Waterproof sealing mechanism of microphone and electronic device

Abstract

This application relates to a waterproof sealing mechanism for a microphone and an electronic device. Based on this application, a sound transmission channel can be formed between a sound-permeable hole in the device housing and a microphone mounted on a module substrate. Furthermore, a waterproof sound-permeable membrane and a sealing film are stacked and sealed between the module substrate and the device housing. The waterproof sound-permeable membrane is horizontally placed within the sound transmission channel, and the sound-permeable holes of the sealing film seal and surround the sound transmission channel penetrating the waterproof sound-permeable membrane between the substrate's pickup hole and the sound-permeable hole, thereby achieving a waterproof seal for the sound transmission channel. Additionally, the sealing film also forms a sealed partition around the outer periphery of the waterproof sound-permeable membrane between the device housing and the module substrate, achieving a secondary waterproof seal for the sound transmission channel. This improves the impact of the sound-permeable hole on the sealing performance of the device housing. Furthermore, if a microphone array containing multiple microphones is used, the sealing consistency of the multiple sound-permeable holes can also be ensured.

Description

Technical Field

[0001] This application relates to waterproof sealing technology, and in particular to a waterproof sealing mechanism for a microphone, and an electronic device using the waterproof sealing mechanism for the microphone. Background Technology

[0002] Electronic devices that require sound wave acquisition are usually equipped with microphones. In addition, the electronic devices also have sound-transmitting holes in their housings so that sound waves from the environment in which the electronic devices are located can be transmitted through the sound-transmitting holes to the microphones inside the housings.

[0003] However, sound-through holes can affect the sealing of the device housing. Even if the opening size is reduced to minimize the impact of the sound-through holes on the sealing, the sound-through holes still cannot achieve a sealing effect. At the same time, they can also cause the intensity of the sound waves transmitted to the microphone to be too low, thereby limiting the effect of sound wave acquisition.

[0004] It is evident that improving the impact of sound-permeable holes on the sealing performance of the equipment housing is a technical problem that needs to be solved in the existing technology. Summary of the Invention

[0005] In view of this, embodiments of this application provide a waterproof sealing mechanism for a microphone and an electronic device that helps to improve the impact of sound-transmitting holes on the sealing performance of the device housing.

[0006] In one embodiment of this application, a waterproof sealing mechanism for a microphone may include:

[0007] The equipment housing has a sound-permeable opening;

[0008] A module substrate is fixedly mounted on the inner surface of the device housing, and the module substrate has a substrate pickup hole corresponding to the position of the sound-transmitting through hole.

[0009] A microphone is fixedly mounted on the substrate surface of the module substrate facing away from the device housing, and the microphone covers the sound pickup hole of the substrate to form a sound transmission channel through the sound pickup hole of the substrate between the microphone and the sound transmission hole.

[0010] A waterproof and acoustically permeable membrane is placed transversely in the sound transmission channel between the module substrate and the device housing;

[0011] A sealing film, together with the waterproof and sound-permeable membrane, is sealed and stacked between the module substrate and the device housing. The sealing film has a sound-permeable hole through which the sound transmission channel penetrates. The sound transmission channel penetrating the waterproof and sound-permeable membrane is sealed and surrounded by the hole wall of the sound-permeable hole between the sound pickup hole of the substrate and the sound-permeable through hole. Furthermore, the sealing film also forms a sealed partition between the device housing and the module substrate, enclosing the outer periphery of the sound-permeable hole of the film.

[0012] In some examples, optionally, the first opening end of the film sound-permeable hole is sealed and mated with the sound-permeable through hole on the inner surface of the device housing facing the module substrate, and the second opening end of the film sound-permeable hole is sealed and mated with the substrate pickup hole on the substrate surface of the module substrate facing the device housing. Furthermore, the waterproof sound-permeable membrane is stacked between the first opening end of the film sound-permeable hole and the sound-permeable through hole, or stacked between the second opening end of the film sound-permeable hole and the substrate pickup hole.

[0013] In some examples, optionally, the sealing film makes sealing contact with at least one of the device housing and the module substrate at the outer periphery of the film's sound transmission hole to form a sealing partition between the device housing and the module substrate that encloses the outer periphery of the film's sound transmission hole.

[0014] In some examples, optionally, the diaphragm size of the waterproof and sound-permeable membrane is adapted to the radial dimension of the sound transmission channel, and the sealing film size is larger than the diaphragm size of the waterproof and sound-permeable membrane.

[0015] In some examples, optionally, the inner surface of the device housing has a positioning groove, and the sound-transmitting through hole is formed at the bottom of the positioning groove; the sealing film is positioned and engaged with the positioning groove, and the positioning engagement makes the sound-transmitting hole of the film coaxially aligned with the sound-transmitting through hole; the sealing partition formed by the sealing film between the device housing and the module substrate is located outside the positioning groove.

[0016] In some examples, optionally, the sealing film has a film boss, the film sound-permeable hole passes through the film boss, the film boss protrudes from the film surface of the sealing film facing the device housing, and the film boss extends into the positioning groove to position and engage with the positioning groove.

[0017] In some examples, optionally, the waterproof and sound-permeable membrane is positioned in the positioning groove, and the waterproof and sound-permeable membrane seals the sound-permeable opening; the sealing film limits and presses the waterproof and sound-permeable membrane against the bottom of the positioning groove.

[0018] In some examples, the waterproof and acoustically permeable membrane is optionally adhered to the bottom of the positioning groove, and the bottom surface of the positioning groove is a polished surface.

[0019] In some examples, optionally, the opening edge of the sound-transmitting through-hole at the bottom of the positioning groove is a rounded edge.

[0020] In some examples, optionally, the sealing film has a recessed groove on the film surface facing the module substrate, which is coaxially arranged with the film boss; the waterproof and sound-permeable membrane is positioned in the recessed groove, which limits and presses the waterproof and sound-permeable membrane against the substrate surface of the module substrate facing the device housing, and the waterproof and sound-permeable membrane seals and covers the substrate pickup hole on the substrate surface of the module substrate facing the device housing.

[0021] In some examples, the waterproof and acoustically permeable membrane is optionally adhered to the substrate surface of the module substrate facing the device housing, and the substrate surface of the module substrate facing the device housing is a polished surface.

[0022] In some examples, optionally, the sealing film has film ribs that enclose the outer periphery of the sound-permeable hole of the film, wherein: the film ribs are distributed on the film surface of the sealing film facing the device housing, and the film ribs are in sealing contact with the device housing outside the positioning groove to form the sealing partition enclosing the outer periphery of the waterproof and sound-permeable membrane through the sealing contact with the device housing; and / or, the film ribs are distributed on the film surface of the sealing film facing the module substrate, and the film ribs are in sealing contact with the module substrate outside the positioning groove to form the sealing partition enclosing the outer periphery of the waterproof and sound-permeable membrane through the sealing contact with the module substrate.

[0023] In some examples, the opening edge of the acoustic through-hole facing the microphone is optionally a rounded edge.

[0024] In some examples, the membrane may optionally include a perforated protective membrane having the same sheet size as the waterproof and sound-permeable membrane, having a greater sheet strength than the waterproof and sound-permeable membrane, and being stacked on at least one surface of the waterproof and sound-permeable membrane.

[0025] In some examples, optionally, the radial dimension of the acoustic through-hole is larger than the radial dimension of the substrate pickup hole, and the radial dimension of the film acoustic through-hole is not smaller than the radial dimension of the acoustic through-hole; the acoustic through-hole is recessed relative to the outer surface of the device housing from the through-hole opening of the waterproof acoustic membrane, and the through-hole opening of the acoustic through-hole from the waterproof acoustic membrane is connected to the outer surface of the device housing through a conical wall opening, and the radial dimension of the conical wall opening increases monotonically in the direction from the acoustic through-hole to the outer surface of the device housing.

[0026] In some examples, optionally, the plurality of microphones and the plurality of substrate pickup holes are arranged in a multi-ring coplanar pattern on the module substrate; the number of the plurality of sound-permeable holes and their coplanar distribution on the device housing are the same as the plurality of microphones and the plurality of substrate pickup holes; the number of the plurality of film sound-permeable holes and their coplanar distribution on the device housing are the same as the plurality of microphones and the plurality of substrate pickup holes; the size of the sealing film is adapted to the size of the module substrate; the waterproof and sound-permeable membrane sealing each of the sound-permeable holes is limited and pressed by the sealing film; and the sealing contact position between the sealing film and the device housing is distributed on the outer periphery of each of the sound-permeable holes sealed by the waterproof and sound-permeable membrane.

[0027] In some examples, optionally, the housing area where the acoustic through-hole is deployed is a flat plate; the module substrate is a flat plate; the housing area and the module substrate are stacked parallel to each other, and the module substrate is fixed to the housing by a plurality of screws arranged in a ring.

[0028] In another embodiment of this application, an electronic device may include the waterproof sealing mechanism of the microphone in the foregoing embodiments.

