A rotating target material integrated binding method

Abstract

The application relates to a rotating target material integrated binding method, which comprises the following steps: sleeving at least one target pipe on an inner lining pipe to form a rotating target material, the target pipe and the inner lining pipe are provided with a matching gap, the outer peripheral wall of the inner lining pipe is processed with a spiral groove, the spiral groove is communicated with the matching gap, and at least one guide strip is embedded in the spiral groove. An indium storage device is fixed to the top of the rotating target material. The rotating target material is fixed in a vertical direction on a rack, an electromagnetic heating device is arranged around the outer peripheral wall of the rotating target material and is heated. The solder in the indium storage device is kept in a molten state, the solder flows into the rotating target material along the matching gap and the spiral groove. The guide strip moves along the spiral groove, the solder is guided to flow through the matching gap and the spiral groove, and the solder is cooled to integrate the target pipe and the inner lining pipe. The spiral groove can guide the solder to flow and then drive the solder to expand from the whole filling space, so that the solder flow efficiency and the welding reliability are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of target material binding, and in particular to a method for integrally binding a rotating target material. Background Art

[0002] The target material is the target material for high-speed energetic particle bombardment. In conventional target bonding techniques, an indium layer is formed on the outer surface of a tubular inner liner using ultrasonic indium coating. The target tubes are placed one by one outside the inner liner, creating a gap between the target and inner liner for solder filling. Solder is injected into the gap from top to bottom, and after the solder cools, the target and inner liner are bonded.

[0003] Chinese patent CN111020507A discloses a target material binding device, which includes a heating assembly, a base frame, a liner, a flip assembly and a clamping device. The heating assembly includes a heating base and a heating box. The heating box is vertically arranged on the heating base. The heating box is arranged at one end of the base frame. The liner is connected to the flip assembly. The flip assembly is installed on the base frame. The flip assembly can drive the liner to rotate between a first position and a second position. When the flip assembly is in the first position, the liner is arranged parallel to the base frame. When the flip assembly is in the second position, the liner is vertically arranged in the heating box. The outside of the liner is used to sleeve the target material. The liner and the target material are both installed on the clamping device. A filling cavity is formed between the liner, the clamping device and the target material. The bottom end of the filling cavity is provided with an injection port for injecting binding material.

[0004] However, the existing rotating target binding method uses a bottom injection method to inject indium, which not only has technical problems such as high driving pressure and complex structure required for indium injection, but also has technical problems such as low solder flow efficiency from bottom to top and limited height of the rotating target. Therefore, improvement is needed. Summary of the Invention

[0005] In order to overcome the problems existing in the related art, an embodiment of the present invention provides a method for integrally binding a rotating target.

[0006] According to a first aspect of an embodiment of the present invention, a method for integrally binding a rotating target is provided, the method comprising:

[0007] At least one target tube is sleeved on an inner liner tube to form a rotating target material, wherein a fitting gap is defined between the target tube and the inner liner tube, a spiral groove is machined on an outer peripheral wall of the inner liner tube, the spiral groove is connected to the fitting gap, and at least one guide bar is pre-embedded in the spiral groove;

[0008] Fixing an indium storage device to the top of the rotating target, wherein the accommodating cavity of the indium storage device is in communication with the fitting gap and the spiral groove, and one end of the guide bar passes through the indium storage device;

[0009] The rotating target is fixed to a frame in a vertical direction, and an electromagnetic heating device is arranged around the outer peripheral wall of the rotating target to heat the rotating target;

[0010] Keeping the solder in the indium storage device in a molten state, and allowing the solder to flow into the rotating target along the fitting gap and the spiral groove;

[0011] The guide bar is moved along the spiral groove to guide the solder to flow and fill the matching gap and the spiral groove. After the solder is cooled, the target tube and the liner tube are bound together.

[0012] In one embodiment, the step of sleeve-mounting at least one target tube in the liner tube to form a rotating target comprises the following steps:

[0013] Processing the outer surface of the inner liner tube to attach an indium layer;

[0014] A metal layer is attached to the inner wall of the target tube, and the thickness of the metal layer is 0.2 mm to 0.5 mm;

[0015] Roughening the metal layer;

[0016] The target tubes are sleeved on the inner liner tube one by one, and two adjacent target tubes are sealed by a sealing gasket.

