Micro-ring resonator pressure sensing device and method of manufacturing the same

Abstract

The application provides a micro-ring resonator pressure sensing device and a preparation method thereof. The device comprises a substrate, a film and a micro-ring resonator array. At least one through hole is formed in the substrate, and the through hole penetrates two end faces of the substrate. The film is arranged on one of the end faces of the substrate, and covers one end of the through hole. At least one micro-ring resonator array is arranged in the film, and the micro-ring of the micro-ring resonator array is aligned with the through hole. The through hole is formed in the substrate, and the runway micro-ring is aligned with the through hole, so that the micro-ring is suspended below. When a load is applied to the device, the film on the substrate will be deformed, and the optical resonant structure attached to the substrate will also be deformed, so that the waveguide size and the relative refractive index are changed, and finally the output spectrum line is shifted. Through detection of the shift amount of the output spectrum line resonant wavelength, the size of the applied load can be obtained, and the sensitivity is high.

Description

Technical Field

[0001] This invention relates to the field of pressure sensor technology, and in particular to a microring resonator pressure sensing device and its fabrication method. Background Technology

[0002] Integrated photonics is a crucial technology for applications such as telecommunications, optical signal processing, and various optical signal sensing. In the sensing field, the main advantages of integrated photonics sensing lie in its small size, mass production capability, low cost, and resistance to electromagnetic interference. With the rapid development of CMOS technology, the research and application of microring resonators in integrated optics have begun to develop rapidly. Due to their simple structure, mostly micrometer-scale dimensions, and ease of combination with other photonic structures, microring resonators have become one of the most common structures in integrated photonics.

[0003] The sensing principle of microring sensors is to achieve optical signal input and output through the coupling of optical fiber and waveguide. Microring resonators can be applied to sensing in various fields such as temperature, pressure, and biology, and their sensitivity has become one of the important indicators of sensing and detection. Currently, the main ways to improve the sensitivity of microring resonators are to improve the quality factor of the microring itself, or to improve mechanical sensitivity through silicon thin films or composite organic thin films. For example, organic thin films have higher mechanical sensitivity due to their low Young's modulus. However, the improvement in sensitivity through the above methods has significant limitations.

[0004] Chinese patent CN113203506B discloses a microdisk-type optical resonant cavity structure capable of dual sensing applications of refractive index and pressure. It achieves sensing and detection through the resonance of a single straight waveguide and the microdisk-type resonant cavity. However, as mentioned earlier, its sensitivity is limited by the Young's modulus of the material itself, resulting in a less than ideal sensitivity. Summary of the Invention

[0005] In view of this, the present invention proposes a microring resonator pressure sensing device and its fabrication method, which is used to solve the problem that the sensitivity of current pressure sensors based on the microring resonator principle is limited by the Young's modulus of the material itself, resulting in less than ideal sensitivity.

[0006] The technical solution of the present invention is implemented as follows: The present invention provides a microring resonator pressure sensing device, including a substrate, a thin film and a microring resonator array; at least one through hole is formed on the substrate, and the two ends of the through hole penetrate through two end faces of the substrate; the thin film is disposed on one end face of the substrate and covers one end of the through hole; at least one microring resonator array is disposed in the thin film, and the microrings of the microring resonator array are aligned with the through hole.

[0007] Based on the above technical solutions, preferably, the microring resonant array includes an optical waveguide and a runway microring; both ends of the optical waveguide are connected to external optical fibers to realize the input and output of optical signals; the runway microring is spaced apart from the optical waveguide, and the runway microring is aligned with the through hole.

[0008] More preferably, there are at least two microring resonant arrays and at least two through holes. The at least two microring resonant arrays are a first array and a second array, with the runway microrings of the first array or the runway microrings of the second array aligned with the through holes one-to-one. The runway length of the runway microrings of the first array is greater than the runway length of the runway microrings of the second array.

[0009] More preferably, there are at least two microring resonant arrays, and at least two through holes are opened. The at least two through holes are a first hole and a second hole, respectively. The raceway microrings of the microring resonant array are aligned one-to-one with the first hole or the second hole, and the inner diameter of the first hole is larger than the inner diameter of the second hole.

