Atomic layer deposition system

Abstract

The present application relates to an atomic layer deposition system, comprising: a body, a carrier, a gas spraying module and a first ring. The body surrounds a reaction chamber; the carrier is located in the reaction chamber. The gas spraying module is arranged on the body and comprises at least one gas inlet and at least one gas diffusion plate between the carrier and the at least one gas inlet, each gas diffusion plate comprises a plurality of perforations. The first ring defines a radial direction and is arranged between the carrier and the at least one gas diffusion plate. The plurality of perforations distributed in the area of the at least one gas diffusion plate defines an outermost distribution contour, the radial dimension of the inner wall of the first ring is greater than the radial dimension of the outermost distribution contour, and the inner wall of the first ring and the outermost distribution contour maintain a distance in the radial direction. The inner wall of the reaction chamber of the present application is not easy to generate residues, effectively reduces the production cost and has good manufacturing effect.

Description

Technical Field

[0001] This invention relates to deposition systems, and more particularly to an atomic layer deposition system. Background Technology

[0002] A typical atomic layer deposition (ALD) system includes a reaction chamber, at least one inlet pipe, and at least one outlet pipe. Different reactive gases are sequentially introduced into the reaction chamber through the at least one inlet pipe and the at least one outlet pipe, so that the substrate located in the reaction chamber can contact and react with the reactive gases respectively, thereby generating a layered thin film.

[0003] However, the active components in these reactive gases tend to deposit on the inner wall of the reaction chamber during the reaction process, leading to a rapid accumulation of thin film residue on the inner wall and thus affecting the deposition effect on the substrate. Therefore, it is necessary to regularly commission the equipment manufacturer to clean the thin film residue in the reaction chamber, resulting in costly and reduced manufacturing efficiency.

[0004] Therefore, it is necessary to provide a novel and progressive atomic layer deposition system to solve the above-mentioned problems. Summary of the Invention

[0005] The main objective of this invention is to provide an atomic layer deposition system in which the inner wall of the reaction chamber is less prone to residue formation, effectively reducing production costs and achieving excellent manufacturing results.

[0006] To achieve the above objectives, the present invention provides an atomic layer deposition system, comprising: a body, a stage, a gas spraying module, and a first annular body. The body encloses a reaction chamber; the stage is located in the reaction chamber and is used to place a substrate. The gas spraying module is disposed on the body and includes at least one air inlet and at least one gas diffuser plate located between the stage and the at least one air inlet. The at least one air inlet is used to input at least one reactive gas into the reaction chamber, and each gas diffuser plate includes a plurality of perforations. The first annular body defines a radial direction and is disposed between the stage and the at least one gas diffuser plate. The plurality of perforations distributed in the region of the at least one gas diffuser plate define an outermost distribution profile. A radial dimension of the inner peripheral wall of the first annular body is larger than a radial dimension of the outermost distribution profile, and the inner peripheral wall of the first annular body and the outermost distribution profile maintain a distance in the radial direction.

[0007] The at least one gas diffuser plate includes a first diffuser plate and a second diffuser plate, the second diffuser plate being located on the side of the first diffuser plate that is relatively far away from the stage, and the distribution density of the plurality of perforations in the second diffuser plate being less than the distribution density of the plurality of perforations in the first diffuser plate.

[0008] The material of the first ring includes at least one of ceramic and metal oxide.

[0009] In an axial direction transverse to the radial direction, each of the gas diffuser plates is misaligned with the first annulus.

[0010] The spacing should be no less than 5 millimeters.

[0011] The main body includes an upper cover and a sealing assembly, the sealing assembly being detachably connected to the upper cover and the gas spraying module, and at least one gas diffuser plate being at least partially accommodated in a through hole of the upper cover and maintaining a first circumferential gap with the upper cover.

[0012] The atomic layer deposition system further includes a second ring body sandwiched between the gas spraying module and the sealing component, wherein an outer peripheral wall of the second ring body maintains a second circumferential gap with the sealing component.

[0013] The gas spraying module further includes a cover plate connected between the sealing component and the at least one gas diffuser plate. The cover plate shields the plurality of perforations in an axial direction transverse to the radial direction. The second ring is sleeved on the outer periphery of the cover plate and abuts against the sealing component in an axial direction.

