Heat Dissipation Control Method and Device, Inverter, Energy Storage Power Supply and Storage Medium

Abstract

The present invention discloses a heat dissipation control method, a heat dissipation control device, an inverter, an energy storage power supply, and a storage medium. The heat dissipation control method is applied to an inverter, and the inverter includes a fan and a power device. The method includes obtaining the junction temperature and the junction temperature change rate of the power device; controlling the rotation speed of the fan according to the junction temperature and the junction temperature change rate. By obtaining the junction temperature of the power device in the inverter to control the rotation speed of the fan, the fan can accurately and timely dissipate heat from the power device. By obtaining the junction temperature change rate of the power device in the inverter to control the rotation speed of the fan, the fan can control the heat dissipation of the power device in advance and in a timely manner, avoiding the delay and lag of the fan in controlling the heat dissipation of the power device when the temperature of the power device is relatively low but the temperature rise rate is very high. Furthermore, the present application can maximize the reduction of the power consumption of the fan while ensuring the heat dissipation effect of the power device, achieving a balance between the heat dissipation effect and the power consumption.

Description

Technical Field

[0001] The present application relates to the technical field of inverters, and more particularly, to a heat dissipation control method, a heat dissipation control device, an inverter, an energy storage power supply, and a storage medium. Background Art

[0002] As one of the core parts of an energy storage power supply, for an inverter to be at a relatively high level in terms of compact structure and high-power operation, it is necessary to control the thermal management of the inverter, that is, to dissipate heat from the power devices of the inverter.

[0003] Currently, when the inverter uses liquid cooling or phase change cooling to dissipate heat from the power devices, it is necessary to arrange a large number of pipelines beside the power devices for the heat-absorbing liquid to flow through. However, considering the structural sealing of the inverter, the maintenance of the heat dissipation module, and the weight of the inverter, using air cooling does not require adding a complex pipeline structure. However, during air cooling, if it is always at the maximum power, although the heat dissipation effect is good, the power consumption is large, reducing the endurance of the energy storage power supply. If the power is insufficient, although the power consumption is small, the heat dissipation effect is poor. Therefore, there is an urgent need for a heat dissipation control scheme that balances power consumption and heat dissipation effect. Summary of the Invention

[0004] Embodiments of the present application provide a heat dissipation control method, a heat dissipation control device, an inverter, an energy storage power supply, and a storage medium.

[0005] The heat dissipation control method of the embodiments of the present application is applied to an inverter. The inverter includes a fan and power devices. The heat dissipation control method includes obtaining the junction temperature and the junction temperature change rate of the power devices; and controlling the rotation speed of the fan according to the junction temperature and the junction temperature change rate.

[0006] The inverter of the embodiments of the present application includes a bottom plate, a radiator, an air duct assembly, a fan, and a plurality of power devices. The radiator and the air duct assembly are both arranged on the bottom plate. The air duct assembly and the bottom plate enclose an air duct. The fan is arranged at the air outlet of the air duct. At least part of the radiator is arranged in the air duct. The plurality of power devices are arranged on the radiator. The rotation speed of the fan is determined according to the junction temperature and the junction temperature change rate of the power devices.

[0007] The energy storage power supply according to the embodiment of the present application includes a controller and an inverter. The inverter includes a bottom plate, a radiator, an air duct assembly, a fan, and a plurality of power devices. The radiator and the air duct assembly are both arranged on the bottom plate. The air duct assembly and the bottom plate enclose an air duct. The fan is arranged at the air outlet of the air duct. At least part of the radiator is arranged in the air duct. The plurality of power devices are arranged on the radiator. The rotation speed of the fan is determined according to the junction temperature and the junction temperature change rate of the power devices. The controller is used to control the rotation speed of the fan according to the junction temperature and the junction temperature change rate of the power devices.

[0008] The heat dissipation control device according to the embodiment of the present application is applied to an inverter. The inverter includes a fan and a power device. The heat dissipation control device includes an acquisition module and a control module. The acquisition module is used to acquire the junction temperature and the junction temperature change rate of the power device; the control module is used to control the rotation speed of the fan according to the junction temperature and the junction temperature change rate.

[0009] The non-volatile computer storage medium according to the embodiment of the present application stores a computer program thereon. When the computer program is executed by a processor, the processor can acquire the junction temperature and the junction temperature change rate of the power device; and control the rotation speed of the fan according to the junction temperature and the junction temperature change rate.

[0010] A heat dissipation control method, a heat dissipation control device, an inverter, an energy storage power supply, and a storage medium according to the embodiment of the present application control the rotation speed of a fan by acquiring the junction temperature of a power device in the inverter, which can enable the fan to dissipate heat from the power device accurately and in a timely manner. Compared with controlling the rotation speed of the fan by using the measured temperature of the power device, the uncertainty caused by the difference between the measured temperature and the junction temperature of the power device in fan control is eliminated; by acquiring the junction temperature change rate of the power device in the inverter to control the rotation speed of the fan, the fan can control the heat dissipation of the power device in advance and in a timely manner, avoiding the delay and lag of the fan in controlling the heat dissipation of the power device when the temperature of the power device is low but the temperature rise rate is large. Furthermore, while ensuring the heat dissipation effect of the power device, the power consumption of the fan can be minimized, and the balance between the heat dissipation effect and the power consumption can be achieved.

