Display module and display device

Abstract

The application discloses a display module, comprising: a cover plate, a display layer, a back film, the back film is arranged on a non-display surface of the display layer, the back film is not light-transmitting, an NFC coil layer, the coil layer is arranged on a side of the back film away from the display layer, a flexible circuit board layer, the flexible circuit board layer is arranged on a side of the NFC coil layer away from the back film, the NFC coil layer is covered, and the NFC coil layer is electrically connected with the flexible circuit board layer. According to the technical scheme provided by the embodiment of the application, the NFC structure is directly arranged on the back film through the coil layer, and the function of supporting and buffering is realized through the back film, the thickness caused by the NFC structure and the buffer layer structure is reduced from the display module, and the display module is extremely thinned, so that the display module has a relatively thin thickness when applied to a wearable module.

Description

Technical Field

[0001] This invention generally relates to the field of display technology, and more particularly to display modules and display devices. Background Technology

[0002] Currently, wearable products are increasingly adopting OLED screens. Taking smartwatches as an example, most smartwatches and smart bands on the market now have NFC functionality. In actual design and production, the NFC (Near Field Communication) circuit board is soldered onto an FPC (Flexible Printed Circuit). The thickness of the NFC board is generally 0.2-0.3mm, which directly increases the thickness of the display module. Simultaneously, a buffer layer is added for blackout and cushioning, and this buffer layer is generally about 0.1-0.2mm thick. Therefore, the resulting wearable product has a relatively large thickness. Summary of the Invention

[0003] In view of the above-mentioned defects or deficiencies in the prior art, it is desirable to provide a display module and a display device.

[0004] Firstly, a display module is provided, comprising:

[0005] cover plate,

[0006] A display layer, comprising opposing display surfaces and non-display surfaces, wherein the cover plate is disposed on the display surface of the display layer.

[0007] A back film is disposed on the non-display surface of the display layer, and the back film is opaque.

[0008] An NFC coil layer is disposed on the side of the back film away from the display layer.

[0009] A flexible circuit board layer is disposed on the side of the NFC coil layer away from the back film, covers the NFC coil layer, and is electrically connected to the NFC coil layer.

[0010] As an alternative, the backing film material is PET, PI, or PVC.

[0011] As an achievable method, the backsheet thickness is 110 μm-200 μm.

[0012] As an implementation method, the NFC coil layer has 3-6 turns, a trace width of 1.5-2mm, and a trace spacing of 0.5-2mm.

[0013] As an implementation method, the distance between the outermost coil of the NFC coil layer and the edge of the back film is greater than or equal to 1 mm.

[0014] As an alternative method, the NFC coil layer is deposited on the back film using a development and etching process.

[0015] As an alternative, the flexible circuit board layer has an adhesive backing on the side near the back film for bonding with the back film.

[0016] As one possible implementation, the flexible circuit board layer includes a first shielding layer, a first cover layer, a copper substrate layer, a second cover layer, and a second shielding layer stacked together, wherein the first shielding layer and the second shielding layer cover the copper substrate layer.

[0017] As one possible implementation, the flexible circuit board layer includes a main body and an extension, the main body being disposed within the area of ​​the display layer and conforming to the shape of the display layer.

[0018] As an alternative approach, the flexible circuit board layer has a first point on the side near the back film, the first point being used for electrical connection with the NFC coil layer.

[0019] As an implementation, the NFC coil layer is provided with a second site, and when the flexible circuit board layer is installed on the side of the NFC coil layer away from the back film, the first site is connected to the second site, and the flexible circuit board layer is used to receive or output NFC signals from the NFC coil layer.

[0020] Secondly, a display device is provided, including the aforementioned display module.

