Fingerprint identification module and fingerprint identification device

Abstract

The application provides a fingerprint identification module and a fingerprint identification device, and relates to the technical field of fingerprint identification. The fingerprint identification module comprises a substrate, a fingerprint identification device arranged on one side of the substrate, a plurality of sensing units arranged on the fingerprint identification device, a shielding layer arranged on the side of the fingerprint identification device away from the substrate, a plurality of first through holes arranged on the shielding layer, and a metal lead layer comprising a first part arranged on the side of the shielding layer away from the substrate and a second part connected with the fingerprint identification device through the shielding layer via the first through holes.

Description

Technical Field

[0001] This application relates to the field of fingerprint recognition technology, and more specifically, to a fingerprint recognition module and a fingerprint recognition device. Background Technology

[0002] With the continuous improvement of living standards, various terminal devices have become necessities in life, and users' requirements for these devices are also increasing. In terms of security, fingerprint recognition offers excellent privacy protection due to the unique characteristics of each individual fingerprint. Therefore, fingerprint recognition is widely used in various terminal devices to enhance user experience and security. Examples include mobile phones, tablets, and televisions in electronic devices; and access control systems and safes in security systems.

[0003] However, existing fingerprint recognition devices have a planar structure with their leads arranged around the fingerprint recognition module. This results in the fingerprint recognition module failing to meet requirements in many aspects, such as material utilization, chip performance, and application scenarios. Summary of the Invention

[0004] The present application provides a fingerprint recognition module and a fingerprint recognition device to overcome or at least partially solve the above-mentioned problems.

[0005] The first aspect of this application provides a fingerprint recognition module, including:

[0006] In one alternative implementation, the substrate;

[0007] A fingerprint recognition device, wherein the fingerprint recognition device is disposed on one side of the substrate, and the fingerprint recognition device is provided with multiple sensing units;

[0008] A shielding layer is disposed on the side of the fingerprint recognition device away from the substrate, and a plurality of first vias are provided on the shielding layer;

[0009] The metal lead layer includes a first portion disposed on the side of the shielding layer opposite to the substrate, and a second portion passing through the shielding layer and connected to the fingerprint recognition device via the first via.

[0010] In one alternative embodiment, the fingerprint recognition device includes a first region and a second region surrounding the first region, the sensing unit is located within the first region, and the first via is located inside the first region in the orthographic projection of the fingerprint recognition device.

[0011] In one alternative embodiment, the fingerprint recognition device includes a first region and a second region surrounding the first region, the sensing unit is located within the first region, and the first via is located inside the second region in the orthographic projection of the fingerprint recognition device.

[0012] In one optional implementation, the fingerprint recognition module further includes:

[0013] An insulating layer is located between the metal lead layer and the shielding layer. The insulating layer has a plurality of second vias, through which the second part passes through the insulating layer and connects to the fingerprint recognition device.

[0014] In one alternative embodiment, the orthographic projection center of the first via on the substrate coincides with the orthographic projection center of the second via on the substrate.

[0015] In one alternative embodiment, the diameter of the first via is larger than the diameter of the second via.

[0016] In one alternative embodiment, the diameter of the second part is equal to the aperture of the second via; the insulating layer is filled between the shielding layer and the second part within the first via.

[0017] In one alternative embodiment, the orthographic projection shape of the shielding layer on the substrate includes: a polygon, an arc, or a combination of polygons and arcs.

[0018] In one optional embodiment, the sensing unit includes at least one first sensing unit and at least one second sensing unit, the first sensing unit and the second sensing unit being spaced apart along a first direction, the orthographic projection of the first sensing unit on the substrate and the orthographic projection of the second sensing unit on the substrate not overlapping; the first sensing unit and the second sensing unit are respectively connected to the second part;

[0019] The first sensing unit includes a plurality of first sensing sub-units spaced apart along a second direction, and the second sensing unit includes a plurality of second sensing sub-units spaced apart along the second direction, wherein the second direction intersects the first direction.

[0020] A second aspect of this application provides a fingerprint recognition device, characterized in that it includes a fingerprint recognition module as described in any one of the first aspects; and

[0021] An image reading component is disposed on the side of the fingerprint recognition module opposite to the substrate.

