A transfer stamp, transfer device and method

Abstract

The embodiment of the present application provides a transfer stamp, a transfer device and a method, wherein the transfer stamp comprises a stamp head for adsorbing a light-emitting device, the stamp head comprises an adsorption surface, the adsorption surface comprises a first edge, the first edge is provided with at least one first protruding part and / or first recessed part, the first protruding part or the first recessed part is concave-convex in a first direction and is arranged in a second direction, the first direction is parallel to a plane where the stamp head is located, and the second direction is perpendicular to the first direction and parallel to the plane where the stamp head is located. The present application is used to solve the problem of display brightness difference caused by the existing transfer stamp when transferring a Micro-LED lamp bead.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of Micro-LED transfer, and particularly relates to a transfer stamp, a transfer device and a transfer method. BACKGROUND

[0002] Micro-LED (Micro Light Emitting Diode Display) has the advantages of high definition, thinness, and energy saving. In the production process of Micro-LED, a transfer stamp is used to transfer a large number of Micro-LED lamp beads to a circuit substrate, so that the driving circuit on the circuit substrate is electrically connected to the corresponding Micro-LED lamp bead.

[0003] Due to the limitation of production conditions, when the transfer stamp is used multiple times to transfer a large number of Micro-LED lamp beads, the display brightness difference between different areas of the display panel is caused. SUMMARY

[0004] Therefore, the embodiments of the present application provide a transfer stamp, a transfer device and a transfer method to solve the problem of display brightness difference caused by the existing transfer stamp when transferring Micro-LED lamp beads.

[0005] In a first aspect, the embodiments of the present application provide a transfer stamp, which comprises a stamp head for adsorbing light emitting devices, and the stamp head comprises an adsorption surface, the adsorption surface comprises a first edge, and the first edge is provided with at least one first protruding part and / or first recessed part, the first protruding part or the first recessed part changes in concave-convex along a first direction and is arranged along a second direction, the first direction is parallel to the plane where the stamp head is located, and the second direction is perpendicular to the first direction and parallel to the plane where the stamp head is located.

[0006] In a second aspect, the embodiments of the present application provide a transfer device, which comprises the transfer stamp of the first aspect.

[0007] In a third aspect, the embodiments of the present application provide a transfer method based on the transfer stamp of the first aspect, which comprises: adsorbing a plurality of light emitting devices on the adsorption surface by using the transfer stamp; moving the transfer stamp to a target area of a target substrate, and releasing the plurality of light emitting devices to make the light emitting devices arranged in the target area of the target substrate; repeating the above steps until the arrangement mode of the light emitting devices on the target substrate meets a preset condition; wherein, the moving of the transfer stamp to the target area of the target substrate twice comprises: moving the transfer stamp to a first target area of the target substrate once, and moving the transfer stamp to a second target area of the target substrate once; the first target area is adjacent to and embedded in the second target area.

[0008] The inventor found that the difference in display brightness of the plurality of lamp beads in the display panel is particularly obvious near the edge of the contact area between the transfer stamp and the circuit substrate, that is, in the process of transferring the Mirco-LED lamp beads to the circuit substrate, the Micro-LED located at the edge of the adsorption surface of the transfer stamp has a larger difference in display brightness after being transferred to the circuit substrate than the Micro-LED at other positions. This non-linear structure can make the Micro-LED arranged along the first edge in the first and second times of transferring the Micro-LED using the transfer stamp be located on a straight line with the Micro-LED away from the first edge after being transferred to the circuit substrate. Then the Micro-LED arranged along the first edge after being transferred to the circuit substrate can be more dispersed, and the Micro-LED arranged along the first edge and the Micro-LED away from the first edge after being transferred to the circuit substrate are adjacent, thereby solving the problem of poor display uniformity in the Mirco-LED display panel in the prior art. BRIEF DESCRIPTION OF DRAWINGS

[0009] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiments will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0010] Figure 1 A structure diagram of a transfer stamp provided by the embodiments of the present application;

[0011] Figure 2 An adsorption surface of a transfer stamp provided by the embodiments of the present application;

[0012] Figure 3 A splicing diagram of the adsorption surface in Figure 2

[0013] Figure 4 An adsorption surface of a transfer stamp provided by the embodiments of the present application;

[0014] Figure 5 A splicing diagram of the adsorption surface in Figure 4

[0015] Figure 6 An adsorption surface of a transfer stamp provided by the embodiments of the present application;

[0016] Figure 7 A splicing diagram of the adsorption surface in Figure 6

[0017] Figure 8 ​​​An adsorbing surface of a transfer stamp provided by an embodiment of the present application;

[0018] Figure 9 An adsorbing surface of a transfer stamp provided by an embodiment of the present application; Figure 8 An adsorbing surface of a transfer stamp provided by an embodiment of the present application;

[0019] Figure 10 An adsorbing surface of a transfer stamp provided by an embodiment of the present application;

[0020] Figure 11 An adsorbing surface of a transfer stamp provided by an embodiment of the present application; Figure 10 An adsorbing surface of a transfer stamp provided by an embodiment of the present application;

[0021] Figure 12 An adsorbing surface of a transfer stamp provided by an embodiment of the present application;

[0022] Figure 13 An adsorbing surface of a transfer stamp provided by an embodiment of the present application; Figure 12 An adsorbing surface of a transfer stamp provided by an embodiment of the present application;

[0023] Figure 14 An adsorbing surface of a transfer stamp provided by an embodiment of the present application;

[0024] Figure 15 An adsorbing surface of a transfer stamp provided by an embodiment of the present application; Figure 14 An adsorbing surface of a transfer stamp provided by an embodiment of the present application;

[0025] Figure 16 An adsorbing surface of a transfer stamp provided by an embodiment of the present application;

[0026] Figure 17 An adsorbing surface of a transfer stamp provided by an embodiment of the present application; Figure 16 An adsorbing surface of a transfer stamp provided by an embodiment of the present application;