[0017] In one embodiment, before the outer surface of the inner liner tube is processed to attach the indium layer, the outer surface of the inner liner tube is processed with the spiral groove, and the pitch of the spiral groove is 1 cm to 6 cm.

[0018] In one embodiment, the cross section of the spiral groove is in the shape of an inwardly concave trapezoid.

[0019] In one embodiment, moving the guide bar along the spiral groove includes:

[0020] One end of the guide bar at least partially passes through the rotary target;

[0021] The other end of the guide bar located at the bottom of the rotating target is wound and pulled until the entire guide bar is pulled out of the rotating target.

[0022] In one embodiment, the method further comprises:

[0023] The rotary target is rotated around an axis, wherein the rotation speed of the rotary target is less than or equal to 0.1 minutes per revolution.

[0024] In one embodiment, after the solder flows and fills the fitting gap and the spiral groove, the method further includes:

[0025] The cooling medium is guided to flow along the inner space of the liner pipe to perform heat exchange cooling.

[0026] In one embodiment, the cooling medium flows along a cooling assembly plugged into the rotating target, wherein the cooling assembly includes a cooling body and at least one cooling channel distributed in the cooling body, and a liquid cooling medium flows in the cooling channel.

[0027] In one embodiment, the indium storage device includes an indium storage container and a heating component surrounding the indium storage container. The accommodating cavity of the indium storage container is connected to the fitting gap and the spiral groove. The solder is located in the accommodating cavity, and the heating component heats to keep the solder temperature stable.

[0028] In one embodiment, the indium storage device further includes a pressurizing component, and the pressurizing component is used to increase the pressure of the solder in the accommodating cavity.

[0029] The technical solution provided by the embodiments of the present invention can include the following beneficial effects: the spiral groove and the fitting gap are connected, which can not only increase the filling space of the solder, but also guide the flow of solder and drive the solder to expand from the entire filling space, thereby improving the efficiency of solder circulation and the reliability of welding. Under the action of gravity, the solder flows and diffuses from top to bottom throughout the filling space, reducing the pressure required for solder circulation. The guide bar moves along the spiral groove, which can increase the guiding effect of the spiral groove on the solder, forming an internal guiding force for the solder circulation, further improving the balance of solder circulation and welding stability, and improving the integrated binding effect of the rotating target.

[0030] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0032] Figure 1 The present invention is a flow chart showing a method for integrally binding a rotating target according to an exemplary embodiment.

[0033] Figure 2 FIG. 4 is a flowchart illustrating a method for preparing a rotary target according to an exemplary embodiment.

[0034] Figure 3 It is a structural schematic diagram of a method for integrally binding a rotating target according to an exemplary embodiment.

[0035] Figure 4 It is a schematic cross-sectional structural diagram of a method for integrally binding a rotating target according to an exemplary embodiment.

[0036] Figure 5 is a schematic structural diagram of a rotating target according to an exemplary embodiment.

[0037] Figure 6 It is a schematic cross-sectional structural diagram of an indium storage device according to an exemplary embodiment.

[0038] Figure 7 yes Figure 4 Schematic diagram of the enlarged structure at point A in the middle.

[0039] In the figure, there are a rotating target material 10; a target tube 11; an inner liner tube 12; a spiral groove 121; a fitting gap 122; a sealing gasket 13; an indium storage device 20; an indium storage container 21; a chassis 211; an annular wall 212; an output port 213; a positioning ring 214; a heating component 22; a booster cover 23; a pneumatic mechanism 24; a sealing ring 25; a frame 30; a clamping arm 31; a positioning base 32; an electromagnetic heating device 40; a cooling component 50; a cooling channel 51; a cooling body 52; a rotating device 60; a winding device 70; a guide bar 80; and a solder 90. Implementation Method

[0040] Among them, the drawings are only used for illustrative purposes and represent only schematic diagrams rather than actual pictures, and should not be understood as limiting this patent; in order to better illustrate the embodiments of the present invention, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of the actual product; for those skilled in the art, it is understandable that some well-known structures and their descriptions in the drawings may be omitted.

[0041] The same or similar numbers in the drawings of the embodiments of the present invention correspond to the same or similar parts; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right", "inside", "outside" and the like indicate an orientation or position relationship based on the orientation or position relationship shown in the drawings, it is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, the terms describing the position relationship in the drawings are only used for illustrative purposes and cannot be understood as limiting this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0042] In the description of the present invention, unless otherwise expressly specified or limited, when the term "connection" or the like appears to indicate a connection relationship between components, such term should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be internal communication between two components or an interaction between two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood in specific circumstances.

