LED arrangement structure

Abstract

The application provides an LED arrangement structure, which comprises the following steps: arranging a plurality of LED lamp beads in a first direction and a second direction on a PCB to form a plurality of LED lamp bead rows and LED lamp bead columns; each LED lamp bead row comprises a plurality of LED lamp bead groups, each LED lamp bead group comprises two adjacent LED lamp beads, and the two non-common poles in each LED lamp bead group in at least one LED lamp bead row are connected to the surface layer of the PCB, so that when the LED lamp beads are connected to the PCB, the two non-common pole connected LED lamp beads can be connected to the PCB through a via, thereby reducing the number of vias on the PCB, improving the yield of the PCB and reducing the production cost of the PCB.

Description

Technical Field

[0001] This invention relates to the field of LED display technology, and more particularly to an LED arrangement structure. Background Technology

[0002] LED displays are flat multimedia display terminals composed of light-emitting diode dot matrix modules or pixel units. They are characterized by high brightness, wide viewing range, long lifespan, and low cost.

[0003] Currently, the design and production of LED displays typically require adding holes, increasing the width, or increasing the number of layers on the PCB board. However, excessive holes can significantly increase the defect rate, while increasing the width or number of layers greatly increases material costs, thus drastically raising the overall production cost of the LED display. Therefore, improving the PCB yield rate to reduce production costs has become a pressing technical problem. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides an LED arrangement structure aimed at improving the low yield rate of PCB boards in existing technologies.

[0005] To address the above problems, embodiments of the present invention provide an LED arrangement structure, comprising:

[0006] A PCB board, wherein a plurality of data lines extending along a first direction, a plurality of scan lines extending along a second direction, and a plurality of vias are provided in the display area of ​​the PCB board; the data lines and the scan lines are located on different layers of the PCB board, and the second direction intersects the first direction; the plurality of vias includes a plurality of first vias and a plurality of second vias;

[0007] Multiple LED beads are disposed on the PCB board, and the multiple LED beads are arranged in an array in the first direction and the second direction to form multiple LED bead rows and multiple LED bead columns. The LED bead rows extend along the first direction, and the LED bead columns extend along the second direction. Each LED bead row includes multiple LED bead groups, and each LED bead group includes two adjacent LED beads. The adjacent multiple LED beads are arranged sequentially along the second direction to form a plurality of light-emitting pixels. The LED beads include common terminals and non-common terminals.

[0008] Within each LED row, the common terminal of all the LEDs is connected to a scan line through a first via.

[0009] Within each row of LED beads, all non-common terminals of the LED beads are connected to one data line;

[0010] In at least one row of LED beads, the non-common terminals of two LED beads in each group of LED beads are connected on the surface of the PCB board.

[0011] Preferably, in the LED arrangement structure, the display area of ​​the PCB board is further provided with a plurality of non-common polarity connection lines extending along the first direction. The non-common polarity connection lines and the data lines are located on different layers of the PCB board, and the non-common polarity connection lines and the scan lines are located on different layers of the PCB board. In each LED bead group, the non-common polarity terminals of two LED beads are connected to one non-common polarity connection line.

[0012] Preferably, in the LED arrangement structure, the non-common electrode connection line passes through the second via and is connected to the data line.

[0013] Preferably, in the LED arrangement structure, within each LED bead group, the non-common electrode connection line is connected to a data line through at least one second via.

[0014] Preferably, in the LED arrangement structure, the common terminal of all LED beads in the light-emitting pixel is connected to the scan line through a first via.

[0015] Preferably, in the LED arrangement structure, within each LED row, the common terminals of all LEDs in at least two adjacent light-emitting pixels are connected to the scan line through a first via.

[0016] Meanwhile, embodiments of the present invention provide an LED arrangement structure, which includes a PCB board for mounting multiple LED beads, the PCB board comprising:

[0017] M data lines, the data lines extending along a first direction, M≥3, and are integers;

[0018] N scan lines, the scan lines extending along a second direction, where N≥2 and is an integer; the second direction intersects the first direction;

[0019] Multiple terminal pairs are located on the surface of the PCB board. Each terminal pair includes a first terminal and a second terminal. The multiple terminal pairs form M rows of terminal pairs and N columns of terminal pairs. The first terminal of all terminal pairs in the i-th row is connected to the i-th data line, and the second terminal of all terminal pairs in the j-th column is connected to the j-th scan line.

[0020] In the terminal pair of the i-th row, the first terminal of the o-th terminal pair is connected to the first terminal of the (o+1)-th terminal pair on the surface of the PCB board, where o is an odd or even number.

[0021] Preferably, in the LED arrangement structure, the PCB board further includes an array of M*N / 2 non-common polarity connection lines, where M*N / 2 is an integer. The non-common polarity connection lines extend along a first direction and are located on the surface layer of the PCB board. The scan lines are located on the inner or bottom layer of the PCB board, and the data lines are located in a film layer between the non-common polarity connection lines and the scan lines. In the terminal pair of the i-th row, the first terminal of the o-th terminal pair is connected to the first terminal of the o+1-th terminal pair through the p-th non-common polarity connection line of the i-th row. When o is even, p is o / 2; when o is odd, p is (o+1) / 2.

