Ghz burst laser source system and method for cutting composite materials

Abstract

The application discloses a GHz pulse train laser light source system, which comprises a bearing module, a laser generation module, a collimation module, a laser adjustment module and a condenser. The bearing module bears a composite material. The laser generation module provides a laser beam. The collimation module collimates the laser beam into a collimated laser beam. The laser adjustment module is used for reflecting the collimated laser beam. The condenser focuses the reflected collimated laser beam into a focused laser beam with a desired cutting width of machining, so as to project the focused laser beam to a cutting position of the composite material. The projection path of the focused laser beam is adjusted by the laser adjustment module, so that the focused laser beam projected to the cutting position of the composite material is parallelly offset, or the cutting position of the composite material is parallelly offset by moving the composite material through the bearing module. The pulse width of the laser beam is between 50fs and 500fs.

Description

TECHNICAL FIELD

[0001] The present application relates to a laser source system, in particular to a GHz pulse train laser source system and method for cutting composite materials. BACKGROUND

[0002] Glass has been an indispensable material in industry, and its potential applications include optical components, microelectronics, microfluidics, and display technology. In recent years, many products have been miniaturized to the micron and nanometer levels, which means that the precision requirements for glass processing will be more stringent than in the past.

[0003] Femtosecond laser is a very important technical breakthrough in recent years. Femtosecond laser refers to a laser pulse width in the order of femtosecond (fs, 10-15 seconds). The laser beam can produce extremely high power density through focusing, and the heat affected zone (HAZ) is extremely small when femtosecond laser is used for material processing, and it can process the inside of transparent materials. Cutting is one of the most popular technologies in laser applications, and when cutting with femtosecond laser, there are many advantages, such as no need for prior thermal processing, high spatial resolution, no significant thermal deformation, and cutting only near the focal point. In addition, compared with traditional cutting, femtosecond laser glass cutting can effectively maintain the structural integrity of the cutting, which is absolutely a great leap for glass cutting.

[0004] Therefore, how to use femtosecond laser to improve the processing efficiency of glass cutting has become the direction of the industry. SUMMARY

[0005] The embodiments of the present application provide a GHz pulse train laser source system and method for cutting composite materials to avoid delamination at the cutting of the processed composite materials and maintain a small heat affected zone (HAZ), so that any debris and cracks can be avoided at the cutting of the processed composite materials.

[0006] The embodiment of the present application discloses a GHz pulse train laser source system for cutting composite material, which comprises a bearing module, a laser generating module, a collimating module, a laser adjusting module and a condenser. The bearing module is used to bear the composite material. The laser generating module is used to provide a laser beam. The collimating module is used to collimate the laser beam into a collimated laser beam. The laser adjusting module is used to reflect the collimated laser beam. The condenser is used to focus the reflected collimated laser beam into a focused laser beam with a predetermined cutting width, so as to project the focused laser beam to the cutting position of the composite material. The projection path of the focused laser beam is adjusted by the laser adjusting module, so that the focused laser beam projected to the cutting position of the composite material is offset in parallel, or the composite material is moved by the bearing module, so that the cutting position of the composite material is offset in parallel. The pulse width of the laser beam is between 50fs and 500fs, the repetition frequency of the laser beam is between 0.5GHz and 10GHz, and the pulse energy of the laser beam is between 100μJ and 1000μJ. The laser generating module, the collimating module, the laser adjusting module, the condenser and the bearing module are arranged in the same optical path.

[0007] The embodiment of the present application also discloses a method for cutting composite material, which comprises the following steps: S1, providing a laser beam by the laser generating module of the GHz pulse train laser source system; S2, generating a focused laser beam according to the laser beam by the collimating module, the laser adjusting module and the condenser of the GHz pulse train laser source system; S3, projecting the focused laser beam to the cutting position of the composite material on the bearing module; S4, when the focused laser beam contacts the surface of the cutting position, melting the surface by the focused laser beam; S5, when the focused laser beam melts the surface, the focused laser beam is incident to the inner wall of the cutting position of the composite material and makes it smooth; S6, effectively removing a part of the composite material according to the plurality of laser parameters of the focused laser beam; S7, performing steps S1-S6 at multiple time periods during cutting, so as to generate a plurality of cutting holes at the cutting position, wherein the cutting holes are arranged along the cutting position and overlap with each other. The pulse width of the laser beam is between 50fs and 500fs, the repetition frequency of the laser beam is between 0.5GHz and 10GHz, and the pulse energy of the laser beam is between 100μJ and 1000μJ. The laser generating module, the collimating module, the laser adjusting module, the condenser and the bearing module are arranged in the same optical path.

