Safety anti-disassembly structure and payment terminal

Abstract

The application provides a security anti-disassembly structure and a payment terminal. The payment terminal comprises a shell, a screen and the security anti-disassembly structure. The security anti-disassembly structure comprises: a printed circuit board arranged in the payment terminal, the printed circuit board being provided with a security chip; a support fixedly arranged on the printed circuit board; and a flexible circuit board comprising a connecting section and a first anti-tearing section. The first anti-tearing section comprises a first substrate layer, a first wiring layer and a first cover layer arranged in sequence. The first wiring layer has an adhesive force with the first cover layer or has no adhesive force with the first cover layer. The first wiring layer has no adhesive force with the first substrate layer. The first substrate layer is supported on the support. The first cover layer is arranged to be attached to a component. The connecting section is fixedly arranged. The first wiring layer is in communication connection with the security chip through the connecting section. The security anti-disassembly structure can be used for the security anti-disassembly of a screen that cannot bear force. The shell, the printed circuit board and the screen can be assembled in sequence.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of payment terminals, and more particularly relates to a safe anti-disassembly structure and a payment terminal. BACKGROUND

[0002] As a financial interaction carrier, the information security of a payment terminal is particularly important. Some existing payment terminals have relatively perfect security protection on the sealing of the shell, but some unscrupulous people still steal internal information by prying open the screen. Therefore, security protection needs to be provided for this behavior.

[0003] In the current payment terminal, a package with a security signal is generally arranged on a printed circuit board or a flexible circuit board. The package has a first pad and a second pad arranged at intervals. A zebra strip or a carbon particle is arranged on a component. When the component is pressed on the printed circuit board or the flexible circuit board, the zebra strip or the carbon particle can conduct the first pad and the second pad. Once the component is disassembled, the zebra strip or the carbon particle is separated from the package, and the first pad and the second pad are disconnected, thereby triggering the security circuit on the printed circuit board or the flexible circuit board. However, in the existing payment terminal, many screens cannot withstand the pressing force. If the pressure is too large, the screen cannot withstand the anti-disassembly pressure and local water ripples appear, or the screen pasted on the shell by the adhesive will separate due to long-term outward pressure. If the pressure is too small, the safe anti-disassembly structure will be unreliable, which will easily trigger the screen during normal use. In addition, when the payment terminal is assembled, the zebra strip on the screen and the package on the printed circuit board need to be abutted by locking between the printed circuit board and the shell. Therefore, during assembly, the screen is first assembled, then the printed circuit board is assembled, and finally the shell is assembled and locked. The locking part of this assembly method is exposed and not aesthetic. SUMMARY

[0004] The purpose of the embodiment of the application is to provide a safe anti-disassembly structure and a payment terminal to solve the technical problem of unreliable safe anti-disassembly structure due to the screen being unable to withstand the pressure in the prior art.

[0005] To achieve the above purpose, the technical solution adopted by the application is to provide a safe anti-disassembly structure for preventing disassembly of a component on a main device, which comprises:

[0006] A printed circuit board is configured to be installed in the main device. The printed circuit board has a security chip.

[0007] A support member is fixedly installed on the printed circuit board.

[0008] The flexible circuit board comprises a connecting section and a first anti-tearing section; the first anti-tearing section comprises a first substrate layer, a first trace layer and a first cover layer which are sequentially laminated, the first trace layer and the first cover layer have adhesion or no adhesion, the first trace layer and the first substrate layer have no adhesion, the first substrate layer is supported on the support, and the first cover layer is arranged to be attached to the component; the connecting section is fixedly arranged, and the first trace layer is in communication connection with the security chip through the connecting section.

[0009] In a possible design, the security anti-disassembly structure further comprises a second anti-tearing section; the second anti-tearing section comprises a second substrate layer, a second trace layer and a second cover layer, the second trace layer and the second cover layer have adhesion or no adhesion, the second trace layer and the second substrate layer have no adhesion, the second cover layer is attached to the support, and the second substrate layer is arranged to abut against the component; the second trace layer is in communication connection with the first trace layer, the second substrate layer is in mechanical connection with the first cover layer, and the second cover layer is in mechanical connection with the first substrate layer.

