A two-in-one silicon rod rapid die bonding method and system based on robot technology

Abstract

The application provides a two-in-one silicon rod fast die bonding method and system based on robot technology, and the method comprises the following steps: a PLC control system controls a wafer holder side pushing device to position a wafer holder, and a wafer holder positioning photoelectric sensor sends a wafer holder positioning signal; a glue coating machine obtains the wafer holder positioning information, performs a first glue coating operation on the wafer holder, and prepares a wafer holder after glue coating; a resin plate is placed above the wafer holder after glue coating to prepare a wafer holder resin plate assembly, and a silicon rod photoelectric sensor sends a second glue coating signal; the glue coating machine obtains the second glue coating signal, performs a second glue coating operation on the wafer holder resin plate assembly, and prepares a wafer holder resin plate assembly after second glue coating; and a silicon rod is placed on the wafer holder resin plate assembly after second glue coating to prepare a silicon rod assembly. The application effectively improves production efficiency, avoids uncontrollability of manual operation, improves process operation precision, and ensures reliability of silicon wafer production.

Description

Technical Field

[0001] This invention relates to the field of photovoltaic wafer slicing, specifically to a method and system for rapid crystal bonding of a two-in-one silicon rod based on robotics. Background Technology

[0002] Currently, in the photovoltaic wafer slicing industry, silicon rods need to be glued to the plastic sheet and crystal holder before entering the slicing process. The existing bonding method involves first bonding the plastic sheet to the crystal holder with adhesive, then using a counterweight to press down on the plastic sheet, allowing it to pre-cur under pressure. Once the plastic sheet and crystal holder are no longer prone to relative displacement, the counterweight is removed, forming the first module. At another station, the silicon rod is glued to the plastic sheet of the first module, and pre-cured again under a counterweight, forming the second module. The second module is then transferred to a curing area for static curing until fully cured before proceeding to the next step.

[0003] When manually loading the crystal trays, employees must use a crystal tray cart to transport the crystal trays to the designated location; employees must use a hammer and chisel to knock off the residual silicon on the surface of the resin board to ensure that there is no obvious residual silicon on the surface of the resin board; when stacking crystal trays, employees can only stack a maximum of four layers and cannot exceed the limit.

[0004] The existing technology has the following problems:

[0005] 1. The existing bonding method has the following disadvantages: (1) This method requires two gluings and two pre-curings with a long curing time, resulting in low overall production efficiency and complicated procedures and cumbersome operation; (2) The two gluings are performed at different work stations, which increases the labor intensity of employees and increases production costs.

[0006] 2. Manually loading the crystal tray involves a certain degree of uncontrollability, and the work station is a high-temperature position, which can easily cause harm to employees. Summary of the Invention

[0007] To address the aforementioned technical problems, this invention provides a rapid die bonding method for a two-in-one silicon rod based on robotics technology. The specific technical solution is as follows:

[0008] A rapid die bonding method for a two-in-one silicon rod based on robotics technology, comprising the following steps:

[0009] The PLC control system acquires the crystal tray positioning signal and controls the movement state of the crystal tray side pushing device according to the crystal tray positioning signal to position the crystal tray. The crystal tray positioning photoelectric sensor sends the crystal tray positioning signal.

[0010] The glue coating machine acquires the crystal tray positioning information and performs a glue coating operation on the crystal tray according to the crystal tray positioning signal to obtain the glue-coated crystal tray.

[0011] The resin board is placed on top of the coated crystal holder to obtain the crystal holder resin board assembly, and the silicon rod photoelectric sensor sends a secondary coating signal.

[0012] The glue applicator acquires a secondary glue applicator signal and performs a secondary glue applicator operation on the crystal holder resin plate assembly according to the secondary glue applicator signal to obtain the crystal holder resin plate assembly after secondary glue applicator.

[0013] A silicon rod is placed on the crystal support resin plate assembly after secondary adhesive coating to obtain a crystal rod assembly. The upper counterweight is in place and the photoelectric sensor sends the upper counterweight signal.

[0014] The robotic arm acquires the upper counterweight signal, and places the counterweight fixture on the crystal rod assembly according to the upper counterweight signal for pressure and curing to obtain a pre-cured crystal rod assembly. The photoelectric sensor sends the counterweight removal signal when the counterweight is in place.