[0029] Based on the above embodiments, a sound transmission channel can be formed between the acoustic through-hole in the device housing and the microphone mounted on the module substrate. Furthermore, a waterproof acoustic membrane and a sealing film are stacked and sealed between the module substrate and the device housing. The waterproof acoustic membrane is horizontally placed within the sound transmission channel, and the sound-permeable holes of the sealing film seal and surround the sound transmission channel penetrating the waterproof acoustic membrane between the substrate's pickup hole and the acoustic through-hole, achieving a waterproof seal for the sound transmission channel without affecting the propagation of sound waves along the channel. Additionally, the sealing film also forms a sealed partition around the periphery of the waterproof acoustic membrane between the device housing and the module substrate, achieving a secondary waterproof seal for the sound transmission channel. This improves the impact of the acoustic through-hole on the sealing performance of the device housing. Furthermore, if a microphone array containing multiple microphones is used, the sealing consistency of the multiple acoustic through-holes can be ensured. Attached Figure Description

[0030] The following figures are for illustrative purposes only and do not limit the scope of this application:

[0031] Figure 1 This is an exploded structural diagram of the waterproof sealing mechanism of the microphone in one embodiment of this application;

[0032] Figure 2 For example Figure 1 A schematic diagram of the microphone distribution in the waterproof sealing mechanism of the microphone in the illustrated embodiment;

[0033] Figure 3 To and Figure 1 A schematic diagram of the device housing structure adapted to the waterproof sealing mechanism of the microphone shown;

[0034] Figure 4 For example Figure 1 A cross-sectional view of the first assembly example of the waterproof sealing mechanism for the microphone shown;

[0035] Figure 5 For example Figure 1 A cross-sectional view of a second assembly example of the waterproof sealing mechanism for the microphone shown;

[0036] Figure 6 For example Figure 1 A cross-sectional view of the third assembly example structure of the waterproof sealing mechanism of the microphone shown;

[0037] Figure 7 This is an exploded view of an electronic device according to another embodiment of this application;

[0038] Figure 8 For example Figure 7 A schematic diagram of the semi-assembled structure of the electronic device in the illustrated embodiment;

[0039] Figure 9 For example Figure 7 A cross-sectional view of the assembly structure of the electronic device in the illustrated embodiment;

[0040] Figure 10 For example Figure 7 An exploded view of the optical imaging module of the electronic device in the illustrated embodiment;

[0041] Figure 11 For example Figure 7 An exploded view of the light-emitting lamp assembly of the electronic device in the illustrated embodiment;

[0042] Figure 12 for Figure 11 The image shows a cross-sectional view of the assembly structure of the light-emitting lamp assembly.

[0043] Figure Labels

[0044] 10 Equipment Housing

[0045] 110 housing panel

[0046] 111 Positioning Settlement Tank

[0047] 112 Limiting Ring Groove

[0048] 113 Imaging Through-Hole

[0049] 114 positioning groove

[0050] 115 sound-through hole

[0051] 116 Conical Wall Opening

[0052] 117 module positioning column

[0053] 118 light-transmitting aperture

[0054] 120 panel perimeter

[0055] 121 antenna mounting through hole

[0056] 122 memory card slots

[0057] 130 First Hole Seat

[0058] 20 Equipment Housing Cover

[0059] 210 Shell Backplate

[0060] 211 Backplate Boss

[0061] 212 Backplate Blind Hole

[0062] 217 threaded mounting through hole

[0063] 220 Backplate Perimeter

[0064] 230 Second Hole Seat

[0065] 30 optical imaging modules

[0066] 300 lens assembly

[0067] 300a optical lens

[0068] 300b lens mount

[0069] 310 processing components

[0070] 350 adapter bracket

[0071] 40-module housing

[0072] 400mm translucent glass

[0073] 410 Warehouse Shell Main Body

[0074] 411 Positioning Column

[0075] 412 Open Flange

[0076] 413 cylindrical column shoulder

[0077] 415 Warehouse Internal Boss

[0078] 416 cable guide post

[0079] 420 hull cover

[0080] 460mm line sealing plug

[0081] 461 Sealing Plug Body

[0082] 462 limiting flange

[0083] 463 seam gap

[0084] 50 Acoustic Acquisition Module

[0085] 500 microphones

[0086] 510 module substrate

[0087] 513 substrate clearance hole

[0088] 515 substrate microphone hole

[0089] 516 substrate connector

[0090] 517 substrate positioning holes

[0091] 520 sealing film

[0092] 522 film ribs

[0093] 523 film clearance hole

[0094] 525 film sound transmission hole

[0095] 526 film boss

[0096] 527 film positioning holes

[0097] 529 recessed groove

[0098] 530 mesh protective film

[0099] 550 waterproof and acoustically permeable membrane

[0100] 60 main control module

[0101] 610 main control circuit board

[0102] 630 clearance plate hole

[0103] 660 microphone connector

[0104] 71 antenna assembly

[0105] 72 cable connector

[0106] 720 connector sleeve

[0107] 80 LED light group

[0108] 800 LED body

[0109] 810 lamp driver board

[0110] 820 light guide base

[0111] 821 base plate

[0112] 822 base enclosure

[0113] 823 light guide column

[0114] 830 light-shielding medium

[0115] 860 driver interface

[0116] 91 housing seal ring

[0117] 93 through-hole sealing ring

[0118] 94 housing seal ring

[0119] 97 antenna sealing ring

[0120] 98 light group sealing ring Detailed Implementation

[0121] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided with reference to the accompanying drawings and embodiments.

[0122] Figure 1 This is an exploded structural diagram of the waterproof sealing mechanism of the microphone in one embodiment of this application. Please refer to... Figure 1 In embodiments of this application, the waterproof sealing mechanism of the microphone may include a device housing 10 and a sound wave acquisition module 50.

[0123] The device housing 10 can be a rigid component of any shape and material. Figure 1 The device housing 10 shown is only a part of it and should not be construed as having a true shape limited to that of the device housing 10. Figure 1 The partial shape is shown in the figure. Furthermore, in an embodiment of this application, the device housing 10 has a sound-transmitting through-hole 115.

[0124] The acoustic wave acquisition module 50 may include a module substrate 510 and a microphone 500. The module substrate 510 is fixedly mounted on the inner surface of the device housing 10. The module substrate 510 has a substrate pickup hole 515 corresponding to the position of the sound transmission hole 115. The microphone 500 can be fixedly mounted on the substrate surface of the module substrate 510 facing away from the device housing 10. The microphone 500 covers the substrate pickup hole 515 to form a sound transmission channel through the substrate pickup hole 515 between the microphone 500 and the sound transmission hole 115.

[0125] Figure 2 For example Figure 1 A schematic diagram of the microphone distribution in the waterproof sealing mechanism of the microphone in the illustrated embodiment. Please refer to... Figure 1 At the same time, further combine Figure 2 In the embodiments of this application, the sound wave acquisition module 50 may include a plurality of microphones 500, and correspondingly provide a plurality of substrate pickup holes 515 corresponding one-to-one with the plurality of microphones 500. That is, the module substrate 510 of the sound wave acquisition module 50 may be equipped with a microphone array containing a plurality of microphones 500. In the illustrated representation of the embodiments of this application, 64 microphones 500 are arranged in a manner of 8 microphones per circle for a total of 8 circles (e.g., Figure 2 The distribution is shown in the form of circles (represented by dashed lines).

[0126] from Figure 2 It can also be seen that the inner surface of the device housing 10 may have at least two module positioning posts 117, and the module substrate 510 may have at least two substrate positioning holes 517 corresponding to the positions of the at least two module positioning posts 117. Based on the one-to-one positioning fit between the at least two module positioning posts 117 and the at least two substrate positioning holes 517, the module substrate 510 is constrained in an assembly position in which the substrate pickup hole 515 is coaxially aligned with the film sound transmission hole 525 and the sound transmission through hole 115. For example, the coaxial alignment described herein may refer to a single-sided gap of no more than 0.5 mm.

[0127] In embodiments of this application, the acoustic wave acquisition module 50 may further include a waterproof and acoustically permeable membrane 550 and a sealing film 520.

[0128] A waterproof and acoustically permeable membrane 550 is horizontally positioned in the sound transmission channel of the microphone 500 between the module substrate 510 and the device housing 10.

[0129] The waterproof and acoustically permeable membrane 550, horizontally positioned within the sound transmission channel of the microphone 500, can be installed at any location between the module substrate 510 and the device housing 10. For example, each waterproof and acoustically permeable membrane 550 can be installed by means such as bonding it to the inner surface of the device housing 10, thereby sealing and covering the corresponding acoustically permeable hole 115 on the inner surface of the device housing 10 facing the module substrate 510, thus horizontally positioned within the sound transmission channel between the corresponding microphone 500 and the acoustically permeable hole 115, forming a waterproof barrier. Alternatively, each waterproof and acoustically permeable membrane 550 can be installed by means such as bonding it to the substrate surface of the module substrate 510, thereby sealing and covering the corresponding substrate pickup hole 515 on the substrate surface of the module substrate 510 facing the device housing 10, similarly horizontally positioned within the sound transmission channel between the corresponding microphone 500 and the acoustically permeable hole 115, forming a waterproof barrier.

