A method for assembling a liquid crystal on silicon and a liquid crystal on silicon cell

Abstract

The application discloses a method for manufacturing a silicon-based liquid crystal box and the silicon-based liquid crystal box, and comprises the following steps: providing a carrier glass, wherein the carrier glass is used for manufacturing a liquid crystal display panel, and a plurality of bonding areas are defined on the carrier glass and are spaced from each other, and the size of the bonding area corresponds to the size of a silicon-based liquid crystal wafer; arranging a first adhesive layer on each bonding area; bonding one of the silicon-based liquid crystal wafer or a cover plate glass to the carrier glass through the first adhesive layer; bonding the wafer and the cover plate glass to obtain a silicon-based liquid crystal box body comprising the carrier glass; and removing the carrier glass by de-bonding the silicon-based liquid crystal box body comprising the carrier glass, so as to obtain the silicon-based liquid crystal box body. By using the method, the silicon-based liquid crystal box can be manufactured by means of the manufacturing equipment and production line of the liquid crystal display panel, and the production cost can be reduced; and the carrier glass can be bonded with a plurality of wafers or cover plate glasses, so that the manufacturing of the silicon-based liquid crystal box can be carried out in batches, and the production efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of silicon-based liquid crystal display, in particular to a silicon-based liquid crystal cell forming method and a silicon-based liquid crystal cell. BACKGROUND

[0002] With the rapid development of optoelectronic and micro-electric manufacturing process technology, projection display technology has been greatly developed. Among them, the new display using silicon-based liquid crystal LCoS (Liquid Crystal on Silicon) technology has the advantages of high resolution, high brightness, small size, etc. Its market application potential is unlimited, and it has gradually become an important research direction of projection display technology, especially in the AR / VR application field, it has become one of the mainstream display technology routes.

[0003] In the production and manufacturing process of the existing LCoS silicon-based liquid crystal cell, the cell forming process of the LCOS silicon-based liquid crystal is directly bonded by using a wafer and a cover glass of the same size through LCOS special equipment. Since the preparation process of LCOS is similar to the preparation process of the existing liquid crystal display panel LCD (Liquid Crystal Display), it is necessary to seek a method for manufacturing the LCOS cell body by means of the LCD production equipment to reduce the production cost of LCOS. SUMMARY

[0004] To solve the above problems, the present application provides a silicon-based liquid crystal cell forming method and a silicon-based liquid crystal cell.

[0005] The silicon-based liquid crystal cell forming method provided by the present application comprises:

[0006] A carrier glass is provided, which is a carrier glass for manufacturing a liquid crystal display panel, and a plurality of bonding areas spaced apart from each other are divided on the carrier glass, and the size of the bonding area corresponds to the size of the wafer of the silicon-based liquid crystal;

[0007] A first gel layer is arranged in each bonding area;

[0008] One of the wafer or the cover glass of the silicon-based liquid crystal is bonded to the carrier glass through the first gel layer;

[0009] The wafer and the cover glass are bonded to obtain a silicon-based liquid crystal cell body comprising the carrier glass;

[0010] The silicon-based liquid crystal cell body comprising the carrier glass is degelled, the carrier glass is removed, and a silicon-based liquid crystal cell body is obtained.

[0011] Optionally, the carrier glass is provided with a plurality of bonding areas by screen printing.

[0012] Optionally, before the first adhesive layer is arranged in each bonding area, a limiting notch is arranged on the bonding area to define a placement position of the wafer.

[0013] Optionally, the bonding area is provided with a groove for accommodating the wafer or the cover glass; and the first adhesive layer is arranged in the groove of the bonding area.

[0014] Optionally, before the first adhesive layer is arranged in the groove of the bonding area, a first limiting part is arranged on the groove to define a placement position of the wafer.

[0015] Optionally, before the first adhesive layer is arranged in the groove of the bonding area, a first limiting part is arranged on the groove to define a placement position of the wafer.

[0016] Optionally, the cover glass is a square glass used for manufacturing a liquid crystal display panel.

[0017] Optionally, the wafer and the cover glass are bonded by arranging a second adhesive layer on a side of the wafer facing the cover glass, or by arranging the second adhesive layer on a side of the cover glass facing the wafer.

[0018] Optionally, the cover glass and the wafer are respectively provided with an alignment film layer.

[0019] To solve the above problems, the second technical solution is provided: a silicon-based liquid crystal box is provided, which is manufactured by the above-mentioned cell manufacturing method.

