A method for manufacturing a polycrystalline diamond compact substrate

Abstract

The application relates to the cutter field and particularly relates to a manufacturing method of a polycrystal diamond compact substrate, wherein diamond powder is poured into a metal cup, the diamond powder is pre-pressed through briquetting to make the diamond powder form a polycrystal diamond layer; the polycrystal diamond layer is combined with a hard alloy substrate, high-temperature and high-pressure sintering is carried out to obtain a compact blank; the compact blank is polished to form a polycrystal diamond compact; the diamond powder is pre-pressed into a polycrystal diamond layer through briquetting, the polycrystal diamond layer is sintered with the treated hard alloy substrate to obtain a compact blank, and finally the compact blank is polished to form a polycrystal diamond compact; the polycrystal diamond layer on the surface of the polycrystal diamond compact is not uniform in thickness by changing the plane structure of the hard alloy substrate, so that the qualified rate and utilization rate of the product are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of cutters, in particular to a manufacturing method of a polycrystalline diamond compact substrate. BACKGROUND

[0002] The traditional production adopts a planar cemented carbide substrate and diamond powder to be sintered under high temperature and high pressure, and the surface of the diamond powder is not uniform in the assembly pressing and sintering process, which leads to the uneven thickness of the diamond layer on the surface of the product, and the phenomenon of thick in the middle and thin on both sides often occurs, which seriously affects the qualified rate and utilization rate of the product. SUMMARY

[0003] The present application aims to provide a manufacturing method of a polycrystalline diamond compact substrate, which solves the problem of uneven thickness of the diamond layer on the surface of the product produced by the traditional production method.

[0004] To achieve the above-mentioned purpose, the present application provides a manufacturing method of a polycrystalline diamond compact substrate, comprising the following steps:

[0005] Pouring diamond powder into a metal cup, pre-pressing the diamond powder by a pressing block to form a polycrystalline diamond layer;

[0006] Combining the polycrystalline diamond layer with a cemented carbide substrate to obtain a compact blank through high temperature and high pressure sintering;

[0007] Polishing the compact blank to form a polycrystalline diamond compact.

[0008] In the step of "pouring diamond powder into a metal cup, pre-pressing the diamond powder by a pressing block to form a polycrystalline diamond layer", the method comprises:

[0009] The diamond powder is mixed by diamond particles with a particle size of 20-30 microns and diamond particles with a particle size of 1-20 microns.

[0010] In the step of "the diamond powder is mixed by diamond particles with a particle size of 20-30 microns and diamond particles with a particle size of 1-20 microns", the method comprises:

[0011] The diamond particles with a particle size of 20-30 microns account for 70-90%, and the diamond particles with a particle size of 1-20 microns account for 10-30%.

[0012] In the step of "combining the polycrystalline diamond layer with a cemented carbide substrate", the method comprises:

[0013] The cemented carbide substrate is placed in a metal cup containing the polycrystalline diamond layer, and then the metal cup is placed in a pre-pressing mold for pre-pressing forming to obtain a combined body.

[0014] Specifically, in the section "pouring diamond powder into a metal cup and pre-pressing the diamond powder using a pressing block to form a polycrystalline diamond layer,"...

[0015] The thickness of the polycrystalline diamond layer is 1mm-2.5mm.

[0016] Specifically, in the section "combining the polycrystalline diamond layer with a cemented carbide substrate and sintering under high temperature and high pressure to obtain a composite blank",...

[0017] The interface between the cemented carbide substrate and the polycrystalline diamond layer has an arc-shaped groove.

[0018] In the phrase "the cemented carbide substrate has an arc-shaped groove":

[0019] The depth of the arc-shaped groove is 1mm to 3mm.

[0020] This invention discloses a method for manufacturing a polycrystalline diamond composite substrate. Diamond powder is poured into a metal cup and pre-pressed using a press block to form a polycrystalline diamond layer. The polycrystalline diamond layer is then combined with a cemented carbide substrate and sintered under high temperature and pressure to obtain a composite blank. The composite blank is then polished to form a polycrystalline diamond composite sheet. The method involves pre-pressing diamond powder into a polycrystalline diamond layer using a press block, sintering the polycrystalline diamond layer with a treated cemented carbide substrate to obtain a composite blank, and finally polishing the composite blank to produce a polycrystalline diamond composite sheet. By altering the planar structure of the cemented carbide substrate, uneven diamond layer thickness on the surface of the manufactured polycrystalline diamond composite sheet is avoided, thereby improving the product's pass rate and utilization rate. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0022] Figure 1 This is a step diagram of the manufacturing method of the polycrystalline diamond composite substrate of the present invention. Detailed Implementation

[0023] The embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, but should not be construed as limiting the present invention.

[0024] Please see Figure 1 This invention provides an artificial intelligence-based port terminal monitoring method, comprising the following steps:

[0025] S101: Pour diamond powder into a metal cup and pre-press the diamond powder with a pressing block to form a polycrystalline diamond layer.

[0026] Specifically, before pre-pressing the diamond powder into a polycrystalline diamond layer, diamond particles with a particle size of 20-30 micrometers and diamond particles with a particle size of 1-20 micrometers are mixed, so that the diamond particles with a particle size of 20-30 micrometers account for 70-90% and the diamond particles with a particle size of 1-20 micrometers account for 10-30%. After the two types of diamond particles are mixed evenly, they are poured into a metal cup and the diamond powder is leveled. Then, the diamond powder is pre-pressed so that the thickness of the pre-pressed polycrystalline diamond layer is 1mm-2.5mm. The number of pre-pressing times is >2, and the pre-pressing pressure is 0.1MPa-1.0MPa.