[0022] Beneficial effects:

[0023] This application provides a fingerprint recognition module and a fingerprint recognition device, comprising: a substrate; a fingerprint recognition device disposed on one side of the substrate, the fingerprint recognition device having multiple sensing units disposed thereon; a shielding layer disposed on the side of the fingerprint recognition device facing away from the substrate, the shielding layer having multiple first vias disposed thereon; and a metal lead layer comprising a first portion disposed on the side of the shielding layer facing away from the substrate, and a second portion passing through the shielding layer and connecting to the fingerprint recognition device vias. By providing a metal lead layer, this application optimizes the connection routing, eliminating the need for the fingerprint recognition device's signal to be transmitted through the periphery of the fingerprint recognition module, shortening the signal transmission path, and reducing the power consumption and cost of the fingerprint recognition module. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic cross-sectional view of a fingerprint recognition module A-A' with leads connected in the second region, according to an embodiment of this application.

[0026] Figure 2 This is a schematic diagram of the orthographic projection structure of a fingerprint recognition module with leads connected in the second region, according to an embodiment of this application.

[0027] Figure 3 This is a schematic diagram of the orthographic projection structure of a fingerprint recognition module with leads connected in the first region, according to an embodiment of this application.

[0028] Figure 4 This is a schematic cross-sectional view of a fingerprint recognition module B-B' with leads connected in the first region, according to an embodiment of this application.

[0029] Figure 5 This is a schematic diagram of the orthographic projection structure of an arc-shaped fingerprint recognition module according to an embodiment of this application;

[0030] Figure 6 This is a C-C' cross-sectional structural diagram of an arc-shaped fingerprint recognition module proposed in one embodiment of this application.

[0031] Explanation of reference numerals in the attached figures: 101, substrate; 1, fingerprint recognition device; 1-1, first sensing unit; 1-11, first sensing sub-unit; 1-2, second sensing unit; 1-3, connecting line; 1-21, second sensing sub-unit; 2, shielding layer; 2-1, first via; 3, insulating layer; 3-1, second via; 4, metal lead layer; 4-1, first part; 4-2, second part; 5, image reading component; A1, first region; A2, second region; X, first direction; Y, second direction. Detailed Implementation

[0032] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0033] In related technologies, existing fingerprint recognition devices have a planar structure, with their leads arranged around the periphery of the fingerprint recognition module. This results in the fingerprint recognition module failing to meet requirements in several aspects, including material utilization, chip performance, and application scenarios. Specifically, the signal transmitting and receiving units on the fingerprint recognition module need to be connected to the image reading component for fingerprint signal reading via wiring. Since the fingerprint recognition module and the image reading component are located on the same plane, the leads between them are arranged around the signal transmitting and receiving units within the fingerprint recognition module. This increases the area of ​​the fingerprint recognition module to accommodate the peripheral leads, leaving the area unused for the signal transmitting and receiving units. Therefore, the effective area of ​​a planar fingerprint recognition device is low, leading to poor material utilization.

[0034] On the other hand, since the leads between the image reading component and the fingerprint recognition module are arranged around the signal transmitting unit and the signal receiving unit in the signal recognition module, the signal transmitting unit and the signal receiving unit in the effective area need to be connected to the image reading component through the leads of the peripheral line. This makes the signal transmission path between the fingerprint recognition module and the image reading component longer, increases the RC hysteresis, thereby increasing the power consumption of the fingerprint recognition device and having an adverse effect on the fingerprint recognition performance.

[0035] In view of this, embodiments of this application propose a fingerprint recognition module. Figure 1 This illustration shows a schematic cross-sectional view of a fingerprint recognition module A-A' with leads connected in the second region, according to an embodiment of this application. Figure 1As shown, the fingerprint recognition module includes: a substrate 101; a fingerprint recognition device 1 disposed on one side of the substrate 101; a shielding layer 2 disposed on the side of the fingerprint recognition device 1 away from the substrate 101, the shielding layer 2 having a plurality of first vias 2-1; and a metal lead layer 4, the metal lead layer 4 including a first part 4-1 disposed on the side of the shielding layer 2 away from the substrate 101, and a second part 4-2 passing through the shielding layer 2 and connected to the fingerprint recognition device 1 via the first vias 2-1.

