Power consumption detection component and method, heating component, target device

Abstract

This application provides a power consumption detection component and method, a heating component, and a target device. The power consumption detection component is detachably mounted on a heating component, which is used to heat the target device. The power consumption detection component includes a main body and an electronic unit detachably mounted on the main body. The electronic unit includes a power supply module, a first detection module, and a control module that are signal-connected to each other. The control module is used to obtain the resistance value and voltage value of the heating component through the first detection module, and to detect the power consumption of the heating component based on the resistance and voltage values. This application solves the problem of low power consumption detection efficiency of heating components in related technologies, achieving the effect of improving the power consumption detection efficiency of heating components.

Description

Technical Field

[0001] This application relates to the field of computers, and more specifically, to a power consumption detection component and method, a heating component, and a target device. Background Technology

[0002] Edge devices typically face a wider temperature range than general-purpose devices. For example, in low-temperature environments (-5 to -40 degrees Celsius), heating elements are usually added to heat the components. Once the temperature is heated above 0 degrees Celsius, the minimum temperature requirement of the device can be met before it can be turned on.

[0003] Current solutions use temperature sensors to detect the heating temperature of the equipment to determine the power consumption of the heating element. However, attaching the temperature sensor directly to the heating element complicates the manufacturing process, increases the manufacturing steps for the heating element, and raises costs. Furthermore, placing the temperature sensor on the heated element requires a considerable heating time to detect a temperature rise. In practical applications, during production, the heating element is typically activated at normal operating temperatures to monitor equipment heating. Activating the heating element at high temperatures can cause localized hotspots, reducing equipment lifespan. On the other hand, production lines require high efficiency; typically, it takes 10 to 20 minutes for the equipment to heat to normal operating temperature. Such a long detection time also impacts production line efficiency.

[0004] There is no effective solution yet to address the problem of low power consumption detection efficiency of heating components in related technologies. Summary of the Invention

[0005] This application provides a power consumption detection component and method, a heating component, and a target device to at least solve the problem of low power consumption detection efficiency of heating components in related technologies.

[0006] According to one embodiment of this application, a power consumption detection component is provided. The power consumption detection component is suitable for detachable installation on a heating component for heating a target device. The power consumption detection component includes a body and an electronic unit detachably installed on the body. The electronic unit includes a power supply module, a first detection module, and a control module that are signal-connected to each other. The control module is used to obtain the resistance value and voltage value of the heating component through the first detection module, and to detect the power consumption of the heating component based on the resistance value and the voltage value.

[0007] In an exemplary embodiment, the electronic unit further includes an on / off adjustment structure disposed within the electronic unit and connected to the control module. Under the control of the control module, the on / off adjustment structure at least adjusts the on / off state between the power supply module and the heating component.

[0008] In an exemplary embodiment, the on / off adjustment structure includes: a first on / off adjustment structure connected to a current-blocking element, the current-blocking element being connected to the heating component; and a second on / off adjustment structure. When the first on / off adjustment structure is in the on / off state, connecting the power supply module and the heating component, the first detection module detects a first voltage value of the heating component and a first resistance value of the current-blocking element, and the control module calculates a second resistance value of the heating component based on the first voltage value and the first resistance value. When the first on / off adjustment structure is in the off state, and the second on / off adjustment structure is in the on / off state, connecting the power supply module and the heating component, the first detection module detects a second voltage value of the heating component, and the control module calculates the heating power of the heating component based on the second voltage value and the second resistance value, and detects the power consumption of the heating component based on the heating power.

[0009] In one exemplary embodiment, the electronic unit further includes a first connection interface, which includes a power-on interface and a communication interface, wherein the power supply module and the heating component are connected through the power-on interface, and the first detection module and the heating component are connected through the communication interface.

[0010] In one exemplary embodiment, the electronic unit further includes a second connection interface, wherein the control module is configured to transmit the power consumption of the heating component to an external device through the second connection interface.