[0130] When the acoustic wave acquisition module 50 includes multiple microphones 500, the diaphragm size of the waterproof acoustic membrane 550 can be adapted to the radial dimension of the sound transmission channel (e.g., larger than or slightly larger than the radial dimension of the sound-transmitting hole 115), and the number of waterproof acoustic membranes 550 can be the same as the number of sound-transmitting holes 115. The adaptation of the diaphragm size of the waterproof acoustic membrane 550 to the radial dimension of the sound transmission channel includes at least the following dimensional constraints: the diaphragm size of the waterproof acoustic membrane 550 is not smaller than the radial dimension of the sound-transmitting hole 115, and it also has an edge allowance to facilitate the installation of the waterproof acoustic membrane 550.

[0131] The sealing film 520 and the waterproof and acoustically transparent membrane 550 are sealed and stacked together between the module substrate 510 and the device housing 10. The sealing film 520 has acoustically transparent holes 525 that correspond one-to-one with the acoustic through-holes 115 and the substrate pickup holes 515, and are penetrated by the corresponding sound transmission channels. That is, each microphone 500 forms a sound transmission channel through the substrate pickup hole 515 and the film acoustically transparent hole 525 between itself and its corresponding acoustic through-hole 115. Furthermore, the diaphragm size of the waterproof and acoustically transparent membrane 550 is adapted to the radial dimension of the sound transmission channel, and at least the following dimensional constraint is included: the diaphragm size of the waterproof and acoustically transparent membrane 550 is not smaller than the radial dimension of the film acoustically transparent hole 525.

[0132] Furthermore, the sealing film 520, which is stacked together with the waterproof and acoustically permeable membrane 550 between the module substrate 510 and the device housing 10, can form a limiting and pressing bond to the waterproof and acoustically permeable membrane 550. For example, if the waterproof and acoustically permeable membrane 550 seals and covers the sound-permeable through-hole 115 on the inner surface of the device housing 10 facing the module substrate 510, then the sealing film 520 can limit and press the waterproof and acoustically permeable membrane 550 onto the inner surface of the device housing 10 facing the module substrate 510. As another example, if the waterproof and acoustically permeable membrane 550 seals and covers the substrate pickup hole 515 on the substrate surface of the module substrate 510 facing the device housing 10, then the sealing film 520 can limit and press the waterproof and acoustically permeable membrane 550 onto the substrate surface of the module substrate 510 facing the device housing 10. Thus, based on the sealing stack of the sealing film 520 and the waterproof sound-permeable membrane 550 between the module substrate 510 and the device housing 10, the sound-permeable hole 525 of the sealing film 520 seals and surrounds the sound transmission channel that passes through the waterproof sound-permeable membrane 550 between the corresponding substrate pickup hole 515 and the sound-permeable through hole 115, so as to achieve a waterproof seal on the sound transmission channel without affecting the propagation of sound waves along the sound transmission channel.

[0133] The aforementioned sealing enclosure can refer to the sound transmission channel penetrating the waterproof acoustic membrane 550 being sealed and surrounded by the wall of the film acoustic hole 525 between the substrate pickup hole 515 and the acoustic through hole 115. For example, the first opening end of the film acoustic hole 525 facing the device housing 10 can be sealed and joined (e.g., seamlessly joined) with the acoustic through hole 115 on the inner surface of the device housing 10 facing the module substrate 510, and the second opening end of the film acoustic hole 525 facing the module substrate 510 can be sealed and joined (e.g., seamlessly joined) with the substrate pickup hole 515 on the substrate surface of the module substrate 510 facing the device housing 10. In this case:

[0134] A waterproof and sound-permeable membrane 550 is stacked between the first opening end of the film sound-permeable hole 525 and the sound-permeable through hole 115, and seals and covers the sound-permeable through hole 115 on the inner surface of the device housing 10 facing the module substrate 510. Alternatively, the waterproof and sound-permeable membrane 550 is stacked between the second opening end of the film sound-permeable hole 525 and the substrate pickup hole 515, and seals and covers the substrate pickup hole 515 on the substrate surface of the module substrate 510 facing the device housing 10.

[0135] The size of the sealing film 520 can be larger than the size of the waterproof and acoustically transparent membrane 550. For example, the size of the sealing film 520 can be adapted to the size of the module substrate 510. That is, when the sound wave acquisition module 50 includes multiple microphones 500, the size of the sealing film 520 can cover the housing area of ​​all the sound-transparent holes 115 opened in the device housing 10, just like the module substrate 510. Furthermore, each waterproof and acoustically transparent membrane 550 that seals and covers each sound-transparent hole 115 or the substrate pickup hole 515 is limited and pressed by the same sealing film 520.

[0136] In this case, the sealing film 520 can also form a sealed partition between the device housing 10 and the module substrate 510, enclosing the outer periphery of the sound-permeable hole 525 of the film, to achieve a secondary waterproof seal for the sound transmission channel sealed around the sound-permeable hole 525 of the film. That is, regardless of whether the waterproof sound-permeable membrane 550 seals and covers the sound-permeable hole 115 on the inner surface of the device housing 10 facing the module substrate 510, or seals and covers the substrate pickup hole 515 on the substrate surface of the module substrate 510 facing the device housing 10, the sealed partition formed by the sealing film 520 between the device housing 10 and the module substrate 510 can include the sealing film 520 making sealed contact with at least one of the device housing 10 and the module substrate 510 on the outer periphery of the waterproof sound-permeable membrane 550. In the case where the acoustic wave acquisition module 50 includes multiple microphones 500, the sealing film 520 has sealing contact positions with at least one of the device housing 10 and the module substrate 510 distributed on the outer periphery of each sound-permeable hole 115 or substrate pickup hole 515 sealed and covered by the waterproof and sound-permeable membrane 550.

[0137] Therefore, based on the waterproof barrier formed by the waterproof sound-permeable membrane 550 in the sound transmission channel, the sealing and surrounding of the sound transmission channel by the sound-permeable hole 525 of the sealing film 520, and the sealing and partition formed by the sealing film 520 surrounding the outer periphery of the sound-permeable hole 525, the influence of the sound-permeable hole 115 on the sealing performance of the equipment housing can be improved.

[0138] Furthermore, if a microphone array containing multiple microphones 500 is used, the sealing consistency of multiple sound-transmitting holes can also be ensured.

[0139] In the embodiments of this application, Figure 1The housing area (e.g., housing panel) of the device housing 10 with the sound-permeable aperture 115 is shown to be a flat plate, and the module substrate 510 is also a flat plate. For example, the module substrate 510 can be a PCB (Printed Circuit Board). In this case, for an array deployment containing multiple microphones 500, the module substrate 510 can be stacked parallel to the housing area of ​​the device housing 10 with the sound-permeable aperture 115, so that the sound transmission channel connecting each microphone 500 and the corresponding sound-permeable aperture 115 is of the same length, thereby ensuring that each microphone 500 in the microphone array has consistent sound pickup.

[0140] That is, if multiple microphones 500 and multiple substrate pickup holes 515 are arranged in a multi-ring coplanar pattern on the module substrate 510, then: the number of multiple sound-permeable holes 115 and multiple waterproof sound-permeable membranes 550 and their coplanar distribution on the device housing 10 are the same as those of multiple microphones 500 and multiple substrate pickup holes 515; the number of multiple film sound-permeable holes 525 and their coplanar distribution on the device housing 10 are the same as those of multiple microphones 500 and multiple substrate pickup holes 515; in addition, the sealing film 520 stacked between the inner surfaces of the module substrate 510 and the device housing 10 is also flat; and the number of multiple film sound-permeable holes 525 on the sealing film 520 and their coplanar distribution on the sealing film 520 are also the same as those of multiple microphones 500 and multiple substrate pickup holes 515.

[0141] In embodiments of this application, for cases containing multiple microphones 500, the module substrate 510 can be fixed to the device housing 10 by a plurality of screws 590 arranged in a ring (e.g., at least two rings) to avoid uneven lengths of the sound transmission channels connecting each microphone 500 and its corresponding sound-transmitting hole 115 due to uneven force on the module substrate 510. In the illustrative representation of the embodiments of this application, 16 screws 590 are arranged in 3 rings, and the number of single-ring screws 590 in the 3 rings is 4, 4, and 8 from the inside out. In this case, the distance between adjacent screws 590 should be set to help make the overall stress-strain uniformity of the module substrate 510 greater than 90%. For example, assuming the radial dimension of the module substrate 510 is 170 mm, the nominal thickness of the module substrate 510 is 2 mm, and the flatness of the module substrate 510 is less than 0.1 mm, then the distance between any two adjacent screws 590 used to fix the module substrate 510 and the sealing film 520 shall not exceed 45 mm. Moreover, since the sealing film 520 is an integrally molded part adapted to the size of the module substrate 510, the sealing film 520 can have a uniform compression amount in the thickness direction sufficient to produce a sealing effect. For example, for the case where the Shore hardness of the sealing film 520 is in the range of 28 to 32 degrees, the sealing film 520 can have a compression amount of 12% to 18% (preferably 15%).

