On-vehicle domain controller

Abstract

The application relates to a vehicle-mounted domain controller, which comprises a cover shell, a bottom cover, a female plate, a sub plate, a heat dissipation system and the like.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of domain controller, in particular to a vehicle-mounted domain controller. BACKGROUND

[0002] The vehicle-mounted domain controller is an indispensable part of the automobile, which provides various functions (radio, navigation, video decoding, USB, Ethernet, etc.); the commonly used structure scheme of the cockpit domain controller host currently includes an existing middle frame main body, an existing main PCB board, an existing bottom cover, and an existing screw, wherein the existing main PCB board is embedded between the existing middle frame main body and the existing bottom cover, and when the function needs to be expanded, the existing adapter PCB board is erected above the existing main PCB board, the existing adapter PCB board is connected with the existing main PCB board by using the existing adapter support, and the existing main PCB board and the existing adapter PCB board are both embedded between the existing middle frame main body and the existing bottom cover.

[0003] This scheme needs to expand the function by adding the existing adapter PCB board, and the existing middle frame main body needs to be greatly changed, and there is no effective isolation between the existing main PCB board and the existing adapter PCB board, the internal space electronic radiation interferes with each other, and the host performance is affected. When the heat dissipation of the existing main PCB board chip increases, the host almost cannot improve the heat dissipation performance, and only a new host can be opened, so the commonality of this structure is not high.

[0004] The technical problems (technical defects) existing in the above background art are:

[0005] The most important and key technical problem is:

[0006] 1. When the function is expanded and the heat dissipation of the existing main PCB board chip changes, the commonality of the host is not high. The heat dissipation performance of the traditional host is insufficient, and the heat dissipation performance needs to be improved.

[0007] 2. These simple domain controllers have large overall volume and scattered arrangement, not only occupy a large space in the vehicle, but also have high overall cost of structural parts and heavy weight, which is not conducive to lightweight design.

[0008] 3. At the same time, the automobile domain controller has high working voltage / current, large power, high switching working frequency and other characteristics, which will form serious electromagnetic interference. The antenna interface will be connected with the mother board, but the mother board and the daughter board will also produce electromagnetic interference. If the relative distance is not enough, the sensitivity of the antenna will be degraded (Desense) and other problems.

[0009] In order to solve the above problems, the vehicle-mounted domain controller is proposed. SUMMARY

[0010] The applicant provides a vehicle-mounted domain controller to improve the heat dissipation effect among the mother board, the daughter board and the antenna assembly, and reduce the electromagnetic interference among the electronic components.

[0011] The technical scheme adopted by the application is as follows:

[0012] Comprise:

[0013] The cover is provided with a containing cavity, and the cover is provided with a heat dissipation mounting portion extending to the containing cavity;

[0014] The bottom cover is connected with the cover to close the open face of the cover;

[0015] The mother board is fixed on the bottom cover;

[0016] The daughter board is fixed on the inner end wall of the containing cavity and is connected with the mother board through the connector;

[0017] The heat dissipation system is arranged in the heat dissipation mounting portion, and the structure of the heat dissipation system comprises a heat dissipation fan, the heat dissipation fan is fixed at one end of the heat dissipation mounting portion, and a plurality of heat dissipation fins in parallel with the air inlet direction are connected in the heat dissipation mounting portion;

[0018] The side wall of the heat dissipation mounting portion is further provided with an extension cavity extending to the containing cavity on the side of the daughter board and communicating with the containing cavity, a driven fan blade is rotatably connected in the extension cavity, and the driven fan blade sends air to the containing cavity for heat dissipation under the action of air flow in the heat dissipation mounting portion.

[0019] Further characterized in that:

[0020] The cover is provided with two groups of opposite heat dissipation holes, and the daughter board is located between the two heat dissipation holes, and the cover is further provided with a daughter board part settling area abutting the daughter board.