[0010] More preferably, four microring resonant arrays are provided, namely two first arrays and two second arrays. Four through holes are provided, including two first holes and two second holes. The runway microrings of the two first arrays are aligned with one of the first holes and one of the second holes respectively. The runway microrings of the two second arrays are aligned with the other first hole and the other second hole respectively.

[0011] Based on the above technical solutions, preferably, the inner diameter of the through hole is 1-3mm.

[0012] Even more preferably, the length of the runway on one side of the micro-ring is 30um-50um.

[0013] Based on the above technical solutions, the preferred film thickness is 0.001-0.005 mm.

[0014] Based on the above technical solutions, preferably, a support layer is also included, which is disposed between the substrate and the film, and supports the portion of the film located in the through hole.

[0015] On the other hand, the present invention also provides a method for fabricating a microring resonator pressure sensing device, comprising the following steps:

[0016] Step 1: The substrate is hollowed out at the corresponding positions according to the design dimensions using laser cutting to form through holes;

[0017] Step 2: Use trichlorosilane to perform anti-adhesion treatment on the complete silicon wafer. Place the trichlorosilane and the silicon wafer in a vacuum chamber at the same time for vacuum treatment, so that the trichlorosilane evaporates to the surface of the silicon wafer. Then, firmly fix the silicon wafer after anti-adhesion treatment to the substrate after the hole-cutting process from the side with adhesive.

[0018] Step 3: Use spin coating to create a support layer. With the silicon wafer facing upwards (the side with the perforated portion of the substrate), spin coat the support layer onto the silicon wafer surface using a spin coater. The thickness of the support layer is approximately 8µm-10µm. After spin coating, cure the layer on a hot plate at 80°C. After curing, apply adhesive around the vias to connect with the film. After curing at 80°C, cure at 100°C. Once the support layer is fully cured, peel the silicon wafer from the substrate and spin coat the layer again on the front side of the substrate. Repeat the curing steps to obtain a suspended organic support layer placed on a silicon substrate with vias.

[0019] Step four: Fabrication of silicon-based molds using MEMS technology. First, a layer of photoresist is uniformly coated onto a clean silicon wafer for exposure; after development, it is rinsed with deionized water and dried with a nitrogen gun; then etching is performed to obtain the waveguide.

[0020] Step 5: Repeatedly fabricate the device using nanoimprint film. Mix PDMS material A and B in a 10:1 ratio, coat it onto a silicon mold to ensure complete coverage of the pattern, and heat to 150°C to cure and form a reusable soft film. Spin-coat a layer of PS material onto the pre-fabricated substrate with a support layer, then imprint the soft film onto the PS material. After curing at 150°C and peeling off the film, a thin film will be formed on the support layer, and a waveguide pattern structure will be formed on the thin film.

[0021] Step 6: Use spin coating to create a waterproof membrane. After mixing polydimethylsiloxane KER-4690 with AB glue at a 1:1 ratio, spin coating is performed using a spin coater to cover the surface of the optical resonator with a waterproof membrane.

[0022] Step 7: Liquid nitrogen cryogenic dissociation and fiber array packaging test. Before the imprinting operation, dissociation channels are etched on the back of the substrate. After being cryogenically frozen with liquid nitrogen, the fragments are dissociated. After dissociation, the optical output spectrum is tested using a testing system, and then the fiber array is packaged. The optical fiber and waveguide are aligned to maximum power using a displacement platform, and then packaged using matching liquid and UV adhesive.

[0023] The microring resonator pressure sensing device and its fabrication method of the present invention have the following advantages over the prior art:

[0024] (1) The present invention opens a through hole on the substrate and aligns the raceway micro-ring with the through hole, so that the micro-ring is suspended below. When a load is applied to the device, the thin film on the substrate will deform accordingly, and the optical resonant structure attached to the substrate will also deform accordingly, thereby changing the waveguide size and relative refractive index, and ultimately causing the output spectrum to shift. By detecting the shift of the output spectrum resonant wavelength, the magnitude of the applied load can be obtained, and its sensitivity is high.

