A circuit board inspection system and method

Abstract

This disclosure provides a circuit board inspection system and method. The inspection system includes: a transmitter for emitting laser light onto the circuit board under test; a receiver for receiving the reflected laser light from the circuit board under test; a modeling device for constructing a model of the circuit under test based on the reflected laser light, the model containing a coordinate system to determine the positions of electronic components; and a comparison device for comparing the model of the circuit under test with a standard circuit model to obtain the inspection result. The circuit board inspection system provided by this disclosure scans the circuit board under test by emitting laser light and receives the reflected laser light, accurately obtaining the data of the circuit board under test. The inspection is then completed by comparing the data with a standard circuit model. Using this inspection system to inspect circuit boards can significantly reduce the time spent on manual inspection and avoids leaving traces on solder joints and electronic components, preventing loose or poorly soldered component leads and avoiding damage to electronic components.

Description

Technical Field

[0001] This disclosure relates to the field of circuit testing and repair technology, and more specifically, to a circuit board testing system and method. Background Technology

[0002] The continuous development of information technology has led to the rapid development of circuit boards as an important component of information technology. As the support for important electronic components, circuit boards are the carriers for the electrical interconnection of electronic components. In order to ensure that the output circuit boards are qualified products, defect detection of circuit boards is required during the production process.

[0003] Traditional testing methods use probe cards or self-made test boards with flying probe testers to check for short circuits, open circuits, etc., but current technology has the following drawbacks:

[0004] Because the tester physically contacts the pads and the solder on them, it may leave small pits in the solder. For some customers, these pits may be considered cosmetic defects, leading to rejection of the assembly. Direct contact between the probes and component leads and solder joints may cause component leads to become loose or result in poor soldering. Summary of the Invention

[0005] The purpose of this disclosure is to provide a circuit board inspection system and method that can solve the technical problem that existing circuit board inspection methods easily damage the circuit boards. The specific solution is as follows:

[0006] According to specific embodiments of this disclosure, in a first aspect, this disclosure provides a circuit board inspection system, comprising: a transmitter for emitting laser light onto a circuit board under test; a receiver for receiving reflected laser light passing through the circuit board under test; a modeling device for constructing a circuit model under test based on the reflected laser light, the circuit model under test having a coordinate system for determining the position of each electronic component; and a comparison device for comparing each electronic component in the circuit model under test with a standard circuit model based on the position of the electronic components, thereby obtaining a detection result.

[0007] Optionally, the comparison device calculates the data difference at the same points in the circuit model under test and the standard circuit model to obtain error data; when the absolute value of the error data is greater than or equal to a threshold, the circuit board under test is judged to be abnormal; if the absolute value of the error data at all points is less than the threshold, the circuit board under test is judged to be normal.

[0008] Optionally, in the standard circuit model, if the point being compared is a closed circuit, the threshold includes: a first threshold; if the absolute value of the error data is greater than or equal to the first threshold and less than the second threshold, it is determined that the circuit board under test has a cold solder joint; if the absolute value of the error data is greater than or equal to the second threshold, it is determined that the circuit board under test is open-circuited; in the standard circuit model, if the point being compared is an open circuit, the threshold includes: a third threshold; if the absolute value of the error data is greater than or equal to the third threshold and less than the fourth threshold, it is determined that the circuit board under test has an over-soldering; if the absolute value of the error data is greater than or equal to the fourth threshold, it is determined that the circuit board under test is short-circuited.

[0009] Optionally, the step of constructing the circuit model under test based on the reflected laser includes: the modeling device generating three-dimensional point cloud data based on the reflected laser.

[0010] Optionally, it is characterized by further comprising: repair equipment, which repairs the circuit board after testing based on the test results.

[0011] According to a specific embodiment of this disclosure, in a second aspect, this disclosure provides a circuit board testing method, comprising: emitting a laser to a circuit board under test; receiving reflected laser light passing through the circuit board under test; constructing a circuit model under test based on the reflected laser light, wherein the circuit model under test has a coordinate system, and determining the position of each electronic component through the coordinate system; and comparing each electronic component in the circuit model under test with a standard circuit model based on the position of the electronic components to obtain a test result.

[0012] Optionally, the step of comparing each electronic component in the circuit model under test and the standard circuit model one-to-one based on the position of the electronic components to obtain the detection result includes: the comparison device calculates the data difference at the same point in the circuit model under test and the standard circuit model to obtain error data; when the absolute value of the error data is greater than or equal to a threshold, it is determined that the circuit board under test is abnormal; if the absolute value of the error data at all points is less than the threshold, it is determined that the circuit board under test is normal.

