Semiconductor surface defect detection device and method

Abstract

The present invention discloses a semiconductor surface defect detection device and method thereof, wherein the semiconductor surface defect detection device comprises: a detection body and a proofreading tool, the detection body comprises: a detection camera, a reflector assembly and a detection platform, the reflector assembly is arranged between the detection camera and the detection platform, the reflector assembly comprises a plurality of reflectors to transmit the image of the bearing surface of the detection platform to the lens of the detection camera; the proofreading tool comprises a standard target surface and a detection target surface located at both ends of the proofreading tool; when proofreading the detection device, the proofreading tool is suitable for being arranged on the detection platform, and the proofreading tool is used to perform a proofreading step to finally determine that the bearing surface of the detection platform where the detection target surface is located is the detection position. The present invention uses the proofreading tool for proofreading, which can unify the consistency and accuracy of different machines and improve the adjustment efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and in particular to a device and method for detecting semiconductor surface defects in semiconductor testing equipment. Background Art

[0002] In the design, processing, manufacturing and production of semiconductor integrated circuits, errors are difficult to avoid completely due to various factors, resulting in delayed R&D progress, low product yields or even complete scrapping, and the losses are difficult to estimate. Designers' loopholes leading to layout errors, differences in working conditions, defects in raw materials, and engineers' misoperation of machinery and equipment are all causes of circuit defects and eventual failure. Therefore, detection has become an important link in ensuring chip quality throughout the design, manufacturing and production of integrated circuits.

[0003] As semiconductor process nodes continue to advance, detection devices need to use higher-magnification optical systems to improve the ability to detect more subtle defects. Increasing the magnification of the optical system will lead to a reduction in the field of view, reduce the measurement speed, and take more time to measure the same sample. For example, for every 1-fold increase in the magnification of the optical system, the system requires 4 times the original measurement time, resulting in a decrease in the yield of semiconductor equipment.

[0004] In the traditional way, the debugging method of the detection device is based on the actual image of the PatternWafer (patterned silicon wafer). During the debugging process, the reflector is installed at the designed position, and the reflection angle of the light source of the reflector is fine-tuned by adjusting the top-pull structure of the reflector so that the light source is incident on the camera. Then, the camera is debugged to the clearest image by debugging the focus ring. In this process, multiple reflectors are superimposed on each other, the pitch of the camera lens, and the installation error of the mechanical structure will affect the actual result. The object distance cannot be guaranteed to be in the theoretical position, and multiple problems are superimposed, making it impossible to accurately locate the root cause of the problem.

[0005] This debugging method not only takes a long time, but also cannot accurately guarantee the consistency of the machine. In addition, multiple errors are superimposed on each other, making it difficult to conduct targeted analysis and inconvenient to troubleshoot when problems occur. Summary of the invention

[0006] The object of the present invention is to provide a detection device and a calibration method which can increase the debugging efficiency and ensure the consistency of different detection devices.

[0007] In order to solve the above technical problems, the present invention proposes a semiconductor surface defect detection device, comprising:

[0008] Testing the subject and proofreading the tooling,

[0009] The detection subject comprises: a detection camera, a reflector assembly and a detection platform, wherein the reflector assembly is arranged between the detection camera and the detection platform, and the reflector assembly comprises a plurality of reflectors to transmit an image of the surface of the bearing surface of the detection platform to the lens of the detection camera;

[0010] The proofreading tool comprises a standard target surface and a detection target surface located at two ends of the proofreading tool;

[0011] When calibrating the detection device, the calibration tool is suitable for being arranged on the detection table, and the calibration step is performed by the calibration tool to finally determine that the bearing surface of the detection table where the detection target surface is located is the detection position.

[0012] Preferably, the calibration step includes: moving the detection platform to set the straight-line distance between the standard target surface or the detection target surface and the detection camera, thereby adjusting the position and angle of the reflector in the reflector assembly according to the clarity of the standard target surface or the clarity of the detection target surface in the detection camera.

[0013] Preferably, the bearing surface of the detection platform intersects with the optical axis direction of the detection camera.

