Force sensitive electronic device

Abstract

The present disclosure relates to force-sensitive electronic devices. An example force-sensitive electronic device is described herein. The device can include a device body, a touch surface bonded to the device body in a bonding region arranged along a peripheral edge of the touch surface, and a plurality of force sensors arranged between the device body and the touch surface. Each force sensor of the plurality of force sensors can be spaced apart from the bonding region.

Description

[0001] This application is a divisional application of Chinese invention patent application No. 201780032919.0, filed on April 20, 2017, entered the Chinese national phase on November 28, 2018, and entitled "Force-Sensitive Electronic Device".

[0002] Cross-references to related applications

[0003] This application claims the benefit of U.S. Provisional Patent Application No. 62 / 325,119, filed April 20, 2016, entitled “FORCE-SENSITIVE ELECTRONICDEVICE,” the disclosure of which is expressly incorporated herein by reference in its entirety. Background Technology

[0004] Touch-sensitive interfaces are widely used in electronic devices, especially consumer electronics. Various touch-sensitive technologies, including resistive, capacitive, surface acoustic wave, and optical technologies, are known in the art. These technologies can be used to sense when and where an operator contacts the touch-sensitive interface. This information can be used to control the operation of consumer electronic devices. Increasing the force sensitivity of touch-sensitive devices can increase the additional control dimensions, which can be very useful, but mechanical integration can be challenging. Summary of the Invention

[0005] This article describes the mechanical integration of force sensors into force-sensitive or touch-sensitive devices.

[0006] This document describes an exemplary force-sensitive electronic device. The device may include a device body, a touch surface, and a plurality of force sensors. The touch surface is bonded to the device body in an adhesive region arranged along the peripheral edge of the touch surface, and the plurality of force sensors are arranged between the device body and the touch surface. Each of the plurality of force sensors may be spaced apart from the adhesive region.

[0007] Additionally, the plurality of force sensors may optionally be at least two force sensors, wherein the at least two force sensors are arranged along a first direction, and wherein the spacing between each of the at least two force sensors and the corresponding peripheral edge of the touch surface is approximately equal.

[0008] Alternatively or otherwise, the plurality of force sensors may optionally be at least two force sensors, wherein the at least two force sensors are arranged along the second direction, and wherein the spacing between each of the at least two force sensors and the corresponding peripheral edge of the touch surface is approximately equal. Optionally, the equal spacing between the corresponding peripheral edges of the touch surface may be maximized.

[0009] Alternatively or otherwise, the device may include a display device disposed between the device body and the touch surface. Multiple force sensors may be disposed in the area between the outer edge of the display device and the bonding area.

[0010] Alternatively or otherwise, the device may include a processor and a memory operatively coupled to the processor. The memory may have computer-executable instructions stored thereon that, when executed by the processor, cause the processor to apply a correction scalar from a three-dimensional normalization matrix to forces applied to the touch surface and measured by multiple force sensors. The three-dimensional normalization matrix corrects for the nonlinear force responses of the multiple force sensors.

[0011] Alternatively or otherwise, the device may include a capacitive touch sensor configured to obtain the location of a force applied to a touch surface. The memory may have additional computer-executable instructions stored thereon that, when executed by a processor, cause the processor to receive the location of the force applied to the touch surface and apply a correction scalar from a three-dimensional normalization matrix based on the location of the force applied to the touch surface.

[0012] This document describes an exemplary method for correcting the nonlinear force response of a force-sensitive electronic device. The method may include measuring a force applied to a touch surface of the force-sensitive electronic device, obtaining the location of the force applied to the touch surface, and applying a correction scalar from a three-dimensional normalization matrix to the measured force applied to the touch surface based on the location of the force applied to the touch surface. The three-dimensional normalization matrix can correct the nonlinear force response of at least one force sensor. Alternatively, the applied force can be measured using at least one force sensor, and the location of the applied force can be obtained using a capacitive touch sensor.

[0013] This document describes another exemplary force-sensitive electronic device. The device may include a circuit board bonded to a touch surface or device body, a force sensor bonded to the circuit board, and a force sensor actuator bonded to the circuit board. The circuit board may include position features for aligning the force sensor actuator with the force sensor. For example, the position features may optionally be markings on the surface of the circuit board. Alternatively or otherwise, the position features may optionally be raised or recessed portions on the surface of the circuit board. An adhesive may be used to bond the force sensor actuator to the circuit board. Alternatively or otherwise, the force sensor actuator may be soldered to the circuit board.

[0014] Alternatively or otherwise, the force sensor actuator can be configured to apply a preload force to the force sensor. For example, when a touch surface is bonded to the device body, the force sensor actuator can apply a preload force to the force sensor.

[0015] Alternatively or otherwise, the circuit board may include circuitry configured to be electrically connected to a force sensor.