[0013] Optionally, in the standard circuit model, if the point being compared is a closed circuit, the threshold includes: a first threshold; if the absolute value of the error data is greater than or equal to the first threshold and less than the second threshold, it is determined that the circuit board under test has a cold solder joint; if the absolute value of the error data is greater than or equal to the second threshold, it is determined that the circuit board under test is open-circuited; in the standard circuit model, if the point being compared is an open circuit, the threshold includes: a third threshold; if the absolute value of the error data is greater than or equal to the third threshold and less than the fourth threshold, it is determined that the circuit board under test has an over-soldering; if the absolute value of the error data is greater than or equal to the fourth threshold, it is determined that the circuit board under test is short-circuited.

[0014] Optionally, the step of constructing a circuit under test model based on the reflected laser, wherein the circuit under test model contains a coordinate system, and determining the position of each electronic component using the coordinate system includes: generating three-dimensional point cloud data based on the reflected laser, wherein the three-dimensional point cloud data contains a coordinate system, and determining the position of each electronic component using the coordinate system.

[0015] Optionally, it also includes: repairing the circuit board after testing based on the test results.

[0016] Compared with the prior art, the above-described solutions of this disclosure have at least the following advantages: The circuit board inspection system provided by this disclosure scans the circuit board under test by emitting a laser and receives the reflected laser, which can accurately grasp the data of the circuit board under test, and then complete the inspection by comparing it with a standard circuit model. Using the circuit board inspection system of this disclosure to inspect circuit boards can greatly reduce the time of manual inspection. The inspection system has no physical contact with the circuit board under test and will not leave traces on solder joints and electronic components, avoiding loose or poorly soldered component leads and avoiding damage to electronic components. Attached Figure Description

[0017] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure. It is obvious that the drawings described below are merely some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort. In the drawings:

[0018] Figure 1 A schematic diagram of a circuit board inspection system according to an embodiment of the present disclosure is shown.

[0019] Figure 2 A schematic diagram of a standard circuit model according to an embodiment of the present disclosure is shown.

[0020] Figure 3 A schematic diagram of a circuit under test model according to an embodiment of the present disclosure is shown.

[0021] Figure 4 A flowchart of a circuit board testing method according to an embodiment of the present disclosure is shown.

[0022] Figure 5 A flowchart of a circuit board inspection method according to another embodiment of the present disclosure is shown.

[0023] Figure 6 A schematic diagram of an electronic device connection structure according to an embodiment of the present disclosure is shown.

[0024] Figure label:

[0025] 100: Transmitter; 200: Receiver; 300: Modeling device; 400: Comparison device; 500: Repair equipment; 600: Circuit board under test; 700: Standard circuit model. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of this disclosure clearer, the disclosure will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this disclosure, and not all of them. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0027] The terminology used in the embodiments of this disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure. The singular forms “a,” “the,” and “the” as used in the embodiments of this disclosure and the appended claims are also intended to include the plural forms, and “multiple” generally includes at least two unless the context clearly indicates otherwise.

[0028] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0029] It should be understood that although the terms first, second, third, etc., may be used to describe... in the embodiments of this disclosure, these... should not be limited to these terms. These terms are only used to distinguish... For example, first... may also be referred to as second... without departing from the scope of the embodiments of this disclosure, and similarly, second... may also be referred to as first...

[0030] Depending on the context, the words “if” or “suppose” as used here can be interpreted as “when” or “in response to determination” or “in response to detection.” Similarly, depending on the context, the phrases “if determination” or “if detection (of the stated condition or event)” can be interpreted as “when determination” or “in response to determination” or “when detection (of the stated condition or event)” or “in response to detection (of the stated condition or event).”

[0031] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a product or system comprising a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a product or system. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the product or system that includes said element.

[0032] The optional embodiments of this disclosure are described in detail below with reference to the accompanying drawings.

[0033] Figure 1 A schematic diagram of a circuit board inspection system according to an embodiment of the present disclosure is shown.

[0034] like Figure 1 As shown, according to a specific embodiment of this disclosure, in a first aspect, this disclosure provides a circuit board inspection system, which may include: a transmitter 100 for emitting laser light onto a circuit board 600 under test; a receiver 200 for receiving reflected laser light passing through the circuit board 600 under test; a modeling device 300 for constructing a circuit model under test based on the reflected laser light, the circuit model under test having a coordinate system, and determining the position of each electronic component through the coordinate system; and a comparison device 400 for comparing each electronic component in the circuit model under test with a standard circuit model 700 based on the position of the electronic components to obtain inspection results.