[0011] In an exemplary embodiment, the electronic unit further includes a second detection module connected to the control module. The second detection module is used to detect the ambient temperature of the environment where the target device is located. When the ambient temperature is less than a first preset threshold, the control module is used to control the power supply module to conduct to the heating component so as to heat the target device through the heating component. When the temperature of the target device is greater than the second preset threshold, the control module is also used to control the target device to start.

[0012] According to another embodiment of this application, a power consumption detection method is provided, comprising: when a heating component and a power supply module are turned on, acquiring the resistance value and the voltage value of the heating component, wherein the heating component is used to heat a target device; and detecting the power consumption of the heating component based on the resistance value and the voltage value.

[0013] In one exemplary embodiment, when the heating component and the power supply module are turned on, the acquisition of the resistance value and voltage value of the heating component includes: when the first on / off adjustment structure turns on the power supply module and the heating component, acquiring the first voltage value of the heating component detected by the first detection module and the first resistance value of the current blocking element, wherein the current blocking element is disposed between the first on / off adjustment structure and the heating component; calculating the second resistance value of the heating component based on the first voltage value and the first resistance value; and when the first on / off adjustment structure is in the off state and the second on / off adjustment structure turns on the power supply module and the heating component, acquiring the second voltage value of the heating component detected by the first detection module.

[0014] In one exemplary embodiment, detecting the power consumption of the heating component based on the resistance value and the voltage value includes: calculating the heating power of the heating component based on the second voltage value and the second resistance value; and detecting the power consumption of the heating component based on the heating power.

[0015] In one exemplary embodiment, the method further includes: obtaining the ambient temperature of the environment where the target device is located, detected by the second detection module; when the ambient temperature is less than a first preset threshold, controlling the power supply module to connect with the heating component to heat the target device through the heating component; and when the temperature of the target device is greater than the second preset threshold, controlling the target device to start.

[0016] According to another embodiment of this application, a heating component is also provided, including a heating element and the aforementioned power consumption detection component, wherein the heating element includes a thermally conductive resistor.

[0017] According to yet another embodiment of this application, a target device is also provided, including the heating component described above.

[0018] According to yet another embodiment of this application, a computer-readable storage medium is also provided, wherein a computer program is stored in the computer-readable storage medium, and the computer program is configured to perform the steps in any of the above method embodiments when it is run.

[0019] According to yet another embodiment of this application, an electronic device is also provided, including a memory and a processor, wherein the memory stores a computer program and the processor is configured to run the computer program to perform the steps in any of the above method embodiments.

[0020] This application provides a solution where the power consumption detection component is detachably mounted on a heating component used to heat a target device. The component includes a main body and an electronic unit detachably mounted on the main body. The electronic unit comprises a power supply module, a first detection module, and a control module interconnected by signals. The control module is used to obtain the resistance and voltage values ​​of the heating component through the first detection module and to detect the power consumption of the heating component based on these values. This allows the power consumption of the heating component to be calculated simply by detecting its resistance and voltage values, eliminating the need for prolonged monitoring using sensors. Therefore, this solves the problem of low power consumption detection efficiency in related technologies, thereby improving the efficiency of power consumption detection for heating components. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the power consumption detection component according to an embodiment of this application;

[0022] Figure 2 This is a schematic diagram of the structure of the heating element according to an embodiment of this application;

[0023] Figure 3 This is a schematic diagram of the specific structure of the power consumption detection component according to an embodiment of this application;

[0024] Figure 4 This is a schematic diagram illustrating the working principle of the power consumption detection component according to an embodiment of this application;

[0025] Figure 5 This is a hardware structure block diagram of a mobile terminal for a power consumption detection method according to an embodiment of this application;

[0026] Figure 6 This is a flowchart of a power consumption detection method according to an embodiment of this application;

[0027] Figure 7 This is a flowchart illustrating the resistance value of the heating element and the voltage value of the heating component obtained according to embodiments of this application.

[0028] Figure 8 This is a flowchart of heating the target device according to an embodiment of this application. Detailed Implementation

[0029] The embodiments of this application will be described in detail below with reference to the accompanying drawings and examples.