[0021] According to the technical solution provided in the embodiments of this application, by directly setting the NFC structure on the back film through the coil layer, and by using the back film to achieve the functions of support and buffering, the thickness of the NFC structure and the buffer layer structure is reduced from the display module, thereby achieving the ultimate thinning of the display module, which can be applied to wearable modules with a thinner thickness. Attached Figure Description

[0022] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0023] Figure 1 This is a schematic diagram of the back of the display module in this embodiment;

[0024] Figure 2 This is a side view of the display module in this embodiment;

[0025] Figure 3This is a schematic diagram of the front of the display panel in this embodiment;

[0026] Figure 4 This is a schematic diagram of the cross-section of the display panel in this embodiment;

[0027] Figure 5 This is a schematic diagram of the back of the display panel in this embodiment;

[0028] Figure 6 This is a schematic diagram of the flexible circuit board structure in this embodiment;

[0029] Figure 7 This is a schematic diagram of the cross-section of the flexible circuit board in this embodiment. Detailed Implementation

[0030] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.

[0031] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0032] Please refer to Figure 1 and Figure 2 This embodiment provides a display module, including:

[0033] Cover plate 10,

[0034] Display layer 11, comprising a display surface and a non-display surface facing away from each other, and cover plate 10 disposed on the display surface of display layer 11.

[0035] A back film 12 is disposed on the non-display surface of the display layer 11, and the back film 12 is opaque.

[0036] NFC coil layer 13, the coil layer being disposed on the side of the back film 12 away from the display layer 11.

[0037] A flexible circuit board layer 14 is disposed on the side of the NFC coil layer 13 away from the back film 12, covers the NFC coil layer 13, and is electrically connected to the NFC coil layer 13.

[0038] The display module provided in this embodiment directly sets the NFC structure on the back film 12 through the coil layer, and the back film 12 realizes the functions of support and buffering. The thickness caused by the NFC structure and the buffer layer structure is reduced from the display module, thereby achieving the ultimate thinning of the display module, which can be applied to wearable modules with a thinner thickness.

[0039] Figure 1 and Figure 2 The provided display module includes a cover plate 10 structure, which is generally made of glass or sapphire, or other flexible materials. The cover plate 10 structure is usually provided by the process of manufacturing the display device. Therefore, the thickness of the cover plate 10 is a conventional thickness that cannot be reduced.

[0040] A display layer 11 is attached to the cover plate 10, with the display surface of the display layer 11 facing the cover plate 10. A back film 12 is placed on the non-display surface of the display layer 11 away from the cover plate 10. Then, an NFC coil layer 13 is placed on the non-display surface of the back film 12 away from the display layer 11. In general, existing display modules have a buffer layer structure on the non-display surface of the display layer 11 to support and buffer the display layer 11. In this embodiment, the NFC coil layer 13 is placed on the back film 12, so there is no need to set a buffer layer structure. The display layer 11 is directly supported and buffered by the back film 12. Thus, the display layer 11 is supported by the back film 12, and the display layer 11 is buffered when the display module is subjected to external force, so as to ensure that the display layer 11 can work stably.

[0041] Optionally, the thickness of the back film 12 is set to 110μm-200μm. Compared with the conventional back film 12, the back film 12 in this embodiment is thicker, which supports the display layer 11 while also providing cushioning. Since existing display modules generally have a buffer layer structure, which is usually achieved by adding a foam material and an adhesive layer, and a back film is set outside the buffer layer for support, the structure of foam material, adhesive layer and back film combined in existing display modules has a relatively thick thickness. In this embodiment, no buffer layer structure is set, and the display layer 11 is directly supported and cushioned by the back film 12. Accordingly, a thicker back film 12 is required to achieve the support and cushioning effect. Compared with the thickness of the structure of buffer layer and back film combined, this embodiment still has a certain thinning effect, and the thickness of the entire display module is also reduced to a certain extent.

[0042] In this embodiment, the display layer 11 is typically about 30 micrometers thick, and the NFC coil layer 13 is also 20-30 micrometers thick. To prevent the NFC coil layer 13 from forming a mold mark on the display layer 11, it is positioned on the side of the back film 12 away from the display layer 11. The thickness of the back film 12 is set within the range of 110μm-200μm, preventing mold marks from forming through it. Additionally, appropriately increasing the thickness of the back film 12 to within the 110μm-200μm range allows it to simultaneously function as a buffer layer. By replacing the function of the buffer layer with the back film 12, the buffer layer is eliminated, resulting in a thinner overall display module. Simultaneously, the back film 12 also supports the display layer 11, increasing the display panel's resistance to deformation. Optionally, the thickness of the back film 12 can be set to 120μm-150μm, for example, 120μm, 130μm, 140μm, 150μm, etc.