[0021] The heat dissipation mounting portion is in a rectangular structure and is open at both ends, the heat dissipation mounting portion is connected with a heat dissipation cover plate covering the heat dissipation fins and the heat dissipation fan, and the length of the heat dissipation cover plate is less than the length of the heat dissipation mounting portion.

[0022] The heat dissipation mounting portion and the bottom cover are reserved with a gap for accommodating the mother board, and the heat dissipation mounting portion is provided with a heat dissipation part settling area abutting the bottom cover.

[0023] The plurality of heat dissipation fins are distributed in parallel and equidistantly, one end of the plurality of heat dissipation fins close to the heat dissipation fan is arranged in a "V" shape, the length of the heat dissipation fin close to the side of the driven fan blade is shorter, and the driven fan blade is located between the windward side of the heat dissipation fin and the heat dissipation fan.

[0024] The rotation path of the driven fan blade extends into the heat dissipation mounting portion, the extension cavity is in an annular structure, and the extension cavity is provided with a ventilation hole.

[0025] The cover is provided with a plug-in area corresponding to the mother board and the daughter board, and a partition cover is arranged on the plug-in area to separate the connectors of the mother board and the daughter board.

[0026] The cover is provided with an antenna mounting portion on the side wall opposite to the plug-in area, the antenna mounting portion comprises two inverted-trapezoidally distributed antenna plug-in ports, the antenna plug-in ports are opposite to the corresponding ports on the mother board, the two antenna plug-in ports are separated from each other to avoid signal interference, and an antenna cover in an L-shaped distribution is connected to the cover and covers the antenna plug-in ports.

[0027] The antenna mounting portion is attached to the side wall of the heat dissipation mounting portion.

[0028] The bottom cover is provided with a mother board settling area attached to the mother board.

[0029] The present application has the following advantages:

[0030] The present application has the following advantages:

[0031] Meanwhile, the present application has the following advantages:

[0032] (1). The cover is provided with a containing cavity, and a heat dissipation mounting portion extending to the containing cavity is arranged on the cover, the heat dissipation mounting portion is open at both ends, the containing cavity is separated into two ends by the heat dissipation mounting portion, one end with a larger size is used for mounting the daughter board, and the other end with a smaller size is used for mounting the antenna, the daughter board and the antenna can be effectively separated, the electromagnetic interference is reduced, and a heat dissipation system is arranged in the heat dissipation mounting portion, the heat dissipation system is arranged in the middle portion, the heat generated by the daughter board, the antenna and the mother board can be better removed, and the heat dissipation effect is improved.

[0033] (2). The greatest improvement is that the heat dissipation system is arranged, the daughter board and the antenna are arranged on the two sides of the heat dissipation mounting portion, and the mother board is attached to the bottom of the heat dissipation mounting portion, the heat dissipation system arranged in the heat dissipation mounting portion can effectively reduce the heat generated by the daughter board, the antenna and the mother board, and the overall heat dissipation effect is improved.

[0034] (3). The heat dissipation system structure comprises a heat dissipation fan, which is fixed at one end of the heat dissipation mounting portion and used for introducing fresh air into the heat dissipation mounting portion, and a plurality of heat dissipation fins parallel to the side wall of the heat dissipation mounting portion are connected in the heat dissipation mounting portion, the plurality of heat dissipation fins are distributed in parallel and equidistantly, and the end of the plurality of heat dissipation fins close to the heat dissipation fan is arranged in a V shape, so that fresh air can be introduced into the heat dissipation mounting portion uniformly, and the heat dissipation fins can guide the heat on the cover shell out, and the heat on the heat dissipation fins is taken away by the air flow, so that the temperature of the cover shell is reduced.

