Artificial board and preparation method thereof

Abstract

The present invention provides a method for preparing an artificial board, which is carried out in sequence according to the following steps: (1) applying adhesive to both sides of the finishing layer of the artificial board; (2) bonding the finishing layer to the panel substrate and sealing the edges; (3) cutting to obtain an intermediate piece; (4) subjecting the intermediate piece to electron beam direct curing in a low-oxygen environment to obtain an artificial board product. The present invention also provides an artificial board prepared by the above method. The present invention completely abandons the hot pressing process, and while achieving the same surface effect as the existing technology or even better results, it has the characteristics of modular processing, fewer processing links and high efficiency. The overall workflow and process consume low energy, and can be processed on demand without waiting for shutdown time. In addition, the edge sealing process can be carried out simultaneously when processing the surface layer, ensuring that the color, texture, touch and texture of the edge sealing are consistent with the surface layer.

Description

Technical field:

[0001] The present application relates to the field of building materials, and in particular to an artificial board and a preparation method thereof. Background technology:

[0002] Artificial boards primarily refer to panels made from processed wood components (shavings, fibers, wood chips, wood cores, etc.) with adhesives and a decorative paper / wood veneer. These panels typically consist of a film-coated paper and a base material. Unlike solid sawn timber, these panels are formed by breaking down and gluing wood into a single piece. Their physical properties differ from those of the original wood, and their water resistance is relatively poor. Therefore, national standards require that the non-contact surfaces of artificial boards be veneered and edge-sealed with decorative paper / wood chips and edge banding before subsequent furniture processing.

[0003] Currently, the surface layer of wood-based panels is typically made of thin veneer or veneer paper impregnated with glue. Edge banding strips are typically made of materials such as PVC (polyvinyl chloride) and ABS, both of which serve to protect the substrate. The surface layer is laminated to the substrate, and the sides are sealed with edge banding strips to create the finished wood-based panel. Due to its low raw material requirements, wide availability, high wood utilization, wide product specifications, excellent processing properties, and diverse surface finishes, wood-based panels are now widely used in wooden furniture, home decoration, and building materials, becoming an essential part of people's lives.

[0004] However, the production process of artificial boards still has the following shortcomings: the traditional veneering process mainly includes veneering and gluing operations on the artificial surface by roller pressing or flat pressing, but the overall process is inseparable from heating and pressurizing. The required process flow is long and time-consuming, and the processing equipment scene and operating environment are demanding, and it consumes a lot of energy, which is not in line with the current mainstream trend of energy conservation and emission reduction; some special artificial boards (such as wood veneer artificial boards) need to be cured by UV irradiation to cure the surface veneer, but UV curing has problems such as low penetration and uneven irradiation range, which may easily lead to uneven veneer curing, veneer seams, overlap, or local debonding, and UV irradiation requires light inducers, which may easily lead to environmental pollution and harmful gas residues; the edge banding process requires the processing board to be positioned and moved, which greatly reduces the processing efficiency, and the edge banding strips are easily contaminated during the movement; in addition, because the traditional veneering process and edge banding process cannot be carried out at the same time, the color and texture of the surface and four sides of the artificial board are inconsistent, which reduces the overall beauty and grade of the product.

[0005] In view of this, this invention is proposed. Summary of the invention:

[0006] The present invention aims to provide a method for preparing an artificial board which abandons the traditional hot pressing process and can perform modular processing.

[0007] In order to achieve the above object, the present invention provides a method for preparing a wood-based panel, which is carried out in the following steps:

[0008] (1) Applying adhesive to both sides of the facing layer of the artificial board;

[0009] (2) bonding the facing layer to the panel substrate and sealing the edges;

[0010] (3) Cutting to obtain the middleware;

[0011] (4) The intermediate piece is subjected to electron beam direct curing in a low oxygen environment to obtain a wood-based panel product.

[0012] Preferably or optionally, the raw materials of the adhesive are, by weight, 55-65% of a main resin, 30-35% of a functional monomer, 12-15% of a functional filler, 0.5-2% of a leveling agent, 1-2% of a dispersant, 0.5-2% of a defoaming agent, 0.5-2% of an anti-settling agent, and 0.5-1% of a silane coupling agent.