[0016] This document describes an exemplary method for manufacturing force-sensitive electronic devices. The method may include bonding a circuit board to a touch surface or device body, bonding a force sensor to the circuit board, aligning a force sensor actuator with the force sensor using position features of the circuit board, and bonding the force sensor actuator to the circuit board for alignment with the force sensor.

[0017] Alternatively, the method may include bonding the touch surface to the device body. This allows a preload force to be applied to the force sensor.

[0018] It should be understood that the aforementioned subject matter (e.g., correcting the nonlinear force response of force-sensitive electronic devices) can also be implemented as a computer-controlled device, computer process, computing system, or article of manufacture, such as a computer-readable storage medium.

[0019] Other systems, methods, features, and / or advantages will or may become apparent to those skilled in the art upon review of the following drawings and detailed description. All such additional systems, methods, features, and / or advantages are intended to be included within this description and are protected by the appended claims. Attached Figure Description

[0020] The components in the accompanying drawings are not necessarily proportional to each other. The same reference numerals denote corresponding components in all the views.

[0021] Figure 1 This is a cross-sectional view of a portion of an exemplary force-sensitive electronic device according to a specific implementation described herein.

[0022] Figure 2 It shows Figure 1 An exemplary arrangement of force sensors in an exemplary force-sensitive electronic device.

[0023] Figure 3A and Figure 3B It shows bonding with different materials. Figure 1 An exemplary force-sensitive electronic device includes a touch surface and a device body. Figure 3A The bonding process using a rigid adhesive is shown. Figure 3B The bonding process using foam tape adhesive is shown.

[0024] Figure 4 A force sensor actuator incorporated into an exemplary force-sensitive electronic device according to a specific embodiment described herein is illustrated.

[0025] Figure 5A and Figure 5B The diagram shows circuit boards respectively bonded to a touchscreen and a device body of an exemplary force-sensitive electronic device according to specific embodiments described herein.

[0026] Figure 6 The diagram shows the positional features of a circuit board of an exemplary force-sensitive electronic device according to a specific embodiment described herein.

[0027] Figure 7A and Figure 7B This illustrates a specific implementation of the bonding process before bonding the touch surface and the device body, as described herein. Figure 7A ) and afterwards ( Figure 7B An example force-sensitive electronic device.

[0028] Figure 8 It shows the results of such as... Figure 2 The force measurement values ​​obtained by the arranged force sensors are amplified and attenuated.

[0029] Figure 9 This demonstrates the use of polynomial response surface transformation for correction. Figure 8 The nonlinear force response measurement is shown in the figure.

[0030] Figure 10 An exemplary computing device is shown. Detailed Implementation

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. Methods and materials similar or equivalent to those described herein may be used in practice or testing of this disclosure. As used in this specification and the appended claims, the singular forms “a,” “an,” and “described” include plural references unless the context clearly indicates otherwise. The term “comprising” and its variations are used synonymously with the term “including” and its variations, and are open-ended, non-restrictive terms. The terms “optional” or “optionally” as used herein mean that a feature, event, or condition subsequently described may or may not occur, and the description includes instances where the feature, event, or condition occurs and instances where it does not occur. In this document, a range may be expressed as from “about” a specific value and / or to “about” another specific value. When such a range is expressed, an aspect includes from one specific value and / or to other specific values. Similarly, when the antecedent “about” is used to express a value as an approximation, it should be understood that the specific value constitutes another aspect. It should also be understood that the endpoints of each range are meaningful relative to and independent of another endpoint.

[0032] Now for reference Figure 1This document describes an exemplary force-sensitive electronic device (sometimes referred to herein as a touch-sensitive device). The force-sensitive electronic device may be an electronic device having a force-sensitive human-machine interface (“HMI”). Optionally, the force-sensitive electronic device may be a consumer electronic device, such as a laptop computer, tablet computer, mobile phone, or other consumer electronic device. However, it should be understood that these are provided by way of example only, and this disclosure contemplates that the force-sensitive electronic device may be any type of electronic device.

[0033] The device may include a device body 102, a touch surface 104, and a plurality of force sensors 108, the touch surface being bonded to the device body 102 in an adhesive region 106, and the plurality of force sensors being arranged between the device body 102 and the touch surface 104. Each force sensor 108 may be a piezoresistive, piezoelectric, or capacitive sensor. For example, each force sensor 108 may be configured to change at least one electrical characteristic (e.g., resistance, charge, capacitance, etc.) based on the amount or value of an applied force, and may output a signal proportional to the amount or value of the applied force. Alternatively or otherwise, each force sensor 108 may be a microelectromechanical (“MEMS”) sensor. For example, each force sensor 108 may optionally be a MEMS sensor as described in the following patents: U.S. Patent No. 9,487,388 entitled "Ruggedized MEMS Force Die" published November 8, 2016; U.S. Patent No. 9,493,342 entitled "Wafer Level MEMS Force Dies" published November 15, 2016; U.S. Patent Application Publication No. 2016 / 0332866 entitled "Miniaturized and ruggedized waferlevel mems force sensors" filed by Brosh et al. on January 13, 2015; or U.S. Patent No. 9,032,818 entitled "Microelectromechanical Load Sensor and Method of Manufacturing the Same" published May 19, 2015, the disclosures of which are incorporated herein by reference in their entirety.