[0035] The circuit board inspection system disclosed herein uses a laser transmitter 100 to scan the circuit board under test and receives the reflected laser light, which can accurately obtain the data of the circuit board under test. The data is then compared with a standard circuit model 700 to complete the inspection. Using this circuit board inspection system can significantly reduce the time spent on manual inspection. The inspection system does not have physical contact with the circuit board under test and will not leave any marks on solder joints or electronic components, avoiding loose or poorly soldered component leads and preventing damage to electronic components.

[0036] The circuit board testing system and method disclosed herein can be used not only for the inspection of newly manufactured circuit boards, but also for the repair and maintenance of used circuit boards.

[0037] The above are merely examples; other situations will not be elaborated upon one by one. Please refer to the similar processing methods mentioned above.

[0038] In practical applications, the transmitter 100 projects a laser onto the side of the circuit board under test 600 containing electronic components; then, the receiver 200 receives the reflected laser light passing through the circuit board under test 600; the modeling device 300 constructs a circuit model under test based on the reflected laser light received by the receiver 200; the circuit model under test includes the positions of each electronic component in the circuit board under test 600 and the overall external structure of the circuit board under test 600; finally, the comparison device 400 compares the circuit model under test with the standard circuit model 700.

[0039] It should be noted that this disclosure uses a coordinate system to determine the position of each electronic component, but is not limited to the coordinate system method. Any method or technical solution that can locate electronic components in the circuit model under test is a modification, equivalent substitution, or improvement made without departing from the spirit and scope of this invention, and should be included within the protection scope of this invention.

[0040] The circuit board itself has multiple electronic components, and in the circuit model under test, the position of each electronic component needs to be determined. Furthermore, in this disclosure, the circuits on the circuit board are also considered electronic components. During the comparison process, the comparison device 400 compares the same electronic components at the same positions in the circuit model under test and the standard circuit model 700 (for example, electronic component a at position A in the circuit model under test is compared with electronic component a' at corresponding position A' in the standard circuit model 700; circuit b at position B in the circuit model under test is compared with circuit b' at corresponding position B' in the standard circuit model 700; i.e., the same component at the same position).

[0041] In some embodiments, the circuit model under test further includes reflectivity information and graphic color information of electronic components.

[0042] In some embodiments, the standard circuit model 700 is pre-stored scan data of a normal circuit board.

[0043] In some embodiments, the standard circuit model 700 is pre-stored three-dimensional point cloud data of a normal circuit board.

[0044] It should be noted that this disclosure uses a circuit model for comparison. When the positions of each electronic component in the circuit can be determined, data comparison can be performed directly without creating a model. For example, by adding coordinates to the data of the circuit under test and the standard circuit, data at the same coordinate can be directly compared.

[0045] In some embodiments, the comparison device 400 is used to compare each electronic component in the circuit model under test with the standard circuit model 700 one-to-one based on the position of the electronic components to obtain error data.

[0046] In some embodiments, the comparison device calculates the data difference at the same points in the circuit model under test and the standard circuit model to obtain error data.

[0047] In some embodiments, if the absolute value of the error data at all points is less than a threshold, the circuit board under test is determined to be normal.

[0048] In some embodiments, when the absolute value of the error data is greater than or equal to a threshold, the circuit board under test is determined to be abnormal.

[0049] In some embodiments, a numerical value can be defined for the conductive portion of the circuit board, and this value increases with the amount of conductor.

[0050] In some embodiments, numerical values ​​can be defined according to the area, volume, etc. of the conductive parts in the circuit board.

[0051] In some embodiments, the error data is a value obtained by subtracting the data of the standard circuit model from the data of the circuit model under test at a certain point, and this value is the error data.

[0052] In some embodiments, in the standard circuit model, if the point being compared is a pass-through, the threshold includes: a first threshold; if the absolute value of the error data is greater than or equal to the first threshold and less than a second threshold, it is determined that the circuit board under test has a cold solder joint. The second threshold is greater than the first threshold.

[0053] The first threshold is a value within the threshold range.

[0054] In some embodiments, in the standard circuit model, when the comparison point is a pass, if the absolute value of the error data is greater than or equal to the second threshold, it is determined that the circuit board under test is open.

[0055] In some embodiments, in the standard circuit model, if the point being compared is an open circuit, the threshold includes: a third threshold; if the absolute value of the error data is greater than or equal to the third threshold and less than the fourth threshold, it is determined that the circuit board under test has been over-soldered.

[0056] The third threshold is a value within the threshold range.

[0057] In some embodiments, in the standard circuit model, if the point being compared is an open circuit, and the absolute value of the error data is greater than or equal to a fourth threshold, it is determined that the circuit board under test is short-circuited. The fourth threshold is greater than the third threshold.