[0036] Figure 2 This illustration shows a schematic diagram of the orthographic projection structure of a fingerprint recognition module with leads connected in the second region, according to an embodiment of this application. Figure 2 As shown in this embodiment, the substrate 101 is made of glass or plastic. The fingerprint recognition device 1 is used to acquire the sensing signal of a fingerprint and convert it into an electrical signal for transmission. The fingerprint recognition device 1 includes a first region A1 and a second region A2 located around the first region A1. Multiple sensing units are disposed on the fingerprint recognition device, and the sensing units are located within the first region A1. The sensing unit includes at least one first sensing unit 1-1 (…). Figure 2 The first sensing unit is outlined in an elliptical box for illustrative purposes only. It is used to indicate that the first sensing unit 1-1 includes multiple first sensing sub-units 1-11 arranged along the second direction, and a second sensing unit 1-2. Figure 2 The second sensing unit is schematically outlined within an elliptical frame. It represents a plurality of second sensing sub-units 1-2 (1-21) arranged along a second direction. The first sensing unit 1-1 and the second sensing unit 1-2 are spaced apart along a first direction X. The orthographic projections of the first sensing unit 1-1 and the second sensing units 1-2 on the substrate 101 do not overlap. It should be noted that the first direction in this embodiment can be determined according to actual conditions and is not limited to... Figure 2 The horizontal direction shown.

[0037] In the embodiments of this application, such as Figure 2As shown, the first sensing unit 1-1 includes a plurality of first sensing sub-units 1-11 spaced apart along the second direction Y, and the second sensing unit 1-2 includes a plurality of second sensing sub-units 1-12 spaced apart along the second direction Y. One of the first and second sensing sub-units is a signal receiving sub-unit, used to receive the sensing signal from fingerprint sensing; the other is a signal transmitting sub-unit, used to transmit a signal to the finger to generate the required sensing signal for fingerprint sensing. Specifically, the first sensing sub-unit can be a signal receiving sub-unit, in which case the second sensing sub-unit is a signal transmitting sub-unit; alternatively, the first sensing sub-unit can also be a signal transmitting sub-unit, in which case the second sensing sub-unit is a signal receiving sub-unit. It should be noted that the second direction in this embodiment can be determined according to actual conditions, as long as the second direction intersects with the first direction, and is not limited to... Figure 2 The vertical direction shown.

[0038] In one alternative embodiment, the sensing unit further includes other signal units, the orthographic projections of which on the substrate do not overlap with the orthographic projections of the first sensing unit and the second sensing unit on the substrate.

[0039] For example, the fingerprint recognition module is a capacitive fingerprint recognition module. The first sensing unit includes multiple first sensing sub-units. The first sensing sub-units are used to emit signals to the fingerprint ridges of the finger to cause a change in capacitance. The second sensing sub-units sense the capacitance change generated by the fingerprint ridges and generate a sensing signal. It should be noted that the above example is only one implementation method proposed to enable those skilled in the art to better understand the solution of this application. In fact, the fingerprint recognition module provided in the embodiments of this application can be a fingerprint recognition module based on various sensing principles, such as capacitive, optical, ultrasonic, or thermal sensing, etc. The type of sensing sub-unit can be determined according to the actual situation, and this application does not limit it here.

[0040] In this embodiment, the shielding layer 2 is used to shield the signals transmitted by the metal lead layer 4, as well as the interference of the image reading component located on the side of the metal lead layer 4 away from the substrate to the fingerprint recognition component 1. Simultaneously, to connect the second part 4-2 of the metal lead layer 4 to the fingerprint recognition component 1, at least one first via 2-1 is provided on the shielding layer 2. The number of first vias 2-1 is the same as the number of second parts 4-2, and the number of first vias 2-1 is greater than or equal to the number of sensing units, ensuring that each first sensing unit 1-1 and each second sensing unit 1-2 is connected to at least one second part 4-2.