[0014] The first ring is located on the side of the top cover that is relatively far from the closure component, and the inner peripheral wall of the first ring is flush with the inner peripheral wall of the top cover that surrounds the through hole.

[0015] The first and second ring bodies are made of at least one of ceramic and metal oxide, respectively; each gas diffuser plate is offset from the first ring body in an axial direction transverse to the radial direction; the spacing is not less than 5 mm; the body includes a top cover and a sealing assembly, the sealing assembly being detachably connected to the top cover and the gas spraying module, at least one gas diffuser plate being at least partially accommodated in a through hole of the top cover and maintaining a first circumferential gap with the top cover; the first ring body has an arc-shaped guide angle on the side away from the gas spraying module; the atomic layer deposition system further includes a second ring body sandwiched between the gas spraying module and the sealing assembly, a second circumferential gap being maintained between an outer peripheral wall of the second ring body and the sealing assembly; the first circumferential gap and the second circumferential gap... The adjacent components have a radial width of not less than 1 mm; the gas spraying module further includes a cover plate connected between the sealing component and the at least one gas diffuser plate, the cover plate shielding the plurality of perforations in the axial direction, the second ring body being sleeved on the outer periphery of the cover plate and axially abutting against the sealing component; the first ring body being disposed on the side of the upper cover relatively away from the sealing component, the inner peripheral wall of the first ring body being flush with the inner peripheral wall of the upper cover surrounding the through hole; the first diffuser plate includes a diffuser portion having the plurality of perforations and a connecting portion being disposed around the diffuser portion, the connecting portion being axially connected to the cover plate and radially spaced opposite to the upper cover; the connecting portion and the diffuser portion being integrally formed; a positioning ring groove is provided on the side of the connecting portion axially away from the platform, and the second diffuser plate is accommodated in the positioning ring groove.

[0016] The beneficial effects of the present invention are: the inner wall of the reaction chamber of the present invention is less prone to the formation of residues, which effectively reduces production costs and produces excellent manufacturing results. Attached Figure Description

[0017] Figure 1 This is a perspective view of a preferred embodiment of the present invention.

[0018] Figure 2 This is a partial exploded view of a preferred embodiment of the present invention.

[0019] Figure 3 This is a partial cross-sectional view of a preferred embodiment of the present invention.

[0020] Figure 4 for Figure 3 A magnified view of a portion of the image.

[0021] Figure 5 This is a partially enlarged cross-sectional view of a preferred embodiment of the present invention.

[0022] 1: Atomic Layer Deposition System

[0023] 10:Ontology

[0024] 11: Reaction Chamber

[0025] 12: Top Cover

[0026] 121: Through-hole

[0027] 13: Enclosed Components

[0028] 20: Platform

[0029] 30: Gas spraying module

[0030] 31: Air intake

[0031] 32: Gas diffuser plate

[0032] 321: Perforation

[0033] 322: Outermost distribution profile

[0034] 323: First diffuser plate

[0035] 323a: Diffuser section

[0036] 323b: Connecting part

[0037] 323c: Positioning ring groove

[0038] 324: Second diffuser plate

[0039] 33: Cover plate

[0040] 40: First Ring Body

[0041] 41: Arc Guide Angle

[0042] 50: Second Ring Body

[0043] A: Axial

[0044] D: Spacing

[0045] G1: First circumferential clearance

[0046] G2: Second circumferential clearance

[0047] R: Radial Detailed Implementation

[0048] The following examples illustrate possible implementations of the present invention, but are not intended to limit the scope of protection of the present invention.

[0049] Please refer to Figures 1 to 5 This illustrates a preferred embodiment of the present invention, wherein the atomic layer deposition system 1 of the present invention includes a body 10, a stage 20, a gas spraying module 30 and a first annulus 40.