[0008] In summary, the GHz burst laser source system and method disclosed in the embodiments of the present application uses a GHz burst laser beam with a pulse width between 50-500 fs to cut the cutting part of the composite material, so as to avoid delamination phenomenon at the cutting part of the processed composite material and maintain a small HAZ. In addition, since the HAZ of the processed composite material is small, any debris and cracks can be avoided at the cutting part of the processed composite material.

[0009] In order to enable further understanding of the features and technical contents of the present application, reference can be made to the following detailed description of the present application and the accompanying drawings, however, the accompanying drawings provided are only for reference and illustration, and are not intended to limit the present application. BRIEF DESCRIPTION OF DRAWINGS

[0010] Figure 1 A schematic diagram of a GHz burst laser source system structure for cutting a composite material is shown.

[0011] Figure 2A A schematic diagram of a laser generation module is shown.

[0012] Figure 2B A schematic diagram of a plurality of pulse bursts of a laser beam is shown.

[0013] Figure 3 A schematic diagram of a cutting method of a focused laser beam is shown.

[0014] Figure 4 A method flowchart of a cutting method of Figure 1 , 3 is shown.

[0015] Figure 5 A schematic diagram of a processing result of a cutting method of Figure 3 is shown.

[0016] Figure 6 A schematic diagram of a processing result of a composite material using a cutting method of Figure 3 is shown.

[0017] Figure 7 A schematic diagram of a processing form of a GHz burst laser source system of Figure 1 is shown.

[0018] Figure 8 A schematic diagram of a plurality of cutting holes overlapped is shown. DETAILED DESCRIPTION

[0019] The following specific embodiments illustrate the implementation of the "GHz pulse train laser source system and method for cutting composite materials" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions of actual dimensions; this is stated in advance. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention.

[0020] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the related listed items.

[0021] Please see Figure 1 The diagram illustrates a schematic structure of a GHz burst laser source system D1 for cutting composite materials according to an embodiment of the present invention. The GHz burst laser source system D1 includes a laser generation module 102, a collimation module 104, a laser adjustment module 106, a condenser lens 108, and a support module 110. The laser generation module 102, collimation module 104, laser adjustment module 106, condenser lens 108, and support module 110 are arranged along the same optical path, but the present invention is not limited thereto. It is worth mentioning that, for example, in another feasible embodiment, the GHz pulse train laser source system D1 may include a laser generation module 102, a laser beam expander 104, an X-axis laser galvanometer scanning module (not shown), an X-axis laser galvanometer controller (not shown), a Y-axis laser galvanometer scanning module (not shown), a Y-axis laser galvanometer controller (not shown), a condenser lens 108, and a carrier module 110, wherein the laser generation module 102, the laser beam expander 104, the X-axis laser galvanometer scanning module, the Y-axis laser galvanometer scanning module, the condenser lens 108, and the carrier module 110 are arranged in the same optical path, but the present invention is not limited thereto.

[0022] Please see Figure 2AThe diagram illustrates the structure of a laser generation module 102. The laser generation module 102 includes a pulsed laser generation module 1022, an acousto-optic modulator (AOM) 1024, and a laser amplifier 1026. The pulsed laser generation module 1022 generates a laser source Ls having multiple pulse signals P1-Pn. The acousto-optic modulator 1024 is located adjacent to the pulsed laser generation module 1022 and is used to increase the repetition frequency of the laser source Ls to generate a pulsed laser beam Lb having multiple bursts based on the increased laser source Ls. The laser amplifier 1026 is located adjacent to the acousto-optic modulator 1024 and is used to increase the pulse energy of the pulsed laser beam Lb to generate a laser beam L1. The repetition frequency of the pulsed laser beam Lb is between 0.5 and 10 GHz (e.g., any positive integer between 0.5 and 10 GHz), and the pulse energy of the laser beam L1 is between 100 and 1000 μJ (e.g., any positive integer between 10 and 30 mJ), but the invention is not limited thereto.

