Data processing device of a sensor and sensor assembly

Abstract

The application provides a data processing device of a sensor and a sensor assembly. The data processing device comprises a sensitivity pre-adjustment module, which performs gain adjustment on sensing data from the sensor according to a scaling factor; a temperature offset module, which obtains an offset at a current temperature according to the current temperature and a temperature offset coefficient; an offset compensation module, which performs offset compensation on the sensing data after gain adjustment according to the offset at the current temperature; a temperature sensitivity deviation module, which obtains a sensitivity deviation at the current temperature according to the current temperature and a temperature sensitivity coefficient; and a sensitivity adjustment module, which performs sensitivity deviation compensation on the sensing data after offset compensation according to the sensitivity deviation at the current temperature. In the application, the temperature offset coefficient TCO and the temperature sensitivity coefficient TCS both only change with temperature, and batch calibration can be performed.

Description

[Technical Field]

[0001] This invention relates to the field of sensor data processing, and more particularly to a sensor data processing device and sensor assembly. [Background Technology]

[0002] For sensors, there are two important parameters that need to be calibrated: offset and sensitivity.

[0003] Figure 1 A data processing device for a conventional sensor is shown. The data processing device includes an offset compensation module 121, a sensitivity adjustment module 122, a temperature offset module 123, and a temperature sensitivity deviation module 124. Generally, the sensing data output by the sensor 110 first undergoes offset compensation via the offset compensation module (OFFSET_COMP) 121, and then undergoes sensitivity deviation compensation via the sensitivity adjustment module (DGAIN) 122. In the sensitivity adjustment module 122, the sensing data is scaled according to a scaling factor (scale).

[0004] However, both the offset and sensitivity change with temperature. For more accurate compensation, the temperature offset module 123 needs to calculate the offset at the current temperature based on the temperature and the temperature offset coefficient (TCO), and then the offset compensation module 121 performs compensation based on the offset at the current temperature. When calibrating the sensitivity, the temperature sensitivity deviation module 124 needs to calculate the sensitivity deviation at the current temperature based on the temperature and the temperature sensitivity coefficient (TCS), and then the sensitivity adjustment module 122 performs sensitivity deviation compensation on the sensing data based on the sensitivity deviation at the current temperature.

[0005] However, in the prior art, the temperature offset coefficient (TCO) is derived by back-calculating the data after sensitivity deviation compensation. Therefore, the TCO is affected not only by temperature but also by the scaling factor (scale) in the sensitivity adjustment module 122, resulting in a larger dynamic range. Furthermore, the temperature sensitivity coefficient is also obtained based on the data after sensitivity deviation compensation. This coefficient is also affected not only by temperature but also by the scaling factor (scale) in the sensitivity adjustment module 122, further increasing its dynamic range.

[0006] The data processing device is typically manufactured as a chip. During chip calibration, it is expected that each chip will use the same temperature offset coefficient (TCO) and temperature sensitivity coefficient (TCS). However, in reality, each chip has a different scaling factor (scale), resulting in each chip having a different TCO and TCS.

[0007] Therefore, there is an urgent need to propose a new technical solution to address the above problems. [Summary of the Invention]

[0008] One of the objectives of this invention is to provide a data processing device and sensor assembly for a sensor, wherein the temperature offset coefficient (TCO) and temperature sensitivity coefficient (TCS) are only affected by temperature and can be calibrated in batches.

[0009] According to one aspect of the present invention, a data processing apparatus for a sensor is provided, comprising: a sensitivity pre-adjustment module, which adjusts the gain of sensing data from the sensor according to a scaling factor; a temperature offset module, which obtains an offset at the current temperature according to the current temperature and a temperature offset coefficient; an offset compensation module, which compensates for the offset of the gain-adjusted sensing data according to the offset at the current temperature; a temperature sensitivity deviation module, which obtains a sensitivity deviation at the current temperature according to the current temperature and a temperature sensitivity coefficient; and a sensitivity adjustment module, which compensates for the sensitivity deviation of the offset-compensated sensing data according to the sensitivity deviation at the current temperature.