[0020] The cell forming method of the silicon-based liquid crystal utilizes a carrier glass for manufacturing a liquid crystal display panel, and a plurality of bonding areas for carrying wafers of the silicon-based liquid crystal are divided on the carrier glass and spaced apart from each other, a first adhesive layer is arranged in each bonding area; one of the wafers of the silicon-based liquid crystal or the cover plate glass is bonded to the carrier glass through the first adhesive layer; the wafer and the cover plate glass are bonded to obtain a cell body of the silicon-based liquid crystal including the carrier glass; the cell body of the silicon-based liquid crystal including the carrier glass is de-bonded, the carrier glass is removed, and the cell body of the silicon-based liquid crystal is obtained. By the method, the cell body of the silicon-based liquid crystal can be produced by means of the cell forming equipment and production line of the liquid crystal display panel, the wafers and the cover plate glass are bonded without using the special equipment for the LCOS, the production cost is reduced, and the carrier glass is divided into a plurality of bonding areas, a plurality of wafers or cover plate glasses can be bonded, the cell forming of the silicon-based liquid crystal can be carried out in batches, and the production efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor. Among them:

[0022] Figure 1 is a flowchart of a first embodiment of the cell forming method of the silicon-based liquid crystal provided by the present application;

[0023] Figure 2 is a structural diagram of an embodiment of the carrier glass provided by the present application;

[0024] Figure 3 is Figure 1 is a structural diagram of the carrier glass bonding wafer in the embodiment;

[0025] Figure 4 is a flowchart of a second embodiment of the cell forming method of the silicon-based liquid crystal provided by the present application;

[0026] Figure 5 is a structural diagram of another embodiment of the carrier glass provided by the present application;

[0027] Figure 6 is a flowchart of a third embodiment of the cell forming method of the silicon-based liquid crystal provided by the present application;

[0028] Figure 7 is Figure 6 is a structural diagram of the cell body of the silicon-based liquid crystal including the carrier glass in the embodiment;

[0029] Figure 8is a flowchart of a fourth embodiment of a cell forming method of a silicon-based liquid crystal provided in the present application.

[0030] Figure 9 is Figure 8 is a structural diagram of a cell of a silicon-based liquid crystal including a carrier glass. DETAILED DESCRIPTION

[0031] In order to make the above objectives, features and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application are described in detail below with reference to the drawings. It can be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application. In addition, it should be noted that, for the purpose of description, only the parts related to the present application are shown in the drawings, rather than all the structures. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.

[0032] The terms "first", "second", and the like in the present application are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "include" and "provide with" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device including a series of steps or units is not limited to the listed steps or units, but can optionally include steps or units not listed, or can optionally include other steps or units inherent to the process, method, product or device.

[0033] Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The phrase appears at various locations in the specification does not necessarily all refer to the same embodiment, nor is it necessarily mutually exclusive of other embodiments. It is explicitly and implicitly understood that the embodiments described herein are combinable.

[0034] Please refer to Figure 1 , Figure 1 is a flowchart of a first embodiment of a cell forming method of a silicon-based liquid crystal provided in the present application. The cell forming method of the silicon-based liquid crystal includes:

[0035] Step S11: providing a carrier glass, the carrier glass being a carrier glass for manufacturing a liquid crystal display panel, the carrier glass being divided into a plurality of bonding areas spaced apart from each other, the size of the bonding area corresponding to the size of a wafer of the silicon-based liquid crystal.

[0036] In the present embodiment, the size of the bonding area is greater than or equal to the size of the silicon-based liquid crystal wafer, and is preferably greater than the size of the wafer.

[0037] Please refer to Figure 2, Figure 2 This is a schematic diagram of the structure of an embodiment of the carrier glass provided in this application. Figure 2 As shown, the carrier glass 110 is used on a production line for manufacturing liquid crystal display (LCD) panels, and the carrier glass 110 has a plurality of spaced-apart bonding areas 120. In the embodiments of this application, the carrier glass 110 is used as a substrate for a silicon-based liquid crystal wafer or a cover glass, and the bonding areas 120 are used to bond one of the silicon-based liquid crystal wafers or cover glasses to the carrier glass 110.

[0038] Step S12: Apply a first adhesive layer to each bonding area.