[0023] Please see Figure 2B The diagram illustrates the structure of multiple pulse trains B1-Bn of the laser beam L1. Figure 2B It is understood that these pulse trains B1-Bn include multiple pulse signals P1-Pn, that is, multiple pulse signals P1 form pulse train B1, multiple pulse signals P2 form pulse train B2, ..., multiple pulse signals Pn form pulse train Bn, so that these pulse trains B1-Bn respectively form multiple pulse signals P1-Pn. The pulse width of these pulse signals P1-Pn is between 50 and 500 fs (e.g., any positive integer between 50 and 500 fs), the number of these pulse signals P1-Pn is between 50 and 1000 (e.g., any positive integer between 50 and 1000), and the frequency of these pulse signals P1-Pn is between 1 and 2000 kHz (e.g., any positive integer between 1 and 2000 kHz), but the present invention is not limited thereto.

[0024] Please see Figure 1 , 2A2B, Laser generating module 102 is used to provide laser beam L1. Collimation module 104 is adjacent to laser generating module 102 and is used to collimate laser beam L1 into collimated laser beam L2. Laser beam L1 can be adjusted by laser generating module 102. The pulse width of laser beam L1 (i.e., the pulse width of the pulse signals P1-Pn) is between 50 and 500 fs (e.g., any positive integer between 50 and 500 fs), the repetition frequency of laser beam L1 (i.e., the repetition frequency of the pulse train laser Lb) is between 0.5 and 10 GHz (e.g., any positive integer between 0.5 and 10 GHz), and the average power of laser beam L1 is determined based on the pulse energy of laser beam L1 and the repetition frequency. Collimation module 104 can be a Fresnel lens (F-Lens), but the invention is not limited thereto.

[0025] It is worth noting that the pulse width, pulse energy, frequency of pulse signals P1-Pn, repetition frequency, and number of pulse signals P1-Pn of the laser beam L1 can be adjusted appropriately according to individual needs. For example, if the pulse energy of the laser beam L1 used for cutting composite materials is high, the repetition frequency of the laser beam L1 can be adjusted to a lower frequency. However, the above example is only one possible embodiment and is not intended to limit the invention.

[0026] Furthermore, it is worth noting that if the pulse width, pulse energy, frequency, repetition frequency, and number of pulse signals P1-Pn of the laser beam L1 used for cutting the composite material are below the aforementioned predetermined range, the laser beam will have difficulty penetrating the composite material. Conversely, if these parameters exceed the predetermined range, cracks are likely to occur at the cut point of the composite material. For example, if the pulse width of the laser beam L1 used for cutting the composite material is 600 fs, cracks are likely to occur at the cut point. However, the examples given above are merely one possible embodiment and are not intended to limit the invention.

[0027] The laser adjustment module 106 is adjacent to the collimation module 104 and is used to reflect the collimated laser beam L2. The laser adjustment module can be a "laser galvanometer scanning module with a scanning galvanometer" or a "laser focusing module with a fixed focusing processing head." In one embodiment, if the laser galvanometer scanning module is used for cutting composite materials, the laser galvanometer scanning module reflects the collimated laser beam L2 according to multiple rotation angles (e.g., 0°, 30°, 60°, ...) (not shown). That is, the laser galvanometer scanning module 106 rotates to generate multiple rotation angles, causing the laser galvanometer scanning module 106 to reflect the collimated laser beam L2 with mirrors at different angles. In one embodiment, if the laser focusing module is used for cutting composite materials, the laser focusing module reflects the collimated laser beam L2 with a single reflection angle. That is, the laser focusing module reflects the collimated laser beam L2 with a mirror at a fixed reflection angle.

[0028] For example, a user can input control commands to a controller (not shown) according to cutting requirements. The controller then sends corresponding drive commands to the laser galvanometer scanning module, causing the laser galvanometer scanning module to rotate accordingly, generating multiple rotation angles. This allows the laser galvanometer scanning module to reflect the collimated laser beam L2 at different angles according to cutting requirements. However, the above example is merely one feasible embodiment and is not intended to limit the invention.