[0142] It is understood that the embodiments of this application are only examples of microphone arrays including multiple microphones 500, but for single microphone deployment schemes containing only one microphone 500, the two-stage sealing scheme using waterproof sound-permeable membrane 550 and sealing film 520 is still applicable.

[0143] The above is a general description of the waterproof sealing mechanism of the microphone in the embodiments of this application. In order to better understand the sealing effect produced by the waterproof sound-permeable membrane 550 and the sealing film 520 working together, a detailed description will be given below in conjunction with the accompanying drawings.

[0144] If the inner surface of the device housing 10 also has at least two module positioning posts 117, then in order to ensure that the film sound transmission hole 525 is coaxially aligned with the sound transmission through hole 115 and the substrate pickup hole 515, the sealing film 520 may also have at least two film positioning holes 527 corresponding to the positions of the at least two module positioning posts 117. Furthermore, based on the one-to-one positioning fit between the at least two module positioning posts 117 and the at least two film positioning holes 527, the sealing film 520 is constrained in an assembly position that makes the film sound transmission hole 525 coaxially aligned with the sound transmission through hole 115 and the substrate pickup hole 515.

[0145] In the embodiments of this application, in order to further improve the coaxiality between the sound-permeable hole 525 of the film and the sound-permeable through hole 115, which serves as the entrance to the sound transmission channel, a structure for positioning and fitting can be provided for the sealing film 520 and the device housing 10.

[0146] Figure 3 To and Figure 1 The diagram shows a device housing structure adapted to the microphone's waterproof sealing mechanism. Please refer to [link / reference]. Figure 3 In the embodiments of this application, for each microphone 500's sound transmission channel, the inner surface of the device housing 10 has a corresponding positioning groove 114, and the sound-transmitting through hole 115 of the sound transmission channel is opened at the bottom of the corresponding positioning groove 114.

[0147] Figure 4 For example Figure 1 A cross-sectional view of the first assembly example structure of the waterproof sealing mechanism for the microphone shown. Figure 5 For example Figure 1 A cross-sectional view of a second assembly example of the waterproof sealing mechanism for the microphone shown. Figure 6 For example Figure 1 The diagram shows a cross-sectional view of a third assembly example of the microphone's waterproof sealing mechanism. Please refer to [reference needed]. Figure 3 At the same time, further combine Figures 4 to 6If the inner surface of the device housing 10 has a corresponding positioning groove 114, then the sealing film 520 can be positioned and engaged with the positioning groove 114. This positioning engagement aligns the sound transmission hole 525 of the film with the sound transmission through hole 115. Furthermore, the sealing partition formed by the sealing film 520 between the device housing 10 and the module substrate 510 is located outside the positioning groove 114. That is, the sealing contact position of the sealing film 520 with at least one of the device housing 10 and the module substrate 510 is located outside the positioning groove 114.

[0148] For example, in Figures 4 to 6 In the process, the sealing film 520 may have a film boss 526 that closes and surrounds each film sound transmission hole 525, that is, the film sound transmission hole 525 passes through the film boss 526, and the film boss 526 that closes and surrounds each film sound transmission hole 525 protrudes from the film surface of the sealing film 520 toward the device housing 10, and the film boss 526 that closes and surrounds each film sound transmission hole 525 extends into the positioning groove 114 where the corresponding sound transmission hole 115 is located and is positioned and engaged with the positioning groove 114.

[0149] exist Figure 4 and Figure 5 In this example, a waterproof sound-permeable membrane 550, which is horizontally placed in each sound transmission channel, is positioned in a positioning groove 114 and sealed to cover the sound-permeable through hole 115 corresponding to the bottom of the positioning groove 114. For example, the radial dimensions of the positioning groove 114 and the film boss 526 can be the same as or adapted to the radial dimensions of the waterproof sound-permeable membrane 550, and the waterproof sound-permeable membrane 550 can be pasted to the bottom of the positioning groove 114.

[0150] In this case, such as Figure 4 and Figure 5 As shown, the sealing film 520 limiting and pressing the waterproof and sound-permeable membrane 550 onto the inner surface of the equipment housing 10 can mean that the sealing film 520 (e.g., film boss 526) limits and presses the waterproof and sound-permeable membrane 550 onto the bottom of the positioning groove 114. This reduces the bonding gap between the waterproof and sound-permeable membrane 550 and the inner surface of the equipment housing 10 (e.g., the bottom of the positioning groove 114), thereby improving the sealing characteristics of the waterproof and sound-permeable membrane 550 for the sound-permeable hole 115.

[0151] If, as described above, the waterproof and acoustically permeable membrane 550 can be adhered to the inner surface of the equipment housing 10, then the sealing film 520 (e.g., film boss 526) can further enhance the adhesion between the waterproof and acoustically permeable membrane 550 and the inner surface of the equipment housing 10 by limiting and pressing it. Furthermore, in this case, preferably, the inner surface of the equipment housing 10 (e.g., the bottom of the positioning groove 114) can be a polished surface to improve sealing characteristics by reducing the bonding gap between the waterproof and acoustically permeable membrane 550 and the inner surface of the equipment housing 10. For example, the polishing degree of the polished surface can be no less than 400 mesh.

[0152] exist Figure 6 In this example, a waterproof and acoustically permeable membrane 550, horizontally positioned in each sound transmission channel, is indirectly positioned by a positioning groove 114 via a sealing film 520 and seals the corresponding substrate pickup hole 515 on the substrate surface of the module substrate 510 facing the device housing 10. Specifically, the sealing film 520 has a recessed groove 529 coaxially arranged with the film boss 526 on the film surface facing the module substrate 510. The waterproof and acoustically permeable membrane 550 is positioned in the recessed groove 529, and the waterproof and acoustically permeable membrane 550 seals the substrate pickup hole 515 on the substrate surface of the module substrate 510 facing the device housing 10. For example, the radial dimensions of the positioning groove 114 and the film boss 526 can be larger than the radial dimension of the waterproof and acoustically permeable membrane 550, the radial dimension of the recessed groove 529 can be the same as or adapted to the radial dimension of the waterproof and acoustically permeable membrane 550, and the waterproof and acoustically permeable membrane 550 can be adhered to the substrate surface of the module substrate 510 facing the device housing 10.

[0153] In this case, such as Figure 6 As shown, the sealing film 520 limiting and pressing the waterproof and sound-permeable membrane 550 onto the inner surface of the device housing 10 can mean that the sealing film 520 (e.g., the recessed groove 529) limits and presses the waterproof and sound-permeable membrane 550 onto the substrate surface of the module substrate 510 facing the device housing 10. This reduces the bonding gap between the waterproof and sound-permeable membrane 550 and the substrate surface of the module substrate 510 facing the device housing 10, thereby improving the sealing characteristics of the waterproof and sound-permeable membrane 550 for the substrate pickup hole 515.

[0154] Moreover, with Figure 4 and Figure 5 Similarly, if the waterproof and sound-permeable membrane 550 is pasted on the substrate surface of the module substrate 510 facing the device housing 10, then preferably, the substrate surface of the module substrate 510 facing the device housing 10 is a polished surface, for example, the polishing degree of the polished surface can be not less than 400 mesh.

[0155] See also Figures 4 to 6Whether the waterproof and sound-permeable membrane 550 seals and covers the sound-permeable hole 115 on the inner surface of the device housing 10 facing the module substrate 510, or seals and covers the substrate pickup hole 515 on the substrate surface of the module substrate 510 facing the device housing 10, the sealing partition formed by the sealing film 520 between the device housing 10 and the module substrate 510 (i.e., sealing contact with at least one of the device housing 10 and the module substrate 510) can be located outside the positioning groove 114.

[0156] For example, the sealing film 520 may have a film rib 522 that surrounds the outer periphery of the film sound hole 525. That is, the film rib 522 may be annular, and the radial dimension of the annulus may be greater than the radial dimension of the film boss 526. Therefore, the film rib 522 is located outside the positioning groove 114.

[0157] Moreover, the film rib 522 can be like Figure 4 and Figure 5 As shown, the film surface of the sealing film 520 facing the device housing 10 is distributed as shown. In this case, the film ribs 522 can make sealing contact with the device housing 10 outside the positioning groove 114 to form a sealed partition that encloses the outer periphery of the waterproof and sound-permeable membrane 550 between the device housing 10 and the module substrate 510.

[0158] Alternatively, the 522 film ribs can also be like... Figure 6 As shown, the sealing film 520 is distributed on the film surface facing the device housing 10 and on the film surface facing the module substrate 510. In this case, the film ribs 522 can make sealing contact with the device housing 10 and the module substrate 510 outside the positioning groove 114 to form a sealed partition that surrounds the outer periphery of the waterproof and sound-permeable membrane 550 between the device housing 10 and the module substrate 510.

[0159] That is, the film ribs 522 can be distributed on the film surface of the sealing film 520 facing the device housing 10 and / or facing the module substrate 510, and the film ribs 522 can be in sealing contact with at least one of the device housing 10 and the module substrate 510 outside the positioning groove 114, so as to form a sealed partition between the device housing 10 and the module substrate 510 that surrounds the outer periphery of the waterproof and sound-permeable membrane 550 using the sealing film 520.