[0039] Please see Figure 3 , Figure 3 for Figure 1 A schematic diagram of the structure of a substrate glass bonded to a wafer. (See diagram below.) Figure 3 As shown, a first colloid layer 121 is provided on each bonding area 120 of the carrier glass 110. Preferably, in order to meet the encapsulation requirements of the subsequent silicon-based liquid crystal, the colloid material of the first colloid layer 121 needs to be heat-resistant and easy to desorb.

[0040] Step S13: Attach either the silicon-based liquid crystal wafer or the cover glass to the carrier glass through the first colloid layer.

[0041] The first colloidal layer 121 acts as an adhesive medium to bond either the silicon-based liquid crystal wafer 210 or the cover glass 310 to the carrier glass 110. Preferably, the thickness of the carrier glass 110 is 200µm to 1000µm, the thickness of the wafer 210 is 100µm to 800µm, and the thickness of the cover glass 310 is 100µm to 800µm.

[0042] Step S14: Bond the wafer to the cover glass to obtain a cell containing a silicon-based liquid crystal including the carrier glass 110.

[0043] The wafer 210 is bonded to the cover glass 310 to obtain a cell housing of silicon-based liquid crystal including the carrier glass 110. Specifically, in one embodiment, as... Figure 3 As shown, a wafer 210 including a carrier glass 110 is bonded to a cover glass 310; in another embodiment, a cover glass 310 including a carrier glass 110 is bonded to a wafer 210.

[0044] Step S15: De-gelatinize the silicon-based liquid crystal cell including the carrier glass to remove the carrier glass and obtain the silicon-based liquid crystal cell.

[0045] Since the carrier glass 110 of the embodiment is a carrier glass for the production line of LCD, and the wafer 210 and the cover glass 310 are attached to the carrier glass 110 by attaching the wafer 210 or the cover glass 310 of the silicon-based liquid crystal to the carrier glass 110 to produce the silicon-based liquid crystal box, the silicon-based liquid crystal box can be produced by means of the cell production equipment and the production line of the liquid crystal display panel, without using the special production equipment of LCOS, so that the equipment investment can be reduced, and the production cost of the silicon-based liquid crystal box can be reduced. Moreover, the protection of the carrier glass 110 can partially offset the stress generated when the wafer 210 and the cover glass 310 are attached, so that the wafer 210 and the cover glass 310 are not easily damaged, and the production yield of the silicon-based liquid crystal is improved.

[0046] In the embodiment of the present application, the cell production method of the silicon-based liquid crystal of the embodiment comprises: providing a carrier glass 110, the carrier glass 110 being a carrier glass for manufacturing a liquid crystal display panel, the carrier glass 110 being divided into a plurality of attachment areas 120 spaced apart from each other, the size of the attachment area 120 corresponding to the size of the silicon-based liquid crystal; a first adhesive layer 121 is arranged in each attachment area 120; one of the wafer 210 or the cover glass 310 of the silicon-based liquid crystal is attached to the carrier glass 110 through the first adhesive layer 121; the wafer 210 and the cover glass 310 are attached to obtain a silicon-based liquid crystal box body comprising the carrier glass 110; the silicon-based liquid crystal box body comprising the carrier glass 110 is de-bonded, the carrier glass 110 is removed, and a silicon-based liquid crystal box body is obtained. The method of the embodiment can produce the silicon-based liquid crystal box by means of the cell production equipment and the production line of the liquid crystal display panel, avoid using the special equipment of LCOS to attach the wafer 210 and the cover glass 310, and reduce the production cost; and the carrier glass 110 is divided into a plurality of attachment areas 120, a plurality of wafers 210 or cover glasses 310 can be attached, the cell production of the silicon-based liquid crystal can be batched, and the production efficiency is improved.

[0047] Optionally, the step S11 further comprises: setting a plurality of attachment areas 120 corresponding to the size of the wafer of the silicon-based liquid crystal on the carrier glass 110 by means of silk printing.

[0048] Specifically, the carrier glass 110 is provided with a plurality of attachment areas 120, the attachment areas 120 can be set by means of silk printing, and the attachment areas 120 include but are not limited to attachment shapes corresponding to the size of the wafer of the silicon-based liquid crystal.

[0049] Please refer to Figure 4 , Figure 4 is a flow diagram of the second embodiment of the cell production method of the silicon-based liquid crystal provided by the present application. As shown in Figure 4 , in the second embodiment, the cell production method comprises the following steps:

[0050] Step S21: Provide carrier glass, which is carrier glass used to manufacture liquid crystal display panels. Multiple spaced bonding areas corresponding to the wafer size of silicon-based liquid crystal are set on the carrier glass by screen printing.