[0014] Preferably, the standard target surface is perpendicular to the optical axis direction of the lens of the detection camera, and the extension direction of the detection target surface intersects with the standard target surface.

[0015] Preferably, when the calibration tool is arranged on the detection platform to calibrate the detection device, the detection target surface is located between the standard target surface and the lens of the detection camera.

[0016] Preferably,

[0017] The standard target surface and the detection target surface facing the lens of the detection camera are coated surfaces and are provided with detection patterns;

[0018] When calibrating the detection device, various parts of the detection device are adjusted according to the clarity of the detection pattern in the detection camera.

[0019] Preferably, the detection pattern is a step pattern or a triangular pattern that is periodically arranged along the horizontal direction.

[0020] Preferably, the detection pattern is centrally symmetrical along the horizontal direction.

[0021] Preferably, the standard target surface is provided with two sets of upper and lower detection patterns, wherein the upper detection patterns are used to adjust the reflector, and the lower detection patterns are used to detect the leveling of the camera.

[0022] Preferably, a group of detection patterns are provided on the detection target surface for adjusting a reflector that reflects an image of the detection position.

[0023] Preferably, the detection camera is a line scan camera or an area array camera.

[0024] Preferably, a camera bracket is further included, and the camera lens assembly is mounted on the camera bracket.

[0025] Preferably, the camera bracket includes screw and pin positions, so as to be suitable for initial positioning of the detection camera by means of screws or pins.

[0026] Preferably, the camera bracket includes a top-pull adapter block, which is suitable for fine-tuning the horizontality of the detection camera through the top-pull adapter block and can be locked and fixed.

[0027] Preferably,

[0028] The reflector assembly includes a first reflector, a second reflector and a third reflector;

[0029] The first reflector is disposed in front of the upper portion of the lens of the detection camera, and is used to reflect light into the lens of the detection camera;

[0030] The third reflector is disposed obliquely above the detection position and is used to reflect the image of the detection position;

[0031] The second reflector is disposed between the first reflector and the third reflector.

[0032] Preferably, the reflector assembly further comprises a reflector bracket, and the first reflector, the second reflector and the third reflector are respectively installed and arranged by the reflector brackets at corresponding positions.

[0033] Preferably, the first reflector and the corresponding reflector bracket are fixedly installed, and a fine-tuning gap is arranged between the second reflector and the third reflector and the corresponding reflector bracket.

[0034] Preferably, the reflector includes a fourth reflector and a fifth reflector;

[0035] The surface of the fourth reflector is disposed obliquely upward in front of the lens of the detection camera, and is used to reflect light into the lens of the detection camera;

[0036] The fifth reflector is disposed horizontally downward and obliquely above the detection position, and is used for reflecting the image of the detection position to the fourth reflector.

[0037] Preferably, the fourth reflector and the corresponding reflector bracket are fixedly installed, and a fine-tuning gap is arranged between the fifth reflector and the corresponding reflector bracket.

[0038] The present invention also provides a method for detecting semiconductor surface defects, comprising:

[0039] Providing a semiconductor surface defect detection device as described above;

[0040] Placing the proofreading tool on the testing table;

[0041] Performing a calibration step, when the detection target surface is imaged clearly enough in the detection camera, determining that the location of the detection target surface is a semiconductor surface detection location;

[0042] Wherein, the proofreading step comprises:

[0043] Step A: moving the inspection platform to adjust the linear distance between the calibration tool and the inspection camera;

[0044] Step B: adjusting the position and angle of the reflector in the reflector assembly between the calibration tool or the detection cameras according to the clarity of the standard target surface in the detection camera and the clarity of the detection target surface.

[0045] Preferably, the proofreading tool comprises a standard target surface and a detection target surface located at both ends of the proofreading tool. When the proofreading tool is placed on the detection table, the standard target surface is set to be perpendicular to the optical axis direction of the detection camera, the detection target surface intersects with the extension direction of the standard target surface, and the detection target surface is located between the standard target surface and the lens of the detection camera.