[0050] The main body 10 encloses a reaction chamber 11; the stage 20 is located in the reaction chamber 11 and is used to place a substrate. The gas spraying module 30 is disposed on the main body 10 and includes at least one air inlet 31 and at least one gas diffuser plate 32 located between the stage 20 and the at least one air inlet 31. The at least one air inlet 31 is used to input at least one reactive gas into the reaction chamber 11, and each of the gas diffuser plates 32 includes a plurality of perforations 321. The first annular body 40 defines a radial direction R and is disposed between the stage 20 and the at least one gas diffuser plate 32. The plurality of perforations 321 are distributed in the region of the at least one gas diffuser plate 32, defining an outermost distribution profile 322. A radial dimension of the inner peripheral wall of the first ring body 40 is larger than a radial dimension of the outermost distribution profile 322. The inner peripheral wall of the first ring body 40 and the outermost distribution profile 322 maintain a distance D in the radial direction R, thereby the first ring body 40 is radially away from a flow path of the at least one reactive gas, reducing contact and making it less likely for deposits to form on the wall of the reaction chamber 11.

[0051] Preferably, the spacing D is not less than 5 mm; in an axial direction A transverse to the radial direction R, each gas diffuser plate 32 is offset from the first ring body 40, thereby relatively moving away from the flow path of the at least one reactive gas and reducing contact reaction. The side of the first ring body 40 away from the gas spraying module 30 is provided with an arc-shaped guide angle 41, which can provide a guiding effect. It should be noted that the spacing D makes the first ring body 40 radially away from the substrate located on the stage 20. In addition to effectively slowing down the flow rate of the at least one reactive gas to fully and uniformly contact and react with the surface of the substrate, even if there are deposits on the first ring body 40, it is not easy to affect the deposition reaction on the surface of the substrate.

[0052] The main body 10 includes an upper cover 12 and a sealing component 13. The sealing component 13 is detachably connected to the upper cover 12 and the gas spraying module 30. At least one gas diffuser plate 32 is at least partially accommodated in a through hole 121 of the upper cover 12 and maintains a first circumferential gap G1 between it and the upper cover 12 to prevent short circuits. In this embodiment, the first ring 40 is disposed on the side of the upper cover 12 relatively away from the sealing component 13. The inner circumferential wall of the first ring 40 is flush with the inner circumferential wall of the upper cover 12 surrounding the through hole 121, which facilitates the disassembly and assembly of the at least one gas diffuser plate 32 for maintenance and replacement. However, the inner circumferential wall of the first ring 40 may also protrude radially or retract relative to the inner circumferential wall of the upper cover surrounding the through hole, which can be configured as needed.

[0053] The atomic layer deposition system 1 further includes a second ring 50 sandwiched between the gas spraying module 30 and the sealing assembly 13, with a second circumferential gap G2 maintained between the outer peripheral wall of the second ring 50 and the sealing assembly 13. The gas spraying module 30 further includes a cover plate 33 connected between the sealing assembly 13 and the at least one gas diffuser plate 32, the cover plate 33 shielding the plurality of perforations 321 in the axial direction A, the second ring 50 being sleeved on the outer periphery of the cover plate 33 and axially abutting against the sealing assembly 13, allowing for stable assembly and good sealing performance.

[0054] In detail, the first ring body 40 and the second ring body 50 are respectively made of at least one of ceramic and metal oxide, with low surface activity and not easily reacting with the at least one reactive gas. Preferably, the first circumferential gap G1 and the second circumferential gap G2 are adjacent and their widths in the radial direction R are not less than 1 mm.

[0055] Preferably, the at least one gas diffuser plate 32 includes a first diffuser plate 323 and a second diffuser plate 324. The second diffuser plate 324 is located on the side of the first diffuser plate 323 that is relatively far away from the stage 20. The distribution density of the plurality of perforations 321 in the second diffuser plate 324 is less than that in the first diffuser plate 323. This allows the at least one reactive gas to be uniformly introduced into the reaction chamber 11 and effectively avoids unstable airflow that could damage the deposition quality. The first diffuser plate 323 includes a diffuser portion 323a with the plurality of perforations 321 and a connecting portion 323b circumferentially disposed in the diffuser portion 323a. The connecting portion 323b is axially connected to the cover plate 33 and radially spaced from the upper cover 12. In this embodiment, the connecting portion 323b and the diffuser portion 323a are integrally formed, resulting in good structural strength. The boundary between the inner peripheral wall of the connecting portion 323b and the diffuser portion 323a defines a circular outermost distribution contour 322. A positioning annular groove 323c is provided on the side of the connecting portion 323b axially away from the platform 20, and the second diffuser plate 324 is accommodated in the positioning annular groove 323c, resulting in a simple structure and easy assembly. However, the second diffuser plate can also be separately assembled to either the first diffuser plate or the cover plate; the gas spraying module may also have only a single gas diffuser plate.