[0034] The bonding area 106 can be arranged along the outer edge of the touch surface 104, such as... Figure 2 As shown. The adhesive area 106 is the area where a portion of the touch surface 104 contacts a portion of the device body 102. The adhesive area 106 may at least partially surround the display area, which is composed of… Figure 2 The dashed box in the diagram illustrates this. In other words, the bonding area 106 is located in the peripheral area of ​​the device, while the display area is located in the central area of ​​the device. See again... Figure 1 The touch surface 104 can be bonded to the device body 102 using adhesive 110. Adhesive 110 can be disposed between portions of the touch surface 104 that contact a portion of the device body 102. It should be understood that adhesive 110 secures the touch surface 104 relative to the device body 102. Therefore, as... Figure 1 As shown, the touch surface 104 is not free-floating relative to the device body 102. As described below, because the touch surface 104 is fixed relative to the device body 102 within the bonding area 106, it is difficult to obtain accurate force measurements in this area. The adhesive 110 may optionally be a pressure-sensitive adhesive (PSA), epoxy resin, or other structural adhesive. Optionally, the adhesive 110 may be a foam tape that allows the touch surface 104 to experience an increased range of motion in the z-direction or along the axis, such as... Figure 3A and Figure 3B As shown. In Figure 3A In this process, a rigid adhesive 110A is used to bond the touch surface 104 to the device body 102. The rigid adhesive hardens and locks the edges of the touch surface 104 upon curing. Figure 3B In this process, a foam tape adhesive 110B is used to bond the touch surface 104 to the device body 102. The foam tape adhesive is more flexible than adhesive 110A and allows the edges of the touch surface 104 to move.

[0035] In conventional touch-sensitive devices, it is generally preferred to place the force sensor near the periphery of the touch surface, for example, to maximize the touch area and provide a touch surface that can float freely relative to the device body. In other words, some degrees of freedom of movement between the touch surface and the device body helps to obtain accurate force measurements. However, this design is incompatible with other design considerations in conventional touch-sensitive electronics. Specifically, the touch surface in conventional touch-sensitive devices is bonded to the device body. However, placing the force sensor near the bonded area leads to attenuation of the force measurement value, making accurate force measurement difficult. (See again...) Figure 2 This describes an exemplary arrangement of force sensors 108 in a device in which a touch surface 104 is bonded to a device body 102. As described above, arranging the force sensors 108 near the bonding area 106 causes undesirable effects on force measurement. To reduce these undesirable effects, each of the plurality of force sensors 108 is coupled with… Figure 2 The adhesive area 106 is spaced apart. In other words, there is space between the adhesive area 106 and the force sensor 108. The force sensor 108 is not arranged within or near the adhesive area 106, where a portion of the touch surface 104 contacts a portion of the device body 102. Instead, the force sensor 108 is arranged inward (e.g., toward the center or display area) and spaced apart from the adhesive area 106. Figure 2The exemplary force-sensitive electronic device is substantially rectangular, such that the touch surface 104 has two pairs of corresponding peripheral edges (e.g., left / right peripheral edges and top / bottom peripheral edges). As used herein, the corresponding peripheral edges are opposite each other. It should be understood that Figure 2 The force-sensitive device shown is provided as an example only, and the force-sensitive device may have other shapes. Two force sensors 108A and 108B may be arranged along the x-direction or axis (also referred to herein as the "first direction"), wherein the spacing between them is approximately equal. Additionally, the two force sensors 108A and 108B may be arranged along the x-direction, wherein the spacing between each of the force sensors 108A, 108B and the corresponding peripheral edge of the touch surface 104 is approximately equal. Figure 2 In this configuration, the x-axis is parallel to the outer edge of the smaller force-sensitive electronic device. Force sensors 108 are equidistant from each other along the x-axis. Additionally, the outer edge is equidistant from the force sensors 108 along the x-axis. This is due to... Figure 2 The distances “a”, “b”, and “c” in the text represent distances. For example, when force sensors 108A and 108B are approximately equidistant from each other and approximately equidistant from the corresponding peripheral edges of touch surface 104, distance a ≈ distance b ≈ distance c. In other words, one peripheral edge of touch surface 104 (e.g., Figure 2 The distance "a" between the left edge of the touch surface 104 and the force sensor 108A is approximately equal to the distance "b" between the force sensors 108A and 108B. Distance "a" is also approximately equal to the relative outer edge of the touch surface 104 (e.g., the left edge of the touch surface 104). Figure 2 The distance “c” between the right edge of the force sensor 108 and the force sensor 108B is defined in the disclosure. This disclosure contemplates that the distances between the force sensors 108 and / or between the force sensor 108 and the peripheral edge can be selected to provide sufficient force transmission to the force sensor 108. This disclosure also contemplates that the distances can vary depending on the size of the force-sensitive electronic device, the number of force sensors, and / or the required force sensing resolution. In some specific embodiments, distances “a”, “b”, and “c” may be approximately 20 millimeters (mm). It should be understood that 20 mm is provided only as an exemplary dimension for distances “a”, “b”, and “c”, which may be greater than or less than 20 mm. It should also be understood that distances “a”, “b”, and “c” do not necessarily have to be equal to achieve sufficient force transmission.

