An assembly apparatus for a BOSA device and a mounting method thereof

Abstract

The application relates to the technical field of optical communication, and provides an assembling device of a BOSA device and a mounting method thereof. The assembling device comprises a BOSA device, an intermediate seat and a PCB board. A plurality of limiting arms are arranged on the intermediate seat, the limiting arms and the bottom plate of the intermediate seat form mounting spaces, and the mounting spaces are used for accommodating the BOSA device. A plurality of bosses corresponding to the limiting arms are arranged on the BOSA device, corresponding buckle holes are arranged on the limiting arms, when the BOSA device is mounted on the intermediate seat, the bosses enter the buckle holes, and the purpose of fixing the BOSA device on the intermediate seat is achieved. A convex foot is further arranged on the intermediate seat, corresponding positioning holes are arranged on the PCB board, the convex foot enters the positioning holes, then the intermediate seat is fixed on the PCB board, and finally the purpose of fixing the BOSA device on the PCB board is achieved.

Description

Technical Field

[0001] This invention relates to the field of optical communication technology, and in particular to an assembly apparatus and installation method for a BOSA device. Background Technology

[0002] In early optical modules, the optical transmitting and receiving components were separate components: the optical transmitting component TOSA (Transmitting Optical Sub-Assembly) and the optical receiving component ROSA (Receiving Optical Sub-Assembly). With the development of optical devices, TOSA and ROSA were combined into one, becoming the optical transmitting and receiving component BOSA (Bi-Directional Optical Sub-Assembly). As an important component of single-fiber optical modules, BOSA is widely used in optical communication equipment.

[0003] In existing BOSA device mounting solutions, one connection method is to use an intermediate connector to connect the BOSA to the PCB (Printed Circuit Board). The connector is generally made of powder metallurgy, which is costly. In addition, the connector needs to be connected to the BOSA square tube by adhesive. After adhesive bonding, it also needs to be baked and cured in an oven. The entire adhesive bonding and curing process is relatively complex and time-consuming. Furthermore, misalignment problems are prone to occur during the adhesive bonding process.

[0004] Therefore, overcoming the shortcomings of the existing technology is an urgent problem to be solved in this technical field. Summary of the Invention

[0005] In view of the above-mentioned defects or improvement needs of the existing technology, the present invention proposes an assembly device for BOSA devices, which aims to improve the technical problem of fixing BOSA on PCB board and overcome the problems of the adhesive connection method in the existing technology, which has a relatively complicated adhesive and curing process, requires a long time, and is prone to misalignment during the adhesive process.

[0006] To achieve the above objectives, a first aspect of the present invention provides an assembly apparatus for a BOSA device, comprising a BOSA device 1 and an intermediate base 2, wherein:

[0007] The base includes a first side 11 and a second side 12 disposed opposite to each other. A first protrusion 13 is provided on the first side 11 and a second protrusion 14 is provided on the second side 12.

[0008] The intermediate seat 2 includes a base plate 23, a first limiting arm 21 and a second limiting arm 22. The first limiting arm 21 and the second limiting arm 22 are both disposed on the base plate 23 and are disposed opposite to each other. The base plate 23, the first limiting arm 21 and the second limiting arm 22 form an installation space. The first limiting arm 21 is provided with a first fastening hole 211 and the second limiting arm 22 is provided with a second fastening hole 221.

[0009] The base plate 23 is also provided with at least one protruding foot 231, which is located on the side opposite to the first limiting arm 21; the PCB board 3 is provided with at least one positioning hole 31, and the protruding foot 231 is used to fix in the positioning hole 31 on the PCB board to fix the intermediate seat 2 on the PCB board 3.

[0010] The base is disposed in the installation space, and the first boss 13 engages with the first latching hole 211, and the second boss 14 engages with the second latching hole 221, so as to fix the BOSA device 1 on the intermediate base 2.

[0011] Furthermore, two first protrusions 13 are provided on the first side surface 11; a first groove 15 is provided on the first side surface 11, and the first protrusions 13 are disposed in the first groove 15, with the two first protrusions 13 respectively disposed at both ends of the first groove 15; a second groove 16 is provided on the second side surface 12, and a second protrusion 14 is disposed in the second groove 16, with the second protrusion 14 disposed in the middle region of the second groove 16; the length of the second protrusion 14 is greater than the length of the first protrusion 13.

[0012] Furthermore, the intermediate seat 2 includes two first limiting arms 21 and one second limiting arm 22. The two first limiting arms 21 are disposed on the same side and at both ends of the base plate 23. The second limiting arm 22 is disposed in the middle area of ​​the base plate 23.

[0013] Furthermore, the base plate 23 is provided with a first notch 232 and a second notch 233. The first notch 232 is located near the first limiting arm 21 and the length of the first notch 232 is greater than the length of the first limiting arm 21. The second notch 233 is located near the second limiting arm 22 and the length of the second notch 233 is greater than the length of the second limiting arm 22.

[0014] Furthermore, the assembly device is also equipped with a disassembly and reassembly component 5, which includes an operating arm 52 and a disassembly arm 51. The disassembly arm 51 is provided with a disassembly groove 511 and a movable part 512. The disassembly groove 511 is used to couple with the first limiting arm 21, and the movable part 512 is inserted into the first notch 232.

[0015] When the operating arm 52 receives external force, the disassembly groove 511 abuts against the side of the first limiting arm 21, and the movable part 512 moves in the first notch 232 to separate the first boss 13 from the corresponding first locking hole 211.