Claims

1. An atomic layer deposition system, characterized in that: include: One body encloses a reaction chamber; A stage is located in the reaction chamber and is used to place a substrate; A gas spraying module, disposed on the body and including at least one air inlet and at least one gas diffuser plate located between the platform and the at least one air inlet, the at least one air inlet for inputting at least one reactive gas into the reaction chamber, each of the gas diffusers including a plurality of perforations; and A first annular body, defining a radial direction, is disposed between the stage and the at least one gas diffuser plate; The plurality of perforations distributed in the region of the at least one gas diffuser plate define an outermost distribution profile. A radial dimension of the inner peripheral wall of the first ring body is greater than a radial dimension of the outermost distribution profile. The inner peripheral wall of the first ring body and the outermost distribution profile maintain a distance in the radial direction. The main body includes an upper cover and a sealing component. The sealing component is detachably connected to the upper cover and the gas spraying module. At least one gas diffuser plate is at least partially accommodated in a through hole of the upper cover and maintains a first circumferential gap with the upper cover. The atomic layer deposition system further includes a second ring body sandwiched between the gas spraying module and the sealing component, wherein an outer peripheral wall of the second ring body and the sealing component maintain a second circumferential gap; The first ring is located on the side of the upper cover that is relatively far from the sealing component, and the inner peripheral wall of the first ring is flush with the inner peripheral wall of the upper cover that surrounds the through hole.

2. The atomic layer deposition system as described in claim 1, characterized in that: The at least one gas diffuser plate includes a first diffuser plate and a second diffuser plate, the second diffuser plate being located on the side of the first diffuser plate that is relatively far away from the stage, and the distribution density of the plurality of perforations in the second diffuser plate being less than the distribution density of the plurality of perforations in the first diffuser plate.

3. The atomic layer deposition system as described in claim 1, characterized in that: The material of the first ring includes at least one of ceramic and metal oxide.

4. The atomic layer deposition system as described in claim 1, characterized in that: In an axial direction transverse to the radial direction, each of the gas diffuser plates is misaligned with the first annulus.

5. The atomic layer deposition system as described in claim 1, characterized in that: The spacing should be no less than 5 millimeters.

6. The atomic layer deposition system as described in claim 1, characterized in that: The gas spraying module further includes a cover plate connected between the sealing component and the at least one gas diffuser plate. The cover plate shields the plurality of perforations in an axial direction transverse to the radial direction. The second ring is sleeved on the outer periphery of the cover plate and abuts against the sealing component in an axial direction.

7. The atomic layer deposition system as described in claim 2, characterized in that: The first ring and the second ring are made of at least one of ceramic and metal oxide. Each gas diffuser plate is offset from the first ring in an axial direction transverse to the radial direction. The spacing is not less than 5 mm. The first ring has a curved guide angle on the side away from the gas spraying module. The first circumferential gap and the second circumferential gap are adjacent and have a radial width of not less than 1 mm. The gas spraying module further includes a cover plate connecting the sealing assembly and the at least one gas diffuser plate. The cover plate shields the plurality of perforations in the axial direction. The second ring is fitted around the outer periphery of the cover plate and axially abuts against the sealing assembly. The first diffuser plate includes a diffuser portion with the plurality of perforations and a connecting portion circumferentially disposed on the diffuser portion. The connecting portion is axially connected to the cover plate and radially spaced from the upper cover. The connecting portion and the diffuser portion are integrally formed. A positioning ring groove is provided on the side of the connecting portion axially away from the platform, and the second diffuser plate is accommodated in the positioning ring groove.

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