mounting structure 200 in the vacuum chamber 11. Subsequently, after replacing the chip on the chip mounting structure 200, the rod drive 44 is used to drive the transmission rod 42 to perform telescopic movement, so that the clamping portion 41 can grasp the chip mounting structure 200 and move in the vacuum chamber 11, and then the chip mounting structure 200 can be installed in the vacuum chamber 11.

[0060] In addition, the replacement module 2 is provided with an installation opening 22 at one end facing away from the vacuum module 1, and the transmission rod 42 passes through the installation opening 22. It should be noted that, as Figure 3 shown, the installation opening 22 is circular and the radius of the installation opening 22 is greater than the radius of the transmission rod 42, which can ensure that the transmission rod 42 can pass through the installation opening 22 smoothly to achieve the grasping work.

[0061] Among them, the vacuum housing 43 is sleeved outside the transmission rod 42 and is in sealing cooperation with the inner peripheral wall of the installation opening 22. It can be understood that the replacement module 2 is provided with a radial flange on the outer peripheral wall of the installation opening 22, and the end of the vacuum housing 43 abutting against the installation opening 22 is also provided with a radial flange, so that the radial flanges of the replacement module 2 and the vacuum housing 43 can abut against each other to strengthen the sealing effect at the installation opening 22, and further ensure that the vacuum environment in the chip replacement chamber 21 inside the replacement module 2 is not damaged or polluted.

[0062] In some embodiments, the installation opening 22, the chip replacement chamber 21 and the vacuum chamber 11 are sequentially communicated along the telescopic direction of the transmission rod 42. That is to say, as Figure 2As shown, the installation port 22, the chip replacement chamber 21, and the vacuum chamber 11 are sequentially arranged in the same direction, and are all consistent with the telescopic direction of the transmission rod 42. At the same time, the position of the installation port 22 is set to face the positions of the chip replacement chamber 21 and the vacuum chamber 11 at the connection, so as to ensure that the transmission rod 42 can freely extend and retract back and forth between the vacuum chamber 11 and the chip replacement chamber 21.

[0063] Among them, the position of the first movable port 32 is also aligned with the position of the installation port 22, so as to ensure that the transmission rod 42 can extend from the installation port 22 to the first movable port 32. At the same time, the diameter of the first movable port 32 is also larger than the end diameter of the transmission rod 42 and the radial dimension of the chip mounting structure 200, which can ensure that the chip mounting structure 200 can smoothly move from the vacuum chamber 11 to the chip replacement chamber 21.

[0064] In some embodiments, the clamping portion 41 includes a fixed plate 411 and a movable plate 412. The fixed plate 411 is fixedly connected to the end of the transmission rod 42. It should be noted that, as Figure 4 shown, both the fixed plate 411 and the movable plate 412 are configured as strip-shaped plates and are both arranged at the end of the transmission rod 42. Among them, the height of the fixed plate 411 on the end of the transmission rod 42 is lower than the height of the chip mounting structure 200 on the vacuum chamber 11. That is to say, the top surface of the fixed plate 411 can abut against the bottom surface of the chip mounting structure 200, so that when the telescopic rod performs telescopic movement, it can avoid the problem that the fixed plate 411 of the clamping portion 41 collides with the chip and causes the clamping portion 41 to be unable to grasp the chip mounting structure 200.

[0065] In addition, the movable plate 412 is rotatably connected to the fixed plate 411 and is adapted to rotate in a direction close to or away from the fixed plate 411, and a clamping protrusion 4121 is provided on the side of the movable plate 412 facing the fixed plate 411. That is to say, both the movable plate 412 and the fixed plate 411 are plate-like structures protruding from the end of the transmission rod 42, and the movable plate 412 can rotate around the connection point, so that the movable plate 412 can clamp the chip mounting structure 200 during rotation. At the same time, the end of the clamping protrusion 4121 is designed with a barb, so that the pressure generated when the clamping protrusion 4121 abuts against the chip mounting structure 200 is relatively large, that is, the clamping force exerted by the clamping protrusion 4121 on the chip mounting structure 200 is increased, so as to ensure that the chip mounting structure 200 is not easily detached during the clamping process and ensure the stability of the movement process.

[0066] In other embodiments, there are multiple clamping portions 41, and the multiple clamping portions 41 are rotatably connected to the transmission rod 42, and any one of the multiple clamping portions 41 can be rotated to the installation position facing the chip mounting structure 200. It should be noted that, as Figure 5As shown, multiple clamping portions 41 are rotatably connected to one end of a transmission rod 42 about a rotation axis. The transmission rod 42 is used to control the clamping portions 41 so that the clamping portions 41 can simultaneously extend and retract along with the transmission rod 42. A rotation shaft 421 is provided at one end of the transmission rod 42, which is rotatably connected to the transmission rod 42. Multiple clamping portions 41 are fixedly connected to the end surface of the rotation shaft 421. As the rotation shaft 421 rotates relative to the transmission rod 42, the clamping portions 41 on the rotation shaft 421 can also rotate relative to the transmission rod 42, thereby allowing the chip mounting structure 200 clamped by the clamping portions 41 to rotate relative to the transmission rod 42.