[0022] Preferably, in the LED arrangement structure, the p-th non-common connection line in the i-th row is connected to the i-th data line through at least one via.

[0023] Preferably, the PCB board further includes an array of M*N / 3 common-pole connection lines, where M*N / 3 is an integer, and the common-pole connection lines are located on the surface layer of the PCB board; the j-th column of terminal pairs includes multiple repeating units, and the second terminals of all terminal pairs within the same repeating unit are connected through one of the common-pole connection lines, and the common-pole connection lines are connected to the j-th scan line through vias.

[0024] Compared with the prior art, the LED arrangement structure provided in this embodiment of the invention forms multiple LED rows and columns by arranging multiple LED beads in an array in a first direction and a second direction on a PCB board. Each LED row includes multiple LED groups, and each LED group includes two adjacent LED beads. In at least one LED row, the two non-common terminals of each LED group are connected on the surface of the PCB board. This allows the two non-common terminal connected LED beads to be connected to the PCB board through a via when the LED beads are connected to the PCB board, thereby reducing the number of vias on the PCB board, improving the yield of the PCB board, and reducing the production cost of the PCB board. Attached Figure Description

[0025] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1This is a schematic diagram of the LED arrangement structure in related technologies;

[0027] Figure 2 This is another schematic diagram of the LED arrangement structure in related technologies;

[0028] Figure 3 A schematic diagram of the LED arrangement structure provided in an embodiment of the present invention;

[0029] Figure 4 A schematic diagram of an LED arrangement structure provided in another embodiment of the present invention;

[0030] Figure 5 A schematic diagram of an LED arrangement structure provided in another embodiment of the present invention;

[0031] Figure 6 A schematic diagram of an LED arrangement structure provided in another embodiment of the present invention;

[0032] Figure 7 This is a schematic diagram of an LED arrangement structure provided in another embodiment of the present invention.

[0033] Figure 8 This is a schematic diagram of an LED arrangement structure provided in another embodiment of the present invention.

[0034] Figure 9 for Figure 8 An exploded view of the film layers of the LED arrangement structure. Detailed Implementation

[0035] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0036] In the description of the invention, it should be understood that the terms "center", "horizontal", "up", "down", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "column", "row", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention.

[0037] In this invention, the term "some embodiments" is used to mean "serving as an example, illustration, or description." Any embodiment described as exemplary in this application is not necessarily to be construed as being more preferred or advantageous than other embodiments. The following description is provided to enable any person skilled in the art to make and use the invention. Details are set forth in the following description for purposes of explanation. It should be understood that those skilled in the art will recognize that the invention can be made without using these specific details. In other instances, known structures and processes are not described in detail to avoid obscuring the description of the invention with unnecessary detail. Therefore, the invention is not intended to be limited to the embodiments shown, but is consistent with the broadest scope of the principles disclosed in this application.

[0038] It should be noted that the first direction and the second direction mentioned in the embodiments of this application are perpendicular to each other. The first direction can be a column direction or a row direction, and similarly, the second direction corresponds to a row direction or a column direction. The first direction and the second direction can be interchanged in practical applications. Specifically, when the first direction is... Figure 1-7 When the x-direction is indicated in the middle, the second direction is... Figure 1-7 The y-direction indicated in the diagram represents the rows of LEDs, and the columns represent the columns of LEDs. Figure 1-7 In this diagram, the x-direction is the row direction and the y-direction is the column direction.

[0039] Please see Figure 1 , Figure 1 This is a schematic diagram of an LED arrangement structure in related technologies. For example... Figure 1 As shown, multiple identical light-emitting pixels 20 are arrayed on the PCB board 10. Each light-emitting pixel 20 consists of three LEDs of different colors: red, blue, and green. The LEDs and pixels 20 are arranged in an array on the PCB board 10. The common terminals of all LEDs in each row of pixels 20 are electrically connected on the surface of the PCB board 10 to form a row scan line. The non-common terminals of LEDs of the same color in each column of pixels 20 are electrically connected on the inner or bottom layer of the PCB board 10 through vias 101 to form a column data line. The selection chip scans the pixels on the PCB board 10 row by row through the scan lines 30, and the driving chip applies different currents through the data lines 40 to obtain different colors in each pixel 20, thus obtaining a complete image on the PCB board 10.

[0040] from Figure 1As can be seen, the number of vias 101 on the PCB board 10 is determined by the number of LED beads. Each light-emitting pixel 20 requires three vias 101 to bring the data line 40 to the inner or bottom layer of the PCB board 10.

[0041] Please see Figure 2 , Figure 2 This is another schematic diagram of an LED arrangement structure in related technologies. For example... Figure 2 As shown, multiple identical light-emitting pixels 20 are arrayed on the PCB board 10. Each light-emitting pixel 20 consists of three LEDs of different colors: red, blue, and green. Thus, both the LEDs and the light-emitting pixels 20 are arranged in an array on the PCB board 10. The common terminals of all LEDs in each row of light-emitting pixels 20 are electrically connected through vias 101 on the inner or bottom layer of the PCB board 10 to form a row scan line. The non-common terminals of LEDs of the same color in each column of light-emitting pixels 20 are electrically connected on the surface layer of the PCB board 10 to form a column data line 40.