[0015] Obtain the de-counterweight signal from the de-counterweight mechanism, remove the counterweight fixture according to the de-counterweight signal, and allow the pre-cured crystal rod assembly to be statically cured to obtain the crystal rod.

[0016] The novel two-in-one rapid die bonding method for silicon rods provided by this invention combines two bonding processes and two pre-curing processes into two bonding processes and one pre-curing process. The two bonding processes are continuous, with the second bonding process occurring immediately after the first bonding process, making full use of the production cycle and effectively improving production efficiency. Robot technology is used to complete processes such as placing the die holder, adding counterweights, and removing the rod, avoiding the uncontrollability of manual operation, and the application of robotic technology effectively reduces the labor intensity of employees. PLC control technology is used to control cylinders to complete the positioning of the die holder, silicon rod, resin plate, and die holder assembly, effectively improving the operational accuracy of the corresponding processes and ensuring the reliability of silicon wafer production.

[0017] In a preferred implementation,

[0018] The duration of pressure curing is 1000s-1200s; and / or

[0019] The ambient temperature for pressure curing is 22℃-30℃; and / or

[0020] The counterweight fixture must weigh at least 80 kg.

[0021] In a preferred implementation, the station for the first gluing operation and the station for the second gluing operation are the same station.

[0022] In a preferred implementation, the crystal tray is placed on the production line and conveyed to the upper crystal tray station. When the crystal tray touches the upper crystal tray photoelectric sensor, the upper crystal tray photoelectric sensor sends an upper crystal tray signal.

[0023] The PLC control system acquires the upper crystal tray signal and controls the stopper to rise according to the upper crystal tray signal. When the crystal tray touches the stopper, the upper crystal tray positioning photoelectric sensor sends the upper crystal tray positioning signal.

[0024] The robotic arm acquires the upper crystal tray positioning signal and grabs the crystal tray to the designated station according to the upper crystal tray positioning signal. After the crystal tray arrives at the designated station, the crystal tray positioning photoelectric sensor sends the crystal tray positioning signal.

[0025] In a preferred implementation, the PLC control system controls the movement state of the crystal tray side-pushing device according to the crystal tray positioning signal to position the crystal tray, and sends a crystal tray positioning signal, including:

[0026] After the crystal tray side-pushing device positions the crystal tray, it triggers the crystal tray positioning photoelectric sensor to send a crystal tray positioning signal.

[0027] In a preferred implementation, after obtaining the crystal support resin plate assembly, the method further includes:

[0028] The crystal substrate resin board assembly triggers the upper silicon rod photoelectric sensor, which then sends a secondary adhesive application signal to the adhesive applicator.

[0029] In a preferred implementation, after obtaining the crystal rod assembly, the method further includes:

[0030] The crystal rod assembly triggers the crystal rod clamping photoelectric sensor, which then sends a clamping signal.

[0031] The PLC control system acquires the clamping signal and uses a cylinder to control the movement of the crystal rod clamping device to complete the positioning of the crystal rod assembly.

[0032] After the crystal rod clamping device positions the crystal rod assembly, it triggers the upper counterweight positioning photoelectric sensor to send an upper counterweight signal.

[0033] In a preferred implementation, after obtaining the pre-cured crystal rod assembly, the method further includes:

[0034] The pre-cured crystal rod assembly triggers the de-weighting photoelectric sensor, which then sends a de-weighting signal.

[0035] In a preferred implementation, after obtaining the crystal rod, the method further includes:

[0036] The crystal rod triggers the photoelectric sensor to reach the bottom position, and the bottom position photoelectric sensor sends a bottom position signal. The robot arm then transfers the crystal rod to the next process according to the bottom position signal.

[0037] A robotic-based rapid die bonding system for a two-in-one silicon rod, comprising:

[0038] Multiple photoelectric sensors are installed at different workstations on the production line. Each photoelectric sensor can send a corresponding signal to the PLC control system. The multiple photoelectric sensors include at least: a crystal tray positioning photoelectric sensor, a crystal tray positioning photoelectric sensor, an upper silicon rod photoelectric sensor, a crystal rod clamping photoelectric sensor, an upper counterweight positioning photoelectric sensor, and a lower counterweight positioning photoelectric sensor.

[0039] A robotic arm is capable of receiving signal commands from multiple photoelectric sensors and performing corresponding operations based on those commands.

[0040] A blocker is used to determine the position of a crystal holder or a silicon rod.