[0067] Therefore, under the driving action of the transmission rod 42, the chip mounting structure 200 can perform telescopic movement and rotational movement in the chip replacement chamber 21 and the vacuum chamber 11, and the chip mounting structure 200 can be installed and removed by using the telescopic movement, and the chip mounting structure 200 can be replaced by using the rotational movement, thereby realizing the process of replacing the chip.

[0068] That is to say, when the transmission rod 42 drives the clamping part 41 to complete the disassembly of the chip mounting structure 200 in the vacuum chamber 11, the transmission rod 42 resets the clamping part 41 to the chip replacement chamber 21. At this time, the rotating shaft 421 rotates, so that the disassembled chip mounting structure 200 is separated from the installation track, and the chip mounting structure 200 to be installed is rotated to the installation track. Then the rod driving part 44 drives the transmission rod 42 to extend, so that the chip mounting structure 200 to be installed on the clamping part 41 reaches the installation position on the vacuum chamber 11 and is installed and matched. Then the clamping part 41 releases the chip mounting structure 200, and the rod driving part 44 drives the transmission rod 42 to retract into the chip replacement chamber 21, thereby completing the entire replacement process.

[0069] In other embodiments, a plurality of clamping portions 41 are arranged around the rotation axis and are evenly spaced apart in the circumferential direction of the rotation axis. Figure 5 As shown, the plurality of clamping portions 41 are circumferentially distributed around the axis of the rotating shaft 421, and the central angle between any two adjacent clamping portions 41 is the same, thereby ensuring that the distance between any two adjacent clamping portions 41 is the same. Furthermore, all clamping portions 41 on the rotating shaft 421 are fixedly connected to the rotating shaft 421, so that when the rotating shaft 421 rotates, all clamping portions 41 move simultaneously.

[0070] Thus, when the disassembled chip mounting structure 200 rotates at any angle, the angle of rotation of the adjacent clamping portion 41 will be the same. When the adjacent clamping portion 41 carrying the chip mounting structure 200 to be installed rotates to the direction same as the telescopic direction of the transmission rod 42, the rotation stops, that is, the rotary shaft 421 rotates by the angle between two adjacent clamping portions 41. At this time, pushing the transmission rod 42 again can complete the installation of the chip mounting structure 200.

[0071] It can be understood that when four clamping portions 41 are provided on the rotary shaft 421, the angles between two adjacent clamping portions 41 are the same, which is 90 degrees. Thus, when rotating to replace the chip mounting structure 200, the rotary shaft 421 only needs to rotate 90 degrees. Or, if five clamping portions 41 are provided on the rotary shaft 421, the angle between two adjacent clamping portions 41 is 72 degrees, and it only needs to rotate 72 degrees when replacing. Or, if six clamping portions 41 are provided on the rotary shaft 421, the angle between two adjacent clamping portions 41 is 60 degrees, and it only needs to rotate 60 degrees when replacing. Or, more clamping portions 41 can also be provided. Thus, the specific number of the clamping portions 41 can be set according to actual needs, and this embodiment does not limit this.

[0072] It can be understood that evenly circumferentially distributing the clamping portions 41 is beneficial to reducing the error tolerance rate when the rotary shaft 421 rotates at an angle. That is, the same angle can be set to save the time for manual debugging of the angle, and it is also beneficial to count the number of remaining chip mounting structures to be installed in the chip replacement cavity 21 according to the degree of rotation angle, thereby saving time costs and labor costs.

[0073] In some other embodiments, the clamping portions 41 are distributed in multiple groups, and each group of clamping portions 41 has two, and the two clamping portions 41 are distributed opposite to each other in the radial direction of the rotation axis. That is to say, as Figure 5 shown, each group of clamping portions 41 in this embodiment is symmetrically distributed around the rotary shaft 421. That is, a group of clamping portions 41 includes two clamping portions 41, and the two clamping portions 41 in each group of clamping portions 41 both pass through the axis. In this way, when multiple groups of clamping portions 41 are fixed on the rotary shaft 421, it can be ensured that the angles between two adjacent groups of clamping portions 41 are the same, ensuring that multiple groups of clamping portions 41 are evenly circumferentially distributed, and further ensuring that the angles between two adjacent clamping portions 41 are the same, that is, ensuring that the distances between two adjacent clamping portions 41 are the same.

[0074] In some other embodiments, the fixing plates 411 of the multiple clamping portions 41 are at the same horizontal height. That is to say, as Figure 5As shown, each clamping portion 41 has the same structure, and the rotating shaft 421 is horizontally installed on the end of the transmission rod 42. When all the clamping portions 41 are installed on the rotating shaft 421, the fixed plates 411 in each group of clamping portions 41 are abutted against the end face of the transmission rod 42, thereby ensuring that the fixed plates 411 in each group of clamping portions 41 maintain the same height relative to the transmission rod 42.

[0075] In this way, it can be ensured that when the clamping portion 41 carrying the disassembled chip mounting structure 200 is rotated, the adjacent clamping portion 41 carrying the chip mounting structure 200 to be installed can accurately complete the installation of the chip mounting structure 200 in the vacuum chamber 11 when it is rotated to the installation position, avoiding the problem of height deviation of the clamping portion 41 during rotation, which leads to the problem of installation failure.