[0016] Furthermore, a protrusion 513 is provided between the disassembly groove 511 and the movable part 512;

[0017] The disassembly arm 51 is provided with a first arc surface 514, a second arc surface 515 and a third arc surface 516. The first arc surface 514 and the second arc surface 515 are connected to form the disassembly groove 511; the second arc surface 515 and the third arc surface 516 are connected to form the protrusion 513.

[0018] The second arc surface 515 is inclined to the plane where the movable part 512 is located, and the angle between the first arc surface 514 and the second arc surface 515 is 80° to 120°.

[0019] Furthermore, both the first boss 13 and the second boss 14 have an abutment surface 141 and a guide surface 142. The abutment surface 141 is parallel to the upper surface of the base, and the guide surface 142 is inclined to the abutment surface 141. The distance between the guide surface 142 and the base gradually decreases along the direction close to the intermediate seat 2.

[0020] Furthermore, the first limiting arm 21 is provided with a first inclined surface 212, which is located on the inner side of the first limiting arm 21 and is positioned above the first latching hole 211.

[0021] The second limiting arm 22 is provided with a second inclined surface, which is located on the inner side of the second limiting arm 22 and is positioned above the second buckle hole 221.

[0022] Furthermore, there are three protruding feet 231, and correspondingly, there are also three positioning holes 31. The protruding feet 231 are elongated strip-shaped protruding feet 231, and the positioning holes 31 are circular holes.

[0023] Furthermore, the BOSA device 1 includes a light emitting component and a light receiving component, which are disposed on different surfaces of the base;

[0024] The assembly device also includes an FPC board 4, which has at least three mounting parts 41, two of which are connected to the light emitting component and the light receiving component respectively, and the other mounting part 41 is connected to the PCB board 3.

[0025] In a second aspect, the present invention also provides a method for mounting a BOSA device assembly apparatus, the mounting method being applied to the assembly apparatus described in the first aspect above, the mounting method comprising:

[0026] The intermediate seat 2 is fixed on the PCB board 3;

[0027] The first protrusion 13 on the BOSA device 1 is engaged with the first fastening hole 211, and the second protrusion 14 on the BOSA device 1 is engaged with the second fastening hole 221 to fix the BOSA device 1 on the intermediate seat 2.

[0028] In this case, the BOSA device 1 is soldered to the FPC board before the intermediate seat 2 is fixed, or the BOSA device 1 is soldered to the FPC board 4 after the intermediate seat 2 is fixed.

[0029] Thirdly, the present invention also provides a method for mounting a BOSA device assembly apparatus, the method being applied to the BOSA device assembly apparatus as described in the first aspect, the method comprising:

[0030] The first protrusion 13 on the BOSA device 1 is engaged with the first fastening hole 211, and the second protrusion 14 on the BOSA device 1 is engaged with the second fastening hole 221 to fix the BOSA device 1 on the intermediate seat 2.

[0031] The intermediate seat 2 is fixed on the PCB board 3;

[0032] In this case, the BOSA device 1 is soldered to the FPC board before the intermediate seat 2 is fixed, or the BOSA device 1 is soldered to the FPC board 4 after the intermediate seat 2 is fixed.

[0033] Compared with the prior art, the beneficial effects of the embodiments of the present invention are as follows:

[0034] This invention provides an assembly apparatus and installation method for a BOSA device. The assembly apparatus includes a BOSA device 1, an intermediate base 2, and a PCB board 3. A first boss 13 is provided on the first side 11 of the BOSA device 1, and a second boss 14 is provided on the second side 12. A first limiting arm 21 and a second limiting arm 22 are arranged opposite to each other on the intermediate base 2, forming an installation space with the intermediate base 2. The BOSA device 1 is placed in the installation space, with the first boss 13 engaging with the first locking hole 211 and the second boss 14 engaging with the second locking hole 221, thereby fixing the BOSA device 1 onto the intermediate base 2. At least one protruding foot 231 is also provided on the base plate 23, located on the side opposite to the first limiting arm 21. At least one positioning hole 31 is provided on the PCB board 3, and the protruding foot 231 is fixed in the positioning hole 31 to fix the intermediate base 2 onto the PCB board 3. In this invention, the intermediate seat is provided with a protruding foot 231. The intermediate seat is fixed to the PCB board by the cooperation of the protruding foot 231 and the positioning hole 31. The BOSA device 1 is provided with a boss, and the intermediate seat 2 is provided with a locking hole. The BOSA device 1 is fixed to the intermediate seat 2 by the cooperation of the boss and the locking hole, which can avoid the occurrence of misalignment. In addition, this fixing method does not require adhesive connection or baking curing. The installation method is simple and can achieve quick installation, so as to quickly, accurately and firmly fix the BOSA device 1 to the PCB board 3. Attached Figure Description

[0035] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0036] Figure 1 This is an exploded structural diagram of an assembly apparatus for a BOSA device provided in an embodiment of the present invention;

[0037] Figure 2 This is a schematic diagram of the overall structure of an assembly device for a BOSA device provided in an embodiment of the present invention;

[0038] Figure 3 This is a schematic diagram of the structure of the intermediate seat of an assembly device for a BOSA device provided in an embodiment of the present invention;

[0039] Figure 4This is a schematic diagram of the PCB board structure adapted to the assembly device of a BOSA device provided in an embodiment of the present invention;

[0040] Figure 5 This is a schematic diagram of the structure of an FPC board adapted to an assembly device for a BOSA device provided in an embodiment of the present invention.