[0041] In one alternative implementation, such as Figure 2As shown, the first via 2-1 is projected onto the fingerprint recognition device 1 within the second region A2, so that the second part 4-2 of the metal lead layer 4 is connected to the sensing unit in the first region A1 of the fingerprint recognition device 1 through the first via 2-1 within the second region A2. Specifically, multiple first sensing sub-units 1-11 within the first sensing unit 1-1 are connected by a connecting line 1-3, which extends into the second region A2. The second part 4-2 of the metal lead layer 4 is connected to the connecting line 1-3 extending into the second region A2 through the first via 2-1, thus connecting the second part 4-2 to the first sensing sub-unit 1-11. Similarly, multiple second sensing sub-units 1-21 within the second sensing unit 1-2 are connected by a connecting line 1-3, which extends into the second region A2. The second part 4-2 of the metal lead layer 4 is connected to the connecting line 1-3 extending into the second region A2 through the first via 2-1, thus connecting the second part 4-2 to the second sensing sub-unit 1-21.

[0042] like Figure 1 and Figure 2 As shown, the second part 4-2 of the metal lead layer 4 is connected to the fingerprint recognition device 1 via the connecting line 1-3 extending from the first region A1 to the second region A2. After the sensing unit acquires the sensing signal and converts it into a corresponding electrical signal, the electrical signal is transmitted along the connecting line 1-3 to the second part 4-2 of the metal lead layer 4. It then passes through the shielding layer via the second part 4-2 to reach the first part 4-1 of the metal lead layer 4. The first part 4-1 of the metal lead layer 4 is connected to the image reading component via a metal pattern, realizing information transmission from the fingerprint recognition device to the image reading component. In this embodiment, the stacked three-dimensional fingerprint recognition module allows the electrical signal to be transmitted directly upwards along the normal direction of the substrate via the second part of the metal lead layer, effectively shortening the signal transmission path length, reducing RC hysteresis, and thus reducing the power consumption of the fingerprint recognition module.

[0043] In one alternative implementation, Figure 3 This illustration shows a schematic diagram of the orthographic projection structure of a fingerprint recognition module with leads connected in the first region, according to an embodiment of this application. Figure 4 This illustration shows a schematic cross-sectional view of a fingerprint recognition module B-B' with leads connected in the first region, according to an embodiment of this application. Figure 3 and Figure 4As shown, the first via 2-1 is projected onto the fingerprint recognition device 1 within the first region A1, allowing the second part 4-2 of the metal lead layer 4 to be directly connected to the sensing unit within the first region A1 of the fingerprint recognition device 1 via the first via 2-1. Specifically, multiple first sensing sub-units 1-11 within the first sensing unit 1-1 are connected by connecting lines 1-3. The second part 4-2 of the metal lead layer 4 can be directly connected to the first sensing sub-units 1-11 within the first region A1 via the first via 2-1, or it can be connected to the connecting lines 1-3 between the first sensing sub-units within the first region A1. Similarly, multiple second sensing sub-units 1-21 within the second sensing unit 1-2 are connected by connecting lines 1-3. The second part 4-2 of the metal lead layer 4 can be directly connected to the second sensing sub-units 1-21 within the first region A1 via the first via 2-1, or it can be connected to the connecting lines 1-3 between the second sensing sub-units 1-21 within the first region A1.

[0044] By connecting the second part 4-2 to the fingerprint recognition device 1 (i.e., the orthographic projection of the first via 2-1 onto the fingerprint recognition device 1 is located inside the first region A1), the electrical signal generated by the sensing unit in the fingerprint recognition device 1 does not need to be transmitted to the connecting line 1-3 in the second region A2. Instead, it can be directly transmitted to the image reading component through the second part 4-2, which is connected to the sensing sub-unit or connecting line 1-3 in the first region A1, further shortening the signal transmission path length.