[0051] The carrier glass 110 is provided with a plurality of bonding areas 120, which can be set by screen printing. The bonding areas 120 include, but are not limited to, bonding shapes corresponding to the wafer size of silicon-based liquid crystal.

[0052] Step S22: Set a limiting notch on the bonding area to define the placement position of the wafer.

[0053] Specifically, wafer 210 includes orientation grooves disposed at the edge of wafer 210 to mark the lattice orientation of wafer 210. For example... Figure 2 As shown, a limiting notch 122 is provided on the bonding area 120. The limiting notch 122 corresponds to the orientation groove of the wafer 210 to limit the placement position of the wafer 210 on the carrier glass 110.

[0054] Step S23: Apply a first adhesive layer to each bonding area.

[0055] Specifically, step S22 is the same as step S12, and will not be repeated here.

[0056] Step S24: The wafer is bonded to the bonding area through the limiting notch and the first colloid layer.

[0057] The limiting notch 122 set in the bonding area 120 corresponds to the orientation groove of the wafer 210, and the wafer 210 is bonded to the bonding area 120 through the first colloid layer 121.

[0058] Step S25: Bond the wafer to the cover glass to obtain a cell containing a silicon-based liquid crystal including a carrier glass.

[0059] Specifically, step S25 is the same as step S14, and will not be repeated here.

[0060] Step S26: De-adhesive is applied to the cell containing the silicon-based liquid crystal, including the carrier glass, to remove the carrier glass and obtain the silicon-based liquid crystal cell.

[0061] Specifically, step S26 is the same as step S15, and will not be repeated here.

[0062] In this embodiment, by providing a limiting notch 122 on the bonding area 120 corresponding to the orientation groove of the wafer 210, and bonding the wafer 210 into the bonding area 120 through the limiting notch 122 and the first colloid layer 121, the placement position of the wafer 210 on the carrier glass 110 is limited, thereby improving the bonding efficiency of the wafer 210.

[0063] Optionally, the step of setting a plurality of bonding areas 120 on the carrier glass 110 corresponding to the wafer size of the silicon-based liquid crystal by means of silk printing and bonding the cover glass 310 on the bonding areas 120 is similar to steps S21-S25, and will not be described here again.

[0064] Please refer to Figure 5 , Figure 5 is a structural schematic diagram of another embodiment of the carrier glass provided by the present application. As shown in Figure 5 , optionally, the bonding area 120 is provided with a groove for accommodating the wafer 210 or the cover glass 310; and step S13 comprises: setting a first glue layer 121 in the groove of the bonding area 120.

[0065] Specifically, the groove is used to accommodate the wafer 210 or the cover glass 310, and the first glue layer 121 is used to bond the wafer 210 or the cover glass 310 in the groove. In the optional embodiment, the method of slotting includes but is not limited to etching using hydrofluoric acid. Preferably, the thinnest part of the groove has a thickness of 100um-800um.

[0066] Please refer to Figure 6 , Figure 6 is a flowchart of a third embodiment of the cell forming method of the silicon-based liquid crystal provided by the present application. As shown in Figure 6 , in the third embodiment, the cell forming method comprises:

[0067] Step S31: providing a carrier glass 110, the carrier glass 110 being a carrier glass for manufacturing a liquid crystal display panel, the carrier glass 110 being divided into a plurality of bonding areas 120 spaced apart from each other, the size of the bonding area 120 corresponding to the wafer size of the silicon-based liquid crystal, and the bonding area 120 being provided with a groove for accommodating the wafer 210.

[0068] Specifically, the bonding area 120 of the carrier glass 110 is provided with a groove corresponding to the wafer size of the silicon-based liquid crystal, and the groove is used to accommodate the wafer 210.

[0069] Step S32: setting a first limiting part on the groove for defining the placement position of the wafer.

[0070] Specifically, when the wafer 210 of the silicon-based liquid crystal is bonded to the carrier glass 110, the first limiting part on the groove corresponds to the limiting notch 122 in the second embodiment, and the first limiting part provided on the groove corresponds to the orientation groove of the wafer 210, and is used to define the placement position of the wafer 210.

[0071] Step S33: setting a first glue layer in the groove of the bonding area.