[0160] In the embodiments of this application, the thickness of the waterproof and sound-permeable membrane 550 can be 0.1 mm, which is easily damaged under external forces (such as wind and rain in the outdoor environment). In particular, when the waterproof and sound-permeable membrane 550 is sealed and covered with the sound-permeable through-hole 115 on the inner surface of the device housing 10 facing the module substrate 510, the risk of damage to the waterproof and sound-permeable membrane 550 will be higher.

[0161] Therefore, in order to reduce the sealing failure of the sound-permeable opening 115 caused by damage to the waterproof sound-permeable membrane 550, such as Figure 4 and Figure 5 As shown, an optimization scheme in an embodiment of this application may include: the opening edge of the sound-transmitting through hole 115 of each microphone 500 adjacent to the waterproof sound-transmitting membrane 550 is a rounded edge, that is, the opening edge of the through hole opening at the bottom of the positioning groove 114 of each sound-transmitting through hole 115 is a rounded edge. Preferably, the nominal radius r0 of the rounded edge can be 0.5mm.

[0162] Similarly, to reduce the sealing failure of the sound-permeable opening 115 caused by damage to the waterproof and sound-permeable membrane 550, such as... Figures 4 to 6 As shown, another optimization scheme that can be used in this embodiment, either as an alternative to or simultaneously with the above-mentioned optimization scheme, may include: the acoustic wave acquisition module 50 may further include a mesh protective membrane 530. The membrane size of the mesh protective membrane 530 is the same as that of the waterproof and acoustically permeable membrane 550. The membrane strength of the mesh protective membrane 530 is greater than that of the waterproof and acoustically permeable membrane 550. For example, the membrane material of the mesh protective membrane 530 may include PET (Polyethylene terephthalate) with a mesh count of not less than about 1000 meshes. The thickness of the mesh protective membrane 530 may be 0.3 mm. Furthermore, the mesh protective membrane 530 is stacked on at least one side surface of the waterproof and acoustically permeable membrane 550 to provide support for the waterproof and acoustically permeable membrane 550. That is, the mesh protective membrane 530 may also be referred to as a support membrane.

[0163] For example, in Figure 4 In the middle, the mesh protective film 530 is stacked in the positioning groove 114 between the waterproof and sound-permeable film 550 and the sealing film 520 (e.g., film boss 526), ​​that is, the mesh protective film 530 is stacked on the side surface of the waterproof and sound-permeable film 550 facing the module substrate 510.

[0164] For example, in Figure 5 In the middle, the mesh protective film 530 is stacked in the positioning groove 114 between the waterproof sound-permeable film 550 and the sealing film 520 (e.g., film boss 526) and between the waterproof sound-permeable film 550 and the bottom of the positioning groove 114. That is, the mesh protective film 530 is also stacked on the two sides of the waterproof sound-permeable film 550 facing the module substrate 510 and the device housing 10 respectively.

[0165] For example, in Figure 6 In the recessed groove 529, the perforated protective membrane 530 is stacked between the waterproof and sound-permeable membrane 550 and the sealing film 520, that is, the perforated protective membrane 530 is stacked on the side surface of the waterproof and sound-permeable membrane 550 facing the equipment housing 10.

[0166] In the case where multiple microphones 500 and multiple substrate pickup holes 515 are distributed in multiple rings on the module substrate 510, there are also multiple mesh protective films 530. The number of multiple mesh protective films 530 can be the same as the number of multiple waterproof and sound-permeable films 550, or twice the number of multiple waterproof and sound-permeable films 550. Furthermore, the coplanar distribution of multiple mesh protective films 530 on the device housing 10 is the same as that of multiple microphones 500, multiple substrate pickup holes 515, and multiple waterproof and sound-permeable films 550.

[0167] Please stay tuned. Figure 3 as well as Figures 4 to 6 In the embodiments of this application, the radial dimension (4 mm) of the sound-transmitting hole 115 is greater than the radial dimension of the substrate pickup hole 515, and the radial dimension (e.g., 5 mm) of the film sound-transmitting hole 525 is not less than the radial dimension of the sound-transmitting hole 115. Thus, the aperture of each sound transmission channel on the sound input side can be enlarged to enhance the signal strength of the sound wave signal transmitted to the microphone 500 through the sound transmission channel.

[0168] To further amplify the signal strength of the acoustic wave signal transmitted to the microphone 500, in this embodiment, the acoustic through-hole 115 is recessed from the outer surface of the device housing 10 facing away from the device cover 20, away from the waterproof acoustic membrane 550. The acoustic through-hole 115 is connected to the outer surface of the device housing 10 facing away from the device cover 20 via a conical wall opening 116. Furthermore, the radial dimension of the conical wall opening 116 increases monotonically in the direction from the acoustic through-hole 115 to the outer surface of the device housing 10 facing away from the device cover 20. Thus, the conical wall opening 116 can form a horn-like opening for expanding and collecting sound waves outside the acoustic through-hole 115. For example, the nominal axial dimension of the conical wall opening 116 is 1.5 mm, and the inclination angle of the conical wall of the conical wall opening 116 relative to the axial direction is in the range of 30° to 35°.

[0169] Furthermore, the flared opening formed by the conical wall opening 116 can be considered as an area communicating with the external environment. Therefore, the concavity of the sound-permeable hole 115 effectively shortens the channel length of the sound transmission channel, which helps to improve the signal-to-noise ratio of the sound wave signal collected by the microphone 500. In addition, the flared opening formed by the conical wall opening 116 can prevent rainwater from accumulating in the sound-permeable hole 115 in the outdoor environment, thereby reducing the probability of corrosion of the waterproof sound-permeable membrane 550, and thus reducing the probability of sealing failure of the sound-permeable hole 115 due to corrosion and damage of the waterproof sound-permeable membrane 550.

[0170] In the embodiments of this application, the acoustic wave acquisition module 50 in the waterproof sealing mechanism of the microphone can also coexist with modules having other functions. For example, an area for deploying modules with other functions can be reserved at the center position of the aforementioned annularly coplanar distribution. Accordingly, to avoid interference with modules having other functions, the module substrate 510 can also have a substrate clearance hole 513, and the sealing film 520 can have a film clearance hole 523. Furthermore, both the substrate clearance hole 513 and the film clearance hole 523 correspond to the position of the imaging through hole 113. In this case, the device housing 10 can have a through hole 113 at the center position of the aforementioned annularly coplanar distribution. If the module having other functions is a speaker, the through hole 113 can be a mesh for covering the speaker's sound-emitting surface. Alternatively, if the module having other functions is an optical imaging module, the through hole 113 can be an imaging through hole for avoiding the imaging field of view of the lens assembly of the optical imaging module.

[0171] Figure 7 This is an exploded view of an electronic device according to another embodiment of this application. Figure 8 For example Figure 7 A schematic diagram of the semi-assembled structure of the electronic device in the illustrated embodiment. Figure 9 For example Figure 7 A cross-sectional view of the assembly structure of the electronic device in the illustrated embodiment. Please refer to... Figures 7 to 9 Taking the through-hole 113 as an imaging through-hole as an example, in this embodiment, the electronic device can be used to perform combined video and audio detection on the target object. The electronic device may include a device housing 10, a device cover 20, an optical imaging module 30, the acoustic wave acquisition module 50 in the aforementioned embodiment, and a main control module 60.

[0172] The device housing 10 and the device cover 20 can be assembled together to provide a cavity for accommodating the components of the electronic device.

[0173] Please see Figures 7 to 9 Simultaneous review Figure 1 In this embodiment, the device housing 10 may include a housing panel 110, and the housing area of ​​the device housing 10 mentioned in the previous embodiment where the sound-permeable hole 115 is deployed may be located on the housing panel 110, that is, Figure 1 The partial structure of the device housing 10 shown can be considered as part of the housing panel 110. Accordingly, the imaging through hole 113 and the sound transmission through hole 115 can both be located on the housing panel 110.

[0174] In embodiments of this application, the device housing 10 may further include a panel periphery 120 enclosing the panel edge of the housing panel 110, and the device cover 20 may include a housing back plate 210 and a back plate periphery 220 enclosing the back plate edge of the housing back plate 210. The device housing 10 and the device cover 20 can be assembled with the housing panel 110 and housing back plate 210 spaced apart (preferably arranged parallel to each other), and the panel periphery 120 and back plate periphery 220 adapted to be spliced ​​together. Alternatively, the device housing 10 may have a first hole seat 130 disposed at the panel corner of the housing panel 110, and the device cover 20 may have a second hole seat 230 disposed at the back plate corner of the housing back plate 210. The device housing 10 and the device cover 20 can be assembled with screws passing through the second hole seat 230 and threaded blind holes in the first hole seat 130.

[0175] Furthermore, as a preferred embodiment of this application, both the device housing 10 and the device cover 20 can be made of metals with rust-proof and corrosion-resistant properties, such as stainless steel, to improve the service life of electronic devices in outdoor environments.