[0027] Figure 18 An adsorbing surface of a transfer stamp provided by an embodiment of the present application;

[0028] Figure 19 An adsorbing surface of a transfer stamp provided by an embodiment of the present application; Figure 18 An adsorbing surface of a transfer stamp provided by an embodiment of the present application;

[0029] Figure 20 An adsorbing surface of a transfer stamp provided by an embodiment of the present application;

[0030] Figure 21 An adsorbing surface of a transfer stamp provided by an embodiment of the present application; Figure 20 An adsorbing surface of a transfer stamp provided by an embodiment of the present application;

[0031] Figure 22 An adsorbing surface of a transfer stamp provided by an embodiment of the present application;

[0032] Figure 23 An adsorbing surface of a transfer stamp provided by an embodiment of the present application; Figure 22 An adsorbing surface of a transfer stamp provided by an embodiment of the present application;

[0033] Figure 24An adsorbing surface of a transfer stamp provided by an embodiment of the present application;

[0034] Figure 25 An adsorbing surface of a transfer stamp provided by an embodiment of the present application; Figure 24 A splicing schematic diagram of the stamp in

[0035] Figure 20 to Figure 25 An adsorbing surface of a transfer stamp provided by an embodiment of the present application;

[0036] Figure 20 An adsorbing surface of a transfer stamp provided by an embodiment of the present application; Figure 21 A splicing schematic diagram of the adsorbing surface in

[0037] Figure 22 An adsorbing surface of a transfer stamp provided by an embodiment of the present application;

[0038] Figure 23 An adsorbing surface of a transfer stamp provided by an embodiment of the present application; Figure 24 A splicing schematic diagram of the adsorbing surface in

[0039] Figure 25 An adsorbing surface of a transfer stamp provided by an embodiment of the present application;

[0040] Figure 26 An adsorbing surface of a transfer stamp provided by an embodiment of the present application; Figure 27 A splicing schematic diagram of the adsorbing surface in

[0041] Figure 26 An adsorbing surface of a transfer stamp provided by an embodiment of the present application;

[0042] Figure 26 An adsorbing surface of a transfer stamp provided by an embodiment of the present application; Figure 28 A splicing schematic diagram of the adsorbing surface in

[0043] Figure 29 An adsorbing surface of a transfer stamp provided by an embodiment of the present application;

[0044] Figure 28 An adsorbing surface of a transfer stamp provided by an embodiment of the present application; Figure 30 A splicing schematic diagram of the adsorbing surface in

[0045] Figure 31 An adsorbing surface of a transfer stamp provided by an embodiment of the present application;

[0046] Figure 30 An adsorbing surface of a transfer stamp provided by an embodiment of the present application; Figure 32 A splicing schematic diagram of the adsorbing surface in

[0047] Figure 33 An adsorbing surface of a transfer stamp provided by an embodiment of the present application;

[0048] Figure 32 An adsorbing surface of a transfer stamp provided by an embodiment of the present application; Figure 28 A splicing schematic diagram of the adsorbing surface in

[0049] Figure 30An adsorption surface of a transfer stamp provided in an embodiment of this application;

[0050] Figure 32 for Figure 28 A schematic diagram of the assembly of the adsorption surfaces in the image;

[0051] Figure 30 An adsorption surface of a transfer stamp provided in an embodiment of this application;

[0052] Figure 34 for Figure 35 A schematic diagram of the assembly of the adsorption surfaces in the image;

[0053] Figure 34 An adsorption surface of a transfer stamp provided in an embodiment of this application;

[0054] Figure 34 for Figure 34 A diagram illustrating the assembly of the seals in the image;

[0055] Figure 8 An adsorption surface of a transfer stamp provided in an embodiment of this application;

[0056] Figure 36 for Figure 37 A schematic diagram of the assembly of the adsorption surfaces in the image;

[0057] Figure 36 An adsorption surface of a transfer stamp provided in an embodiment of this application;

[0058] Figure 36 for Figure 38 A schematic diagram of the assembly of the adsorption surfaces in the image;

[0059] Figure 39 An adsorption surface of a transfer stamp provided in an embodiment of this application;

[0060] Figure 38 for Figure 2 to Figure 39 A schematic diagram of the assembly of the adsorption surfaces in the image;

[0061] Figure 38 to Figure 61 An adsorption surface of a transfer stamp provided in an embodiment of this application;

[0062] Figure 40 to Figure 51 for Figure 40 A schematic diagram of the assembly of the adsorption surfaces in the image;

[0063] Figure 41 An adsorption surface of a transfer stamp provided in an embodiment of this application;

[0064] Figure 42 for Figure 43 A schematic diagram of the assembly of the adsorption surfaces in the image;

[0065] Figure 44An adsorption surface of a transfer stamp provided in an embodiment of this application;

[0066] Figure 46 for Figure 48 A schematic diagram of the assembly of the adsorption surfaces in the image;

[0067] Figure 44 An adsorption surface of a transfer stamp provided in an embodiment of this application;

[0068] Figure 46 for Figure 48 A schematic diagram of the assembly of the adsorption surfaces in the image;

[0069] Figure 50 An adsorption surface of a transfer stamp provided in an embodiment of this application;

[0070] Figure 38 for Figure 52 to Figure 61 A schematic diagram of the assembly of the adsorption surfaces in the image;

[0071] Figure 38 An adsorption surface of a transfer stamp provided in an embodiment of this application;

[0072] Figure 52 for Figure 58 A schematic diagram of the assembly of the adsorption surfaces in the image;

[0073] Figure 60 An adsorption surface of a transfer stamp provided in an embodiment of this application;

[0074] Figure 52 for Figure 58 A diagram illustrating the assembly of the seals in the image.