[0042] from Figure 2 As can be seen, to avoid trace crossing issues on the PCB board, each column of luminous pixels 20 requires two data lines 40 to pass between the positive and negative terminals of one or more LED beads. Although Figure 2 Each luminous pixel 20 requires only one via 101. However, due to the constraints of the PCB board 10's routing rules, the data line 40 passing between the positive and negative terminals of the LED chip inevitably increases the size of the LED chip, leading to a sharp increase in cost. Taking the commonly used COB chip 0408 (4mil×8mil) as an example, the distance between the positive and negative terminals of the COB chip is only 75um. The spacing of the pads on the PCB board 10 is generally smaller than the spacing of the pads on the COB chip to prevent misalignment; therefore, this value is generally taken as 70um. According to the PCB board 10's manufacturing process, the typical trace width and spacing are 100um. If both data lines 40 pass between the positive and negative terminals of the COB chip, the distance between the positive and negative terminals of the COB chip must be at least 500um. At this point, the COB chip will be much larger than the original 75um design size of the diode, making the diode very large and drastically increasing manufacturing costs.

[0043] Please see Figure 3 , Figure 3 This is a schematic diagram of an LED arrangement structure provided in an embodiment of the present invention. Figure 3 As shown, an LED arrangement structure includes:

[0044] PCB board 10;

[0045] A plurality of first LED beads 201 and a plurality of second LED beads 202 are disposed on the PCB board 10; the first LED beads 201 and the second LED beads 202 are arranged in an array in a first direction and a second direction;

[0046] Multiple first LED beads 201 form multiple first LED bead rows 210 along the second direction, multiple second LED beads 202 form multiple second LED bead rows 220 along the second direction, and multiple first LED beads 201 and multiple second LED beads 202 form multiple third LED bead rows 230 along the first direction.

[0047] In each first LED row 210, the common terminal of each first LED 201 is electrically connected to form a scan line 30; in each second LED row 220, the common terminal of each second LED 202 is electrically connected to form a scan line 30; in each third LED row 230, the non-common terminal of each first LED 201 and each second LED 202 is electrically connected to form a data line 40.

[0048] In each of the third LED rows 230, the common or non-common terminals of two adjacent first LEDs 201 and second LEDs 202 are adjacent; the scan line 30 and the data line 40 are located on different layers in the PCB board 10.

[0049] The LED arrangement structure provided in this embodiment of the invention involves setting multiple first LED beads 201 and multiple second LED beads 202 on a PCB board 10. The first LED beads 201 and the second LED beads 202 are arranged in an array in a first direction and a second direction. The multiple first LED beads 201 form multiple rows 210 of first LED beads along the second direction, the multiple second LED beads 202 form multiple rows 220 of second LED beads along the second direction, and the multiple first LED beads 201 and the multiple second LED beads 202 form multiple rows 230 of third LED beads along the first direction. Simultaneously, the common terminals of the first LED beads 201 in each row 210 are electrically connected to form a scan line 30 along the second direction. In the second LED row 220, the common terminal electrical connection between the second LEDs 202 forms a scan line 30 along the second direction. In each third LED row 230, the non-common terminal electrical connection between the first LEDs 201 and the second LEDs 202 forms a data line 40 along the first direction. In each third LED row 230, the common or non-common terminals of two adjacent first LEDs 201 and second LEDs 202 are adjacent. The scan line 30 and the data line 40 are located on different layers in the PCB board 10. This not only reduces the number of vias 101 on the PCB board 10, but also eliminates the need to increase the width or number of layers of the PCB board 10. It also improves the yield of the PCB board 10 while reducing the production cost of the LED display.

[0050] Specifically, in Figure 3In the illustrated embodiment, three adjacent first LEDs 201 in the first LED row 210 can form a light-emitting pixel 20, and three adjacent second LEDs 202 in the second LED row 220 can form a light-emitting pixel 20. The first LEDs 201 in each light-emitting pixel 20 are arranged vertically, and the second LEDs 202 in each light-emitting pixel 20 are also arranged vertically. The scan line 30 formed by the common terminal electrical connection between the first LEDs 201 in each first LED row 210 is a column scan line, and the scan line 30 formed by the common terminal electrical connection between the second LEDs 202 in each second LED row 220 is also a column scan line. The first LEDs 201 in each third LED row 230... The non-common terminal electrical connection between the first LED bead 201 and the second LED bead 202 forms a row data line 40. The common or non-common terminals of two adjacent first LED bead 201 and second LED bead 202 in each third LED bead row 230 are adjacent. This allows at least the LED beads in the first LED bead row 210 or the second LED bead row 220 to be equipped with vias 101 on the PCB board 10, and each LED bead does not need to be equipped with a via 101 on the PCB board 10. Thus, without increasing the LED size or the width or thickness of the PCB board 10, the number of vias 101 on the PCB board 10 is reduced, thereby improving the yield of the PCB board 10 and reducing the production cost of the LED display.