[0025] (2) The micro-ring resonant array of the present invention adopts a four-track structure. By changing the track length and the inner diameter of the through hole, the load applied to the device can be detected with different sensitivities to meet the measurement requirements under different environments, thereby achieving four different indicators using the same device. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a perspective view of the pressure sensing device of the present invention;

[0028] Figure 2 This is a top view of the pressure sensing device of the present invention;

[0029] Figure 3 This is a top view of the base of the present invention;

[0030] Figure 4 This is a top view of the base of the present invention;

[0031] Figure 5 For the present invention Figure 3 Cross-sectional view along line AA;

[0032] Figure 6 This is a graph showing the relative changes in the parameters of the microring resonant array of the present invention as a function of the thin film radius;

[0033] Figure 7 This is a graph showing the relative changes in the parameters of the microring resonant array of the present invention as a function of the film thickness;

[0034] Figure 8 This is a graph showing the change in sound pressure sensitivity as a function of film size in this invention.

[0035] In the figure: 1. Substrate; 100. Through hole; 101. First hole; 102. Second hole; 2. Thin film; 3. Micro-ring resonant array; 31. Optical waveguide; 32. Runway micro-ring; 301. First array; 302. Second array; 4. Support layer. Detailed Implementation

[0036] The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0037] Example 1

[0038] like Figure 1 As shown, combined with Figure 5 The present invention provides a microring resonator pressure sensing device, comprising a substrate 1, a thin film 2, and a microring resonator array 3.

[0039] The substrate is a silicon wafer with a thickness of approximately 500 μm and dimensions of 2 cm × 2 cm. At least one through-hole 100 is formed on the substrate 1, with both ends of the through-hole 100 penetrating both end faces of the substrate 1. The inner diameter of the through-hole 100 is 1-3 mm.

[0040] Thin film 2 is disposed on one end face of substrate 1, and thin film 2 covers one end of through hole 100. Thin film 2 is made of polydimethylsiloxane (PDMS) material, thin film 2 has a thickness of 0.001-0.005 mm, and a refractive index of about 1.4.

[0041] At least one microring resonant array 3 is disposed within the thin film 2, and the microrings of the microring resonant array 3 are aligned with the through-hole 100. The microring resonant array 3 is made of polystyrene (PS) organic material with a refractive index of 1.5 or higher, and the waveguide size is approximately 1.5 μm × 1.5 μm, with an allowable error range of 0.2 μm.

[0042] Specifically, it includes optical waveguide 31 and runway microring 32.

[0043] The optical waveguide 31 is rectangular, and its two ends are connected to external optical fibers to realize the input and output of optical signals.

[0044] The runway microring 32 is spaced apart from one rectangular side of the optical waveguide 31, and the runway microring 32 is aligned with the through hole 100. The runway length of one side of the runway microring 32 is 30um-50um, and the radius of the two rings is 80um-120um.

[0045] In this embodiment, a through-hole 100 is formed in the substrate 1, with the through-hole 100 located directly below the racetrack micro-ring 32 of the micro-ring resonant array 3, thus suspending the thin film 2 below the racetrack micro-ring 32. When a load is applied to the device, the load exerts pressure on both the substrate 1 and the thin film 2, causing them to deform. It should be noted that, since the thin film 2 is extremely thin, the actual deformation caused by pressure is the support layer 4 attached between the thin film 2 and the substrate 1. The deformation of the support layer 4 causes the thin film 2 attached to it to deform as well, and the micro-ring resonant array 3 attached to the substrate 1 also deforms along with the thin film 2. During the deformation process, the size and effective refractive index of the micro-ring resonant array 3 change, thereby changing the position of the resonant wavelength in the output spectrum. Pressure sensing is achieved by monitoring the wavelength shift. The principle relied upon is mainly based on the photoelastic effect and the Poisson effect, observing the change in the resonant wavelength, mainly relying on the following formula. Where λ is the resonant wavelength of the optical signal, L is the perimeter of the racetrack resonant cavity, and neff is the effective refractive index of the waveguide.