[0010] In a possible design, a first buffer section is connected between the first anti-tearing section and the second anti-tearing section, the second trace layer and the first trace layer are in communication connection through the first buffer section, the second substrate layer and the first cover layer are in mechanical connection through the first buffer section, and the second cover layer and the first substrate layer are in mechanical connection through the first buffer section.

[0011] In a possible design, the flexible circuit board comprises a second buffer section, the second buffer section is in communication connection with the first trace layer, and the second buffer section is in mechanical connection with the first substrate layer and the first cover layer respectively.

[0012] In a possible design, an elastic pad is arranged on the support, the elastic pad pads up the first anti-tearing section and attaches the first anti-tearing section to the component.

[0013] In a possible design, the security anti-disassembly structure further comprises a conductor, the conductor is mounted on the printed circuit board, the connecting section abuts between the support and the conductor, and the connecting section is in communication connection with the security chip through the conductor.

[0014] In a possible design, the support is locked to the printed circuit board through a locking member, and the support is provided with the locking member at least at positions on opposite sides of the conductor respectively.

[0015] In a possible design, a plurality of pads are formed on the connecting section, the first trace layer is bent and extends and covers the first tear-proof section, and ends of the first trace layer are connected with the pads respectively.

[0016] In a possible design, a protection ring is further formed on the connecting section, the protection ring is arranged outside the pads, and the protection ring is mutually exclusive with the pads in terms of electrical level signals.

[0017] The safe anti-disassembly structure provided in the application has the following beneficial effects: the safe anti-disassembly structure provided in the embodiment of the application has an adhesive force between the first trace layer and the first cover layer, the first cover layer is pasted on a component, and the first trace layer has no adhesive force with the first base material layer, so that when the component is disassembled, the first cover layer is opened together with the component, the first trace layer is attached to the first cover layer on one side and is not attached to the first base material layer on the other side, most of the structure of the first trace layer is taken away by the first cover layer, a small part of the first trace layer stays on the first base material layer because the first base material layer is not taken away by the first cover layer, and the first trace layer itself is fragile, so that the first trace layer is damaged. Once the first trace layer is damaged, the circuit between the security chip, the connecting section and the first tear-proof section is disconnected, the security chip detects the disconnection of the circuit and immediately erases all sensitive information, and the whole main device is in a triggered state and cannot be used. In addition, if the first trace layer also has no adhesive force with the first base material layer, when the component is disassembled, the component is opened, the first cover layer is opened together with the component, and the first trace layer is damaged because both sides have no adhesive force and the structure itself is fragile. The safe anti-disassembly structure of the application only needs to support the first tear-proof section by the support, and does not require the component to have the ability to bear pressure, that is, the safe anti-disassembly structure of the application can be applied to a screen that cannot bear large pressure, and can also be used for a shell or other structure that can bear large pressure, so that the application range is better and the use is more reliable. In addition, when the component is a screen, the support can support the first tear-proof section to abut against the screen, so that during the assembly of the main device, the printed circuit board can be installed in the shell first, then the support and the flexible circuit board are installed, and finally the screen is installed, solving the problem of the installation sequence of the traditional main device that can only install the screen first, then install the printed circuit board, and finally install the shell and lock it, so that there is no need to lock screws on the surface of the shell, and the appearance of the whole main device is improved.

[0018] On the other hand, the application further provides a payment terminal, which comprises a shell, a screen and the safe anti-disassembly structure, the safe anti-disassembly structure is installed in the shell, and the screen is the component and is installed on the shell.

[0019] The beneficial effects of the payment terminal provided in this application are as follows: The payment terminal provided in this application embodiment, through the design of the aforementioned secure anti-tamper structure, makes the screen tamper-proof and reliably tamper-proof, thereby improving the security of the payment terminal. Simultaneously, during assembly, the printed circuit board can be installed in the housing first, followed by the support components and flexible circuit board, and finally the screen. This solves the problem of the traditional installation sequence in payment terminals, which requires first installing the screen, then the printed circuit board, and finally the housing and locking it. This eliminates the need to tighten screws on the surface of the housing, improving the overall aesthetics of the main device. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 A perspective view of the payment terminal provided in the embodiments of this application;

[0022] Figure 2 for Figure 1 A schematic diagram of a payment terminal after removing the screen and supporting components;

[0023] Figure 3 for Figure 1 A schematic diagram of the structure of a payment terminal after the screen is removed;

[0024] Figure 4 for Figure 1 Cross-sectional view of the flexible circuit board corresponding to the payment terminal;

[0025] Figure 5 This is a schematic diagram of the structure of the flexible circuit board provided in the embodiments of this application;

[0026] Figure 6 This is a schematic diagram illustrating the assembly of the flexible circuit board, screen, and support components provided in an embodiment of this application.