[0046] Preferably, the proofreading and adjusting step comprises:

[0047] Setting the straight-line distance between the standard target surface and the detection camera as a first distance, wherein the first distance is a theoretical object distance of a lens of the detection camera;

[0048] Adjusting the angle of the second reflector so that the imaging focus of the detection pattern on the standard target surface observed by the detection camera is clear and level;

[0049] fastening the second reflector;

[0050] Setting the straight-line distance between the standard target surface and the detection camera to be a second distance, wherein the second distance is smaller than the first distance;

[0051] Adjusting the angle of the third reflector so that the imaging focus of the detection pattern on the detection target surface observed by the detection camera is clear and horizontal;

[0052] Fasten the third reflector.

[0053] Preferably, before the calibration step, the method further includes: a camera leveling step.

[0054] Preferably, the step of leveling the camera includes:

[0055] Install the lens assembly of the inspection camera and perform preliminary installation positioning;

[0056] The mobile testing platform drives the target surface component fixture to move forward and backward to preliminarily find the focal plane of the camera;

[0057] Fine-tune the lens assembly of the inspection camera horizontally until the inspection camera captures a clear and horizontal image of the inspection pattern on the standard target surface, and the brightness of the left and right fields of view is uniform and bright;

[0058] Fasten the lens assembly of the detection camera.

[0059] Compared with the prior art, the technical solution provided in the present invention has the following beneficial effects:

[0060] The calibration tool provided by the technical solution of the present invention is used in a semiconductor defect detection device for calibration. The adjustment of each reflector is performed according to standard requirements, which can unify the consistency and accuracy of different machines and improve the adjustment efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0061] Figure 1 A side schematic diagram of a semiconductor surface defect detection device provided by an embodiment of the present invention.

[0062] Figure 2 A schematic structural diagram of a semiconductor surface defect detection device provided by an embodiment of the present invention.

[0063] Figure 3 It is a schematic diagram of the structure of the proofreading tool provided in this embodiment.

[0064] Figures 4 to 5 This is a schematic diagram of a detection pattern in the technical solution provided by the present invention.

[0065] Figure 6 to Figure 7 The present invention provides a flow chart of a method for detecting semiconductor surface defects.

[0066] Figures 8 to 10 A schematic diagram of the process of the calibration and adjustment steps of a method for detecting semiconductor surface defects provided by the present invention.

[0067] Fig.11 It is a schematic diagram of a semiconductor surface defect detection device provided in another embodiment of the present invention. DETAILED DESCRIPTION

[0068] Many specific details are set forth in the following description to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways than those described herein, and those skilled in the art can make similar generalizations without violating the connotation of the present invention, so the present invention is not limited to the specific implementation disclosed below.

[0069] Secondly, the present invention is described in detail using schematic diagrams. When describing the embodiments of the present invention in detail, for the convenience of explanation, the schematic diagrams are only examples and should not limit the scope of protection of the present invention.

[0070] Embodiment 1

[0071] Figure 1 Shown is a side schematic diagram of a semiconductor surface defect detection device provided by an embodiment of the present invention. Figure 2 A schematic structural diagram of a semiconductor surface defect detection device provided by an embodiment of the present invention.

[0072] refer to Figure 1 and Figure 2 As shown, the semiconductor surface defect detection device provided by the embodiment of the present invention includes:

[0073] The detection body 900 and the proofreading tool 500 , wherein the detection body 900 includes: a detection camera 440 , a reflector assembly 300 and a detection platform 200 .

[0074] Specifically, the detection body 900 also includes a carrier platform 100, and the carrier platform 100 can be translated with high precision. In some conventional methods, the carrier platform 100 can be provided by a fine adjustment frame (stage). The fine adjustment frame (stage) is a special device for adjusting the light path alignment in the optical path system. In particular, it is used as a high-precision coupling device in the fiber-to-fiber coupling and fiber-to-waveguide coupling of micrometer-sized fibers to achieve the alignment of fiber-to-fiber and waveguide.

[0075] The detection camera 440 is installed on the fixed end of the loading platform 100 via a camera bracket 460 .