[0076] In some embodiments, the replacement module 2 is provided with a replacement port 23. It is understood that Figure 3 As shown, the replacement port 23 is configured as a circular hole, and the diameter of the replacement port 23 is larger than the radial dimension of the chip mounting structure 200. Thus, the removed chip mounting structure 200 can be removed from the replacement module 2 through the replacement port 23, and the chip mounting structure 200 to be installed can be placed into the replacement module 2 through the replacement port 23 to complete the chip replacement process.

[0077] Among them, the second valve plate 61 is movably installed at the replacement port 23 and is used to selectively close the replacement port 23. It should be noted that, if Figure 3 As shown, the second valve plate 61 is constructed as a square plate structure. Figure 3 As shown, the second valve plate 61 is installed on a side of the replacement module 2 that is different from the first valve plate 31, and the second valve plate 61 is used to selectively isolate the chip replacement chamber 21 from the external environment, thereby facilitating adjustment of the vacuum environment of the chip replacement chamber 21, so that the chip replacement chamber 21 can maintain a closed space after the chip is replaced, thereby playing a barrier role and then improving the vacuum environment of the chip replacement chamber 21.

[0078] At the same time, the second valve plate 61 is designed as a controllable valve plate, which can be controlled to rise and fall in real time according to experimental requirements, thereby facilitating the operation of replacing the chip and ensuring the stability of the vacuum environment.

[0079] Specifically, a second movable seat 6 is further provided on the replacement module 2. The second movable seat 6 is provided with a second movable port 62 communicating with the replacement port 23. A second valve plate 61 is arranged on the second movable seat 6, so that the second valve plate 61 can be movably installed at the second movable port 62 and selectively extend to the replacement port 23. It should be noted that the second movable port 62 is configured as a circular through hole, and the second valve plate 61 is connected to the second movable port 62 to form the second movable seat 6. Among them, the second valve plate 61 can ensure that the second movable port 62 is always in a sealed state during the process of selectively communicating the chip replacement cavity 21 and the external environment. At the same time, the width of the second flap is greater than the diameter of the second movable port 62, so as to ensure that the second valve plate 61 can achieve an absolute sealing effect when blocking the second movable port 62.

[0080] In some embodiments, the second movable seat 6 is provided with a second operation knob 63. The second operation knob 63 is located outside the second movable seat 6 and is connected to the second flap. The second operation knob 63 is adapted to drive the second flap to move up and down relative to the second movable port 62 during rotation. It should be noted that, as Figure 3 shown, the second operation knob 63 is arranged on the top of the second valve plate 61, and the second operation knob 63 and the second valve plate 61 are connected by threads, so that the second operation knob 63 can push or pull the second valve plate 61 to move up and down during torsion, so as to achieve the purpose of opening or closing the second movable port 62.

[0081] That is to say, by rotating the second operation knob 63, the second valve plate 61 can be made unobstructed or blocked. In this embodiment, when the second operation knob 63 is rotated clockwise, the second valve plate 61 begins to descend. Continuing to rotate the second operation knob 63, the bottom of the second valve plate 61 is lower than the lowest end of the second movable port 62, so as to block the chip replacement cavity 21 and the external environment. When the second operation knob 63 is rotated counterclockwise, the second valve plate 61 begins to rise. Continuing to rotate the second operation knob 63, the bottom of the second valve plate 61 is higher than the highest end of the second movable port 62, so that the chip replacement cavity 21 and the external environment are communicated.

[0082] In some embodiments, the opening direction of the installation port 22 is perpendicular to the opening direction of the replacement port 23. It should be noted that, as Figure 3 shown, the installation port 22 and the vacuum cavity 11 are horizontal in the same direction, while the replacement port 23 is on one side of the chip replacement cavity 21 to ensure that the chip installation structure 200 can be taken out. Among them, in this embodiment, the replacement port 23 is arranged on the Y - direction side of the chip installation structure 200, so that the installation port 22 and the second movable port 62 are both in the X - direction, so that the replacement port 23 and the installation port 22 are perpendicular to each other.

[0083] It can be understood that setting the replacement port 23 and the installation port 22 at a vertical angle can avoid the problem that the freedom of movement of the grasping mechanism 4 is affected by other structures during operation. At the same time, setting the replacement port 23 and the installation port 22 at a vertical angle makes the distance from the replacement port 23 to the center of the chip replacement cavity 21 shorter, which can save manufacturing costs and is beneficial to operations such as the removal and installation of the chip installation structure 200.

[0084] In some embodiments, a mounting seat 5 is provided in the vacuum chamber 11. The mounting seat 5 is used for plugging and unplugging connection with the chip installation structure 200, and the plugging and unplugging direction is towards the chip replacement cavity 21. That is to say, the mounting seat 5 is installed in the vacuum chamber 11, and the chip installation structure 200 is installed on the mounting seat 5 to carry out normal work. At the same time, the mounting seat 5 is fixed in the vacuum chamber 11 and ensures that the plugging port of the mounting seat 5 is aligned with the chip replacement cavity 21, so that the chip installation structure 200 can be plugged and unplugged with the mounting seat 5, and it is ensured that the process of plugging and unplugging cooperation between the chip installation structure 200 and the mounting seat 5 will not be offset, avoiding situations such as electrical connection failure or unstable connection, which will affect the operation of the chip.