[0075] Label Explanation

[0076] 001, Transfer stamp; 100, Adsorption surface; 110, First edge; 111, First protrusion; 111a, First sub-protrusion; 111b, Second sub-protrusion; 112, First recess; 112a, First sub-recess; 112b, Second sub-recess; 120, Second edge; 121, Second protrusion; 122, Second recess; 130, Third edge; 131, Third protrusion; 132, Third recess. Detailed Implementation

[0077] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0078] It should be understood that the described embodiments are merely some, not all, of the embodiments in this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0079] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0080] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0081] In the description of this specification, it should be understood that the terms "substantially", "approximately", "about", "about", "generally", "largely" used in the claims and embodiments of this application refer to values ​​that can be generally agreed upon within a reasonable range of process operations or tolerances, rather than a precise value.

[0082] It should be understood that although terms such as first, second, third, etc., may be used to describe regions in the embodiments of this application, these regions should not be limited to these terms. These terms are only used to distinguish regions from each other. For example, without departing from the scope of the embodiments of this application, a first region may also be referred to as a second region, and similarly, a second region may also be referred to as a first region.

[0083] Through meticulous and in-depth research, the applicant in this case has provided a solution to the problems existing in the prior art.

[0084] Figure 60 A schematic diagram of the structure of a transfer seal provided for the implementation of this application; Figure 62 to Figure 65 An adsorption surface of a transfer stamp provided in an embodiment of this application; Figure 62 for Figure 64 A schematic diagram of the splicing of the adsorption surfaces in the image.

[0085] Please see ​ and ​The embodiment of the present application provides a transfer stamp 001, the transfer stamp 001 comprises a stamp head for adsorbing a light-emitting device, the stamp head comprises an adsorption surface 100, the adsorption surface 100 comprises a first edge 110, the first edge 110 is provided with at least one first protruding part 111 and / or a first recessed part 112, the first protruding part 111 / the first recessed part 112 is concave-convex along a first direction X and is arranged along a second direction Y, the first direction X is parallel to a plane in which the stamp head is located, and the second direction Y is perpendicular to the first direction X and parallel to the plane in which the stamp head is located. It can be understood that the first direction X and the second direction Y are perpendicular to each other, and the first direction X and the second direction Y are respectively parallel to the plane in which the adsorption surface 100 is located.

[0086] It should be noted that the recessed part and the protruding part in the embodiment of the present application are relative, when the first edge 110 comprises at least two first recessed parts 112, it can be understood that the first protruding part 111 is between the two first recessed parts 112; when the first edge 110 comprises at least two first protruding parts 111, the first recessed part 112 is between the two first protruding parts 111.

[0087] The inventor has found that the difference in display brightness of the plurality of lamp beads in the display panel is particularly obvious near the edge of the contact area between the transfer stamp and the circuit substrate, that is, in the process of transferring the Mirco-LED lamp bead to the circuit substrate, the display brightness difference of the Micro-LED located at the edge of the adsorption surface 100 of the transfer stamp 001 and the Micro-LED at other positions is larger after being transferred to the circuit substrate. The inventor has further analyzed that the main reason for the problem is that the pressure and deformation of the transfer stamp during the transfer of the Micro-LED are uneven, which causes the Micro-LED at the edge of the adsorption surface 100 and the corresponding electrode on the circuit substrate to be seriously misaligned, and then the display brightness of the Micro-LED is obviously different from the display brightness of other Micro-LEDs.

[0088] In the embodiment of the present application, as ​As shown, the first edge 110 of the adsorption surface 100 is provided with at least one first protruding part 111 and / or first recessed part 112, i.e., the first edge 110 of the adsorption surface 100 is a non-straight structure. Such a non-straight structure can make the Micro-LEDs EL1 arranged along the first edge 110 in the front and back two times of using the transfer stamp 001 to transfer the Micro-LEDs be located in a straight line after being transferred to the circuit substrate together with the Micro-LEDs EL2 away from the first edge 110. Then the Micro-LEDs EL1 arranged along the first edge 110 can be more dispersed after being transferred to the circuit substrate, and the Micro-LEDs EL1 arranged along the first edge 110 can be adjacent to more Micro-LEDs EL2 away from the first edge 110 after being transferred to the circuit substrate, thereby solving the problem of poor display uniformity in the prior art Micro-LED display panel.

[0089] It should be noted that, in order to clearly illustrate, ​ The distribution of the Micro-LEDs near the first edge 110 of the transfer stamp 001 is illustrated in FIG. 1, and the distribution of the Micro-LEDs at other positions is not illustrated. However, in actual situations, the transfer stamp 001 can uniformly adsorb the Micro-LEDs on the whole surface, or can adsorb the Micro-LEDs according to requirements.

[0090] It should be further noted that, ​ The illustrated splicing diagram of the adsorption surface refers to a splicing diagram of the areas of the Micro-LEDs released by the adsorption surface 100 of one transfer stamp 001 on the circuit substrate in multiple times of transferring the Micro-LEDs; or a splicing diagram of the adsorption surfaces 100 of multiple transfer stamps 001 in the process of simultaneously transferring the Micro-LEDs, i.e., the areas of the Micro-LEDs released by the adsorption surfaces 100 of the multiple transfer stamps 001 on the circuit substrate. The meaning of the splicing diagram of the adsorption surface below is also as described above.

[0091] ​ An adsorption surface of a transfer stamp provided by an embodiment of the present application; ​ An adsorption surface of a transfer stamp provided by an embodiment of the present application; ​ A splicing diagram of the adsorption surface in FIG. 1; ​ An adsorption surface of a transfer stamp provided by an embodiment of the present application; ​ A splicing diagram of the adsorption surface in FIG. 2; ​ An adsorption surface of a transfer stamp provided by an embodiment of the present application; ​ A splicing diagram of the adsorption surface in FIG. 3; ​ A splicing diagram of the adsorption surface in FIG. 4; ​ A splicing diagram of the adsorption surface in FIG. 5.