[0072] A first glue layer 121 is arranged at the bottom of the groove of the bonding area 120, and the first glue layer 121 is used to bond the wafer 210 to the groove.

[0073] Step S34: Bond the wafer to the groove through the first limiting part and the first glue layer.

[0074] Please refer to Figure 7 , Figure 7 is Figure 6 The structure diagram of the cell of the silicon-based liquid crystal including the carrier glass. As shown in Figure 7 The orientation groove of the wafer 210 corresponds to the first limiting part of the groove, and the wafer 210 is bonded to the groove through the first glue layer 121.

[0075] Step S35: Bond the wafer to the cover glass to obtain the cell of the silicon-based liquid crystal including the carrier glass.

[0076] Specifically, step S35 is the same as step S14, and will not be repeated here.

[0077] Step S36: Delaminate the cell of the silicon-based liquid crystal including the carrier glass, remove the carrier glass, and obtain the silicon-based liquid crystal cell.

[0078] Specifically, step S36 is the same as step S15, and will not be repeated here.

[0079] In this embodiment, by arranging the first limiting part corresponding to the orientation groove of the wafer 210 on the groove, and bonding the wafer 210 to the bonding area 120 through the first limiting part and the first glue layer 121, the placement position of the wafer 210 on the carrier glass 110 is limited, and the bonding efficiency of the wafer 210 is improved.

[0080] Please refer to Figure 8 , Figure 8 is the flowchart of the fourth embodiment of the cell forming method of the silicon-based liquid crystal provided by the present application. As shown in Figure 8 The cell forming method of the silicon-based liquid crystal includes the following steps in the fourth embodiment:

[0081] Step S41: Provide a carrier glass, which is a carrier glass for manufacturing a liquid crystal display panel, and the carrier glass is divided into a plurality of bonding areas spaced apart from each other, the size of the bonding area corresponds to the size of the wafer of the silicon-based liquid crystal, and the bonding area is provided with a groove for accommodating the cover glass.

[0082] Specifically, the bonding area 120 of the carrier glass 110 is provided with a groove corresponding to the size of the wafer of the silicon-based liquid crystal, and the groove is used to accommodate the cover glass 310.

[0083] Step S42: Arrange a positioning part on the cover glass for limiting the bonding position of the wafer.

[0084] Specifically, when the cover glass 310 of the silicon-based liquid crystal is attached to the carrier glass 110, in order to facilitate the subsequent attachment of the cover glass 310 to the wafer 210, a positioning portion for defining the attachment position of the wafer 210 can be arranged on the cover glass 310.

[0085] Step S43: A second limiting portion corresponding to the positioning portion is arranged on the groove.

[0086] Correspondingly, the second limiting portion corresponding to the positioning portion of the cover glass 310 is arranged on the groove. Alternatively, the positioning portion of the cover glass 310 and the second limiting portion of the groove both correspond to the first limiting portion in the third embodiment.

[0087] Step S44: A first adhesive layer is arranged in the groove of the attachment area.

[0088] The first adhesive layer 121 is arranged at the bottom of the groove of the attachment area 120, and the first adhesive layer 121 is used to attach the cover glass 310 to the groove.

[0089] Step S45: The cover glass 310 is attached to the attachment area 120 by the second limiting portion and the first adhesive layer 121.

[0090] Please refer to Figure 9 , Figure 9 is Figure 8 the structure diagram of the cell of the silicon-based liquid crystal including the carrier glass. As shown in Figure 9 , the positioning portion of the cover glass 310 corresponds to the second limiting portion of the groove, and the cover glass 310 is attached to the attachment area 120 by the first adhesive layer 121.

[0091] Step S46: The wafer 210 is attached to the cover glass 310 to obtain the cell of the silicon-based liquid crystal including the carrier glass 110.

[0092] Specifically, step S46 is the same as step S14, which will not be described here.

[0093] Step S47: The cell of the silicon-based liquid crystal including the carrier glass 110 is de-glued, the carrier glass 110 is removed, and the cell of the silicon-based liquid crystal is obtained.

[0094] Specifically, step S47 is the same as step S15, which will not be described here.

[0095] In this embodiment, by arranging the positioning portion corresponding to the orientation groove of the wafer 210 on the cover glass 310, arranging the second limiting portion corresponding to the positioning portion on the groove, and attaching the cover glass 310 to the attachment area 120 by the second limiting portion and the first adhesive layer 121, the position of the wafer 210 when attached to the cover glass 310 is defined.