[0085] In some embodiments, the chip installation structure 200 includes a circuit board 201 and a chip bracket 202. The chip bracket 202 is used to carry the chip, and the circuit board 201 is in plugging and unplugging cooperation with the mounting seat 5. It should be noted that, as Figure 9 and Figure 10 shown, the circuit board 201 is configured as a rectangular board, and the chip bracket 202 is fixedly installed at the top of the circuit board 201. Thus, the chip bracket 202 can be driven to move on the mounting seat 5 by the plugging and unplugging cooperation between the circuit board 201 and the mounting seat 5, so as to complete the disassembly or replacement process.

[0086] Moreover, the chip bracket 202 is installed on the circuit board 201. That is to say, as Figure 10 shown, the chip bracket 202 is installed on the circuit board 201, and the chip is installed on the chip bracket 202 by using the carrying function of the chip bracket 202, so that the chip bracket 202 can play a role in supporting and positioning the chip electrodes. Thus, it is convenient for the installation and positioning of the chip electrodes, and thus convenient for the electrical connection between the chip and the circuit board 201.

[0087] In some embodiments, the mounting seat 5 is provided with a sliding slot 522, and the circuit board 201 is in sliding cooperation with the sliding slot 522. It should be noted that, as Figure 8As shown, the width of the sliding slot 522 is the same as the width of the circuit board 201, so that the circuit board 201 can be slidably inserted into the sliding slot 522, thereby achieving the clamping of the circuit board 201 and achieving the purpose of fixing the chip mounting structure 200. In addition, the length of the sliding slot 522 is less than the length of the circuit board 201, so that after the circuit board 201 is slidably engaged with the sliding slot 522, one end of the circuit board 201 can protrude from the sliding slot 522 by a part.

[0088] That is to say, after the circuit board 201 is slidably engaged in the sliding slot 522, the other end of the circuit board 201 can also protrude from the mounting seat 5 by a part. Thus, it can be ensured that the protruding part of the circuit board 201 can be clamped by the clamping part 41, so as to ensure that the clamping part 41 can transmit force to the circuit board 201 to drive the circuit board 201 to move on the sliding slot 522, and then realize the perfect cooperation between the circuit board 201 and the mounting seat 5, and ensure the stable electrical connection between the chip and the circuit board 201.

[0089] In some embodiments, the mounting seat 5 includes an upper seat body 51 and a lower seat body 52, and the upper seat body 51 and the lower seat body 52 are spliced and connected. It should be noted that, as Figure 6 shown, the upper seat body 51 is constructed as a U-shaped plate structure, and the lower seat body 52 is constructed as a plate structure with a groove in the middle area. Among them, the upper seat body 51 is provided with a limiting protrusion 511 facing the direction of the lower seat body 52 at the end, and the lower seat body 52 is provided with a limiting groove 521 at the corresponding position. When the upper seat body 51 and the lower seat body 52 are fitted and installed, the cooperation between the limiting protrusion 511 and the limiting groove 521 can ensure the fixed connection between the upper seat body 51 and the lower seat body 52.

[0090] Among them, the sliding slot 522 is formed at the connection between the upper seat body 51 and the lower seat body 52, that is, the sliding slot 522 is formed beside the connection between the lower seat body 52 and the upper seat body 51. Specifically, a rectangular groove is formed at the center position of the lower seat body 52, and the two ends of the lower seat body 52 in the Y direction are respectively abutted against the upper seat body 51 and fixedly spliced.

[0091] In some embodiments, the substrate material of the circuit board 201 is zirconia ceramic material. It can be understood that the zirconia ceramic material has a dielectric loss only 1 / 20 of that of glass, which can effectively reduce the radio frequency loss of the circuit board 201, improve the voltage bearing capacity of the circuit board 201, and reduce the equivalent capacitance of the circuit board 201. At the same time, compared with other materials, such as silicone materials, aluminum nitride or alumina and other materials. The zirconia ceramic material has better parameters in terms of toughness, density, bending strength and fracture toughness, etc., so as to ensure that the circuit board 201 will not be easily damaged by external forces, improve the compressive and drop resistance of the circuit board 201, and improve the toughness of the circuit board 201 and the yield rate in the bonding and soldering process, so that the circuit board 201 has higher wear resistance and high temperature resistance.

[0092] In some embodiments, the circuit board 201 is provided with a gold finger 2011, and the mounting base 5 is provided with an electrical contact piece 523. The electrical contact piece 523 defines an electrical connection slot 524 communicating with the sliding slot 522. The circuit board 201 is adapted to slide along the sliding slot 522 until the gold finger 2011 is inserted and engaged with the electrical connection slot 524. It should be noted that, as Figure 11 shown, the circuit board 201 is provided with a gold finger 2011 at its end, and the mounting base 5 includes a bottom plate and an electrical contact piece 523 is provided at the end of the bottom plate, so that the distribution position of the gold finger 2011 on the circuit board 201 is the same as the distribution position of the electrical contact piece 523 on the bottom plate. At the same time, the electrical contact piece 523 is configured as a groove structure having an electrical connection slot 524.