[0036] Alternatively or otherwise, the two force sensors 108B and 108C may be arranged along the y-direction or axis (also referred to herein as the “second direction”), wherein the spacing between each of the force sensors 108B, 108C and the corresponding peripheral edge of the touch surface 104 is approximately equal. Figure 2In this configuration, the y-axis is parallel to the outer edge of the large force-sensitive electronic device. Each force sensor 108 is equidistant from the outer edge along the y-axis, and the distance from the outer edge is maximized. This is achieved by... Figure 2 The distances "d1" and "d2" in the text represent distances. For example, when force sensors 108B and 108C are approximately equidistant from the corresponding peripheral edges of touch surface 104, distance d1 ≈ distance d2. In other words, one peripheral edge of touch surface 104 (e.g., Figure 2 The distance “d1” between the top edge of the touch surface 104 and the force sensor 108B is approximately equal to the relative outer edge of the touch surface 104 (e.g., the top edge of the touch surface 104). Figure 2 The distance “d2” between the bottom edge of the touch surface 104 and the force sensor 108C. Optionally, the equal spacing between the respective peripheral edges of the touch surface 104 and each of the force sensors 108B and 108C is maximized, such that the force sensors 108B and 108C are arranged as far away from the bonding area 106 as possible. It should be understood that the number and arrangement of force sensors shown in the figure are provided only as examples, and other numbers and different arrangements of force sensors can be used. For example, force-sensitive electronic devices may include 1, 2, 3, 4, 5, etc., of force sensors, and may be arranged according to the description provided herein. In addition, the width of the bonding area 106 (shown as distance d3) can be minimized. Minimizing distance d3 allows for maximizing distances d1 and d2 as described herein, while it is understood that the impact of minimizing distance d3 on device durability can also be considered. The width d3 of the bonding area can be about 2 to 4 mm. In this example, distances d1 and d2 are maximized as much as possible while allowing sufficient space to provide sufficient force transmission, which can be achieved by making the values ​​of d1 and d2 equal to or greater than 4 mm. It should be understood that 2 to 4 mm is provided only as an example, and the width d3 of the bonding area can be greater than 4 mm or less than 2 mm. Furthermore, the values ​​of d1 and d2 are provided only as examples and may depend on the value of d3. This disclosure contemplates the possibility of selecting the distance between the force sensor 108 and its peripheral edge to provide sufficient force transmission to the force sensor 108. This disclosure also contemplates that the distance may vary depending on the size of the force-sensitive electronics, the number of force sensors, and / or the required force sensing resolution.

[0037] Refer again Figure 1 The device may also include a display device 112 disposed between the device body 102 and the touch surface 104. The display device 112 may be a liquid crystal display (LCD), a light-emitting diode (LED) display, an organic LED (OLED) display, or other types of display. The bonding region 106 may be disposed at least partially around the periphery of the display region (e.g., around the periphery of the display device 112), such as... Figure 2 As shown. For example, the bonding area 106 can be arranged in a closed loop around the periphery of the display area, such as... Figure 2As shown. Figure 1 As shown, in some specific embodiments, multiple force sensors 108 may be arranged in the region between the peripheral edge of the display device 112 and the bonding region 106. By arranging the force sensors 108 in this region, no additional height can be added to the device, which minimizes the total thickness of the device in the z-direction. For example, current advancements in mobile phone technology have reduced the size of the bezel at the bonding points of electronic components (e.g., Figure 1 The bonding area 106 in the middle) and the display (e.g., Figure 1 The space between the displays 112 in the display is relatively small. Therefore, this disclosure envisions a force sensor (e.g., Figure 1 The force sensors 108 can optionally be placed below the display to minimize their impact on the component area and allow for greater placement flexibility. For example, in other embodiments, one or more force sensors can optionally be clipped on... Figure 1 Between the main body 102 of the device and the display 112.