[0058] The thresholds disclosed herein are all determined based on data from standard circuits. The range of the thresholds is the error value that ensures the normal state and appearance of the circuit board, or it can be said to be the difference between the floating data of the standard circuit and the data of the standard circuit.

[0059] In some embodiments, the range less than the threshold is an error value that ensures the normal state and appearance of the circuit board, which can also be described as the difference between the floating data of the standard circuit and the data of the standard circuit.

[0060] In the standard circuit model, if the absolute value of the error data is less than the threshold, it proves that the circuit board under test 600 is no different from the standard circuit model 700 or the difference is very small, and it does not affect normal use.

[0061] In some embodiments, in the standard circuit model, if the point being compared is a closed circuit, the error data above the second threshold is the value when the circuit is completely disconnected or broken.

[0062] In some embodiments, in the standard circuit model, if the point being compared is an open circuit, the error data above the fourth threshold is considered a short circuit, which is equivalent to a point on the circuit board that should not exist having a conductor (solder joint, solder) and has already affected the connection of surrounding circuits or electronic components.

[0063] In some embodiments, if the point being compared is an open circuit, the absolute value of the error data is greater than the threshold, indicating that there should be no conductor at this point, but a conductor has appeared, which is an over-soldering phenomenon.

[0064] The circuit between the third threshold and the first threshold has been over-soldered. The over-soldered part does not involve other circuits. The circuit can be powered on, but the effect is poor, affecting the value during normal use.

[0065] Figure 2 A schematic diagram of a standard circuit model according to an embodiment of the present disclosure is shown.

[0066] Figure 3 A schematic diagram of a circuit under test model according to an embodiment of the present disclosure is shown.

[0067] like Figure 2 and Figure 3 As shown, Figure 2 It is a schematic diagram of a standard circuit model. Figure 3 Figure (a) shows that the error data is within the threshold range, indicating that the circuit board is normal.

[0068] Figure 2 It is a schematic diagram of a standard circuit model. Figure 3 Figure (b) shows that when the error data exceeds the second threshold, it is determined to be an open circuit in the circuit board. From... Figure 3As can be clearly seen in Figure (b), there is an open circuit at the solder joints of the two pins of electronic component e (dashed boxes in the figure), and there is also an open circuit in circuit d (dashed boxes in the figure); Figure 3 (b) and Figure 2 When comparing, the error data between the positions of electronic component e and circuit d will be significantly greater than the second threshold. Therefore, the judgment... Figure 3 The circuit board in Figure (b) is open-circuited.

[0069] Figure 2 It is a schematic diagram of a standard circuit model. Figure 3 In Figure (c), the error data of electronic component e is greater than the fourth threshold, indicating that electronic component e is over-soldered and has caused a short circuit; the error data of circuit d is greater than the threshold, indicating that circuit d is over-soldered but has not caused a short circuit. From Figure 3 As can be clearly seen in Figure (c), the two solder joints of electronic component e are now connected (dashed box in the figure), and circuit d also has a large solder joint (dashed box in the figure); Figure 3 (c) and Figure 2 When comparing, if the absolute value of the error data of electronic component e is significantly greater than the fourth threshold, it is determined that electronic component e is over-soldered and has caused a short circuit. If the error data of circuit d is significantly greater than the third threshold and less than the fourth threshold, it is determined that circuit d is over-soldered.

[0070] In some embodiments, the circuit board inspection system may further include: the modeling device 300 generating three-dimensional point cloud data based on the reflected laser.

[0071] In some embodiments, the comparison device 400 is used to compare the three-dimensional point cloud data with the data of the standard circuit model 700 to obtain error data. It should be noted that in this embodiment, when the modeling device 300 generates a three-dimensional point cloud model of the circuit under test based on the reflected laser, the data of the standard circuit model 700 is also pre-stored three-dimensional point cloud data.

[0072] like Figure 1 As shown, in some embodiments, the circuit board testing system may further include: a repair device 500, which repairs the tested circuit board based on the test results.

[0073] In some embodiments, the repair equipment 500 may include: a processor for generating a repair strategy based on the detection results; and a robotic arm for repairing the circuit board based on the repair strategy.

[0074] In some embodiments, the repair equipment 500 may further include a sensor for acquiring the position and distance of electronic components on a circuit board.

[0075] The processor automatically analyzes and synthesizes observation information from several sensors under certain criteria, calculates various possible actions, and then issues task instructions to the robotic arm for execution. For example, it issues instructions such as "replace the faulty electronic component" or "resolder the faulty solder joint" to the robotic arm. Upon receiving the instruction, the robotic arm will replace the component or resolder the faulty solder joint.

