wafer boat

By setting an internally threaded component on the lower surface of the cooling substrate and engaging it in the receiving hole, the problem of fixing the wafer stage for brittle materials is solved, achieving stable fixation and temperature uniformity, and reducing manufacturing costs.

CN116959941BActive Publication Date: 2026-07-10NGK INSULATORS LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
NGK INSULATORS LTD
Filing Date
2023-01-04
Publication Date
2026-07-10

AI Technical Summary

Technical Problem

In the prior art, wafer stage using cooling substrates made of brittle materials is prone to cracking when fixed to the mounting plate, and is also prone to generating temperature unevenness points on the wafer.

Method used

Using an alumina substrate and a brittle cooling substrate, the component is fixed by an internally threaded part in a receiving hole on the lower surface of the cooling substrate. The connecting part is engaged in the receiving hole in a state where the shaft is restricted from rotating, thus avoiding cracking. The receiving hole is set in the refrigerant flow path to prevent the generation of temperature uneven points.

Benefits of technology

This method achieves stable fixation of brittle cooling substrates, avoids cracking and the generation of temperature unevenness points, reduces manufacturing costs, and improves cooling efficiency.

✦ Generated by Eureka AI based on patent content.

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  • Figure CN116959941B_ABST
    Figure CN116959941B_ABST
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Abstract

A wafer mounting table capable of mounting a wafer mounting table having a brittle cooling substrate to a setting plate without any obstacle and capable of preventing a wafer from generating a temperature-specific point. A wafer mounting table (10) has an alumina substrate (20), a brittle cooling substrate (30), and a ductile internally threaded member (38). The alumina substrate (20) has a wafer mounting surface (22a) on an upper surface and has an electrode (26) built therein. The cooling substrate (30) is joined to a lower surface of the alumina substrate (20) and has a refrigerant flow path (32) formed therein. The internally threaded member (38) is housed in a housing hole (36) in a state in which the rotation of a shaft is restricted and in a state in which a fitting portion of the housing hole (36) is fitted. The internally threaded member (38) is capable of being screwed with an external thread of a bolt (98) inserted from the lower surface side of the cooling substrate (30). The housing hole (36) is provided inside the refrigerant flow path (32).
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