[0029] The carrier module 110 is used to carry the composite material 112. The condenser lens 108 is adjacent to the laser adjustment module 106 and is used to converge the reflected collimated laser beam L2 into a focused laser beam L3, so as to project the focused laser beam L3 onto the cutting point 114 of the composite material 112. The composite material 112 has a thickness of 50 to 1000 μm and includes at least two substrates prepared for cutting. Each substrate is a glass, a metal, a ceramic, or a semiconductor wafer, but the present invention is not limited thereto.

[0030] Specifically, if a laser galvanometer scanning module (laser adjustment module 106) is used to cut the composite material, the projection path of the focused laser beam L3 can be adjusted by the laser galvanometer scanning module so that the focused laser beam L3 projected onto the cutting point 114 of the composite material 112 is offset in parallel at a translational speed V. That is, the composite material 112 on the fixed support module 110 is fixed and the laser galvanometer scanning module (laser adjustment module 106) is adjusted so that the focused laser beam L3 is projected onto the cutting point 114 of the composite material 112 at a translational speed V. In one embodiment, if a laser focusing module (laser adjustment module 106) is used to cut the composite material, the composite material 112 can be moved by the support module 110 (for example, the support module 110 can move along the X-axis or Y-axis on a horizontal plane), causing the cut point 114 of the composite material 112 to be offset in parallel at a translational speed V. That is, by fixing the laser focusing module (laser adjustment module 106) and moving the support module 110, the support module 110 is offset in parallel at a translational speed V, thereby causing the cut point 114 of the composite material 112 to be offset in parallel at a translational speed V. In another embodiment, the laser beam L3 and the cut point of the composite material 112 can be offset in opposite directions by adjusting the laser galvanometer scanning module (laser adjustment module 106) and moving the support module 110.

[0031] Therefore, through the adjustment of the laser adjustment module 106 and / or the movement of the support module 110, the focused laser beam L3 is projected onto the cutting point 114 of the composite material 112 for cutting. For details on the cutting method of the focused laser beam L3 on the composite material 112, please refer to the following text. Figure 3 A detailed explanation.

[0032] Please see Figure 3The diagram illustrates the cutting method of the focused laser beam L3. First, the focused laser beam L3 is projected onto the cutting point 114 of the composite material 112 on the carrier module 110. When the focused laser beam L3 contacts the surface 116 of the cutting point 114, it melts (ablation) the surface 116. Then, after the focused laser beam L3 has melted the surface 116, it is incident on the inner wall 118 of the cutting point 114 of the composite material 112 and smooths it. Then, based on multiple laser parameters of the focused laser beam L3, a portion of the composite material is effectively removed. The way the focused laser beam L3 melts from the surface 116 to the inner wall 118 is called the preheating phenomenon. The multiple laser parameters include the pulse width of the laser beam L1, the pulse energy of the laser beam L1, the number of multiple pulse signals P1-Pn of the multiple pulse trains B1-Bn of the laser beam L1, the repetition frequency of the laser beam L1, and the frequency of the multiple pulse signals P1-Pn. Furthermore, during the process of the focused laser beam L3 melting the inner wall 118, the focused laser beam L3 undergoes reflection and multiple scattering under grazing incidence on the inner wall 118. The focused laser beam L3 loses some energy with each reflection, causing the drilling energy to decrease as the drilling depth increases, eventually reaching saturation at the drilling depth.

[0033] Specifically, when the bottom influence of the focused laser beam L3 falls below a melting threshold, melting of the inner wall 118 is stopped. The bottom influence can be defined as the energy density of the composite material melted by the laser beam; energy density refers to the energy density of the laser beam per square unit of joules (J / cm²). 2 The melting threshold can be adjusted based on the pulse width of the laser beam L1, the pulse energy of the laser beam L1, the number of multiple pulse signals P1-Pn of multiple pulse trains B1-Bn of the laser beam L1, the repetition frequency of the laser beam L1, and the frequency of the multiple pulse signals P1-Pn, but the present invention is not limited thereto.

[0034] Finally, the above is performed at multiple time points during a single cut. Figure 3 The cutting method generates multiple cutting holes 120 at the cutting point 114, wherein these cutting holes 120 are arranged along the cutting point 114 and overlap each other. It is worth noting that during the cutting process, the focused laser beam L3 is repeatedly projected back and forth onto the cutting point 114 at a translational speed V according to the above cutting method, so that the cutting point 114 is cut, ensuring the complete cutting of the cutting point 114.