[0051] In some embodiments, each scan line 30 is located on the surface of the PCB board 10, and each data line 40 is located on the bottom or inner layer of the PCB board 10. Specifically, the scan lines 30 formed by the common terminal electrical connection between each first LED 201 in each first LED row 210 are all located on the surface of the PCB board 10, and the scan lines 30 formed by the common terminal electrical connection between each second LED 202 in each second LED row 220 are also located on the surface of the PCB board 10. The data lines 40 formed by the non-common terminal electrical connection between the first LED 201 and the second LED 202 in each third LED row 230 are located on the bottom or inner layer of the PCB board 10.

[0052] In some embodiments, a plurality of adjacent first LED beads 201 in each first LED bead row 210 constitute a light-emitting pixel 20, and a plurality of adjacent second LED beads 202 in each second LED bead row 220 constitute a light-emitting pixel 20. Specifically, a light-emitting pixel 20 may be composed of multiple LED beads, and a light-emitting pixel 20 may contain one or more LED beads with the same or different light-emitting colors. The specifications, quantity, and color of the LED beads between two light-emitting pixels 20 may be exactly the same or not exactly the same, and their specific settings can be configured according to the actual application.

[0053] In some embodiments, in each of the third LED row 230, the first LED 201 and the second LED 202 are LEDs of the same color; the first LED 201 and the second LED 202 are LEDs of the same size; and the first LED 201 and the second LED 202 are any one of red, blue, and green LEDs. However, the embodiments of this application are not limited to this, and the first LED 201 and the second LED 202 can be LEDs of different sizes.

[0054] Specifically, in this embodiment, each light-emitting pixel 20 is identical, and each light-emitting pixel 20 is composed of red LED beads, blue LED beads, and green LED beads. The red LED beads, blue LED beads, and green LED beads are arranged vertically from top to bottom along the second direction, thereby making the left and right viewing angles of the LED display screen symmetrical, and maximizing the left and right viewing angles of the finished LED display screen.

[0055] Specifically, each light-emitting pixel 20 can be composed of red LED beads, blue LED beads, and green LED beads. The light-emitting pixels 20 formed by the first LED bead 201 and the second LED bead 202 on the PCB board 10 are also arranged in an array on the PCB board 10. In each light-emitting pixel 20, the red LED beads, blue LED beads, and green LED beads can be arranged vertically from top to bottom.

[0056] It should be noted that the first LED 201 and the second LED 202 in each third LED row 230 can be LEDs of the same size or different sizes. Only the common and non-common terminals of the second LEDs 202 in two adjacent first LED rows 210 and second LED rows 220 need to be configured as follows: Figure 3 The left and right sides can be swapped as shown, thus eliminating the need for at least one column of vias 101 on the PCB board 10.

[0057] In some embodiments, the non-common terminals of two adjacent first LEDs 201 and second LEDs 202 in each third LED row 230 are electrically connected on the surface of the PCB board 10. Specifically, when the common terminals of two adjacent first LEDs 201 and second LEDs 202 in each third LED row 230 are adjacent, if the corresponding first LED row 210 exists only once on the PCB board 10, then the first LED row 210 cannot be placed at the outermost edge of the array and must be arranged in the middle of the array; if the corresponding second LED row 220 exists only once on the PCB board 10, then the second LED row 220 cannot be placed at the outermost edge of the array and must be arranged in the middle of the array. In this case, the non-common terminals of two LEDs in the third LED row 230 can be connected. The non-common terminals of adjacent first LED beads 201 and second LED beads 202 are electrically connected on the surface of PCB board 10, thereby reducing the number of vias 101 on PCB board 10. When the non-common terminals of two adjacent first LED beads 201 and second LED beads 202 in each third LED bead row 230 are adjacent, the non-common terminals of two adjacent first LED beads 201 and second LED beads 202 in the third LED bead row 230 can be directly electrically connected on the surface of PCB board 10, thereby reducing the number of vias 101 on PCB board 10.

[0058] In some embodiments, such as Figures 3 to 5 As shown, the number of rows of the first LED bead row 210 and the number of rows of the second LED bead row 220 on the PCB board 10 can be equal or unequal. The first LED bead row 210 and the second LED bead row 220 can be arranged alternately on the PCB board 10, or they can be arranged without alternation. As long as the common or non-common terminals of two adjacent first LED beads 201 and second LED beads 202 in each third LED bead row 230 are adjacent, the number of vias 101 on the PCB board 10 can be reduced. Figure 3 The number of rows of the first LED bead row 210 is equal to the number of rows of the second LED bead row 220. The first LED bead row 210 and the second LED bead row 220 are arranged alternately on the PCB board 10. At this time, relative to Figure 1 This can eliminate half of the vias 101 on the PCB board 10; Figure 4 If the row number of the first LED row 210 is less than the row number of the second LED row 220, and the row number of the first LED row 210 is 'a', and the row number of the second LED row 220 is 'b', then relative to... Figure 1 The via 101 in row a can be omitted on PCB board 10; Figure 5If the row number of the first LED row 210 is greater than the row number of the second LED row 220, and the row number of the first LED row 210 is 'a', and the row number of the second LED row 220 is 'b', then relative to... Figure 1 The via 101 in row b can be omitted on PCB board 10.

