Metal suspension wire structure

Abstract

The application discloses a metal suspended line structure, which is arranged in a stack from top to bottom by a plurality of metal substrates and is connected through a metallized via to form a self-encapsulating structure. The interiors of at least two metal substrates among the metal substrates except the top metal substrate and the bottom metal substrate are formed into air-filled hollow cavities. A required circuit structure is arranged on the metal substrate between the two hollow cavities. The application forms a multilayer self-encapsulating structure by a multilayer metal integrated suspended line circuit technology, performs circuit design on the suspended line layer, and realizes high-performance radio frequency, microwave and terahertz circuits by using the low-loss and high-Q characteristics of the metal structure. The circuit layout can fully exert the advantages of the full-metal integrated suspended line platform, realizes a circuit structure with high Q value, good electromagnetic shielding and excellent heat dissipation performance, and can also etch a radiation unit on the top metal substrate and the bottom metal substrate to design an antenna structure.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of radio frequency microwave circuit, in particular to a metal suspended line structure.

[0002] In modern communication systems, transmission lines are an important part of microwave and millimeter wave circuits, and the size, loss and other characteristics of the transmission lines are directly related to the performance of the entire circuit and system. Traditional dielectric suspended lines have the advantages of small loss and weak dispersion, and dielectric integrated suspended line circuits have self-packaging characteristics. In recent years, small size, high integration and high stability transmission lines have become a research hotspot in the field of transmission lines. Circuits based on dielectric integrated suspended lines have been successfully applied to the design of various microwave devices. However, the Q value (quality factor) of traditional dielectric integrated suspended lines is relatively small, which cannot meet the requirements of devices with high Q value, such as narrow-band filters and multiplexers, which require transmission line structures with extremely high Q value. At the same time, the heat dissipation effect of dielectric integrated suspended lines needs to be improved in some active devices. SUMMARY

[0003] The purpose of the present application is to solve the problems in the prior art, and to provide a metal suspended line structure (MISL) based on a multi-layer metal integrated suspended line platform, which uses a multi-layer metal structure to design a multi-layer circuit, and a multi-layer all-metal integrated suspended line platform to design a high-Q metal transmission line, a metal resonator, etc., achieving high-Q, self-packaging and easy integration.

[0004] The present application is realized in the following way: a metal suspended line structure is formed by stacking a plurality of metal substrates from top to bottom and connecting through metalized vias to form a self-packaging structure. In addition to the top metal substrate and the bottom metal substrate, at least two spaced metal substrates in the metal substrates form air-filled hollow cavities. The circuit structure needed is arranged on the metal substrate between the two hollow cavities.

[0005] The multi-layer metal substrates are connected by a counterbore, a rivet or a tin solder, thereby forming a self-packaging structure.

[0006] The two hollow cavities are rectangular cavities with the same area.

[0007] The metalized vias on each metal substrate are a plurality of vias arranged on the surface of the corresponding metal substrate.

[0008] The circuit structure includes a suspended line and a coaxial feed structure connected to the suspended transmission line. The suspended transmission line is located in the air cavity on the metal substrate, and the coaxial feed structure is arranged at both ends of the air cavity.

[0009] Wherein, the circuit structure includes a coaxial line filter, and the coaxial line filters are multiple and arranged at intervals in the air cavity formed on the metal substrate on one side of the air cavity.

[0010] One end of the coaxial filter is connected to an inner wall of the air cavity in the longitudinal direction, and the other end thereof is separated from another inner wall of the air cavity in the longitudinal direction.

[0011] A waveguide feeding module is provided on the top of the top metal substrate.

[0012] The thicknesses of the multi-layer metal substrates are the same or different.

[0013] This invention utilizes multi-layer metal integrated suspension circuit technology to form a multi-layer self-encapsulated structure. Circuit design is performed at the suspension layer, leveraging the low-loss and high-Q characteristics of metal structures to achieve high-performance RF, microwave, and terahertz circuits. This circuit layout fully leverages the advantages of the all-metal integrated suspension platform, achieving a circuit structure with high Q, excellent electromagnetic shielding, and superior heat dissipation. Radiating elements can also be etched on the top and bottom metal substrates to design antenna structures.

[0014] In addition, based on this platform, it can be easily integrated with other active and passive circuits. Each layer of metal structure can be processed independently and finally integrated through riveting or soldering. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 FIG. 1 is a schematic diagram of a metal-integrated suspended line (MISL) structure according to an embodiment of the present invention.

[0016] Figure 2 It is a schematic diagram of the transmission line and coaxial feeding structure in the metal suspension line structure according to an embodiment of the present invention.

[0017] Figure 3 It is a schematic diagram of a resonator-type filter and a waveguide feeding structure in a metal suspension line structure according to an embodiment of the present invention.