[0027] Figure 7 This is a schematic diagram of the wiring of a flexible circuit board provided in an embodiment of this application;

[0028] Figure 8 This is an assembly diagram of a flexible circuit board, screen, and support member provided for another embodiment of this application.

[0029] The following are the labeling elements in the figure:

[0030] 100, printed circuit board; 200, conductor; 300, support; 310, support portion; 311, first side; 312, second side; 313, third side; 320, mounting portion; 330, through slot; 400, flexible circuit board; 410, connecting segment; 411, solder pad; 412, guard ring; 420, first tear-preventing segment; 421, first base material layer; 422, first trace layer; 423, first cover layer; 430, second tear-preventing segment; 431, second base material layer; 432, second trace layer; 433, second cover layer; 440, first buffer segment; 441, third base material layer; 442, third trace layer; 443, third cover layer; 450, transition segment; 460, second buffer segment; 500, elastic pad; 600, protective wall; 700, locking member; 800, screen; 900, housing; 1000, magnetic stripe card reader; 1100, IC card reader. DETAILED DESCRIPTION

[0031] In order to make the technical problems to be solved, technical solutions and beneficial effects of the present application clearer, the present application will be further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not intended to limit the present application.

[0032] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0033] It should be understood that the terms "length", "width", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0034] In addition, the terms "first", "second", "third", etc. are only used for description purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features referred to. Therefore, the features defined with "first", "second", etc. can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specifically limited.

[0035] Please refer to Figure 1The security anti-disassembly structure provided by the embodiments of the present application will be described. The security anti-disassembly structure is used for anti-disassembly of a component on a main device, wherein the component can be the screen 800, and the main device can be a payment terminal. It can be understood that in other embodiments, the component can also be the shell 900, and the main device is a payment terminal; or the component is the screen 800 or the shell 900, and the main device is a mobile phone, a tablet computer, a game console or a cash dispenser, etc., which is not limited herein.

[0036] Please refer to Figure 2 and Figure 3 The security anti-disassembly structure includes a printed circuit board 100, a support 300 and a flexible circuit board 400. The printed circuit board 100 has a security chip thereon; the support 300 is fixedly installed on the printed circuit board 100; the flexible circuit board 400 includes a connection segment 410 and a first anti-tearing segment 420 in communication connection; the first anti-tearing segment 420 includes a first substrate layer 421, a first wiring layer 422 and a first cover layer 423 which are sequentially and press-bonded, the first wiring layer 422 has an adhesive force or no adhesive force with the first cover layer 423, the first wiring layer 422 has no adhesive force with the first substrate layer 421, the first substrate layer 421 is supported on the support 300, and the first cover layer 423 is pasted on the component; the connection segment 410 is fixedly arranged, and the first wiring layer 422 is in communication connection with the security chip through the connection segment 410.

[0037] The security chip is a security processor on the printed circuit board 100, and the first wiring layer 422 is in communication connection with the security chip through the connection segment 410, so as to form communication connection between the flexible circuit board 400 and the security chip. The first wiring layer 422 is a signal wiring (also referred to as a Tamper signal line or a trigger signal line), which is a signal line whose level change can be detected by the security chip. When the security chip detects that the level on the signal line is inconsistent with the set level value, the security chip will trigger the security mechanism to erase the key and other sensitive information. At the same time, since the connection segment 410 is fixed on the printed circuit board 100, the flexible circuit board 400 can always be connected with the security chip, and the security chip detects that the circuit works normally.

[0038] For the first anti-tearing segment 420, the first substrate layer 421 serves as the base body of the first anti-tearing segment 420, and is used for bearing the first wiring layer 422 and the first cover layer 423. Meanwhile, the first substrate layer 421 is also used for conducting the first wiring layer 422 and an external circuit; the first wiring layer 422 is a security circuit wiring layer, and the first anti-tearing segment 420 forms communication connection with the connection segment 410 through the first wiring layer 422; and the first cover layer 423 is used for covering and supporting the first wiring layer 422. When the first cover layer 423 is back-glued, the first cover layer 423 also plays a pasting role.