[0041] Figure 6 This is a schematic diagram of the structure of a BOSA device provided in an embodiment of the present invention, which is an assembly apparatus for a BOSA device.

[0042] Figure 7 This is a schematic diagram of the structure of a BOSA device, which is another assembly apparatus for a BOSA device provided in an embodiment of the present invention.

[0043] Figure 8 This is a schematic diagram of the overall structure (with disassembly / return parts) of an assembly device for a BOSA device provided in an embodiment of the present invention;

[0044] Figure 9 This is a side view (with disassembly / return parts) of an assembly apparatus for a BOSA device provided in an embodiment of the present invention;

[0045] Figure 10 This is a schematic diagram of the disassembly and reassembly components of an assembly apparatus for a BOSA device provided in an embodiment of the present invention;

[0046] Figure 11 This is a side view of the disassembly and reassembly components of a BOSA device assembly apparatus provided in an embodiment of the present invention.

[0047] Figure 12 This is a schematic diagram of a protrusion structure provided in an embodiment of the present invention;

[0048] Figure 13 This is a schematic diagram of the installation process of an assembly apparatus for a BOSA device provided in an embodiment of the present invention;

[0049] The attached figures are labeled as follows:

[0050] BOSA device 1; First side 11; Second side 12; First boss 13; Second boss 14; Abutting surface 141; Guide surface 142; First groove 15; Second groove 16; Intermediate seat 2; First limiting arm 21; First locking hole 211; First inclined surface 212; Second limiting arm 22; Second locking hole 221; Base plate 23; Protruding foot 231; First notch 232; Second notch 233; PCB board 3; Positioning hole 31; FPC board 4; Mounting part 41; Removal part 5; Removal arm 51; Removal groove 511; Movable part 512; Protrusion 513; First arc surface 514; Second arc surface 515; Third arc surface 516; Operating arm 52. Detailed Implementation

[0051] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0052] In the description of this invention, the terms "inner", "outer", "longitudinal", "lateral", "upper", "lower", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and do not require that this invention must be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0053] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0054] Example 1:

[0055] Embodiment 1 of the present invention provides an assembly apparatus for BOSA devices, such as... Figures 1 to 8 As shown, the assembly device includes a BOSA device 1, a PCB board 3, and an intermediate base 2, wherein:

[0056] The BOSA device 1 includes a base (not shown in the figure), the base includes a first side 11 and a second side 12 disposed opposite to each other, the first side 11 is provided with a first boss 13, and the second side 12 is provided with a second boss 14.

[0057] The intermediate seat 2 includes a base plate 23, a first limiting arm 21 and a second limiting arm 22. The first limiting arm 21 and the second limiting arm 22 are both disposed on the base plate 23 and are disposed opposite to each other. The base plate 23, the first limiting arm 21 and the second limiting arm 22 form an installation space. The first limiting arm 21 is provided with a first fastening hole 211 and the second limiting arm 22 is provided with a second fastening hole 221.

[0058] The base plate 23 is also provided with at least one protruding foot 231, which is located on the side opposite to the first limiting arm 21; the PCB board 3 is provided with at least one positioning hole 31, and the protruding foot 231 is fixed in the positioning hole 31 to fix the intermediate seat 2 on the PCB board 3.

[0059] The base is disposed in the installation space, and the first boss 13 engages with the first latching hole 211, and the second boss 14 engages with the second latching hole 221, so as to fix the BOSA device 1 on the intermediate base 2.

[0060] In this embodiment, by setting a first limiting arm 21 and a second limiting arm 22 on the intermediate seat 2, the first limiting arm 21, the second limiting arm 22 and the base plate 23 of the intermediate seat 2 form an installation space, which is used to accommodate the BOSA device 1. The BOSA device 1 is provided with a first boss 13 and a second boss 14. The first limiting arm 21 is provided with a corresponding first locking hole 211, and the second limiting arm 22 is provided with a corresponding second locking hole 221. When the BOSA device 1 is installed on the intermediate seat 2, the first boss 13 enters the first locking hole 211, and the second boss 14 enters the second locking hole 221, thereby fixing the BOSA device 1 on the intermediate seat 2. The intermediate seat 2 is also provided with a protruding foot 231, and the PCB board 3 is provided with a corresponding positioning hole 31. The protruding foot 231 enters the positioning hole 31, and then the intermediate seat 2 is fixed on the PCB board 3, thereby finally fixing the BOSA device 1 on the PCB board 3.

[0061] In this embodiment, the intermediate seat 2 is fixed on the PCB board 3 by the cooperation of the protrusion 231 and the positioning hole 31, and the BOSA device 1 is fixed on the intermediate seat 2 by the cooperation of the boss and the locking hole. This can avoid the occurrence of misalignment. In addition, this fixing method does not require adhesive connection or baking curing. The installation method is simple and can achieve quick installation, so as to quickly, accurately and firmly fix the BOSA device 1 on the PCB board 3.

[0062] To better secure the intermediate seat 2 to the PCB board 3, a preferred implementation scheme exists in conjunction with the embodiments of the present invention, specifically, as follows: Figures 3-4 As shown, there are three protruding feet 231, and correspondingly, there are also three positioning holes 31. The protruding feet 231 are elongated strips, and the positioning holes 31 are circular holes.