[0059] In some embodiments, the non-common terminals of each of the first LED beads 201 in each of the third LED bead rows 230 are electrically connected through vias 101 on the PCB board 10. Specifically, as shown in the figure... Figure 3 As shown, when the non-common terminals of each first LED 201 in the third LED row 230 are electrically connected through vias 101 on the PCB board 10, it is only necessary to electrically connect the non-common terminal of the second LED 202 adjacent to the first LED 201 to the non-common terminal of the first LED 201 on the surface of the PCB board 10, so as to reduce the number of vias 101 on the PCB board 10.

[0060] In some embodiments, the non-common terminals of each of the second LED beads 202 in each of the third LED bead rows 230 are electrically connected through vias 101 on the PCB board 10. Specifically, as shown in the figure... Figure 6 As shown, when the non-common terminals of each second LED 202 in the third LED row 230 are electrically connected through vias 101 on the PCB board 10, it is only necessary to electrically connect the non-common terminal of the first LED 201 adjacent to the second LED 202 to the non-common terminal of the second LED 202 on the surface of the PCB board 10, so as to reduce the number of vias 101 on the PCB board 10.

[0061] In some embodiments, the non-common terminals of the first LED bead 201 and the second LED bead 202 in each of the third LED bead rows 230 are electrically connected through vias 101 on the PCB board 10. Specifically, as shown in... Figure 7 As shown, when the non-common terminals of the first LED 201 and the second LED 202 in the third LED row 230 are electrically connected through vias 101 on the PCB board 10, the non-common terminals of the second LED 202 adjacent to the first LED 201 are electrically connected to the non-common terminals of the first LED 201 on the surface of the PCB board 10; the non-common terminals of the first LED 201 adjacent to the second LED 202 are electrically connected to the non-common terminals of the second LED 202 on the surface of the PCB board 10, thereby reducing the number of vias 101 on the PCB board 10.

[0062] It can be understood that in the third LED row 230, one first LED 201 corresponds to a separate first LED row 210, and one second LED 202 corresponds to a separate second LED row 220. The first LED row 210 and the second LED row 220 are the arrangement of LEDs in the first direction, and the third LED row 230 is the arrangement of LEDs in the second direction.

[0063] It's understandable. Figures 3 to 7 The arrangement of the LED beads can be rotated 90 degrees in practical applications, that is... Figure 3-7 The column scan lines formed in the image become row scan lines, the row data lines become column data lines, and the LED beads in each luminous pixel 20 become horizontally arranged.

[0064] It is also understood that the LED beads 201 in the LED light board structure provided in the embodiments of the present invention can be packaged on the PCB board 10 in the form of COB or in the form of SMD. The choice can be made according to the specific situation in actual application, and this application does not make any specific limitation.

[0065] Based on the above explanation, it can be understood that the scan line 30 necessarily includes a portion located on the PCB board 10 and a portion located on the LED bead, the data line 40 necessarily includes a portion located on the PCB board 10, and the via 101 is used to connect the various parts of different film layers. Combining the above explanation, the structure of the PCB board 10 can be determined, and it provides... Figure 8 , Figure 9 The structure of PCB board 10 is described below. The following embodiments further illustrate the LED arrangement structure provided by the embodiments of the present invention in conjunction with the structure of PCB board 10.

[0066] Figure 9 (a) in the middle is Figure 8 An exploded view of the film layer containing the scan lines in the LED arrangement structure. Figure 9 (b) in the middle is Figure 8 An exploded view of the film layer containing the data lines in the LED arrangement structure. Figure 9 (c) in the middle is Figure 8 An exploded view of the film layer containing the non-common electrode connection line in the LED arrangement structure.

[0067] It should be noted that, in Figure 8 , Figure 9 In this embodiment, the non-common polarity connection line 511 and the common polarity connection line 512 are located in the same film layer, while the scan line 30, the data line 40, and the non-common polarity connection line 511 are located in different film layers. However, the embodiments of this application are not limited to this, for example, the non-common polarity connection line and the common polarity connection line are located in different film layers.

[0068] like Figures 3 to 9 As shown, an embodiment of the present invention provides an LED arrangement structure, which includes:

[0069] The PCB board 10 has a plurality of data lines 40 extending along a first direction, a plurality of scan lines 30 extending along a second direction, and a plurality of vias 101 disposed within its display area; the data lines 40 and the scan lines 30 are located on different layers of the PCB board 10, and the second direction intersects the first direction; the plurality of vias 101 includes a plurality of first vias 101a and a plurality of second vias 101b;

[0070] Multiple LED beads (e.g., first LED bead 201) are disposed on the PCB board. These LED beads are arranged in an array along the first direction and the second direction, forming multiple LED bead rows (e.g., third LED bead row 230) and multiple LED bead columns (e.g., first LED bead row 210). The LED bead rows extend along the first direction, and the LED bead columns extend along the second direction. Each LED bead row includes multiple LED bead groups (e.g., ... Figure 3 The first LED bead 201 and the second LED bead form an LED bead group, and each LED bead group includes two adjacent LED beads; the adjacent LED beads are arranged sequentially along the second direction to form a plurality of light-emitting pixels; the LED beads include common terminals and non-common terminals;

[0071] Within each LED row, the common terminal of all the LEDs is connected to a scan line 30 through a first via 101a;

[0072] Within each row of LED beads, all non-common terminals of the LED beads are connected to one data line 40;

[0073] In at least one row of LED beads, the non-common terminals of two LED beads in each group of LED beads are connected on the surface of the PCB board 10.