[0027] S102: The polycrystalline diamond layer is combined with the cemented carbide matrix and sintered under high temperature and high pressure to obtain a composite blank.

[0028] Specifically, before combining the polycrystalline diamond layer with the cemented carbide substrate, the cemented carbide substrate is processed. Specifically, the bonding surface between the cemented carbide substrate and the polycrystalline diamond layer is ground to form an arc-shaped groove on the cemented carbide substrate, the depth of which is 1mm to 3mm. Then, the processed cemented carbide substrate is placed in a metal cup containing the polycrystalline diamond layer, with the arc-shaped groove on the cemented carbide substrate close to the polycrystalline diamond layer. The metal cup is then placed in a pre-pressing mold to pre-press and form the composite. The metal cup containing the composite is then placed in a high-temperature, high-pressure equipment for high-temperature, high-pressure sintering. During sintering, the sintering pressure is 6-8 GP and the sintering temperature is 1400-1650℃. The composite is sintered under these conditions for 5-8 minutes to obtain the composite blank.

[0029] S103: Grind and polish the composite blank to form a polycrystalline diamond composite sheet.

[0030] Specifically, after the assembly is sintered into the composite blank, the pressure is released and cooled, and the composite blank is removed from the metal cup; firstly, the outer circle of the composite blank is ground to the standard size; then the end face of the cemented carbide substrate of the composite blank is ground to the standard size; finally, the end face of the polycrystalline diamond layer of the composite blank is ground to the standard size.

[0031] The manufacturing method of the polycrystalline diamond composite substrate of the present invention first involves mixing diamond particles of different sizes to obtain diamond powder. The mixed diamond powder is then placed in a metal cup and pressed to form a polycrystalline diamond layer. Next, a cemented carbide substrate is processed by grinding an arc-shaped groove into the interface between the cemented carbide substrate and the polycrystalline diamond layer. The processed cemented carbide substrate is placed in the metal cup, with the side of the cemented carbide substrate having the arc-shaped groove adhering to the polycrystalline diamond layer. The metal cup is then placed in a pre-pressing mold to pre-press and form the composite. Finally, the metal cup containing the composite is placed at a high temperature. Sintering is performed in a high-pressure device to sinter the assembly into a composite blank. After depressurization and cooling, the composite blank is removed from the metal cup. Finally, the outer circle of the composite blank is ground to achieve the standard size. The end face of the cemented carbide substrate is ground to the standard size, and the end face of the polycrystalline diamond layer is ground to the standard size. By changing the traditional planar structure of the cemented carbide substrate, the bonding surface between the cemented carbide substrate and the polycrystalline diamond layer has an arc-shaped groove. Then, high-temperature and high-pressure sintering is performed to avoid uneven diamond layer thickness on the surface of the polycrystalline diamond composite sheet, thereby improving the product qualification rate and utilization rate.

[0032] The above-disclosed embodiments are merely one or more preferred embodiments of this application and should not be construed as limiting the scope of this application. Those skilled in the art can understand that all or part of the processes for implementing the above embodiments and equivalent changes made in accordance with the claims of this application still fall within the scope of this application.

Claims

1. A method for manufacturing a polycrystalline diamond composite substrate, characterized in that, Includes the following steps: Diamond powder is poured into a metal cup and pre-pressed by a pressing block to form a polycrystalline diamond layer. The polycrystalline diamond layer is combined with a cemented carbide matrix and then sintered under high temperature and high pressure to obtain a composite sheet blank. The composite blank is ground and polished to form a polycrystalline diamond composite sheet; In this process, the bonding surface between the cemented carbide substrate and the polycrystalline diamond layer has an arc-shaped groove, and then high-temperature and high-pressure sintering is performed to avoid uneven diamond layer thickness on the surface of the polycrystalline diamond composite sheet. The depth of the arc-shaped groove is 1mm to 3mm.

2. The method for manufacturing the polycrystalline diamond composite substrate as described in claim 1, characterized in that: In the process of "pouring diamond powder into a metal cup and pre-pressing the diamond powder with a pressing block to form a polycrystalline diamond layer", the method includes: The diamond powder is composed of diamond particles with a particle size of 20-30 micrometers and diamond particles with a particle size of 1-20 micrometers.

3. The method for manufacturing the polycrystalline diamond composite substrate as described in claim 2, characterized in that: In the statement "The diamond powder is composed of diamond particles with a particle size of 20-30 micrometers and diamond particles with a particle size of 1-20 micrometers": Diamond particles with a diameter of 20-30 micrometers account for 70-90%, and diamond particles with a diameter of 1-20 micrometers account for 10-30%.

4. The method for manufacturing the polycrystalline diamond composite substrate as described in claim 1, characterized in that, In the phrase "combining the polycrystalline diamond layer with a cemented carbide substrate", the method includes: The cemented carbide substrate is placed in a metal cup containing the polycrystalline diamond layer, and then the metal cup is placed in a pre-pressing mold to pre-press and form the composite.

5. The method for manufacturing the polycrystalline diamond composite substrate as described in claim 1, characterized in that, In the process of "pouring diamond powder into a metal cup and pre-pressing the diamond powder with a pressing block to form a polycrystalline diamond layer",... The thickness of the polycrystalline diamond layer is 1mm-2.5mm.

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