[0076] The function of a robotic arm is to move end effectors. Various end effectors, tailored to specific applications, are mounted on the robotic arm to grasp and move different electronic components; it is a simplified version of the human hand. Robotic arms often have built-in pressure sensors that transmit the force applied when the arm grasps a specific object to an intelligent processor. This prevents the object from falling or being crushed.

[0077] Robotic arms are specifically designed to perform tasks such as "replacing faulty electronic components" and "replacing faulty solder joints" in a controlled environment, following instructions.

[0078] In some embodiments, the maintenance device 500 may further include a stepper motor that controls the movement of the actuator of a robotic arm.

[0079] Stepper motors move precisely in incremental increments, allowing intelligent processors to issue precise commands to the robotic arm, which uses sensors to ensure it moves exactly the correct amount. Their incredibly precise hands can solder together an extremely small microchip.

[0080] In some embodiments, the sensors mounted on the robotic arm are called inner sensors, while the sensors that are part of the environment are called external sensors. The inner sensors are used to detect the state of the robotic arm itself (such as the angle between the arms, the position, speed, and acceleration of the robotic arm during motion engineering, etc.); the external sensors are used to detect the external environment and object conditions in which the robotic arm is located, such as the shape and spatial position of the object being grasped, whether there are obstacles, whether the object has slipped, etc.

[0081] According to a specific embodiment of this disclosure, in a second aspect, this disclosure provides a circuit board testing method, which may include: emitting a laser to a circuit board 600 under test; receiving reflected laser light passing through the circuit board 600 under test; constructing a circuit model under test based on the reflected laser light, wherein the circuit model under test has a coordinate system, and determining the position of each electronic component through the coordinate system; and comparing each electronic component in the circuit model under test with a standard circuit model 700 based on the position of the electronic components to obtain a test result.

[0082] The circuit board testing method disclosed herein uses a laser emitter 100 to scan the circuit board under test and receives the reflected laser light, which can accurately determine the data of the circuit board under test. The data is then compared with a standard circuit model 700 to complete the testing. Using this circuit board testing method can significantly reduce the time spent on manual testing. The testing system has no physical contact with the circuit board under test and leaves no traces on solder joints or electronic components, avoiding loose or poorly soldered component leads and preventing damage to electronic components.

[0083] Figure 4 A flowchart of a circuit board testing method according to an embodiment of the present disclosure is shown.

[0084] like Figure 4 As shown, in the second aspect, a circuit board inspection method is provided, comprising at least the following steps:

[0085] S100 emits a laser to the circuit board under test 600.

[0086] S200 receives the reflected laser light passing through the circuit board under test 600.

[0087] S300. Construct a circuit model under test based on the reflected laser. The circuit model under test has a coordinate system, and the position of each electronic component is determined by the coordinate system.

[0088] S400: Based on the position of the electronic components, each electronic component in the circuit model under test is compared one-to-one with the standard circuit model 700 to obtain the test results.

[0089] In some embodiments, step S400 may specifically include: the comparison device calculating the data difference at the same point between the circuit model under test and the standard circuit model to obtain error data;

[0090] When the absolute value of the error data is greater than or equal to the threshold, it is determined that the circuit board under test is abnormal.

[0091] If the absolute value of the error data at all points is less than the threshold, the circuit board under test is judged to be normal.

[0092] In a standard circuit model, if the point being compared is a path, the threshold includes: a first threshold;

[0093] When the absolute value of the error data is greater than or equal to the first threshold and less than the second threshold, it is determined that the circuit board under test has a poor solder joint.

[0094] When the absolute value of the error data is greater than or equal to the second threshold, it is determined that the circuit board under test is open.

[0095] In a standard circuit model, if the point being compared is an open circuit, the threshold includes: a third threshold;

[0096] When the absolute value of the error data is greater than or equal to the third threshold and less than the fourth threshold, it is determined that the circuit board under test has been over-soldered.

[0097] When the absolute value of the error data is greater than or equal to the fourth threshold, it is determined that the circuit board under test is short-circuited.

[0098] In the standard circuit model, if the point being compared is an open circuit, and the absolute value of the error data is greater than the second threshold, it is determined that the circuit board under test has been over-soldered.

[0099] In some embodiments, step S300 may specifically include: generating three-dimensional point cloud data based on the reflected laser, wherein the three-dimensional point cloud data contains a coordinate system, and determining the position of each electronic component through the coordinate system.

[0100] In some embodiments, step S400 may specifically include: comparing the three-dimensional point cloud data with the data of the standard circuit model 700 to obtain error data.

[0101] It should be noted that in this embodiment, when the modeling device 300 generates a three-dimensional point cloud data of the circuit under test based on the reflected laser, the data of the standard circuit model 700 is also a pre-stored three-dimensional point cloud data.