[0039] Secondly, it needs to be explained that the first wiring layer 422 and the first cover layer 423 have an adhesive force, which means that the first wiring layer 422 and the first cover layer 423 have a mutual adhesion force on the basis of mutual pressing, so that the first wiring layer 422 and the first cover layer 423 are tightly adhered together. The adhesive force can be achieved by setting a first adhesive layer between the first wiring layer 422 and the first cover layer 423 to adhere the first wiring layer 422 to the first cover layer 423; or a back adhesive can also be set on the first cover layer 423 to adhere the first wiring layer 422 to the first cover layer 423.

[0040] In addition, the first cover layer 423 is adhered to the component, which can be directly made into a back adhesive layer, or a back adhesive can also be set on the surface of the first cover layer 423.

[0041] When assembling, the first base layer 421 of the first tear-proof section 420 is first supported on the support 300, then the support 300 is fixed on the printed circuit board 100 and the connecting section 410 is fixedly connected, then the first cover layer 423 is adhered to the component, and finally the component is assembled and pressed to tightly adhere the component and the first cover layer 423 together. When the component is removed, the component is lifted, the first cover layer 423 is lifted with the component, the first wiring layer 422 is attached to the first cover layer 423 on one side and is not attached to the first base layer 421 on the other side, resulting in that most of the first wiring layer 422 is taken away by the first cover layer 423, a small part of the first wiring layer 422 stays on the first base layer 421 because the first base layer 421 is not taken away by the first cover layer 423, and the first wiring layer 422 itself is fragile, thereby causing the first wiring layer 422 to be damaged. Once the first wiring layer 422 is damaged, the circuit between the security chip, the connecting section 410 and the first tear-proof section 420 is disconnected, the security chip detects the disconnection and immediately erases all sensitive information, and the entire host device is in a triggered state and cannot be used. In addition, if the first wiring layer 422 and the first base layer 421 also do not have an adhesive force, when the component is removed, the component is lifted, the first cover layer 423 is lifted with the component, and the first wiring layer 422 is not attached on both sides due to the lack of adhesive force and is fragile in structure, so it is easy to be damaged by being split by the first cover layer 423 and the first base layer 421.

[0042] It needs to be explained that the configuration of the security chip in the present embodiment is the same as that of the security chip of the host device with the anti-disassembly function in the prior art, which is used to detect the on-off of the security loop, erase sensitive information, and make the entire host device in a triggered state and unable to be used, which will not be described in detail here.

[0043] Overall, the security anti-disassembly structure in the embodiment of the application supports the first tear-proof section 420 through the support 300 fixedly installed on the printed circuit board 100, so that the first tear-proof section 420 can be tightly pasted on the component, and then the internal structure of the first tear-proof section 420 in the flexible circuit board 400 is creatively and uniquely designed, so that the first trace layer 422 inside the first tear-proof section 420 will be damaged once the first tear-proof section 420 is lifted by the component, thereby achieving the purpose of anti-disassembly alarm. In addition, the security anti-disassembly structure of the application only needs to support the first tear-proof section 420 through the support 300, and does not require the component to have the ability to bear pressure, that is, the security anti-disassembly structure of the application can be applied to the screen 800 which cannot bear large pressure, and can also be used for the shell 900 or other structures which can bear large pressure, so that the application range is better and the use is more reliable.

[0044] In one embodiment, referring to Figure 5 and Figure 6 , the security anti-disassembly structure further comprises a second tear-proof section 430, the first tear-proof section 420 is mechanically connected with the second tear-proof section 430, and the first tear-proof section 420 is communicatively connected with the second tear-proof section 430.

[0045] Specifically, the second tear-proof section 430 comprises a second base material layer 431, a second trace layer 432 and a second cover layer 433, the second trace layer 432 and the second cover layer 433 have an adhesive force or do not have an adhesive force, the second base material layer 431 and the second trace layer 432 do not have an adhesive force, the second cover layer 433 is pasted on the support 300, and the second base material layer 431 is arranged to abut on the component; the second trace layer 432 is communicatively connected with the first trace layer 422, the second base material layer 431 is mechanically connected with the first cover layer 423, and the second cover layer 433 is mechanically connected with the first base material layer 421.