[0038] Now for reference Figures 4 to 7B This describes an exemplary force-sensitive electronic device incorporating a force sensor actuator. Figures 4 to 7A Force-sensitive electronic devices have many similarities to Figure 1 The device shares common features with the touch surface 104, therefore these common features will not be described in detail below. The device may include a circuit board 114 bonded to the touch surface 104, a force sensor 108 bonded to the circuit board 114, and a force sensor actuator 116 bonded to the circuit board 114. The circuit board 114, force sensor 108, and / or force sensor actuator 116 may be bonded using adhesives (such as PSA, DSA, or other structural adhesives). Additionally, the circuit board 114 may be any circuit board configured to electrically connect the force sensor to the processor. For example, the circuit board 114 may optionally be a rigid or flexible printed circuit board (PCB). Optionally, the circuit board 114 may be a flexible PCB (FPCB). Furthermore, the force sensor actuator 116 may be formed from a variety of materials such as rubber or polymers (e.g., urethane, polyurethane, silicone, etc.). Although Figure 4 A circuit board 114 bonded to touch surface 104 is shown; however, it should be understood that in some alternative embodiments, circuit board 114 may be bonded to device body 102. For example, Figure 5A A circuit board 114 is shown bonded to the touch surface 104 of the device. This is related to... Figure 5B In contrast, it shows the circuit board 114 bonded to the device body 102.

[0039] Now for reference Figure 6The circuit board 114 may include one or more position features 120 for aligning the force sensor actuator 116 with the force sensor 108. For example, the position features 120 may optionally be markings on the surface of the circuit board 114. Alternatively or otherwise, the position features 120 may optionally be protrusions or recesses on the surface of the circuit board 114. The position features 120 can be used to mechanically align the force sensor actuator 116 and the force sensor 108 during manufacturing. Due to the relatively small size and manufacturing tolerances of the force sensor 108, aligning the force sensor with the force application features of the device body can be difficult. Therefore, providing position features on the circuit board 114 overcomes this difficulty.

[0040] Refer again Figure 4 Force sensor actuator 116 can be configured to apply a preload force to force sensor 108. For example, when touch surface 104 is bonded to device body 102, force sensor actuator 116 can apply a preload force to force sensor 108. Force sensor actuator 116 can compress and preload force sensor 108. Figure 7A and Figure 7B This is shown before bonding the touch surface 104 and the device body 102 ( Figure 7A ) and afterwards ( Figure 7B An example force-sensitive electronic device. (e.g.) Figure 4 As shown, a gap 115 may be provided between the force sensor actuator 116 and the device body 102. The gap 115 accommodates manufacturing and assembly tolerances. Additionally, a deformable layer 117 may form a deformable zone between the force sensor actuator 116 and the device body 102. The deformable layer 117 may be configured to deform in the z-direction and apply a preload force to the force sensor 108 when the touch surface 104 is bonded to the device body 102. The preload force may be designed not to exceed a predetermined percentage of the force sensing range of the force sensor, such as 20% (e.g., for a force sensor with a range of 10N, the preload force may be designed not to exceed 2N). Alternatively or additionally, the preload force may have a predetermined tolerance, such as + / - 20% (e.g., for a preload force of 2N, the predetermined tolerance is 1.6N-2.4N). It should be understood that the predetermined percentage and / or predetermined tolerance may have values ​​other than those provided above as examples only. Optionally, the force sensor actuator 116 may include a portion (e.g., a protrusion) for distributing the applied force to the force sensor 108. Techniques for reducing the torque and / or shear force applied to the force sensor are known in the art. For example, U.S. Patent No. 7,190,350, filed April 12, 2002 by Roberts and entitled “Touch screen with rotationally isolated force sensor,” describes a rotationally isolated force sensor.

[0041] As mentioned above, placing the force sensor near the bonded area results in amplification and / or attenuation of the force measurement. This can make accurate force measurement difficult. Now refer to Figure 8 This describes the amplification and attenuation of force measurements. These effects are expressed relative to... Figure 2 The force sensor arrangement described occurs as follows. At some locations, the force measurement is amplified by approximately 20% (e.g., at the opposite end along the y-axis of the device). At other locations, the force measurement is attenuated by approximately 80% due to edge effects, and in some cases, by more than 80% (e.g., at the opposite end along the x-axis of the device). In contrast, the force measurement at the center of the device is accurate. Therefore, the force response of the device is non-linear.

[0042] To correct the nonlinear response, the data from the three-dimensional normalized matrix (e.g., Figure 9 The correction scalar of the "normalization matrix" shown can be applied to forces measured by multiple force sensors (e.g., force sensor 108 as described herein). The three-dimensional normalization matrix can correct for the nonlinear force responses of multiple force sensors based on the touch location (X,Y) and the uncompensated force (F'), provided the touch location is known based on another touch sensor. For example, the device may also include capacitive touch sensors, such as a projected capacitive touchscreen for obtaining the location of the applied force.