[0035] For example, when the cutting period is from 1 ms to 19 s, the repetition frequency of the focused laser beam L3 is 1 kHz, and each pulse train with a repetition frequency of 1 GHz contains 50 pulse signals, the above is performed at multiple time intervals during the cutting period (e.g., 1 ms, 2 ms..., 19 s). Figure 3 The cutting method produces multiple overlapping cutting holes 120 at the cutting point 114 of the composite material 112, and the focused laser beam L3 is repeatedly projected back and forth onto the cutting point 114 at a translational speed V, so that the cutting point 114 can be completely cut. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0036] Please see Figure 4 Its drawing is used for Figure 1 , 3 The method flowchart for the cutting method includes: Step S1: Providing a laser beam L1 through the laser generation module 102 of the GHz pulse train laser source system D1; Step S2: Generating a focused laser beam L3 based on the laser beam L1 through the collimation module 104, laser adjustment module 106, and condenser lens 108 of the GHz pulse train laser source system D1; Step S3: Projecting the focused laser beam L3 onto the cutting point 114 of the composite material 112 on the support module 110; Step S4: When the focused laser beam L3 contacts the cutting point... When the surface 116 of the composite material 114 is melted by the focused laser beam L3, the surface 116 is ablated. Step S5: When the focused laser beam L3 has melted the surface 116, the focused laser beam L3 is incident on the inner wall 118 of the cut 114 of the composite material 112 and smooths it. Step S6: According to multiple laser parameters of the focused laser beam L3, a portion of the composite material is effectively removed. Step S7: Steps S1 to S6 are executed at multiple time periods during the cutting process to generate multiple cutting holes 120 at the cut 114.

[0037] Please see Figure 5 Its drawing uses Figure 3 A schematic diagram showing the processing results of the cutting method. (From...) Figure 5 It is known that the cutting holes 120 at the cutting point 114 are cylindrical holes with a fixed diameter. The inner wall of each cutting hole 120 is a smooth surface. The depth of each cutting hole 120 is determined by the number of pulse trains and the energy density, and the depth varies linearly. The diameter of each cutting hole 120 is between 20 and 40 μm, the depth is between 70 and 295 μm, and the smoothness (Rz) of the inner wall is between 100 and 5000 nm (ten-point average roughness Rz), but the present invention is not limited to these.

[0038] Please see Figure 6 Its drawing uses Figure 3 A schematic diagram showing the processing results of composite material 112 using the cutting method. (From...) Figure 6 It can be seen that, through Figure 3 The cutting method ensures that the cut surface 114 of the processed composite material 112 does not undergo delamination and maintains a small heat-affected zone (HAZ). Therefore, the processed composite material 112 and its surface 116 are undamaged, and the measured electrical properties are normal. Furthermore, due to the small HAZ of the processed composite material 112, any debris and cracks can be avoided at the cut surface 114.

[0039] Please see Figure 7 Its illustration Figure 1 A schematic diagram of the fabrication process of the GHz pulse train laser source system D1. (From...) Figure 1 , 7 It can be seen that the processing form of the GHz pulse train laser source system D1 includes full cutting (dicing) or half cutting (scribing) of composite material 112. Full cutting of composite material 112 is controlled according to the number of multiple pulse signals P1-Pn of multiple pulse trains B1-Bn of laser beam L1. After focusing, the laser spot size of laser beam L3 is similar to the width of the cutting part 114.

[0040] Furthermore, the laser spot overlap rate of the focused laser beam L3 is determined based on the laser spot size of the focused laser beam L3 and the overlap rate of the cutting holes 120 at the cutting point 114. The translation speed V of the focused laser beam L3 is determined based on the laser spot overlap rate of the focused laser beam L3 and the repetition frequency of the laser beam L1. The translation speed V of the carrier module 110 is determined based on the overlap rate, wherein the overlap rate of the cutting holes 120 is between 70% and 99%, but the present invention is not limited thereto.

[0041] Figure 8 A schematic diagram illustrating multiple overlapping cut holes 120. (By...) Figure 8 It can be seen that these cutting holes 120 overlap each other in proportion to one hole (e.g. Figure 8 (As shown by the diagonal line), the proportion of the hole is the overlap rate of these cut holes 120.