[0013] Preferably or optionally, the raw materials of the adhesive are 55% main resin, 30% functional monomer, 12.5% ​​functional filler, 0.5% leveling agent, 1% dispersant, 0.5% defoaming agent, 0.5% anti-settling agent, and 0.5% silane coupling agent in weight percentage.

[0014] Among them, the additives used in the present invention, namely the leveling agent, dispersant, defoamer, anti-settling agent and silane coupling agent are all commercially available products conventionally used in the field. Among them, the leveling agent is preferably a siloxane leveling agent, and the silane coupling agent is used to better disperse the functional filler in the raw material and reduce the occurrence of stratification.

[0015] By optimizing the adhesive components, the present invention can reduce the minimum complete curing radiation dose of the adhesive to 10 kGy while ensuring the physical and chemical properties of the finished product (double bond conversion rate). At the same time, the adhesive can withstand an electron beam radiation dose of ≥100 kGy and will not suffer radiation damage or modification under conditions where the electron beam radiation dose is ≤200 kGy.

[0016] Preferably or optionally, the main resin is a modified polyurethane acrylic resin, preferably with the brand CN2281.

[0017] The main resin is used to provide adhesion and mechanical properties of the adhesive after curing.

[0018] Preferably or alternatively, the functional monomer is any one of TMPTA or TMPTMA.

[0019] Furthermore, the functional monomer is selected from any one of SARBIO 5400, SR579 NS, SR350LC NS or SR444DNS.

[0020] Functional monomers serve the purpose of diluting and curing the adhesive.

[0021] Preferably or optionally, the electron beam direct irradiation dose parameter is set to 120-150 kGy, and the acceleration voltage is set to 200-300 kV.

[0022] Preferably or optionally, the oxygen concentration of the hypoxic environment is ≤200 ppm.

[0023] Preferably or optionally, the adhesive coating amount is 10-15g / m 2 .

[0024] On the other hand, the present invention provides a man-made board prepared by the above-mentioned method for preparing a man-made board.

[0025] The artificial board and preparation method provided by the present invention completely abandon the hot pressing process compared with the traditional process. While achieving the same surface effect (or even better effect), it has the characteristics of modular processing, fewer processing links and high efficiency. The overall work flow and process have low energy consumption, and can be made on demand without waiting for shutdown time. In addition, edge sealing can be performed when processing the surface layer to ensure that the color, texture, touch and texture of the edge are consistent with the surface layer. Description of the drawings:

[0026] Figure 1 Schematic diagram of the artificial board product prepared by the method described in Example 1. Specific implementation method:

[0027] In order to enable those skilled in the art to more clearly understand the application, the application will be described in detail below in conjunction with Examples and accompanying drawings. Before describing, it should be understood that the terms used in this specification and the appended claims should not be interpreted as being limited to ordinary meanings and dictionary meanings, but should be interpreted according to the meaning and concept corresponding to the technical aspects of the application on the basis of the principle of allowing the inventor to appropriately define terms for best interpretation. Therefore, the description proposed here is only for the preferred embodiment for illustration purposes, is not intended to limit the scope of the application, thus it should be understood that, without departing from the spirit and scope of the application, other equivalents or improved methods can be obtained therefrom, and the scope claimed for protection of the application should be based on the scope limited by the claims. Unless otherwise stated, the reagents and instruments used in the following examples are commercially available products.

[0028] Example 1

[0029] This embodiment provides a wood-based panel.

[0030] The artificial board is prepared according to the following preparation method.

[0031] Adhesive is applied to both sides of the facing layer. In this embodiment, the facing layer is Schattdecor's matte facing paper (printed finished facing paper based on printed decorative paper, pre-impregnated paper or thermoplastic material).

[0032] In this embodiment, the coating process uses upper and lower rollers conventional in the art that have holes for squeezing adhesive.