[0063] The protruding foot 231 has a slender strip-shaped structure, which matches the plate-shaped structure of the base plate 23. The three protruding feet 231 can stably fix the intermediate seat 2 onto the PCB board 3. Compared with setting one or two protruding feet 231, the reliability is high. Compared with setting three or more protruding feet 231, the installation process is convenient and materials are saved. The positioning hole 31 is a circular hole, which makes it easier to position the protruding foot 231 when it enters the positioning hole 31. The protruding foot 231 and the positioning hole 31 do not need to fit perfectly, which makes the connection between the intermediate seat 2 and the PCB board 3 faster.

[0064] In an optional solution, the protruding foot 231 can be cylindrical. In this case, at least two protruding feet 231 are required to achieve the positioning of the intermediate seat 2. When the protruding foot 231 is of other shapes, if the shape of the positioning hole 31 corresponds to the protruding foot 231, one or more protruding feet 231 can achieve the positioning.

[0065] In practical applications, to improve the stability between the intermediate seat and the PCB board, after the protrusion passes through the PCB board, a welding process is used to weld the protrusion to the PCB board. Alternatively, other processes can be used to reinforce the connection between the intermediate seat and the PCB board.

[0066] To better secure the BOSA device 1 to the intermediate base 2, a preferred implementation scheme exists in conjunction with the embodiments of the present invention, specifically, as follows: Figures 6-7 As shown, two first protrusions 13 are provided on the first side surface 11; a first groove 15 is provided on the first side surface 11, and the first protrusions 13 are disposed in the first groove 15, with the two first protrusions 13 respectively disposed at both ends of the first groove 15; a second groove 16 is provided on the second side surface 12, and a second protrusion 14 is disposed in the second groove 16, with the second protrusion 14 disposed in the middle region of the second groove 16; the length of the second protrusion 14 is greater than the length of the first protrusion 13.

[0067] like Figure 6 As shown, the first side 11 is located on the azimuth plane of the detector in the BOSA device 1, while the corresponding second side 12 is located at... Figure 6 The middle section presents an empty surface; the advantage of this is that it ensures minimal modification to the housing of the BOSA device 1 in the design of the fixing structure between the intermediate seat 2 and the BOSA device 1, while still achieving a three-point locking effect. Furthermore, the reason for choosing the first side 11 and the second side 12 with the aforementioned orientation characteristics is that the corresponding second locking hole 221 can be made larger and flatter than the first locking hole 211. Therefore, during installation, the second locking hole 221 can be first fastened onto the second boss 14, and then... Figure 1 From the perspective shown, simply turning it clockwise allows the first locking hole 211 to engage with the first protrusion 13, making installation more convenient and efficient.

[0068] The first groove 15 is a groove near the edge at the bottom end of the first side surface 11, specifically, as shown in the figure. Figure 6 As shown, the first groove 15 is located at the top corner of the BOSA device 1 base, and the first boss 13 is a boss located on the edge of the first groove 15. The first boss 13 is also located at the top corner of the BOSA device 1 base, such that the two surfaces of the first boss 13 within the first groove 15 maintain a certain distance from the two opposite surfaces of the first groove 15, so that the first boss 13 can enter the first locking hole 211 in the first limiting arm 21. Figure 7 As shown, the second groove 16 is a groove located in the middle part of the bottom end of the second side 12, and the second boss 14 is a boss located in the middle of the second groove 16, so that the three surfaces of the second boss 14 are kept at a certain distance from the three side walls of the second groove 16, so that the second boss 14 can enter the second fastening hole 221.

[0069] In conjunction with this, such as Figure 3 As shown, the intermediate seat 2 includes two first limiting arms 21 and one second limiting arm 22. The two first limiting arms 21 are disposed on the same side and at both ends of the base plate 23. The second limiting arm 22 is disposed in the middle area of ​​the base plate 23. It can be understood that the two first limiting arms 21 and the second limiting arm 22 are distributed in a triangular shape. Through the cooperation of the two first limiting arms 21 and the second limiting arm 22, the BOSA device 1 can be reliably fixed on the intermediate seat 2.

[0070] Meanwhile, the first limiting arm 21 and the first side 11 are located on the same side, and when the BOSA device 1 is fixed on the intermediate seat 2, the top surface of the first limiting arm 21 contacts the top surface of the first groove 15, which makes the BOSA device 1 more stable when placed on the intermediate seat 2; when the BOSA device 1 is fixed on the intermediate seat 2, a portion of the first limiting arm 21 is outside the first groove 15, at which time... Figure 8 As shown, in the axial direction of the BOSA device 1, a portion of the first limiting arm 21 is located outside the first groove 15.

[0071] The second limiting arm 22 is located on the same side as the second side 12. The size of the second limiting arm 22 is adapted to the second groove 16. The second groove 16 can be filled by the second limiting arm 22, so that the second limiting arm 22 can be completely accommodated in the second groove 16. When the second boss 14 enters the second locking hole 221 and the second limiting arm 22 fills the second groove 16, the second limiting arm 22 side strengthens the limiting of the BOSA device 1, so as to better fix the BOSA device 1 on the intermediate seat 2.