[0043] Optionally, the back film 12 is made of PI (polyimide), PET (polyethylene terephthalate), or PVC (polyvinyl chloride). In this embodiment, the back film 12 is configured as an opaque structure to provide good support for the display function of the display layer 11. This opaque structure can be achieved directly through the material of the back film 12 itself, such as opaque PI, PET, or PVC materials. The back film 12 supports and buffers the display layer 11, while also serving to block light, providing a good environment for the display of the display layer 11.

[0044] Optionally, the back film 12 is a black back film. Since light will cause current to be generated in the current-carrying layer of the light-emitting device, causing the display layer 11 to produce abnormal display under light and affecting Gamma adjustment, a light-shielding layer is required to block the light. In this embodiment, the back film 12 is set to an opaque structure to achieve the function of a light-shielding layer. Optionally, the back film 12 is set to black, so that it has a better light-shielding effect.

[0045] Optionally, the NFC coil layer 13 has 3-6 turns, a trace width of 1.5-2mm, and a trace spacing of 0.5-2mm.

[0046] In this embodiment, the NFC coil layer 13 is directly disposed on the back film 12. The NFC coil layer 13 is fabricated using a copper layer, which is typically only 20μm-30μm thick. Compared to an NFC circuit board, it has a thinner thickness. Furthermore, the NFC coil layer 13 is disposed on the side of the back film 12 away from the display layer 11, avoiding the situation where the NFC coil layer 13 would affect the display layer 11's molding display due to the thinness of both the NFC coil layer 13 and the display layer 11. The number of turns in the NFC coil layer 13 is set to 3-6 turns, for example, set to... Figure 1 If the number of turns in the NCF coil layer 13 is set too high (e.g., three, four, five, six, etc.), the screen will flicker due to magnetic field interference generated by the NFC coil layer 13 during operation. Furthermore, the coil trace width should be set to 1.5-2mm, for example, 1.5mm, 1.6mm, 1.7mm, 1.8mm, 1.9mm, or 2mm, and the trace spacing should be set to 0.5-2mm, for example, the spacing between coils should be 0.5mm, 0.6mm, 0.7mm, 1mm, 1.2mm, 1.5mm, 1.8mm, or 2mm. The coil width and spacing can be freely combined and selected according to the space required for the coil.

[0047] Optionally, the distance between the outermost coil of the NFC coil layer 13 and the edge of the back film 12 is greater than or equal to 1 mm.

[0048] In this embodiment, a flexible circuit board is also provided on the side of the NFC coil layer 13 away from the back film 12. Since the flexible circuit board and the back film 12 need to be bonded together, the bonding process needs to maintain a certain precision range. Generally, the bonding precision between the flexible circuit board and the back film 12 is 0.3mm. Therefore, the flexible circuit board needs to be set slightly smaller than the back film 12. During installation, the flexible circuit board and the back film 12 are bonded more accurately, and the flexible circuit board will not exceed the structure of the back film 12, resulting in a better assembly effect. Generally, the flexible circuit board is set at least 0.3mm smaller than the back film 12 to provide better bonding. To achieve the desired effect, and considering that the flexible circuit board needs to cover the NFC coil layer 13 after bonding, it is optional to set a certain distance between the outermost edge of the NFC coil layer 13 and the outermost edge of the back film 12, so that the flexible circuit board can bond well with the back film 12 during the bonding process and completely cover the NFC coil layer 13. Considering the setting accuracy of the NFC coil layer 13 and the bonding accuracy of the flexible circuit board, it is optional to set the distance between the outermost edge of the NFC coil layer 13 and the edge of the back film 12 to be at least 1mm. If the display module itself has a large area, the distance between the outermost edge of the NFC coil layer 13 and the edge of the back film 12 can be greater than 1mm.