[0046]

[0047] Specifically, incident light propagates from the input end of optical waveguide 31 through an external optical fiber. When the signal enters the coupling region formed by the straight runway of optical waveguide 31 and runway microring 32, part of the light is coupled into runway microring 32, while the rest continues to propagate along optical waveguide 31. The signal that enters runway microring 32 will circle runway microring 32 once and then pass through the coupling region again. At this time, the same part of the light will be coupled into optical waveguide 31, while the rest continues to propagate in a ring along runway microring 32.

[0048] It is evident that the resonant wavelength of the optical signal is directly related to the deformation of the microring resonant array 3. Because the film 2 is suspended below, the deformation of the film 2 and the microring resonant array 3 within it increases, thereby increasing the change in waveguide size and relative refractive index. This ultimately leads to an increase in the shift of the output spectral line. By detecting the shift in the resonant wavelength of the output spectral line, the magnitude of the applied load can be determined, thus increasing the detection sensitivity.

[0049] Example 2

[0050] Based on the description of the detection principle in Example 1, it can be seen that the straight runway length of the runway microring 32 is directly related to the detection sensitivity. To address different detection environment requirements and different sensitivity requirements, such as... Figure 1 As shown, combined with Figure 2 The micro-ring resonant array 3 has at least two parts, and the through-hole 100 has at least two parts.

[0051] Among them, at least two micro-ring resonant arrays 3 are a first array 301 and a second array 302, and the runway micro-rings 32 of the first array 301 or the runway micro-rings 32 of the second array 302 correspond one-to-one with the alignment through-holes 100.

[0052] The runway length of the runway microring 32 in the first array 301 is greater than the runway length of the runway microring 32 in the second array 302.

[0053] This technical solution achieves different output spectral line requirements by controlling the runway structure dimensions. High sensitivity demands a high Q value, which is achieved by shortening the straight runway length. Conversely, high threshold and high stability requirements necessitate a low Q value, which is achieved by increasing the straight runway length. Controlling the runway length adjusts the coupling between the runway microring 32 and the straight waveguide 31, altering the output spectral line and ultimately achieving different measurement thresholds and sensitivities.

[0054] Example 3

[0055] Based on the description of the detection principle in Example 1, it can be seen that the deformation of the thin film 2 and the micro-ring resonant array 3 within it is directly related to the detection sensitivity. To address different detection environment requirements and different sensitivity requirements, such as... Figure 1 As shown, combined with Figure 3 The micro-ring resonant array 3 has at least two parts, and the through-hole 100 has at least two parts.

[0056] Among them, at least two through holes 100 are a first hole body 101 and a second hole body 102. The inner diameter of the first hole body 101 is larger than the inner diameter of the second hole body 102.

[0057] The racetrack microrings 32 of the microring resonant array 3 are aligned one-to-one with the first aperture 101 or the second aperture 102.

[0058] When using this technical solution, the deformation is adjusted by changing the size of the through-hole 100 below the runway micro-ring 32. Changing the aperture of the through-hole 100 below different runways yields different sensitivities to meet measurement requirements under different environments. Experimental results are as follows... Figure 6 As shown, the radius of the thin film 2 represents the radius of the through hole 100. The results show that a small aperture results in low sensitivity, a large measurement range, and low accuracy; a large aperture results in high sensitivity, a small measurement range, and high accuracy.

[0059] Example 4

[0060] Furthermore, the detection sensitivity is also directly related to the thickness of film 2. According to experimental analysis, the results are as follows: Figure 8 As shown, by reasonably controlling the size of the through hole 100 and the thickness of the film 2, we can meet the measurement requirements under different environments.

[0061] Example 5

[0062] Based on the above embodiments, in order to address different detection indicators and adapt the detection range and accuracy according to the load pressure, thereby achieving the requirements of high-sensitivity and high-precision detection, such as... Figure 1 As shown, combined with Figure 4 The micro-ring resonant array 3 has four holes, and the through holes 100 have four holes.

[0063] Among them, the four micro-ring resonant arrays 3 are two first arrays 301 and two second arrays 302.

[0064] The four through holes 100 include two first hole bodies 101 and two second hole bodies 102.

[0065] The runway microrings 32 of the two first arrays 301 are aligned one-to-one with one of the first apertures 101 and one of the second apertures 102; the runway microrings 32 of the two second arrays 302 are aligned one-to-one with the other first aperture 101 and the other second aperture 102.