[0043] like Figures 1 to 4As shown, the present invention provides a method for integrally binding a rotating target material, and the method for integrally binding a rotating target material comprises the following steps:

[0044] In step S101, at least one target tube 11 is sleeved on the inner liner tube 12 to form a rotating target material 10. The inner liner tube 12 is a metal tube structure. For example, the inner liner tube 12 is configured as a steel tube, a stainless steel tube or a tube of other materials. The target tube 11 is a tubular structure. The length of the target tube 11 is less than the length of the inner liner tube 12. The target tube 11 is a tubular structure made of sputtering material. Optionally, the target tube 11 can be configured as a silver target.

[0045] The inner diameter of the inner liner tube 12 is smaller than that of the target tube 11. There is a fitting gap 122 between the target tube 11 and the inner liner tube 12. The fitting gap 122 is used to flow in the solder 90. After the solder 90 cools, the target tube 11 and the inner liner tube 12 are bound together. Optionally, the target tube 11 can be provided as one or more tubes. One or more target tubes 11 are sleeved outside the inner liner tube 12, and a welding gap is provided between the end faces of two adjacent target tubes 11. Optionally, a protective film is attached to the end of the target tube 11. The protective film can prevent the ends of the target tube 11 from being affected by the solder 90 and prevent the solder 90 from infiltrating into the substance in the target tube 11. Optionally, the protective film is configured as a high-temperature resistant glue.

[0046] Furthermore, the outer wall of the inner liner tube 12 is machined with a spiral groove 121, which is connected to the fitting gap 122. At least one guide bar 80 is embedded in the spiral groove 121. The connection between the spiral groove 121 and the fitting gap 122 not only increases the filling space for the solder 90, but also guides the flow of the solder 90, thereby driving the solder 90 to expand from the entire filling space, improving the flow efficiency of the solder 90 and the reliability of the welding. The spiral groove 121 is spirally distributed on the outer surface of the inner liner tube 12, thereby forming a circumferential guide groove structure, which can guide the solder 90 to flow obliquely along the spiral line and spread to both sides.

[0047] In step S102, the indium storage device 20 is fixed to the top of the rotating target 10. The accommodating cavity of the indium storage device 20 is connected to the fitting gap 122 and the spiral groove 121, and one end of the guide bar 80 passes through the indium storage device 20. The indium storage device 20 is used to accommodate lead-free solder 90, such as an alloy composed of indium tin and copper. The solder 90 is used to weld and bind the liner tube 12 and the target tube 11. The indium storage device 20 is provided with an accommodating cavity. The indium storage device 20 is sleeved on one end of the liner tube 12. The accommodating cavity is provided with a cavity facing the fitting gap 122, so that the accommodating cavity is connected to the fitting gap 122 and the spiral groove 121 respectively. The solder 90 can enter the fitting gap 122 and the spiral groove 121 from the accommodating cavity.

[0048] In step S103, the rotating target 10 is vertically secured to the frame 30. An electromagnetic heating device 40 is positioned around the outer circumference of the rotating target 10 to heat the rotating target 10. The electromagnetic heating device 40 heats the solder 90 within the receiving cavity, molten in the cavity. The rotating target 10 stands vertically on the frame 30. The frame 30 is equipped with a clamping arm 31 for securing the rotating target 10 and a positioning base 32 for supporting the rotating target 10. This ensures that the gravity exerted on the solder 90 is aligned with the flow direction. The electromagnetic heating device 40 is spirally wound around the rotating target 10, thereby heating the entire rotating target 10 and maintaining smooth flow of the solder 90. Optionally, the electromagnetic heating device 40 is wound around the target tube 11 and spirally extends along the length of the rotating target 10, thereby heating the entire rotating target 10, forming an integrated heating layout with good heating balance. Optionally, the electromagnetic heating device 40 includes a magnetic induction wire and a power source connected to the magnetic induction wire. This device heats the rotating target 10 via electromagnetic induction, improving temperature reliability and heating flexibility across the heating area. The electromagnetic heating device 40 is spirally wound around the rotating target 10, providing uniform heating throughout the entire target 10 and ensuring smooth flow of solder 90.