[0072] To achieve guidance during the fixing process of the BOSA device 1 and the intermediate seat 2, in conjunction with the embodiments of the present invention, there is also a preferred implementation scheme, specifically, as follows: Figure 6 , Figure 7 and Figure 12 As shown, both the first boss 13 and the second boss 14 have an abutment surface 141 and a guide surface 142. The abutment surface 141 is parallel to the upper surface of the base and is used to abut against the top surface of the first groove 15 or the second groove 16. The guide surface 142 is inclined to the abutment surface 141. Along the direction close to the intermediate seat 2, the distance between the guide surface 142 and the base gradually decreases, serving as a guide when the first limiting arm 21 and the second limiting arm 22 enter the first groove 15 or the second groove 16. It should be noted that the second boss 14 and the first boss 13 have the same structure, differing only in size. Here, only the dimensions are considered. Figure 12 The structure of the first and second protrusions is shown, but not separately.

[0073] To achieve guidance during the fixing process of the BOSA device 1 and the intermediate seat 2, in conjunction with the embodiments of the present invention, there is also a preferred implementation scheme, specifically, as follows: Figure 3 As shown, the first limiting arm 21 is provided with a first inclined surface 212, which is located on the inner side of the first limiting arm 21 and is positioned above the first buckle hole 211; the second limiting arm 22 is provided with a second inclined surface (not shown in the figure), which is located on the inner side of the second limiting arm 22 and is positioned above the second buckle hole 221.

[0074] The first inclined surface 212 and the guide surface 142 on the first boss 13 cooperate to allow the first boss 13 to enter the first locking hole 211 more easily; the second inclined surface and the guide surface 142 on the second boss 14 cooperate to allow the second boss 14 to enter the second locking hole 221 more quickly; in general, the cooperation of the two inclined surfaces makes it easier for the BOSA device 1 to be installed on the intermediate seat 2. It should be noted that... Figure 3 Only the first inclined plane 212 is shown in the diagram; in reality, the second inclined plane and... Figure 3 The structure of the first inclined surface 212 shown is the same, only the size is different. Furthermore, the ingenuity of this design in the present invention is that the first inclined surface 212 also provides a cylindrical slot on the BOSA device 1 for setting the position of the optical device (which can be a detector or a laser, for example, in TO package form) in a suitable way.

[0075] To achieve the circuit signal connection between the BOSA device 1 and the PCB board 3, in conjunction with the embodiments of the present invention, there is also a preferred implementation scheme, such as... Figure 1 , Figure 2 and Figure 5 As shown, the assembly device also includes an FPC board 4, on which at least three mounting portions 41 are provided; the BOSA device 1 includes a light emitting component and a light receiving component, which are disposed on different sides of the base; two of the mounting portions 41 on the FPC are respectively connected to the light emitting component and the light receiving component, and the other mounting portion 41 is connected to the PCB.

[0076] Specifically, the optical emitting component and optical receiving component on the BOSA device 1 are respectively soldered to different mounting portions 41 on the FPC board 4. One mounting portion 41 of the FPC board 4 is provided with positioning pads and signal pads. The PCB board 3 is provided with corresponding positioning pads and signal pads. After the FPC board 4 and the PCB board 3 are positioned by the positioning pads, the signal pads are then soldered to achieve the circuit signal connection between the FPC board 4 and the PCB board 3.

[0077] In conjunction with the embodiments of the present invention, there is also a preferred implementation scheme, specifically, as follows: Figure 3As shown, the base plate 23 is provided with a first notch 232 and a second notch 233. The first notch 232 is located adjacent to the first limiting arm 21, and the length of the first notch 232 is greater than the length of the first limiting arm 21. The second notch 233 is located adjacent to the second limiting arm 22, and the length of the second notch 233 is greater than the length of the second limiting arm 22. The aforementioned notches can provide heat dissipation channels for the BOSA device 1 to achieve better heat dissipation.

[0078] Furthermore, the BOSA device 1 can be separated from the intermediate base 2 through the first notch 232. Specifically, in order to achieve the disassembly of the BOSA device 1 from the intermediate base 2, in conjunction with the embodiments of the present invention, there is also a preferred implementation scheme, such as... Figures 8-11 As shown, the assembly device is also equipped with a disassembly and reassembly component 5. The disassembly and reassembly component 5 includes an operating arm 52 and two disassembly arms 51 arranged opposite to each other. The operating arm 52 connects the two disassembly arms 51 to form the disassembly and reassembly component 5. The disassembly arm 51 is provided with a disassembly groove 511 and a movable part 512. The front end of the disassembly groove 511 on the disassembly arm 51 is the movable part 512.

[0079] like Figure 8 As shown, the disassembly groove 511 is used to couple with the first limiting arm 21. Specifically, along the axial direction of the BOSA device 1, a portion of the first limiting arm 21 is located outside the first groove 15, and the disassembly groove 511 abuts against the extended portion of the first limiting arm 21, with the movable part 512 inserted into the first notch 232. When the disassembly / removal component 5 is arranged on the intermediate seat 2, the disassembly groove 511 prevents the disassembly / removal component 5 from easily becoming misaligned and dislodging. Simultaneously, the disassembly groove 511 also serves as the contact point between the intermediate seat 2 and the disassembly / removal component 5, transmitting force during the disassembly of the BOSA device 1. When the operating arm 52 receives external force, the disassembly groove 511 abuts against the side of the first limiting arm 21, and the movable part 512 moves within the first notch 232, thereby applying external force to the first limiting arm 21 through the disassembly groove 511, causing the first boss 13 to separate from the corresponding first locking hole 211.