[0011] The additional aspects and advantages of the embodiment of the present application will be partially given in the following description, partially become obvious from the following description, or be understood through the practice of the embodiment of the present application. Description of the Drawings

[0012] The above and / or additional aspects and advantages of the present application will become obvious and easy to understand from the description of the embodiment in conjunction with the following drawings, where:

[0013] Figure 1It is a schematic flowchart of the heat dissipation control method for some embodiments of the present application;

[0014] Figure 2 It is a schematic structural diagram of an inverter for some embodiments of the present application;

[0015] Figure 3 It is a schematic structural diagram of an inverter and a fan for some embodiments of the present application;

[0016] Figure 4 It is a schematic structural diagram of an energy storage power supply for some embodiments of the present application;

[0017] Figure 5 It is a schematic flowchart of the heat dissipation control method for some embodiments of the present application;

[0018] Figure 6 It is a schematic flowchart of the heat dissipation control method for some embodiments of the present application;

[0019] Figure 7 It is a schematic diagram of the first thermal network model for some embodiments of the present application;

[0020] Figure 8 It is a schematic diagram of the second thermal network model for some embodiments of the present application;

[0021] Figure 9 It is a schematic structural diagram of a power device for some embodiments of the present application;

[0022] Figure 10 It is a schematic flowchart of the heat dissipation control method for some embodiments of the present application;

[0023] Figure 11 It is a schematic flowchart for solving the first set of equations of the first thermal network model for some embodiments of the present application;

[0024] Figure 12 It is a schematic flowchart for solving the second set of equations of the second thermal network model for some embodiments of the present application;

[0025] Figure 13 It is a schematic flowchart of the heat dissipation control method for some embodiments of the present application;

[0026] Figure 14 It is a schematic module diagram of a data sending device for some embodiments of the present application;

[0027] Figure 15 It is a schematic diagram of the connection state between a non - volatile computer storage medium and a processor for some embodiments of the present application. Specific embodiments

[0028] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, in which the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the embodiments of the present application, and should not be construed as a limitation to the embodiments of the present application.

[0029] Please refer to Figures 1 to 4 , an embodiment of the present application provides a heat dissipation control method, which is applied to an inverter 100. The inverter 100 includes a fan 200 and a power device 50. The heat dissipation control method includes:

[0030] Step 011: Obtain the junction temperature and the junction temperature change rate of the power device 50.

[0031] Among them, the inverter 100 in the embodiment of the present application can be a converter that can realize the mutual conversion of DC electrical energy and AC electrical energy with a fixed frequency and fixed voltage or variable frequency and variable voltage. For example, the inverter 100 can convert DC electrical energy (such as a battery, a storage battery, etc.) into AC electrical energy, or convert AC electrical energy into DC electrical energy, or can convert low voltage into high voltage and high voltage into low voltage.

[0032] The inverter 100 in the embodiment of the present application includes a power device 50 and a fan 200. The inverter 100 also includes a transformer 51 and an inductor 52. For example, the power device 50 can be an Insulated Gate Bipolar Transistor (IGBT) and a Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET), etc. The power device 50, the transformer 51, the inductor 52, etc. will generate heat during operation, so that the overall temperature of the inverter 100 rises. The fan 200 can deliver air flow to the inverter 100 and take away the heat generated by each device in the inverter 100 through the air flow, thereby reducing the temperature of the inverter 100.

[0033] The junction temperature of the power device 50 can be the actual highest temperature of the semiconductor chip (such as a wafer, a die) in the electronic device. Here, it can be the temperature of the power device 50 during actual operation; the junction temperature change rate of the power device 50 is used to characterize the change of the junction temperature of the power device 50 within a preset time.

[0034] Optionally, a temperature sensor for detecting the temperature of the power device 50 is further provided in the energy storage power supply 1000. Furthermore, the inverter 100 determines the junction temperature and the junction temperature change rate of the power device 50 based on the temperatures detected by the temperature sensor.

[0035] Step 012: Control the rotational speed of the fan 200 according to the junction temperature and the rate of change of the junction temperature.

[0036] Specifically, the inverter 100 according to the embodiment of the present application is further configured to control the rotational speed of the fan 200 according to the junction temperature and the rate of change of the junction temperature.

[0037] Optionally, taking the MOS transistor in the inverter 100 as an example of the power device 50, the higher the junction temperature, the faster the cooling is required at this time to prevent the temperature from continuing to rise and exceeding the temperature limit of the power device 50, which may affect the performance of the power device 50 or even damage the power device 50. At this time, the fan 200 can be controlled to operate at a relatively high rotational speed; conversely, the lower the junction temperature, the farther the temperature of the power device 50 is from reaching the temperature limit of the power device 50, and the fan 200 can be controlled to operate at a relatively low rotational speed, thereby saving power consumption.

[0038] Considering the rate of change of the junction temperature, the advance and timeliness of the heat dissipation control can be ensured. In the case where the junction temperature is relatively low but the rate of change of the junction temperature is relatively high, the rotational speed of the fan 200 should also be increased to rapidly cool down in advance, preventing the rotational speed of the fan 200 from being increased after the junction temperature changes, resulting in cooling delay and hysteresis, thereby further improving the heat dissipation effect.

[0039] In this way, by combining the junction temperature and the rate of change of the junction temperature to jointly control the rotational speed of the fan 200, the fan 200 can accurately and timely dissipate heat from the power device 50. Compared with controlling the rotational speed of the fan 200 by using the measured temperature of the power device 50, the uncertainty caused by the difference between the measured temperature and the junction temperature of the power device 50 to the control of the fan 200 is eliminated; by obtaining the rate of change of the junction temperature of the power device 50 in the inverter 100 to control the rotational speed of the fan 200, the fan 200 can advance and timely control the heat dissipation of the power device 50, avoiding the delay and hysteresis of the fan 200 in controlling the heat dissipation of the power device 50 when the temperature of the power device 50 is relatively low but the temperature rise rate is very large. Furthermore, while ensuring the heat dissipation effect of the power device 50, the power consumption of the fan 200 can be minimized, achieving the balance between the heat dissipation effect and the power consumption.

[0040] Please refer to Figure 5 , in some embodiments, Step 011: Obtain the junction temperature and the rate of change of the junction temperature of the power device 50, including:

[0041] Step 0111: Obtain the maximum junction temperature and the maximum rate of change of the junction temperature of multiple power devices 50;

[0042] Step 012: Control the rotational speed of the fan 200 according to the junction temperature and the rate of change of the junction temperature, including:

[0043] Step 0121: Control the rotational speed of the fan 200 according to the maximum junction temperature and the maximum rate of change of the junction temperature.

[0044] Specifically, a plurality of power devices 50 are provided in the inverter 100 according to an embodiment of the present application. The inverter 100 controls the rotation speed of the fan 200 according to the maximum value of the junction temperatures among all the junction temperatures corresponding to the plurality of power devices 50 and the maximum value of the change rates among all the junction temperature change rates.