[0035] (4). The side wall of the heat dissipation mounting portion is further provided with an extension cavity protruding between the mother board and the daughter board, the extension cavity is provided with a ventilation hole, a driven fan blade is rotatably connected in the extension cavity through a rotating shaft, the rotating shaft is perpendicular to the mother board, the rotating path of the driven fan blade extends into the heat dissipation mounting portion, and the driven fan blade sends air to the mother board and the daughter board for heat dissipation under the action of the air flow in the heat dissipation mounting portion, the heat dissipation fan introduces fresh air into the heat dissipation mounting portion, part of the fresh air is introduced into the driven fan blade along the side wall of the heat dissipation mounting portion, the driven fan blade rotates immediately and blows the introduced fresh air into the mother board and the daughter board from the ventilation hole of the extension cavity, so that the heat generated by the mother board and the daughter board is discharged from the heat dissipation hole, and the cooling effect of the mother board and the daughter board is improved.

[0036] (5). In order to improve the wind resistance of the driven fan blade, the length of the heat dissipation fin close to the side of the driven fan blade is relatively short, and the driven fan blade is located between the windward side of the heat dissipation fin and the heat dissipation fan, so that the rotating path of the driven fan blade is left, the driven fan blade can receive more wind force, and the shorter heat dissipation fin can introduce fresh air into the extension cavity, which is convenient for subsequent heat dissipation of the mother board and the daughter board.

[0037] (6). The heat dissipation mounting portion and the bottom cover are reserved with a gap for accommodating the mother board, and the heat dissipation portion of the heat dissipation mounting portion is provided with a settlement area abutting against the bottom cover, so that the contact area with the mother board is increased through the settlement area of the heat dissipation portion, the heat dissipation effect of the mother board is improved, the bottom cover is limited by clamping the mother board between the heat dissipation mounting portion and the bottom cover, and the overall fixing effect is improved.

[0038] (7). The antenna is fixed by the independent antenna cover, the overall effect is improved, the cover shell and the bottom cover are generally made of metal material, the antenna cover is made of non-metal material, the signal transmission of the antenna is facilitated, the cover shell and the bottom cover do not need to be disassembled during assembly and disassembly, the disassembly effect is improved, the antenna assembly is separated from the daughter board through the heat dissipation mounting portion, the contact range of the antenna assembly and the mother board is reduced through the inverted trapezoidal distribution of the antenna plug-in interface, and the two antenna plug-in interfaces are also separated, through the above structure distribution, the electromagnetic interference is minimized, and the stability of signal transmission is improved. BRIEF DESCRIPTION OF DRAWINGS

[0039] Figure 1 This is a schematic diagram of the structure of the present invention.

[0040] Figure 2 This is an exploded view of the present invention.

[0041] Figure 3 This is the front view of the present invention.

[0042] Figure 4 for Figure 5 A sectional view of section AA in the middle.

[0043] Figure 5 for Figure 5 Sectional view of section BB.

[0044] Figure 6 This is a schematic diagram of the structure of the casing in this invention.

[0045] Figure 7 This is a schematic diagram of the casing structure from another perspective in this invention.

[0046] in:

[0047] 100. Housing; 200. Bottom cover; 300. Heat dissipation system; 400. Antenna mounting section; 500. Mother board; 600. Daughter board; 700. Isolation enclosure; 800. Connector;

[0048] 101. Heat dissipation mounting section; 102. Heat dissipation holes; 103. Sub-board section settlement area; 104. Heat dissipation section settlement area; 105. Connecting area;

[0049] 201. Settlement zone of the mother slab;

[0050] 301. Cooling fan; 302. Heat sink cover; 303. Heat sink fins; 304. Extension cavity; 3041. Vent hole; 305. Driven fan blade;

[0051] 401. Antenna radome; 402. Antenna connector. Detailed Implementation

[0052] The specific embodiments of the present invention will now be described with reference to the accompanying drawings.

[0053] like Figures 1-7 As shown, this embodiment discloses an in-vehicle domain controller, characterized by including a housing 100, a bottom cover 200, a motherboard 500, a daughterboard 600, and a heat dissipation system 300, which can effectively reduce the heat generated by the housing 100, the motherboard 500, and the daughterboard 600 during operation, as well as reduce the electromagnetic interference of various electronic components.