[0030] It should be noted that the terms "first," "second," etc., in the specification, claims, and drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0031] First, the relevant technologies involved in this invention will be explained:

[0032] CPU: Central Processing Unit;

[0033] ADC: Analog to Digital Converter;

[0034] PCB (Printed Circuit Board) is a type of printed circuit board.

[0035] To address the problem in related technologies where power consumption detection of heating components relies solely on temperature measurement, resulting in low efficiency, this embodiment provides a power consumption detection component, such as... Figure 1 The diagram shown is a structural schematic of the power consumption detection component in this embodiment. The power consumption detection component is suitable for detachable installation on the heating component, which is used to heat the target device. The power consumption detection component includes a main body and an electronic unit detachably installed on the main body. The electronic unit includes a power supply module, a first detection module, and a control module that are interconnected by signals. The control module is used to obtain the resistance value and voltage value of the heating component through the first detection module, and to detect the power consumption of the heating component based on the resistance value and voltage value.

[0036] In this embodiment, the heating assembly includes a heating element, which is made of a thermally conductive resistor. For example, such as Figure 2 As shown, the thermal resistor can be a resistance wire, with its two ends serving as the input to the heating element. When voltage is applied to the positive and negative terminals of the power supply, the heating element heats up. The heating assembly is detachably connected to the power consumption detection assembly via a connector, which can be a multi-pin connector, such as a 3-pin connector. The positive and negative terminals of the power supply are connected to the two ends of the resistance wire through the connector, energizing the heating element for heat conduction. In this embodiment, the middle portion of the resistance wire is used as a tap, leading out a detection line that connects to the detection module in the power consumption detection assembly via the connector. The detection module detects the operating status of the heating element through the detection line.

[0037] In this embodiment, as Figure 3As shown, the main body of the power consumption detection component can be a PCB board, with the electronic unit serving as the main control board. The target device can be the component to be heated, such as an edge server device. Edge servers typically face applications in a wider temperature range than general-purpose servers, for example, in low-temperature environments ranging from -5°C to -40°C, requiring heating to above 0°C before powering on. During server heating, a heating element is attached to the device to be heated, and the heating element's cable is connected to the PCB board via a connector. The main control board for the heating element is soldered onto the PCB board, controlling the heating of the heating element and performing detection functions.

[0038] This embodiment can be applied in scenarios where heating elements are needed to heat the target device in low-temperature environments. It can also be applied in scenarios where power consumption of heating components is detected in normal-temperature environments. However, in existing technologies, sensors are attached to the heating element to detect its heating temperature and limit its maximum temperature. Since the heating element temperature is very high, the temperature of the heated device may not rise quickly enough, making it impossible to detect the actual temperature of the target device. Testing the performance of the heating element requires a long heating time to detect the temperature rise. Furthermore, in the production process of heating components, there are no high-low temperature test chambers on the production line. The operating temperature of the production line is usually ambient temperature, around 20 degrees Celsius. If the heating element is used to heat the target device for a long time at this temperature, hot spots may appear in localized areas, reducing the lifespan of the target device. On the other hand, production lines require high production efficiency; the time it takes for the equipment to heat to normal temperature is typically ten to twenty minutes. The long testing time results in low production efficiency. Therefore, this method is not suitable for performance testing of heating components during the production process. This embodiment calculates the power consumption of the heating component simply by detecting its resistance and voltage values, eliminating the need for prolonged monitoring with sensors. Therefore, it solves the problem of low power consumption detection efficiency in related technologies, thereby improving the efficiency of power consumption detection for heating components.