[0049] In step S104, the solder 90 in the indium storage device 20 is maintained in a molten state and flows into the rotating target 10 along the fitting gap 122 and the spiral groove 121. The molten solder 90 is injected into the spiral groove 121 and the fitting gap 122, thereby covering the entire rotating target 10 from top to bottom. The solder 90 flows and diffuses from top to bottom under the action of gravity throughout the filler space, reducing the pressure required for the solder 90 to flow.

[0050] In step S105, the guide bar 80 is moved along the spiral groove 121 to guide the solder 90 to flow through the matching gap 122 and the spiral groove 121. After the solder 90 cools, the target tube 11 and the liner tube 12 are integrally bonded. The movement of the guide bar 80 along the spiral groove 121 can enhance the guiding effect of the spiral groove 121 on the solder 90, forming an internal guiding force for the flow of the solder 90, further improving the balance of the solder 90 flow and the welding stability, and enhancing the integral bonding effect of the rotating target 10.

[0051] In this embodiment, the guide bar 80 moves along the spiral groove 121. During the movement of the spiral groove 121, a driving force is generated between the guide bar 80 and the spiral groove 121, which promotes the flow of the solder 90. Optionally, the cross-sectional dimensions of the guide bar 80 are smaller than the cross-sectional dimensions of the spiral groove 121. Optionally, the guide bar 80 can be configured as a metal wire to provide good toughness, heat retention resistance, and winding performance.

[0052] like Figures 4 to 7As shown, in the above step S101, the target tube 11 and the liner tube 12 need to be pre-treated and processed, wherein step S101 further includes the following steps:

[0053] Step S201: Processing the outer surface of the inner liner tube 12 to attach an indium layer. Ultrasonic superindium processing is used to process the indium layer on the surface of the inner liner tube 12, so that the indium layer adheres to the surface of the stainless steel tube or carbon steel tube. This not only facilitates a high welding rate when binding the target tube 11, but also facilitates the recovery of the rotating target material 10 after sputtering, facilitating post-processing. Prior to processing the outer surface of the inner liner tube 12 to attach the indium layer, a spiral groove 121 is machined on the outer surface of the inner liner tube 12. The pitch of the spiral groove 121 is 1 cm to 6 cm. Optionally, the pitch of the spiral groove 121 can be configured to be 1 cm, 1.5 cm, 2 cm, 3 cm, 3.5 cm, 4 cm, 5 cm, or 6 cm. For example, a spiral groove 121 with an M133*2 shape is machined on the outer wall of the inner liner tube 12. The spiral groove 121 is used to increase the flow rate of the solder 90 and also enhance the weld strength between the inner liner tube 12 and the target tube 11. The spiral groove 121 can be configured as a triangular groove, a rectangular groove, a dovetail groove with an inwardly concave structure, or a trapezoidal groove. Preferably, the cross-section of the spiral groove 121 is a concave trapezoid. When the solder 90 solidifies, it forms a trapezoidal tension fit with the spiral groove 121, thereby increasing the axial and radial welding force of the target tube 11.

[0054] In step S202, a metal layer is attached to the inner surface of the target tube 11. The thickness of the metal layer is 0.2 mm to 0.5 mm. This metal layer is added to the inner surface of the target tube 11 to prevent direct contact between the target tube 11 and the solder 90. Furthermore, the metal layer strengthens the connection between the target tube 11 and the solder 90. Optionally, the metal layer can be configured as a nickel layer, a tin layer, or a copper layer, preferably a copper layer, as copper provides excellent performance and reliability in bonding with the target tube 11, as well as ease of processing.

[0055] Step S203: Roughening the metal layer. The surface of the metal layer facing the inner liner tube 12 is roughened to increase its roughness. For example, setting the roughness of the metal layer to 3.5, 6.3, etc. can increase the soldering efficiency of the solder 90. Preferably, a protective layer is applied to the outer surface of the target tube 11 to keep it clean and prevent corrosion from the solder 90.

[0056] In step S204, the target tubes 11 are placed one by one on the inner liner tube 12, and two adjacent target tubes 11 are sealed with a sealing gasket 13. A sealing gasket 13 is set between the two adjacent target tubes 11 to prevent the solder 90 from flowing out of the gap between the end faces of the two target tubes 11. In addition, a gap is required between the two adjacent target tubes 11, and the width of the gap can be configured to be between 0.1mm and 0.4mm. Among them, the more reasonable the gap and the less impurities, the less technical problems such as arcing and nodules in the target tube 11. Optionally, the thickness of the sealing gasket 13 is configured to be 0.1mm-0.4mm and is removed after the target tubes 11 are welded and bound to maintain a balanced gap width.