[0043] In a projected capacitive touchscreen, an insulator (e.g., glass) is coated with a conductive material. The conductive material can be a conductive layer, a grid (e.g., rows and columns), an array, etc. Optionally, the conductive material can be transparent, such as indium tin oxide (“ITO”). A voltage can be applied to the conductive material to generate an electrostatic field. Then, when a conductor (e.g., a human finger) touches the display, the local electrostatic field is distorted. The local distortion can be detected / measured on the display as a change in capacitance and one or more touch locations (e.g., x-position and y-position) can be determined. Projected capacitive touchscreens are known in the art and will not be described in further detail herein.

[0044] Using the location of the applied force and the uncompensated magnitude, a correction scalar from a three-dimensional normalization matrix can be applied to the measured force applied to the touch surface based on the location of the force applied to the touch surface. For example, the three-dimensional normalization matrix may have axes corresponding to the x-position, y-position (sometimes referred to herein as the "position plane of the touch surface"), and force, such that any nonlinearity of the force at a fixed location can be accurately corrected. The three-dimensional normalization matrix may have multiple nodes or points in the x,y plane and may have multiple force levels. An exemplary correction matrix for a mobile phone may have 96 points in the x,y plane and may have 3 to 5 force levels. It should be understood that the number of points and / or force levels in the x,y plane is not intended to be limited by this disclosure. Multiple points may be distributed across the x,y plane. This disclosure contemplates that points may be uniformly or non-uniformly spaced in the x,y plane. Furthermore, different correction scalars may be applied at the same point depending on the magnitude of the applied force. For example, in some embodiments, the three-dimensional normalization matrix may have three force levels. When the applied force is less than a first threshold, a first correction scalar can be applied to correct the uncompensated force. When the applied force is greater than the first threshold but less than a second threshold, a second correction scalar can be applied to correct the uncompensated force. When the force is greater than the second threshold, a third correction scalar can be applied to correct the uncompensated force. If a force is applied between matrix nodes or points, the correction scalar can be determined by linear interpolation or continuous approximation of the correction scalar values ​​at multiple nearby matrix nodes or points. Therefore, the nonlinear force response of the entire touchscreen can be corrected under a series of forces. This correction is as follows: Figure 9 As shown.

[0045] Using a dense calibration matrix to characterize each device on a production line is typically impractical. Such a calibration procedure could take more than a minute per device, significantly increasing testing costs for high-volume products. Therefore, to reduce testing time for high-volume products, a small number of devices (e.g., a subset of high-volume products) can be represented by a dense point matrix (e.g., points on the position plane of a touch surface) to represent the group (e.g., high-volume products). It should be understood that the number of points in the dense matrix should not be limited by this disclosure. From these matrices of the device subset, the master matrix can be calculated by averaging each point in the matrix of all measured devices in the subset. The master matrix can then be applied to each device on the line without calibration. For example, the master matrix can be used to adjust one or more scalar values ​​of the aforementioned three-dimensional normalized matrix for each device on the line. To improve accuracy, one or more points (e.g., a smaller number of points compared to the number of points in the master matrix) can optionally be measured on each device to calibrate the master matrix before applying it to the device. This can be done by weighting the master matrix points relative to the calibration points based on their distance from the calibration points. Various known methods can be used to determine the optimal weighting to maximize accuracy, including linear and polynomial functions. This testing method has been shown to significantly reduce calibration time while measuring force with high accuracy on the device's touchscreen.

[0046] The device may also include a processor and memory operatively coupled to the processor. The processor may be configured to apply a correction scalar from a three-dimensional normalized matrix as described herein. Regarding Figure 10 The computing device described herein includes an exemplary processor and memory. The processor may be communicatively coupled to a force sensor, for example, via a circuit board (e.g., circuit board 114 as described herein). This disclosure contemplates that the processor and the force sensor may be communicatively coupled via any medium facilitating data exchange between the processor and the force sensor, including but not limited to wired, wireless, and optical links. The force applied to a touch surface (e.g., touch surface 104 as described herein) may be measured by the force sensor and received by the processor. Alternatively or otherwise, the processor and a capacitive touch sensor, such as a projected capacitive touchscreen, may be communicatively coupled, for example via any medium facilitating data exchange between the processor and the capacitive touch sensor, including but not limited to wired, wireless, and optical links. The location of the applied force may be measured by the capacitive touch sensor and received by the processor.

[0047] It should be understood that the logical operations described herein with reference to the various figures can be implemented as (1) on a computing device (e.g., Figure 10(1) A series of computer-implemented actions or program modules (i.e., software) running on the computing device described herein, (2) interconnected machine logic circuits or circuit modules (i.e., hardware) within the computing device, and / or (3) a combination of software and hardware of the computing device. Therefore, the logical operations discussed herein are not limited to any particular combination of hardware and software. Implementation is a matter of choice, depending on the performance and other requirements of the computing device. Therefore, the logical operations described herein are referred to differently as operations, structural devices, actions, or modules. These operations, structural devices, actions, and modules may be implemented in software, in firmware, in dedicated digital logic, and in any combination thereof. It should also be understood that more or fewer operations than those shown in the figures and described herein may be performed. These operations may also be performed in a different order than those described herein.

