Photosensitive module, camera module and assembly process thereof

The multi-layer heat dissipation component structure solves the problem of insufficient heat dissipation in the camera module, achieving efficient heat dissipation and freedom of the image sensor chip, which is suitable for the heat dissipation requirements of high-pixel camera modules.

CN116736611BActive Publication Date: 2026-05-29NINGBO SUNNY OPOTECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
NINGBO SUNNY OPOTECH CO LTD
Filing Date
2022-03-02
Publication Date
2026-05-29

AI Technical Summary

Technical Problem

With the trend towards high pixel count, large chip size, small size, and large aperture, current camera modules face the challenge of heat dissipation, especially due to insufficient heat dissipation performance of the circuit board. This makes it difficult to effectively dissipate heat from the chip, affecting the module's performance and reliability.

Method used

The system employs a multi-layer heat dissipation component structure, including a support, a heat dissipation fluid, and a heat dissipation component. The support connects the photosensitive component and the heat dissipation component. The heat dissipation fluid contacts the heat-generating area of ​​the photosensitive component and is guided to the heat dissipation component, thereby achieving rapid heat dissipation.

Benefits of technology

It effectively reduces the contact area of ​​metal heat sinks, improves heat dissipation efficiency, ensures the vertical movement freedom of the image sensor chip, does not affect the optical image stabilization function, and is suitable for the heat dissipation needs of high-pixel camera modules.

✦ Generated by Eureka AI based on patent content.

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    Figure CN116736611B_ABST
Patent Text Reader

Abstract

The application discloses a photosensitive module, a camera module and an assembling process. The photosensitive module comprises a photosensitive assembly and a heat dissipation assembly. The photosensitive assembly comprises a photosensitive chip and a circuit board assembly. The photosensitive chip is fixed to the circuit board assembly. The photosensitive assembly has a heating area. The heat dissipation assembly comprises a supporting piece, a heat dissipation fluid and a heat dissipation piece. The supporting piece is connected to the photosensitive assembly and the heat dissipation piece. A containing cavity is formed between the supporting piece and the heat dissipation piece. The heat dissipation fluid is contained in the containing cavity and contacts the lower surface of the heating area in the photosensitive assembly. Thus, the camera module has a compact structure. The heat generated during the working of the camera module is effectively and quickly led out through the multi-layer heat dissipation assembly structure, and the attaching area of the metal heat dissipation piece is reduced.
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