[0045] In one optional embodiment, the first via 2-1 is partially located inside the second region A2 and partially located inside the first region A1, where its orthographic projection is on the fingerprint recognition device 1. When the second part 4-2 is directly connected to the sensing subunit or connecting line 1-3 in the first region A1, although the signal transmission path length can be further reduced, if too much of the orthographic projection of the first via 2-1 is located inside the first region A1, the shielding effect of the shielding layer 2 will be weakened. Therefore, to simultaneously achieve both shielding effectiveness and reduce RC hysteresis, the first via 2-1 of the shielding layer can be configured such that part of its orthographic projection is located inside the second region A2 and partially located inside the first region A1. It should be noted that the specific number of first vias whose orthographic projection is located inside the first region of the fingerprint recognition device 1 can be determined according to actual conditions, for example, based on the signal-to-noise ratio of the final transmitted signal; this application does not impose any limitations on this.

[0046] In existing planar fingerprint recognition modules, the area of ​​the ineffective sensing region (equivalent to the second region A2) is further increased due to the fact that the leads are located within the ineffective sensing region and need to be routed from the same plane, while the area of ​​the effective sensing region (i.e., the first region A1) is reduced. For example, for a planar fingerprint recognition module with 192*256 sensing units, the effective sensing region accounts for less than 60%. In this embodiment, the second part 4-2 of the metal lead layer 4 is mostly or even entirely located within the first region A1 in the orthographic projection of the fingerprint recognition device 1. Furthermore, the three-dimensional routing achieved through the second part 4-2 effectively reduces the area of ​​the ineffective sensing region, making the effective sensing area close to 100%, which improves material utilization and production efficiency. Simultaneously, compared to routing from the periphery of the effective sensing region, the three-dimensional routing method based on the second part 4-2 can significantly shorten the signal transmission path and reduce signal line width limitations, thereby reducing signal attenuation, lowering chip power consumption, and improving chip performance.

[0047] In this embodiment, the material of the metal lead layer 4 can be any one or more of a variety of good conductors with electrical signals, such as copper, aluminum, molybdenum, titanium, and indium tin oxide. The pins of the metal lead layer 4 connected to the image reading component can be surface treated. Preferably, the pins can be surface treated by methods such as immersion gold, immersion silver, immersion tin, gold plating, nickel plating, and OSP (Organic Solderability Preservatives).

[0048] In an optional embodiment, to prevent a short circuit between the first part 4-1 of the metal lead layer 4 and the shielding layer, the fingerprint recognition module further includes an insulating layer 3. The insulating layer 3 is located between the metal lead layer 4 and the shielding layer 2. The insulating layer 3 has a plurality of second vias 3-1. The second part 4-2 passes through the insulating layer 3 vias 3-1 and connects to the fingerprint recognition device 1. Specifically, to ensure that the second part 4-2 connects to the fingerprint recognition device 1 vias 3-1 and 2-1 sequentially along the shortest path, the orthographic projection center of the first via 2-1 on the substrate 101 coincides with the orthographic projection center of the second via 3-1 on the substrate 101.

[0049] In one alternative implementation, such as Figure 1As shown, in the fingerprint recognition device 1, to prevent a short circuit caused by direct contact between the first sensing unit 1-1 and the second sensing unit 1-2, a first insulating layer is provided between the first sensing unit 1-1 and the second sensing unit 1-2. The first insulating layer has multiple vias, and the second part 4-2 passes through the vias in the first insulating layer to connect with the first sensing unit. Preferably, the material of the first insulating layer can be the same as that of the insulating layer 3 to reduce costs. Furthermore, to prevent a short circuit caused by direct contact between the second sensing unit 1-2 and the shielding layer 2, a second insulating layer is provided between the second sensing unit 1-2 and the shielding layer. The second insulating layer has multiple vias, and the second part 4-2 passes through the vias in the second insulating layer to connect with the fingerprint recognition device 1. Preferably, the material of the first insulating layer can be the same as that of the insulating layer 3.