[0045] For example, when the inverter 100 includes a power device A, a power device B, and a power device C, the inverter 100 first obtains that the junction temperatures of the power device A, the power device B, and the power device C are T jA , T jB and T jC respectively, and the junction temperature change rates of the three are G A , G B and G C respectively.

[0046] Then, the inverter 100 determines the maximum value Max1 among T jA , T jB and T jC and the maximum value Max2 among G A , G B and G C. respectively.

[0047] Finally, the inverter 100 controls the rotation speed of the fan 200 according to Max1 and Max2. For example, when the sum of Max1 and Max2 is greater than the first preset threshold and less than or equal to the second preset threshold, the fan 200 is controlled to operate in "gear 1"; when the sum of Max1 and Max2 is greater than the second preset threshold, the fan 200 is controlled to operate in "gear 2". Among them, the higher the gear of the fan 200, the higher its rotation speed.

[0048] In this way, by obtaining the maximum junction temperature and the maximum junction temperature change rate of the plurality of power devices 50 to control the rotation speed of the fan 200, the heat dissipation effect is maximally guaranteed.

[0049] Please refer to Figure 3 and Figure 6 , in some embodiments, the power device 50 includes a plurality of them. The inverter 100 further includes a radiator 30, a first temperature measuring device 70, a second temperature measuring device 80, and a third temperature measuring device 90. The inverter 100 forms an air duct 60. The air duct 60 includes an air inlet 61 and an air outlet 62. The fan 200 is provided at the air outlet 62. The plurality of power devices 50 are provided on the radiator 30. The first temperature measuring device 70 is provided at one end of the radiator 30 close to the fan 200. The second temperature measuring device 80 is provided at the air inlet 61. The third temperature measuring device 90 is provided at the air outlet 62. The heat dissipation control method further includes:

[0050] Step 013: Establish a first thermal network model for multiple power devices 50 and the heat sink 30, and a second thermal network model for a single power device 50;

[0051] Step 014: Construct a first system of equations according to the first thermal network model and a second system of equations according to the second thermal network model;

[0052] Step 015: Calculate the junction temperature corresponding to each power device 50 based on the first system of equations, the second system of equations, the current of the power device 50, the first temperature collected by the first temperature measuring device 70, the second temperature collected by the second temperature measuring device 80, the third temperature collected by the third temperature measuring device 90, the first preset parameter of the heat sink 30, and the second preset parameter of the power device 50.

[0053] Specifically, please refer to Figure 3 , the inverter 100 of the embodiment of the present application forms an air duct 60. The air duct 60 includes an air inlet 61 and an air outlet 62, and the fan 200 is arranged at the air outlet 62; there are multiple power devices 50. For example, the number of MOS transistors can be 4. The inverter 100 further includes a heat sink 30, a first temperature measuring device 70, a second temperature measuring device 80, a third temperature measuring device 90, etc. By arranging multiple power devices 50 on the heat sink 30, the heat sink 30 can dissipate the heat generated by the multiple power devices 50. The first temperature measuring device 70, the second temperature measuring device 80, and the third temperature measuring device 90 can be thermocouple temperature measuring devices, infrared temperature measuring devices, etc. The first temperature measuring device 70 is arranged at one end of the heat sink 30 close to the fan 200, the second temperature measuring device 80 is arranged at the air inlet 61, and the third temperature measuring device 90 is arranged at the air outlet 62.

[0054] In the embodiment of the present application, in order to accurately estimate the junction temperature of each power device 50, a first thermal network model is established for the heat sink 30 and all power devices 50 in the inverter 100; at the same time, in the embodiment of the present application, a second thermal network model is also established for one of the power devices 50 in the inverter 100. Furthermore, the embodiment of the present application can accurately calculate the junction temperature of the inverter 100 and each power device 50 in the inverter 100 through the first thermal network model and the second thermal network model.

[0055] Taking the number of power devices 50 being 4 as an example, please refer to Figure 7 and Figure 8 , Figure 7 is a schematic diagram of the first thermal network model in some embodiments of the present application, Figure 8 is a schematic diagram of the second thermal network model in some embodiments of the present application.

[0056] The embodiment of the present application also establishes a first set of equations based on the first thermal network model; meanwhile, the embodiment of the present application will establish a second set of equations based on the second thermal network model.

[0057] Finally, the embodiment of the present application also respectively collects the temperature T at the end of the radiator 30 m (i.e., the first temperature), the temperature T at the air inlet 61 of the air duct 60 in (i.e., the second temperature), and the temperature T at the air outlet 62 of the air duct 60 out (i.e., the third temperature) by the first temperature measuring device 70, the second temperature measuring device 80, and the third temperature measuring device 90, and solves the first set of equations and the second set of equations in combination with the first preset parameters of the radiator 30 and the second preset parameters of the power device 50, so as to obtain the junction temperature of each power device 50.

[0058] It can be understood that the specific forms of the first set of equations and the second set of equations in the embodiment of the present application can be determined according to the thermal network model established according to the actual situation.

[0059] Optionally, the radiator 30 further includes a heat dissipation plate 31 and a ceramic heat sink 32. The power device 50 is disposed on the ceramic heat sink 32, and the ceramic heat sink 32 is disposed on the heat dissipation plate 31. The first preset parameters can be obtained from materials such as the specification book when the inverter 100 leaves the factory. The first preset parameters include the thermal resistance and heat capacity of the ceramic heat sink 32, the thermal resistance and heat capacity of the radiator 30 (specifically, the heat dissipation plate 31), the thermal resistance and heat capacity of the radiator 30 in the air outlet direction (as Figure 2 and Figure 3 shown, the air outlet direction can be the direction in which the air duct 60 extends, that is, the direction represented by L), the thermal resistance and heat capacity of heat transfer in the air outlet direction, the convective heat transfer resistance between the air flow and the radiator 30. The convective heat transfer resistance is determined according to the convective heat transfer area and the convective heat transfer coefficient. The convective heat transfer area is determined according to the surface area of the radiator 30, and the convective heat transfer coefficient is determined according to the Nusselt Nu correlation.