[0080] In an optional embodiment, the disassembly and reassembly component 5 may have only one disassembly arm 51, which can be used to disassemble the BOSA device on the intermediate seat 2 when there is only one first limiting arm 21; or, when there are multiple first limiting arms 21, multiple disassembly and reassembly components 5 can be provided to disassemble the BOSA device on the intermediate seat 2.

[0081] To better facilitate the disassembly of the BOSA device 1 from the intermediate base 2, in conjunction with the embodiments of the present invention, there is also a preferred implementation scheme, specifically, as follows: Figures 10-11 As shown, a protrusion 513 is provided between the disassembly groove 511 and the movable part 512. The disassembly arm 51 is provided with a first arc surface 514, a second arc surface 515, and a third arc surface 516. The first arc surface 514 and the second arc surface 515 are connected to form the disassembly groove 511; the second arc surface 515 and the third arc surface 516 are connected to form the protrusion 513; the second arc surface 515 is inclined to the plane where the movable part 512 is located, and the angle between the first arc surface 514 and the second arc surface 515 is 80° to 120°. In a preferred embodiment, the angle between the first arc surface 514 and the second arc surface 515 is close to 90°, so that the disassembly groove 511 can be mounted on the first limiting arm 21. This structure can utilize the thickness of the disassembly / removal component 5 to provide greater movement space for the movable part 512 within a certain gap.

[0082] The ingenuity of the disassembly scheme proposed in this invention, which consists of the disassembly and reassembly component 5, lies in the fact that, as... Figures 1-9 In the optimal solution shown, the gap between the two movable parts 512 in the corresponding disassembly / return component 5 is exactly the same as the gap between the first side 11 and the second side 12. Therefore, the optical device mounting slot on the first side 11 can be used as a fulcrum for disassembling the disassembly / return component 5. Figure 9 Taking the perspective as an example, the corresponding disassembled and returned parts 5 Figure 9 In the initial insertion state shown, simply pulling clockwise to the right will cause the pair of first limiting arms 21 located on the first side 11 to be lifted and disengaged from their respective first protrusions 13. Furthermore, as shown... Figure 9 As shown, the corresponding optical device mounting slot (circular) has its fulcrum for the disassembly / return piece 5 located in its third quadrant, thus enabling the first limiting arm 21 to be directly formed. Figure 9 The force applied from the center to the lower left corner allows for a very smooth peeling process between BOSA device 1 and intermediate seat 2.

[0083] The ingenuity of the intermediate seat 2 and the matching disassembly and reassembly component 5, as designed in this invention, is also demonstrated in the process of introducing the disassembly and reassembly component 5. Figure 3In this invention, a pair of first bosses 13 are fabricated on the first side 11 where the optical device mounting slot is located, and a pair of first limiting arms 21 are fabricated on the intermediate seat 2 to be fixed to the corresponding pair of first bosses 13. At this time, the invention uses a laser cutting method on a complete steel plate to make the cutting groove (described as the first notch 232 in the embodiment of the invention) left on the intermediate seat 2 during the fabrication of the first limiting arms 21 serve as the landing point of the movable part 512 of the disassembly and reassembly part 5. (Here, in the embodiment of the invention, in order to comfortably complete the disassembly, the length of the corresponding movable part 512 should not be too short, and the disassembly...) During the unloading process, the advantage of partially penetrating and passing through the cutting groove is that the cutting groove can also limit the movable part 512 during the peeling process, preventing the operator from using too much force and causing unsuitable deformation of the first limiting arm 21. The significance of making the first boss 13 on the corner of the BOSA device 1 is also highlighted at this time. Because of this, the cutting groove left when making the first limiting arm 21 can still allow the movable part 512 to be placed on the intermediate seat 2 smoothly without deliberate reprocessing after the BOSA device 1 is installed on the intermediate seat 2.

[0084] Furthermore, the design intent of the aforementioned disassembly groove 511 and protrusion 513 also needs to be emphasized; the disassembly groove 511 allows the movable part to be smoothly inserted into the cutting groove left on the intermediate seat 2 during the manufacturing process of the first limiting arm 21, and, because it is an oblique insertion process, the upper side of the disassembly groove 511 (with) Figure 9 (As shown in the orientation description) allows the disassembly and reassembly component 5 to be naturally mounted on the first limiting arm 21 via the upper side of the disassembly groove 511 after being inserted into the cutting groove; while the protrusion 513 allows the force during disassembly to be more effectively transmitted to the first limiting arm 21, thus completing a more efficient disassembly operation.

[0085] Example 2:

[0086] Based on the BOSA device assembly apparatus of Embodiment 1 above, this embodiment provides a mounting method for the BOSA device assembly apparatus. The mounting method is applied to the assembly apparatus described in Embodiment 1 above, and includes:

[0087] Step 101: Fix the intermediate seat 2 onto the PCB board 3;

[0088] Step 102: Engage the first boss 13 on the BOSA device 1 with the first locking hole 211, and engage the second boss 14 on the BOSA device 1 with the second locking hole 221 to fix the BOSA device 1 on the intermediate seat 2.

[0089] In this case, the BOSA device 1 is soldered to the FPC board before the intermediate seat 2 is fixed, or the BOSA device 1 is soldered to the FPC board after the intermediate seat 2 is fixed.

[0090] The specific structure of the BOSA device assembly device is described in Example 1 above and will not be repeated here.