[0074] This invention enables the connection of two non-common terminals within each LED group in at least one LED row to the surface layer of a PCB board. This allows the two non-common terminals of the LEDs to be connected to the PCB board via a single via, thereby reducing the number of vias on the PCB board, improving PCB yield, and lowering PCB production costs.

[0075] Specifically, compared to related technologies where the non-common terminals of each LED bead are connected to the PCB board through vias, this invention connects the non-common terminals of two LED beads in each LED bead group on the surface of the PCB board. This reduces the number of vias and the number of connection points between the non-common terminals and the data lines, thereby reducing the risk of connection failure, improving the yield of the PCB board, and lowering the production cost of the PCB board.

[0076] In some embodiments, such as Figure 8 , Figure 9 As shown, the display area of ​​the PCB board 10 is further provided with a plurality of non-common polarity connection lines 511 extending along a first direction. The non-common polarity connection lines 511 and the data lines 40 are located on different layers of the PCB board 10, and the non-common polarity connection lines 511 and the scan lines 30 are located on different layers of the PCB board 10. Within each LED bead group, the non-common polarity terminals of two LED beads are connected to one non-common polarity connection line 511. By setting the non-common polarity connection lines, placing them on different layers from the data lines and scan lines, the size of a single trace can be reduced, thereby reducing the pixel size and correspondingly improving the resolution of the LED arrangement structure. Furthermore, connecting the non-common polarity terminals of two LED beads to one non-common polarity connection line reduces the number of vias in the PCB board and the LED arrangement structure, thereby improving the yield of the LED arrangement structure.

[0077] Specifically, such as Figure 3 , Figure 8 As shown, you can see that within an LED bead group, two LED beads (e.g.) Figure 3 If the non-common terminals of the first LED bead 201 and the second LED bead 202 are connected together, then the non-common terminals of the two LED beads can be connected by a non-common connection line 511, thereby reducing the number of vias and improving the yield of the LED arrangement structure.

[0078] In some embodiments, such as Figure 8 , Figure 9 As shown, the non-common polarity connection line 511 passes through the second via 101b and connects to the data line 40. By connecting the non-common polarity connection line to the data line through the second via, the data line can drive the LED beads through the non-common polarity connection line, enabling the normal operation of the LED arrangement structure.

[0079] In some embodiments, within each LED bead group, the non-common connection line is connected to one data line through at least one second via. Specifically, the non-common connection line can be connected to one data line through one second via, two second vias, or three vias.

[0080] In some embodiments, such as Figure 8 , Figure 9 As shown, within each LED bead group, the non-common electrode connection line 511 is connected to a data line 40 through at least one and at most two second vias 101b. By connecting the non-common electrode connection line to a data line through one second via, the number of second vias in the PCB board is reduced, thereby reducing the space occupied by a single pixel, improving the resolution of the LED arrangement structure, and reducing the number of vias can reduce damage to the various film layers of the PCB board during the process, avoiding the effects of water and oxygen intrusion, electrical changes, etc., and improving the yield of the PCB board. By connecting the non-common electrode connection line to a data line through two second vias, if the trace in one second via breaks, the trace in the other second via can still conduct two LED beads, thereby improving the yield of the PCB board.

[0081] Specifically, Figure 8 The diagram shows that within each of the LED bead groups, the non-common connection line 511 is connected to a data line via a second via 101b.

[0082] Connecting scan lines to the common terminals of each LED bead via vias results in an excessive number of vias, larger pixel sizes, and lower yield of the LED arrangement structure. In some embodiments, such as... Figure 3 , Figure 8 As shown, the common terminal of all LED beads in the light-emitting pixel 20 is connected to the scan line 30 through a first via 101a. By connecting the common terminal of all LED beads in the light-emitting pixel to the scan line through a single via, the number of vias can be reduced, thereby reducing the pixel size, improving the resolution of the LED arrangement structure, and increasing the yield of the LED arrangement structure. In some embodiments, such as Figure 3 , Figure 8 , Figure 9As shown, within each LED row, the common terminals of all LEDs in at least two adjacent light-emitting pixels 20 are connected to the scan line 30 through a first via 101a. By connecting the common terminals of all LEDs in two adjacent light-emitting pixels to the scan line through a first via, the number of vias on the PCB board can be reduced, thereby reducing the pixel size, improving the resolution of the LED arrangement structure, and increasing the yield of the LED arrangement structure.

[0083] It should be noted that, in Figure 8 , Figure 9 Although only the first terminal 513a or the second terminal 513b is shown in some terminal pairs 513, it is understood that the first terminal 513a will have a corresponding second terminal 513b to form a terminal pair 513, and the second terminal 513b will have a corresponding first terminal to form 513a. Therefore, in the following embodiments, the first terminal 513a or the second terminal 513b will still be described as a part of a terminal pair 513. Accordingly, Figure 8 , Figure 9 The terminal pairs 513 shown are the third and fourth column terminal pairs, and the scan lines shown are the second, third, fourth and fifth scan lines.