[0046] When the second trace layer 432 and the second cover layer 433 have an adhesive force, the second trace layer 432 and the second cover layer 433 can be pasted together through a second adhesive layer.

[0047] As can be seen from the above, the structural composition of the second tear-proof section 430 is the same as that of the first tear-proof section 420, except that the second cover layer 433 of the second tear-proof section 430 is pasted to the support 300, while the first cover layer 423 of the first tear-proof section 420 is attached to the component, that is, the second tear-proof section 430 is obtained by turning the first tear-proof section 420 by one side. When assembling, the first tear-proof section 420 and the second tear-proof section 430 are first joined together by joining technology, then the first cover layer 423 of the first tear-proof section 420 is pasted to the component, and the second cover layer 433 of the second tear-proof section 430 is pasted to the support 300, so that when the component is removed and lifted, the first cover layer 423 and the second cover layer 433 pull the first tear-proof section 420 and the second tear-proof section 430 in opposite directions respectively, so that the first wiring layer 422 and the second wiring layer 432 are more easily damaged, which can be the first wiring layer 422 first damaged, or the second wiring layer 432 first damaged, mainly depending on the position of the component being lifted, so that the sensitivity of the safety anti-disassembly structure is higher, the safety anti-disassembly effect is better, and it is more reliable.

[0048] In one embodiment, referring to Figure 5 and Figure 6 , the first tear-proof section 420 and the second tear-proof section 430 are connected by the first buffer section 440, the second wiring layer 432 and the first wiring layer 422 are communicatively connected through the first buffer section 440, the second substrate layer 431 and the first cover layer 423 are mechanically connected through the first buffer section 440, and the second cover layer 433 and the first substrate layer 421 are mechanically connected through the first buffer section 440. In this embodiment, the first buffer section 440 is provided between the first tear-proof section 420 and the second tear-proof section 430, so as to provide a buffer space between the first tear-proof section 420 and the second tear-proof section 430, thereby reducing damage to the first tear-proof section 420 or the second tear-proof section 430 caused by pulling when the main device falls or vibrates.

[0049] In one embodiment, referring to Figure 5 and Figure 6 , the first buffer section 440 is not pasted to the support 300, and the first buffer section 440 is not pasted to the component, so that when the first tear-proof section 420 or the second tear-proof section 430 is pulled when the main device falls or vibrates, the first buffer section 440 can buffer the pulling to reduce damage to the first tear-proof section 420 or the second tear-proof section 430. It can be understood that in other embodiments of the present application, the first buffer section 440 can also be pasted to the support 300, or the first buffer section 440 can also be pasted to the component, which is not limited herein.

[0050] In one embodiment, the first buffer section 440 does not have the tear-proof effect, that is, the structure of the first buffer section 440 is the same as that of the existing flexible circuit board 400. Specifically, please refer to Figure 5 and Figure 6 The first buffer section 440 includes a third substrate layer 441, a third trace layer 442, and a third cover layer 443, the third trace layer 442 has an adhesive force with the third cover layer 443, and the third trace layer 442 has an adhesive force with the third substrate layer 441. Therefore, whether the third substrate layer 441 or the third cover layer 443 is subjected to a pulling force, the third substrate layer 441, the third trace layer 442, and the third cover layer 443 will be taken away together, and the third trace layer 442 will not be damaged. The third trace layer 442 and the third cover layer 443 can be pasted together through a third adhesive layer, and the third trace layer 442 and the third substrate layer 441 can be pasted together through a fourth adhesive layer. It can be understood that in other embodiments of the present application, the first buffer section 440 can also have a tear-proof effect, and the specific structure and mounting method of the first buffer section 440 can be the same as those of the first tear-proof section 420 or the second tear-proof section 430.

[0051] In one embodiment, please refer to Figure 5 and Figure 6 The second tear-proof section 430, the first buffer section 440, and the first tear-proof section 420 are sequentially joined together, the second tear-proof section 430 is joined with the connecting section 410, and the internal traces in the connecting section 410, the second tear-proof section 430, the first buffer section 440, and the first tear-proof section 420 are sequentially and communicatively connected. It can be understood that in other embodiments of the present application, the positions of the first tear-proof section 420 and the second tear-proof section 430 can be exchanged, and the first tear-proof section 420 can be joined with the connecting section 410, which is not limited herein.