[0176] Please pay special attention Figure 8 In the embodiments of this application, the device housing 10 can serve as a mounting carrier for most components, the device cover 20 can be used to install a heat dissipation module, and the device cover 20 can also serve as a mounting base for electronic devices. The outer surface of the device cover 20 (e.g., the back plate 210) facing away from the device housing 10 (the housing panel 110) can have a back plate boss 211. The back plate boss 211 can be used to cooperate with an external desktop bracket or wall mount bracket. Furthermore, the back plate boss 211 can have a back plate blind hole 212 to achieve a fixed connection with an external desktop bracket or wall mount bracket.

[0177] The optical imaging module 30 may include a lens assembly 300, and the lens field of view of the lens assembly 300 is oriented toward the imaging aperture 113.

[0178] In the embodiments of this application, the lens assembly 300 may include any optical lens that transmits visible light, and the optical imaging module 30 may also include visible light sensing elements such as CCD (Charge Coupled Device) or CMOS. Thus, the optical imaging module 30 can use the visible light sensing elements to image the visible light transmitted by the lens assembly 300 to generate a visible light image, so that the optical imaging module can be used to acquire monitoring images of the target object. Furthermore, during the use of the electronic device to detect the target object, the optical imaging module 30 can be used to acquire monitoring images of the target object.

[0179] The main control module 60 can be electrically connected to the optical imaging module 30 and the acoustic wave acquisition module 50 (i.e., the module substrate 510), and the optical imaging module 30, the acoustic wave acquisition module 50 and the main control module 60 are all housed in the cavity formed by the assembly of the device cover 20 and the device housing 10.

[0180] In the embodiments of this application, the main control module 60 may include a main control circuit board 610, which may be a PCB, and the main control circuit board 610 may integrate at least one processing device such as a CPU (central processing unit), MCU (microcontroller unit), FPGA (field-programmable gate array), or GPU (graphics processing unit).

[0181] For example, the main control circuit board 610 of the main control module 60 can be electrically connected to the optical imaging module 30 via a module cable.

[0182] For example, the main control circuit board 610 can be stacked on the substrate surface of the module substrate 510 facing away from the device housing 10 (e.g., housing panel 110). The main control circuit board 610 has a clearance plate hole 630 to avoid the module housing 40. The main control module 60 can also include a microphone docking port 660 integrated into the main control circuit board 610. The module substrate 510 can also integrate a substrate plug-in interface 516 on the substrate surface facing away from the device housing 10 (e.g., housing panel 110). The main control module 60 can be electrically connected to the sound wave acquisition module 50 through the insertion of the microphone docking port 660 and the substrate plug-in interface 516. Furthermore, the insertion of the microphone docking port 660 and the substrate plug-in interface 516 can leave a gap between the main control circuit board 610 and the module substrate 510. This gap can prevent the main control circuit board 610 from interfering with the microphone 500 arranged on the substrate surface of the module substrate 510 facing away from the device housing 10 (e.g., housing panel 110).

[0183] Since the main control module 60 can be electrically connected to the optical imaging module 30 and the acoustic wave acquisition module 50 (i.e., module substrate 510), during the use of the electronic device to detect target objects, the main control module 60, which is electrically connected to the optical imaging module 30 and the acoustic wave acquisition module 50, can acquire the monitoring image of the target object acquired by the optical imaging module 30 and the surface acoustic wave of the target object acquired by the acoustic wave acquisition module 50.

[0184] In the embodiments of this application, the main control module 60 can also use the communication components of the electronic device to send the monitoring image and surface acoustic wave of the target object to the client or server, or the main control module 60 can also store the monitoring image and surface acoustic wave of the target object locally in the electronic device.

[0185] As an optional embodiment of this application, the communication component of the electronic device may include an antenna assembly 71. The antenna assembly 71 may be mounted on the device housing 10 (e.g., the periphery of the panel 120), and the antenna assembly 71 may be electrically connected to the main control module 60 to support the main control module 60 in transmitting monitoring images and surface acoustic waves of the target object to a client or server via wireless transmission. For example, the device housing 10 (e.g., the periphery of the panel 120) may also have an antenna mounting hole 121, in which the antenna assembly 71 may be mounted, and the antenna assembly 71 may be electrically connected to the main control module 60 via a flexible cable.

[0186] As another optional embodiment of this application, the communication component of the electronic device may include a cable connector 72. The cable connector 72 may be installed on the device housing 20 (e.g., the housing back plate 210), and the cable connector 72 is electrically connected to the main control module 60 to support the main control module 60 in transmitting monitoring images and surface acoustic waves of the target object to a client or server via wired transmission. For example, the device housing 20 (e.g., the housing back plate 210) may have a threaded mounting hole 217, the cable connector 72 may be installed in the threaded mounting hole 217, and the cable connector 72 may be electrically connected to the main control module 60 via a flexible cable.

[0187] As another optional embodiment of this application, the device housing 10 (e.g., the periphery of the panel 120) may also have a memory card slot 122, which can be used to accommodate non-volatile memory cards such as SD (Secure Digital Memory) cards. The memory card slot 122 may be equipped with a memory card bus interface for compatibility with non-volatile memory cards. Furthermore, the memory card bus interface in the memory card slot 122 is electrically connected to the main control module 60 to support the main control module 60 in storing the monitoring images and surface acoustic waves of the target object on the non-volatile memory card placed in the memory card slot 122 of the electronic device.

[0188] Therefore, the electronic device in this embodiment can also perform real-time online detection of the target object, thereby improving the real-time performance compared to manual inspection and enabling the client or server to promptly trigger alarms based on anomalies in the monitoring image and / or surface acoustic waves. Moreover, it is understood that although... Figures 1 to 3The electronic device shown includes an antenna assembly 71, a cable connector 72, and a memory card slot 122. However, this does not mean that the embodiments of this application are intended to limit the inclusion of these three components in the electronic device at the same time. That is, in the embodiments of this application, the electronic device may include at least one of the antenna assembly 71, the cable connector 72, and the memory card slot 122, rather than necessarily including the antenna assembly 71, the cable connector 72, and the memory card slot 122 at the same time.

[0189] In addition, in embodiments of this application, to enable the electronic device to have sealing characteristics suitable for outdoor environments:

[0190] The optical imaging module 30 can be encapsulated in the module housing 40, which seals and covers the imaging through-hole 113. Furthermore, the module housing 40 has a light-transmitting glass 400 that seals and blocks the lens assembly 300 at the imaging through-hole 113. In other words, the optical imaging module 30 can be sealed and installed in an electronic device.

[0191] The acoustic wave acquisition module 50 can be sealed and installed in electronic devices using a waterproof and acoustically permeable membrane 550 and a sealing film 520; and,

[0192] The device cover 20 is sealed to the device housing 10. For example, a housing sealing ring 91 is press-fitted between the periphery 120 of the panel of the device housing 10 and the periphery 220 of the back plate of the device cover 20. Furthermore, the screw passing through the second hole seat 230 can seal the second hole seat 230 by means of a washer fitted on the screw, and / or a sealing washer can be press-fitted between the first hole seat 130 and the second hole seat 230.

[0193] Additionally, considering the sealing characteristics of electronic devices:

[0194] If the electronic device also includes an antenna assembly 71, then the antenna assembly 71 can use an antenna sealing ring 97 and sealant to seal the antenna mounting through hole 121 installed in the device housing 10 (e.g., the periphery of the panel 120);

[0195] If the electronic device also includes a cable connector 72, the cable connector 72 can seal the threaded mounting hole 217 installed in the device housing cover 20 (e.g., housing back plate 210). Specifically, the cable connector 72 can further have a connector sleeve 720, and the connector sleeve 720 and the threaded mounting hole 217 can be sealed together with a sealant.

[0196] If the device housing 10 (e.g., panel perimeter 120) also has a memory card receiving slot 122, then the memory card bus interface in the memory card receiving slot 122 can be sealed in the memory card receiving slot 122 by means such as dispensing.

[0197] The sealing device of the acoustic wave acquisition module 50 in the electronic device using the waterproof and acoustically permeable membrane 550 and the sealing film 520 can be referred to in the aforementioned embodiments, and will not be repeated here. The sealing device of the optical imaging module 30 in the electronic device will be further described below with reference to the accompanying drawings.

[0198] Figure 10 For example Figure 7 An exploded view of the optical imaging module of the electronic device in the illustrated embodiment. Please refer to [link / reference]. Figure 10 And watch back at the same time Figures 7 to 9 In the embodiments of this application, the module housing 40 includes not only the light-transmitting glass 400, but also the housing body 410 and the housing cover 420. For example, the housing body 410 and the housing cover 420 can be made of the same metal material as the equipment housing 10, or the housing body 410 and the housing cover 420 can also be made of plastic material.

[0199] The main body of the silo 410 has a hollow structure. Figure 7 and Figure 8 In order to show the hollow structure of the main body 410, the cover plate 420 is omitted and the positional relationship between the optical imaging module 30 and the main body 410 is indicated by the reference numeral "30" with a dashed arrow. In addition, the main body 410 also has a first opening end facing the imaging through hole 113 (i.e. facing the housing panel 110) and a second opening end facing away from the imaging through hole 113 (i.e. facing away from the housing panel 110).