[0060] Optionally, please refer to Figure 9 , the power device 50 includes a chip solder layer 501, a DBC layer 502, a substrate solder layer 503, and a substrate 504. The second preset parameters include the thermal resistance and heat capacity of the chip solder layer 501, the thermal resistance and heat capacity of the DBC layer 502, the thermal resistance and heat capacity of the substrate solder layer 503, and the thermal resistance and heat capacity of the substrate 504. The second preset parameters can be obtained from materials such as the specification book when the inverter 100 leaves the factory. Furthermore, the first set of equations and the second set of equations in the embodiment of the present application can be expressed in the following form, that is:

[0061] The first set of equations:

[0062] (1)

[0063] (2)

[0064] (3)

[0065] (4)

[0066] (5)

[0067] (6)

[0068] (7)

[0069] (8)

[0070] Among them, R c and C c respectively correspond to the thermal resistance and heat capacity of the ceramic heat sink 32 of the radiator 30. R h and C h respectively correspond to the thermal resistance and heat capacity of the radiator 30. R and C ht respectively correspond to the thermal resistance and heat capacity of heat transfer in the air outlet direction of the radiator 30. R f is the convective heat transfer thermal resistance between the air flow and the radiator 30. T m is the first temperature collected by the first temperature measuring device 70. T f can be obtained by calculating the difference according to the second temperature T in collected by the second temperature measuring device 80 and the third temperature T out collected by the third temperature measuring device 90. For example, T f is the value obtained by linearly interpolating the difference between T in and T out . T H is the temperature at the corresponding position of the MOS transistor on the radiator 30 and is the intermediate calculated value of the first set of equations. T K is the board temperature of the MOS transistor, and t is the temperature sampling interval time. Furthermore, the board temperature T k of each MOS transistor can be calculated through the first set of equations.

[0071] The second set of equations can be expressed as follows:

[0072] (9)

[0073] (10)

[0074] (11)

[0075] (12)

[0076] Wherein, P is the thermal loss value transferred outward by the MOS transistor, R and C respectively correspond to the thermal resistance and heat capacity of different layers of the MOS transistor, t is the temperature sampling interval time, and T j is the junction temperature of the MOS transistor, and T is the temperature of different layers of the MOS transistor.

[0077] After the current of the power device 50 is collected, the first temperature T collected by the first temperature measuring device 70 m and the second temperature T collected by the second temperature measuring device 80 in and the third temperature T collected by the third temperature measuring device 90 out are obtained, and after the first preset parameter and the second preset parameter are obtained, the junction temperature of each MOS transistor can be calculated by combining the first equation set and the second equation set.

[0078] Please refer to Figure 10 , in some embodiments, step 015: According to the first equation set, the second equation set, the current of the power device 50, the first temperature collected by the first temperature measuring device 70, the second temperature collected by the second temperature measuring device 80, the third temperature collected by the third temperature measuring device 90, the first preset parameter of the heat sink 30, and the second preset parameter of the power device 50, calculating the junction temperature corresponding to each power device 50 includes:

[0079] Step 0151: According to the second equation set, the board temperature and junction temperature of each power device 50 at the (N-1)th moment (the 0th moment is the initial moment), the current of each power device 50 at the Nth moment, and the second preset parameter, calculate the junction temperature and the externally expanded heat dissipation power consumption of each power device 50 at the Nth moment, wherein N is a positive integer, and the board temperature and junction temperature of each power device 50 at the 0th moment can be determined according to the ambient temperature at the 0th moment (such as using the first temperature, the second temperature, or the third temperature (or the average value of the three) as the ambient temperature);

[0080] Step 0152: According to the first equation set, the board temperature of each power device 50 at the (N-1)th moment, the externally expanded heat dissipation power consumption and junction temperature at the Nth moment, the first temperature, the second temperature, and the third temperature at the Nth moment, and the first preset parameter, calculate the board temperature of each power device 50 at the Nth moment;

[0081] Steps 0151 and 0152 are executed in a loop.

[0082] For a clearer description of the embodiments of the present application, please refer to Figure 10 and Figure 11 .

[0083] Specifically, based on the above formulas (9) to (12), the junction temperature and thermal power consumption of the MOS transistor can be deduced, that is, as shown in formula (13), that is:

[0084] (13)

[0085] Among them, the externally extended heat dissipation power consumption P of the power device 50 out will have a corresponding relationship P j due to the current I flowing through the power device 50 and the junction temperature T of the power device 50 out = F(I, T j ).

[0086] At this time, the board temperature T k and the junction temperature T j of each power device 50 at the (N - 1)-th moment (such as the 0-th moment, the 1-st moment) can be used as the initial values for iterative solution calculation of the second thermal network model, input into the second set of equations, and then combined with the current current of each power device 50 at the N-th moment (such as the 1-st moment, the 2-nd moment) and the second preset parameter to calculate the junction temperature T j and the externally extended heat dissipation power consumption P out of each power device 50 at the N-th moment (such as the 1-st moment, the 2-nd moment).

[0087] Then, the board temperature T k of each power device 50 at the (N - 1)-th moment (such as the 0-th moment, the 1-st moment), the externally extended heat dissipation power consumption P out at the N-th moment (such as the 1-st moment, the 2-nd moment), and the junction temperature T j at the N-th moment (such as the 1-st moment, the 2-nd moment) can be used as the initial values for iterative solution calculation of the first thermal network model, input into the first set of equations, and then combined with the first temperature T m at the N-th moment (such as the 1-st moment, the 2-nd moment), the second temperature T in at the N-th moment (such as the 1-st moment, the 2-nd moment), and the third temperature T out at the N-th moment (such as the 1-st moment, the 2-nd moment), and the first preset parameter to calculate the board temperature T k of each power device 50 at the N-th moment (such as the 1-st moment, the 2-nd moment).

[0088] In this way, by repeatedly executing step 0151 and step 0152, the board temperature T k at any moment, the junction temperature T j and the externally extended heat dissipation power consumption P out can be calculated.

[0089] Among them, the board temperature T k and the junction temperature T j at the 0-th moment can be determined according to the ambient temperature at the 0-th moment (such as using the first temperature, the second temperature, or the third temperature (or the average value of the first temperature, the second temperature, and the third temperature) as the ambient temperature).