[0092] Please refer to ​ In an embodiment of the present application, the shape of the first edge 110 is a first shape, and the two first shapes are fitted together. It can be understood that fitting means that seamless splicing can be basically achieved.

[0093] For example, please refer to ​ The shape of the first protruding part 111 is the same as that of the first recessed part 112. As shown in ​ , the shape of the first protruding part 111 or the first recessed part 112 is a trapezoid, or as shown in ​ , the shape of the first protruding part 111 or the first recessed part 112 is a rectangle, or as shown in ​ , the shape of the first protruding part 111 or the first recessed part 112 is a circular arc.

[0094] It should be noted that the shape of the first protruding part 111 or the first recessed part 112 is not limited to the shape described in the present embodiment, and can be other shapes that can form fitting with each other, such as other broken line shapes or non-circular arc-shaped curved shapes.

[0095] For example, as shown in ​ , the first protruding part 111 includes a first sub-protruding part 111a' and a second sub-protruding part 111b', or the first recessed part 112 includes a first sub-recessed part 112a' and a second sub-recessed part 112b', the shape of the first protruding part 111 is the same as that of the first sub-recessed part 112a', and the shape of the second sub-protruding part 111b' is the same as that of the second sub-recessed part 112b'. The shape of the first sub-protruding part 111a' is different from that of the second sub-protruding part 111b', and the shape of the first sub-recessed part 112a' is different from that of the second sub-recessed part 112b'. This difference can increase the diversity of the shape of the first edge 110, further improve the display uniformity of the display panel, and can alleviate the diffraction phenomenon.

[0096] ​ An adsorption surface of a transfer stamp provided by an embodiment of the present application; ​ An adsorption surface ​ in the present application.

[0097] Please refer to ​ In an embodiment of the present application, the adsorption surface 100 further includes a second edge 120, and the second edge 120 is provided with at least one second protruding part 121 and / or a second recessed part 122; the shape of the first edge 110 is fitted with the shape of the second edge 120. The fitting of the shape of the first edge 110 and the second edge 120 reduces the difficulty of fitting the target area occupied by the transfer stamp 001 on the substrate in the front and rear two uses, thereby reducing the control difficulty of the transfer stamp 001.

[0098] ​An adsorption surface of a transfer stamp provided by an embodiment of the present application; ​ An adsorption surface of a transfer stamp provided by an embodiment of the present application; ​ An adsorption surface of a transfer stamp provided by an embodiment of the present application;

[0099] An adsorption surface of a transfer stamp provided by an embodiment of the present application; ​ In a technical solution of the embodiment, the first edge 110 and the second edge 120 are oppositely arranged on the adsorption surface 100, and the second protruding part 121 or the second recessed part 122 is recessed and protruded along the first direction X and arranged along the second direction Y. The first edge 110 and the second edge 120 are oppositely arranged on the adsorption surface 100, and the transfer stamp 001 does not need to be rotated when the transfer stamp 001 is used twice to transfer the Mirco-LED lamp beads, which reduces the control difficulty and cost of the transfer stamp 001 and is conducive to saving production cost.

[0100] The shape of the first edge 110 is a first shape, and the shape of the second edge 120 is a second shape, as shown in ​ and ​ The first shape can be coincided with the second shape through translation, and as shown in ​ The first shape or the second shape includes a plurality of trapezoids, as shown in ​ The first shape or the second shape includes a plurality of circular arcs.

[0101] It should be noted that the recessed part (or the protruding part) in the present application can also be understood as being recessed (or protruding) relative to the edge line of the adsorption surface 100, as shown in ​ It can be understood that, in the first edge 110 and the second edge 120, one of them is provided with only a recessed part, and the other is provided with only a protruding part.

[0102] ​ An adsorption surface of a transfer stamp provided by an embodiment of the present application; ​ An adsorption surface of a transfer stamp provided by an embodiment of the present application; ​ An adsorption surface of a transfer stamp provided by an embodiment of the present application; ​ An adsorption surface of a transfer stamp provided by an embodiment of the present application; ​ An adsorption surface of a transfer stamp provided by an embodiment of the present application; ​ An adsorption surface of a transfer stamp provided by an embodiment of the present application;

[0103] An adsorption surface of a transfer stamp provided by an embodiment of the present application; ​ An adsorption surface of a transfer stamp provided by an embodiment of the present application; ​ The first shape is coincided with the second shape through rotation of 180 degrees. In the first shape includes a plurality of trapezoids in ​ The angle between the base and the waist of the trapezoid is not perpendicular, which can effectively weaken the display brightness difference of the Micro-LED lamp beads. ​ The first shape includes a plurality of rectangles in

[0104] ​ An adsorption surface of a transfer stamp provided by an embodiment of the present application; ​ An adsorption surface of a transfer stamp provided by an embodiment of the present application; ​ A splicing schematic diagram of the adsorption surface in the transfer stamp.

[0105] Referring to ​ , the first shape is symmetrical about a straight line with the second shape. Further, the first shape and the second shape respectively include a plurality of rectangles.

[0106] ​ An adsorption surface of a transfer stamp provided by an embodiment of the present application; ​ An adsorption surface of a transfer stamp provided by an embodiment of the present application; ​ A splicing schematic diagram of the adsorption surface in the transfer stamp. ​ An adsorption surface of a transfer stamp provided by an embodiment of the present application; ​ An adsorption surface of a transfer stamp provided by an embodiment of the present application; ​ A splicing schematic diagram of the adsorption surface in the transfer stamp. ​ An adsorption surface of a transfer stamp provided by an embodiment of the present application; ​ An adsorption surface of a transfer stamp provided by an embodiment of the present application; ​ A splicing schematic diagram of the stamp in the transfer stamp.