[0052] In one embodiment, please refer to Figure 4 The support 300 is provided with an elastic pad 500, and the elastic pad 500 pads and adheres the first tear-proof section 420 to the component. During assembly, the elastic pad 500 can be arranged on the support 300 first, then the first tear-proof section 420 is arranged on the elastic pad 500, and finally the component is assembled. Since the elastic pad 500 has a buffering effect, the first cover layer 423 of the first tear-proof section 420 can be tightly adhered to the component, so that when the component is lifted, the first cover layer 423 can be lifted together with the component, thereby ensuring the working reliability of the safety anti-disassembly structure.

[0053] In one embodiment, the elastic pad 500 is a foam, and the first tear-proof section 420 is padded by the foam to a certain height, so that the first tear-proof section 420 is fully attached to the components. It can be understood that in other embodiments, the elastic pad 500 can also be a silica gel pad or a rubber pad, which is not limited herein.

[0054] In one embodiment, referring to Figure 4 , the connecting section 410 is connected with the second tear-proof section 430 through a transition section 450. The transition section 450 is mainly used to realize the transition connection between the connecting section 410 and the first tear-proof section 420, specifically, to realize the mechanical connection and the communication connection between the connecting section 410 and the first tear-proof section 420. The structure of the transition section 450 is not specially required, and the transition section 450 can be pasted on the support 300. The transition section 450 can have a tear-proof effect, and the adhesion between the wiring layer and the cover layer is good, and the adhesion between the wiring layer and the base material layer is poor. Alternatively, the transition section 450 can not have a tear-proof effect, and the adhesion between the wiring layer and the cover layer and the adhesion between the wiring layer and the base material layer are good.

[0055] In one embodiment, referring to Figure 2 and Figure 4 , the security anti-tamper structure further comprises a conductive body 200, the conductive body 200 is installed on the printed circuit board 100, and the connecting section 410 is in communication connection with the security chip through the conductive body 200; the connecting section 410 is abutted between the support 300 and the conductive body 200, the conductive body 200 is installed on the printed circuit board 100, and the support 300 is also fixedly installed on the printed circuit board 100, so that the connecting section 410 can be abutted on the conductive body 200 through the support 300, to realize the communication connection between the connecting section 410 and the conductive body 200, ensure the reliable communication connection between the connecting section 410 and the conductive body 200, and thus when the first wiring layer 422 is damaged, it can be detected by the security chip in time.

[0056] In one embodiment, the support 300 is locked to the printed circuit board 100 by the locking member 700, and the locking member 700 is installed on the support 300 at least at positions on opposite sides of the conductive body 200. In this embodiment, the support 300 is locked to the printed circuit board 100 by the locking member 700, thereby ensuring the mounting stability of the support 300 on the printed circuit board 100. Meanwhile, the printed circuit board 100 is locked to the printed circuit board 100 at positions on opposite sides of the conductive body 200 by the two locking members 700 on opposite sides of the conductive body 200, thereby improving the locking stability of the support 300 to the connecting segment 410 and improving the communication stability between the connecting segment 410 and the conductive body 200. It can be understood that in other embodiments of the present application, the support 300 can also be fixed to the printed circuit board 100 by buckling, which is not limited herein.

[0057] In one embodiment, referring to Figure 4 , the support 300 has a first side 311 and a second side 312 arranged oppositely and a third side 313 connected between the first side 311 and the second side 312, the first tear-proof segment 420 is arranged on the first side 311, and the connecting segment 410 is arranged between the second side 312 and the conductive body 200; the security anti-disassembly structure further includes a transition segment 450 connected between the connecting segment 410 and the first tear-proof segment 420, and the transition segment 450 is arranged on the third side 313 of the support 300. In this embodiment, the support 300 is arranged to not only support the first tear-proof segment 420 but also lock and fix the connecting segment 410, which has a simple structure and is easy to assemble. It can be understood that in other embodiments of the present application, the connecting segment 410 can also be fixed separately by other structures, which is not limited herein.

[0058] In one embodiment, referring to Figure 3 and Figure 4 , the support 300 includes a support portion 310 and a mounting portion 320, the support portion 310 and the mounting portion 320 are connected to each other, the thickness of the support portion 310 along the direction perpendicular to the printed circuit board 100 is greater than the thickness of the mounting portion 320, the first tear-proof segment 420, the connecting segment 410 and the transition segment 450 are connected to the support portion 310, and the mounting portion 320 is arranged to support the printed circuit board 100 and to mount a sub-board or other accessories.