[0041] A cylinder is used to control the rise or reset of the stopper.

[0042] Glue applicator: A glue applicator is used to perform glue application operations;

[0043] The PLC control system is connected to multiple photoelectric sensors, robotic arms, stoppers, and cylinder electrical signals. The PLC control system can receive signals sent by multiple photoelectric sensors and send matching control commands according to the corresponding signals. Attached Figure Description

[0044] Figure 1 This is a flowchart of the crystal bonding method in this invention. Detailed Implementation

[0045] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0046] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0047] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0048] In this invention, unless otherwise explicitly specified and limited, the terms "installation", "connection", "linking", "fixing", etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components.

[0049] like Figure 1 As shown, a rapid die bonding method for a two-in-one silicon rod based on robotics technology includes the following steps:

[0050] The PLC control system acquires the crystal tray positioning signal and controls the movement state of the crystal tray side pushing device according to the crystal tray positioning signal to position the crystal tray. The crystal tray positioning photoelectric sensor sends the crystal tray positioning signal.

[0051] The glue coating machine acquires the crystal tray positioning information and performs a glue coating operation on the crystal tray according to the crystal tray positioning signal to obtain the glue-coated crystal tray.

[0052] The resin board is placed on top of the coated crystal holder to obtain the crystal holder resin board assembly, and the silicon rod photoelectric sensor sends a secondary coating signal.

[0053] The glue applicator acquires a secondary glue applicator signal and performs a secondary glue applicator operation on the crystal holder resin plate assembly according to the secondary glue applicator signal to obtain the crystal holder resin plate assembly after secondary glue applicator.

[0054] A silicon rod is placed on the crystal support resin plate assembly after secondary adhesive coating to obtain a crystal rod assembly. The upper counterweight is in place and the photoelectric sensor sends the upper counterweight signal.

[0055] The robotic arm acquires the upper counterweight signal, and places the counterweight fixture on the crystal rod assembly according to the upper counterweight signal for pressure and curing to obtain a pre-cured crystal rod assembly. The photoelectric sensor sends the counterweight removal signal when the counterweight is in place.

[0056] Obtain the de-counterweight signal from the de-counterweight mechanism, remove the counterweight fixture according to the de-counterweight signal, and allow the pre-cured crystal rod assembly to be statically cured to obtain the crystal rod.

[0057] The novel two-in-one rapid die bonding method for silicon rods provided by this invention combines two bonding processes and two pre-curing processes into two bonding processes and one pre-curing process. The two bonding processes are continuous, with the second bonding process occurring immediately after the first bonding process, making full use of the production cycle and effectively improving production efficiency. Robot technology is used to complete processes such as placing the die holder, adding counterweights, and removing the rod, avoiding the uncontrollability of manual operation, and the application of robotic technology effectively reduces the labor intensity of employees. PLC control technology is used to control cylinders to complete the positioning of the die holder, silicon rod, resin plate, and die holder assembly, effectively improving the operational accuracy of the corresponding processes and ensuring the reliability of silicon wafer production.

[0058] In a preferred implementation,

[0059] The duration of pressure curing is 1000s-1200s; and / or

[0060] The ambient temperature for pressure curing is 22℃-30℃; and / or

[0061] The counterweight fixture must weigh at least 80 kg.

[0062] In a preferred implementation, the station for the first gluing operation and the station for the second gluing operation are the same station.

[0063] In a preferred implementation, the crystal tray is placed on the production line and conveyed to the upper crystal tray station. When the crystal tray touches the upper crystal tray photoelectric sensor, the upper crystal tray photoelectric sensor sends an upper crystal tray signal.

[0064] The PLC control system acquires the upper crystal tray signal and controls the stopper to rise according to the upper crystal tray signal. When the crystal tray touches the stopper, the upper crystal tray positioning photoelectric sensor sends the upper crystal tray positioning signal.

[0065] The robotic arm acquires the upper crystal tray positioning signal and grabs the crystal tray to the designated station according to the upper crystal tray positioning signal. After the crystal tray arrives at the designated station, the crystal tray positioning photoelectric sensor sends the crystal tray positioning signal.

[0066] In a preferred implementation, the PLC control system controls the movement state of the crystal tray side-pushing device according to the crystal tray positioning signal to position the crystal tray, and sends a crystal tray positioning signal, including:

[0067] After the crystal tray side-pushing device positions the crystal tray, it triggers the crystal tray positioning photoelectric sensor to send a crystal tray positioning signal.