[0093] Thus, in actual installation, the circuit board 201 is slid along the sliding slot 522 until it abuts against the electrical contact piece 523, and then the circuit board 201 is continuously pushed forward, so that the circuit board 201 enters the electrical connection slot 524 and reaches the limit position. At this time, the gold finger 2011 on the circuit board 201 can cooperate with the electrical contact piece 523 on the mounting base 5, thereby realizing the electrical connection between the two, that is, connecting an external power supply to control the circuit.

[0094] In some embodiments, one end of the circuit board 201 facing the gold finger 2011 is configured as a wedge structure. It can be understood that in actual processing, configuring one end of the circuit board 201 facing the gold finger 2011 as a wedge structure is beneficial for guiding and improving the installation fault tolerance rate of the chip.

[0095] In some embodiments, both sides of the top surface of the circuit board 201 are provided with an RF connection plating layer 2012 and a DC connection plating layer 2013. The distribution directions of the RF connection plating layer 2012 and the DC connection plating layer 2013 are the same as the axial direction of the trapping field formed by the well chips. It should be noted that, as Figure 11 shown, the RF connection plating layer 2012 and the DC connection plating layer 2013 are provided on both sides in the Y direction of the circuit board 201 and are consistent with the axial direction of the trapping field formed by the chip. Thus, it is beneficial to shorten the wiring distance between the chip electrode piece and the circuit board 201, thereby reducing the electromagnetic signal interference generated by the circuit, and is beneficial to reducing the space occupied by wiring, so that the laser light path can have more optional in-well space sites.

[0096] In some embodiments, the mounting base 5 is provided with a power connection notch 53 for embedding a copper sheet. It should be noted that, as Figure 7 and Figure 8As shown, power connection notches 53 are provided at one end symmetric along the X direction at the limit protrusion 511 of the upper seat body 51 and the limit groove 521 of the lower seat body 52. The power connection notch 53 is a rectangular through opening, which enables only the power connection notch 53 to communicate between the inside of the mounting base 5 and the outside after the upper seat body 51 and the lower seat body 52 are spliced. Thus, a copper sheet can be embedded at the power connection notch 53, facilitating the electrical connection between the electroplated layer on the mounting base 5 and the chip electrodes.

[0097] In some embodiments, the chip mounting structure 200 further includes a bracket base 203 connected to the bottom of the circuit board 201. The mounting base 5 is provided with a base slot 525 communicating with the sliding slot 522, and the bracket base 203 is adapted to be supported on the inner bottom wall of the base slot 525. It should be noted that, as Figure 10 shown, the bracket base 203 is connected to the center position at the bottom of the circuit board 201, ensuring uniform stress on the chip mounting structure 200.

[0098] Specifically, the size of the bracket base 203 is the same as the size of the base slot 525 formed by the lower seat body 52. It can be understood that the base slot 525 is a groove structure constructed at the center position of the sliding slot 522, making the lower seat body 52 form a stepped structure in the Z direction.

[0099] Among them, the relative position of the base slot 525 on the sliding slot 522 is kept the same as the relative position of the bracket base 203 on the circuit board 201, ensuring that the bracket base 203 can be slidably inserted into the inner bottom wall of the base slot 525 while also ensuring that the circuit board 201 can be slidably inserted into the sliding slot 522.

[0100] Thus, when the bracket base 203 reaches the limit position of the base slot 525 and stops, at this time the circuit board 201 is completely inserted into the sliding slot 522, and the gold fingers 2011 are also completely inserted into the electrical connection slots 524, so that the gold fingers 2011 of the circuit board 201 can cooperate with the electrical contact pieces 523 on the lower seat body 52, and at the same time the electroplated layer on the circuit board 201 cooperates with the electrodes on the chip, thus realizing the chip installation process. In this way, the normal operation of the chip can be ensured.

[0101] In some embodiments, the width of the circuit board 201 is greater than the width of the bracket base 203, and the length of the bracket base 203 is also greater than the length of the bracket base 203. It can be understood that the bracket base 203 can be made of a material with relatively high structural strength, enabling the bracket base 203 to provide greater structural strength, thereby reducing the volume of the bracket base 203, which is beneficial to reducing the overall volume and weight of the chip mounting structure 200.

[0102] In some embodiments, the bracket base 203 is provided with a base hollow portion 2031. It should be noted that, asFigure 10 As shown, a base support hollow portion 2031 is provided at the center position of the support base 203, so that a hollow structure is formed inside the support base 203, thereby further reducing the weight of the support base 203, reducing the magnitude of the driving force required by the clamping portion 41, and facilitating faster and safer disassembly and installation operations.

[0103] In some embodiments, support feet 2032 are provided at the top of the support base 203, and support feet 2021 are provided at the bottom of the chip support 202, and the support feet 2032 and the support feet 2021 correspond to each other one by one. It should be noted that both the support feet 2032 and the support feet 2021 are in contact with the circuit board 201, and the support base and the support feet 2021 are correspondingly arranged at the upper and lower ends of the circuit board 201 one by one, which is beneficial to ensuring that when the chip mounting structure 200 moves or disassembles and installs the chip, the force received by the circuit board 201 is relatively uniform, thereby avoiding problems such as tilting and bending of the circuit board 201 due to uneven force, and further improving the service life of the circuit board 201.