[0200] The optical imaging module 30 can be inserted into the housing body 410 from the second opening end of the housing body 410 with the lens field of view of the lens assembly 300 facing the first opening end of the housing body 410, and accommodated inside the housing body 410 in this position. For example, the optical imaging module 30 may also include a processing component 310 and an adapter bracket 350. The lens assembly 300 is assembled and connected to the processing component 310. That is, the lens assembly 300 may include an optical lens 300a and a lens base 300b that houses a visible light sensor. The lens base 300b can be assembled and connected to the processing component 310. The processing component 310 can be fixedly mounted on the adapter bracket 350. The adapter bracket 350 is fixedly mounted on the internal protrusion 415 inside the housing body 410.

[0201] The first opening of the main body 410 is sealed with a light-transmitting glass 400. The main body 410 can be fixedly installed on the equipment housing 10 (e.g., housing panel 110) with the first opening of the light-transmitting glass 400 facing the equipment housing 10 (e.g., housing panel 110). For example, the main body 410 can be fixedly installed on the equipment housing 10 (e.g., housing panel 110) with screws so that the first opening of the main body 410 with the light-transmitting glass 400 is in sealed contact with the equipment housing 10 (e.g., housing panel 110). Thus, the first opening of the main body 410 with the light-transmitting glass 400 can seal and cover the imaging through hole 113 opened in the equipment housing 10 (e.g., housing panel 110).

[0202] When the optical imaging module 30 is housed inside the housing body 410 with the lens field of view of the lens assembly 300 facing the first opening end of the housing body 410, the second opening end of the housing body 410 can be covered by the housing cover plate 420. For example, the housing cover plate 420 can be installed on the housing body 410 by screws.

[0203] Please see Figure 10 At the same time, pay special attention Figure 9 In the embodiments of this application, the housing body 410 may have a positioning cylinder 411, the lens assembly 300 extends into the positioning cylinder 411, and the first opening end of the housing body 410 sealed by the light-transmitting glass 400 may be located at the end of the positioning cylinder 411; correspondingly, the inner surface of the device housing 10 (e.g., housing panel 110) facing the device housing cover 20 (e.g., housing back plate 210) may have a positioning groove 111, and the imaging through hole 113 may be opened at the bottom of the positioning groove 111. Preferably, in the embodiments of this application, the bottom of the positioning groove 111 with the imaging through hole 113 may protrude from the outer surface of the device housing 10 (e.g., housing panel 110) away from the device housing cover 20 (e.g., housing back plate 210).

[0204] Therefore, based on the positioning fit between the positioning cylinder 411 and the positioning groove 111, the module housing 40, which encapsulates the optical imaging module 30, can be positioned and adjusted during the assembly process so that the light-transmitting glass 400 is aligned with the imaging through hole 113, and is installed in this position on the device housing 10 (e.g., housing panel 110).

[0205] Specifically, in the embodiments of this application, the end of the positioning cylinder 411 may have an axially protruding opening flange 412, the radial dimension of which is adapted to the radial dimension of the positioning groove 111. The opening flange 412 can be embedded in the positioning groove 111, and the light-transmitting glass 400 can be embedded in the opening flange 412. Furthermore, considering the sealing characteristics of electronic devices:

[0206] The transparent glass 400 can be sealed with the opening flange 412, for example, by applying adhesive to seal the transparent glass 400 and the opening flange 412.

[0207] The annular joint between the translucent glass 400 and the opening flange 412, forming a sealing fit, is covered and shielded by the bottom of the positioning groove 111; and,

[0208] The end of the positioning cylinder 411 also has a cylinder shoulder 413 located on the outer periphery of the opening flange 412. The radial dimension of the cylinder shoulder 413 is larger than the radial dimension of the positioning groove 111. The cylinder shoulder 413 is sealed to the equipment housing 10 on the outer periphery of the positioning groove 111 so that the end of the positioning cylinder 411 can seal and cover the imaging through hole 113 opened at the bottom of the positioning groove 111. For example, a through hole sealing ring 93 can be extruded between the cylinder shoulder 413 and the equipment housing 10 and surrounds the outer periphery of the positioning groove 111. In this case, the equipment housing 10 (e.g., housing panel 110) can also have a limiting ring groove 112 surrounding the outer periphery of the positioning groove 111, and the through hole sealing ring 93 is limited to the limiting ring groove 112.

[0209] In addition to ensuring the sealing characteristics of the device housing 10 at the imaging through hole 113, the module housing 40 can also ensure the inner layer sealing of the optical imaging module 30 in the housing cavity by sealing and encapsulating the optical imaging module 30. That is, the second opening end of the housing body 410 facing away from the imaging through hole 113 (i.e. facing away from the housing panel 110) can be sealed and covered by the housing cover plate 420. For example, the second opening end of the housing body 410 is equipped with a housing sealing ring 94 that is sealed and compressed by the housing cover plate 420.

[0210] In this case, in order to prevent the electrical connection between the optical imaging module 30 and the main control module 60 from damaging the sealing performance of the module housing 40 for the optical imaging module 30, the housing body 410 can also have a cable guide post 416 in the shell wall between the first opening end and the second opening end. The module cable of the optical imaging module 30 can pass through the cable guide post 416 to the outside of the module housing 40. The main control module 60 can be electrically connected to the optical imaging module 30 through the module cable. Furthermore, the cable guide post 416 is sealed and filled, that is, a cable guide sealing plug 460 that allows the module cable to pass through can be inserted into the cable guide post 416.

[0211] For example, the wire-passing sealing plug 460 may include a sealing plug body 461 that blocks the wire-passing cylinder 416, a limiting flange 462 protruding laterally from the sealing plug body 461, and a wire-passing slot 463 penetrating the sealing plug body 461. The limiting flange 462, through a limiting engagement with the inner wall of the wire-passing cylinder 416, can prevent the sealing plug body 461 from over-inserting into the housing body 410 within the wire-passing cylinder 416. Furthermore, the wire-passing slot 463 allows the module cable between the main control module 60 and the optical imaging module 30 to pass through and be tightly compressed by the sealing plug body 461. Preferably, the module cable may include a flat cable, such as an FPC (Flexible Printed Circuit), which is easily sealed and held in the wire slot 463. The wire-passing sealing plug 460 may be made of silicone.

[0212] More preferably, if the lens assembly 300 is assembled and connected to the processing assembly 310 and fixedly installed inside the housing body 410 via the adapter bracket 350, then the lens assembly 300 and the processing assembly 310 can also be sealed with adhesive.

[0213] Please review Figure 7 and Figure 8 In embodiments of this application, the electronic device may further include a light-emitting lamp group 80 for generating visual indicator light.

[0214] Figure 11 For example Figure 7 An exploded view of the light-emitting lamp assembly of the electronic device in the illustrated embodiment. Figure 12 for Figure 11 The image shows a cross-sectional view of the assembly structure of the light-emitting lamp assembly. Figure 12 To highlight the light-emitting lamp assembly 80, the optical imaging module 30 and the acoustic wave acquisition module 50 within the cavity formed by the assembly of the equipment housing 10 and the equipment housing cover 20 are omitted. Please refer to [link / reference]. Figure 11 and Figure 12 and simultaneously combined Figure 7 and Figure 8 The light-emitting lamp assembly 80 may include a lamp assembly driver board 810 and a light guide base 820.

[0215] The lamp driver board 810 has at least two light-emitting elements 800. For example, the light-emitting elements 800 may include electrically powered light-emitting components such as LEDs (Light-Emitting Diodes). Figure 12 The example uses three light-emitting lamps 800, but it is understood that the number of light-emitting lamps 800 is not limited to this.

[0216] The light guide base 820 can be an integrally molded part including PC (Polycarbonate). The light guide base 820 can include a base plate 821 and a base surrounding plate 822. The base surrounding plate 822 can enclose and surround the base plate 821 on the side facing the lamp drive plate 810 and form a lamp cavity for accommodating the light-emitting lamp body 800. The light guide base 820 can also include light guide columns 823 that protrude from the other side of the base plate 821 away from the lamp drive plate 810 and correspond one-to-one with the light-emitting lamp body 800.

[0217] In this case, the lamp drive board 810 can cover the lamp cavity formed by the base plate 822, and make each light-emitting lamp body 800 contained in the lamp cavity aligned and in contact with the corresponding light guide post 823, so that the light generated by any light-emitting lamp body 800 can be transmitted to the corresponding light guide post 823.

[0218] The device housing 10 (e.g., housing panel 110) may also have light-transmitting holes 118 corresponding to the light guide pillars 823. Each light guide pillar 823 can be inserted into the corresponding light-transmitting hole 118. Furthermore, the light guide base 820 seals and covers the light-transmitting holes 118 where each light guide pillar 823 is located. That is, the base plate 821 can be in sealed contact with the inner surface of the device housing 10 (e.g., housing panel 110) facing the device housing cover 20 (e.g., housing back plate 210). For example, a light group sealing ring 98 can be press-fitted between the base plate 821 and the inner surface of the device housing 10 (e.g., housing panel 110) facing the device housing cover 20 (e.g., housing back plate 210).