[0042] Therefore, the GHz pulse train laser source system D1 of the present invention uses a laser beam L1 with a GHz pulse train (burst) having a pulse width between 50 and 500 fs to cut the cutting section 114 of the composite material 112, thereby avoiding delamination at the cutting section 114 of the processed composite material 112 and maintaining a small HAZ. Furthermore, because the HAZ of the processed composite material 112 is small, any fragments and cracks can be avoided at the cutting section 114 of the processed composite material 112.

[0043] It is worth mentioning that the implementation of the GHz pulse train laser source system D1 for cutting composite materials of the present invention, as well as the advantages and effects of the present invention, can be clearly understood through the above specific embodiments. However, the present invention is not limited to the examples given above.

[0044] In summary, the GHz burst laser source system and method disclosed in this invention uses a GHz burst laser beam with a pulse width between 50 and 500 fs to cut the composite material, thereby avoiding delamination at the cut surface and maintaining a small HAZ. Furthermore, because the HAZ of the processed composite material is small, no fragments or cracks are generated at the cut surface, and no melting or evaporation occurs.

[0045] Furthermore, the GHz pulse train laser source system and method provided by this invention can cut composite materials such as glass-to-glass, glass-to-metal, glass-to-ceramic, and glass-to-silicon wafers (silicon slabs), and can be applied to 5G power components using third-generation semiconductor materials such as gallium nitride (GaN) and silicon carbide (SiC).

[0046] Furthermore, the composite materials used in this invention (e.g., glass) have advantages such as low electromagnetic signal shielding, high hardness, low cost, and light weight, which have led to their gradual adoption as materials for 3C panels and camera modules in recent years. Therefore, the value of using femtosecond lasers for glass cutting in this invention is correspondingly increased, processing efficiency is improved, and economic costs are reduced, thus showing broad prospects.

[0047] The content disclosed above is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of protection of the claims of the present invention. Therefore, all equivalent technical changes made based on the content of the present invention specification and drawings are included within the scope of protection of the claims of the present invention.

Claims

1. A GHz pulse train laser source system for cutting composite materials, characterized in that, The GHz pulse train laser source system includes: A support module is used to support the composite material. A laser generating module for providing a laser beam. A collimation module is used to collimate the laser beam into a collimated laser beam. A laser adjustment module is used to reflect the collimated laser beam, and A condenser lens is used to focus the reflected collimated laser beam onto a focused laser beam having a predetermined cutting width, so as to project the focused laser beam onto a cut in the composite material; The projection path of the focused laser beam is adjusted by the laser adjustment module so that the focused laser beam projected onto the cut of the composite material is deflected in parallel, or the composite material is moved by the support module so that the cut of the composite material is deflected in parallel. The laser beam has a pulse width between 50 and 500 fs, a repetition frequency between 0.5 and 10 GHz, and a pulse energy between 100 and 1000 μJ. The laser generating module, the collimation module, the laser adjustment module, the condenser lens, and the carrier module are arranged in the same optical path. The laser generating module includes: a pulsed laser generating module, an acousto-optic modulator adjacent to the pulsed laser generating module, and a laser amplifier adjacent to the acousto-optic modulator. The pulsed laser generation module is configured to generate a laser source. The acousto-optic modulator is configured to increase the repetition frequency of the laser source and to generate a pulsed laser with multiple pulse trains based on the laser source after increasing the repetition frequency. The laser amplifier is configured to generate the laser beam by increasing the pulse energy of the laser pulse train. Each pulse train of the laser pulse train includes multiple pulse signals, the number of pulse signals in each pulse train is between 50 and 1000, the pulse width of each pulse signal in each pulse train is between 50 and 500 fs, and the frequency of each pulse signal in each pulse train is between 1 and 2000 kHz.

2. The GHz pulse train laser source system according to claim 1, characterized in that, The laser adjustment module is either a laser galvanometer scanning module or a laser focusing module. The laser galvanometer scanning module reflects the collimated laser beam according to multiple rotation angles, and the laser focusing module reflects the collimated laser beam according to a reflection angle. The focused laser beam is projected onto the cut of the composite material at a translational speed. The supporting module is offset parallel to the cut at the translational speed. The cut includes multiple cutting holes, each of which is a cylindrical hole with a fixed diameter. The inner wall of each cutting hole is a smooth surface. The cutting holes are arranged along the cut and overlap each other. The depth of each cutting hole is determined by the number of pulse trains and an energy density. The hole diameter is between 20 and 40 µm, the depth is between 70 and 295 µm, and the smoothness of the inner wall of each cutting hole is between 100 and 5000 nm.