[0107] Referring to ​ , in a technical solution of the embodiment, the first edge 110 and the second edge 120 are adjacently arranged on the adsorption surface 100, which can be understood as that the first edge 110 is connected with the second edge 120, the direction of the concave-convex change of the second convex part 121 or the second concave part 122 is not parallel to the first direction X, and the direction of the concave-convex change of the second convex part 121 or the second concave part 122 is parallel to the plane where the adsorption surface 100 is located. The arrangement direction of the second convex part 121 or the second concave part 122 is not parallel to the second direction Y, and the arrangement direction of the second convex part 121 or the second concave part 122 is parallel to the plane where the adsorption surface 100 is located. The first edge 110 and the second edge 120 are adjacent, so that both of the two adjacent edges of the transfer stamp 001 are non-straight lines, the direction of the concave-convex change of the second convex part 121 or the second concave part 122 is not parallel to the first direction X, and the arrangement direction of the second convex part 121 or the second concave part 122 is not parallel to the second direction Y. Therefore, the non-straight edge design is performed in two directions respectively, and such design can improve the uniformity of the display brightness of the display panel from the two directions.

[0108] The first shape is coincident with the second shape by rotating 90 degrees.

[0109] For example, as shown in ​ and ​ , the first shape is coincident with the second shape by rotating 90 degrees, and the first shape includes a plurality of trapezoids, and the second shape includes a plurality of trapezoids. ​ and ​As shown, the first shape is fitted with the second shape, wherein the first shape comprises a plurality of rectangles, and the second shape comprises a plurality of rectangles. ​ As shown, the first shape is fitted with the second shape, wherein the first shape comprises a plurality of rectangles, and the second shape comprises a plurality of rectangles. ​ As shown, the first shape is fitted with the second shape, wherein the first shape comprises a plurality of rectangles, and the second shape comprises a plurality of rectangles.

[0110] ​ An adsorption surface of a transfer stamp provided by an embodiment of the present application; ​ An adsorption surface of a transfer stamp provided by an embodiment of the present application; ​ An adsorption surface of a transfer stamp provided by an embodiment of the present application;

[0111] In an embodiment of the present application, the adsorption surface 100 further comprises a third edge 130, and the third edge 130 is provided with at least one third protruding part 131 and / or third recessed part 132; the shape of the first edge 110 is different from the shape of the third edge 130. The difference between the shape of the first edge 110 and the shape of the third edge 130 further weakens the concentration of the Micro-LEDs adsorbed at the edges of the adsorption surface 100 on the circuit substrate, and improves the uniformity of the display brightness of the display panel.

[0112] As shown in ​ In a technical solution of the embodiment, the first edge 110 and the third edge 130 are oppositely arranged on the adsorption surface 100, and the third protruding part 131 or the third recessed part 132 changes in concave-convex along the first direction X and is arranged along the second direction Y. The opposite arrangement of the first edge 110 and the third edge 130 on the adsorption surface 100 makes the difference between the first edge 110 and the third edge 130 be in the first direction X, and the rotation angle of the transfer stamp 001 in the transfer process is relatively fixed (for example, 180 degrees), thereby reducing the control difficulty of the transfer stamp 001.

[0113] ​ An adsorption surface of a transfer stamp provided by an embodiment of the present application; ​ An adsorption surface of a transfer stamp provided by an embodiment of the present application; ​ An adsorption surface of a transfer stamp provided by an embodiment of the present application; ​ An adsorption surface of a transfer stamp provided by an embodiment of the present application; ​ An adsorption surface of a transfer stamp provided by an embodiment of the present application; ​ An adsorption surface of a transfer stamp provided by an embodiment of the present application; ​ An adsorption surface of a transfer stamp provided by an embodiment of the present application; ​ An adsorption surface of a transfer stamp provided by an embodiment of the present application; ​ An adsorption surface of a transfer stamp provided by an embodiment of the present application;

[0114] As shown in ​ , ​ and ​In one technical solution of the embodiment, the first edge 110 is arranged adjacent to the third edge 130 on the adsorption surface 100, the first edge 110 is connected with the third edge 130, the direction of the concave-convex change of the third convex part 131 or the third concave part 132 is not parallel to the first direction X, and the direction of the concave-convex change of the third convex part 131 or the third concave part 132 is parallel to the plane where the adsorption surface 100 is located. The arrangement direction of the third convex part 131 or the third concave part 132 is not parallel to the second direction Y, and the arrangement direction of the third convex part 131 or the third concave part 132 is parallel to the plane where the adsorption surface 100 is located. The adjacent arrangement of the first edge 110 and the third edge 130 makes both of the two adjacent edges of the transfer stamp 001 be non-linear and the shapes of the two adjacent edges be different, thereby weakening the difference in display brightness of the Micro-LED lamp beads on the two adjacent edges. The direction of the concave-convex change of the third convex part 131 or the third concave part 132 is not parallel to the first direction X, and the arrangement direction of the third convex part 131 or the third concave part 132 is not parallel to the second direction Y. Therefore, the non-linear edges are designed in two directions respectively and the two directions are different, and such a design can improve the uniformity of the display brightness of the display panel from the two directions.

[0115] For example, the third edge 130 has a third shape, as shown in FIG. 13A, the third shape includes a plurality of rectangles, and the rectangle is beneficial to reduce the manufacturing cost of the adsorption surface 100. ​ As shown in FIG. 13B, the third shape includes a plurality of circular arcs, and the circular arc can further make the Micro-LEDs arranged along the third edge 130 be more dispersed after being transferred to the circuit substrate, thereby being beneficial to improve the uniformity of the display brightness of the display panel. ​ 32 As shown in FIG. 13B, the third shape includes a plurality of circular arcs, and the circular arc can further make the Micro-LEDs arranged along the third edge 130 be more dispersed after being transferred to the circuit substrate, thereby being beneficial to improve the uniformity of the display brightness of the display panel.