[0050] In one optional embodiment, to prevent a short circuit between the second part 4-2 of the metal lead layer 4 and the shielding layer 2, the diameter of the first via 2-1 is larger than the diameter of the second via 3-1; the diameter of the second part 4-2 is equal to the diameter of the second via 3-1, so that the second part 4-2 is in contact with the insulating layer 3; the insulating layer 3 is filled between the shielding layer 2 and the second part 4-2 within the first via 2-1. By providing a first via 2-1 with a diameter larger than that of the second via 3-1, the wall of the first via 2-1 does not contact the second part 4-2, and the material of the insulating layer 3 is used to fill the gap, thus isolating the shielding layer 2 and the second part 4-2 and preventing a short circuit.

[0051] In one optional embodiment, the fingerprint recognition module further includes an auxiliary layer located between the fingerprint recognition device 1 and the first portion 4-1 of the metal lead layer 4. For example, in an optical fingerprint recognition module, a collimation layer is disposed as the auxiliary layer on the side of the fingerprint recognition device 1 facing away from the substrate.

[0052] In one optional embodiment, the orthographic projection shape of the shielding layer 2 on the substrate 101 includes: a polygon, an arc, or a combination of polygons and arcs. Because the wiring of a planar fingerprint recognition device is located in the ineffective sensing area surrounding the effective sensing area, it is impossible to directly modify the shielding layer (e.g., shape, size, etc.) to adapt to different application scenarios. If the shape of the shielding layer needs to be modified, the entire development process (e.g., layout design, mask fabrication, tape-out, etc.) needs to be restarted due to the limitations of wiring modifications, resulting in a long development cycle and high development costs. In this embodiment, since the orthographic projection of the second part 4-2 of the metal lead layer 4 on the fingerprint recognition device 1 is mostly located in the first area, the first via 2-1 on the shielding layer 2 corresponding to the second part 4-2 is not in the outer area of ​​the shielding layer (corresponding to the second area). Therefore, based on the shielding layer requirements of different application scenarios, its outer shape can be directly changed without affecting the position of the first via 2-1. This allows fingerprint recognition modules produced in the same batch to be adapted to different size and shape requirements through simple secondary cutting, shortening the development cycle and reducing development costs.

[0053] For example, Figure 5 This illustration shows a schematic diagram of the orthographic projection structure of an arc-shaped fingerprint recognition module according to an embodiment of this application. Figure 6 This paper illustrates a C-C' cross-sectional structure of an arc-shaped fingerprint recognition module according to an embodiment of this application. Figure 5 and Figure 6 As shown, when the application scenario requires an arc-shaped (e.g., circular) fingerprint recognition device, since the orthographic projection of the first via 2-1 onto the fingerprint recognition device 1 is located inside the first region A1, the second part 4-2 of the metal lead layer 4 is directly connected to the sensing unit in the first region A1 of the fingerprint recognition device 1 through the first via 2-1. Therefore, the orthographic projection of the first via 2-1 of the shielding layer 2 onto the fingerprint recognition device 1 is not within the second region A2, and the outer periphery of the shielding layer (corresponding to the second region A2) can be directly cut a second time to modify the shape of the shielding layer and other layers of the fingerprint recognition module corresponding to the shielding layer into a circle.

[0054] This application provides a fingerprint recognition module, comprising: a substrate; a fingerprint recognition device disposed on one side of the substrate, the fingerprint recognition device having multiple sensing units disposed thereon; a shielding layer disposed on the side of the fingerprint recognition device facing away from the substrate, the shielding layer having multiple first vias disposed thereon; and a metal lead layer comprising a first portion disposed on the side of the shielding layer facing away from the substrate, and a second portion passing through the shielding layer and connecting to the fingerprint recognition device vias. By providing a metal lead layer, this application optimizes the connection routing, eliminating the need for the fingerprint recognition device's signal to be transmitted through the periphery of the fingerprint recognition module, shortening the signal transmission path, and reducing the power consumption and cost of the fingerprint recognition module.

[0055] Based on the same inventive concept, this application discloses a fingerprint recognition device, including a fingerprint recognition module as described in the embodiments of this application; and an image reading component, wherein the image reading component is disposed on the side of the fingerprint recognition module opposite to the substrate.