[0033] In this embodiment, the adhesive composition used is as follows: 60% by weight of a main resin, the main resin used in this embodiment is CN2281; 25% of a functional monomer, the functional monomer used in this embodiment is Sartomer's SR350LC NS; 12% of a functional filler, the functional filler used in this embodiment is 2000-mesh alumina powder; 0.5% of a leveling agent, the leveling agent used in this embodiment is Jiyan AMORSO-189T; 1% of a dispersant, the dispersant used in this embodiment is BYK's DISPERBYK-2158; 0.5% of a defoaming agent, the defoaming agent used in this embodiment is BYK-070; 0.5% of an anti-settling agent, the anti-settling agent used in this embodiment is BYK's RHEOBYK-431; and 0.5% of a silane coupling agent, the silane coupling agent used in this embodiment is Dow Corning's OFS-6011.

[0034] The above raw materials are mixed evenly according to the above ratio to obtain the adhesive.

[0035] During the rolling process of the upper and lower rollers, the adhesive is applied at a rate of 15g / m 2 The coating amount is applied and penetrates into the finishing layer.

[0036] The adhesive-coated facing layer is bonded to the panel substrate. In this embodiment, the panel substrate is particleboard, but in other embodiments, the panel substrate may also be medium-density fiberboard. The bonding process is performed using positioning rollers. In this embodiment, the positioning rollers also include bending strips to bend and press the facing layer protruding from both sides of the panel substrate, forming an edge banding facing layer.

[0037] The panel substrate bonded with the facing layer is cut into intermediate pieces according to the required size using a cutter.

[0038] The intermediate piece is sent to the electron beam irradiation station and directly cured by electron beam in a low oxygen environment (oxygen concentration ≤ 200 ppm). In this embodiment, the direct dose of electron beam curing is 150 kGy, and the voltage range of electron beam irradiation is between 200-300 kV.

[0039] During the electron beam irradiation process, electrons collide with molecules in the air and scatter, so that the edge banding finishing layer can still receive 30-60% of the electron beam dose of the surface finishing layer, thus achieving the technical effect of simultaneous curing and bonding of the surface and the edge banding.

[0040] The artificial board prepared in this embodiment is as follows Figure 1 shown.

[0041] Example 2

[0042] This embodiment provides a wood-based panel.

[0043] The artificial board is prepared according to the following preparation method.

[0044] Adhesive is applied to both sides of the finishing layer. In this embodiment, the finishing layer is made of matte finishing paper with the brand Schattdecor (printed finished finishing paper based on printed decorative paper, pre-impregnated paper or thermoplastic material).

[0045] In this embodiment, the coating process uses upper and lower rollers conventional in the art that have holes for squeezing adhesive.

[0046] In this embodiment, the adhesive composition used is as follows: 55% by weight of a main resin, the main resin used in this embodiment is CN2281; 30% of a functional monomer, the functional monomer used in this embodiment is Sartomer's SR350LC NS; 12% of a functional filler, the functional filler used in this embodiment is 2000-mesh alumina powder; 0.5% of a leveling agent, the leveling agent used in this embodiment is Jiyan AMORSO-189T; 1% of a dispersant, the dispersant used in this embodiment is BYK's DISPERBYK-2158; 0.5% of a defoamer, the defoamer used in this embodiment is BYK-070; 0.5% of an anti-settling agent, the anti-settling agent used in this embodiment is BYK's RHEOBYK-431; and 0.5% of a silane coupling agent, the silane coupling agent used in this embodiment is Dow Corning's OFS-6011.

[0047] The above raw materials are mixed evenly according to the above ratio to obtain the adhesive.

[0048] During the rolling process of the upper roller and the lower roller, the adhesive is 15g / m 2 The coating amount is applied and penetrates into the finishing layer.

[0049] The adhesive-coated facing layer is bonded to the panel substrate. In this embodiment, the panel substrate is particleboard. In other embodiments, the panel substrate may also be medium-density fiberboard. The bonding process is performed using positioning rollers. In this embodiment, the positioning rollers also include bending strips to bend and press the facing layer on both sides of the panel substrate, forming an edge banding facing layer.

[0050] The panel substrate bonded with the facing layer is cut into intermediate pieces according to the required size using a cutter.

[0051] The intermediate piece is sent to the electron beam irradiation station and directly cured by electron beam in a low oxygen environment (oxygen concentration ≤ 200 ppm). In this embodiment, the direct dose of electron beam curing is 140 kGy, and the voltage range of electron beam irradiation is between 200-300 kV.