[0068] In a preferred implementation, after obtaining the crystal support resin plate assembly, the method further includes:

[0069] The crystal substrate resin board assembly triggers the upper silicon rod photoelectric sensor, which then sends a secondary adhesive application signal to the adhesive applicator.

[0070] In a preferred implementation, after obtaining the crystal rod assembly, the method further includes:

[0071] The crystal rod assembly triggers the crystal rod clamping photoelectric sensor, which then sends a clamping signal.

[0072] The PLC control system acquires the clamping signal and uses a cylinder to control the movement of the crystal rod clamping device to complete the positioning of the crystal rod assembly.

[0073] After the crystal rod clamping device positions the crystal rod assembly, it triggers the upper counterweight positioning photoelectric sensor to send an upper counterweight signal.

[0074] In a preferred implementation, after obtaining the pre-cured crystal rod assembly, the method further includes:

[0075] The pre-cured crystal rod assembly triggers the de-weighting photoelectric sensor, which then sends a de-weighting signal.

[0076] In a preferred implementation, after obtaining the crystal rod, the method further includes:

[0077] The crystal rod triggers the photoelectric sensor to reach the bottom position, and the bottom position photoelectric sensor sends a bottom position signal. The robot arm then transfers the crystal rod to the next process according to the bottom position signal.

[0078] A robotic-based rapid die bonding system for a two-in-one silicon rod, comprising:

[0079] Multiple photoelectric sensors are installed at different workstations on the production line. Each photoelectric sensor can send a corresponding signal to the PLC control system. The multiple photoelectric sensors include at least: a crystal tray positioning photoelectric sensor, a crystal tray positioning photoelectric sensor, an upper silicon rod photoelectric sensor, a crystal rod clamping photoelectric sensor, an upper counterweight positioning photoelectric sensor, and a lower counterweight positioning photoelectric sensor.

[0080] A robotic arm is capable of receiving signal commands from multiple photoelectric sensors and performing corresponding operations based on those commands.

[0081] A blocker is used to determine the position of a crystal holder or a silicon rod.

[0082] A cylinder is used to control the rise or reset of the stopper.

[0083] Glue applicator: A glue applicator is used to perform glue application operations;

[0084] The PLC control system is connected to multiple photoelectric sensors, robotic arms, stoppers, and cylinder electrical signals. The PLC control system can receive signals sent by multiple photoelectric sensors and send matching control commands according to the corresponding signals.

[0085] The above description is merely a preferred embodiment of the present invention, and while it is quite specific and detailed, it should not be construed as a limitation on the scope of the invention patent. It should be noted that several improvements and modifications can be made without departing from the concept of the present invention, and these all fall within the protection scope of the present invention.

Claims

1. A rapid die bonding method for a two-in-one silicon rod based on robotics, characterized in that, The station for the first glue application operation and the station for the second glue application operation are the same station. The method includes the following steps: The PLC control system acquires the crystal tray positioning signal and controls the movement state of the crystal tray side pushing device according to the crystal tray positioning signal to position the crystal tray. The crystal tray positioning photoelectric sensor sends the crystal tray positioning signal. The glue coating machine acquires the crystal tray positioning signal, and performs a glue coating operation on the crystal tray according to the crystal tray positioning signal to obtain the glue-coated crystal tray; The resin board is placed on top of the coated crystal holder to obtain the crystal holder resin board assembly, and the silicon rod photoelectric sensor sends a secondary coating signal. The glue coating machine acquires the secondary glue coating signal and performs a secondary glue coating operation on the crystal holder resin plate assembly according to the secondary glue coating signal to obtain the crystal holder resin plate assembly after secondary glue coating. A silicon rod is placed on the crystal support resin plate assembly after the second coating to obtain a crystal rod assembly. The upper counterweight is in place and the photoelectric sensor sends the upper counterweight signal. After obtaining the crystal rod assembly, the method further includes: The crystal rod assembly triggers the crystal rod clamping photoelectric sensor, and the crystal rod clamping photoelectric sensor sends a clamping signal; The PLC control system acquires the clamping signal and uses a cylinder to control the movement of the crystal rod clamping device according to the clamping signal to complete the positioning of the crystal rod assembly; After the crystal rod clamping device positions the crystal rod assembly, it triggers the upper counterweight positioning photoelectric sensor to send an upper counterweight signal. The robotic arm acquires the upper counterweight signal, and places a counterweight fixture with a weight of at least 80KG on the crystal rod assembly according to the upper counterweight signal for pressure and curing, thereby obtaining a pre-cured crystal rod assembly. The photoelectric sensor sends a counterweight removal signal when the counterweight is in place. The counterweight removal mechanism obtains the counterweight removal signal, removes the counterweight fixture according to the counterweight removal signal, and performs static curing on the pre-cured crystal rod assembly to obtain the crystal rod.