[0076] In this embodiment, the camera bracket 460 is fixedly mounted on the mounting end of the object carrying platform 100 and has a fixed position. Figure 2 As shown, the outer frame of the camera bracket 460 is a rectangle, one side of which is in contact with the object-carrying platform 100. A lens mounting portion is provided inside the camera bracket 460, and the lens of the detection camera 400 passes through the through hole of the lens mounting portion and faces the other end of the object-carrying platform 100. In addition, in some embodiments, the camera bracket 460 may also be provided with a camera power supply unit, a control unit, and other parts that assist the normal operation of the camera.

[0077] Furthermore, in this embodiment, the camera bracket 460 includes screws and pins, which are suitable for initially positioning the detection camera 440 through screws or pins. The camera bracket 460 also includes a top-pull adapter block 405, which is suitable for fine-tuning the horizontality of the detection camera 440 through the top-pull adapter block 405, and can be locked and fixed.

[0078] In this embodiment, the detection camera 440 is a line scan camera or an area array camera. The lens of the detection camera 440 faces the detection platform 200, and the optical axis of the detection camera 440 is parallel to the direction of the bearing surface of the detection platform 200. Preferably, in this embodiment, the extension direction of the optical axis of the detection camera 440 and the bearing surface of the detection platform 200 is horizontal.

[0079] In this embodiment, the detection platform 200 is located on a side of the object loading platform 100 away from the detection camera 440, and can be precisely controlled to move in translation to change the position between the detection platform 200 and the detection camera 440, and then fixed. In addition, the detection platform 200 has a bearing surface, which can stably place the sample or object to be observed.

[0080] Further, combined with Figure 1 refer to Figure 2 In this embodiment, the reflector assembly 500 is arranged between the detection camera 440 and the detection platform 200, and the reflector assembly 500 includes a plurality of reflectors to transmit the image of the surface of the bearing surface of the detection platform 200 to the lens of the detection camera 440. In this embodiment, the reflector assembly 500 includes three reflectors: a first reflector A1, a second reflector A2, and a third reflector A3. In other embodiments, the number of reflectors included in the reflector assembly 500 can also be one, two or other numbers. In this embodiment, the first reflector A1 is arranged in front of the lens of the detection camera 440, and is used to reflect light into the lens of the detection camera 440; the third reflector A3 is arranged obliquely above the detection position, and is used to reflect the image of the detection position; the second reflector A2 is arranged between the first reflector A1 and the third reflector A3.

[0081] Specifically, in this embodiment, the detection body 900 includes a mounting bracket, and the mounting bracket includes two mounting side walls 410 arranged opposite to each other. The mounting side walls 410 are vertically arranged on the upper surface of the object loading platform 100 and connected to the two sides of the rectangular outer frame of the camera bracket 460. A reflector bracket is arranged between the two opposite mounting side walls to install the reflectors. The first reflector A1, the second reflector A2 and the third reflector A3 are respectively installed by the reflector brackets 420 at corresponding positions.

[0082] In a preferred embodiment, the first reflector A1 and the corresponding reflector bracket 420 are fixedly installed, and a fine-tuning gap is provided between the second reflector A2 and the third reflector A3 and the corresponding reflector bracket 420 .

[0083] Figure 3 FIG. 2 is a schematic diagram of the structure of the proofreading tool provided in this embodiment. Figure 1 and Figure 2 ,refer to Figure 3 As shown, in this embodiment, the calibration tool 500 includes a flat plate portion 510 and a standard target surface B2 and a detection target surface B1 located at two ends of the flat plate portion 510;

[0084] Furthermore, in this embodiment, the flat plate portion 510 is a plane whose upper and lower surfaces are both horizontally arranged, and a standard installation portion and a detection installation portion are arranged at both ends of the flat plate portion 510 .

[0085] The standard installation portion is suitable for installing a standard glass plate 53 provided with a standard target surface B2 , and the installation direction of the standard glass plate 53 is perpendicular to the upper and lower surfaces of the flat plate portion 510 .

[0086] The detection installation portion is suitable for installing a detection glass plate 51 provided with a detection target surface B1, and the installation direction of the detection glass plate 51 is slightly inclined toward one end of the standard installation portion.