[0048] See Figure 10 An exemplary computing device 1000 is shown on which embodiments of the present invention can be implemented. It should be understood that the exemplary computing device 1000 is merely one example of a suitable computing environment on which embodiments of the present invention can be implemented. Optionally, the computing device 1000 can be a well-known computing system, including but not limited to personal computers, servers, handheld or laptop devices, multiprocessor systems, microprocessor-based systems, networked personal computers (PCs), minicomputers, mainframe computers, embedded systems, and / or distributed computing environments comprising multiple of the foregoing systems or devices. Distributed computing environments enable remote computing devices connected to communication networks or other data transmission media to perform various tasks. In a distributed computing environment, program modules, applications, and other data can be stored on local and / or remote computer storage media.

[0049] In its most basic configuration, the computing device 1000 typically includes at least one processing unit 1006 and system memory 1004. Depending on the exact configuration and type of the computing device, the system memory 1004 can be volatile (such as random access memory (RAM)), non-volatile (such as read-only memory (ROM), flash memory, etc.), or a combination of both. This most basic configuration in... Figure 10 The image is shown as dashed line 1002. The processing unit 1006 may be a standard programmable processor that performs the arithmetic and logical operations required to operate the computing device 1000. The computing device 1000 may also include a bus or other communication mechanism for transmitting information between the various components of the computing device 1000.

[0050] The computing device 1000 may have additional features / functions. For example, the computing device 1000 may include additional storage, such as removable storage 1008 and non-removable storage 1010, including but not limited to disks, optical discs, or magnetic tapes. The computing device 1000 may also include one or more network connections 1016 that allow the device to communicate with other devices. The computing device 1000 may also have input devices 1014, such as a keyboard, mouse, touchscreen, etc. It may also include output devices 1012, such as a monitor, speakers, printer, etc. Additional devices may be connected to a bus to facilitate data communication between the various components of the computing device 1000. All of these devices are well known in the art and need not be discussed in detail here.

[0051] Processing unit 1006 can be configured to execute program code encoded in a tangible computer-readable medium. A tangible computer-readable medium refers to any medium capable of providing data that causes computing device 1000 (i.e., the machine) to operate in a particular manner. Instructions to be executed can be provided to processing unit 1006 using various computer-readable media. Exemplary tangible computer-readable media may include, but are not limited to, volatile media, non-volatile media, removable media, and non-removable media implemented in any method or technology for storing information such as computer-readable instructions, data structures, program modules, or other data. System memory 1004, removable storage 1008, and non-removable storage 1010 are examples of tangible computer storage media. Exemplary tangible computer-readable recording media include, but are not limited to, integrated circuits (e.g., field-programmable gate arrays or application-specific integrated circuits), hard disks, optical disks, magneto-optical disks, floppy disks, magnetic tapes, holographic storage media, solid-state devices, RAM, ROM, electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, CD-ROMs, digital versatile optical discs (DVDs) or other optical storage, magnetic tape cassettes, magnetic tapes, disk storage, or other magnetic storage devices.

[0052] In an exemplary embodiment, processing unit 1006 may execute program code stored in system memory 1004. For example, a bus may transmit data to system memory 1004, and processing unit 1006 may receive and execute instructions from system memory. Data received in system memory 1004 may optionally be stored in removable storage 1008 or non-removable storage 1010 before or after execution by processing unit 1006.

[0053] It should be understood that the various techniques described herein can be implemented in combination with hardware or software, or in combination thereof, where appropriate. Therefore, the methods and apparatuses of the subject matter disclosed herein, or certain aspects or portions thereof, may take the form of program code (i.e., instructions) contained in a tangible medium such as a floppy disk, CD-ROM, hard disk drive, or any other machine-readable storage medium, wherein when the program code is loaded into and executed by a machine such as a computing device, the machine becomes an apparatus for implementing the subject matter disclosed herein. Where the program code executes on a programmable computer, the computing device generally includes a processor, a processor-readable storage medium (including volatile and non-volatile memory and / or storage elements), at least one input device, and at least one output device. One or more programs may implement or utilize the processes described in connection with the subject matter disclosed herein, for example, by using an application programming interface (API), reusable controls, etc. Such programs may be implemented using a high-level procedural language or an object-oriented programming language to communicate with a computer system. However, if desired, one or more programs may be implemented using assembly language or machine language. In any case, the language may be a compiled language or an interpreted language and may be combined with a hardware implementation.

[0054] Although the subject matter has been described using language specific to structural features and / or methodological actions, it should be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or actions described above. Rather, the specific features and actions described above are disclosed as examples of implementing the claims.