[0219] In the embodiments of this application, to prevent the light generated by the light-emitting lamp body 800 housed in the lamp cavity from being mistakenly conducted to other light guides besides its corresponding light guide 823:

[0220] The light-emitting lamp assembly 80 may also include a light-shielding medium 830 that forms a light-shielding barrier between every two adjacent light-emitting lamp bodies 800. The light-shielding medium 830 may include light-shielding foam, and the light-shielding medium 830 may be in the form of a sheath fitted over each light-emitting lamp body 800 and together with each light-emitting lamp body 800, it is housed in the lamp cavity formed by the base plate 822. That is, the light-shielding medium 830 is used to prevent light leakage within the lamp cavity formed by the base plate 822.

[0221] The connecting parts of the base plate 821 connected between each light guide post 823 can be staggered in a stepped manner in the protruding direction of the light guide post 823. For example, the staggered size Δh of the base plate 821 in the protruding direction of the light guide post 823 can be 1mm. That is, the stepped structure of the base plate 821 is used to reduce light leakage through the base plate 821.

[0222] Preferably, the PC material light guide base 820 may be doped with light-diffusing powder at a ratio of 0.3% so that the light guide post 823 inserted into each light-transmitting hole 118 can generate uniform light.

[0223] Furthermore, the mounting position of the light-emitting lamp assembly 80 on the device housing 10 (e.g., housing panel 110) can avoid obstructing the optical imaging module 30 and the acoustic wave acquisition module 50, from... Figure 10 and Figure 11 It can also be seen that the lamp drive board 810 may have a drive plug-in interface 860 for the backlight guide base 820, and the main control module 60 may have a lamp docking port (not shown in the figure) for plugging into the drive plug-in interface 860 to realize the electrical connection between the light-emitting lamp group 80 and the main control module 60.

[0224] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A waterproof sealing mechanism for a microphone, characterized in that, include: The equipment housing (10) has multiple sound-permeable holes (115). The module substrate (510) has a plurality of substrate pickup holes (515) corresponding to the positions of the plurality of sound-transmitting through holes (115). Multiple microphones (500) are provided, and the multiple microphones (500) cover the corresponding substrate pickup holes (515) on the substrate surface of the module substrate (510) facing away from the device housing (10) to form a sound transmission channel through the corresponding substrate pickup hole (515) between the microphone (500) and the corresponding sound transmission hole (115). A waterproof and sound-permeable membrane (550) is placed transversely in the sound transmission channel between the module substrate (510) and the device housing (10); A sealing film (520) is sealed and stacked together with the waterproof and sound-permeable membrane (550) between the module substrate (510) and the device housing (10). The sealing film (520) has multiple sound-permeable holes (525) that correspond to the positions of multiple sound-permeable through holes (115) and multiple sound-collecting holes (515) of the substrate and are penetrated by the sound transmission channel. in: The plurality of sound-permeable holes (115) are respectively opened at the bottom of the corresponding positioning grooves (114) on the inner surface of the device housing (10); The sealing film (520) has a film boss (526) that closes and surrounds each of the film sound-permeable holes (525), and each of the film bosses (526) extends into the corresponding positioning groove (114) and is positioned and engaged with the corresponding positioning groove (114), so that the sound transmission channel through the waterproof sound-permeable membrane (550) is sealed and surrounded by the hole wall of the film sound-permeable hole (525) between the substrate pickup hole (515) and the sound-permeable through hole (115); The sealing film (520) also has film ribs (522) that enclose the outer periphery of each of the film sound holes (525) and are located outside the positioning groove (114) to form a sealing partition between the device housing (10) and the module substrate (510) that encloses the outer periphery of the film sound holes (525) and is located outside the positioning groove (114).

2. The waterproof sealing mechanism for the microphone according to claim 1, characterized in that, The first opening end of the film sound-permeable hole (525) is sealed and connected with the sound-permeable through hole (115) on the inner surface of the device housing (10) facing the module substrate (510), and the second opening end of the film sound-permeable hole (525) is sealed and connected with the substrate pickup hole (515) on the substrate surface of the module substrate (510) facing the device housing (10). Furthermore, the waterproof sound-permeable membrane (550) is stacked between the first opening end of the film sound-permeable hole (525) and the sound-permeable through hole (115), or stacked between the second opening end of the film sound-permeable hole (525) and the substrate pickup hole (515). And / or, The film rib (522) is in sealed contact with at least one of the device housing (10) and the module substrate (510) outside the positioning groove (114) to form a sealing partition between the device housing (10) and the module substrate (510) that encloses the outer periphery of the film sound transmission hole (525) and is located outside the positioning groove (114). And / or, The size of the waterproof and sound-permeable membrane (550) is adapted to the radial dimension of the sound transmission channel, and the size of the sealing film (520) is adapted to the radial dimension of the module substrate (510).

3. The waterproof sealing mechanism for the microphone according to claim 1, characterized in that, The positioning fit ensures that the sound-transmitting hole (525) of the film is coaxially aligned with the sound-transmitting through hole (115).

4. The waterproof sealing mechanism for the microphone according to claim 1, characterized in that, The film boss (526) protrudes from the film surface of the sealing film (520) facing the device housing (10).

5. The waterproof sealing mechanism for the microphone according to claim 1, characterized in that, There are multiple waterproof and sound-permeable membranes (550), each of which is positioned in the corresponding positioning groove (114) and each of which seals the corresponding sound-permeable hole (115). The sealing film (520) respectively limits and presses the multiple waterproof and sound-permeable membranes (550) onto the bottom of the corresponding positioning groove (114).

6. The waterproof sealing mechanism for the microphone according to claim 1, characterized in that, The sealing film (520) has a recessed groove (529) on the film surface facing the module substrate (510) that is coaxially arranged with the film boss (526). The waterproof and sound-permeable membrane (550) is positioned in the recessed groove (529), which limits and presses the waterproof and sound-permeable membrane (550) onto the substrate surface of the module substrate (510) facing the device housing (10), and the waterproof and sound-permeable membrane (550) seals and covers the substrate pickup hole (515) on the substrate surface of the module substrate (510) facing the device housing (10).

7. The waterproof sealing mechanism for the microphone according to claim 1, characterized in that, The film ribs (522) are distributed on the film surface of the sealing film (520) facing the device housing (10), and the film ribs (522) are in sealing contact with the device housing (10) outside the positioning groove (114) to form a sealing partition that encloses the outer periphery of the waterproof and sound-permeable membrane (550) through sealing contact with the device housing (10); And / or, The film ribs (522) are distributed on the film surface of the sealing film (520) facing the module substrate (510), and the film ribs (522) are in sealing contact with the module substrate (510) outside the positioning groove (114) to form a sealing partition that encloses the outer periphery of the waterproof and sound-permeable membrane (550) through the sealing contact with the module substrate (510).

8. The waterproof sealing mechanism for the microphone according to claim 1, characterized in that, It also includes a perforated protective membrane (530), the membrane size of which is the same as that of the waterproof and sound-permeable membrane (550), the membrane strength of which is greater than that of the waterproof and sound-permeable membrane (550), and the perforated protective membrane (530) is stacked on at least one side surface of the waterproof and sound-permeable membrane (550). And / or, The radial dimension of the sound-permeable hole (115) is greater than the radial dimension of the substrate pickup hole (515), and the radial dimension of the film sound-permeable hole (525) is not less than the radial dimension of the sound-permeable hole (115). The opening of the sound-permeable hole (115) away from the waterproof sound-permeable membrane (550) is recessed relative to the outer surface of the device housing (10). The opening of the sound-permeable hole (115) away from the waterproof sound-permeable membrane (550) is connected to the outer surface of the device housing (10) through a conical wall opening (116). Furthermore, the radial dimension of the conical wall opening (116) increases monotonically in the direction from the sound-permeable hole (115) to the outer surface of the device housing (10).

9. The waterproof sealing mechanism for the microphone according to claim 1, characterized in that, The multiple microphones (500) and the multiple substrate pickup holes (515) are arranged in a multi-ring coplanar pattern on the module substrate (510); The number of the plurality of sound-transmitting through holes (115) and their coplanar distribution on the device housing (10) are the same as those of the plurality of microphones (500) and the plurality of substrate pickup holes (515); The number of the plurality of film sound transmission holes (525) and their coplanar distribution on the device housing (10) are the same as those of the plurality of microphones (500) and the plurality of substrate pickup holes (515); The size of the sealing film (520) is adapted to the size of the module substrate (510). The waterproof and sound-permeable membrane (550) of each sound-permeable hole (115) is limited and pressed by the sealing film (520). Furthermore, the sealing contact positions between the sealing film (520) and the device housing (10) are distributed on the outer periphery of each sound-permeable hole (115) sealed by the waterproof and sound-permeable membrane (550). The housing area of ​​the device housing (10) with the sound-permeable hole (115) is a flat plate, the module substrate (510) is a flat plate, the housing area and the module substrate (510) are stacked in parallel, and the module substrate (510) is fixed to the device housing (10) by a plurality of screws (590) arranged in a ring.

10. An electronic device, characterized in that, A waterproof sealing mechanism for a microphone as described in any one of claims 1 to 9.

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