[0087] Furthermore, in this embodiment, when the calibration tool 500 is placed on the standard target surface B2 and is perpendicular to the optical axis direction of the lens of the detection camera 440 , the extension direction of the detection target surface B1 intersects with the extension direction of the standard target surface B2 .

[0088] Furthermore, in this embodiment, the standard target surface B2 and the detection target surface B1 are coated surfaces facing the lens of the detection camera 440 and are provided with detection patterns. Preferably, when calibrating the detection device, the various parts of the detection device are adjusted according to the clarity of the detection pattern in the detection camera 440.

[0089] Furthermore, the flat plate portion 510 of the calibration tool 500 is provided with an alignment hole 52 and a mounting hole 51 , which are suitable for aligning and fixing the calibration tool 500 on the testing table 200 and stably mounting it.

[0090] Figures 4 to 5 The figure shows an implementation method of a detection pattern in the technical solution provided by the present invention, wherein Figure 5 for Figure 4 In the technical solution provided by the present invention, the detection patterns on the standard target surface B2 and the detection target surface B1 can also be other detection patterns with similar principles that can be used by those skilled in the art.

[0091] refer to Figures 4 to 5 As shown, the detection pattern is a step pattern or a triangular pattern arranged periodically along the horizontal direction. Figure 4 Enlarged view of the detail marked by ellipse A Figure 5 , the step pattern or triangular pattern is composed of gradually increasing horizontal lines. Further, in this embodiment, the detection pattern is centrally symmetrical along the horizontal direction.

[0092] Furthermore, in this embodiment, the standard target surface is provided with two sets of upper and lower detection patterns. The detection target surface is provided with a set of detection patterns for adjusting a reflector that reflects an image at a detection position.

[0093] In this embodiment, when the calibration tool 500 is set in the semiconductor surface defect detection device provided in this embodiment for calibration, the calibration tool 500 is suitable for being set on the detection platform 200, and the detection target surface B1 is located between the standard target surface B2 and the lens of the detection camera 440. The detection target surface B1 and the standard target surface B2 are both facing the lens of the detection camera 440.

[0094] Furthermore, when the detection device is calibrated, the calibration step is performed through the calibration tool 500 to finally determine that the bearing surface of the detection table 100 where the detection target surface B2 is located is the detection position.

[0095] When calibrating the detection device, the calibration tool 500 is suitable for being set on the detection table 200, and the calibration step is performed by the calibration tool 500 to finally determine that the bearing surface of the detection table 100 where the detection target surface B2 is located is the detection position.

[0096] Figure 6 FIG. 1 is a flow chart of a method for detecting semiconductor surface defects provided by the present invention, referring to FIG. Figure 6 As shown, a method for detecting semiconductor surface defects provided by the present invention comprises:

[0097] Step S100: providing the semiconductor surface defect detection device as described above;

[0098] The semiconductor surface defect detection device provided herein is as described above, comprising:

[0099] The detection body 900 and the proofreading tool 500 , wherein the detection body 900 includes: a detection camera 440 , a reflector assembly 300 and a detection platform 200 .

[0100] The detection camera 440 is installed on the fixed end of the loading platform 100 via a camera bracket 460 .

[0101] The detection platform 200 is located on a side of the loading platform 100 away from the detection camera 440, and can be precisely controlled to move in translation to change the position between the detection platform 200 and the detection camera 440, and then fixed. In addition, the detection platform 200 has a bearing surface on which the sample or object to be observed can be stably placed. For more specific details of the semiconductor surface defect detection device, refer to the detailed description above.

[0102] In a preferred embodiment, the method further comprises: a step of leveling the camera.

[0103] The step of leveling the camera includes:

[0104] Install the lens assembly of the inspection camera and perform preliminary installation positioning;

[0105] The mobile testing platform drives the target surface component fixture to move forward and backward to preliminarily find the focal plane of the camera;

[0106] Fine-tune the lens assembly of the inspection camera horizontally until the inspection camera captures a clear and horizontal image of the inspection pattern on the standard target surface, and the brightness of the left and right fields of view is uniform and bright;

[0107] Fasten the lens assembly of the detection camera.