[0049] The display module structure provided in this embodiment is as follows: Figure 1 and Figure 2 As shown, it includes a cover plate 10, a display layer 11, a back film 12, an NFC coil layer 13, and a flexible circuit board layer 14 stacked together. In this embodiment, the display layer 11, back film 12, and NFC coil layer 13 are collectively referred to as a display panel, and their specific details are as follows: Figure 3 , Figure 4 and Figure 5 As shown, the display layer 11 includes a circular region 111 and a protruding portion (the protruding portion is located in...). Figure 3 (below), such as Figure 3 As shown, the circular area is divided into a display area 110 and a portion surrounding the display area 110. The protruding portion is a driving circuit area 112 connected to the display area. During the setup of the display module, the protruding driving circuit portion 112 bends towards the non-display surface of the display layer 11, forming a shape as shown in the diagram. Figure 1 and Figure 2 The form shown (where the protruding part is bent at the top). Figure 1 , Figure 2 and Figure 3 The orientation of the display layers 11 is not the same, and a back film 12 is attached to the non-display surface of the display layers 11. The back film 12 is generally set to be the same shape as the circular area 111 of the display layers 11 (the display layers 11 can also be other shapes), and supports the display layers 11. The aforementioned NFC coil layer 13 is also disposed on the back film 12. The NFC coil layer 13 is generally located in the center of the display layers 11, forming a shape like... Figure 3 The structure shown is as follows. The NFC coil layer 13 also includes second points 131, which are the two ends of the wound coil structure and serve as connection points for connection with the flexible circuit board. The position of the two ends can be determined according to the connection position between the NFC coil layer and the flexible circuit board layer 14. Generally, they are set on the outside of the coil, and the two second points 131 are set close to each other. The connection line between the second points 131 and the formed circular coil is a straight line. The coil structure in the formed NFC coil layer has a regular shape and a good signal acquisition effect.

[0050] Optionally, the NFC coil layer 13 is disposed on the back film 12 by a development and etching process. In this embodiment, the NFC coil is generally disposed by a development and etching process. A copper substrate layer is attached to the side of the back film 12 away from the display layer 11. The copper layer is generally 30 micrometers to 30 micrometers thick. Compared with conventional NFC circuit boards, it has a significant thinning effect. Subsequently, the NFC coil layer 13 is disposed on the back film 12 by exposure, development and etching processes. The NFC coil layer 13 formed by this disposal method is thinner, which can achieve the thinning of the entire display module.

[0051] The NFC coil layer 13 can also be set in other ways, such as by evaporating the material onto the back film 12, or by punching to prepare the NFC coil. However, the coil formed by evaporation or punching may have poor precision. Therefore, the NFC coil layer 13 is usually set by developing and etching. This process is relatively mature and the prepared NFC coil layer 13 has good precision, which can meet the needs of display modules of different sizes.

[0052] Optionally, the flexible circuit board layer 14 has an adhesive backing on the side near the back film 12 for bonding with the back film 12.

[0053] In this embodiment, the flexible circuit board layer 14 is bonded to the back film 12. An adhesive backing (not shown in the figure) is provided on the flexible circuit board. During the bonding process with the back film 12, it also serves to encapsulate the NFC coil, eliminating the need for an additional encapsulation layer to protect the NFC coil. The thickness of the adhesive backing is generally 0.03mm-0.1mm, for example, 0.03mm, 0.05mm, 0.07mm, 0.08mm, 0.1mm, etc. The thickness of the adhesive backing can be selected according to the size of the display module or the application device of the display module. For example, when the size of the display module is large, a thicker adhesive backing can be used for bonding to ensure the firm bonding between the flexible circuit board layer 14 and the back film 12.

[0054] Optional, such as Figure 7 As shown, the flexible circuit board layer 14 includes a first shielding layer 144, a first cover layer 146, a copper substrate layer 148, a second cover layer 147, and a second shielding layer 145 stacked together, with the first shielding layer 144 and the second shielding layer 145 covering the copper substrate layer 148.