[0066] In this embodiment, the micro-ring resonant array 3 adopts a four-track structure. By changing the straight track length of the track micro-ring 32 and the inner diameter of the through hole 100, the load applied to the device can be detected with different sensitivities to meet the measurement requirements under different environments, thereby achieving four different indicators using the same device.

[0067] Example 6

[0068] It also includes a support layer 4, which is disposed between the substrate 1 and the film 2. The support layer 4 supports the portion of the film 2 located in the through hole 100. Since the film 2 is extremely thin and micro-rings are provided on the film 2, the support layer 4 is needed to support the film 2 in order to prevent the micro-rings from falling into the through hole 100 due to tearing or damage to the film 2.

[0069] The support layer 4 is also made of PDMS material, with a thickness of 0.02-0.05 mm. The thickness of the support layer 4 varies with the thickness of the thin film 2. In addition, a waterproof membrane layer can be spin-coated on the outer surface of the thin film 2. The waterproof membrane layer can prevent the micro-ring resonant array 3 from being contaminated when used as a pressure sensor, thereby improving the device lifespan and anti-interference capability.

[0070] The refractive indices of the support layer 4 and the waterproof membrane layer are both lower than those of the thin film 2. This is to prevent the light passing through the micro-ring resonant array 3 from leaking into a medium with a higher refractive index, thereby confining the light within the waveguide made of the thin film 2 and avoiding adverse effects on the detection sensitivity.

[0071] Example 7

[0072] The method for fabricating the microring resonator pressure sensing device of the present invention:

[0073] 1) The substrate 1 is hollowed out at the corresponding position according to the design dimensions using laser cutting to form a through hole 100.

[0074] 2) Use trichlorosilane to perform anti-adhesion treatment on the intact silicon wafer. Place the trichlorosilane and the silicon wafer in a vacuum chamber and perform vacuum treatment for about 3 minutes to allow the trichlorosilane to evaporate to the surface of the silicon wafer, ensuring that the PDMS film will not stick to the silicon wafer when it is subsequently peeled off. Secure the anti-adhesion treated silicon wafer to the perforated substrate 1 from the side with adhesive.

[0075] 3) Fabrication of the support layer 4 using spin coating. With the silicon wafer facing upwards on the perforated side of the substrate 1, spin coat at 7000 rpm for approximately 5 minutes to obtain the PDMS support layer 4, with a thickness of approximately 8-10 μm. After spin coating, rapid curing is performed on a hot plate at 80°C. After rapid curing, adhesive is dripped around the vias 100 to connect with the thin film 2, further increasing the connectivity between the support layer 4 and the substrate 1. Curing is then performed at 80°C for 1 hour, followed by curing at 100°C for 1 hour. After complete PDMS curing, the silicon wafer is peeled from the substrate 1, and spin coating is performed again on the front side of the substrate 1 at a high speed of 9000 rpm to ensure that there are no gaps on the front side that could cause the waveguide in the subsequent microring resonant array 3 to break. Repeating the curing steps again yields a suspended organic support layer 4 with a thickness of less than 10 μm, placed on the perforated silicon substrate 1.

[0076] 4) Fabrication of silicon-based molds using MEMS technology. First, a layer of Arp6200.13 photoresist is uniformly coated onto a clean silicon wafer. Exposure is performed with an electron beam current of 1 nA and an exposure dose of 300 uC / cm². Development is then carried out in a methyl isobutyl ketone (MIBK) solution for 100 seconds, followed by rinsing with deionized water and drying with a nitrogen gun. The etching gas is SF6, the passivation gas is C4H8, the pressure is 20 mTorr, the ionization power is 30 W, the gas flow ratio is 12-15, and the etching time is 160 s, yielding a waveguide with a depth of approximately 1.6 μm.

