Chip bonding method and apparatus

Abstract

This invention provides a chip bonding method and apparatus. The chip bonding method includes: providing a substrate and a shape memory conductive film; at least one chip is fixed on the surface of the substrate, and the surface has multiple pads corresponding one-to-one with multiple solder feet of the chip; placing the shape memory conductive film on the chip, wherein the shape memory conductive film at least covers the chip and the pads corresponding to the chip's solder feet; heating the shape memory conductive film to above its deformation temperature, causing the shape memory conductive film to return to a first shape, and in the first shape shape conductive film, a first portion and a second portion of the conductive sheet area overlap with the solder on the corresponding pads of the substrate and the solder feet of the chip; heating the solder on the solder feet and pads to a molten state, and then using the cooled and solidified solder to weld and fix the conductive sheet area of ​​the shape memory conductive film to the pads of the substrate and the solder feet of the chip, respectively. This invention can greatly improve chip bonding efficiency.

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