[0090] For example, when calculating the junction temperature T j and the externally extended heat dissipation power consumption P outAt time 0, the board temperature T of each power device 50 at time 0 is obtained by measuring the ambient temperature at time 0 k and the junction temperature T of each power device 50 at time 0 j , by taking the board temperature T at time 0 k and the junction temperature T of each power device 50 at time 0 j as the initial values for iterative solution calculation of the second thermal network model, inputting them into the second set of equations, and then combining the current current of each power device 50 at time 1 and the second preset parameter, calculating the junction temperature T of each power device 50 at time 1 j and the externally extended heat dissipation power P out ; when calculating the board temperature T at time 1 k , the board temperature T of each power device 50 at time 0 k , the externally extended heat dissipation power P at time 1 out and the junction temperature T at time 1 j can be used as the initial values for iterative solution calculation of the first thermal network model, inputting them into the first set of equations, and then combining the first temperature T at time 1 m , the second temperature T in and the third temperature T out , and the first preset parameter, calculating the board temperature T of each power device 50 at time 1 k .

[0091] For another example, when calculating the junction temperature T at time 2 j and the externally extended heat dissipation power P out , the board temperature T of each power device 50 at time 1 is obtained by measuring the ambient temperature at time 1 k and the junction temperature T j , by taking the board temperature T at time 1 k and the junction temperature T j as the initial values for iterative solution calculation of the second thermal network model, inputting them into the second set of equations, and then combining the current current of each power device 50 at time 2 and the second preset parameter; when calculating the board temperature T at time 2 k , the board temperature T of each power device 50 at time 1 k , the externally extended heat dissipation power P at time 2 out and the junction temperature T at time 2 j can be used as the initial values for iterative solution calculation of the first thermal network model, inputting them into the first set of equations, and then combining the first temperature T at time 2 m , the second temperature T in and the third temperature T out , and the first preset parameter, calculating the board temperature T of each power device 50 at time 2 k .

[0092] In this way, steps 0151 and 0152 are executed cyclically. By using iterative calculation, the board temperature of each power device 50 output by step 0152 is used as the input of step 0151, and the thermal power consumption of each power device 50 output by step 0151 is used as the input of step 0152. Moreover, each time step 0151 is executed, the junction temperature of each power device 50 at the current moment can be output, thus facilitating the realization of the rotational speed control of the fan 200 based on the junction temperature of the power device 50.

[0093] Please refer to again Figure 9 , in some embodiments, the heat sink 30 further includes a ceramic heat sink 32. The power device 50 is disposed on the ceramic heat sink 32. The first preset parameters include the thermal resistance and heat capacity of the ceramic heat sink 32, the thermal resistance and heat capacity of the heat sink 30, the thermal resistance and heat capacity of the heat transfer of the heat sink 30 in the air outlet direction, and the convective heat transfer resistance between the air flow and the heat sink 30. The convective heat transfer resistance is determined according to the convective heat transfer area and the convective heat transfer coefficient. The convective heat transfer area is determined according to the surface area of the heat sink 30, and the convective heat transfer coefficient is determined according to the Nusselt Nu correlation.

[0094] The power device 50 includes a chip solder layer 501, a DBC layer 502, a substrate solder layer 503, and a substrate 504. The second preset parameters include the thermal resistance and heat capacity of the chip solder layer 501, the thermal resistance and heat capacity of the DCB layer, the thermal resistance and heat capacity of the substrate solder layer 503, and the thermal resistance and heat capacity of the substrate 504.

[0095] Specifically, the heat sink 30 further includes a heat dissipation plate 31 and a ceramic heat sink 32. The power device 50 (such as the substrate 504 of the MOS transistor) is disposed on the ceramic heat sink 32. The ceramic heat sink 32 is disposed on the heat dissipation plate 31. The ceramic heat sink 32 can play the roles of insulation and heat conduction, can transfer the heat of the power device 50 to the heat sink 30, and insulate the power device 50 and the heat sink 30; the first preset parameters include the thermal resistance and heat capacity of the ceramic heat sink 32, such as R in formula (1) c , C c , the thermal resistance and heat capacity of the heat sink 30, such as R in formula ( ), C h , the thermal resistance and heat capacity of the heat transfer of the heat sink 30 in the air outlet direction, such as R in formula (4) h , C ht . ht .

[0096] The convective heat transfer resistance between the air flow and the heat sink 30 is Rf in formula (6). The convective heat transfer resistance is determined according to the convective heat transfer area and the convective heat transfer coefficient. Among them, the convective heat transfer area is determined according to the surface area of the heat sink 30, and the convective heat transfer coefficient is determined according to the Nusselt Nu correlation. The specific formula is as follows:

[0097] Rf = 1 / h * A

[0098] Wherein, A is the convective heat transfer area, and in the second heat network model, A is 1 / 4 of the overall heat dissipation surface area of the radiator 30. h is the convective heat transfer coefficient, and h can be obtained through the Nusselt Nu correlation. The relationship between h and the Nusselt Nu correlation can be expressed by the formula which is Nu The Nusselt

[0099]

[0100] Wherein, ρ is the air density, μ is the dynamic viscosity of the air, λ is the thermal conductivity of the air, l is the characteristic dimension of the radiator 30, C p is the specific heat capacity at constant pressure of the air, α, β, and γ are correlation coefficients, v is the air flow velocity of the radiator 30, and the air flow velocity of the radiator 30 can be calculated by the formula v = Qt / At * (0.15 * i + 0.6). Wherein, At is the ventilation cross-sectional area of the radiator 30, Q is the total flow rate of the fan 200, the flow rate Qt of the radiator 30 = 0.2 * Q, and i can take 1, 2, 3, 4.

[0101] The power device 50 (such as a MOS transistor) includes a chip solder layer 501, a DBC layer 502, a substrate solder layer 503, and a substrate 504. The second preset parameters include the thermal resistance and heat capacity of the chip solder layer 501, such as R1 and C1 in formula (9), the thermal resistance and heat capacity of the DCB layer, such as R2 and C2 in formula 10, the thermal resistance and heat capacity of the substrate solder layer 503, such as R3 and C3 in formula (11), and the thermal resistance and heat capacity of the substrate 504, such as R4 and C4 in formula (12).