[0039] In an exemplary embodiment, the electronic unit further includes: an on / off adjustment structure disposed within the electronic unit, connected to a control module, and under the control of the control module, the on / off adjustment structure at least adjusts the on / off state between the power supply module and the heating component. In this embodiment, the on / off adjustment structure includes: a first on / off adjustment structure connected to a current-blocking element, the current-blocking element being connected to the heating component; and a second on / off adjustment structure. When the first on / off adjustment structure connects the power supply module and the heating component, a first detection module detects a first voltage value of the heating component and a first resistance value of the current-blocking element, and a control module calculates a second resistance value of the heating component based on the first voltage value and the first resistance value. When the first on / off adjustment structure is in an off state and the second on / off adjustment structure connects the power supply module and the heating component, the first detection module detects a second voltage value of the heating component, and the control module calculates the heating power of the heating component based on the second voltage value and the second resistance value, and detects the power consumption of the heating component based on the heating power. Optionally, the first and second on / off adjustment structures can be switches or devices capable of controlling current transmission, such as diodes. For example, ... Figure 4 As shown, the first on / off adjustment structure is switch 1, the second on / off adjustment structure is switch 2, the control module is MCU, the power supply module is Vdd, the current-impeding element is a resistor, and the detection module is ADC. When Vdd is turned on, it supplies power to the MCU. The MCU controls switch 1 to close, and Vdd supplies power to the heating component. Due to the current limitation of the resistor, the current through the heating component is relatively small. The ADC samples the voltage of the heating component to obtain a first voltage value. Since the first resistance value is known in advance, the MCU can calculate the second resistance value of the heating component based on the first voltage value and the first resistance value. After the ADC samples the voltage of the heating component, the MCU controls switch 1 to open and controls switch 2 to close. After switch 1 is closed, Vdd supplies power to the heating component, and the heating component is in the normal heating stage. The ADC samples the voltage of the heating component to obtain a second voltage value. After the ADC samples the voltage of the heating component, the MCU controls switch 2 to open and calculates the current value of the heating component based on the second voltage value and the second resistance value. Therefore, the heating power of the heating component can be calculated based on the current value, thus calculating the power consumption of the heating component.

[0040] In this embodiment, by controlling the closing of switches 1 and 2 via the MCU, the voltage value of the heating element can be quickly acquired without temperature detection. The power consumption of the heating element can be calculated rapidly without causing any damage to the equipment. Furthermore, this detection method utilizes the calibrated equivalent resistance of the heating element for current detection, which is more cost-effective and has better integration compared to using a separate external resistor.

[0041] In one exemplary embodiment, the electronic unit further includes: a first connection interface, the connection interface including a power-on interface and a communication interface, wherein the power supply module and the heating component are connected via the power-on interface, and the first detection module and the heating component are connected via the communication interface. Figure 4 As shown, the first connection interface is set in 3PIN, which includes three interfaces: two power interfaces (positive and negative terminals of the power supply) for transmitting electrical energy; and one communication interface (the interface of the detection line) for transmitting voltage signals and control commands.

[0042] In this embodiment, the electronic unit and the heating component are connected via a first connection interface, enabling a detachable connection. This allows the power consumption detection component to detect the power consumption of various types of heating components, expanding the detection range. It also facilitates production and assembly.

[0043] In one exemplary embodiment, the electronic unit further includes a second connection interface, wherein the control module is configured to transmit the power consumption of the heating component to an external device via the second connection interface. Figure 4 As shown, the second connection interface can be an operation and maintenance communication interface, and the external device can be a server or other storage device. For example, if the external device is a server, the server transmits control commands to the MCU through the operation and maintenance communication interface to control the MCU's control of switches 1 and 2. The MCU can also transmit the power consumption information of the heating component to the server through the operation and maintenance communication interface.

[0044] This embodiment allows maintenance personnel to obtain the power consumption of the heating component in a timely manner through the second external connection interface, and to control the heating component accordingly.

[0045] In one exemplary embodiment, the electronic unit further includes: a second detection module connected to the control module, the second detection module being used to detect the ambient temperature of the environment where the target device is located, wherein, when the ambient temperature is less than a first preset threshold, the control module is used to control the power supply module to connect with the heating component to heat the target device through the heating component, and when the temperature of the target device is greater than the second preset threshold, it is also used to control the target device to start. Figure 4 As shown, the second detection module may include an ambient temperature sensor to detect the temperature of the target device. For example, when the target device is in a low-temperature environment, the MCU controls switch 2 to turn on, activating the heating component. The heating component heats the target device, and when the target device is heated to its normal startup temperature, the MCU controls the target device to start. When the target device is in a normal-temperature environment and heating is not required, the MCU controls switches 1 and 2 to alternately close, detecting the voltage value of the heating component and its power consumption.