Claims

1. A method for correcting the nonlinear force response of a force-sensitive electronic device, the force-sensitive electronic device having a touch surface attached to the electronic device at an adhesive region along the periphery of the touch surface, and the touch surface defining a display area within the touch surface that does not overlap with the adhesive region, the method comprising: A series of force sensors are placed sequentially within the electronic device from the first force sensor to the last force sensor along a first axis extending across the touch surface in a first direction from a first peripheral edge near the first force sensor to a second peripheral edge near the last force sensor, and the force sensors are positioned entirely within the display area of ​​the touch surface. The series of force sensors are spaced at equal distances between the first outer edge and the first force sensor, between the second outer edge and the last force sensor, and between the force sensors in the series of force sensors. A set of corresponding correction scalars is assigned to a corresponding location on the touch surface, and each correction scalar in each set corresponds to at least one magnitude of the force applied at the corresponding location; The force applied to the touch surface of the force-sensitive electronic device at one of the corresponding locations is measured using at least one force sensor; The corresponding location of the force applied to the touch surface is obtained using a capacitive touch sensor; as well as Select from the set of selection scalars for the corresponding locations a correction scalar to be assigned to the magnitude of the force applied at the corresponding location of the applied force. The correction scalar is applied to the measured force.

2. The method of claim 1, further comprising a three-dimensional normalized matrix comprising a plurality of correction scalars for a plurality of points in a position plane of the touch surface, the plurality of correction scalars being assigned to a plurality of corresponding sets of correction scalars at corresponding locations on the touch surface.

3. The method of claim 2, wherein the three-dimensional normalization matrix further comprises a plurality of correction scalars for the plurality of force levels.

4. The method of claim 1, further comprising obtaining the correction scalar by finding a three-dimensional normalization matrix, the three-dimensional normalization matrix comprising a corresponding set of a plurality of correction scalars assigned to corresponding locations on the touch surface.

5. The method of claim 4, further comprising calculating the correction scalar by linear interpolation or continuous approximation of the correction scalar between points in the position plane of the touch surface.

6. The method according to claim 1, further comprising: An additional series of force sensors are positioned along a second axis, which extends across the touch surface in a second direction from a third peripheral edge near the first force sensor to a fourth peripheral edge near the end force sensor. The force sensors are fully positioned within the display area of ​​the touch surface. The additional series of force sensors are spaced at equal distances between the third peripheral edge and the first force sensor, between the fourth peripheral edge and the end force sensor, and between the force sensors in the additional series of force sensors.

7. A force-sensitive electronic device for correcting nonlinear force responses, comprising: A touch surface is attached to the force-sensitive electronic device by an adhesive region at the periphery of the touch surface, the touch surface defining a display area within the touch surface that does not overlap with the adhesive region; Within the electronic device, a series of force sensors are arranged along a first axis in order from a first force sensor to a last force sensor. The first axis extends across the touch surface in a first direction from a first peripheral edge near the first force sensor to a second peripheral edge near the second force sensor. The force sensors are fully positioned within the display area of ​​the touch surface, and the series of force sensors are spaced apart by equal distances between the first peripheral edge and the first force sensor, between the second peripheral edge and the last force sensor, and between the force sensors in the series of force sensors. A capacitive touch sensor is configured to detect the corresponding position of the force applied to the touch surface; A processor and a memory, the memory being operatively coupled to the processor, wherein the memory has computer-executable instructions stored thereon that, when executed by the processor, cause the processor to: Access includes a three-dimensional normalized matrix comprising a plurality of correction scalars assigned to corresponding locations on the touch surface, each correction scalar in each set corresponding to at least one magnitude of a force applied at the corresponding location; Receive a measurement of the magnitude of the force applied to the touch surface, wherein the force applied to the touch surface is measured using at least one force sensor; The location of the force applied to the touch surface is received, wherein a capacitive touch sensor is used to obtain the location of the force applied to the touch surface; as well as A correction scalar is selected from a set of selection scalars for the corresponding location, and the correction scalar is assigned to the magnitude of the force applied at the corresponding location of the applied force. The correction scalar is applied to the measured value of the force.

8. The force-sensitive electronic device of claim 7, wherein the three-dimensional normalization matrix comprises a plurality of correction scalars for a plurality of points in the position plane of the touch surface.

9. The force-sensitive electronic device of claim 8, wherein the three-dimensional normalization matrix further comprises a plurality of correction scalars for a plurality of force levels.

10. The force-sensitive electronic device of claim 7, wherein the memory has additional computer-executable instructions stored thereon, which, when executed by the processor, cause the processor to obtain the correction scalar by searching in the three-dimensional normalized matrix.

11. The force-sensitive electronic device of claim 10, wherein the memory has additional computer-executable instructions stored thereon, which, when executed by the processor, cause the processor to calculate the correction scalar by linear interpolation or continuous approximation of a correction scalar between points in the position plane of the touch surface.

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