[0102] Figure 5 A flowchart of a circuit board inspection method according to another embodiment of the present disclosure is shown.

[0103] like Figure 5 As shown, in some embodiments, the circuit board testing method may further include:

[0104] S500. Repair the circuit board after testing based on the test results.

[0105] In some embodiments, step S500 may specifically include: generating a repair strategy based on the detection results; and repairing the circuit board based on the repair strategy.

[0106] In some embodiments, constructing a circuit under test model based on the reflected laser, wherein the circuit under test model has a coordinate system, and determining the position of each electronic component through the coordinate system may include: generating three-dimensional point cloud data based on the reflected laser, wherein the three-dimensional point cloud data has a coordinate system, and determining the position of each electronic component through the coordinate system.

[0107] In some embodiments, the three-dimensional point cloud data is compared with the data of the standard circuit model 700 to obtain error data.

[0108] In some embodiments, if the error data is within a threshold range, the circuit board is determined to be normal;

[0109] In some embodiments, if the error data is less than a threshold, it is determined to be a cold solder joint or open circuit on the circuit board;

[0110] In some embodiments, if the error data is greater than a threshold, it is determined that the circuit board is over-soldered or short-circuited.

[0111] In some embodiments, the circuit board inspection method may further include: repairing the inspected circuit board based on the inspection results.

[0112] In some embodiments, repairing the circuit board after detection based on the detection results may include: generating a repair strategy based on the detection results; and repairing the circuit board based on the repair strategy.

[0113] Laser beams are emitted by the transmitter 100, reflected upon encountering the circuit board under test 600, and captured by the receiver 200. The distance to obstacles is determined by measuring the flight time of each laser beam, and a point cloud of the object's geometric surface is constructed. For example, when the laser emits 2 million or more laser beams per second, it means there are more than 2 million point clouds. The point cloud represents the 3D world because the laser acquires the accurate three-dimensional coordinates (X, Y, Z) of each impact point. This constructs a rich 3D environmental scene. The information from the circuit board under test 600 is converted into image signals and transmitted to a dedicated image processing system. Based on pixel distribution and information such as brightness and color, it is converted into digital signals. The image processing system performs various calculations on these signals to extract the target's classification features, such as area, quantity, position, and length. Then, based on preset hardware circuit device tolerances and other conditions, it outputs results, including size, angle, number, presence / absence, etc., to achieve automatic recognition and determine whether the device is used correctly.

[0114] When light enters the surface of the circuit board under test 600, various imperfections and defects will exhibit a different appearance from the surrounding environment in terms of reflection and refraction. For example, when uniform light is incident perpendicularly on the surface of the device, if the electronic component pins in the circuit board under test 600 are properly and uniformly soldered around them, the emission direction will not change, and the detected light will be uniform.

[0115] When the pins of the circuit board under test 600 are missing solder or not soldered at all, the emitted light will change, and the detected image will also change accordingly. Due to the presence of defects, stress concentration and deformation will occur around the defects, making them easy to observe in the image. If a light-transmitting defect is encountered (e.g., no solder, insufficient solder / poor solder joint, etc.), the light will be refracted and deflected at the defect location, and the intensity of the light will be less than the surrounding light, thus the light detected on the camera target surface will be correspondingly enhanced.

[0116] Absorbent impurities (such as sand grains) weaken the light at the defect location, and the light detected on the camera target surface is weaker than the surrounding light. The actual connection status of the device is determined by analyzing the strength and characteristics of the image signal collected by the camera and comparing them with various preset possible conditions.

[0117] This embodiment provides an electronic device for an audio / video processing method based on display location. The electronic device includes: at least one processor; and a memory communicatively connected to the at least one processor; wherein...

[0118] The memory stores instructions executable by the processor, which are then executed by the at least one processor to enable the at least one processor to: emit a laser beam toward the circuit board under test 600; receive reflected laser beams passing through the circuit board under test 600; construct a circuit model under test based on the reflected laser beams, the circuit model under test having a coordinate system, and determine the position of each electronic component using the coordinate system; and compare each electronic component in the circuit model under test with the standard circuit model 700 based on the positions of the electronic components to obtain a test result.

[0119] This disclosure provides a non-volatile computer storage medium storing computer-executable instructions that can execute the circuit board-based detection method in any of the above method embodiments.

[0120] The following is for reference. Figure 6 The diagram illustrates a structural schematic of an electronic device suitable for implementing embodiments of the present disclosure. The terminal devices in the embodiments of the present disclosure may include, but are not limited to, mobile terminals such as mobile phones, laptops, digital broadcast receivers, PDAs (personal digital assistants), PADs (tablet computers), PMPs (portable multimedia players), in-vehicle terminals (e.g., in-vehicle navigation terminals), and fixed terminals such as digital TVs and desktop computers. Figure 6 The electronic device shown is merely an example and should not be construed as limiting the functionality and scope of the embodiments disclosed herein.