[0052] During the electron beam irradiation process, electrons collide with molecules in the air and scatter, so that the edge banding finishing layer can still receive 30-60% of the electron beam dose of the surface finishing layer, thus achieving the technical effect of simultaneous curing and bonding of the surface and the edge banding.

[0053] Example 3

[0054] This embodiment provides a wood-based panel.

[0055] The artificial board is prepared according to the following preparation method.

[0056] Adhesive is applied to both sides of the finishing layer. In this embodiment, the finishing layer is made of matte finishing paper with the brand Schattdecor (printed finished finishing paper based on printed decorative paper, pre-impregnated paper or thermoplastic material).

[0057] In this embodiment, the coating process uses upper and lower rollers conventional in the art that have holes for squeezing adhesive.

[0058] In this embodiment, the adhesive composition used is as follows: 50% by weight of a main resin, the main resin used in this embodiment is CN2281; 35% of a functional monomer, the functional monomer used in this embodiment is Sartomer's SR350LC NS; 12% of a functional filler, the functional filler used in this embodiment is 2000-mesh alumina powder; 0.5% of a leveling agent, the leveling agent used in this embodiment is Jiyan AMORSO-189T; 1% of a dispersant, the dispersant used in this embodiment is BYK's DISPERBYK-2158; 0.5% of a defoaming agent, the defoaming agent used in this embodiment is BYK's BYK-070; 0.5% of an anti-settling agent, the anti-settling agent used in this embodiment is BYK's RHEOBYK-431; and 0.5% of a silane coupling agent, the silane coupling agent used in this embodiment is Dow Corning's OFS-6011.

[0059] The above raw materials are mixed evenly according to the above ratio to obtain the adhesive.

[0060] During the rolling process of the upper roller and the lower roller, the adhesive is 10g / m 2 The coating amount is applied and penetrates into the finishing layer.

[0061] The finishing layer coated with adhesive is bonded to the panel substrate. In this embodiment, the panel substrate is selected from particle board or medium-density fiberboard, and the bonding process is carried out by pressing with a positioning roller. At the same time, in this embodiment, the positioning roller is also equipped with a bending edge strip to bend and press the finishing layer on both sides of the panel substrate to form an edge strip finishing layer.

[0062] The panel substrate bonded with the facing layer is cut into intermediate pieces according to the required size using a cutter.

[0063] The intermediate piece is sent to the electron beam irradiation station and directly cured by electron beam in a low oxygen environment (oxygen concentration ≤ 200 ppm). In this embodiment, the direct dose of electron beam curing is 120 kGy, and the voltage range of electron beam irradiation is between 200-300 kV.

[0064] During the electron beam irradiation process, electrons collide with molecules in the air and scatter, so that the edge banding finishing layer can still receive 30-60% of the electron beam dose of the surface finishing layer, thus achieving the technical effect of simultaneous curing and bonding of the surface and the edge banding.

[0065] Comparative Example 1

[0066] This comparative example is basically the same as the solution in Example 1, except that the direct radiation dose of electron beam curing is 80 kGy.

[0067] After the process is completed, the finishing layer on the four sides of the panel substrate is not completely cured, and warping and bubbles are generated.

[0068] Comparative Example 2

[0069] This comparative example is basically the same as that in Example 1, except that the direct radiation dose of electron beam curing is 200 kGy.

[0070] After the process was completed, the product of this comparative example had the same curing effect as that of Example 1, and no radiation damage occurred on the surface.

[0071] Comparative Example 3

[0072] This comparative example is basically the same as the solution in Example 1, with the only difference being that the voltage used in the electron beam irradiation is in the range of 100-150 kV.

[0073] After the process is completed, the finishing layer on the four sides of the panel substrate is not completely cured, and warping and bubbles are generated.

[0074] Comparative Example 4

[0075] This comparative example is basically the same as the solution in Example 1, except that the adhesive is a commercially available adhesive product.