[0057] Preferably, the sealing gasket 13 is made of a polymer material with an I-shaped structure, wherein the sealing gasket 13 can clamp and define the end faces of two adjacent target tubes 11 while maintaining a uniform spacing. After binding, the polymer material is cleaned with a hook knife to keep the gap clean.

[0058] In step S105, the guide bar 80 is moved along the spiral groove 121 to accelerate the flow of the guide solder 90. The movement of the guide bar 80 includes the following steps:

[0059] In step S301, one end of the guide bar 80 at least partially extends beyond the rotating target 10. In this step, the guide bar 80 extends beyond the rotating target 10 to guide the flow of the solder 90 over a relatively long range. For example, the guide bar 80 may be configured as a copper wire loop positioned above the rotating target 10, with one end extending along the spiral groove 121 and passing through the inner liner 12.

[0060] In step S302, the other end of the guide bar 80 located at the bottom of the rotating target 10 is wound and pulled until the entire guide bar 80 is pulled out of the rotating target 10. The other end of the guide bar 80 passes through the bottom of the rotating target 10. By pulling the guide bar 80, the guide bar 80 moves relative to the spiral groove 121. Accordingly, during the movement of the guide bar 80, the solder 90 is driven to move along the spiral groove 121. Combined with the gravity and the guiding force on the solder 90, the solder 90 is able to fill the spiral groove 121 and the fitting gap 122.

[0061] Optionally, the winding device 70 is used to wind the connected guide bar 80 so as to remove the guide bar 80 from the rotating target 10. The winding device 70 includes a winding power mechanism mounted on the frame 30 and a winding disk connected to the winding power mechanism. The winding disk is provided with a clamping head for clamping and fixing one end of the guide bar 80. The winding power mechanism drives the winding disk to rotate so that the guide bar 80 is wound around the winding disk.

[0062] like Figures 4 to 7As shown, in one embodiment, the method for integrally binding the rotating target 10 further includes the following steps: rotating the rotating target 10 about an axis, wherein the rotation speed of the rotating target 10 is less than or equal to 0.1 min / rev. For example, the rotation speed can be configured to be 0.1 min / rev, 0.2 min / rev, 0.5 min / rev, 0.8 min / rev, 1 min / rev, 1.5 min / rev, 3 min / rev, or 5 min / rev. This step can be performed simultaneously with step S105 or step S104 to accelerate the flow efficiency of the solder 90.

[0063] A rotating device 60 is installed at the bottom of the frame 30 , and the rotating device 60 is drivingly connected to the rotating target 10 to drive the rotating target 10 to rotate smoothly at a preset speed, thereby accelerating the flow of the solder 90 and improving the diffusion efficiency of the solder 90 .

[0064] Optionally, the rotating device 60 includes a rotating motor mounted on the frame 30, a driving member mounted on the output shaft of the rotating motor, and a driven member mounted on the rotating target 10. The driving member and the driven member are drivingly connected to each other so that the rotating motor can drive the rotating target 10 to rotate. Optionally, the driving member and the driven member are configured as a gear mechanism meshing transmission. Optionally, the driving member and the driven member are configured as a pulley transmission or a sprocket transmission.

[0065] In one embodiment, the indium storage device 20 includes an indium storage container 21 and a heating assembly 22 surrounding the indium storage container 21. The heating assembly 22 is used to heat the indium alloy material within the indium storage container 21. The indium storage container 21 is sleeved within the inner liner tube 12. The indium storage container 21 defines a receiving cavity that communicates with the mating gap 122 and the spiral groove 121. The solder 90 is located within the receiving cavity. The heating assembly 22 heats the solder 90 to maintain a stable temperature, thereby keeping the solder 90 in a molten state.