[0054] Among them, such as Figure 6 and Figure 7As shown, the housing 100 is provided with a receiving cavity, and the housing 100 is provided with a heat dissipation mounting portion 101 extending to the receiving cavity, the heat dissipation mounting portion 101 is open at both ends, and the receiving cavity of the housing 100 is divided into two ends by the heat dissipation mounting portion 101, wherein the larger end is used for mounting the daughter board 600, and the smaller end is used for mounting the antenna, which can effectively separate the daughter board 600 and the antenna, reduce electromagnetic interference, and at the same time, the heat dissipation system 300 is arranged in the heat dissipation mounting portion 101, which can better take away the heat generated by the daughter board 600, the antenna, and the mother board 500, and improve the heat dissipation effect.

[0055] The bottom cover 200 is connected with the housing 100 and is used for closing the open face of the housing 100, the housing 100 is provided with two groups of opposite heat dissipation holes 102, and the daughter board 600 is located between the two heat dissipation holes 102.

[0056] The heat dissipation mounting portion 101 and the bottom cover 200 are reserved with a gap for accommodating the mother board 500, and the heat dissipation portion settling area 104 is arranged on the heat dissipation mounting portion 101 and abuts against the bottom cover 200, which can improve the contact area with the mother board 500 and improve the heat dissipation effect of the mother board 500, and at the same time, the mother board 500 is clamped between the heat dissipation mounting portion 101 and the bottom cover 200, which can limit the bottom cover 200 and improve the overall fixing effect.

[0057] As shown in the drawings, Figures 2-5 The mother board 500 is fixed on the bottom cover 200, the area of the mother board 500 is basically laid on the entire bottom cover 200, the bottom cover 200 is provided with a mother board settling area 201 abutting against the mother board 500, and the heat dissipation effect is improved.

[0058] In the embodiment, as shown in the drawings, Figure 3 and Figure 4 The daughter board 600 is fixed on the inner end wall of the receiving cavity, and is connected and interacted with the mother board 500 through the connector 800, the mother board 500 is fixed on the bottom cover 200, and the daughter board 600 is fixed on the inner end wall of the housing 100, which can increase the distance between the daughter board 600 and the mother board 500 as much as possible in the limited space.

[0059] The biggest improvement in this embodiment is to set the heat dissipation system 300 in the heat dissipation mounting portion 101. The heat dissipation system 300 includes a heat dissipation fan 301 fixed at one end of the heat dissipation mounting portion 101 for introducing fresh air into the heat dissipation mounting portion 101. A plurality of heat dissipation fins 303 parallel to the side wall of the heat dissipation mounting portion 101 are connected in the heat dissipation mounting portion 101. The plurality of heat dissipation fins 303 are distributed equidistantly in parallel. The plurality of heat dissipation fins 303 are arranged in a V shape at the end close to the heat dissipation fan 301, which can uniformly introduce fresh air into the heat dissipation mounting portion 101. The heat dissipation fins 303 can also conduct heat on the cover 100. The heat on the heat dissipation fins 303 is carried away by the air flow, thereby reducing the temperature of the cover 100.

[0060] In another embodiment, the heat dissipation mounting portion 101 has a rectangular structure. A heat dissipation cover plate 302 covering the heat dissipation fins 303 and the heat dissipation fan 301 is connected to the heat dissipation mounting portion 101. The length of the heat dissipation cover plate 302 is less than the length of the heat dissipation mounting portion 101, which can make the air flow move uniformly along the direction of the heat dissipation fins 303, facilitating the removal of heat. The length of the heat dissipation cover plate 302 is less than the length of the heat dissipation mounting portion 101, which facilitates installation and improves air outlet efficiency.

[0061] At the same time, the heat dissipation mounting portion 101 is flanked by a daughter board 600 and an antenna. The heat dissipation mounting portion 101 is also attached to a mother board 500. By setting the heat dissipation system 300 in the heat dissipation mounting portion 101, the heat generated by the daughter board 600, the antenna, and the mother board 500 can be effectively reduced, improving the overall heat dissipation effect.