[0116] ​ An adsorption surface of a transfer stamp provided in an embodiment of the present application; ​ An adsorption surface provided in the present application; ​ A splicing schematic diagram of the adsorption surface.

[0117] As shown in FIG. 11A, the first edge 110 is arranged adjacent to the third edge 130 on the adsorption surface 100, the first edge 110 is connected with the third edge 130, the direction of the concave-convex change of the third convex part 131 or the third concave part 132 is not parallel to the first direction X, and the direction of the concave-convex change of the third convex part 131 or the third concave part 132 is parallel to the plane where the adsorption surface 100 is located. The arrangement direction of the third convex part 131 or the third concave part 132 is not parallel to the second direction Y, and the arrangement direction of the third convex part 131 or the third concave part 132 is parallel to the plane where the adsorption surface 100 is located. The adjacent arrangement of the first edge 110 and the third edge 130 makes both of the two adjacent edges of the transfer stamp 001 be non-linear and the shapes of the two adjacent edges be different, thereby weakening the difference in display brightness of the Micro-LED lamp beads on the two adjacent edges. The direction of the concave-convex change of the third convex part 131 or the third concave part 132 is not parallel to the first direction X, and the arrangement direction of the third convex part 131 or the third concave part 132 is not parallel to the second direction Y. Therefore, the non-linear edges are designed in two directions respectively and the two directions are different, and such a design can improve the uniformity of the display brightness of the display panel from the two directions. ​ In one embodiment of the present application, the first convex part 111 includes a first sub-convex part 111a and a second sub-convex part 111b, and the maximum width of the first sub-convex part 111a and the second sub-convex part 111b along the first direction X is not the same; and / or, the first concave part 112 includes a first sub-concave part 112a and a second sub-concave part 112b, and the maximum width of the first sub-concave part 112a and the second sub-concave part 112b along the first direction X is not the same. That is, the first edge 110 is designed to be different, and such a different design can further make the Micro-LEDs arranged along the first edge 110 be more dispersed after being transferred to the circuit substrate, thereby being beneficial to improve the uniformity of the display brightness of the display panel.​

[0118] Please refer to ​ In an embodiment of the present application, along the second direction Y, the first sub-protruding part 111a is located on the side of the second sub-protruding part 111b close to the end of the first edge 110; the maximum width D1 of the first sub-protruding part 111a along the first direction X is greater than the maximum width d1 of the second sub-protruding part 111b along the first direction X; and / or, along the second direction Y, the first sub-recess part 112a is located on the side of the second sub-recess part 112b close to the end of the first edge 110; the maximum width D2 of the first sub-recess part 112a along the first direction X is greater than the maximum width d2 of the second sub-recess part 112b along the first direction X. It can be understood that, compared with the second sub-protruding part 111b, the first sub-protruding part 111a is closer to the corresponding end point of the first edge 110, and the corresponding end point of the first edge 110 is on the same side of the first sub-protruding part 111a as the second sub-protruding part 111b. The closer to the end of the corresponding side, the greater the maximum width of the first protruding part 111 along the first direction X, that is, the greater the difference, which can effectively transfer the difference in display brightness of the Micro-LED lamp beads at the corner position of the substrate area occupied by the stamp 001, and further improve the uniformity of the display brightness of the display panel.

[0119] Please refer to ​ In an embodiment of the present application, the first protruding part 111 includes a first sub-protruding part 111a' and a second sub-protruding part 111b', and the shape of the first sub-protruding part 111a' is different from the shape of the second sub-protruding part 111b'; and / or, the first recess part 112 includes a first sub-recess part 112a' and a second sub-recess part 112b', and the shape of the first sub-recess part 112a' is different from the shape of the second sub-recess part 112b'. That is, the first edge 110 is designed differently, and such differential design can further weaken the difference in display brightness of the Micro-LED lamp beads on the first edge 110, and improve the uniformity of the display brightness of the display panel.

[0120] ​ An adsorption surface of a transfer stamp provided by an embodiment of the present application; ​ An adsorption surface ​ A splicing diagram of the adsorption surface in

[0121] Please refer to ​In an embodiment of the present application, the first edge 110 is provided with a plurality of first protrusions 111, the distance between part of two adjacent first protrusions 111 is a first distance L1, and the distance between part of two adjacent first protrusions 111 is a second distance L2, the first distance L1 is not equal to the second distance L2; and / or, the first edge 110 is provided with a plurality of first recesses 112, the distance between part of two adjacent first recesses 112 is a third distance L3, and the distance between part of two adjacent first recesses 112 is a fourth distance L4, the third distance L3 is not equal to the fourth distance L4. That is, the plurality of first protrusions 111 (or the plurality of first recesses 112) are arranged non-uniformly on the first edge 110, further increasing the difference in arrangement of the Micro-LED lamp beads at the first edge 110, weakening the difference in display brightness of the Micro-LED lamp beads on the first edge 110, and improving the uniformity of the display brightness of the display panel.

[0122] ​ A transfer stamp adsorption surface provided by an embodiment of the present application; ​ A transfer stamp adsorption surface provided by an embodiment of the present application; ​ A transfer stamp adsorption surface provided by an embodiment of the present application;

[0123] Please refer to ​ In an embodiment of the present application, the shape of the first protrusion 111 includes at least one of a rectangle, a triangle, a trapezoid, and a semicircle; and / or, the shape of the first recess 112 includes at least one of a rectangle, a triangle, a trapezoid, and a semicircle. The rectangle, triangle, trapezoid, etc. are easy to realize, which is beneficial to reduce the production cost of the transfer stamp 001.

[0124] In an embodiment of the present application, the number of edges of the adsorption surface 100 of the transfer stamp 001 can be 3, 4, 5, or 6, etc. The plurality of edges of the adsorption surface 100 of the transfer stamp 001 includes the first edge 110. The plurality of edges of the adsorption surface 100 of the transfer stamp 001 also includes at least one second edge 120 and / or at least one third edge 130.