[0084] It should be noted that, Figure 9 The example given is the third and fourth terminal pairs in the second row. Therefore, o is 3. However, the embodiments of this application are not limited to this. Depending on the position of the terminal pair, o can be a corresponding value.

[0085] At the same time, such as Figures 3 to 9 As shown, an embodiment of the present invention provides an LED arrangement structure, which includes a PCB board 10 for mounting multiple LED beads. The PCB board 10 includes:

[0086] M data lines 40, the data lines 40 extending along a first direction, M≥3, and are integers;

[0087] N scan lines 30, the scan lines 30 extending along a second direction, N≥2 and being an integer; the second direction intersects the first direction;

[0088] Multiple terminal pairs 513 are located on the surface of the PCB board 10. Each terminal pair 513 includes a first terminal 513a and a second terminal 513b. The multiple terminal pairs 513 form M rows of terminal pairs 513 and N columns of terminal pairs 513. The first terminal 513a of all terminal pairs 513 in the i-th row of terminal pairs 513 is connected to the i-th data line 40, and the second terminal 513b of all terminal pairs 513 in the j-th column of terminal pairs 513 is connected to the j-th scan line 30. For example, in Figure 8 , Figure 9 In the second row of terminal pairs 513, the first terminal 513a of all terminal pairs 513 is connected to the second data line, and the second terminal 513b of all terminal pairs 513 in the third column of terminal pairs 513 is connected to the third scan line.

[0089] In the i-th row of terminal pairs 513, the first terminal 513a of the o-th terminal pair 513 is connected to the first terminal 513a of the (o+1)-th terminal pair 513 on the surface of the PCB board, where o is either odd or even; for example, in Figure 8 , Figure 9 In the second row of terminal pairs, the first terminal 513a of the third terminal pair 513 is connected to the first terminal 513a of the fourth terminal pair 513 on the surface of the PCB board 10.

[0090] This invention provides an LED arrangement structure. By aligning the first terminal of one terminal pair with the first terminal of the next terminal pair in a row, two LED beads can be connected through the first terminals of the two terminal pairs. The two LED beads can be connected to the PCB board through a via, thereby reducing the number of vias on the PCB board, improving the PCB board yield, and reducing the PCB board production cost.

[0091] In some embodiments, such as Figure 8 , Figure 9 As shown, the PCB board 10 further includes an array of M*N / 2 non-common polarity connection lines 511, where M*N / 2 is an integer. The non-common polarity connection lines 511 extend along a first direction and are located on the surface layer of the PCB board 10. The scan line 30 is located on the inner or bottom layer of the PCB board 10. The data line 40 is located on the film layer between the non-common polarity connection lines 511 and the scan line 30. In the terminal pair 513 of the i-th row, the first terminal 513a of the o-th terminal pair 513 is connected to the first terminal 513a of the o+1-th terminal pair through the p-th non-common polarity connection line 511 of the i-th row. When o is even, p is o / 2; when o is odd, p is (o+1) / 2. By connecting the first terminal of the two terminals through a non-common polarity connection line, two LED beads can be connected through the first terminal of the two terminals. The two LED beads can be connected to the PCB board through a via, thereby reducing the number of vias on the PCB board, thus improving the PCB board yield and reducing the PCB board production cost. However, the embodiments of this application are not limited to this; the scan line can be located in the film layer between the non-common polarity connection line and the data line.

[0092] Specifically, for example Figure 8 , Figure 9The diagram shows the third and fourth terminal pairs. The first terminal 513a of the third terminal pair 513 in the second row is connected to the second non-common polarity connection line 511 in the second row. Figure 8 (The first non-common connection line is not shown in the diagram) connects to the first terminal 513a of the fourth terminal pair.

[0093] In some embodiments, such as Figure 8 , Figure 9 As shown, the p-th non-common polarity connection line 511 in the i-th row is connected to the i-th data line 40 through at least one and at most two vias. Connecting the non-common polarity connection line to the data line through one via reduces the number of vias on the PCB board, thereby reducing the space occupied by a single pixel, improving the resolution of the LED arrangement structure, and reducing the number of vias can reduce damage to the various film layers of the PCB board during the manufacturing process, avoiding the effects of water and oxygen intrusion, electrical changes, etc., and improving the PCB board yield. By connecting the non-common polarity connection line to a data line through two vias, if the trace in one via breaks, the trace in the other via can still conduct two LED beads, thereby improving the PCB board yield.

[0094] Specifically, such as Figure 8 , Figure 9 As shown, the second non-common connection line 511 in the second row is connected to the second data line 40 through a second via 101b. However, the embodiments of this application are not limited to this, and the non-common connection line can be connected to the data line through multiple vias.