[0066] Optionally, the indium storage container 21 includes a chassis 211, an annular wall 212 disposed around the chassis 211, and a positioning ring 214, wherein the positioning ring 214 and the annular wall 212 are respectively located on both sides of the chassis 211. The height of the annular wall 212 is greater than the height of the positioning ring 214, and the major diameter of the annular wall 212 is greater than the outer diameter of the positioning ring 214. A groove-shaped accommodating cavity is formed between the annular wall 212 and the chassis 211. The output port 213 is disposed in the central region of the chassis 211, and the inner liner tube 12 is inserted into the accommodating cavity through the output port 213. The gap between the output port 213 and the inner liner tube 12 corresponds to the fitting gap 122, so that the solder 90 can be injected into the fitting gap 122. Preferably, the output port 213 is chamfered or conically concavely inclined toward the fitting gap 122 to form a funnel-shaped diversion structure to guide the solder 90 into the fitting gap 122 and the spiral groove 121.

[0067] The positioning ring 214 is an annular rib structure that is used to locate the outer circumference of the target tube 11. The inner diameter of the positioning ring 214 is greater than or equal to the outer circumference of the target tube 11, thereby aligning the output port 213 with the fitting gap 122. Preferably, the centerline of the positioning ring 214 coincides with the centerline of the output port 213 to achieve center positioning. Furthermore, a sealing ring 25 is installed within the positioning ring 214, which elastically seals the fitting gap 122 between the target tube 11 and the positioning ring 214. Optionally, the sealing ring 25 is configured as a tubular seal made of a high-temperature resistant rubber material.

[0068] In a preferred embodiment, the indium storage device 20 further includes a pressurizing assembly, which is used to increase the pressure of the solder 90 within the accommodating chamber. The pressurizing assembly includes a pressurizing cover 23 disposed on the indium storage container 21 and a pneumatic mechanism 24 connected to the pressurizing cover 23. The pressurizing cover 23 is disposed on the indium storage container 21 to form a sealed chamber. The pneumatic mechanism 24 delivers gas into the sealed chamber to create a pressurized flow that propels the solder 90, thereby accelerating the solder 90 to fill the spiral groove 121 and the fitting gap 122. Optionally, the pneumatic mechanism 24 delivers an inert gas into the sealed chamber to prevent oxidation of the solder 90.

[0069] like Figures 4 to 7 As shown, after the solder 90 has flowed through the mating gap 122 and the spiral groove 121 in step S105, the solder 90 needs to be cooled to integrally bond the liner tube 12 and the target tube 11. The method for integrally bonding the rotating target 10 further includes directing a cooling medium to flow through the interior of the liner tube 12 for heat exchange cooling. The cooling medium absorbs heat from the rotating target 10 and removes it during its circulation, thereby evenly reducing the temperature of the rotating target 10 and improving cooling efficiency, allowing the solder 90 to securely bond the target tube 11 and the liner tube 12.

[0070] In one embodiment, a cooling medium flows along a cooling assembly 50 that is plugged into and assembled on the rotating target 10. The cooling assembly 50 includes a cooling body 52 and at least one cooling channel 51 distributed within the cooling body 52. ​​A liquid cooling medium flows through the cooling channel 51. The cooling assembly 50 improves the cooling efficiency of the rotating target 10 and controls the temperature of each area of ​​the rotating target 10 to be uniform through a stable cooling effect, thereby reducing the internal pressure. The cooling assembly 50 is inserted into the inner liner 12 and is located at the center of the inner liner 12. The outer surface of the cooling assembly 50 is in contact with or smaller than the inner liner 12 to cool the rotating target 10 from the inside out. The cooling medium can be configured as a heat exchange fluid such as water, coolant, or cooling oil. The excess heat is removed during the cooling medium flow process, and the overall temperature of the rotating target 10 is further maintained balanced.

[0071] In one embodiment, the cooling channel 51 includes an input port, an output port, and a cooling portion connecting the input and output ports. The cooling portion is configured as a curved cooling channel 51 structure that bends back and forth or expands the heat dissipation area. The input port and the output port are used for the input and output of fluid media, respectively. The cooling portion is configured as a curved cooling channel 51 to guide and increase the cooling area.

[0072] Optionally, the cooling part is a U-shaped cooling channel 51 with at least two reciprocating bends, or the cooling part is a multi-channel U-shaped cooling channel 51 with continuous bends. The overall flow path is long, the capacity of the circulating and stored cooling medium is large, the thermal specific heat capacity is improved, and the cooling balance is high.

[0073] Optionally, the cooling portion is a spiral cooling channel 51, which spirals upward along the cooling body 52. ​​The spiral size of the spiral cooling channel 51 is controllable and is evenly distributed on the surface of the cooling body 52, so that the heat dissipation is balanced.