[0055] like Figure 7The diagram shows the structure of the flexible circuit board layer 14. This flexible circuit board has two shielding layers, a first shielding layer 144 and a second shielding layer 145, which wrap around the copper substrate layer 148. The copper substrate layer forms the circuit board of this circuit structure. The shielding layers protect the circuit signals of the circuit board structure and can also restrain NFC signals to prevent adverse effects on the terminal device and strengthen the NFC signal. A corresponding cover layer is provided between the two shielding layers to cover and protect the circuit board structure. Optionally, the first shielding layer 144, the second shielding layer 145, the first cover layer 146, and the second cover layer 147 can all have the same shape, providing complete coverage of the circuit board structure; alternatively, the shapes of the first shielding layer 144 and the second shielding layer 145 can be different from those of the first cover layer 146 and the second cover layer 147. For example, the shape of the corresponding shielding layer can match the shape of the intermediate copper substrate layer 148, and the cover layer can provide complete coverage to protect and support the copper substrate layer 148.

[0056] Optionally, the flexible circuit board layer 14 includes a main body 142 and an extension 143. The main body 142 is disposed within the area of ​​the display layer 11 and is shaped to conform to the display layer 11.

[0057] The flexible circuit board layer 14 provided in this embodiment has the following shape: Figure 6 As shown, the flexible circuit board layer 14 is shaped similarly to the display layer 11. The flexible circuit board layer 14 includes a connected main body 142 and an extension 143, where the extension 143 is a protruding portion mainly used for connection to the main unit, providing an interface for connection. The main body 142 is stacked on top of the display portion of the display layer 11. The aforementioned shape similarity means that the main body of the flexible circuit board is modeled after the display portion of the display layer 11, setting it to have the same shape as the display portion of the display layer 11. For example, when the display portion of the display layer 11 is circular, the main body of the flexible circuit board is also circular. If the display portion of the display layer 11 is square or rectangular, the main body 142 of the flexible circuit board is also set to a matching square or rectangular structure. Alternatively, depending on actual needs, the display layer 11 and the main body of the flexible circuit board can be set to the same irregular shape. Regardless of the shape, the main body 142 must have space for the drive circuit. Figure 6 As shown, the flexible circuit board layer 14 comprises two parts, wherein the main body 142 is configured as a circular structure. However, the main body 142 does not form a complete circle; the upper part of the circle lacks region A. Figure 6(The area marked by the dashed line) When the flexible circuit board layer 14 is bonded to the back film 12, the driving circuit on the display layer 11 is bent and bonded to the side of the back film 12 away from the display layer 11. This side is also the bonding surface of the flexible circuit board layer 14. Therefore, when the flexible circuit board 14 is bonded to this side of the back film 12, the position of the corresponding driving circuit needs to be reserved. This is achieved through area A above the main body 142 in this application.

[0058] Furthermore, in this embodiment, the shape of the main body 142 in the flexible circuit board layer 14 is not exactly the same as that of the display layer 11. The main body 142 is designed to mimic the shape of the display layer 11, and both adopt the same shape structure. However, according to the installation accuracy requirements, the size of the main body 142 is generally smaller than that of the display layer 11. In addition, the main body 142 may also be provided with similar grooves or corresponding notches according to the installation requirements of other structures to facilitate the installation of the display device, or it may be adjusted according to the circuit form. For example, a point structure for connecting with the NFC coil is provided on the flexible circuit board layer 14, which is the first point 141.

[0059] Optionally, the flexible circuit board layer 14 has a first point 141 on the side near the back film 12. The first point 141 is used for electrical connection with the NFC coil layer 13. In this embodiment, the first point 141 on the flexible circuit board layer 14 is to realize the electrical connection between the flexible circuit board layer 14 and the NFC coil layer 13. Its setting position matches the second point 131 on the NFC coil layer 13. Specifically, the first point 141 is set on the side of the flexible circuit board layer 14 near the back film 12 and is set in the middle of the flexible circuit board layer 14. The copper substrate layer 148 in the flexible circuit board layer 14 is led out to the surface to realize the connection with the NFC coil layer 13. At the same time, the two second points 131 are also set close to each other, and the distance between the two second points 131 is the same as the distance between the two first points 141, so as to facilitate the connection between the flexible circuit board layer 14 and the NFC coil layer 13.