[0091] Specifically, in actual use, the assembly and installation of the BOSA device will be further extended from steps 101 to 102 as follows:

[0092] Step 201: After the protruding foot 231 passes through the positioning hole 31, the intermediate seat 2 is fixed on the PCB board 3.

[0093] Step 202: Engage the first boss 13 on the BOSA device 1 into the first locking hole 211, partially insert the first limiting arm 21 into the first groove 15, engage the second boss 14 on the BOSA device 1 into the second locking hole 221, and fill the second groove 16 with the first limiting arm 21 to fix the BOSA device 1 on the intermediate seat 2.

[0094] Step 203: Solder the two mounting parts 41 of the FPC board 4 to the light emitting component and the light receiving component of the BOSA device 1 respectively.

[0095] Step 204: Solder the positioning pads on the FPC board 4 to the positioning pads on the PCB board 3, and solder the signal pads on the FPC board 4 to the corresponding signal pads on the PCB board 3.

[0096] The above four steps can be performed in any order to achieve the assembly of the BOSA device 1 and the PCB board 3.

[0097] For example, you can also follow these steps in sequence:

[0098] Step 301: Solder the two mounting parts 41 of the FPC board 4 to the light emitting component and the light receiving component of the BOSA device 1 respectively.

[0099] Step 302: Engage the first protrusion 13 on the BOSA device 1 into the first locking hole 211, partially insert the first limiting arm 21 into the first groove 15, engage the second protrusion 14 on the BOSA device 1 into the second locking hole 221, and fill the second groove 16 with the first limiting arm 21 to fix the BOSA device 1 on the intermediate seat 2.

[0100] Step 303: After the protruding foot 231 passes through the positioning hole 31, the intermediate seat 2 is fixed on the PCB board 3.

[0101] Step 304: Solder the positioning pads on the FPC board 4 to the positioning pads on the PCB board 3, and solder the signal pads on the FPC board 4 to the corresponding signal pads on the PCB board 3.

[0102] Steps 301-304 above present a completely different sales model compared to steps 201-204. Although, purely from a content perspective, the only difference is the order of the steps, they conceal corresponding commercial implications. Steps 301-302 can be the process steps for the seller of the product proposed in this invention, while the corresponding steps 303-304 are the process steps for the manufacturer purchasing the BOSA device products assembled using the device proposed in this invention. That is, steps 301-302 and 303-304 are actually processing processes in two separate factories. In contrast, steps 201-204 above can be understood as a method flow where all processes are performed in the same factory.

[0103] In addition, the extended process of the method of the present invention can also be represented by the following steps in sequence:

[0104] Step 401: Engage the first boss 13 on the BOSA device 1 with the first locking hole 211, partially insert the first limiting arm 21 into the first groove 15, engage the second boss 14 on the BOSA device 1 with the second locking hole 221, and fill the second groove 16 with the first limiting arm 21 to fix the BOSA device 1 on the intermediate seat 2.

[0105] Step 402: After the protruding foot 231 passes through the positioning hole 31, the intermediate seat 2 is fixed on the PCB board 3.

[0106] Step 403: Solder the two mounting parts 41 of the FPC board 4 to the light emitting component and the light receiving component of the BOSA device 1 respectively.

[0107] Step 404: Solder the positioning pads on the FPC board 4 to the positioning pads on the PCB board 3, and solder the signal pads on the FPC board 4 to the corresponding signal pads on the PCB board 3.

[0108] Alternatively, the extended process of the method of the present invention can also be represented by the following steps in sequence:

[0109] Step 501: Engage the first boss 13 on the BOSA device 1 into the first locking hole 211, partially insert the first limiting arm 21 into the first groove 15, engage the second boss 14 on the BOSA device 1 into the second locking hole 221, and fill the second groove 16 with the first limiting arm 21 to fix the BOSA device 1 on the intermediate seat 2.

[0110] Step 502: Solder the two mounting portions 41 of the FPC board 4 to the light emitting component and the light receiving component of the BOSA device 1, respectively.

[0111] Step 503: After the protruding foot 231 passes through the positioning hole 31, the intermediate seat 2 is fixed on the PCB board 3.

[0112] Step 504: Solder the positioning pads on the FPC board 4 to the positioning pads on the PCB board 3, and solder the signal pads on the FPC board 4 to the corresponding signal pads on the PCB board 3.

[0113] Correspondingly, steps 401-404 and 501-504 differ only in the order of the installation steps. We will not go into too much detail about them here. In practice, they will be adjusted and applied reasonably according to the compatibility of each manufacturer's processing and production line.

[0114] In this embodiment, the intermediate seat is provided with a protrusion 231. The intermediate seat is fixed to the PCB board by the cooperation of the protrusion 231 and the positioning hole 31. The BOSA device 1 is provided with a boss, and the intermediate seat 2 is provided with a locking hole. The BOSA device 1 is fixed to the intermediate seat 2 by the cooperation of the boss and the locking hole, which can avoid the occurrence of misalignment. In addition, this fixing method does not require adhesive connection or baking curing. The installation method is simple and can achieve quick installation, so as to quickly, accurately and firmly fix the BOSA device 1 to the PCB board 3.