[0102] In some embodiments, the maximum junction temperature change rate corresponding to each power device 50 is determined according to a plurality of consecutive maximum junction temperatures obtained by sampling and a preset sampling interval.

[0103] Specifically, the maximum junction temperature change rate G corresponding to each power device 50 can be obtained by taking the difference between two consecutive maximum junction temperatures obtained by sampling, dividing the differences by the corresponding sampling time intervals respectively, and then summing and averaging the obtained values. For example, if the maximum junction temperatures Tjmax1, Tjmax2, and Tjmax3 are obtained by continuously sampling the power device 50 three times at a preset sampling time t, the maximum junction temperature change rate G corresponding to the power device 50 can be obtained by the following formula:

[0104] G = = [(T jmax1 - T jmax2 ) / t + (T jmax2 - T jmax3 ) / t + (Tjmax1 -T jmax3 ) / 2t] / 3

[0105] Please refer to Figure 13 , in some embodiments, step 0121: controlling the rotation speed of the fan 200 according to the maximum junction temperature and the maximum junction temperature change rate, including:

[0106] Step 01211: determining a first duty cycle according to the maximum junction temperature and a second duty cycle according to the maximum junction temperature change rate;

[0107] Step 01212: controlling the rotation speed of the fan 200 according to the first duty cycle and the second duty cycle.

[0108] Wherein, the duty cycle refers to the proportion of the working time of the fan 200 in the working cycle.

[0109] Specifically, according to the maximum junction temperature T jmax of the power device 50, the first duty cycle Z1 can be determined. The maximum junction temperature T jmax and the first duty cycle Z1 have a step function relationship, and their corresponding relationship is shown in Table 1 below:

[0110] Table 1

[0111]

[0112] According to the maximum junction temperature change rate G of the power device 50, the second duty cycle Z2 can be determined. The maximum junction temperature change rate G and the second duty cycle Z2 have a proportional function relationship, and their corresponding relationship is expressed by the following formula:

[0113] G =

[0114] Wherein, T jmax represents the maximum junction temperature of the power device 50, and t represents the sampling interval time.

[0115] According to the sum of the first duty cycle and the second duty cycle, the value of the duty cycle of the fan 200 can be determined. Furthermore, the rotation speed of the fan 200 is controlled by the duty cycle of the fan 200. The larger the duty cycle of the fan 200, the higher the temperature of the power device 50 or the faster the temperature rise rate. At this time, it is necessary to increase the rotation speed of the fan 200 to take away more heat of the power device 50 to ensure the heat dissipation effect; the smaller the duty cycle of the fan 200, the lower the temperature and the slower the temperature rise rate. At this time, the rotation speed of the fan 200 can be reduced, so as to reduce the power consumption while ensuring the heat dissipation effect.

[0116] Please refer to again Figure 2 and Figure 3, the inverter 100 according to the embodiment of the present application includes a bottom plate 20, a radiator 30, an air duct assembly 40, a fan 200, and a plurality of power devices 50. The radiator 30 and the air duct assembly 40 are both disposed on the bottom plate 20. The air duct assembly 40 and the bottom plate 20 enclose an air duct 60. The fan 200 is disposed at the air outlet 62 of the air duct 60. At least a part of the radiator 30 is disposed in the air duct 60. The plurality of power devices 50 are disposed on the radiator 30. The rotation speed of the fan 200 is determined according to the junction temperature and the junction temperature change rate of the power devices 50.

[0117] Specifically, the inverter 100 includes a bottom plate 20, a radiator 30, an air duct assembly 40, a fan 200, and a plurality of power devices 50.

[0118] Among them, the radiator 30 includes a heat dissipation plate 31 and a ceramic heat sink 32. The power device 50 is disposed on the ceramic heat sink 32. The ceramic heat sink 32 is disposed on the heat dissipation plate 31. The heat dissipation plate 31 is disposed on the bottom plate 20. The number of radiators 30 can be two, such as a first radiator 33 and a second radiator 34. The first radiator 33 is close to the left side of the air duct 60, and the second radiator 34 is close to the right side of the air duct 60. The two radiators 30 both extend along the air outlet direction and are both at least partially located in the air duct 60. The transformer 51 and the inductor 52 are located between the two radiators 30.

[0119] The air duct assembly 40 includes a top wall 41 and side walls 42. The side walls 42 are disposed on the bottom plate 20. The top wall 41, the side walls 42, and the bottom plate 20 enclose the air duct 60. The fan 200 is used to draw air through the air outlet 62, and at least a part of the radiator 30 is disposed in the air duct 60. The fan 200 can make the air flow enter from the air inlet of the inverter 100, and pass through the inductor 52, the heat dissipation plate 31 and the ceramic heat sink 32 of the radiator 30 and then enter the air duct 60. Due to the air extraction characteristics of the air flow field of the fan 200, there is no area with a sharp change in flow velocity in the air duct 60, and there is no flow dead zone, and the thermal balance is relatively good. Part of the air flow can pass through the radiator 30 at a relatively large uniform flow velocity in the air duct 60 to dissipate heat from the power device 50, and the other air flow bypasses around the inductor 52 and flows forward to the transformer 51 to complete the heat dissipation of the relevant components.

[0120] The number of power devices 50 can be multiple, and the multiple power devices 50 are arranged in sequence along the air outlet direction. The inverter 100 further includes a transformer 51 and an inductor 52. The transformer 51 and the inductor 52 are both disposed on the bottom plate 20. The transformer 51 and the inductor 52 are located in the air duct 60 and / or at the air inlet 61 of the air duct 60. And the inductor 52 includes multiple ones, the multiple inductors 52 extend along the air outlet direction, and the multiple inductors 52 are alternately arranged. Any two adjacent inductors 52 are respectively disposed close to the two radiators 30 (for example, the inductor 52 includes a first inductor 521 and a second inductor 522, the first inductor 521 is disposed close to the first radiator 33, and the second inductor 522 is disposed close to the second radiator 34).