[0010] In one embodiment, the value of the scaling factor in the sensitivity pre-adjustment module is set such that the sensing data passing through the sensitivity pre-adjustment module is adjusted to the desired amplitude range.

[0011] In one embodiment, the sensitivity pre-adjustment module is used to adjust the room temperature sensitivity deviation of the sensing data from the sensor.

[0012] In one embodiment, the offset at the current temperature is only temperature-dependent, and the sensitivity deviation at the current temperature is only temperature-dependent.

[0013] In one embodiment, the data processing device for the sensor further includes a temperature sensor for providing the current temperature.

[0014] According to another aspect of the present invention, a sensor assembly is provided, comprising: a sensor; and the data processing device described above connected to the sensor.

[0015] In one embodiment, the sensor is a MEMS accelerometer or a MEMS gyroscope.

[0016] Compared with existing technologies, this invention adds a sensitivity pre-adjustment module before the offset compensation module and the sensitivity adjustment module. The sensitivity pre-adjustment module is responsible for calibrating the sensitivity at room temperature, and the output sensing data is adjusted to the desired amplitude range. In this way, the sensitivity adjustment module is only responsible for adjusting the part of the sensitivity that changes with temperature, and its scaling factor is fixed. Thus, the dynamic range of the temperature offset coefficient TCO and the temperature sensitivity coefficient TCS is fixed. Both the temperature offset coefficient TCO and the temperature sensitivity coefficient TCS only change with temperature, which allows for batch calibration. [Attached Image Description]

[0017] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:

[0018] Figure 1 A schematic diagram of the structure of a data processing device for an existing sensor is shown;

[0019] Figure 2 This is a schematic diagram of the data processing device in one embodiment of the present invention.

Detailed Implementation Methods

[0020] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0021] The term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the invention. The phrase "in one embodiment" appearing in different places throughout this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that excludes other embodiments. Unless otherwise specified, the terms "connected," "linked," and "connected" used herein to indicate electrical connection refer to direct or indirect electrical connection.

[0022] In this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," "coupled," etc., should be interpreted broadly; for example, they can refer to direct connection or indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0023] The present invention provides a data processing device in which the temperature offset coefficient (TCO) and temperature sensitivity coefficient (TCS) are only affected by temperature, and batch calibration can be performed.

[0024] Figure 2 This is a schematic diagram of the data processing device in one embodiment of the present invention. Figure 2 As shown, the data processing device 200 includes a sensitivity pre-adjustment module 211, a temperature offset module 212, a sensitivity adjustment module 213, a temperature offset module 214, and a temperature sensitivity deviation module 215.

[0025] The sensitivity pre-adjustment module (PRE-DGAIN) 211 adjusts the gain of the sensing data from the sensor 110 according to a scaling factor. Specifically, the sensitivity pre-adjustment module 211 is used to adjust the room temperature sensitivity deviation of the sensing data from the sensor. The scaling factor in the sensitivity pre-adjustment module is set so that the sensing data after passing through the sensitivity pre-adjustment module 211 is adjusted to the desired amplitude range. For different data processing devices, the scaling factor in the sensitivity pre-adjustment module 211 can be different, so that different data processing devices can all handle sensing data within the desired amplitude range.

[0026] The temperature offset module 214 obtains the offset at the current temperature based on the current temperature and the temperature offset coefficient TCO. The offset compensation module 212 performs offset compensation on the gain-adjusted sensing data based on the offset at the current temperature. Specifically, the data obtained by summing the offset at the current temperature and the gain-adjusted sensing data is the offset-compensated sensing data. The temperature sensitivity deviation module 215 obtains the sensitivity deviation at the current temperature based on the current temperature and the temperature sensitivity coefficient TCS. The sensitivity adjustment module 213 performs sensitivity deviation compensation on the offset-compensated sensing data based on the sensitivity deviation at the current temperature. Specifically, the data obtained by multiplying the sensitivity deviation at the current temperature by the offset-compensated sensing data is the sensitivity deviation-compensated sensing data.