[0074] Optionally, the cooling section comprises multiple branch cooling channels 51, each converging at one end to the input and output ports. Branch cooling channels 51 are multiple parallel cooling channels 51 distributed throughout the cooling body 52, converging at their respective ends. Having the cooling medium flow through each branch and converge at a single point enhances layout flexibility.

[0075] In an optional embodiment, the end of the liner tube 12 is fixedly connected to the cooling body 52, and the cooling assembly 50 is pre-installed on the rotating target 10. In another optional embodiment, the liner tube 12 and the cooling assembly 50 are rotatably connected so that the cooling assembly 50 can be movably inserted into the rotating target 10.

[0076] Other embodiments of the present invention will readily occur to those skilled in the art after considering the specification and practicing the disclosure herein. This application is intended to cover any variations, uses, or adaptations of the present invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the invention being indicated by the following claims.

[0077] It should be understood that the present invention is not limited to the exact construction described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.

Claims

1. A method for integrally binding a rotating target, characterized in that: The method for integrally binding the rotating target comprises: At least one target tube is sleeved on an inner liner tube to form a rotating target material, wherein a fitting gap is defined between the target tube and the inner liner tube, a spiral groove is machined on an outer peripheral wall of the inner liner tube, the spiral groove is connected to the fitting gap, and at least one guide bar is pre-embedded in the spiral groove; Fixing an indium storage device to the top of the rotating target, wherein the accommodating cavity of the indium storage device is in communication with the fitting gap and the spiral groove, and one end of the guide bar passes through the indium storage device; The rotating target is fixed to a frame in a vertical direction, and an electromagnetic heating device is arranged around the outer peripheral wall of the rotating target to heat the rotating target; Keeping the solder in the indium storage device in a molten state, and allowing the solder to flow into the rotating target along the fitting gap and the spiral groove; The guide bar is moved along the spiral groove to guide the solder to flow and fill the matching gap and the spiral groove. After the solder is cooled, the target tube and the liner tube are bound together.

2. The method for integrally binding a rotating target according to claim 1, characterized in that: The method of sleeve-arranging at least one target tube into the liner tube to form a rotating target material comprises the following steps: Processing the outer surface of the inner liner tube to attach an indium layer; A metal layer is attached to the inner wall of the target tube, and the thickness of the metal layer is 0.2 mm to 0.5 mm; Roughening the metal layer; The target tubes are sleeved on the inner liner tube one by one, and two adjacent target tubes are sealed by a sealing gasket.

3. The method for integrally binding a rotating target according to claim 2, wherein: Before the outer surface of the inner liner tube is processed to attach the indium layer, the outer surface of the inner liner tube is processed with the spiral groove, and the pitch of the spiral groove is 1 cm to 6 cm.

4. The method for integrally binding a rotating target according to claim 3, characterized in that: The cross section of the spiral groove is in the shape of an inwardly concave trapezoid.

5. The method for integrally binding a rotating target according to claim 3, characterized in that: The step of moving the guide bar along the spiral groove comprises: One end of the guide bar at least partially passes through the rotary target; The other end of the guide bar located at the bottom of the rotating target is wound and pulled until the entire guide bar is pulled out of the rotating target.

6. The method for integrally binding a rotating target according to claim 1, characterized in that: The method also includes: The rotary target is rotated around an axis, wherein the rotation speed of the rotary target is less than or equal to 0.1 minutes per revolution.

7. The method for integrally binding a rotating target according to claim 1, characterized in that: After the solder flows and fills the fitting gap and the spiral groove, the method further includes: The cooling medium is guided to flow along the inner space of the liner pipe to perform heat exchange cooling.

8. The method for integrally binding a rotating target according to claim 7, characterized in that: The cooling medium flows along a cooling assembly plugged into the rotating target. The cooling assembly includes a cooling body and at least one cooling channel distributed in the cooling body. Liquid cooling medium flows in the cooling channel.

9. The method for integrally binding a rotating target according to claim 1, characterized in that: The indium storage device includes an indium storage container and a heating component surrounding the indium storage container. The accommodating cavity of the indium storage container is connected to the fitting gap and the spiral groove. The solder is located in the accommodating cavity. The heating component heats to keep the solder temperature stable.

10. The method for integrally binding a rotating target according to claim 9, characterized in that: The indium storage device further includes a pressurizing component, which is used to increase the pressure of the solder in the accommodating cavity.

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