[0108] Preferably, the camera bracket includes screw and pin positions, so as to be suitable for initial positioning of the detection camera by means of screws or pins.

[0109] Preferably, the camera bracket includes a top-pull adapter block, which is suitable for fine-tuning the horizontality of the detection camera through the top-pull adapter block and can be locked and fixed.

[0110] Step S200: placing the proofreading tool on the testing table;

[0111] The calibration tool 500 provided herein comprises a flat plate portion 510 and a standard target surface B2 and a detection target surface B1 located at two ends of the flat plate portion 510;

[0112] The flat plate portion 510 provided here is a plane with both upper and lower surfaces arranged horizontally. Furthermore, the flat plate portion 510 of the proofreading tool 500 is provided with an alignment hole 52 and a mounting hole 51, which is suitable for aligning and fixing and stably installing the proofreading tool 500 on the testing table 200.

[0113] The two ends of the flat plate portion 510 are provided with a standard mounting portion and a detection mounting portion.

[0114] The standard installation portion is suitable for installing a standard glass plate 53 provided with a standard target surface B2, and the detection installation portion is suitable for installing a detection glass plate 51 provided with a detection target surface B1.

[0115] In this step, placing the proofreading tool 500 on the testing table includes:

[0116] Step S201: placing the flat plate portion 510 of the proofreading tool 500 on the testing table, and performing horizontal adjustment and fixed installation;

[0117] Step S202: installing and leveling the standard glass plate 53 in the standard installation portion.

[0118] The standard glass plate 53 includes a standard target surface B2, and the standard target surface B2 includes a detection pattern. Figures 4 to 5 As shown, the detection pattern is an equidistant step pattern or a triangular pattern that is periodically arranged along the horizontal direction. Further, in this embodiment, the detection pattern is centrally symmetrical along the horizontal direction.

[0119] In a preferred embodiment, the standard target surface B1 is provided with two groups of detection patterns, the lower group of detection patterns is used to detect the leveling of the camera 440, and the upper group of detection patterns is used to adjust the reflector.

[0120] One side of the detection pattern on the standard target surface B2 is aligned with the lens of the detection camera 440, and the standard target surface is perpendicular to the optical axis direction of the detection camera.

[0121] Furthermore, this step also includes installing a detection glass plate 51 provided with a detection target surface B1 on the detection installation portion. The detection target surface B1 is provided with a set of detection patterns for adjusting a reflector that reflects an image of the detection position. The detection target surface B1 is located between the standard target surface B2 and the lens of the detection camera 440, the detection target surface B1 faces the lens of the detection camera 440, and the installation direction of the detection glass plate is slightly toward the standard target surface B2, that is, the detection target surface intersects with the extension direction of the standard target surface.

[0122] Specifically, in this embodiment, an object-image distance line test is also included:

[0123] A. Build the frame, place the light source behind the detection glass plate 51 of the detection target surface B1, and adjust the height of the detection glass plate 51 until the camera can see black stripes;

[0124] B. Adjust the light intensity appropriately and fine-tune the detection camera so that the black stripes captured by the camera are clear and sharp.

[0125] Step S300: performing a calibration step, when the detection target surface B1 is imaged clearly enough in the detection camera 440, determining the location of the detection target surface B1 as the semiconductor surface detection location;

[0126] Wherein, the proofreading step comprises:

[0127] Step A: Move the inspection platform to adjust the linear distance between the calibration tool and the inspection camera.

[0128] Step B: adjusting the position and angle of the reflector in the reflector assembly between the calibration tool or the detection cameras according to the clarity of the standard target surface in the detection camera and the clarity of the detection target surface.