[0096] Optionally, the cover glass 310 is a cover glass for manufacturing liquid crystal display panel.

[0097] Specifically, in the fifth embodiment, the size of the cover glass 310 can be the same as the size of the cover glass in the LCD production line. At this time, when the cover glass 310 is attached to the carrier glass 110, the size of the attachment area 120 of the carrier glass 110 corresponds to the size of the cover glass in the LCD production line.

[0098] Since the carrier glass 110 and the cover glass 310 have the same size as the existing LCD production line, the carrier glass 110, the cover glass 310 and the production equipment of the LCD in the LCD production line can be used to produce the silicon-based liquid crystal. Unlike the prior art, which uses special equipment to produce silicon-based liquid crystal, the cell forming method of the present application has lower production cost and is conducive to the further development of silicon-based liquid crystal.

[0099] In the sixth embodiment, the way of attaching the wafer 210 or the cover glass 310 to the carrier glass 110 includes any one of the above-mentioned cell forming methods. After the wafer 210 or the cover glass 310 is attached to the carrier glass 110, step S14 further includes: providing a second adhesive layer 410 on the side of the wafer 210 facing the cover glass 310, and attaching the wafer 210 and the cover glass 310 through the second adhesive layer 410; or providing a second adhesive layer 410 on the side of the cover glass 310 facing the wafer 210, and attaching the wafer 210 and the cover glass 310 through the second adhesive layer 410.

[0100] In an optional embodiment, a second adhesive layer 410 is provided on the side of the wafer 210 facing the cover glass 310, and the second adhesive layer 410 is used to attach the wafer 210 and the cover glass 310, so as to obtain a cell body of the silicon-based liquid crystal including the carrier glass 110.

[0101] Alternatively, a second adhesive layer 410 is provided on the side of the cover glass 310 facing the wafer 210, and the wafer 210 and the cover glass 310 are attached through the second adhesive layer 410, so as to obtain a cell body of the silicon-based liquid crystal including the carrier glass 110.

[0102] Specifically, the second adhesive layer 410 is provided on the wafer 210 or the cover glass 310, and a liquid crystal space (not shown in the figure) is formed, which is used to accommodate liquid crystal. After the second adhesive layer 410 is heat-cured, the second adhesive layer 410 hardens, so that the wafer 210 and the cover glass 310 are fixed to form a cell, so as to obtain a cell body of the silicon-based liquid crystal including the carrier glass 110.

[0103] Further, the cover glass 310 and the wafer 210 are respectively provided with an alignment film layer.

[0104] Specifically, the cover glass 310 and the wafer 210 are each provided with an alignment layer, which includes, but is not limited to, a polyimide (PI) layer. The alignment layer is used to orient the liquid crystal molecules in the silicon-based liquid crystal cell. After the alignment layer is applied to the cover glass 310 and the wafer 210, the alignment layer can be rubbed to allow the liquid crystal molecules to align in an orderly manner according to the direction of the grooves generated by the rubbing.

[0105] Furthermore, before the wafer 210 is bonded to the cover glass 310 or after the silicon-based liquid crystal cell is obtained, the method for forming a silicon-based liquid crystal cell also includes: injecting liquid crystal into the silicon-based liquid crystal cell.

[0106] Specifically, such as Figure 7 or Figure 9 As shown, a second colloidal layer 410 is disposed on one side of the cover glass 310 or the wafer 210. The second colloidal layer 410 is a frame-shaped colloidal layer and is disposed at the edge of the cover glass 310 or the wafer 210, so that a liquid crystal space is formed inside the second colloidal layer 410, which is used to contain liquid crystal. In one embodiment, before the wafer 210 is bonded to the cover glass 310, a certain amount of liquid crystal can be directly filled into the liquid crystal space of the second colloidal layer 410, and the wafer 210 is bonded to the cover glass 310 after the liquid crystal filling is completed to obtain a silicon-based liquid crystal cell.

[0107] In another embodiment, after obtaining the silicon-based liquid crystal cell, the step of filling the silicon-based liquid crystal cell with liquid crystal includes: providing a filling port, the filling port being disposed on the second colloidal layer 410; and filling the silicon-based liquid crystal cell with liquid crystal through the filling port to obtain the silicon-based liquid crystal cell.