[0077] 5) Devices are repeatedly fabricated using nanoimprint film 2. A PDMS material A and B are mixed in a 10:1 ratio and coated onto a silicon mold to ensure complete pattern coverage. The mixture is then cured at 150°C for 1 hour to form a reusable soft film, which is essentially film 2. A layer of PS material is spin-coated at 6000 rpm onto a pre-fabricated suspended substrate with a PDMS support layer 4. The soft film is then imprinted onto the PS material and cured at 150°C for 2 hours. After peeling off the film, film 2 will be present on the support layer 4, with a patterned structure formed on film 2. This enables the fabrication of a low-cost and highly reproducible organic optical resonator.

[0078] 6) A waterproof membrane is prepared using spin coating. After mixing polydimethylsiloxane KER-4690 with AB adhesive at a 1:1 ratio, a spin coating process is performed at 8000 r / min for 5 minutes to coat the surface of the optical resonator with a 5 μm thick waterproof membrane. This waterproof membrane can prevent the optical resonator from being contaminated when used as a pressure sensor.

[0079] 7) Liquid nitrogen cryogenic dissociation and fiber array packaging testing. Both the PDMS thin film substrate 1 and the support layer 4 have high ductility, requiring liquid nitrogen freezing to modify the PDMS before dissociation to ensure a smooth dissociation surface. Dissociation channels are etched on the back of substrate 1 before imprinting, and the film is dissociated as quickly as possible after liquid nitrogen cryogenic freezing. After dissociation, optical output spectral line testing is performed using a testing system, followed by fiber array (FA) packaging. The fiber and waveguide 31 are aligned to maximum power using a displacement platform, and encapsulation is performed using matching fluid and UV adhesive. This allows the microring resonant array 3 to achieve perfect 8-channel packaging with a 127µm pitch between each input / output port.

[0080] In summary, the novel process of spin-coating the thin film 2 and the support layer 4 directly onto the surface of the substrate 1 can produce an ultrathin PDMS thin film 2 and support layer 4 that are tightly attached to the surface of the substrate 1, which has higher sensitivity than conventional thin film structures.

[0081] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method of fabricating a micro-ring resonator pressure sensor device, the method comprising: The micro-ring resonator pressure sensing device comprises a substrate (1), a film (2), a micro-ring resonator array (3) and a supporting layer (4); ​ At least one through hole (100) is formed in the substrate (1), and the through hole (100) penetrates through both end surfaces of the substrate (1); The film (2) is arranged on one of the end surfaces of the substrate (1), and covers one end of the through hole (100); At least one micro-ring resonator array (3) is arranged in the film (2), and the micro-ring of the micro-ring resonator array (3) is aligned with the through hole (100); The supporting layer (4) is arranged between the substrate (1) and the film (2), and supports the part of the film (2) located in the through hole (100); The method comprises the following steps, Step 1: The substrate (1) is hollowed out at the corresponding position according to the designed size by laser cutting to form the through hole (100); Step 2: The complete silicon wafer is subjected to anti-adhesion treatment by using trichlorosilane, the trichlorosilane and the silicon wafer are simultaneously placed in a vacuum box for vacuumizing treatment, the trichlorosilane is volatilized to the surface of the silicon wafer, and the silicon wafer after the anti-adhesion treatment and the substrate (1) after the hole processing are tightly fixed together from the side by using glue; Step 3: The supporting layer (4) is prepared by using a spin coating method, the silicon wafer located on the hole side of the substrate (1) is upward, the supporting layer (4) obtained by spin coating the surface of the silicon wafer by using a spin coater has a thickness of 8-10 um, and after the spin coating is completed, solidification is performed on a hot plate at 80 DEG C; after the solidification, glue is dropped around the through hole (100) to connect the film (2); after the solidification at 80 DEG C, solidification at 100 DEG C is performed, the silicon wafer and the substrate (1) are peeled off after the supporting layer (4) is completely solidified, spin coating is performed again on the front surface of the substrate (1), and after the solidification step is repeated again, the suspended organic supporting layer (4) on the substrate (1) in the hole of the silicon substrate is obtained; Step 4: The silicon-based mold is prepared by using a MEMS process, a layer of photoresist is uniformly coated on a clean silicon wafer for exposure; after development, the wafer is washed by deionized water and dried by using a nitrogen gun; etching treatment is performed to obtain a waveguide; Step 5: The device is repeatedly prepared by means of nano-imprinting the film (2), the A glue and the B glue of the PDMS material are mixed at a ratio of 10:1, are coated on the silicon mold to ensure complete coverage of the pattern, and are heated and solidified at 150 DEG C to form a reusable soft film; a layer of PS material is spin coated on the substrate (1) with the supporting layer (4) which has been prepared, then the soft film is imprinted on the PS material, and after solidification at 150 DEG C and film stripping, the film (2) is formed on the supporting layer (4), and the pattern structure of the waveguide is formed on the film (2); Step 6: The waterproof film layer is prepared by using a spin coating method, the AB glue of the polydimethylsiloxane KER-4690 is configured at a ratio of 1:1, and the spin coating machine is used for spin coating work, so that the surface of the optical resonator is covered with a layer of waterproof film layer; Step seven, liquid nitrogen refrigeration dissociation and fiber array packaging test, before the embossing operation, the dissociation channel is engraved on the back of the substrate (1), and the chip is dissociated after being frozen at low temperature by liquid nitrogen; after dissociation, the optical output spectrum is tested by using the test system, and the fiber array packaging is performed, the fiber and the optical waveguide (31) are aligned to the maximum power by using the displacement platform, and the matching liquid and the ultraviolet glue are used for packaging.