[0129] Specifically, refer to Figure 7 , combined with Figures 8 to 10 As shown, in this embodiment, the proofreading step includes:

[0130] Step S301: setting the straight-line distance between the standard target surface B2 and the detection camera 440 to be a first distance L1, where the first distance L1 is a theoretical object distance of the lens of the detection camera;

[0131] Step S302: adjusting the angle of the second reflector A2 so that the imaging focus of the detection pattern on the standard target surface B2 observed by the detection camera 440 is clear and horizontal;

[0132] Step S303: fastening the second reflector A2;

[0133] Step S304: setting the straight-line distance between the standard target surface B2 and the detection camera 440 to be a second distance L2, wherein the second distance L2 is smaller than the first distance L1;

[0134] Step S305: adjusting the angle of the third reflector A3 so that the imaging focus of the detection pattern on the detection target surface B2 observed by the detection camera 440 is clear and horizontal;

[0135] Step S306: fasten the third reflector A3.

[0136] Specifically, in this embodiment, the first reflector A1 is disposed in front of the upper part of the lens of the detection camera 440, and is used to reflect light into the lens of the detection camera 440; the third reflector A3 is disposed obliquely above the detection position, and is used to reflect the image of the detection position; the second reflector A2 is disposed between the first reflector A1 and the third reflector A3. Preferably, the reflector assembly further includes a reflector bracket, and the first reflector A1, the second reflector A2 and the third reflector A3 are respectively installed and disposed through the reflector brackets at corresponding positions.

[0137] Preferably, the first reflector A1 and the corresponding reflector bracket are fixedly installed, and a fine-tuning gap is arranged between the second reflector A2 and the third reflector A3 and the corresponding reflector bracket.

[0138] Embodiment 2

[0139] refer to Fig.11 As shown, in this embodiment, a semiconductor surface defect detection device is provided, wherein other structures are basically the same as those in the first embodiment, and the reflectors include a fourth reflector A4 and a fifth reflector A5;

[0140] The surface of the fourth reflector A4 is disposed obliquely upward in front of the lens of the detection camera 440, and is used to reflect light into the lens of the detection camera 440;

[0141] The fifth reflector A5 is disposed horizontally downward and obliquely above the detection position (close to the detection target surface B1 in the figure), and is used to reflect the image of the detection position to the fourth reflector A4.

[0142] The fourth reflector A4 is fixedly mounted to a corresponding reflector bracket, and a fine-tuning gap is provided between the fifth reflector A5 and the corresponding reflector bracket.

[0143] Correspondingly, in the semiconductor surface defect detection device provided in this embodiment, the calibration tool 500 provided in the first embodiment can still be used for calibration and debugging to complete a flow chart of a semiconductor surface defect detection method.

[0144] The specific operation steps can be reasonably deduced by those skilled in the art after understanding the technical essence of the above technical solution without departing from the spirit and scope of the present invention, and will not be repeated or elaborated in this embodiment.

[0145] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with this technology to understand the content of the present invention and implement it accordingly, but they are not used to limit the protection scope of the present invention.

[0146] Any person skilled in the art may make possible changes and modifications to the technical solution of the present invention by using the methods and technical contents disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the contents of the technical solution of the present invention shall fall within the protection scope of the technical solution of the present invention.

Claims

1. A semiconductor surface defect detection device, characterized in that: include: Testing the subject and proofreading the tooling, The detection subject comprises: a detection camera, a reflector assembly and a detection platform, wherein the reflector assembly is arranged between the detection camera and the detection platform, and the reflector assembly comprises a plurality of reflectors to transmit an image of the surface of the bearing surface of the detection platform to the lens of the detection camera; The proofreading tool comprises a standard target surface and a detection target surface located at two ends of the proofreading tool; When calibrating the detection device, the calibration tool is suitable for being arranged on the detection table, and the calibration step is performed by the calibration tool to finally determine that the bearing surface of the detection table where the detection target surface is located is the detection position; The standard target surface is perpendicular to the optical axis direction of the lens of the detection camera, and the extension direction of the detection target surface intersects with the standard target surface; The standard target surface and the detection target surface facing the lens of the detection camera are coated surfaces and are provided with detection patterns; the detection patterns of the standard target surface are used to adjust the reflector and to level the detection camera; The calibration step includes: moving the detection platform to set the straight-line distance between the standard target surface and the detection target surface and the detection camera, thereby adjusting the position and angle of the reflector in the reflector assembly according to the clarity of the standard target surface and the clarity of the detection target surface in the detection camera; When the calibration tool is placed on the detection table to calibrate the detection device, the detection target surface is located between the standard target surface and the lens of the detection camera; Wherein, the reflector assembly includes a first reflector, a second reflector and a third reflector; The first reflector is disposed in front of the upper portion of the lens of the detection camera, and is used to reflect light into the lens of the detection camera; The third reflector is disposed obliquely above the detection position and is used to reflect the image of the detection position; The second reflector is disposed between the first reflector and the third reflector; Alternatively, the reflector assembly includes a fourth reflector and a fifth reflector; The surface of the fourth reflector is disposed obliquely upward in front of the lens of the detection camera, and is used to reflect light into the lens of the detection camera; The fifth reflector is disposed horizontally downward and obliquely above the detection position, and is used for reflecting the image of the detection position to the fourth reflector.