[0059] Referring to Figure 4 , a through slot 330 is formed at the connection between the support portion 310 and the mounting portion 320, corresponding to the connection between the connecting segment 410 and the transition segment 450, so as to facilitate the connecting segment 410 to pass through the through slot 330 to abut between the support portion 310 and the conductive body 200.

[0060] In one embodiment, the electrically conductive body 200 is a zebra strip, which is welded on the printed circuit board 100 and used to realize the communication connection between the flexible circuit board 400 and the printed circuit board 100. It can be understood that in other embodiments of the present application, the electrically conductive body 200 can also be carbon particles or other electrically conductive bodies 200 used for electrically conductive connection, which are not limited herein.

[0061] In one embodiment, referring to Figure 2 and Figure 4 , the security anti-disassembly structure further comprises a protective wall 600, which is welded on the printed circuit board 100 and in communication connection with the security chip. The protective wall 600 encloses a protective space, and the electrically conductive body 200 is arranged in the protective space. The protective wall 600 can protect the electrically conductive body 200 from being probed from the side. Specifically, when someone probes the electrically conductive body 200 from the side, the protective wall 600 will be touched, and the protective wall 600 is in communication connection with the security chip. Therefore, when the protective wall 600 is touched, the security chip will be detected, thereby triggering the security system.

[0062] In one embodiment, referring to Figure 7 , the connection section 410 is provided with a plurality of pads 411, the first wiring layer 422 is bent and extended to cover the first anti-tearing section 420, and the ends of the first wiring layer 422 are connected to the pads 411, respectively. In this embodiment, by covering the first anti-tearing section 420 with the first wiring layer 422, no matter which position of the first anti-tearing section 420 is damaged, the security chip will be triggered.

[0063] In one embodiment, referring to Figure 7 , the connection section 410 is provided with a plurality of pads 411, the first wiring layer 422 is bent and extended to cover the first anti-tearing section 420, the second wiring layer 432 is bent and extended to cover the second anti-tearing section 430, the third wiring layer 442 is bent and extended to cover the first buffer section 440, and the fourth wiring layer on the transition section 450 also covers the transition section 450. The first wiring layer 422, the third wiring layer 442, the second wiring layer 432 and the fourth wiring layer are connected in sequence and finally connected to the pads 411.

[0064] In one embodiment, referring to Figure 5The protection ring 412 is formed on the connection section 410 and surrounds each pad 411. The protection ring 412 and each pad 411 are mutually exclusive in terms of signal level. For example, when the pad 411 is at a high signal level, the protection ring 412 is at a low signal level. When the pad 411 is at a low signal level, the protection ring 412 is at a high signal level. When someone probes the pad 411 from the side, the pad 411 and the protection ring 412 are connected. Because the pad 411 and the protection ring 412 are mutually exclusive in terms of signal level, the security chip detects an abnormal signal and can be triggered.

[0065] The pad 411 can be exposed copper on the connection section 410, and the protection ring 412 can also be exposed copper on the connection section 410.

[0066] Optionally, the connection section 410 can have a tear-proof effect or can not have a tear-proof effect. The connection section 410 can have no adhesive, or can have single-sided adhesive or double-sided adhesive.

[0067] In another embodiment of the present application, referring to Figure 8 The flexible circuit board 400 includes a second buffer section 460, which is in communication connection with the first wiring layer 422. The second buffer section 460 is mechanically connected to the first base material layer 421 and the first cover layer 423. In this embodiment, the second buffer section 460 is arranged on the basis of the first tear-proof section 420 to buffer the first tear-proof section 420. The structure and function of the second buffer section 460 are the same as those of the first buffer section 440, and will not be repeated here.

[0068] In another embodiment of the present application, referring to Figure 8 The flexible circuit board 400 includes at least two first tear-proof sections 420. Adjacent two first tear-proof sections 420 are in communication connection and mechanical connection through the second buffer section 460. In this embodiment, the second buffer section 460 is arranged between the adjacent two first tear-proof sections 420 to provide a buffer space between the two first tear-proof sections 420. When the main device falls or vibrates, the two first tear-proof sections 420 are pulled, which causes damage to the two first tear-proof sections 420.