[0062] To further improve the heat dissipation effect between the mother board 500 and the daughter board 600, as shown in Figures 4-5 and Figure 7 In this embodiment, an extension cavity 304 protruding towards the mother board 500 and the daughter board 600 is arranged on the side wall of the heat dissipation mounting portion 101. An air hole 3041 is formed in the extension cavity 304. A driven fan blade 305 is rotatably connected in the extension cavity 304 by a rotating shaft perpendicular to the mother board 500. The rotation path of the driven fan blade 305 extends into the heat dissipation mounting portion 101. The driven fan blade 305 is driven to send air to the mother board 500 and the daughter board 600 by the air flow in the heat dissipation mounting portion 101. Fresh air is introduced into the heat dissipation mounting portion 101 by the heat dissipation fan 301. Part of the fresh air is introduced into the driven fan blade 305 along the side wall of the heat dissipation mounting portion 101. The driven fan blade 305 is immediately rotated and blows the introduced fresh air into the mother board 500 and the daughter board 600 through the air hole 3041 in the extension cavity 304. Thus, the heat generated by the mother board 500 and the daughter board 600 is discharged from the heat dissipation hole 102, improving the cooling effect of the mother board 500 and the daughter board 600.

[0063] In this embodiment, in order to improve the wind resistance of the driven fan blade 305, the length of the heat dissipation fin 303 close to the side of the driven fan blade 305 is short, and the driven fan blade 305 is located between the windward side of the heat dissipation fin 303 and the heat dissipation fan 301, which can leave a path for the driven fan blade 305 to rotate, so that the driven fan blade 305 can receive more wind force, and the shorter heat dissipation fin 303 can introduce fresh air into the extension cavity 304, facilitating subsequent heat dissipation of the mother board 500 and the daughter board 600.

[0064] In this embodiment, the cover 100 is also provided with a daughter board part settling area 103 for attaching the daughter board 600, which improves the heat dissipation effect of the daughter board 600, increases the heat dissipation area at the heat concentration position, and further improves the heat dissipation effect.

[0065] As shown in Figure 3 The cover 100 is provided with a plug-in area 105 corresponding to the mother board 500 and the daughter board 600, and a separation cover 700 is arranged on the plug-in area 105 to separate the connectors of the mother board 500 and the daughter board 600.

[0066] In this embodiment, another important improvement is the structure design of the antenna mounting part 400, which is attached to the side wall of the heat dissipation mounting part 101. The cover 100 is provided with the antenna mounting part 400 on the side wall opposite to the plug-in area 105. The antenna mounting part 400 includes two inverted trapezoidal antenna plug-in interfaces 402, which are opposite to the corresponding interfaces on the mother board 500. Through the shape design, when the antenna assembly is connected with the mother board 500, it is convenient to plug in and dock, and the contact area is small, which avoids signal interference between the mother board 500 and the antenna assembly. At the same time, the two antenna plug-in interfaces 402 are separated from each other, which avoids signal interference between the two antenna assemblies. At the same time, the cover 100 is connected with an antenna cover 401 in "L" shape distribution and covering the antenna plug-in interface 402. By setting an independent antenna cover 401 to fix the antenna, the overall effect is improved. At the same time, the cover 100 and the bottom cover 200 are generally made of metal material, while the antenna cover 401 is made of non-metal material, which facilitates signal transmission of the antenna. When assembling and disassembling, the cover 100 and the bottom cover 200 do not need to be disassembled, which improves the disassembly effect. In addition, the antenna assembly is separated from the daughter board 600 through the heat dissipation mounting part 101, and the contact range between the antenna assembly and the mother board 500 is reduced through the inverted trapezoidal distribution of the antenna plug-in interface 402. Moreover, the two antenna plug-in interfaces 402 are also separated from each other. Through the above structure distribution, electromagnetic interference can be minimized, and the stability of signal transmission is improved.