[0046] This embodiment can control the start-up of the heating component in a timely manner by detecting the environment in which the target device is located.

[0047] In one exemplary embodiment, the electronic unit may further include a prompting module connected to the MCU and receiving control commands from the MCU. The prompting module may include indicator lights or an audible prompting device. For example, when the prompting module includes indicator lights, the MCU controls the indicator lights to provide prompts according to different scenarios. In scenarios where the target device is in an extreme environment requiring heating, the indicator lights flash to indicate that the heating component has been activated and is heating the target device; it is not recommended to activate the target device during the heating phase. In scenarios where the heating component needs to be detected, the indicator lights display different colors to indicate that the heating component is being detected, and after detection, the indicator lights display different colors based on the detection results. When the detection is normal, the indicator lights display green; when an abnormality occurs, the indicator lights display red.

[0048] The methods and embodiments provided in this application can be executed on a mobile terminal, computer terminal, or similar computing device. Taking running on a mobile terminal as an example, Figure 5 This is a hardware structure block diagram of a mobile terminal according to an embodiment of the power consumption detection method of this application. Figure 5 As shown, a mobile terminal may include one or more ( Figure 5 Only one is shown in the diagram. A processor 502 (which may include, but is not limited to, a microprocessor MCU or a programmable logic device FPGA, etc.) and a memory 504 for storing data are also shown. The mobile terminal may further include a transmission device 506 for communication functions and an input / output device 508. Those skilled in the art will understand that... Figure 5 The structure shown is for illustrative purposes only and does not limit the structure of the mobile terminal described above. For example, the mobile terminal may also include components that are more... Figure 5 The more or fewer components shown, or having the same Figure 5 The different configurations shown.

[0049] The memory 504 can be used to store computer programs, such as application software programs and modules, like the computer program corresponding to the power consumption detection method in this embodiment. The processor 502 executes various functional applications and data processing by running the computer program stored in the memory 504, thus implementing the aforementioned method. The memory 504 may include high-speed random access memory, and may also include non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some instances, the memory 504 may further include memory remotely located relative to the processor 502, and these remote memories can be connected to the mobile terminal via a network. Examples of such networks include, but are not limited to, the Internet, corporate intranets, local area networks, mobile communication networks, and combinations thereof.

[0050] Transmission device 506 is used to receive or send data via a network. Specific examples of the network described above may include a wireless network provided by the mobile terminal's communication provider. In one example, transmission device 506 includes a Network Interface Controller (NIC), which can connect to other network devices via a base station to communicate with the Internet. In another example, transmission device 506 may be a Radio Frequency (RF) module used for wireless communication with the Internet.

[0051] This embodiment provides a power consumption detection method. Figure 6 This is a flowchart of a power consumption detection method according to an embodiment of this application, such as... Figure 6 As shown, the process includes the following steps:

[0052] Step S602: When the heating component and the power supply module are turned on, obtain the resistance value and voltage value of the heating component, wherein the heating component is used to heat the target device;

[0053] Step S604: Detect the power consumption of the heating component based on the resistance and voltage values.

[0054] The entity executing the above steps may be a terminal, a server, a specific processor set in the terminal or server, or a processor or processing device set relatively independently of the terminal or server (e.g., MCU), but is not limited thereto.

[0055] In this embodiment, the heating assembly includes a heating element, which is made of a thermally conductive resistor. For example, such as Figure 2As shown, the thermal resistor can be a resistance wire, with its two ends serving as the input to the heating element. When voltage is applied to the positive and negative terminals of the power supply, the heating element heats up. The heating assembly is detachably connected to the power consumption detection assembly via a connector, which can be a multi-pin connector, such as a 3-pin connector. The positive and negative terminals of the power supply are connected to the two ends of the resistance wire through the connector, energizing the heating element for heat conduction. In this embodiment, the middle portion of the resistance wire is used as a tap, leading out a detection line that connects to the detection module in the power consumption detection assembly via the connector. The detection module detects the operating status of the heating element through the detection line.