[0125] Please refer to ​ The number of edges of the adsorption surface 100 of the transfer stamp 001 is 4.

[0126] As shown in ​ As shown in ​ As shown in ​As shown, the shapes of the two second edges 120 can be mutually embedded, and the shape of the first edge 110 is embedded with the shape of the second edge 120, increasing the variety of the rotation angle of the transfer stamp 001, and reducing the control difficulty of the transfer stamp 001. ​ As shown, the adsorption surface 100 of the transfer stamp 001 includes a first edge 110, a second edge 120, and a third edge 130. As shown in ​ As shown, the transfer stamp 001 with the adsorption surface 100 can increase the variety of the adsorption surface 100 and the splicing edge of the adsorption surface 100, effectively reducing the difference in display brightness of the Mirco-LED lamp beads at the edge. As shown in ​ 、 ​ and ​ As shown, the adsorption surface 100 of the transfer stamp 001 includes a first edge 110 and two second edges 120, wherein ​ The adsorption surface 100 shown in the process of realizing splicing does not need to be misaligned, ​ The adsorption surface 100 shown in the process of realizing splicing needs to be misaligned, ​ As shown, the shape of the first edge 110 of the adsorption surface 100 includes several arcs, and the shapes of the second edge 120 and the third edge 130 respectively include several arcs. As shown in ​ As shown, the adsorption surface 100 of the transfer stamp 001 includes a first edge 110 and two third edges 130, and the shapes of the two third edges 130 are different.

[0127] As shown in ​ 、 ​ As shown, the adsorption surface 100 of the transfer stamp 001 respectively includes four non-straight edges. As shown in ​ As shown, the adsorption surface 100 of the transfer stamp 001 includes a first edge 110 and three third edges 130, and the shapes of the three third edges 130 are all different, so that the difference in display brightness of the Mirco-LED lamp beads at the edge can be more effectively weakened. As shown in ​ 、 ​ and ​ As shown, the adsorption surface 100 of the transfer stamp 001 includes a first edge 110 and three second edges 120, ​ As shown, the first edge 110 and the second edge 120 of the adsorption surface 100 respectively include several sawteeth, ​ As shown, the first edge 110 and the second edge 120 of the adsorption surface 100 respectively include several rectangles, ​ As shown, the first edge 110 and the second edge 120 of the adsorption surface 100 respectively include several arcs.

[0128] Please refer to ​The number of edges of the adsorption surface 100 of the transfer stamp 001 is 6. ​ The edges of the adsorption surface 100 shown include a first edge 110 and five straight edges. ​ The edges of the adsorption surface 100 shown include a first edge 110 and five second edges 120.

[0129] In the embodiments of the present application, when a large number of Mirco-LED lamp beads are transferred by using the transfer stamp 001, the transfer stamp 001 needs to be rotated so that the edges of the areas occupied by the transfer stamp 001 in the previous and next two times of use can correspond to each other. It should be noted that, preferably, the rotation of the transfer stamp 001 occurs after the release action of the previous transfer and before the adsorption action of the next transfer.

[0130] The embodiments of the present application provide a transfer device, which includes the transfer stamp 001 of the first aspect.

[0131] The embodiments of the present application provide a transfer method based on the transfer stamp 001 of the first aspect, which includes: adsorbing a plurality of light emitting devices on the adsorption surface 100 by using the transfer stamp 001; moving the transfer stamp 001 to a target area of a target substrate, and releasing the plurality of light emitting devices so that the light emitting devices are arranged on the target area of the target substrate; repeating the above steps until the arrangement of the light emitting devices on the target substrate meets a preset condition; wherein, the moving of the transfer stamp 001 to the target area of the target substrate twice includes: moving the transfer stamp 001 to a first target area of the target substrate once, and moving the transfer stamp 001 to a second target area of the target substrate next time; the first target area and the second target area are adjacent and embedded.

[0132] In an embodiment of the present application, when the first target area is located at the edge of the substrate and the position of the first target area is smaller than the area of the adsorption surface 100 of the transfer stamp 001, the first area of the adsorption surface 100 of the transfer stamp 001 adsorbs the light emitting devices, and the shape of the first area coincides with that of the first target area. This can effectively avoid the waste of light emitting devices.

[0133] In an embodiment of the present application, the adsorption surface 100 includes the first edge 110 and the second edge 120, the first edge 110 and the second edge 120 are oppositely arranged, and the shape of the first edge 110 is symmetric about a straight line with the shape of the second edge 120; the first target area and the second target area are adjacent and embedded along a third direction X', and the first target area and the second target area are dislocated in a fourth direction Y', and the third direction and the fourth direction are perpendicular.

[0134] In an embodiment of the present application, the transfer stamp 001 adsorbs the light emitting devices on the initial carrier to the adsorption surface 100, and moves the transfer stamp 001 to the target region of the target substrate twice, including: the first time adsorbing the light emitting devices on the first initial region of the initial carrier to the adsorption surface 100, moving the transfer stamp 001 to the first target region of the target substrate, and releasing the light emitting devices on the adsorption surface 100 into the first target region, rotating the transfer stamp 001 to make the first initial region adjacent to and embedded with the second initial region, and the second time adsorbing the light emitting devices on the second initial region of the initial carrier to the adsorption surface 100, and moving the transfer stamp 001 to the second target region of the target substrate; the first target region and the second target region are adjacent and embedded; the shape of the first initial region coincides with the shape of the first target region, and the shape of the second initial region coincides with the shape of the second target region.