[0027] This invention adds a sensitivity pre-adjustment module 211 before the offset compensation module 212 and the sensitivity adjustment module 213. The pre-adjustment module 211 is responsible for room-temperature calibration of the sensitivity, adjusting the output sensing data to the desired amplitude range. Thus, the sensitivity adjustment module 213 only adjusts the portion of the sensitivity that changes with temperature, and its scaling factor is fixed, for example, 1. This ensures that both the temperature offset coefficient (TCO) and the temperature sensitivity coefficient (TCS) change only with temperature, allowing for batch calibration. This solves the problem of inconsistent TCO and TCS among individual chips, including the data processing device.

[0028] The sensor 110 can be an accelerometer or a gyroscope. In one example, the sensor 110 can be an accelerometer. Suppose that the desired output value of the accelerometer is 100 regardless of the temperature when the acceleration is 1g. If, at 25 degrees Celsius (room temperature), the accelerometer outputs 50 at 1g, the sensitivity pre-adjustment module will amplify the sensing data by a factor of 2 (i.e., the scaling factor of the sensitivity pre-adjustment module is 2) to obtain 100; at this time, the temperature offset module outputs 0 (i.e., the offset at the current temperature is 0), and the compensated data is still 100; the temperature sensitivity deviation module outputs 1 (i.e., the sensitivity deviation at the current temperature is 1), meaning that the sensing data needs to be amplified by a factor of 1, but the output is still 100, which is the same as the desired value. When the temperature changes, for example to 5 degrees, if the accelerometer output value at 1g becomes 60, the sensitivity pre-adjustment amplifies the data by 2 times to get 120; the temperature offset module can calculate the offset to be -10 based on the current temperature, and the compensated data is 110; the temperature sensitivity deviation module calculates the sensitivity deviation to be 0.91 based on the current temperature, that is, the output is 0.91, which means that the sensing data needs to be scaled by 0.91 times, and the compensated data is 100.1, which is close to the expected value.

[0029] In one embodiment, the data processing device further includes a temperature sensor for providing the current temperature.

[0030] According to another aspect of the present invention, a data processing apparatus is also provided, comprising a sensor 300 and a data processing apparatus 200 as described above connected to the sensor 300. The sensor may be a MEMS (Micro-Electro-Mechanical System) accelerometer or a MEMS gyroscope.

[0031] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0032] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications and variations to the above embodiments within the scope of the present invention.

Claims

1. A data processing device for a sensor, characterized in that, It includes: The sensitivity pre-adjustment module adjusts the gain of the sensing data from the sensor based on a scaling factor; The temperature offset module calculates the offset at the current temperature based on the current temperature and the temperature offset coefficient. The offset compensation module compensates for the offset of the gain-adjusted sensing data based on the offset at the current temperature. The temperature sensitivity deviation module calculates the sensitivity deviation at the current temperature based on the current temperature and the temperature sensitivity coefficient. The sensitivity adjustment module compensates for sensitivity deviations in the offset-compensated sensor data based on the sensitivity deviations at the current temperature. Setting the scaling factor value in the sensitivity pre-adjustment module adjusts the sensing data after passing through the sensitivity pre-adjustment module to the desired amplitude range. The sensitivity pre-adjustment module is used to adjust the room temperature sensitivity deviation of the sensing data from the sensor. Both the temperature offset coefficient and the temperature sensitivity coefficient change only with the current temperature.

2. The data processing device for the sensor according to claim 1, characterized in that, It also includes: A temperature sensor is used to provide the current temperature.

3. A sensor assembly, characterized in that, It includes: sensor; The data processing device as described in any one of claims 1-2, connected to the sensor.

4. The sensor assembly according to claim 3, characterized in that, The sensor is a MEMS accelerometer or a MEMS gyroscope.

Images