[0060] Optionally, the NFC coil layer 13 is provided with a second point 131. When the flexible circuit board layer 14 is installed on the side of the NFC coil layer 13 away from the back film 12, the first point 141 is connected to the second point 131. The flexible circuit board layer 14 is used to receive or output NFC signals from the NFC coil layer 13.

[0061] In this embodiment, the flexible circuit board is bonded to the back panel, and an NFC coil is also provided in the middle. The NFC coil is electrically connected to the flexible circuit board. Optionally, the electrical connection is made through conductive adhesive, and the position of the first point 141 is set to match the position of the second point 131, which facilitates the setting of conductive adhesive and the connection between the two, without the need for additional lead wire connection, and the assembly of the display module structure is also more convenient; or alternatively, the second point 131 set on the NFC coil layer 13 and the first point 141 set on the flexible circuit board layer 14 are electrically connected, and the flexible circuit board receives or outputs the signal of the NFC coil.

[0062] In this embodiment, the back film 12 is thickened to a certain extent, and the back film 12 structure is used as a buffer material without setting a buffer layer. Furthermore, the NFC coil is placed between the back film 12 and the flexible circuit board, without using an NFC circuit board structure. This further reduces the thickness of the display module. Through the above method, the display module can be reduced to an extreme thickness of 0.3mm-0.5mm.

[0063] This application also provides a display device, including the display module described above.

[0064] The display device provided in this embodiment can be a structure including any of the above-mentioned display modules. Preferably, the above-mentioned display modules are applied to wearable display devices, such as wristband structures, etc. The accompanying drawings show a circular display device, but different shapes can be set according to different wearable structures, such as square, elliptical or irregular structures, etc.

[0065] It should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer" used above to indicate orientation or positional relationships are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention; the directional terms "inner" and "outer" refer to the inside or outside relative to the outline of each component itself. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature.

[0066] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways, rotated 90 degrees, or in other orientations, and the spatial relative descriptions used herein will be interpreted accordingly.

[0067] The above description is merely a preferred embodiment of this application and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of the invention involved in this application is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the inventive concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features with similar functions disclosed in this application.

Claims

1. A display module, characterized in that, include: cover plate, A display layer, comprising opposing display surfaces and non-display surfaces, wherein the cover plate is disposed on the display surface of the display layer. A back film is disposed on the non-display surface of the display layer and is opaque. The thickness of the back film is 110μm-200μm. An NFC coil layer is disposed on the side of the back film away from the display layer. A flexible circuit board layer is disposed on the side of the NFC coil layer away from the back film, covering the NFC coil layer and electrically connected to it. The side of the flexible circuit board layer near the back film is provided with adhesive, the thickness of which is 0.03mm-0.1mm. The flexible circuit board layer includes a first shielding layer, a first cover layer, a copper substrate layer, a second cover layer, and a second shielding layer stacked together, wherein the first shielding layer and the second shielding layer cover the copper substrate layer.

2. The display module according to claim 1, characterized in that, The backing material is polyimide, polyethylene terephthalate, or polyvinyl chloride.

3. The display module according to claim 1, characterized in that, The NFC coil layer has 3-6 turns, a trace width of 1.5-2mm, and a trace spacing of 0.5-2mm.

4. The display module according to claim 3, characterized in that, The distance between the outermost coil of the NFC coil layer and the edge of the back film is greater than or equal to 1 mm.

5. The display module according to claim 3, characterized in that, The NFC coil layer is deposited on the back film through a development and etching process.

6. The display module according to claim 1, characterized in that, The flexible circuit board layer includes a main body and an extension. The main body is disposed within the area of ​​the display layer and is configured to conform to the shape of the display layer.

7. The display module according to claim 1, characterized in that, The flexible circuit board layer has a first point on the side near the back film, and the first point is used to electrically connect with the NFC coil layer.

8. The display module according to claim 7, characterized in that, The NFC coil layer has a second site. When the flexible circuit board layer is installed on the side of the NFC coil layer away from the back film, the first site is connected to the second site. The flexible circuit board layer is used to receive or output the NFC signal of the NFC coil layer.

9. A display device, characterized in that, Includes the display module described in any one of claims 1-8.

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