[0108] Specifically, the silicon-based liquid crystal cell is provided with a crystal filling port, which is used to fill liquid crystal into the liquid crystal space inside the silicon-based cell. The crystal filling port can be located on the side of the second colloidal layer 410 or on the cover glass 310.

[0109] Optionally, after obtaining the silicon-based liquid crystal cell, the silicon-based liquid crystal cell can be cut to obtain a silicon-based liquid crystal chip.

[0110] This application also proposes a silicon-based liquid crystal cell, which is fabricated by the silicon-based liquid crystal cell assembly method described in any of the above embodiments. Specifically, the silicon-based liquid crystal cell includes a wafer 210 and a cover glass 310. Specifically, the cover glass 310 can also be a cover glass for fabricating a liquid crystal display panel, and the cover glass can be square glass.

[0111] Different from the prior art, the application obtains a silicon-based liquid crystal box body including the carrier glass 110 by loading the wafer 210 or the cover glass 310 on the carrier glass 110 for preparing a liquid crystal display panel, then adhering the wafer 210 and the cover glass 310, and then removing the carrier glass 110 by delaminating the silicon-based liquid crystal box body including the carrier glass 110, thereby avoiding the use of special equipment for adhering the wafer 210 and the cover glass 310, and reducing the production cost; the carrier glass 110 is divided into multiple adhering areas, multiple wafers 210 or cover glasses 310 can be adhered, the silicon-based liquid crystal box can be formed in batches, and the production efficiency is improved; and the protection of the carrier glass 110 can partially offset the stress generated when the wafer 210 and the cover glass 310 are adhered, so that the wafer 210 and the cover glass 310 are not easily damaged, which is conducive to the further development of the silicon-based liquid crystal.

[0112] The above description is only an embodiment of the application, and does not limit the patent scope of the application, and any equivalent structure or equivalent process transformation using the content of the specification and drawings, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the application.

Claims

1. A method of cell assembly of a silicon-based liquid crystal, characterized by, The application relates to a carrier glass for manufacturing a liquid crystal display panel, which is divided into a plurality of mutually spaced bonding areas corresponding to the size of a wafer of a silicon-based liquid crystal. A first adhesive layer is arranged in each bonding area. One of the wafer of the silicon-based liquid crystal or a cover plate glass is bonded to the carrier glass through the first adhesive layer. The wafer and the cover plate glass are bonded to obtain a silicon-based liquid crystal cell including the carrier glass. The carrier glass is removed by delamination to obtain a silicon-based liquid crystal cell. The plurality of mutually spaced bonding areas corresponding to the size of the wafer of the silicon-based liquid crystal are arranged on the carrier glass by silk printing.

2. The cell-assembling method according to claim 1, wherein Before the first adhesive layer is arranged in each bonding area, the application comprises the following steps: A limiting notch is arranged on the bonding area to define the placement position of the wafer.

3. The cell-assembling method according to claim 2, wherein The wafer is bonded to the bonding area through the limiting notch and the first adhesive layer. A groove is arranged on the bonding area to accommodate the wafer or the cover plate glass. The first adhesive layer is arranged in the groove of the bonding area. Before the first adhesive layer is arranged in the groove of the bonding area, the application comprises the following steps:

4. The cell-assembling method according to claim 1, wherein A first limiting part is arranged on the groove to define the placement position of the wafer. The wafer is bonded to the groove through the first limiting part and the first adhesive layer.

5. The cell-assembling method according to claim 4, wherein Before the first adhesive layer is arranged in the groove of the bonding area, the application comprises the following steps: A positioning part is arranged on the cover plate glass to define the bonding position of the wafer. A second limiting part corresponding to the positioning part is arranged on the groove. The wafer is bonded to the bonding area through the second limiting part and the first adhesive layer.

6. The cell-assembling method according to claim 4, wherein The cover plate glass is a square glass for manufacturing a liquid crystal display panel. The wafer and the cover plate glass are bonded through a second adhesive layer arranged on one side of the wafer facing the cover plate glass, or through a second adhesive layer arranged on one side of the cover plate glass facing the wafer. An alignment film layer is arranged on the cover plate glass and the wafer respectively. A silicon-based liquid crystal cell manufactured by the cell manufacturing method of any one of claims 1-9. ​ 7. The cell-assembling method according to claim 1, wherein ​ 8. The method of claim 1-7, wherein, ​ ​ ​ 9. The cell-assembling method according to claim 8, wherein ​ 10. A liquid crystal cell on silicon, characterized in that ​

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