[0056] The target device can be a component to be heated, such as an edge server. Edge servers typically operate in environments with a wider temperature range than general-purpose servers, for example, in low-temperature environments ranging from -5°C to -40°C. The server needs to be heated to above 0°C before being powered on. During heating, a heating element is attached to the component to be heated. The heating element's cable is connected to a PCB board via a connector. A main control board for the heating element is soldered onto the PCB board. This main control board controls the heating of the heating element and also provides a function for detecting the heating element's temperature.

[0057] This embodiment can be applied in scenarios where a heating element needs to be activated to heat the target device in a low-temperature environment. It can also be applied in scenarios where power consumption of the heating component is detected in a normal-temperature environment. For example, in scenarios where power consumption of the heating component is detected, only the resistance and voltage values ​​of the heating component need to be detected to calculate the power consumption, without the need for long-term monitoring by a sensor. Therefore, it can solve the problem of low power consumption detection efficiency of heating components in related technologies, thereby improving the efficiency of power consumption detection for heating components.

[0058] In an exemplary embodiment, when the heating component and the power supply module are turned on, the acquisition of the resistance value and voltage value of the heating component includes: when the first on / off adjustment structure turns on the power supply module and the heating component, acquiring the first voltage value of the heating component detected by the first detection module and the first resistance value of the current-blocking element, wherein the current-blocking element is disposed between the first on / off adjustment structure and the heating component; calculating the second resistance value of the heating component based on the first voltage value and the first resistance value; and acquiring the second voltage value of the heating component detected by the first detection module when the first on / off adjustment structure is in the off state and the second on / off adjustment structure turns on the power supply module and the heating component. In this embodiment, the first on / off adjustment structure and the second on / off adjustment structure can be switches or devices that can control current transmission, such as diodes. When the first on / off adjustment structure is switch 1, the second on / off adjustment structure is switch 2, the control module is an MCU, the power supply module is Vdd, the current-blocking element is a resistor, and the detection module is an ADC, the acquired resistance value of the heating element and voltage value of the heating component are as follows: Figure 7 As shown, the specific steps include the following:

[0059] After S701 and Vdd are enabled, power is supplied to the main control board MCU, and the MCU is started.

[0060] S702, the MCU controls switch 1 to close, and Vdd supplies power to the heating element; due to the current limitation of the resistor, the current through the heating element is relatively small;

[0061] S703, the ADC samples the voltage of the heating element to obtain the first voltage value X;

[0062] S704, since the first resistance value R1 of the resistor is known in advance, the MCU can calculate the second resistance value R of the heating element based on the first voltage value X and the first resistance value R1. The calculation formula includes: R = R1 * X / (Vdd - X).

[0063] S705: After the ADC samples the voltage of the heating element, the MCU controls switch 1 to open and switch 2 to close.

[0064] S706, after switch 1 is closed, Vdd supplies power to the heating element, and the heating element is in the normal heating stage. The ADC samples the voltage of the heating element to obtain the second voltage value X2.

[0065] S707, after the ADC samples the voltage of the heating element, the MCU controls switch 2 to open and calculates the current value I of the heating element based on the second voltage value X2 and the second resistance value R. The calculation formula includes: I = X2 / R.

[0066] S708, calculate the heating power P of the heating element based on the current value. The calculation formula includes: P = Vdd * I;

[0067] S709: If the power P is equal to the power of the heating element device or within the allowable error range (the allowable error range can be 10% of the heating element power), then the heating element is deemed to be functioning well; otherwise, an abnormality in the heating element is reported.

[0068] In this embodiment, by controlling the closing of switches 1 and 2 via the MCU, the voltage value of the heating element can be quickly acquired without temperature detection. The power consumption of the heating element can be quickly calculated without causing any damage to the equipment noise.