[0121] The number of the fans 200 can be multiple, and the number of the fans 200 needs to correspond to the number of the radiators 30. For example, if the number of the radiators is 2, the number of the fans 200 is correspondingly 2. Thus, the distances between the two fans 200 at both ends of the air duct 60 and the corresponding two ends of the air duct 60 are both greater than or equal to 10% of the width of the air duct 60. It should be noted that the direction parallel to the bottom plate 20 and perpendicular to the air outlet direction is the width direction of the air duct 60, as Figure 2 and Figure 3 shown, the direction represented by W is the width direction of the air duct 60, and the air outlet direction is the length direction of the air duct 60, that is, the direction represented by L; finally, the rotation speed of the fan 200 is determined according to the junction temperature and the junction temperature change rate of the power device 50.

[0122] Please refer to again Figure 4 , the energy storage power supply 1000 of the embodiment of the present application includes a controller 400 and an inverter 100. The controller 400 is used to control the rotation speed of the fan 200 according to the junction temperature and the junction temperature change rate of the power device 50.

[0123] Among them, the energy storage power supply 1000 can be a photovoltaic solar cell, a nickel-metal hydride battery, a nickel-cadmium battery, a lithium-ion battery, etc.

[0124] Optionally, the controller 400 can also execute the heat dissipation control method of any of the above embodiments. For the sake of brevity, it will not be elaborated here.

[0125] Please refer to Figure 14 , the heat dissipation control device 10 of the embodiment of the present application is applied to the inverter 100. The inverter 100 includes a fan 200 and a power device 50. The heat dissipation control device 10 includes an acquisition module 11 and a control module 12. The acquisition module 11 is used to acquire the junction temperature and the junction temperature change rate of the power device 50; the control module 12 is used to control the rotation speed of the fan 200 according to the junction temperature and the junction temperature change rate.

[0126] The acquisition module 11 is specifically used to acquire the maximum junction temperature of multiple power devices 50 and the maximum junction temperature change rate.

[0127] The control module 12 is specifically used to control the rotation speed of the fan 200 according to the maximum junction temperature and the maximum junction temperature change rate. Determine the first duty ratio according to the maximum junction temperature and the second duty ratio according to the maximum junction temperature change rate; control the rotation speed of the fan 200 according to the first duty ratio and the second duty ratio.

[0128] The heat dissipation control device 10 further includes a first creation module 13. The first creation module 13 is used to establish a first thermal network model of multiple power devices 50 and the radiators 30 and a second thermal network model of a single power device 50.

[0129] The heat dissipation control device 10 further includes a second creation module 14, and the second creation module 14 is configured to construct a first set of equations according to the first thermal network model and a second set of equations according to the second thermal network model.

[0130] The heat dissipation control device 10 further includes a calculation module 15, and the calculation module 15 is configured to calculate the junction temperature corresponding to each power device 50 according to the first set of equations, the second set of equations, the current of the power device 50, the first temperature collected by the first temperature measurement device 70, the second temperature collected by the second temperature measurement device 80, the third temperature collected by the third temperature measurement device 90, the first preset parameter of the radiator 30, and the second preset parameter of the power device 50.

[0131] Specifically, the calculation module 15 is configured to calculate the junction temperature and the externally expanded heat dissipation power consumption of each power device 50 at the Nth moment according to the second set of equations, the board temperature and the junction temperature of each power device 50 at the (N - 1)th moment, the current of each power device 50 at the Nth moment, and the second preset parameter; calculate the board temperature of each power device 50 at the Nth moment according to the first set of equations, the board temperature of each power device 50 at the (N - 1)th moment, the externally expanded heat dissipation power consumption and the junction temperature of each power device 50 at the Nth moment, the first temperature, the second temperature, and the third temperature at the Nth moment, and the first preset parameter.

[0132] Please refer to Figure 15 , the embodiment of the present application further provides a non - volatile computer storage medium 300, on which a computer program 310 is stored. When the computer program 310 is executed by a processor 320, the steps of the heat dissipation control method in any of the above - mentioned embodiments are implemented. For the sake of brevity, it will not be elaborated here.

[0133] It should be noted that in this article, the term "including", "comprising" or any other variant thereof is intended to cover non - exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or further includes elements inherent to such a process, method, article or device. Without further limitation, an element defined by the statement "including one..." does not exclude the existence of another identical element in the process, method, article or device including that element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in a reverse order according to the functions involved. For example, the described methods may be performed in an order different from that described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0134] Through the description of the above embodiments, those skilled in the art can clearly understand that the above embodiment methods can be implemented by means of software plus a necessary general hardware platform. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on such an understanding, the technical solution of the present application, in essence or the part that contributes to the prior art, can be embodied in the form of a computer software product. The computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk), and includes several instructions for causing a terminal (which can be a mobile phone, computer, server, or network device, etc.) to execute the methods of the various embodiments of the present application.

[0135] The embodiments of the present application have been described above in conjunction with the accompanying drawings. However, the present application is not limited to the above specific implementation manners. The above specific implementation manners are merely illustrative and not restrictive. Under the inspiration of the present application, those of ordinary skill in the art can also make many forms without departing from the purpose of the present application and the scope protected by the claims, and all of them belong to the protection scope of the present application.

Claims

1. A heat dissipation control method, characterized in that, Applied to an inverter, the inverter includes a radiator, a first temperature measuring device, a second temperature measuring device, a third temperature measuring device, a fan, and a plurality of power devices. The inverter forms an air duct, the air duct includes an air inlet and an air outlet, the fan is arranged at the air outlet, the plurality of power devices are arranged on the radiator, the first temperature measuring device is arranged at one end of the radiator close to the fan, the second temperature measuring device is arranged at the air inlet, the third temperature measuring device is arranged at the air outlet, and the method includes: Obtaining the junction temperature and the junction temperature change rate of the power device, including: Establishing a first thermal network model of the plurality of power devices and the radiator and a second thermal network model of a single power device; Constructing a first set of equations according to the first thermal network model and a second set of equations according to the second thermal network model; Calculating the junction temperature corresponding to each power device according to the first set of equations, the second set of equations, the current of the power device, the first temperature collected by the first temperature measuring device, the second temperature collected by the second temperature measuring device, the third temperature collected by the third temperature measuring device, the first preset parameter of the radiator, and the second preset parameter of the power device; Controlling the rotation speed of the fan according to the junction temperature and the junction temperature change rate.