2. The semiconductor surface defect detection device according to claim 1, characterized in that: The detection camera is a line scan camera or an area array camera.

3. The semiconductor surface defect detection device according to claim 1, characterized in that: It also includes a camera bracket, and the lens of the detection camera is installed on the camera bracket; the camera bracket includes screws and pin positions, so as to be suitable for initial positioning of the detection camera by screws or pins.

4. The semiconductor surface defect detection device according to claim 3, characterized in that: The camera bracket includes a top-pull adapter block, which is suitable for fine-tuning the horizontality of the detection camera through the top-pull adapter block and can be locked and fixed.

5. The semiconductor surface defect detection device according to claim 4, characterized in that: The reflector assembly also includes a reflector bracket, and each of the reflector pairs is installed by the reflector bracket at a corresponding position.

6. The semiconductor surface defect detection device according to claim 5, characterized in that: The first reflector and its corresponding reflector bracket are fixedly installed, and a fine-tuning gap is arranged between the second reflector and the third reflector and their corresponding reflector brackets respectively.

7. The semiconductor surface defect detection device according to claim 5, characterized in that: The fourth reflector and its corresponding reflector bracket are fixedly installed, and a fine-tuning gap is arranged between the fifth reflector and its corresponding reflector bracket.

8. A method for detecting semiconductor surface defects, characterized in that: include: Providing a semiconductor surface defect detection device as claimed in claim 1; Placing the proofreading tool on the testing table; Performing a calibration step, when the detection target surface is imaged clearly enough in the detection camera, determining that the location of the detection target surface is a semiconductor surface detection location; Wherein, the proofreading step comprises: Step A: moving the inspection platform to adjust the linear distance between the calibration tool and the inspection camera; Step B: adjusting the position and angle of the reflector in the reflector assembly between the calibration tool and the detection camera according to the clarity of the standard target surface in the detection camera and the clarity of the detection target surface; The proofreading tool includes a standard target surface and a detection target surface located at both ends of the proofreading tool. When the proofreading tool is placed on the detection table, the standard target surface is set to be perpendicular to the optical axis direction of the detection camera, the detection target surface intersects with the extension direction of the standard target surface, and the detection target surface is located between the standard target surface and the lens of the detection camera.

9. The method for detecting semiconductor surface defects according to claim 8, characterized in that: Before the calibration step, the method further includes: a camera leveling step.

10. The method for detecting semiconductor surface defects according to claim 9, characterized in that: The step of leveling the camera includes: Install the lens of the inspection camera and perform preliminary installation positioning; The mobile testing platform drives the target surface component fixture to move forward and backward to preliminarily find the focal plane of the camera; Fine-tune the lens of the inspection camera horizontally until the inspection camera captures a clear and horizontal image of the inspection pattern on the standard target surface, and the brightness of the left and right fields of view is uniform and bright; Fasten the lens of the detection camera.

11. The method for detecting semiconductor surface defects according to claim 8, characterized in that: Before the calibration step, the method also includes the steps of leveling the standard target surfaces at both ends of the calibration tooling and detecting the target surfaces.

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