[0069] In one exemplary embodiment, detecting the power consumption of a heating component based on a resistance value and a voltage value includes: calculating the heating power of the heating component based on a second voltage value and a second resistance value; and detecting the power consumption of the heating component based on the heating power. In this embodiment, the specific formulas for calculating the heating power of the heating component based on the second voltage value and the second resistance value, and for detecting the power consumption of the heating component based on the heating power, are as described above and will not be repeated here.

[0070] In one exemplary embodiment, the method further includes: acquiring the ambient temperature of the environment where the target device is located, detected by the second detection module; controlling the power supply module to connect to the heating component when the ambient temperature is lower than a first preset threshold, so as to heat the target device through the heating component; and controlling the target device to start when the temperature of the target device is higher than the second preset threshold. In this embodiment, the second detection module may include an ambient temperature sensor to detect the temperature of the target device. For example, such as... Figure 8 As shown, when the target device is in a low-temperature environment, the target device is heated through the following steps:

[0071] S801, power on and start the main control board MCU;

[0072] S802, detects whether the ambient temperature of the environment where the target equipment is located meets the operating temperature required by the target equipment;

[0073] S803: When the ambient temperature of the environment where the target equipment is located does not reach the operating temperature required by the target equipment, the heating element is activated;

[0074] S804 controls the target device to start when it is heated to the normal start-up temperature;

[0075] S805: When the ambient temperature of the environment where the target device is located reaches the operating temperature required by the target device, the target device is started.

[0076] This embodiment can control the start-up of the heating component in a timely manner by detecting the environment in which the target device is located.

[0077] In summary, this embodiment fully utilizes the existing characteristics of the heating element. By calibrating a portion of the heating element's resistance, a precise resistance value is obtained. This resistance value is then used to detect the current, and finally, through voltage measurement, the power of the heating element is determined, achieving the goal of rapidly testing the heating element's functionality. Furthermore, on the production line, this embodiment eliminates the need for temperature detection, significantly reducing testing time and facilitating rapid production testing.

[0078] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods according to the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) and includes several instructions to cause a terminal device (which may be a mobile phone, computer, server, or network device, etc.) to execute the methods described in the various embodiments of this application.

[0079] This embodiment also provides a heating component, including a heating element, and a power consumption detection component of any of the above embodiments, wherein the heating element includes a thermally conductive resistor.

[0080] This embodiment also provides a target device, including the heating component from the above embodiments.

[0081] The above-described equipment is used to implement the above embodiments and preferred embodiments, and will not be repeated hereafter.

[0082] It should be noted that the above modules can be implemented by software or hardware. For the latter, they can be implemented in the following ways, but are not limited to: all the above modules are located in the same processor; or, the above modules are located in different processors in any combination.

[0083] Embodiments of this application also provide a computer-readable storage medium storing a computer program, wherein the computer program is configured to execute the steps in any of the above method embodiments when run.

[0084] In one exemplary embodiment, the aforementioned computer-readable storage medium may include, but is not limited to, various media capable of storing computer programs, such as a USB flash drive, read-only memory (ROM), random access memory (RAM), portable hard disk, magnetic disk, or optical disk.

[0085] Embodiments of this application also provide an electronic device, including a memory and a processor, wherein the memory stores a computer program and the processor is configured to run the computer program to perform the steps in any of the above method embodiments.

[0086] In one exemplary embodiment, the electronic device may further include a transmission device and an input / output device, wherein the transmission device is connected to the processor and the input / output device is connected to the processor.

[0087] Specific examples in this embodiment can be found in the examples described in the above embodiments and exemplary implementations, and will not be repeated here.

[0088] Obviously, those skilled in the art should understand that the modules or steps of this application described above can be implemented using general-purpose computing devices. They can be centralized on a single computing device or distributed across a network of multiple computing devices. They can be implemented using computer-executable program code, and thus can be stored in a storage device for execution by a computing device. In some cases, the steps shown or described can be performed in a different order than those presented here, or they can be fabricated as separate integrated circuit modules, or multiple modules or steps can be fabricated as a single integrated circuit module. Thus, this application is not limited to any particular combination of hardware and software.