[0121] like Figure 6As shown, the electronic device may include a processing system (e.g., a central processing unit, a graphics processing unit, etc.) 301, which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 302 or a program loaded from a storage system 308 into a random access memory (RAM) 303. The RAM 303 also stores various programs and data required for the operation of the electronic device. The processing system 301, ROM 302, and RAM 303 are interconnected via a bus 304. An input / output (I / O) interface 305 is also connected to the bus 304.

[0122] Typically, the following systems can be connected to I / O interface 305: input systems 306 including, for example, touchscreens, touchpads, keyboards, mice, cameras, microphones, accelerometers, gyroscopes, etc.; output systems 307 including, for example, liquid crystal displays (LCDs), speakers, vibrators, etc.; storage systems 308 including, for example, magnetic tapes, hard disks, etc.; and communication systems 309. Communication system 309 allows electronic devices to communicate wirelessly or wiredly with other devices to exchange data. Although Figure 6 Electronic devices with various systems are shown, but it should be understood that it is not required to implement or have all of the systems shown. More or fewer systems may be implemented alternatively.

[0123] In particular, according to embodiments of this disclosure, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, embodiments of this disclosure include a computer program product comprising a computer program carried on a computer-readable medium, the computer program containing program code for performing the methods shown in the flowcharts. In such embodiments, the computer program can be downloaded and installed from a network via communication system 309, or installed from storage system 308, or installed from ROM 302. When the computer program is executed by processing system 301, it performs the functions defined in the methods of embodiments of this disclosure.

[0124] It should be noted that the computer-readable medium described in this disclosure can be a computer-readable signal medium or a computer-readable storage medium, or any combination thereof. A computer-readable storage medium can be, for example,—but not limited to—an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, system, or device, or any combination thereof. More specific examples of a computer-readable storage medium may include, but are not limited to: an electrical connection having one or more wires, a portable computer disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination thereof. In this disclosure, a computer-readable storage medium can be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, system, or device. In this disclosure, a computer-readable signal medium can include a data signal propagated in baseband or as part of a carrier wave, carrying computer-readable program code. Such propagated data signals can take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. A computer-readable signal medium can be any computer-readable medium other than a computer-readable storage medium, which can send, propagate, or transmit a program for use by or in connection with an instruction execution system, system, or device. The program code contained on the computer-readable medium can be transmitted using any suitable medium, including but not limited to: wires, optical fibers, RF (radio frequency), etc., or any suitable combination thereof.

[0125] The aforementioned computer-readable medium may be included in the aforementioned electronic device; or it may exist independently and not assembled into the electronic device.

[0126] The aforementioned computer-readable medium carries one or more programs. When these programs are executed by the electronic device, the electronic device: emits a laser to scan the circuit board under test and receives the reflected laser, accurately obtaining data from the circuit board under test. The data is then compared with a standard circuit model to complete the detection. Using the circuit board inspection system of this disclosure can significantly reduce the time spent on manual inspection. The inspection system has no physical contact with the circuit board under test and leaves no traces on solder joints or electronic components, avoiding loose or poorly soldered component leads and preventing damage to electronic components.

[0127] Alternatively, the aforementioned computer-readable medium carries one or more programs that, when executed by the electronic device, cause the electronic device to: emit a laser to scan the circuit board under test via a transmitter and receive the reflected laser, thereby accurately obtaining the data of the circuit board under test, and then completing the detection by comparing it with a standard circuit model. Using the circuit board inspection system of this disclosure to inspect circuit boards can significantly reduce the time spent on manual inspection. The inspection system has no physical contact with the circuit board under test and will not leave traces on solder joints or electronic components, avoiding loose or poorly soldered component leads and preventing damage to electronic components.

[0128] Computer program code for performing the operations of this disclosure can be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, and C++, and conventional procedural programming languages ​​such as the "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network—including a local area network (LAN) or a wide area network (WAN)—or can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0129] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this disclosure. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0130] This invention aims to protect a circuit board inspection system and method. The inspection system may include: a transmitter 100 for emitting laser light onto a circuit board 600 under test; a receiver 200 for receiving reflected laser light from the circuit board 600; a modeling device 300 for constructing a circuit model based on the reflected laser light, the circuit model having a coordinate system for determining the position of each electronic component; and a comparison device 400 for comparing each electronic component in the circuit model under test with a standard circuit model 700 based on the position of the electronic components to obtain the inspection result. The circuit board inspection system provided in this disclosure scans the circuit board under test by emitting laser light from the transmitter 100 and receives the reflected laser light, accurately obtaining the data of the circuit board under test. The inspection is then completed by comparing the data with the standard circuit model 700. Using this circuit board inspection system can significantly reduce the time required for manual inspection. The inspection system has no physical contact with the circuit board under test and leaves no traces on solder joints or electronic components, avoiding loose or poorly soldered component leads and preventing damage to electronic components.