[0056] like Figure 1 As shown, the image reading component 5 is located on the side of the first part 4-1 of the metal lead layer 4 facing away from the substrate. The image reading component 5 is used to perform noise reduction, analog-to-digital conversion, and other processing on the electrical signals transmitted based on the metal lead layer 4 to form a fingerprint image. Figure 2 As shown, the lead pattern formed on the first part 4-1 of the metal lead layer 4 after the patterning process is connected to the pin of the image reading component 5.

[0057] In one optional embodiment, the image reading component 5 fixes the fingerprint image reading chip 5 to the side of the first part 4-1 of the metal lead layer 4 facing away from the substrate 101 through processes such as encapsulation, reflow soldering, thermoforming, and bonding with various conductive adhesives such as anisotropic conductive adhesive. The position of the orthographic projection of the image reading chip 5 onto the first part 4-1 of the metal lead layer 4 can be determined according to actual conditions, and this application does not impose any limitations thereon.

[0058] It should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0059] It should also be noted that, in this document, the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations, nor should they be construed as indicating or implying relative importance. Moreover, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements, but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. In the absence of further restrictions, an element defined by the phrase "includes a..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes the element.

[0060] Although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the embodiments of the present invention.

[0061] The technical solutions provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand this application, and the content of this specification should not be construed as a limitation of this application. Furthermore, for those skilled in the art, there will be different forms of changes in the specific implementation methods and application scope based on this application. It is neither necessary nor possible to exhaustively list all implementation methods here, and obvious changes or modifications derived therefrom are still within the protection scope of this application.

Claims

1. A fingerprint recognition module, characterized in that, include: Substrate; A fingerprint recognition device, wherein the fingerprint recognition device is disposed on one side of the substrate, and the fingerprint recognition device is provided with multiple sensing units; A shielding layer is disposed on the side of the fingerprint recognition device away from the substrate, and a plurality of first vias are provided on the shielding layer; The metal lead layer includes a first portion disposed on the side of the shielding layer opposite to the substrate, and a second portion passing through the shielding layer and connected to the fingerprint recognition device via the first via.

2. The fingerprint recognition module according to claim 1, characterized in that, The fingerprint recognition device includes a first region and a second region surrounding the first region. The sensing unit is located within the first region, and the first via is projected onto the fingerprint recognition device within the first region.

3. The fingerprint recognition module according to claim 1, characterized in that, The fingerprint recognition device includes a first region and a second region surrounding the first region, the sensing unit is located within the first region, and the first via is projected onto the fingerprint recognition device within the second region.

4. The fingerprint recognition module according to claim 1, characterized in that, The fingerprint recognition module also includes: An insulating layer is located between the metal lead layer and the shielding layer. The insulating layer has a plurality of second vias, through which the second part passes through the insulating layer and connects to the fingerprint recognition device.

5. The fingerprint recognition module according to claim 4, characterized in that, The orthographic projection center of the first via on the substrate coincides with the orthographic projection center of the second via on the substrate.

6. The fingerprint recognition module according to claim 4, characterized in that, The diameter of the first via is larger than the diameter of the second via.

7. The fingerprint recognition module according to claim 4, characterized in that, The diameter of the second part is equal to the diameter of the second via; the insulating layer is filled between the shielding layer and the second part within the first via.

8. The fingerprint recognition module according to claim 1, characterized in that, The orthographic projection shape of the shielding layer on the substrate includes: a polygon, an arc, or a combination of a polygon and an arc.

9. The fingerprint recognition module according to claim 1, characterized in that, The sensing unit includes at least one first sensing unit and at least one second sensing unit, the first sensing unit and the second sensing unit are spaced apart along a first direction, and the orthographic projection of the first sensing unit on the substrate and the orthographic projection of the second sensing unit on the substrate do not overlap; the first sensing unit and the second sensing unit are respectively connected to the second part; The first sensing unit includes a plurality of first sensing sub-units spaced apart along a second direction, and the second sensing unit includes a plurality of second sensing sub-units spaced apart along the second direction, wherein the second direction intersects the first direction.

10. A fingerprint recognition device, characterized in that, Including the fingerprint recognition module as described in any one of claims 1 to 9; and An image reading component is disposed on the side of the fingerprint recognition module opposite to the substrate.

Images