[0089] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the principles of this application should be included within the protection scope of this application.

Claims

1. A power consumption detection component, characterized in that, The power consumption detection component is detachably mounted on the heating component, which is used to heat the target device. The power consumption detection component includes a body and an electronic unit detachably mounted on the body. The electronic unit includes a power supply module, a first detection module, and a control module that are interconnected by signals. The control module is used to obtain the resistance value and voltage value of the heating component through the first detection module, and to detect the power consumption of the heating component based on the resistance value and the voltage value. The electronic unit further includes: an on / off adjustment structure, which is disposed within the electronic unit and connected to the control module. Under the control of the control module, the on / off adjustment structure at least adjusts the on / off state between the power supply module and the heating component. The on / off adjustment structure includes: a first on / off adjustment structure connected to a current-impeding element, the current-impeding element being connected to the heating component; and a second on / off adjustment structure. When the first on / off adjustment structure is in the on / off state, connecting the power supply module and the heating component, the first detection module detects a first voltage value of the heating component and a first resistance value of the current-impeding element, and the control module calculates a second resistance value of the heating component based on the first voltage value and the first resistance value. When the first on / off adjustment structure is in the off state, and the second on / off adjustment structure is in the on / off state, connecting the power supply module and the heating component, the first detection module detects a second voltage value of the heating component, and the control module calculates the heating power of the heating component based on the second voltage value and the second resistance value, and detects the power consumption of the heating component based on the heating power.

2. The power consumption detection component according to claim 1, characterized in that, The electronic unit also includes: The first connection interface includes a power interface and a communication interface, wherein the power supply module and the heating component are connected through the power interface, and the first detection module and the heating component are connected through the communication interface.

3. The power consumption detection component according to any one of claims 1-2, characterized in that, The electronic unit also includes: The second connection interface is used by the control module to transmit the power consumption of the heating component to an external device.

4. The power consumption detection component according to claim 1, characterized in that, The electronic unit also includes: The second detection module is connected to the control module. The second detection module is used to detect the ambient temperature of the environment where the target device is located. When the ambient temperature is less than a first preset threshold, the control module is used to control the power supply module to conduct to the heating component so as to heat the target device through the heating component. When the temperature of the target device is greater than the second preset threshold, the control module is also used to control the target device to start.

5. A power consumption detection method, characterized in that, include: When the heating component and the power supply module are turned on, the resistance value and the voltage value of the heating component are obtained, wherein the heating component is used to heat the target device; The power consumption of the heating component is detected based on the resistance value and the voltage value; The process of acquiring the resistance and voltage values ​​of the heating component when the heating component and power supply module are connected includes: acquiring a first voltage value of the heating component detected by a first detection module and a first resistance value of a current-blocking element when the first on / off adjustment structure connects the power supply module and the heating component, wherein the current-blocking element is disposed between the first on / off adjustment structure and the heating component; calculating a second resistance value of the heating component based on the first voltage value and the first resistance value; and acquiring a second voltage value of the heating component detected by the first detection module when the first on / off adjustment structure is in an off state and the second on / off adjustment structure connects the power supply module and the heating component. Detecting the power consumption of the heating component based on the resistance value and the voltage value includes: calculating the heating power of the heating component based on the second voltage value and the second resistance value; and detecting the power consumption of the heating component based on the heating power.

6. The method according to claim 5, characterized in that, The method further includes: The ambient temperature of the environment where the target device is located is detected by the second detection module; When the ambient temperature is less than a first preset threshold, the power supply module is controlled to be connected to the heating component so as to heat the target device through the heating component; When the temperature of the target device exceeds a second preset threshold, the target device is controlled to start.

7. A heating assembly, characterized in that, It includes a heating element and a power consumption detection component as described in any one of claims 1-4, wherein the heating element includes a thermally conductive resistor.

8. A target device, characterized in that, Includes the heating component as described in claim 7.

9. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program, wherein the computer program, when executed by a processor, implements the steps of the method described in any one of claims 5 to 6.

10. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the steps of the method described in any one of claims 5 to 6.

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