[0018] Figure 4 Schematic diagram of a seven-layer MSISL structure of a metal suspension line structure according to an embodiment of the present invention. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in combination with the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments.

[0020] In order to realize high Q and good heat dissipation characteristics, the present application focuses on the realization of a full-metal integrated suspended line structure to improve the Q value and heat dissipation of a device designed based on the structure.

[0021] Figure 1 A metal suspended line structure according to an embodiment of the present application is shown, which includes multiple layers of metal substrates arranged in order from top to bottom, each layer being a metal structure, and the layers are metal substrate one 1, metal substrate two 2, metal substrate three 3, metal substrate four 4, and metal substrate five 5 in order from top to bottom. Metal substrate two 2 and metal substrate four 4 are partially cut to form air-filled first hollow cavity 11 and second hollow cavity 12. Main circuit design is performed on metal substrate three 3. Corresponding metallized through holes 13 are punched on each metal substrate, and a connecting piece penetrates all the metal substrates, thereby forming a closed cavity structure. The multiple layers of metal substrates are connected by a counterbore, a rivet, or tin soldering, thereby forming a self-packaging structure.

[0022] The thickness of each layer of metal substrate can be freely set according to actual needs. The metal substrate is processed by metal etching and other processes from aluminum, copper, or other alloys.

[0023] As shown in Figure 2 , Figure 2 A transmission line structure designed based on a metal suspended line structure (MSISL) is shown. Based on this transmission line structure, a coupler, a power divider, and other RF microwave circuits that realize the transmission line structure 14 can be designed, and the circuits can be fed by using a coaxial feed line structure 15.

[0024] As shown in Figure 3 , Figure 3 A resonator structure designed based on a metal suspended line structure (MSISL) is shown, such as using various metal sheet-shaped or columnar resonators, and using them to design coaxial line filters 17, duplexers, and other structures. Various types of antennas and the like can also be designed by etching a radiation structure on metal substrate one 1 or metal substrate five 5. This structure can also be directly fed by using a coaxial feed line or a waveguide feed module 16.

[0025] As shown in Figure 4 , Figure 4 A multilayer stacked structure based on a metal suspended line structure (MSISL) is shown, which can realize vertical integration of circuits. Figure 4 It is a seven-layer circuit, and metal plate one 21, metal plate two 22, metal plate three 23, metal plate four 24, metal plate five 25, metal plate six 26, and metal plate seven 27 are arranged from top to bottom. Any multilayer circuit can be integrated by using vertical stacking.

[0026] In the above-mentioned seven-layer circuit, the metal plates are all provided with metalized through holes, the air-filled hollow cavity is formed in the metal plate 2, the metal plate 4 and the metal plate 6, the metal plate 3 23 and the metal plate 5 25 are the suspension line layers, and the main circuit is set, such as Figure 2 、 Figure 3 The circuit design of the embodiment shown.

[0027] It should be noted that, in the present invention, the number of the metal plates or metal substrates can be Figure 1 、 Figure 2 Figure 3 The five-layer structure shown can also be Figure 4 The seven-layer structure shown may be a structure with more layers, and is not limited to the embodiments given.

[0028] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. A metal suspension line structure, characterized in that: A self-encapsulated structure is formed by stacking multiple layers of metal substrates from top to bottom and connecting them through metallized through-holes. Among the metal substrates other than the top metal substrate and the bottom metal substrate, at least two separated metal substrates have air-filled hollow cavities formed inside. The required circuit structure is arranged on the metal substrate between the two hollow cavities; the circuit structure includes a suspension line, which is located in the air cavity on the metal substrate.

2. The metal suspension line structure according to claim 1, characterized in that: The multi-layer metal substrate is connected by countersunk holes, rivets or soldering to form a self-encapsulated structure.

3. The metal suspension line structure according to claim 1, characterized in that: The two hollow cavities are rectangular cavities with the same area.

4. The metal suspension line structure according to claim 1, characterized in that: There are multiple metallized through holes on each layer of the metal substrate.

5. The metal suspension line structure according to claim 1, characterized in that: The circuit structure includes a coaxial feeding structure connected to the suspension line, and the coaxial feeding structure is arranged at two ends of the air cavity.

6. The metal suspension line structure according to claim 1, characterized in that: The circuit structure includes a coaxial line filter. There are multiple coaxial line filters, which are arranged at intervals on one side of the air cavity and formed on the metal substrate.

7. The metal suspension line structure according to claim 6, characterized in that: One end of the coaxial filter is connected to an inner wall of the air cavity in the longitudinal direction, and the other end thereof is separated from the other inner wall of the air cavity in the longitudinal direction.

8. The metal suspension line structure according to claim 6, characterized in that: A waveguide feeding module is arranged on top of the top metal substrate.

9. The metal suspension line structure according to claim 1, characterized in that: The thickness of the multi-layer metal substrate may be the same or different.

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