2. The rapid die bonding method for a two-in-one silicon rod based on robot technology according to claim 1, characterized in that: The duration of the pressure curing is 1000s-1200s; and / or The ambient temperature for the pressure curing process is 22℃-30℃.

3. The rapid die bonding method for a two-in-one silicon rod based on robot technology according to claim 1, characterized in that, The PLC control system controls the movement of the crystal tray side-pushing device according to the crystal tray positioning signal to position the crystal tray, and sends a crystal tray positioning signal, including: After the crystal tray side-pushing device positions the crystal tray, it triggers the crystal tray positioning photoelectric sensor to send a crystal tray positioning signal.

4. The rapid die bonding method for a two-in-one silicon rod based on robot technology according to claim 1, characterized in that, The method further includes: The crystal tray is placed on the production line and conveyed to the upper crystal tray station. When the crystal tray touches the upper crystal tray photoelectric sensor, the upper crystal tray photoelectric sensor sends an upper crystal tray signal. The PLC control system acquires the upper crystal tray signal and controls the blocker to rise according to the upper crystal tray signal. When the crystal tray touches the blocker, the upper crystal tray positioning photoelectric sensor sends an upper crystal tray positioning signal. The robotic arm acquires the upper crystal tray positioning signal and grabs the crystal tray to the designated station according to the upper crystal tray positioning signal. After the crystal tray arrives at the designated station, the crystal tray positioning photoelectric sensor sends the crystal tray positioning signal.

5. The rapid die bonding method for a two-in-one silicon rod based on robot technology according to claim 1, characterized in that, After obtaining the crystal substrate resin plate assembly, the method further includes: The crystal substrate resin plate assembly triggers the upper silicon rod photoelectric sensor, which then sends a secondary adhesive application signal to the adhesive applicator.

6. The rapid die bonding method for a two-in-one silicon rod based on robot technology according to claim 1, characterized in that, After obtaining the pre-cured crystal rod assembly, the method further includes: The pre-cured crystal rod assembly triggers the de-weighting photoelectric sensor, which then sends a de-weighting signal.

7. The rapid die bonding method for a two-in-one silicon rod based on robot technology according to claim 1, characterized in that, After obtaining the crystal rod, the method further includes: The ingot triggers the ingot placement photoelectric sensor, which sends an ingot placement signal. The robot arm then transfers the ingot to the next process based on the ingot placement signal.

8. A robotic-based rapid die bonding system for a two-in-one silicon rod, characterized in that, The system is used to implement the rapid die bonding method for a two-in-one silicon rod based on robotics as described in any one of claims 1 to 7, and the system includes: Multiple photoelectric sensors are respectively set at different workstations on the production line. Each photoelectric sensor can send a corresponding signal to the PLC control system. The multiple photoelectric sensors include at least: a crystal tray positioning photoelectric sensor, a crystal tray positioning photoelectric sensor, an upper silicon rod photoelectric sensor, a crystal rod clamping photoelectric sensor, an upper counterweight positioning photoelectric sensor, and a lower counterweight positioning photoelectric sensor. The robotic arm is capable of receiving signal commands from multiple photoelectric sensors and performing corresponding operations based on the signal commands. A blocker, the blocker being used to determine the position of the crystal holder or the silicon rod; A cylinder, the cylinder being used to control the rise or reset of the stopper; Glue applicator: The glue applicator is used to perform glue applicator operations; Crystal tray side-pushing device: The crystal tray side-pushing device is used to position the crystal tray; Crystal rod clamping device: The crystal rod clamping device is used to position the crystal rod assembly; The PLC control system is connected to the multiple photoelectric sensors, the robotic arm, the stopper, and the cylinder electrical signals. The PLC control system can receive signals sent by the multiple photoelectric sensors and send matching control commands according to the corresponding signals.

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