[0104] In one embodiment, the ion trap system 100 capable of vacuum-changing chips further includes a positioning sleeve 231 for feeding the chip mounting structure 200 to the grasping mechanism 4, and the positioning sleeve 231 has a limiting structure for maintaining the feeding posture of the chip mounting structure 200. It should be noted that the positioning sleeve 231 can be a circular ring structure made of plastic material, so that the positioning sleeve 231 can undergo elastic deformation, which is simpler and more convenient to install and is not easily damaged. At the same time, the soft positioning sleeve 231 can provide protection for the chip mounting structure 200 after installation. When the chip mounting structure 200 is bumped, the positioning sleeve 231 can be used for buffering and resisting, weakening the energy of the collision to protect the chip mounting structure 200 from being damaged.

[0105] Moreover, the limiting structure of the positioning sleeve 231 can ensure that the posture of the chip mounting structure 200 does not change during the movement process, so that the chip mounting structure 200 can be accurately positioned and the installation process can be completed in the vacuum chamber 11, thereby improving the efficiency of the installation process and ensuring the stability of the installation process.

[0106] In some embodiments, it further includes a replacement port 23 for placing the positioning sleeve 231, and the positioning sleeve 231 is in circumferential limiting cooperation with the inner peripheral wall of the installation port 22. It should be noted that as Figure 12 shown, the outer diameter of the positioning sleeve 231 can be the same as the inner diameter of the replacement port 23, so that the positioning sleeve 231 can be adaptively installed on the replacement port 23, thereby ensuring the sealing performance of the two and further ensuring the stability of the vacuum environment.

[0107] In some embodiments, an active lumen 2311 and a positioning groove 2313 communicating with the active lumen 2311 are formed in the positioning sleeve 231, and the chip mounting structure 200 is in sliding positioning cooperation with the positioning groove 2313. It should be noted that, as Figure 12 shown, two limiting portions 2312 are formed inside the positioning sleeve 231. The two limiting portions 2312 are both arranged at the lower end of the active lumen 2311 and symmetrically distributed, so that the chip mounting structure 200 can be limited and pressed by the limiting portions 2312 to achieve the purpose of fixing the chip mounting structure 200.

[0108] Specifically, the two limiting portions 2312 are both provided with positioning grooves 2313 of the same size, and the two positioning grooves 2313 are horizontally symmetrically distributed relative to the positioning lumen, so that the distance between the two positioning grooves 2313 can be the same as the width of the circuit board 201. In this way, when the chip mounting structure 200 enters the active lumen 2311, the circuit board 201 is in sliding plug-in cooperation with the two positioning grooves 2313 in the horizontal direction, which can ensure that the posture of the chip mounting structure 200 is horizontal when it enters the chip replacement cavity 21, thus facilitating the chip mounting structure 200 to be more accurately clamped with the clamping portion 41 in the chip replacement cavity 21, and further facilitating accurate installation with the mounting seat 5 in the vacuum cavity 11, reducing the uncertain force between the chip mounting structure 200 and the mounting seat 5, and facilitating the rapid addressing of the ion trap system.

[0109] Among them, when the chip mounting structure 200 enters the replacement port 23 and is in sliding plug-in connection with the positioning sleeve 231, the positioning sleeve 231 will move simultaneously with the chip mounting structure 200. When the chip mounting structure 200 is accurately placed on the clamping portion 41, the positioning sleeve 231 is moved out of the chip replacement cavity 21 to the replacement port 23, so as to prepare for the next replacement of the chip mounting structure 200.

[0110] In some embodiments, a support groove 2314 communicating with the positioning groove 2313 is further formed in the positioning sleeve 231, and the bracket base 203 is slidably supported in the support groove 2314. It should be noted that, as Figure 12 shown, each limiting portion 2312 is provided with a support groove 2314. The two support grooves 2314 are horizontally symmetrically distributed, and the two support grooves 2314 are respectively arranged below the two positioning grooves 2313, and at the same time, the distance between the two support grooves 2314 is the same as the width of the bracket base 203, so that the bracket base 203 can be in sliding cooperation with the support groove 2314, thus facilitating the support groove 2314 to provide a support force for the bracket base 203, reducing the support force of the positioning groove 2313, further protecting the circuit board 201, avoiding risks such as bending or breaking of the circuit board 201 due to excessive force, and improving the installation accuracy of the chip mounting structure 200.

[0111] The ion trap system 100 capable of vacuum chip replacement according to an embodiment of the present invention includes the following embodiments of chip replacement:

[0112] The first: Realize chip replacement by using the disassembly of the grasping mechanism 4.

[0113] That is to say, as Figure 13 shown, during the disassembly process of the replacement module 2 by using the grasping mechanism 4, the chip mounting structure 200 is taken out of the outside world and the chip on the chip replacement bracket 202 is replaced. The specific operation process is as follows:

[0114] F1: Evacuate the chip replacement chamber 21 to the same vacuum environment as the vacuum chamber 11 or a vacuum environment higher than that of the vacuum chamber 11.

[0115] F2: Open the first valve plate 31, extend the clamping part 41 in the grasping mechanism 4 into the vacuum chamber 11 and grasp the chip mounting structure 200, so that the chip mounting structure 200 is disengaged from the vacuum chamber 11 and enters the chip replacement chamber 21.