2. The method for fabricating a microring resonator pressure sensing device according to claim 1, characterized in that: The micro-ring resonance array (3) comprises optical waveguides (31) and runway micro-rings (32). The optical waveguides (31) are connected with external optical fibers at both ends and realize input and output of optical signals. The runway micro-rings (32) are arranged at intervals from the optical waveguides (31), and the runway micro-rings (32) are aligned with the through holes (100).

3. The method of claim 2, wherein the micro-ring resonator pressure sensor is prepared by the steps of: providing a substrate; forming a micro-ring resonator on the substrate; and forming a pressure sensitive layer on the micro-ring resonator. The micro-ring resonance array (3) has at least two, and the through hole (100) has at least two, at least two micro-ring resonance arrays (3) are respectively a first array (301) and a second array (302), the runway micro-rings (32) of the first array (301) or the runway micro-rings (32) of the second array (302) are one-to-one aligned with the through holes (100), and the runway length of the runway micro-rings (32) of the first array (301) is greater than the runway length of the runway micro-rings (32) of the second array (302).

4. The method of claim 2, wherein the micro-ring resonator pressure sensor is prepared by the steps of: providing a substrate; forming a micro-ring resonator on the substrate; and forming a pressure sensitive layer on the micro-ring resonator. The micro-ring resonance array (3) has at least two, and the through hole (100) has at least two, at least two micro-ring resonance arrays (3) are respectively a first array (301) and a second array (302), the runway micro-rings (32) of the first array (301) or the runway micro-rings (32) of the second array (302) are one-to-one aligned with the through holes (100), and the runway length of the runway micro-rings (32) of the first array (301) is greater than the runway length of the runway micro-rings (32) of the second array (302).

5. The method of claim 4, wherein the micro-ring resonator pressure sensor is prepared by the steps of: providing a substrate; forming a micro-ring resonator on the substrate; and forming a cavity on the substrate, wherein the cavity is in contact with the micro-ring resonator. The micro-ring resonance array (3) is provided with four, and the four micro-ring resonance arrays (3) are respectively two first arrays (301) and two second arrays (302), the through hole (100) is provided with four and comprises two first holes (101) and two second holes (102); The runway micro-rings (32) of the two first arrays (301) are one-to-one aligned with one of the first holes (101) and one of the second holes (102); The runway micro-rings (32) of the two second arrays (302) are one-to-one aligned with the other first hole (101) and the other second hole (102).

6. The method of claim 1, wherein: The inner diameter of the through hole (100) is 1-3mm.

7. The method of claim 2, wherein the micro-ring resonator pressure sensor is prepared by the steps of: providing a substrate; forming a micro-ring resonator on the substrate; and forming a cavity on the substrate, wherein the cavity is in contact with the micro-ring resonator. The single-side runway length of the runway micro-ring (32) is 30um-50um.

8. The method of claim 1, wherein: The thickness of the film (2) is 0.001-0.005mm.

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