[0095] In some embodiments, such as Figure 8 , Figure 9 As shown, the PCB board 10 also includes an array of M*N / 3 common-pole connection lines 512, where M*N / 3 is an integer. The common-pole connection lines 512 are located on the surface layer of the PCB board 10. The j-th column of terminal pairs 513 includes multiple repeating units. The second terminals 513b of all terminal pairs 513 within the same repeating unit are connected through one common-pole connection line 512. The common-pole connection line 512 is connected to the j-th scan line 30 through a via. By connecting the second terminals of all terminal pairs within the repeating unit through one common-pole connection line, and connecting the common-pole connection line to the scan line through a via, the common terminals of all LED beads of the light-emitting pixel are connected to the scan line through one via. This reduces the number of vias, thereby reducing the pixel size, improving the resolution of the LED arrangement structure, and improving the yield of the LED arrangement structure.

[0096] Specifically, two common-pole connection lines within two adjacent repeating units can be connected to the scan line through the same via.

[0097] In practice, each of the above units or structures can be implemented as an independent entity or can be arbitrarily combined to be implemented as the same or several entities. For specific implementation of each of the above units or structures, please refer to the previous embodiments, which will not be repeated here.

[0098] The above provides a detailed description of an LED arrangement structure provided by the embodiments of the present invention. Specific examples have been used to illustrate the principles and embodiments of the present invention. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in specific embodiments and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. An LED arrangement structure, characterized in that, include: A PCB board, wherein a plurality of data lines extending along a first direction, a plurality of scan lines extending along a second direction, and a plurality of vias are provided in the display area of ​​the PCB board; the data lines and the scan lines are located on different layers of the PCB board, and the second direction intersects the first direction; the plurality of vias includes a plurality of first vias and a plurality of second vias; Multiple LED beads are disposed on the PCB board, and the multiple LED beads are arranged in an array in the first direction and the second direction to form multiple LED bead rows and multiple LED bead columns. The LED bead rows extend along the first direction, and the LED bead columns extend along the second direction. Each LED bead row includes multiple LED bead groups, and each LED bead group includes two adjacent LED beads. The adjacent multiple LED beads are arranged sequentially along the second direction to form a plurality of light-emitting pixels. The LED beads include common terminals and non-common terminals. Within each LED row, the common terminal of all the LEDs is connected to a scan line through a first via. Within each row of LED beads, all non-common terminals of the LED beads are connected to one data line; In at least one row of LED beads, the non-common terminals of two LED beads in each group of LED beads are connected on the surface of the PCB board.

2. The LED arrangement structure according to claim 1, characterized in that, The display area of ​​the PCB board is also provided with a number of non-common polarity connection lines extending along the first direction. The non-common polarity connection lines and the data lines are located on different layers of the PCB board, and the non-common polarity connection lines and the scan lines are located on different layers of the PCB board. In each LED lamp bead group, the non-common polarity terminals of two LED lamp beads are connected to one non-common polarity connection line.

3. The LED arrangement structure according to claim 2, characterized in that, The non-common polarity connection line passes through the second via and connects to the data line.

4. The LED arrangement structure according to claim 3, characterized in that, Within each LED bead group, the non-common connection line is connected to one of the data lines through at least one second via.

5. The LED arrangement structure according to claim 1, characterized in that, The common terminal of all LED beads in the light-emitting pixel is connected to the scan line through a first via.

6. The LED arrangement structure according to claim 1, characterized in that, Within each LED row, the common terminals of all LEDs in at least two adjacent light-emitting pixels are connected to the scan line through a first via.

7. An LED arrangement structure, characterized in that, Includes a PCB board for mounting multiple LED beads, the PCB board comprising: M data lines, the data lines extending along a first direction, M≥3, and are integers; N scan lines, the scan lines extending along a second direction, where N≥2 and is an integer; the second direction intersects the first direction; Multiple terminal pairs are located on the surface of the PCB board. Each terminal pair includes a first terminal and a second terminal. The multiple terminal pairs form M rows of terminal pairs and N columns of terminal pairs. The first terminal of all terminal pairs in the i-th row is connected to the i-th data line, and the second terminal of all terminal pairs in the j-th column is connected to the j-th scan line. In the terminal pair of the i-th row, the first terminal of the o-th terminal pair is connected to the first terminal of the (o+1)-th terminal pair on the surface of the PCB board, where o is an odd or even number; The PCB board further includes an array of M*N / 2 non-common polarity connection lines, where M*N / 2 is an integer. The non-common polarity connection lines extend along a first direction and are located on the surface layer of the PCB board. The scan lines are located on the inner or bottom layer of the PCB board, and the data lines are located in a film layer between the non-common polarity connection lines and the scan lines. In the terminal pair of the i-th row, the first terminal of the o-th terminal pair is connected to the first terminal of the (o+1)-th terminal pair through the p-th non-common polarity connection line of the i-th row. When o is even, p is o / 2; when o is odd, p is (o+1) / 2. Alternatively, the PCB board may further include an array of M*N / 3 common-pole connection lines, where M*N / 3 is an integer, and the common-pole connection lines are located on the surface of the PCB board; the j-th column of terminal pairs includes multiple repeating units, and the second terminals of all terminal pairs within the same repeating unit are connected through one of the common-pole connection lines, and the common-pole connection lines are connected to the j-th scan line through vias.

8. The LED arrangement structure according to claim 7, characterized in that, The p-th non-common connection line in the i-th row is connected to the i-th data line through at least one via.

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