[0067] The above description is an explanation of the present application, not a limitation of the application. The scope of the present application is defined in the claims. Within the protection scope of the present application, any form of modification can be made.

Claims

1. An in-vehicle domain controller characterized by, The utility model relates to a heat dissipation system of a rack-mounted server, which comprises the following components: a cover (100) with a receiving cavity and a heat dissipation mounting portion (101) extending to the receiving cavity; a bottom cover (200) connected to the cover (100) to close the open face of the cover (100); a female board (500) fixed to the bottom cover (200); a daughter board (600) fixed to the inner end wall of the receiving cavity and connected to the female board (500) through a connector (800); a heat dissipation system (300) arranged in the heat dissipation mounting portion (101), which comprises a heat dissipation fan (301) fixed to one end of the heat dissipation mounting portion (101) and a plurality of heat dissipation fins (303) arranged in parallel in the heat dissipation mounting portion (101); an extension cavity (304) arranged on the side wall of the heat dissipation mounting portion (101) and extending towards the daughter board (600) and communicating with the receiving cavity, and a driven fan blade (305) rotatably connected in the extension cavity (304) and driven by the air flow in the heat dissipation mounting portion (101) to send air into the receiving cavity for heat dissipation.

2. The in-vehicle domain controller of claim 1, wherein: The cover (100) is provided with two groups of opposite heat dissipation holes (102), and the daughter board (600) is located between the two heat dissipation holes (102). The cover (100) is further provided with a daughter board portion settling area (103) abutting against the daughter board (600).

3. The in-vehicle domain controller of claim 1, wherein: The heat dissipation mounting portion (101) has a rectangular structure with both ends open. The heat dissipation mounting portion (101) is provided with a heat dissipation cover plate (302) covering the heat dissipation fins (303) and the heat dissipation fan (301), and the length of the heat dissipation cover plate (302) is less than the length of the heat dissipation mounting portion (101).

4. The in-vehicle domain controller of claim 1, wherein: A gap is reserved between the heat dissipation mounting portion (101) and the bottom cover (200) to accommodate the female board (500), and a heat dissipation portion settling area (104) is arranged on the heat dissipation mounting portion (101) to abut against the bottom cover (200).

5. The in-vehicle domain controller of claim 1, wherein: The plurality of heat dissipation fins (303) are arranged in parallel and equidistantly distributed. The heat dissipation fins (303) near one end of the heat dissipation fan (301) are arranged in a "V" shape. The heat dissipation fins (303) near the driven fan blade (305) are relatively short, and the driven fan blade (305) is located between the windward side of the heat dissipation fins (303) and the heat dissipation fan (301).

6. The in-vehicle domain controller of claim 1, wherein: The rotation path of the driven fan blade (305) extends into the heat dissipation mounting portion (101). The extension cavity (304) has a ring structure, and the extension cavity (304) is provided with a ventilation hole (3041).

7. The in-vehicle domain controller of claim 1, wherein: The cover (100) is provided with a plug-in area (105) corresponding to the female board (500) and the daughter board (600), and a separation cover (700) is arranged on the plug-in area (105) to separate the connectors of the female board (500) and the daughter board (600).

8. The in-vehicle domain controller of claim 5, wherein: The antenna mounting part (400) is arranged on the side wall of the other end of the plug-in area (105) of the cover (100), and comprises two inverted trapezoidal antenna plug-in interfaces (402). The antenna plug-in interfaces (402) are opposite to the corresponding interfaces on the motherboard (500), and the two antenna plug-in interfaces (402) are spaced apart from each other to avoid signal interference. Meanwhile, an antenna cover (401) in the shape of "L" is connected to the cover (100) and covers the antenna plug-in interfaces (402).

9. The in-vehicle domain controller of claim 8, wherein: The antenna mounting part (400) is arranged on the side wall of the heat dissipation mounting part (101).

10. The in-vehicle domain controller of claim 1, wherein: The bottom cover (200) is provided with a motherboard subsidence area (201) for abutting the motherboard (500).

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