[0135] In an embodiment of the present application, the light emitting devices are released twice to be arranged in the target region of the target substrate, including: the first time releasing the light emitting devices to be arranged in the first target region of the target substrate, and the second time releasing the light emitting devices to be arranged in the second target region of the target substrate; wherein the first target region includes a first boundary close to the second target region, and the second target region includes a second boundary close to the first target region; the light emitting devices arranged in the first target region and close to the first boundary are arranged in a non-linear manner, and the light emitting devices arranged in the second target region and close to the second boundary are arranged in a non-linear manner. The light emitting devices arranged in a non-linear manner near the first boundary and the second boundary are arranged in a non-linear manner, so that the light emitting devices arranged in a corresponding row or column are transferred to the substrate by multiple times of using the transfer stamp 001, thereby weakening the difference in display brightness of the Micro-LED lamp beads in the prior art.

[0136] In an embodiment of the present application, the arrangement of the light emitting devices on the target substrate meets the preset condition, including: the arrangement of the light emitting devices on the target substrate is arrayed.

[0137] The above merely describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the scope of protection of the present application.

Claims

1. A transfer stamp, characterized in that, The transfer stamp includes a stamp head for adsorbing light-emitting devices. The stamp head includes an adsorption surface, and the adsorption surface includes a first edge. The first edge is provided with at least a first protrusion and / or a first depression. The first protrusion or the first depression varies in shape along a first direction and is arranged along a second direction. The first direction is parallel to the plane where the stamp head is located, and the second direction is perpendicular to the first direction and parallel to the plane where the stamp head is located. The transfer stamp is used to transfer the light-emitting device to a target area, the target area including a target boundary line corresponding to the first edge; wherein, two adjacent target areas can be spliced ​​together by interlocking their respective target boundary lines.

2. The transfer stamp according to claim 1, characterized in that, The shape of the first edge is a first shape, and two first shapes fit together.

3. The transfer stamp according to claim 1, characterized in that, The adsorption surface further includes a second edge, which has at least one second protrusion and / or a second recess; the shape of the first edge matches the shape of the second edge.

4. The transfer stamp according to claim 1, characterized in that, The adsorption surface further includes a third edge, which has at least one third protrusion and / or a third recess; the shape of the first edge is different from the shape of the third edge.

5. The transfer stamp according to claim 1, characterized in that, The first protrusion includes a first sub-protrusion and a second sub-protrusion, wherein the maximum width of the first sub-protrusion and the second sub-protrusion along the first direction is different; and / or, The first recess includes a first sub-recess and a second sub-recess, and the maximum width of the first sub-recess and the second sub-recess along the first direction is different.

6. The transfer stamp according to claim 5, characterized in that, Along the second direction, the first sub-protrusion is located on the side of the second sub-protrusion near the first edge end; the maximum width of the first sub-protrusion along the first direction is greater than the maximum width of the second sub-protrusion along the first direction; And / or, Along the second direction, the first sub-recess is located on the side of the second sub-recess near the first edge end; the maximum width of the first sub-recess along the first direction is greater than the maximum width of the second sub-recess along the first direction.

7. The transfer stamp according to claim 1, characterized in that, The first protrusion includes a first sub-protrusion and a second sub-protrusion, wherein the shape of the first sub-protrusion is dissimilar to the shape of the second sub-protrusion; and / or, The first recess includes a first sub-recess and a second sub-recess, and the shape of the first sub-recess is not similar to the shape of the second sub-recess.

8. The transfer stamp according to claim 1, characterized in that, The first edge is provided with a plurality of first protrusions, the distance between some adjacent first protrusions is a first distance, and the distance between some adjacent first protrusions is a second distance, wherein the first distance is not equal to the second distance; and / or, The first edge is provided with a plurality of first recesses, the distance between some adjacent two first recesses is a third distance, and the distance between some adjacent two first recesses is a fourth distance, wherein the third distance is not equal to the fourth distance.

9. The transfer stamp according to claim 1, characterized in that, The shape of the first protrusion includes at least one of a rectangle, triangle, trapezoid, and semicircle; and / or, The shape of the first recess includes at least one of a rectangle, a triangle, a trapezoid, and a semicircle.

10. A transfer device, characterized in that, The transfer device includes the transfer stamp as described in any one of claims 1-9.

11. A transfer method based on the transfer stamp according to any one of claims 1-9, characterized in that, include: The transfer stamp is used to adsorb several light-emitting devices onto the adsorption surface; Move the transfer stamp to the target area of ​​the target substrate, and release the plurality of light-emitting devices so that the light-emitting devices are disposed in the target area of ​​the target substrate; Repeat the above steps until the arrangement of the light-emitting devices on the target substrate meets the preset conditions; The two movements of the transfer stamp to the target area of ​​the target substrate include: The transfer stamp is moved to a first target area of ​​the target substrate in the previous step, and then moved to a second target area of ​​the target substrate in the next step; the first target area and the second target area are adjacent to and interlocked.

12. The transfer method according to claim 11, characterized in that, The adsorption surface includes a first edge and a second edge, the first edge and the second edge are disposed opposite to each other, and the shape of the first edge and the shape of the second edge are symmetrical about a straight line; The first target region and the second target region are adjacent and interlocked along a third direction, and the first target region and the second target region are misaligned in a fourth direction, wherein the third direction is perpendicular to the fourth direction.

13. The transfer method according to claim 12, characterized in that, The two releases of the plurality of light-emitting devices to dispose of the light-emitting devices in the target area of ​​the target substrate include: The plurality of light-emitting devices are released in a previous step to place the light-emitting devices in the first target area of ​​the target substrate, and the plurality of light-emitting devices are released in a subsequent step to place the light-emitting devices in the second target area of ​​the target substrate; The first target area includes a first boundary near the second target area, and the second target area includes a second boundary near the first target area; a plurality of light-emitting devices disposed in the first target area and near the first boundary are arranged in a non-linear manner, and a plurality of light-emitting devices disposed in the second target area and near the second boundary are arranged in a non-linear manner.

14. The transfer method according to claim 13, characterized in that, The process of arranging the light-emitting devices on the target substrate until they meet preset conditions includes: Until the light-emitting devices on the target substrate are arranged in an array.

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