2. The heat dissipation control method according to claim 1, wherein The calculating the junction temperature corresponding to each power device according to the first set of equations, the second set of equations, the current of the power device, the first temperature collected by the first temperature measuring device, the second temperature collected by the second temperature measuring device, the third temperature collected by the third temperature measuring device, the current rotation speed of the fan, the first preset parameter of the radiator, and the second preset parameter of the power device includes: Calculating the junction temperature and the external heat dissipation power consumption of each power device at the Nth moment according to the second set of equations, the board temperature and junction temperature of each power device at the (N-1)th moment, the current of each power device at the Nth moment, and the second preset parameter, where N is a positive integer, and the board temperature and junction temperature of each power device at the 0th moment can be determined according to the environmental temperature at the 0th moment; Calculating the board temperature of each power device at the Nth moment according to the first set of equations, the board temperature of each power device at the (N-1)th moment, the external heat dissipation power consumption and junction temperature at the Nth moment, the first temperature, second temperature, and third temperature at the Nth moment, and the first preset parameter; Execute the loop to calculate the junction temperature and external heat dissipation power consumption of each power device at the Nth moment according to the second set of equations, the board temperature and junction temperature of each power device at the (N - 1)th moment, the current of each power device at the Nth moment, and the second preset parameter, where N is a positive integer, and the board temperature and junction temperature of each power device at the 0th moment can be determined according to the ambient temperature at the 0th moment; the step of calculating the board temperature of each power device at the Nth moment according to the first set of equations, the board temperature of each power device at the (N - 1)th moment, the external heat dissipation power consumption and junction temperature at the Nth moment, the first temperature, second temperature and third temperature at the Nth moment, and the first preset parameter.

3. The heat dissipation control method according to claim 1 or 2, characterized in that The radiator further includes a ceramic heat sink, the power device is disposed on the ceramic heat sink, the first preset parameter includes the thermal resistance and heat capacity of the ceramic heat sink, the thermal resistance and heat capacity of the radiator, the thermal resistance and heat capacity of the radiator for heat transfer in the air outlet direction, the convective heat transfer resistance between the air flow and the radiator, the convective heat transfer resistance is determined according to the convective heat transfer area and the convective heat transfer coefficient, the convective heat transfer area is determined according to the surface area of the radiator, and the convective heat transfer coefficient is determined according to the Nusselt Nu correlation. The power device includes a chip solder layer, a DBC layer, a substrate solder layer and a substrate, and the second preset parameter includes the thermal resistance and heat capacity of the chip solder layer, the thermal resistance and heat capacity of the DBC layer, the thermal resistance and heat capacity of the substrate solder layer, and the thermal resistance and heat capacity of the substrate.

4. The heat dissipation control method according to claim 1, wherein There are multiple power devices, and the obtaining of the junction temperature and the junction temperature change rate of the power device includes: Obtain the maximum junction temperature and the maximum junction temperature change rate of multiple power devices. The controlling of the rotation speed of the fan according to the junction temperature and the junction temperature change rate includes: Control the rotation speed of the fan according to the maximum junction temperature and the maximum junction temperature change rate.

5. The heat dissipation control method according to claim 4, wherein The maximum junction temperature change rate corresponding to each power device is determined according to a continuous plurality of the maximum junction temperatures obtained by sampling and a preset sampling interval.

6. The heat dissipation control method according to claim 4, wherein The controlling of the rotation speed of the fan according to the maximum junction temperature and the maximum junction temperature change rate includes: Determine a first duty cycle according to the maximum junction temperature and a second duty cycle according to the maximum junction temperature change rate; Control the rotation speed of the fan according to the first duty cycle and the second duty cycle.

7. The heat dissipation control method according to claim 6, wherein The maximum junction temperature and the first duty cycle have a step function relationship, and the maximum junction temperature change rate and the second duty cycle have a proportional function relationship.

8. An inverter, characterized in that, Applied to an energy storage power supply, the energy storage power supply includes a controller. The inverter includes a radiator, a first temperature measuring device, a second temperature measuring device, a third temperature measuring device, a fan, and a plurality of power devices. The inverter forms an air duct, the air duct includes an air inlet and an air outlet, the fan is arranged at the air outlet, the plurality of power devices are arranged on the radiator, the first temperature measuring device is arranged at one end of the radiator close to the fan, the second temperature measuring device is arranged at the air inlet, the third temperature measuring device is arranged at the air outlet, and the controller is used to execute the heat dissipation control method according to any one of claims 1-7.

9. A energy storage power supply, characterized in that, Including the inverter and the controller according to claim 8.

10. A heat dissipation control device, characterized in that, Applied to an inverter, the inverter includes a radiator, a first temperature measuring device, a second temperature measuring device, a third temperature measuring device, a fan, and a plurality of power devices. The inverter forms an air duct, the air duct includes an air inlet and an air outlet, the fan is arranged at the air outlet, the plurality of power devices are arranged on the radiator, the first temperature measuring device is arranged at one end of the radiator close to the fan, the second temperature measuring device is arranged at the air inlet, the third temperature measuring device is arranged at the air outlet, and the heat dissipation control device includes: An acquisition module for acquiring the junction temperature and the junction temperature change rate of the power device; the acquisition module for establishing a first thermal network model of the plurality of power devices and the radiator and a second thermal network model of a single power device; constructing a first set of equations according to the first thermal network model and a second set of equations according to the second thermal network model; calculating the junction temperature corresponding to each power device according to the first set of equations, the second set of equations, the current of the power device, the first temperature collected by the first temperature measuring device, the second temperature collected by the second temperature measuring device, the third temperature collected by the third temperature measuring device, the first preset parameter of the radiator, and the second preset parameter of the power device. A control module for controlling the rotation speed of the fan according to the junction temperature and the junction temperature change rate.

11. A non-volatile computer storage medium, characterized in that, A computer program is stored thereon, and when the computer program is executed by a processor, it implements the heat dissipation control method according to any one of claims 1 to 7.

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