[0131] The apparatus described in the embodiments of this disclosure can be implemented in software or in hardware. The name of the apparatus does not necessarily limit the apparatus itself; for example, the first acquisition apparatus can also be described as "an apparatus for acquiring at least two Internet Protocol addresses".

Claims

1. A circuit board inspection system for non-contact inspection of the electrical connection status of a circuit board, characterized in that, include: A transmitter used to emit a laser beam onto the circuit board under test; A receiver for receiving reflected laser light passing through the circuit board under test; A modeling device is used to construct a circuit under test model based on the reflected laser. The circuit under test model has a coordinate system, through which the position of each electronic component is determined. The circuit under test model includes reflectivity information and graphic color information of the electronic components. The comparison device is used to compare each electronic component in the circuit model under test with a standard circuit model based on the position of the electronic components, and obtain the test results. The comparison device calculates the data difference at the same point between the circuit model under test and the standard circuit model to obtain error data. When the absolute value of the error data is greater than or equal to the threshold, it is determined that the circuit board under test is abnormal. If the absolute value of the error data at all points is less than the threshold, the circuit board under test is considered to be normal. In a standard circuit model, if the point being compared is a path, the threshold includes: a first threshold; When the absolute value of the error data is greater than or equal to the first threshold and less than the second threshold, it is determined that the circuit board under test has a poor solder joint. When the absolute value of the error data is greater than or equal to the second threshold, it is determined that the circuit board under test is open. In a standard circuit model, if the point being compared is an open circuit, the threshold includes: a third threshold; When the absolute value of the error data is greater than or equal to the third threshold and less than the fourth threshold, it is determined that the circuit board under test has been over-soldered. When the absolute value of the error data is greater than or equal to the fourth threshold, it is determined that the circuit board under test is short-circuited.

2. The circuit board testing system according to claim 1, characterized in that, The construction of the circuit under test model based on the reflected laser includes: The modeling device generates three-dimensional point cloud data based on the reflected laser.

3. The circuit board testing system according to claim 1 or 2, characterized in that, Also includes: Repair equipment, which repairs the circuit board after testing based on the test results.

4. A circuit board inspection method for non-contact inspection of the electrical connection status of a circuit board, characterized in that, include: Emit a laser to the circuit board under test; Receives reflected laser light passing through the circuit board under test; A circuit model under test is constructed based on the reflected laser. The circuit model under test includes a coordinate system, through which the position of each electronic component is determined. The circuit model under test includes the reflectivity information and graphic color information of the electronic components. By comparing each electronic component in the circuit model under test with that in the standard circuit model based on their location, the test results are obtained. The method of comparing each electronic component in the test circuit model with the standard circuit model based on the location of the electronic components yields the following test results: The comparison device calculates the data difference at the same point between the circuit model under test and the standard circuit model to obtain error data; When the absolute value of the error data is greater than or equal to the threshold, it is determined that the circuit board under test is abnormal. If the absolute value of the error data at all points is less than the threshold, the circuit board under test is considered to be normal. In a standard circuit model, if the point being compared is a path, the threshold includes: a first threshold; When the absolute value of the error data is greater than or equal to the first threshold and less than the second threshold, it is determined that the circuit board under test has a poor solder joint. When the absolute value of the error data is greater than or equal to the second threshold, it is determined that the circuit board under test is open. In a standard circuit model, if the point being compared is an open circuit, the threshold includes: a third threshold; When the absolute value of the error data is greater than or equal to the third threshold and less than the fourth threshold, it is determined that the circuit board under test has been over-soldered. When the absolute value of the error data is greater than or equal to the fourth threshold, it is determined that the circuit board under test is short-circuited.

5. The circuit board testing method according to claim 4, characterized in that, The step of constructing a circuit under test model based on the reflected laser, wherein the circuit under test model includes a coordinate system, and determining the position of each electronic component using the coordinate system includes: Three-dimensional point cloud data is generated based on the reflected laser. The three-dimensional point cloud data contains a coordinate system, and the position of each electronic component is determined by the coordinate system.

6. The circuit board testing method according to claim 4 or 5, characterized in that, Also includes: The circuit board was repaired based on the test results.

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