[0115] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An assembly apparatus for a BOSA device, characterized in that, include: BOSA device (1) and intermediate base (2), wherein: The BOSA device (1) includes a base, the base including a first side (11) and a second side (12) disposed opposite to each other, a first boss (13) is provided on the first side (11), and a second boss (14) is provided on the second side (12); The intermediate seat (2) includes a base plate (23), a first limiting arm (21) and a second limiting arm (22). The first limiting arm (21) and the second limiting arm (22) are both disposed on the base plate (23) and are disposed opposite to each other. The base plate (23), the first limiting arm (21) and the second limiting arm (22) form an installation space. The first limiting arm (21) is provided with a first fastening hole (211) and the second limiting arm (22) is provided with a second fastening hole (221). The base plate (23) is also provided with at least one protruding foot (231), which is located on the side opposite to the first limiting arm (21); the protruding foot (231) is used to fix it in the positioning hole (31) on the PCB board; The base is disposed in the installation space, and the first boss (13) engages with the first latching hole (211), and the second boss (14) engages with the second latching hole (221) to fix the BOSA device (1) on the intermediate base (2).

2. The assembly apparatus for the BOSA device as described in claim 1, characterized in that, Two first protrusions (13) are provided on the first side surface (11); A first groove (15) is provided on the first side surface (11), and a first boss (13) is provided in the first groove (15). The two first bosses (13) are respectively provided at both ends of the first groove (15). A second groove (16) is provided on the second side surface (12), and a second boss (14) is provided in the second groove (16). The second boss (14) is provided in the middle area of ​​the second groove (16). The length of the second boss (14) is greater than the length of the first boss (13).

3. The assembly apparatus for the BOSA device as described in claim 2, characterized in that, The intermediate seat (2) includes two first limiting arms (21) and one second limiting arm (22). The two first limiting arms (21) are located on the same side and at both ends of the base plate (23). The second limiting arm (22) is located in the middle area of ​​the base plate (23).

4. The assembly apparatus for the BOSA device as described in claim 1, characterized in that, The base plate (23) is provided with a first notch (232) and a second notch (233). The first notch (232) is located near the first limiting arm (21), and the length of the first notch (232) is greater than the length of the first limiting arm (21). The second notch (233) is located near the second limiting arm (22), and the length of the second notch (233) is greater than the length of the second limiting arm (22).

5. The assembly apparatus for the BOSA device as described in claim 4, characterized in that, The assembly device is also equipped with a disassembly and reassembly component (5), which includes an operating arm (52) and a disassembly arm (51). The disassembly arm (51) is provided with a disassembly groove (511) and a movable part (512). The disassembly groove (511) is used to couple with the first limiting arm (21), and the movable part (512) is inserted into the first notch (232). When the operating arm (52) receives an external force, the disassembly groove (511) abuts against the side of the first limiting arm (21), and the movable part (512) moves in the first notch (232) to separate the first boss (13) from the corresponding first latching hole (211).

6. The assembly apparatus for the BOSA device as described in claim 5, characterized in that, A protrusion (513) is provided between the disassembly groove (511) and the movable part (512); The disassembly arm (51) is provided with a first arc surface (514), a second arc surface (515) and a third arc surface (516). The first arc surface (514) is connected to the second arc surface (515) to form the disassembly groove (511); the second arc surface (515) and the third arc surface (516) are connected to form the protrusion (513). The second arc surface (515) is inclined to the plane where the movable part (512) is located, and the angle between the first arc surface (514) and the second arc surface (515) is 80° to 120°.

7. The assembly apparatus for the BOSA device as described in claim 1, characterized in that, Both the first boss (13) and the second boss (14) have an abutment surface (141) and a guide surface (142). The abutment surface (141) is parallel to the upper surface of the base, and the guide surface (142) is inclined to the abutment surface (141). The distance between the guide surface (142) and the base gradually decreases along the direction close to the intermediate seat (2).

8. The assembly apparatus for the BOSA device as described in claim 1, characterized in that, The first limiting arm (21) is provided with a first inclined surface (212), the first inclined surface (212) is located inside the first limiting arm (21), and the first inclined surface (212) is located above the first buckle hole (211); The second limiting arm (22) is provided with a second inclined surface, which is located inside the second limiting arm (22) and is positioned above the second buckle hole (221).

9. A method for installing a BOSA device assembly apparatus, characterized in that, The mounting method is applied to the assembly apparatus for the BOSA device as described in any one of claims 1 to 8, and the mounting method includes: The intermediate seat (2) is fixed on the PCB board (3); The first boss (13) on the BOSA device (1) is engaged with the first latching hole (211), and the second boss (14) on the BOSA device (1) is engaged with the second latching hole (221) to fix the BOSA device (1) on the intermediate seat (2). In this case, the BOSA device (1) is soldered to the FPC board before the intermediate seat (2) is fixed, or the BOSA device (1) is soldered to the FPC board after the intermediate seat (2) is fixed.

10. A method for installing a BOSA device assembly apparatus, characterized in that, The mounting method is applied to the assembly apparatus for the BOSA device as described in any one of claims 1 to 8, and the mounting method includes: The first boss (13) on the BOSA device (1) is engaged with the first latching hole (211), and the second boss (14) on the BOSA device (1) is engaged with the second latching hole (221) to fix the BOSA device (1) on the intermediate seat (2). The intermediate seat (2) is fixed on the PCB board (3); In this case, the BOSA device (1) is soldered to the FPC board before the intermediate seat (2) is fixed, or the BOSA device (1) is soldered to the FPC board after the intermediate seat (2) is fixed.

Images