3. The GHz pulse train laser source system according to claim 2, characterized in that, The overlap rate of the laser spot of the focused laser beam is determined by the size of the laser spot and the overlap rate of the cut holes. The translation speed of the focused laser beam is determined by the overlap rate and the repetition frequency. The average power of the laser beam is determined by the pulse energy and the repetition frequency. The translation speed of the carrier module is determined by the overlap rate. The size of the laser spot is similar to the width of the cut.

4. The GHz pulse train laser source system according to claim 1, characterized in that, The composite material has a thickness of 50 to 1000 µm and includes at least two substrates prepared for dicing, each substrate being a glass, a metal, a ceramic, or a semiconductor wafer.

5. A method for cutting composite materials, characterized in that, The method for cutting composite materials includes: S1: A laser beam is provided by a laser generation module of a GHz pulse train laser source system; S2: A focused laser beam is generated based on the laser beam through a collimation module, a laser adjustment module and a condenser lens of the GHz pulse train laser source system; S3: Project the focused laser beam onto a cut in a composite material on a support module; S4: When the focused laser beam comes into contact with a surface at the cut, the surface is melted by the focused laser beam; S5: When the focused laser beam has melted the surface, the focused laser beam is incident on an inner wall of the cut of the composite material and smooths it. S6: Based on multiple laser parameters of the focused laser beam, a portion of the composite material is effectively removed; and S7: Steps S1 to S6 are performed at multiple time periods during a cutting process to generate multiple cutting holes at the cutting point, wherein the cutting holes are arranged along the cutting point and overlap each other. The laser beam has a pulse width between 50 and 500 fs, a repetition frequency between 0.5 and 10 GHz, and a pulse energy between 100 and 1000 μJ. The laser generating module, the collimation module, the laser adjustment module, the condenser lens, and the carrier module are arranged in the same optical path. The laser generating module includes: a pulsed laser generating module, an acousto-optic modulator adjacent to the pulsed laser generating module, and a laser amplifier adjacent to the acousto-optic modulator. The pulsed laser generation module is configured to generate a laser source. The acousto-optic modulator is configured to increase the repetition frequency of the laser source and to generate a pulsed laser with multiple pulse trains based on the laser source after increasing the repetition frequency. The laser amplifier is configured to generate the laser beam by increasing the pulse energy of the laser pulse train. Each pulse train of the laser pulse train includes multiple pulse signals, the number of pulse signals in each pulse train is between 50 and 1000, the pulse width of each pulse signal in each pulse train is between 50 and 500 fs, and the frequency of each pulse signal in each pulse train is between 1 and 2000 kHz.

6. The method for cutting composite materials according to claim 5, characterized in that, The laser adjustment module is either a laser galvanometer scanning module or a laser focusing module. The laser galvanometer scanning module reflects the collimated laser beam from the collimation module according to multiple rotation angles, and the laser focusing module reflects the collimated laser beam according to a reflection angle. The focused laser beam is projected onto the cut of the composite material at a translational speed. The supporting module is offset parallel to the cut at the translational speed. The cut holes are cylindrical holes with a fixed diameter. The inner walls of the cut holes are smooth. The depth of the cut holes is determined by the number of pulse trains and an energy density. The hole diameter is between 20 and 40 µm, the depth is between 70 and 295 µm, and the smoothness of the inner walls is between 100 and 5000 nm.

7. The method for cutting composite materials according to claim 6, characterized in that, The overlap rate of the laser spot of the focused laser beam is determined by the size of the laser spot and the overlap rate of the cut holes. The translation speed of the focused laser beam is determined by the overlap rate and the repetition frequency. The average power of the laser beam is determined by the pulse energy and the repetition frequency. The translation speed of the carrier module is determined by the overlap rate. The size of the laser spot is similar to the width of the cut.

8. The method for cutting composite materials according to claim 5, characterized in that, The composite material has a thickness of 50 to 1000 µm and includes at least two substrates prepared for dicing, each substrate being a glass, a metal, a ceramic, or a semiconductor wafer.

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