[0076] After the process was completed, the surface adhesive of the comparative product showed modification due to the radiation intensity exceeding the maximum value that the adhesive could withstand, that is, radiation damage occurred. At the same time, the finishing layer on the four sides of the panel substrate was not completely cured, and warping and bubbles were generated.

[0077] Effect embodiment

[0078] The surface bonding strength of the facing paper layers of Examples 1-3 was tested using the surface bonding strength determination method described in Section 4.16 of GB / T 17657-2013 "Test methods for physical and chemical properties of wood-based panels and facing wood-based panels";

[0079] The water absorption thickness expansion rate of the samples of Examples 1-3 was tested using the method described in Section 4.5 of GB / T 17657-2013 "Test methods for physical and chemical properties of wood-based panels and veneered wood-based panels"; the 24-hour water absorption rate of the samples of Examples 1-3 was tested using the method described in Section 4.6;

[0080] The hardness of the surface finishing paper layer of Examples 1-3 was measured using the standard method of GB / T 6739-2006 "Paints and varnishes - Determination of film hardness by pencil method";

[0081] The flame retardancy of the samples of Examples 1 to 3 was measured using the relevant method described in Section 5.1.1 of GB 8624-2012 "Classification of Combustion Performance of Building Materials" for flat building materials.

[0082] The results of the above measurements are shown in Table 1.

[0083] Table 1 Performance test results

[0084]

[0085] It can be seen from the results in Table 1 that the surface finishing layers of the artificial boards prepared in the various embodiments of the present invention have good adhesion, high hardness and flame retardancy. At the same time, the prepared artificial boards have low water absorption and water absorption volume expansion rate, and have good performance.

[0086] The present invention provides a kind of artificial board and its preparation method, compared with traditional processes, completely abandoning the hot pressing process. While achieving the same surface effect (or even better effect), it has the characteristics of modular processing, fewer processing steps and high efficiency. The overall workflow and process have low energy consumption, and can be made on demand without waiting for downtime. In addition, the edge sealing process can be carried out simultaneously with the surface lamination, ensuring that the color, texture, touch and texture of the edge sealing are consistent with the surface layer. At the same time, by improving the formula of the adhesive, the surface finishing layer of the prepared artificial board has good adhesion, low water absorption rate and water absorption volume expansion rate, high hardness and flame retardancy. Therefore, the artificial board and its preparation method of the present invention have good application prospects.

Claims

1. A method for preparing a wood-based panel, characterized in that: Follow the steps below: (1) Apply adhesive to both sides of the facing layer of the artificial board; (2) Bonding the finishing layer to the panel substrate and sealing the edges; during the bonding process, a positioning roller is used for pressing, and the positioning roller is also equipped with a bending edge strip to bend and press the finishing layer on both sides of the panel substrate to form an edge strip finishing layer; (3) Cutting to obtain the middleware; (4) Curing the intermediate piece by electron beam direct curing in a low oxygen environment to obtain a wood-based panel product; The raw materials of the adhesive are 50-60% by weight of main resin, 25-35% of functional monomer, 12% of functional filler, 0.5% of leveling agent, 1% of dispersant, 0.5% of defoaming agent, 0.5% of anti-settling agent, and 0.5% of silane coupling agent.

2. The method for preparing the artificial board according to claim 1, wherein: The raw materials of the adhesive are 60% by weight of main resin, 25% of functional monomer, 12% of functional filler, 0.5% of leveling agent, 1% of dispersant, 0.5% of defoaming agent, 0.5% of anti-settling agent and 0.5% of silane coupling agent.

3. The method for preparing the artificial board according to claim 1, characterized in that: The main resin is modified polyurethane acrylic resin.

4. The method for preparing a wood-based panel according to claim 1, wherein: The functional monomer is any one of TMPTA and TMPTMA.

5. The method for preparing a wood-based panel according to claim 1, wherein: The oxygen concentration of the hypoxic environment is ≤200 ppm.

6. The method for preparing a wood-based panel according to claim 1, wherein: The electron beam direct irradiation dose parameter is set to 120-150 kGy, and the acceleration voltage is set to 200-300 kV.

7. A wood-based panel, characterized in that: The artificial board is prepared by the preparation method of any one of claims 1 to 6.

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