[0116] F3: Close the first valve plate 31, disassemble the grasping mechanism 4 from the chip replacement chamber 21, and then replace the chip on the chip mounting structure 200 clamped by the clamping part 41.

[0117] F4: Reinstall the grasping mechanism 4 clamping the chip mounting structure 200 back to the chip replacement chamber 21, and then evacuate the chip replacement chamber 21 to the same vacuum environment as the vacuum chamber 11.

[0118] F5: Open the first valve plate 31, install the chip mounting structure 200 on the grasping mechanism 4 into the vacuum chamber 11, and then the grasping mechanism 4 resets to the chip mounting chamber.

[0119] F6: Close the first valve plate 31, detect the vacuum environment of the vacuum chamber 11, and if the vacuum degree of the vacuum environment is low, evacuate it to the required parameter environment.

[0120] The second: Realize chip replacement by disassembling the chip mounting structure 200 at the replacement port 23.

[0121] That is to say, as Figure 14 shown, when the grasping mechanism 4 moves the chip mounting structure 200 to the chip replacement chamber 21, by opening the replacement port 23, the chip mounting structure 200 is taken out of the chip replacement chamber 21, and then the chip on the chip replacement bracket 202 is replaced. The specific operation process is as follows:

[0122] S1: Evacuate the chip replacement chamber 21 to the same vacuum environment as the vacuum chamber 11 or a vacuum environment higher than that of the vacuum chamber 11.

[0123] S2: Open the first valve plate 31, extend the clamping part 41 in the grasping mechanism 4 to the vacuum chamber 11 and grasp the chip mounting structure 200, so that the chip mounting structure 200 is removed from the vacuum chamber 11 to the chip replacement chamber 21.

[0124] S3: Close the first valve plate 31, open the second valve plate 61, take out the chip mounting structure 200 on the clamping part 41 in the grasping mechanism 4 from the replacement opening 23, and replace the chip on the chip mounting structure 200.

[0125] S4: Insert the chip mounting structure 200 to be installed into the chip replacement chamber 21 from the replacement opening 23 to be fixedly connected with the clamping part 41, and then close the second valve plate 61.

[0126] S5: Vacuum the chip replacement chamber 21 to the same vacuum environment as the vacuum chamber 11.

[0127] S6: Open the first valve plate 31, install the chip mounting structure 200 on the grasping mechanism 4 into the vacuum chamber 11, and then the grasping mechanism 4 resets to the chip replacement chamber 21.

[0128] S7: Close the first valve plate 31, detect the vacuum environment of the vacuum chamber 11, if the vacuum degree of the vacuum environment is low, vacuum it to the required parameter environment.

[0129] The third method: Replace the chip in the chip replacement chamber 21.

[0130] That is to say, as Figure 15 shown, by setting multiple clamping parts 41, each clamping part 41 holds a chip mounting structure 200. After the clamping part 41 moves the chip mounting structure 200 in the vacuum chamber 11 to the chip replacement chamber 21, rotate the clamping part 41 to install another chip mounting structure 200 in the vacuum chamber 11 to complete the process of replacing the chip. The specific operation process is as follows:

[0131] T1: Detect the vacuum environment of the chip replacement chamber 21. If the vacuum environment of the chip replacement chamber 21 is low, vacuum the chip replacement chamber 21 to the same vacuum environment as the vacuum chamber 11 or a vacuum environment higher than that of the vacuum chamber 11.

[0132] T2: Open the first valve plate 31, extend the clamping part 41 corresponding to the vacuum chamber 11 direction in the grasping mechanism 4 into the vacuum chamber 11 and grasp the chip mounting structure 200 and remove the chip mounting structure 200 from the vacuum chamber 11.

[0133] T3: Rotate the clamping part 41 carrying the removed chip mounting structure 200 until the clamping part 41 carrying the new chip mounting structure 200 rotates to the direction consistent with the vacuum chamber 11 and stops.

[0134] T4: Advance the clamping part 41 carrying the new chip mounting structure 200 towards the vacuum chamber 11 so that the chip mounting structure 200 can be stably fixed within the vacuum chamber 11.

[0135] T5: The grasping mechanism 4 retracts to the chip replacement chamber 21 and closes the first valve plate 31.

[0136] T6: Detect the vacuum environment of the vacuum chamber 11. If the vacuum degree of the vacuum environment is low, evacuate it to a parameter environment that meets the requirements.

[0137] It can be understood that the third method of replacing the chip does not require opening the ion trap system in the short term, enabling the ion trap system to remain uncontacted with the outside world during chip replacement, thereby preventing the outside environment from interfering with the vacuum environments within the vacuum chamber 11 and the chip replacement chamber 21, and further ensuring the stability of the chip working environment. Meanwhile, since the operation of replacing the chip each time is simpler, the time consumed in the entire chip replacement process can be further reduced, improving the replacement efficiency.

[0138] However, there is a quantity limit for the clamping part 41 grasped by the grasping mechanism 4. Therefore, when all the chip mounting structures 200 on all the clamping parts 41 are out of date, it is necessary to replace the chip mounting structures 200 on all the clamping parts 41. At this time, the chips on the chip support 202 can be replaced by the first method or the second method described above. In this way, the vacuum environment of the ion trap system can be efficiently and fully ensured to be stable for a relatively long time.