[0069] Referring to Figures 1 to 4 The present application also provides a payment terminal, which includes a shell 900, a screen 800, and the above-mentioned security anti-disassembly structure. The security anti-disassembly structure is installed in the shell 900. The screen 800 is a component, and the screen 800 is installed on the shell 900.

[0070] The payment terminal in this embodiment connects the above-mentioned security anti-disassembly structure on the screen 800, so that the screen 800 without support capability can achieve anti-disassembly.

[0071] Optionally, the printed circuit board 100 can be a main board of the payment terminal; or a printed circuit board 100 specially arranged for anti-disassembly, which is in communication connection with the main board of the payment terminal.

[0072] In one embodiment, referring to Figure 2 The payment terminal further comprises a magnetic stripe card reader 1000 arranged on the printed circuit board 100, which is in communication connection with the printed circuit board 100, and is used for reading a magnetic stripe card.

[0073] In one embodiment, referring to Figure 2 The payment terminal further comprises an IC card reader 1100 arranged on the printed circuit board 100, which is in communication connection with the printed circuit board 100, and is used for reading an IC card.

[0074] The above merely provides the preferred embodiments of the present application, but not for limiting the present application. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A security tamperproof structure for preventing tampering of a component on a main device, characterized by comprising: The security anti-disassembly structure comprises: A printed circuit board is arranged in the main body device, and the printed circuit board has a security chip; A support is fixedly arranged on the printed circuit board; A flexible circuit board comprises a connecting segment and a first anti-tearing segment; the first anti-tearing segment comprises a first substrate layer, a first trace layer and a first cover layer which are sequentially arranged; the first trace layer has or does not have adhesion with the first cover layer; the first trace layer does not have adhesion with the first substrate layer; the first substrate layer is supported on the support; the first cover layer is arranged to be adhered to the component; the connecting segment is fixedly arranged; the first trace layer is in communication connection with the security chip through the connecting segment; The security anti-disassembly structure further comprises a second anti-tearing segment; the second anti-tearing segment comprises a second substrate layer, a second trace layer and a second cover layer; the second trace layer has or does not have adhesion with the second cover layer; the second trace layer does not have adhesion with the second substrate layer; the second cover layer is adhered to the support; the second substrate layer is arranged to abut against the component; the second trace layer is in communication connection with the first trace layer; the second substrate layer is in mechanical connection with the first cover layer; the second cover layer is in mechanical connection with the first substrate layer.

2. The security opening preventing structure according to claim 1, wherein The first anti-tearing segment and the second anti-tearing segment are connected with a first buffer segment; the second trace layer and the first trace layer are in communication connection through the first buffer segment; the second substrate layer and the first cover layer are in mechanical connection through the first buffer segment; the second cover layer and the first substrate layer are in mechanical connection through the first buffer segment.

3. The security opening preventing structure according to claim 1, wherein The flexible circuit board comprises a second buffer segment; the second buffer segment is in communication connection with the first trace layer; the second buffer segment is in mechanical connection with the first substrate layer and the first cover layer respectively.

4. A security tamper-evident structure according to any one of claims 1 to 3, wherein An elastic pad is arranged on the support; the elastic pad pads up the first anti-tearing segment and adheres the first anti-tearing segment to the component.

5. The security opening preventing structure according to any one of claims 1 to 3, wherein The security anti-disassembly structure further comprises a conductor; the conductor is arranged on the printed circuit board; the connecting segment abuts between the support and the conductor; the connecting segment is in communication connection with the security chip through the conductor.

6. A security opening preventing structure according to claim 5, wherein The support is locked to the printed circuit board through a locking member; the support is arranged with the locking member at least at positions on opposite sides of the conductor.

7. The security opening preventing structure according to any one of claims 1 to 3, wherein A plurality of pads are formed on the connecting segment; the first trace layer is bent and extended to cover the first anti-tearing segment; ends of the first trace layer are connected with the pads respectively.

8. A security opening preventing structure according to claim 7, wherein A protection ring is further formed on the connecting segment; the protection ring is arranged outside the pads; the protection ring and the pads are in exclusive electrical connection.

9. A payment terminal, characterized by The security anti-disassembly structure of any one of claims 1 to 8 is arranged in the shell; the screen is the component and is arranged on the shell.

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