[0139] In some embodiments, the first valve plate 31 is arranged to connect the chip replacement chamber 21 with the vacuum chamber 11 when the vacuum degree in the chip replacement chamber 21 exceeds the set vacuum degree, and the set vacuum degree is 10 -6 mBar. It can be understood that in the three methods of replacing the chip described above, the parameter of the evacuated environment needs to be greater than 10 -6 mBar, so as to ensure that the vacuum environment of the ion trap system will not be damaged.

[0140] That is to say, there may be some errors in actual operation, resulting in a slight decrease in the vacuum degree. However, according to experimental measurements, when the vacuum degree of the chip replacement chamber 21 reaches 10 -6 mBar or more, during two consecutive chip replacement processes, the vacuum environment within the vacuum chamber 11 has not been significantly contaminated, that is, the manipulation and reading of qubits have not been affected.

[0141] Thus, the problem of a huge workload due to the contamination of the vacuum environment during chip replacement can be solved, and the cost is further reduced. At the same time, in this embodiment, the vacuum chamber 11 is reduced from 10 -6 mBar to 10-9 The time spent in the evacuation process of mBar is only about 0.5 h, which can greatly reduce the time spent in evacuation, shorten the operation cycle, and improve work efficiency.

[0142] 1. In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0143] 2. In the description of the present invention, the "first feature" and "second feature" may include one or more of such features.

[0144] 3. In the description of the present invention, the meaning of "a plurality" is two or more.

[0145] 4. In the description of the present invention, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through additional features therebetween.

[0146] 5. In the description of the present invention, the first feature being "above", "over" and "on" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the horizontal height of the first feature is higher than that of the second feature.

[0147] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0148] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the claims and their equivalents.

Claims

1. An ion trap system capable of vacuum chip replacement, characterized in that Comprising: A vacuum module and a replacement module, the replacement module being connected to the vacuum module, a vacuum chamber being formed in the vacuum module, a chip replacement chamber being formed in the replacement module, the chip replacement chamber communicating with the vacuum chamber, and the replacement module being provided with a vacuum pumping port communicating with the chip replacement chamber; The replacement module is provided with a replacement port and a mounting port spaced apart from the replacement port, a second valve plate being movably mounted at the replacement port and being used for selectively closing the replacement port, the opening direction of the mounting port being perpendicular to the opening direction of the replacement port, and a positioning sleeve capable of being adaptively mounted being provided at the replacement port; A grasping mechanism, the grasping mechanism being disposed in the replacement module, and the grasping mechanism being provided with a movable clamping portion, the clamping portion being used for clamping a chip mounting structure to move between the chip replacement chamber and the vacuum chamber; the grasping mechanism further includes a transmission rod, the transmission rod passing through the mounting port, the transmission rod being used for controlling the clamping portion such that the clamping portion can simultaneously perform axial telescopic movement along with the transmission rod, and the chip mounting structure clamped by the clamping portion can rotate relative to the transmission rod; A first valve plate, the first valve plate being movably mounted at the connection between the replacement module and the vacuum module, and the first valve plate being used for selectively blocking the communication between the chip replacement chamber and the vacuum chamber.

2. The ion trap system capable of vacuum chip replacement according to claim 1, wherein A first movable seat is provided at the connection between the replacement module and the vacuum module, the first movable seat being provided with a first movable port communicating with the chip replacement chamber and the vacuum chamber, and the first valve plate being movably mounted at the first movable port and being adapted to selectively extend to the communication between the chip replacement chamber and the vacuum chamber.

3. The ion trap system capable of vacuum chip replacement according to claim 1, wherein The grasping mechanism further includes a vacuum housing and a rod driving member, the clamping portion being connected to one end of the transmission rod, the rod driving member being connected to the other end of the transmission rod and being used for driving the transmission rod to extend and retract, and the vacuum housing being connected to the rod driving member; The vacuum housing is sleeved outside the transmission rod and is in sealing cooperation with the inner peripheral wall of the mounting port.

4. The ion trap system capable of vacuum chip replacement according to claim 3, characterized in that, The mounting port, the chip replacement chamber and the vacuum chamber are sequentially communicated along the telescopic direction of the transmission rod.

5. The ion trap system capable of vacuum chip replacement according to claim 1, wherein A mounting seat is disposed in the vacuum chamber, the mounting seat being used for plugging and unplugging connection with the chip mounting structure and the plugging and unplugging direction being towards the chip replacement chamber.

6. The ion trap system capable of vacuum chip replacement according to claim 5, wherein The chip mounting structure includes a circuit board, the circuit board being provided with a gold finger, the mounting seat being provided with an electrical contact piece and a sliding slot, the electrical contact piece defining an electrical connection slot communicating with the sliding slot, and the circuit board being adapted to slide along the sliding slot until the gold finger is plugged into the electrical connection slot in a mating manner, and the substrate material of the circuit board being a silicon-based material or a ceramic material.

7. The ion trap system capable of vacuum chip replacement according to claim 1, characterized in that, The first valve plate is configured to communicate the chip replacement chamber with the vacuum chamber when the vacuum degree in the chip replacement chamber exceeds a set vacuum degree, and the set vacuum degree is 10 -6 mBar.

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